JP3239991B2 - エレクトロルミネセンス装置およびその製造方法 - Google Patents
エレクトロルミネセンス装置およびその製造方法Info
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- JP3239991B2 JP3239991B2 JP11615997A JP11615997A JP3239991B2 JP 3239991 B2 JP3239991 B2 JP 3239991B2 JP 11615997 A JP11615997 A JP 11615997A JP 11615997 A JP11615997 A JP 11615997A JP 3239991 B2 JP3239991 B2 JP 3239991B2
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- electroluminescent device
- electroluminescent
- polymer
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/114—Poly-phenylenevinylene; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/06—Luminescent, e.g. electroluminescent, chemiluminescent materials containing organic luminescent materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
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- Luminescent Compositions (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
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- Control Of El Displays (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Nitrogen Condensed Heterocyclic Rings (AREA)
Description
センス装置に関し、一層詳細には、発光層が半導体であ
るエレクトロルミネセンス素子(EL)を含み、それぞ
れ前記半導体のバンドギャップが異なるエレクトロルミ
ネセンス素子を組み合わせてディスプレイ等の如き表示
装置を構成するエレクトロルミネセンス装置およびその
製造方法に関する。
は、電界の影響により発光するよう構成されている。こ
のような半導体における物理的過程に対する一般的な作
用は、半導体の相対する電極から半導体に注入される電
子−正孔対の放射結合を通して行われる。その一例を挙
げると、GaPおよびあるいは、同様なIII 族の元素と
V族の元素の組み合わせからなる半導体を基礎として構
成されている。
されているものの、その大きさが非常に微小であるため
に大面積ディスプレイに使用するに際しては、困難を伴
うばかりか不経済でもある。
品の材料は幾種類か知られているが、無機半導体の一つ
であるZnS(硫化亜鉛)が好適である。しかしなが
ら、この系には信頼性に薄いという、問題が存在する。
(anthracenc)、ペリレン(perylen
e)、そしてコロネン(coronene)のようなシ
ンプルな芳香族分子単体(simple aromat
ic molecules)がエレクトロルミネセンス
素子(EL)の材料として用いられていることが知られ
ている。
ZnSと同様に、それらが信頼性を欠くばかりか、これ
らの有機層と電流注入電極層(current−inj
ecting electrode layers)と
の接合性に問題がある。
利用したエレクトロルミネセンス素子は、米国特許3,
621,321号に開示されている。この素子は、多量
の電力を消費し、且つその電力消費量に比して発光が少
ないという不都合を有している。
特許4,672,265号には、発光層を二層からなる
構造としたエレクトロルミネセンス素子(EL)が記載
されている。
物質は、前述の不都合な有機材料である。
合を未然に回避するか、若しくは少なくとも前記不都合
を低減化することを可能とするエレクトロルミネセンス
装置およびその製造方法を提供することを目的とする。
ば、エレクトロルミネセンス装置を構成する素子が少な
くとも共役ポリマーが用いられる高密度で薄いポリマー
膜から構成される半導体層と、前記半導体層の第1の表
面と接する第1接触層と、前記半導体層の第2の表面と
接する第2接触層とを有する。
(charge carriers)が半導体層に注入
されることより発光することを応用した共役ポリマー半
導体に発見の基礎をおいている。
れらは、光学変調器(optical modulat
or)に用いられ、欧州特許出願0294061号で検
討されている。この場合には、第1の電極と第2の電極
の間に位置する変調のためのアクティブ層としてポリア
セチレンが用いられている。光学変調効果を発生させる
アクティブ層に空間電荷領域を形成するように、一つの
電極とアクティブ層との間に絶縁層を設ける必要があ
る。空間電荷層の存在が発光に寄与する電子−正孔対
(elector−hole pairs)の形成を妨
げるため、エレクトロルミネセンス素子には不向きであ
る。いずれにせよ、欧州特許出願0294061号に開
示されているエレクトロルミネセンス素子では、光学変
調効果の破壊に関しては、全く望ましくない。
ポリマー(ConiugatedPolymer)がポ
リポリ(p−フエニレンビニレン)〔PPV〕であるの
が好ましく、第1の電荷注入接触層(first ch
arge injection contact la
yer)は、一側の表面に薄い酸化物層が形成されたア
ルミニウムの薄層からなり、半導体層の第1の表面は前
記酸化物層と接し、そして第2の電荷注入接触層(se
cond charge injection con
tact layer)はアルミニウムまたは金の薄層
である。
PVであり、第1接触層がアルミニウム、若しくはマグ
ネシウムと銀の合金で、第2接触層(second c
ontact layer)は、酸化インジウムであ
る。
PPVであり、接触層の一つは非晶質シリコンからな
り、他方の接触層は、アルミニウム、金、マグネシウム
−銀合金、酸化インジウムなる群のうちから選択され
る。
第2接触層のうちのいずれかを基板に積層し、PPVの
薄層を付与し、そして、その上に前記積層されなかった
接触層を積層する。
ら5μmの範囲の均一な厚さを有し、共役ポリマーは1
eVから3.5eVの範囲で半導体バンドギャップを有
する。その上、電界発光するポリマー膜の共役ポリマー
の大きさは、膜内の共役ポリマーにおける電荷の浸透移
動が十分なされるものである。
って非極在π電子を有するポリマーを意味する。
フレンドにより、Journalof Molecul
ar Electronies4(1988)Janu
ary−March,No.1,の37頁から46頁で
検討されている。
とおりである。すなわち、正の接触層は、ポリマー膜に
正の電荷キャリヤを注入し、負の接触層は、ポリマー膜
に負の電荷キャリヤを注入する。この場合、正の接触層
は高い仕事関数を有することが、また負の接触層は低い
仕事関数を有するように構成される。従って、負の接触
層は、例えば、金属あるいはドープ半導体(a dop
ed semiconductor)のような電子注入
材料(electric─injectingmate
rial)から構成され、ポリマー半導体層と接して、
外部電位を印加されて負電位を生じる時、電子のポリマ
ー半導体層への注入がなされる。正の接触層は、例え
ば、金属やドープ半導体のような正孔注入材料(hol
e−ingecting material)から構成
され、ポリマー半導体層とし、外部電位を印加されてポ
リマー半導体層に一般に正孔と呼ばれる正の電荷が注入
される。
に空間が排除されたポリマー膜を意味する。
(electric─injecting mater
ial)に加えて、有機材料を含むことが可能である。
役ポリマーから構成される。またあるいは、共役ポリマ
ーからなる膜は、共役ポリマーの混合物から構成される
ことも可能である。
りである。 (i)ポリマーは酸素、湿度に対して化学的に安定であ
ること。 (ii)ポリマー膜は、下地層との間の良好な接着性、温
度上昇あるいは圧力圧迫を原因とする亀裂の発生に対す
る阻止能力、縮み、膨張、再結晶あるいは他の形態変化
への抵抗性を有するべきである。
ス装置およびその製造方法についてその実施態様を挙げ
て図面を参照しながら説明する。
リ(p−フエニレンビニレン)[PPV]であり、下記
式において、フェニレン環は、各々独立してアルキル基
(好適にはメチル基)、アルコキシ基(好適にはメトキ
シ基若しくはエトキシ基)、ハロゲン(好適には塩素若
しくは臭素)のなかから選択される一あるいはそれ以上
数の置換基であってよい。
V]から誘導されるその他の共役ポリマーもまた、本発
明に係るエレクトロルミネセンス素子のポリマー膜とし
て適当に使用される。
例を示す。 (i)式1のフェニレン環を縮合環系に置き換える例え
ば、フェニレン環に代えてアントラセンあるいはナフタ
レン環系に置換することによって得られる、以下のよう
な構造を示すポリマー。
同様に1あるいはそれ以上の数の置換基を有してもよ
い。 (ii)フェニレン環をフラン環のような複素環系に置換
することによって得られる、以下の構造を示すポリマ
ー。
それ以上の数の置換基を有してもよい。 (iii) 各々のフェニレン環(若しくは前記(i)ある
いは(ii)においてに与えられた他の環系)に結合した
ビニレン部分の数を増やすことによって得られる、以下
のような構造示すポリマー。
5、6、7を示す。
換基を有してもよい。
のスペクトルを確実に網羅するために異なった波長を放
射するエレクトロルミネセンスの構造が得られるので、
異なった様々な半導体のエネルギーギャップを有し、こ
れらを組み合わせてエレクトロルミネセンス装置を構成
する。
的方法あるいは熱処理によって得ることができる。前記
方法のうち後者の場合においては、共役ポリマーに変質
させる前に、必要に応じて前処理することができる。
ルホニウム前駆体を使用することにより同様に導電性基
板に付与することができる。
(II)よりも有機溶媒への溶解度が高いポリマー前駆体
を用いるが有利な場合がある。
に示されるような反応図式に基いた方法により、導電性
基板上に付与される。スルホニウム塩単量体(II)は、
水溶液、水エタノール混液、若しくはメタノール中で前
駆体ポリマー(III)に合成される。そのような前駆体ポ
リマー(III)は、ホトレジスト処理のために半導体産業
で用いられている一般的なスピンーコーティング技術に
より導電性基板上に付与することができる。その結果生
じた前駆体ポリマー(III)は、通例200℃から350
℃での加熱処理によりポリフエニレンビニレン(I)に
転化される。
I)への重合、そしてPPVのための熱転化のために必要
な詳細な条件は、文献、例えば、D.D.C.Brad
leyによるJ.Phys.D(Applied Ph
ysics)、20、1389(1987)およびJ.
D.Stenger Smith、R.W.Lenzと
G.WegnerによるPolymer、30、104
8(1989)に記載されている。
mから10μmの厚さが得られることが知られている。
これらのPPV膜は、ごくわずなピンホールしかみられ
ない。PPV膜は、約2.5eV(500nm)の半導
体エネルギーギャップを有する。
する材料は、ポリ(フェニレン)である。
ヘキサ−1、3−ジエンの生化学的に製造される誘導体
を出発物質として製造される。このポリ(フェニレン)
の製造は、Ballard et al、J.Che
m.Comm.954(1983)により詳細に記載さ
れている。
い膜としてスピンコートされ、そして、その後、通例1
40℃から240℃の範囲で熱処理されて共役ポリ(フ
ェニレン)ポリマーに転換される。
たフェニレンコポリマーを得ることができる。
とされ使用できる材料として、例えば、以下のようなも
のが含まれる。 (a)ポリ(4、4’−ジフェニレンジフェニルビニレ
ン)[PDPV]は、両方のビニレンの炭素がフェニル
環により置換されている。それは、薄い膜を形成できる
ように普通の有機溶媒に解ける。 (b)ポリ(1、4−フェニレン−1−ジフェニルビニ
レンとポリ(1、4−フェニレンジフェニルビニレン)
ポリマーはPPVと類似物質であり、それぞれ一つある
いは両方のビニレンの炭素がフェニル基と置換されてい
る。それらは各々有機溶媒に解け薄い膜として被覆され
る。 (c)有機溶媒中に溶解可能であり、長い主鎖を有する
アルキル(アルキルはオクチルと等しいかそれ以上に長
い)についてはポリ(3−アルキルチオフェン)ポリマ
ー(アルキルは、プロピル、ブチル、ペンチル、ヘキシ
ル、ヘプチル、オクチル、デシル、ウンデシル、ドデシ
ルのいずれか一つ)は溶融加工可能である。 (d)ポリ(3−アルキルピロール)ポリマーは(3−
アルキルチオフェン)ポリマーと類似であることが予想
される。 (e)ブチルよりも大きなアルキルを有するポリ(2、
5−ジアルコキシ−p−フェニレンビニレン)ポリマー
は溶解加工可能である。 (f)ポリ(フェニルアセチレン)は主鎖中の水素原子
がフェニル基に置換されたポリアセチレンの誘導体であ
る。この置換によって、材料は加工可能である。
って導電性基板(電荷注入接触層)に必要とされるポリ
マーからなる薄い均一な膜が容易に得られるように、他
のポリマーとの共役ポリマーが混合されたポリマーブレ
ンドが使用されることもある。
うなコポリマーまたはポリマーブレンドを用いる時、前
記共役ポリマーの膜を併せ有するエレクトロルミネセン
ス素子の活性部位は、コポリマーあるいはポリマーブレ
ンドのパーコレイション開始物質と同じかそれ以上に大
きい多量の共役ポリマー部位を含まなければならない。
ップあるいは多種類の電荷のバンドギャップのポリマー
層から形成されている。
素子(EL)の構造を以下に説明する。
あるいは、ホウケイ酸塩ガラス1の上面に、第1の電荷
注入接触層2を形成した。電荷注入接触層2は、約20
nmの厚さの層を作るためのシャドウマスクによりアル
ミニウムを熱蒸着させて形成した。前記シャドウマスク
によりパターンが形成され、前記パターンは、縦の長さ
が15mmで2mmの間隙を有して平行に並ぶ幅2mm
の一連の細長い小片状である。。アルミニウム電荷注入
接触層を、薄い表面酸化物層3を形成するために空気に
さらした。このようにして電荷注入接触層を形成した。
解されたPPVの前駆体のメタノール溶液を、前記の結
合基板にスピンコーティングした。これは、結合基板の
表面の全体にポリマーの塗布がなされ、軸の回転速度が
5000r.p.m.で回転して行なわれた。その結
果、得られた基板とポリマー前駆体層は、真空オーブン
中で300℃の温度で加熱された。この加熱処理によっ
てポリマー前駆体はPPVに変換された。得られたPP
V膜4は100から300nmの厚さであった。必要最
低限の膜の厚さは20nm程度である。しかしながら、
20nmから1μmの範囲の厚さであってもよい。
膜の上に金あるいはアルミニウムを蒸着させて形成し
た。シャドウマスクを用いて、PPV膜の表面上におい
てパターンを形成し、縦の長さが15mmで2mmの間
隙を有して平行に並ぶ幅2mmの一連の細長い小片を得
た。第2の電荷注入接触層の厚さは、20から30nm
の範囲であった。このようにして正孔注入接触層を形成
した。
エレクトロルミネセンス素子(EL)の水平面に垂直に
発光をなすために透明、若しくは半透明であることが望
ましい。この実施例では金、若しくはアルミニウムの層
が30mm以下の厚さである時になされる。PPV層の
厚さが約200nmの素子であって強力なエレクトロル
ミネセンス素子(EL)のためのしきい値電圧は、約4
0ボルトである。この電圧は、2×106 Vcm -1 の
しきい電界を付与することになる。半透明の電極を通し
てなされる電流密度2mA/cm2 の発光がある。この
実施例のエレクトロルミネセンス素子(EL)のレスポ
ンスタイムは、非常に短く、そして10マイクロセカン
ドより速い。エレクトロルミネセンス素子(EL)は、
空気中では、特別な用心をすることなく使用され、機能
低下の兆候はなにも示さない。
ータにより分光し、シリコン光起電力セルで検出し、室
温20℃で計測し光学通路を有する低温保持装置に素子
を保持した。その結果を図4に示す。エレクトロルミネ
センス素子(EL)のスペクトルは、ピークが温度によ
ってその位置をわずかにシフトして0.15eVだけ異
なって690nmから500nm(1.8eVから2.
4eV)のスペクトル範囲で発光する。
比べて低い仕事関数を有し電子注入層として用いるのに
適した他の材料は、(非結晶あるいは結晶性)のn−ド
ープシリコン、酸化膜を有するシリコン、純粋、若しく
は金などの他の金属との合金であるアルカリ、およびア
ルカリ土類金属類である。“nタイプドープ”共役ポリ
マーの薄層を、金属層と電界発光ポリマー層との間に入
れることができる。
比べて高い仕事関数を有し正孔注入層として用いるのに
適した他の材料は、インジウム/スズ酸化物、白金、ニ
ッケル、パラジウム、および黒鉛である。また、電気化
学的に重合されたポリピロール、ポリチオフェン等の
“pタイプドープ”共役ポリマーの薄膜を金属層とエレ
クトロルミネセンスポリマー層の間に入れることができ
る。
できる。すなわち、白金のような融点温度が特に高い金
属を除いた殆どの金属は、蒸着により付着させることが
できる。インジウム/錫の酸化物を含む全ての合金は、
DCまたはRFスパッタリング法を用いて、付着させる
ことができる。 「実施例2」 この例は、一連の層から構成される。先ず、透明な酸化
インジウムからなる所定の層が、抵抗率が5×10-4Ω
cmとなるように形成する。インジウムターゲットから
一般的に0.11nm/secで、一般に2×10-4m
barの酸素圧力を付与しながらイオンビームのスパッ
タリングを含む工程により基板上に設ける。
ートは、100nmの厚さによりもたらされる。そのよ
うな膜は、可視スペクトル部で光学透過係数は、90%
以上である。
り、酸化インジウム層上に配設される。アルミニウム接
触層は、50nmの厚さを有するように蒸着により最後
に形成される。この構造で、酸化インジウム接触層が正
の接触層として働き、アルミニウム接触層は、負の接触
層として働く。発光は、酸化インジウム層を通過する。 「実施例3」この構造体の制作は、実施例2の上部金属
接触層までは近似して行われる。ここで、負接触層とし
て機能する上部接触層は、AgおよびMgの合金を蒸着
させることで形成した。蒸着は、AgおよびMgの粉末
を、容器内で1:10のモル比で混合したものを加熱し
て行われ、主として50nmの厚さの層が形成された。
質として用いるのが望ましい。Agを加えて合金とする
のは、ポリマー層に対する金属膜の固着を良くし、酸化
を抑制するためである。この例における電流/電圧特性
およびエレクトロルミネセンス特性は、前記実施例2に
記載のものと略同じである。 「実施例4」これらの構造体は、負極として機能する非
晶質シリコーン水素合金層と、正極として機能する酸化
インジウムの層とで制作される。ガラス基板は、Alま
たはCrを蒸着させて得られる金属接触層を有する。非
晶質シリコーン水素合金層は、以下に詳細に示す高周波
加熱(RF)スパッタリングによって形成された。
ットと液体窒素冷却ゲッタを有し、8cmのターゲット
基板で作用する。チャンバは、5×10-8mbarのベ
ース圧力に設定される。マグネトロンのターゲットは、
厚さ3mmのn−ドープSiウエハ層を担持させる。タ
ーゲットは、試料に関して1乃至2時間プレスパッタリ
ングを行うことで浄化される。このようにして用意され
た基板は、厚さ3cmのCuおよびAlの基板温度が2
50乃至300°Cとなるように加熱される。基板は、
約6rpmで回転される。スパッタリングのガスとして
は、0.007乃至0.013mbarの圧力でH2 3
0%を含むArが用いられ、蒸着の間、連続的にチャン
バに供給される。RFのパワーとしては、2Wの反射出
力を有する250Wが使用される。付着は、厚さ1μm
の膜厚に対して1.5時間付着を行う場合に、主として
12nm/分である。
直流抵抗率が5×106 乃至5×108 Ωcmである。
非晶質シリコン−水素層に加えられた。そして、実施例
2に示した手順でPPV層に直接した酸化インジウム層
を形成した。
m2 、シリコン−水素層の厚さ1μm、PPVの層の厚
さ40nm、酸化インジウム層の厚さ250nmの構造
体に関して得られた結果を図7および図8に示す。図7
は、順バイアス(酸化インジウム層を正極とする)をか
けた場合の素子の電流/電圧特性を示す。また、図8
は、電流に対する発光量の変化を示す。電荷の注入およ
び発光は、約17Vより開始される。そして、この閾値
を越えた電流値の上昇は、例えば、図5に示すように、
シリコン−水素層がない場合に比較してなだらかであ
る。
ン−水素接触層に対して酸化インジウム層を負極とす
る)をかけた場合に、弱い電界発光を示す。従って、順
バイアスをかけることが望ましい。 「実施例5」実施例4に示す構造体の最上層である酸化
インジウム層は、半透明のAuまたはAlと置き換え
た。構造体の最上層は、厚さ約20nmからなる発光を
示す層として形成された。これらの素子は、上述した各
実施例と同様の特性を示した。
施例3に示した接触層にも適用することができる。
を形成する方法はそれ自体公知である。シリコンの場
合、これは、シランのグロー放電と蒸着を含む。付着方
法は、蒸着、RFおよび直流スパッタリングでもよい。
る付着技術と、接触層における所望の光学的透明度によ
って決定される。電荷注入の容易性は、電荷注入接触層
を複合層として構成することで改善される。この複合層
は、正孔および電子を夫々注入するため、酸化および還
元共役ポリマーの薄膜層を含む。これらの特別な共役ポ
リマー層は、活性状態の電界発光ポリマーと同様であっ
てよい。このような物質をドープする方法は、この分野
においては良く知られており、「導電性ポリマーハンド
ブック」(ティ.ジェイ.スコッテイム(T.J.Sk
otheim))に良く書かれている。
の平面に垂直に発光させるため透明または半透明とする
べきであるが、それは素子の平面内で放射が要求されな
い場合には必ずしも必要なものではない。
サイズの限界は、スピンコーティンに使用することがで
きる基板のサイズによって決定される。例えば、このよ
うにして、直径15cmのシリコンウエファのコーティ
ングが行われる。さらに、広い面積のコーティングを行
うためには、ドローコーティングの技術が用いられる。
従って、平方メートルの面積を有する共役ポリマーを用
いたエレクトロルミネセンス素子の製造もできる。
いくつかは非常に高い温度で蒸着される金属層の付着、
または、活性電界光領域を限定するためのフォトリソグ
ラフィの工程で得られ、非晶質シリコン層の蒸着のよう
な前工程に対して、耐性を有する。PPVの場合、基板
に前駆体ポリマーを用いる方法では、スピンコーティン
グまたはドローコーティングのいずれかによるのが適当
であるが、共役ポリマーとエレクトロルミネセンス素子
のタイプによって、スピンコーティング、ドローコーテ
ィングおよび溶融工程の全てを基板上に共役ポリマーを
付着するのに使用することができる。
効果を用いる種々の用途に適用される。従来より、半導
体LEDが使用されていたところに用いられる。また、
液晶が使用されていたところにも用いられる。エレクト
ロルミネセンス素子は数多くの特性を有している。
ネセンス装置は、視角が拡張される。さらに、広面積の
エレクトロルミネセンス装置は、大面積液晶ディスプレ
イが遭遇する基板の平面性についての問題点を克服する
ことができる。エレクトロルミネセンス装置は、テレビ
ジョンやコンピュータディスプレイのように、マトリッ
クス方式のディスプレイに対して特に好適である。マト
リックス方式のディスプレイに適用されるエレクトロル
ミネセンス装置の一例を図3に示す。ここでは、電荷注
入接触層が、半導体層のいずれか一方の側部において、
一方の接触層が他方の接触層に対して直交するようにし
て筋状に形成される。ディスプレイの画素としての個々
エレクトロルミネセンス素子すなわち半導体層の領域の
マトリックスのアドレス指定は、下方の電荷注入接触層
と上方の電荷注入層とを特定することで達成される。さ
らに、エレクトロルミネセンス素子は、応答速度が速い
ため、テレビジョンの受像機に適する。特に、発光の色
を共役ポリマーの選択および半導体のバンドギャップの
選択によって制御することができる。従って、緑、赤、
青を混色してなるカラーディスプレイは、エレクトロル
ミネセンス素子の共役ポリマーの配置によって制御が可
能となる。
図である。
略図である。
略図である。
センス素子の出力を示すグラフである。
ぞれ電流対発光および出力強度対印加電圧を示すグラフ
である。
ぞれ電流対発光および出力強度対印加電圧を示すグラフ
である。
流出力および電界発光強度を示すグラフである。
流出力および電界発光強度を示すグラフである。
Claims (25)
- 【請求項1】複数の共役ポリマーからなる緻密なポリマ
ー膜の形状を呈し発光色を制御する異なる半導体バンド
ギャップを有する半導体層と、素子に電界をかけること
によって第1のタイプの電荷キャリヤが前記半導体層に
放出されるように選択された第1の接触層と、前記素子
に電界をかけることによって第2のタイプの電荷キャリ
ヤが前記半導体層に放出されるように選択された第2の
接触層とからなり、前記共役ポリマーは発光色を制御す
る半導体バンドギャップを有し、前記半導体層のポリマ
ー膜は、該半導体層を横断して前記第1と第2の接触層
の間に電界をかけたときに前記第1の接触層に対して第
2の接触層を正にすべく前記第1と第2の電荷キャリヤ
が前記半導体層の中に注入されて共役ポリマー電荷キャ
リヤ対を形成するように結合されて放射して崩壊するこ
とにより、前記共役ポリマーから発光が行われるほどに
十分に低い濃度の外部電荷キャリヤを有することを特徴
とするエレクトロルミネセンス装置。 - 【請求項2】請求項1記載のエレクトロルミネセンス装
置において、共役ポリマーが式 【化1】 [式中、フェニレン環は、必要に応じてアルキル(好適
にはメチル)、アルコキシ(好適にはメトキシまたはエ
トキシ)、ハロゲン(好適には塩素または臭素)または
ニトロの中からそれぞれ独立して選択される一つあるい
はそれ以上の置換基を有していてもよい]のポリ(p−
フェニレンビニレン) [PPV] であるエレクトロルミ
ネセンス素子を有することを特徴とするエレクトロルミ
ネセンス装置。 - 【請求項3】請求項1または2記載のエレクトロルミネ
センス装置において、前記ポリマー膜は10nmから5
μmの実質的に均一な厚さからなるエレクトロルミネセ
ンス素子を有することを特徴とするエレクトロルミネセ
ンス装置。 - 【請求項4】請求項1乃至3のいずれかに記載のエレク
トロルミネセンス装置において、共役ポリマーが1eV
から3.5eVの範囲内で半導体のバンドギャップを有
するエレクトロルミネセンス素子を有することを特徴と
するエレクトロルミネセンス装置。 - 【請求項5】請求項1乃至4のいずれかに記載のエレク
トロルミネセンス装置において、ポリマー膜のエレクト
ロルミネセンス領域において共役ポリマーの割合はフイ
ルムに存在する共役ポリマーにあってキャリヤを移動さ
せるために十分な浸透しきい値を有するものであるエレ
クトロルミネセンス素子を有することを特徴とするエレ
クトロルミネセンス装置。 - 【請求項6】請求項1乃至5のいずれかに記載のエレク
トロルミネセンス装置において、第1の電荷キャリヤの
注入接触層は薄い酸化層を形成したアルミニウムからな
る一つの薄い表面層を有し、半導体層の第1の表面が前
記酸化層と接触しているエレクトロルミネセンス素子を
有することを特徴とするエレクトロルミネセンス装置。 - 【請求項7】請求項1乃至6のいずれかに記載のエレク
トロルミネセンス装置において、第1の接触層はアルミ
ニウム、若しくはマグネシウムと銀の合金からなるグル
ープから選択されるエレクトロルミネセンス素子を有す
ることを特徴とするエレクトロルミネセンス装置。 - 【請求項8】請求項6記載のエレクトロルミネセンス装
置において、第2の電荷キャリヤ注入接触層はアルミニ
ウムと金からなるグループから選択されるエレクトロル
ミネセンス素子を有することを特徴とするエレクトロル
ミネセンス装置。 - 【請求項9】請求項1乃至8のいずれかに記載のエレク
トロルミネセンス装置において、第1と第2の電荷キャ
リヤ注入接触層は少なくとも一つが半透明体であるエレ
クトロルミネセンス素子を有することを特徴とするエレ
クトロルミネセンス装置。 - 【請求項10】請求項7記載のエレクトロルミネセンス
装置において、第2の接触層は酸化インジウム若しくは
酸化インジウムスズであるエレクトロルミネセンス素子
を有することを特徴とするエレクトロルミネセンス装
置。 - 【請求項11】請求項1乃至5のいずれかに記載のエレ
クトロルミネセンス装置において、第1の接触層は非晶
質シリコンからなり、第2の接触層はアルミニウム、金
および酸化インジウムから構成されるグループから選択
されるエレクトロルミネセンス素子を有することを特徴
とするエレクトロルミネセンス装置。 - 【請求項12】請求項1乃至11のいずれかに記載のエ
レクトロルミネセンス装置において、少なくとも第1と
第2の電荷キャリヤ注入接触層の一つは支持基板に接触
しているエレクトロルミネセンス素子を有することを特
徴とするエレクトロルミネセンス装置。 - 【請求項13】請求項9記載のエレクトロルミネセンス
装置において、支持基板は石英ガラスからなるエレクト
ロルミネセンス素子を有することを特徴とするエレクト
ロルミネセンス装置。 - 【請求項14】請求項1乃至13のいずれかに記載のエ
レクトロルミネセンス装置において、エレクトロルミネ
センス素子によってアレイを形成し、前記第1と第2の
電荷キャリヤ注入接触層が前記アレイに選択的にアドレ
スすることを許容すべく配列されているエレクトロルミ
ネセンス素子を有することを特徴とするエレクトロルミ
ネセンス装置。 - 【請求項15】発光色を制御する異なる半導体バンドギ
ャップを有する複数の共役ポリマーからなる緻密なポリ
マー膜層の形状の半導体層を有し、ポリマー膜として前
駆体ポリマーの層を基板上に付着させる工程と、前記付
着された前駆体ポリマーを高温に加熱して共役ポリマー
に生成する工程と、第1の接触層の薄層を前記半導体層
の第1の表面と接して設け、第2の接触層の薄層を前記
半導体層の第2の表面と接して設ける工程とからなり、
前記ポリマー膜は、第2の接触層を第1の接触層に対し
て正にするように前記半導体層の第1及び第2の接触層
間に電界をかけることにより電荷キャリヤが前記半導体
層に注入されて、前記半導体層から発光がなされる十分
に低い濃度の外部電荷キャリヤを有することを特徴とす
るエレクトロルミネセンス装置の製造方法。 - 【請求項16】請求項15記載の製造方法において、先
ず、支持基板上に前記第1の電荷注入接触層を付着させ
て複合基板を形成し、前記第1の電荷注入接触層上にポ
リマー膜として前記前駆体ポリマーを付着させ、次に複
合基板及び前駆体ポリマーをポリマー膜中に前記共役ポ
リマーを生成する高温に加熱し、最後に前記第2の電荷
注入接触層をポリマー膜上に設けてエレクトロルミネセ
ンス素子を形成し、該エレクトロルミネセンス素子を組
み合わせることを特徴とするエレクトロルミネセンス装
置の製造方法。 - 【請求項17】請求項15または16記載の製造方法に
おいて、前駆体を構成するポリマーは可溶体で且つポリ
マー膜としてスピンコーティングにより前記基板上に設
けられてエレクトロルミネセンス素子を形成し、該エレ
クトロルミネセンス素子を組み合わせることを特徴とす
るエレクトロルミネセンス装置の製造方法。 - 【請求項18】請求項15乃至17のいずれかに記載の
製造方法において、前記前駆体ポリマーはポリ(p−フ
ェニレンビニレン)[PPV]のための前駆体ポリマー
からなるエレクトロルミネセンス素子を形成し、該エレ
クトロルミネセンス素子を組み合わせることを特徴とす
るエレクトロルミネセンス装置の製造方法。 - 【請求項19】請求項15乃至18のいずれかに記載の
製造方法において、前記ポリマー膜は10nmから5μ
mの範囲において均一な厚さからなるエレクトロルミネ
センス素子を形成し、該エレクトロルミネセンス素子を
組み合わせることを特徴とするエレクトロルミネセンス
装置の製造方法。 - 【請求項20】請求項15乃至19のいずれかに記載の
製造方法において、第1の電荷キャリヤ注入接触層はア
ルミニウムの薄い層からなり、一つの表面が薄い酸化層
を形成し、前記第1の電荷キャリヤ注入接触層の薄い酸
化層が前記半導体層の第1の表面と接触するように設け
ることによりエレクトロルミネセンス素子を形成し、該
エレクトロルミネセンス素子を組み合わせることを特徴
とするエレクトロルミネセンス装置の製造方法。 - 【請求項21】請求項15乃至20のいずれかに記載の
製造方法において、前記第2の電荷キャリヤ注入接触層
はアルミニウムと金からなるグループから選択されるこ
とによりエレクトロルミネセンス素子を形成し、該エレ
クトロルミネセンス素子を組み合わせることを特徴とす
るエレクトロルミネセンス装置の製造方法。 - 【請求項22】請求項15乃至19のいずれかに記載の
製造方法において、第1の接触層はアルミニウムとマグ
ネシウム/銀の合金からなるグループから選択され、且
つ第2の接触層は酸化インジウムであるエレクトロルミ
ネセンス素子を形成し、該エレクトロルミネセンス素子
を組み合わせることを特徴とするエレクトロルミネセン
ス装置の製造方法。 - 【請求項23】請求項15乃至19のいずれかに記載の
製造方法において、前記第1の接触層はアモルファスシ
リコンからなり、第2の接触層はアルミニウム、金、お
よび酸化インジウムからなるグループから選択されるこ
とによりエレクトロルミネセンス素子を形成し、該エレ
クトロルミネセンス素子を組み合わせることを特徴とす
るエレクトロルミネセンス装置の製造方法。 - 【請求項24】請求項15乃至23のいずれかに記載の
製造方法において、前記第1と第2の電荷キャリヤ注入
接触層は蒸着によって設けられることによりエレクトロ
ルミネセンス素子を形成し、該エレクトロルミネセンス
素子を組み合わせることを特徴とするエレクトロルミネ
センス装置の製造方法。 - 【請求項25】請求項15乃至24のいずれかに記載の
製造方法において、前記支持基板が石英ガラスであるエ
レクトロルミネセンス素子を形成し、該エレクトロルミ
ネセンス素子を組み合わせることを特徴とするエレクト
ロルミネセンス装置の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8909011:2 | 1989-04-20 | ||
GB898909011A GB8909011D0 (en) | 1989-04-20 | 1989-04-20 | Electroluminescent devices |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50602890A Division JP3249971B2 (ja) | 1989-04-20 | 1990-04-18 | エレクトロルミネセント素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH1092577A JPH1092577A (ja) | 1998-04-10 |
JP3239991B2 true JP3239991B2 (ja) | 2001-12-17 |
Family
ID=10655404
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50602890A Expired - Lifetime JP3249971B2 (ja) | 1989-04-20 | 1990-04-18 | エレクトロルミネセント素子 |
JP9116158A Pending JPH1092576A (ja) | 1989-04-20 | 1997-04-18 | 電界発光素子およびその製造方法 |
JP11615997A Expired - Lifetime JP3239991B2 (ja) | 1989-04-20 | 1997-04-18 | エレクトロルミネセンス装置およびその製造方法 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50602890A Expired - Lifetime JP3249971B2 (ja) | 1989-04-20 | 1990-04-18 | エレクトロルミネセント素子 |
JP9116158A Pending JPH1092576A (ja) | 1989-04-20 | 1997-04-18 | 電界発光素子およびその製造方法 |
Country Status (14)
Country | Link |
---|---|
US (2) | US5247190A (ja) |
EP (1) | EP0423283B1 (ja) |
JP (3) | JP3249971B2 (ja) |
KR (1) | KR100189398B1 (ja) |
AT (1) | ATE117834T1 (ja) |
AU (1) | AU626415B2 (ja) |
BR (1) | BR9006718A (ja) |
CA (1) | CA2030785C (ja) |
DE (1) | DE69016345T2 (ja) |
ES (1) | ES2070320T3 (ja) |
FI (1) | FI112555B (ja) |
GB (1) | GB8909011D0 (ja) |
HK (1) | HK24597A (ja) |
WO (1) | WO1990013148A1 (ja) |
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- 1997-04-18 JP JP11615997A patent/JP3239991B2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7750553B2 (en) | 2004-07-30 | 2010-07-06 | Dai Nippon Printing Co., Ltd. | Organic EL element provided with an electrode in a liquid state and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
DE69016345T2 (de) | 1995-05-24 |
ATE117834T1 (de) | 1995-02-15 |
DE69016345D1 (de) | 1995-03-09 |
CA2030785C (en) | 2000-05-30 |
EP0423283B1 (en) | 1995-01-25 |
JP3249971B2 (ja) | 2002-01-28 |
EP0423283A1 (en) | 1991-04-24 |
KR100189398B1 (ko) | 1999-08-02 |
JPH04500582A (ja) | 1992-01-30 |
ES2070320T3 (es) | 1995-06-01 |
AU5428590A (en) | 1990-11-16 |
JPH1092576A (ja) | 1998-04-10 |
KR920700480A (ko) | 1992-02-19 |
FI112555B (fi) | 2003-12-15 |
WO1990013148A1 (en) | 1990-11-01 |
FI906271A0 (fi) | 1990-12-19 |
HK24597A (en) | 1997-02-27 |
AU626415B2 (en) | 1992-07-30 |
US5399502A (en) | 1995-03-21 |
US5247190A (en) | 1993-09-21 |
CA2030785A1 (en) | 1990-10-21 |
GB8909011D0 (en) | 1989-06-07 |
BR9006718A (pt) | 1991-08-06 |
JPH1092577A (ja) | 1998-04-10 |
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