KR100327105B1 - 고휘도 형광체 및 그 제조방법 - Google Patents
고휘도 형광체 및 그 제조방법 Download PDFInfo
- Publication number
- KR100327105B1 KR100327105B1 KR1019990026897A KR19990026897A KR100327105B1 KR 100327105 B1 KR100327105 B1 KR 100327105B1 KR 1019990026897 A KR1019990026897 A KR 1019990026897A KR 19990026897 A KR19990026897 A KR 19990026897A KR 100327105 B1 KR100327105 B1 KR 100327105B1
- Authority
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- South Korea
- Prior art keywords
- lead
- thin film
- pbx
- group
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000000034 method Methods 0.000 title claims abstract description 92
- 239000010409 thin film Substances 0.000 claims abstract description 107
- 150000002500 ions Chemical class 0.000 claims abstract description 81
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 80
- 239000002243 precursor Substances 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims abstract description 68
- 229910052717 sulfur Inorganic materials 0.000 claims abstract description 60
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 55
- 238000006243 chemical reaction Methods 0.000 claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 claims abstract description 49
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 9
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 8
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims abstract description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims abstract description 8
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims abstract description 8
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims abstract description 8
- 239000010408 film Substances 0.000 claims description 48
- MRMOZBOQVYRSEM-UHFFFAOYSA-N tetraethyllead Chemical compound CC[Pb](CC)(CC)CC MRMOZBOQVYRSEM-UHFFFAOYSA-N 0.000 claims description 40
- 150000001875 compounds Chemical class 0.000 claims description 24
- 230000008569 process Effects 0.000 claims description 21
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 10
- 229910052788 barium Inorganic materials 0.000 claims description 9
- 229910052791 calcium Inorganic materials 0.000 claims description 9
- 229910052712 strontium Inorganic materials 0.000 claims description 9
- 229910052725 zinc Inorganic materials 0.000 claims description 9
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 238000007259 addition reaction Methods 0.000 claims 7
- 229910021476 group 6 element Inorganic materials 0.000 claims 3
- 239000012528 membrane Substances 0.000 claims 1
- 238000000231 atomic layer deposition Methods 0.000 abstract description 31
- 150000002902 organometallic compounds Chemical class 0.000 abstract description 14
- 238000000151 deposition Methods 0.000 abstract description 11
- 238000000277 atomic layer chemical vapour deposition Methods 0.000 abstract description 6
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 abstract description 6
- 230000008021 deposition Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 39
- 239000000539 dimer Substances 0.000 description 31
- 239000000758 substrate Substances 0.000 description 15
- 238000005136 cathodoluminescence Methods 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000011575 calcium Substances 0.000 description 8
- 229910052976 metal sulfide Inorganic materials 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 238000001194 electroluminescence spectrum Methods 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000001228 spectrum Methods 0.000 description 6
- 238000002441 X-ray diffraction Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 238000005424 photoluminescence Methods 0.000 description 5
- 239000000376 reactant Substances 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- ORFSSYGWXNGVFB-UHFFFAOYSA-N sodium 4-amino-6-[[4-[4-[(8-amino-1-hydroxy-5,7-disulfonaphthalen-2-yl)diazenyl]-3-methoxyphenyl]-2-methoxyphenyl]diazenyl]-5-hydroxynaphthalene-1,3-disulfonic acid Chemical compound COC1=C(C=CC(=C1)C2=CC(=C(C=C2)N=NC3=C(C4=C(C=C3)C(=CC(=C4N)S(=O)(=O)O)S(=O)(=O)O)O)OC)N=NC5=C(C6=C(C=C5)C(=CC(=C6N)S(=O)(=O)O)S(=O)(=O)O)O.[Na+] ORFSSYGWXNGVFB-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- IOEJYZSZYUROLN-UHFFFAOYSA-M Sodium diethyldithiocarbamate Chemical compound [Na+].CCN(CC)C([S-])=S IOEJYZSZYUROLN-UHFFFAOYSA-M 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- -1 halogen ions Chemical class 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 150000002736 metal compounds Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000005001 rutherford backscattering spectroscopy Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- 238000000295 emission spectrum Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 230000005283 ground state Effects 0.000 description 3
- 239000012705 liquid precursor Substances 0.000 description 3
- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000002366 halogen compounds Chemical class 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 150000004763 sulfides Chemical class 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- IZSHZLKNFQAAKX-UHFFFAOYSA-N 5-cyclopenta-2,4-dien-1-ylcyclopenta-1,3-diene Chemical group C1=CC=CC1C1C=CC=C1 IZSHZLKNFQAAKX-UHFFFAOYSA-N 0.000 description 1
- 101100476480 Mus musculus S100a8 gene Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000003877 atomic layer epitaxy Methods 0.000 description 1
- PDGMFZNRFDLFEE-UHFFFAOYSA-N benzyl(triphenyl)plumbane Chemical compound C=1C=CC=CC=1[Pb](C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 PDGMFZNRFDLFEE-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- JGIATAMCQXIDNZ-UHFFFAOYSA-N calcium sulfide Chemical compound [Ca]=S JGIATAMCQXIDNZ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- KOLLAKXQEFEJTO-UHFFFAOYSA-N dicyclohexyl(diphenyl)plumbane Chemical compound C1CCC(CC1)[Pb](C1CCCCC1)(c1ccccc1)c1ccccc1 KOLLAKXQEFEJTO-UHFFFAOYSA-N 0.000 description 1
- 229940116901 diethyldithiocarbamate Drugs 0.000 description 1
- LMBWSYZSUOEYSN-UHFFFAOYSA-N diethyldithiocarbamic acid Chemical compound CCN(CC)C(S)=S LMBWSYZSUOEYSN-UHFFFAOYSA-N 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000695 excitation spectrum Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- XCAUINMIESBTBL-UHFFFAOYSA-N lead(ii) sulfide Chemical compound [Pb]=S XCAUINMIESBTBL-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- QZSXNPWWIBEWHV-UHFFFAOYSA-N tetracyclohexylplumbane Chemical compound C1CCCCC1[Pb](C1CCCCC1)(C1CCCCC1)C1CCCCC1 QZSXNPWWIBEWHV-UHFFFAOYSA-N 0.000 description 1
- WBJSMHDYLOJVKC-UHFFFAOYSA-N tetraphenyllead Chemical compound C1=CC=CC=C1[Pb](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 WBJSMHDYLOJVKC-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- DTTVFKVGEOETRX-UHFFFAOYSA-N triethyllead Chemical compound CC[Pb](CC)CC.CC[Pb](CC)CC DTTVFKVGEOETRX-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G21/00—Compounds of lead
- C01G21/21—Sulfides
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/24—Lead compounds
- C07F7/26—Tetra-alkyl lead compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/56—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing sulfur
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/66—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing germanium, tin or lead
- C09K11/661—Chalcogenides
- C09K11/662—Chalcogenides with zinc or cadmium
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/66—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing germanium, tin or lead
- C09K11/661—Chalcogenides
- C09K11/663—Chalcogenides with alkaline earth metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/88—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/88—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
- C09K11/881—Chalcogenides
- C09K11/883—Chalcogenides with zinc or cadmium
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/88—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing selenium, tellurium or unspecified chalcogen elements
- C09K11/881—Chalcogenides
- C09K11/885—Chalcogenides with alkaline earth metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/305—Sulfides, selenides, or tellurides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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Abstract
Description
Pb 농도(mol.%) | CIE 색좌표 | |
x | y | |
0.6 | 0.15 | 0.11 |
0.8 | 0.14 | 0.10 |
1.0 | 0.15 | 0.11 |
1.4 | 0.15 | 0.10 |
2.0 | 0.15 | 0.11 |
2.5 | 0.14 | 0.12 |
Claims (43)
- Ⅱ족 원소(M = Ca, Sr, Zn, Ba 또는 Mg)와 Ⅵ족 원소(X = S 또는 Se)를 포함하는 모재료를 형성하기 위한 모재료 성장반응 및 Pb2+이온을 상기 모재료 내에 발광중심이온으로 첨가하기 위한 발광중심이온 첨가반응을 이용하여 성장된 상기 모재료 내에 Pb2+이온을 발광중심이온으로 첨가하는 형광막의 제조방법에 있어서,상기 발광중심이온 첨가반응은 테트라알킬 납, 테트라아릴 납, 알킬아릴 납, 다이싸이클로디펜타디에닐 납 또는 비스트리알킬실릴 납 중 어느 하나를 Pb-전구체로 하여 상기 Pb-전구체와 H2X(X=S 또는 Se)가 반응하여 PbX가 형성되는 단계를 포함하는 것을 특징으로 하는 형광막의 제조 방법.
- 제1항 있어서,상기 테트라알킬 납, 테트라아릴 납, 알킬아릴 납 및 비스트리알킬실릴 납의 알킬기 또는 아릴기는 메틸기, 에틸기, 프로필기, 아이소프로필기, 싸이클로헥실기, 페닐기 또는 벤질기 중 적어도 하나인 것을 특징으로 하는 형광막의 제조 방법.
- 제1항 있어서,상기 테트라알킬 납은 테트라에틸 납인 것을 특징으로 하는 형광막 제조 방법.
- 제1항에 있어서,상기 모재료는 M-전구체와 H2X(X=S 또는 Se)가 반응하여 형성된 Ⅱ-Ⅵ족 화합물인 것을 특징을 하는 형광막의 제조 방법
- 제1항에 있어서,상기 형광막 내의 Pb2+이온의 농도는 0.2 ~ 4.0 mo1%인 것을 특징으로 하는 형광막의 제조방법.
- 제1항에 있어서,상기 모재료 성장반응 및 상기 발광중심이온 첨가반응은 동시에 진행되고, 상기 Pb2+이온의 농도는 M-전구체의 농도와 Pb-전구체의 농도 간의 상대적인 비율에 의하여 조절되는 것을 특징으로 하는 형광막의 제조 방법.
- 제1항에 있어서,상기 모재료 성장반응 및 상기 발광중심이온 첨가반응이 분리하여 교대로 이뤄지는 것을 특징으로 하는 형광막의 제조 방법.
- 제7항에 있어서,상기 모재료 성장반응을 이용하여 모재료 영역의 박막을 성장한 후 상기 발광중심이온 첨가반응을 이용하여 PbX(X = S 또는 Se)박막을 성장하는 과정을 복수회 반복하여 원하는 두께의 형광체 박막을 성장하는 것을 특징으로 하는 형광막의 제조 방법.
- 제7항에 있어서,상기 Pb2+이온의 농도는 모재료 영역의 박막의 두께와 PbX박막의 두께 간의 상대적인 비율에 의하여 조절되는 것을 특징으로 하는 형광막의 제조 방법.
- 제7항에 있어서,상기 PbX 박막의 1회 성장 두께는 0.005~0.6Å인 것을 특징으로 하는 형광막의 제조 방법.
- 제8항에 있어서,상기 모재료 성장반응을 a(a는 자연수) 싸이클 수행한 후, 상기 발광중심이온 첨가반응을 b(b는 자연수) 싸이클 수행하는 과정을 교대로 복수회 반복하여 모재료 영역의 박막과 PbX 박막을 성장하는 것을 특징으로 하는 형광막의 제조 방법.
- 제11항에 있어서,반응온도가 350℃ 이상인 경우 상기 발광중심 이온 첨가반응의 사이클 수 b가 2 이하인 것을 특징으로 하는 형광막의 제조 방법.
- 제11항에 있어서,상기 PbX 박막의 성장속도는 0.005 ~ 0.6Å/cycle 인 것을 특징으로 하는 형광막의 제조 방법.
- 제1항에 있어서,상기 모재료 성장반응 및 발광중심이온 첨가반응은 반응온도 150~500℃ 범위에서 이뤄지는 것을 특징으로 하는 형광막의 제조 방법.
- Ⅱ족 원소(M = Ca, Sr, Zn, Ba 또는 Mg) 및 Ⅵ족 원소(X = S 또는 Se)을 포함하는 모재료 내에 Pb2+이온이 발광중심이온으로 첨가된 형광막에 있어서,상기 Pb2+이온은 테트라알킬 납, 테트라아릴 납, 알킬아릴 납, 다이싸이클로 디펜타디에닐 납 또는 비스트리알킬실릴 납 중 어느 하나를 Pb-전구체로 하여 상기 Pb-전구체와 H2X(X=S 또는 Se)가 반응하여 형성된 PbX 상태로 상기 모재료 내에 첨가된 것을 특징으로 하는 형광막.
- 제15항에 있어서,상기 테트라알킬 납, 테트라아릴 납, 알킬아릴 납, 비스트리알킬실릴 납의 알킬기 또는 아릴기는 메킬기, 에틸기, 프로필기, 아이소프로필기, 싸이클로헥실기, 페닐기 또는 벤질기 중 적어도 하나인 것을 특징으로 하는 형광막.
- 제15항 있어서,상기 테트라알킬 납은 테트라에틸 납인 것을 특징으로 하는 형광막.
- 제15항에 있어서,상기 모재료는 M-전구체와 H2X(X=S 또는 Se)가 반응하여 형성된 Ⅱ-Ⅵ족 화합물인 것을 특징으로 하는 형광막.
- 제15항에 있어서,상기 형광막 내의 Pb2+이온의 농도는 0.2 ~ 4.0 mol%인 것을 특징으로 하는 형광막.
- 제15항에 있어서,상기 형광막은 상기 모재료 박막과 상기 발광중심이온이 포함된 PbX 박막이 복수회 교번 적층되어 형성된 형광체 박막인 것을 특징으로 하는 형광막.
- 제20항에 있어서,상기 PbX 박막의 한층의 두께는 0.005 ~ 0.6 Å인 것을 특징으로 하는 형광막.
- 제21항에 있어서,상기 PbX 박막의 성장속도는 0.005 ~ 0.6 Å/사이클인 것을 특징으로 하는 형광막.
- Ⅱ족 원소(M = Ca, Sr, Zn, Ba 또는 Mg) 및 Ⅵ족 원소(X = S 또는 Se)을 포함하는 모재료로 형성된 적어도 하나 이상의 모재료층을 구비하며, 상기 모재료층의 전부 또는 일부에 Pb2+이온이 발광중심이온으로 첨가된 다층구조의 형광막에 있어서,상기 Pb2+이온은 테트라알킬 납, 테트라아릴 납, 알킬아릴 납, 다이싸이클로 디펜타디에닐 납, 또는 비스트리알킬실릴 납 중 어느 하나를 Pb-전구체로 하여 상기 Pb-전구체와 H2X(X=S 또는 Se)가 반응하여 형성된 PbX 상태로 상기 모재료층 내에 첨가된 것을 특징으로 하는 다층구조의 형광막.
- 제23항에 있어서,상기 테트라알킬 납, 테트라아릴 납, 알킬아릴 납, 비스트리알킬실릴 납의 알킬기 또는 아릴기는 메킬기, 에틸기, 프로필기, 아이소프로필기, 싸이클로헥실기, 페닐기 또는 벤질기 중 적어도 하나인 것을 특징으로 하는 다층구조의 형광막.
- 제23항 있어서,상기 테트라알킬 납은 테트라에틸 납인 것을 특징으로 하는 다층구조의 형광막.
- 제23항에 있어서,상기 모재료는 M-전구체와 H2X(X=S 또는 Se)가 반응하여 형성된 Ⅱ-Ⅵ족 화합물인 것을 특징으로 하는 다층구조의 형광막.
- 제23항에 있어서,상기 모재료는 ZnX, CaX 또는 SrX로 형성된 것을 특징으로 하는 다층구조의 형광막.
- 제23항에 있어서,상기 형광막 내의 Pb2+이온의 농도는 0.2 ~ 4.0 mol%인 것을 특징으로 하는 다층구조의 형광막.
- 제23항에 있어서,상기 형광막은 상기 모재료 박막과 상기 발광중심이온이 포함된 PbX 박막이 복수회 교번 적층되어 형성된 형광체 박막인 것을 특징으로 하는 다층구조의 형광막.
- 제29항에 있어서,상기 PbX 박막의 한층의 두께는 0.005 ~ 0.6 Å인 것을 특징으로 하는 다층구조의 형광막.
- 제30항에 있어서,상기 PbX 박막의 성장 속도는 0.005 ~ 0.6 Å/사이클인 것을 특징으로 하는 다층구조의 형광막.
- 제1항의 방법으로 제조된 형광막을 포함하는 전계발광소자.
- 제15항의 형광막을 포함하는 전계발광소자.
- 제23항의 다층구조의 형광막을 포함하는 전계발광소자.
- 제32항 내지 제34항 중 어느 하나의 항에 있어서,상기 전계발광소자는 상기 형광막의 상하부에 절연막을 구비한 것을 특징으로 하는 전계발광소자.
- 제1항의 방법으로 제조된 형광막을 포함하는 음극선발광소자.
- 제15항의 형광막을 포함하는 음극선발광소자.
- PbX 박막 제조방법에 있어서,테트라알킬 납, 테트라아릴 납, 알킬아릴 납, 다이싸이클로디펜타티에닐 납 또는 비스트리알킬실릴 납 중 어느 하나를 Pb-전구체로 하여 상기 Pb-전구체와 H2X(X=S 또는 Se)가 반응시켜 PbX 박막을 형성하는 것을 특징으로 하는 PbX 박막 제조 방법.
- 제38항에 있어서,상기 테트라알킬 납, 테트라아릴 납, 알킬아릴 납, 비스트리알킬실릴 납의 알킬기 또는 아릴기는 메틸기, 에틸기, 프로필기, 아이소프로필기, 싸이클로헥실기, 페닐기 또는 벤질기 중 적어도 하나인 것을 특징으로 하는 PbX 박막 제조 방법.
- 제38항 있어서,상기 테트라알킬 납은 테트라에틸 납인 것을 특징으로 하는 PbX 박막 제조 방법.
- 제38항에 있어서,상기 반응은 100 ~ 450℃에서 이루어짐을 특징으로 하는 PbX 박막 제조 방법.
- 제38항에 있어서,상기 PbX 박막의 성장속도는 0.005 ~ 0.6 Å/사이클인 것을 특징으로 하는 PbX 박막 제조 방법.
- 제38항 내지 제42항 중 어느 하나의 항의 방법으로 제조된 PbX박막.
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KR1019990026897A KR100327105B1 (ko) | 1998-08-14 | 1999-07-05 | 고휘도 형광체 및 그 제조방법 |
JP11229063A JP2000138094A (ja) | 1998-08-14 | 1999-08-13 | PBX(X=S、Se)薄膜の製造方法とPBXを含む電界発光素子及びその製造方法 |
FI991732A FI121962B (fi) | 1998-08-14 | 1999-08-16 | Menetelmä runsaasti luminoivan loisteaineen valmistamiseksi |
CA 2313336 CA2313336C (en) | 1999-07-05 | 2000-07-04 | High luminance-phosphor and method for fabricating the same |
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KR100392363B1 (ko) * | 2000-12-26 | 2003-07-22 | 한국전자통신연구원 | 형광체 및 그 제조방법 |
KR100494843B1 (ko) * | 2002-11-01 | 2005-06-14 | 한국전자통신연구원 | 란탄족 이온이 도핑된 2족 금속황화물 형광층 제조 방법 |
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FI121962B (fi) | 2011-06-30 |
JP2000138094A (ja) | 2000-05-16 |
FI19991732A7 (fi) | 2000-02-14 |
KR20000016902A (ko) | 2000-03-25 |
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