KR101899019B1 - 감광성 잉크 조성물과 투명 도전체, 및 이들을 사용하는 방법 - Google Patents
감광성 잉크 조성물과 투명 도전체, 및 이들을 사용하는 방법 Download PDFInfo
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Images
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- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
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- C09D139/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Coating compositions based on derivatives of such polymers
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Abstract
Description
도 1a는 본 발명의 일 양태에 따라 제조된 도전성 필름 위에 배치된 마스크를 나타낸 것이다.
도 1b는 직접적인 광-패턴화에 따라 패턴화된 도전성 필름을 나타낸 것이다.
도 2는 열-활성 감광성 화합물을 갖는 투명 도전체 내에 보이지 않거나 저시정 (low-visibility)의 패턴이 형성된 본 발명의 일 양태를 나타낸 것이다.
도 3a는 어떠한 감광성 화합물도 포함하지 않는 표준 투명 도전체를 나타낸 것이다.
도 3b는 암실에서의 열처리 후, 열-활성 감광성 화합물을 포함하는 투명 도전체 내의 깨지거나 손상된 나노 와이어를 나타낸 것이다.
도 3c는 광-조사 후, 감광성 화합물을 포함하는 투명 도전체 내의 온전한 나노 와이어를 나타낸 것이다.
대조군 필름 (1) | 박막 필름 (2) | 박막 필름 (3) | |
T% | 92.5 | 92.0 | 92.3 |
H% | 0.62 | 0.75 | 0.61 |
R(Ohm/Sq) | 78 | >19,999 | 114 |
대조군 필름 (1) | 박막 필름 (2) 140℃/90 초 |
박막 필름 (4) 100℃/90 초 |
|
T% | 92.5 | 92.0 | 91.7 |
H% | 0.62 | 0.75 | 0.78 |
R(Ohm/Sq) | 78 | >19,999 | 280 |
대조군 필름 (1) | 박막 필름 (2) DPIN 140℃/90 초 |
박막 필름 (5) DPITf 160℃/90 초 |
박막 필름 (6) DPITf 광/160℃/90 초 |
|
T% | 92.5 | 92.0 | 91.8 | 91.8 |
H% | 0.62 | 0.75 | 0.80 | 0.64 |
R(Ohm/Sq) | 78 | >19,999 | 1,600 | 160 |
Claims (54)
- 복수개의 도전성 나노 구조체;
결합 물질;
감광성 화합물; 및
극성 용매를 포함하되, 상기 극성 용매는 4 이상의 극성 지수를 갖는 양성자성 용매인, 잉크 조성물. - 제1항에 있어서, 상기 결합 물질이, 폴리비닐피롤리돈, 폴리비닐 알코올, 폴리아크릴아미드, 폴리아크릴레이트, 폴리에틸렌 옥사이드, 폴리에틸렌 이민, 음이온성 및 양이온성 고분자 전해질, 폴리(2-에틸-2-옥사졸린), 하이드록시프로필메틸 셀룰로오스, 하이드록시프로필메틸 셀룰로오스 프탈레이트, 하이드록시프로필 셀룰로오스, 하이드록시부틸메틸 셀룰로오스, 에틸하이드록시에틸 셀룰로오스, 소듐 카르복시메틸-하이드록시에틸 셀룰로오스, 및 카르복시메틸에틸 셀룰로오스로 이루어진 군에서 선택되는 가교성 폴리머인, 잉크 조성물.
- 제2항에 있어서, 상기 가교성 폴리머가 폴리비닐피롤리돈인 잉크 조성물.
- 제2항에 있어서, 상기 가교성 폴리머가 하이드록시프로필메틸 셀룰로오스인 잉크 조성물.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 감광성 화합물이 IRGACURE® 754인 잉크 조성물.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 감광성 화합물이 오늄 염인 잉크 조성물.
- 삭제
- 제1항에 있어서, 상기 극성 용매가 물, 1가 알코올 또는 다가 알코올인 잉크 조성물.
- 제8항에 있어서, 상기 극성 용매가 폴리프로필렌 글리콜 모노메틸 에테르인 잉크 조성물.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 도전성 나노 구조체는 금속 나노 와이어인 잉크 조성물.
- 제10항에 있어서, 상기 금속 나노 와이어는 은 나노 와이어인 잉크 조성물.
- 제11항에 있어서, 상기 금속 나노 와이어는 길이가 10 ㎛ 초과이고 직경이 100 nm 미만인 잉크 조성물.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 계면 활성제를 추가로 포함하는 잉크 조성물.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 보조 용매를 추가로 포함하는 잉크 조성물.
- 제14항에 있어서, 상기 보조 용매는 극성 용매인 잉크 조성물.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 상기 나노 구조체에 대한 상기 결합 물질의 중량비가 0.1:1 내지 10:1인 잉크 조성물.
- 제1항 내지 제4항 중 어느 하나의 항에 있어서, 1 내지 1000 cP의 점도를 갖는 잉크 조성물.
- 복수개의 도전성 나노 구조체, 결합 물질, 감광성 화합물, 및 극성 용매로서, 4 이상의 극성 지수를 갖는 양성자성 용매를 포함하는 잉크 조성물을 기판에 증착하고, 상기 극성 용매를 제거함으로써, 상기 기판에, 상호 연결된 도전성 나노 구조체의 박막 필름을 형성하는 단계; 및
상기 박막 필름의 일부를 UV 광원에 노출시켜 상기 박막 필름의 상기 노출된 부분 내의 가교성 폴리머를 가교 결합시키는 단계를 포함하는 방법. - 삭제
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- 복수개의 나노 구조체, 결합 물질, 열-활성 감광성 화합물, 및 극성 용매로서, 4 이상의 극성 지수를 갖는 양성자성 용매를 포함하는 잉크 조성물을 기판에 증착하고, 상기 극성 용매를 제거함으로써, 상기 기판에, 상호 연결된 도전성 나노 구조체의 박막 필름을 형성하는 단계;
개구부를 포함하며 상기 박막 필름을 마스크에 덮인 영역 및 상기 개구부에 대응되는 마스크에 덮이지 않은 영역으로 경계 짓는 마스크를, 상기 박막 필름 위에 배치하는 단계;
제1 온도에서 상기 마스크의 개구부를 통하여 상기 박막 필름을 UV 광원에 노출시켜 상기 마스크에 덮이지 않은 영역 내의 상기 감광성 화합물을 광-분해시키는 단계; 및
제2 온도의 암실에서 상기 박막 필름을 열원에 노출시켜 상기 마스크에 덮인 영역 내의 상기 감광성 화합물을 열-분해시키는 단계를 포함하는 방법. - 삭제
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PCT/US2011/023732 WO2011097470A2 (en) | 2010-02-05 | 2011-02-04 | Photosensitive ink compositions and transparent conductors and method of using the same |
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Country Status (7)
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KR (1) | KR101899019B1 (ko) |
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Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102103541B1 (ko) | 2005-08-12 | 2020-04-23 | 캄브리오스 필름 솔루션스 코포레이션 | 나노와이어 기반의 투명 도전체 |
US20120097329A1 (en) * | 2010-05-21 | 2012-04-26 | Merck Patent Gesellschaft | Stencils for High-Throughput Micron-Scale Etching of Substrates and Processes of Making and Using the Same |
TW201224072A (en) * | 2010-10-22 | 2012-06-16 | Cambrios Technologies Corp | Nanowire ink compositions and printing of same |
AU2011338991B2 (en) * | 2010-12-07 | 2017-04-13 | Rhodia Operations | Electrically conductive nanostructures, method for making such nanostructures, electrically conductive polymer films containing such nanostructures, and electronic devices containing such films |
CN108762575A (zh) | 2011-02-23 | 2018-11-06 | 迪睿合电子材料有限公司 | 分散液 |
US10494720B2 (en) | 2011-02-28 | 2019-12-03 | Nthdegree Technologies Worldwide Inc | Metallic nanofiber ink, substantially transparent conductor, and fabrication method |
US20120217453A1 (en) | 2011-02-28 | 2012-08-30 | Nthdegree Technologies Worldwide Inc. | Metallic Nanofiber Ink, Substantially Transparent Conductor, and Fabrication Method |
WO2013002195A1 (ja) * | 2011-06-30 | 2013-01-03 | 富士フイルム株式会社 | 導電膜及びその製造方法、並びにタッチパネル |
CN102311681A (zh) * | 2011-08-25 | 2012-01-11 | 浙江科创新材料科技有限公司 | Uv固化型银纳米线墨水及其制备方法和使用方法 |
JP5646424B2 (ja) * | 2011-09-27 | 2014-12-24 | 株式会社東芝 | 透明電極積層体 |
KR101305710B1 (ko) * | 2011-12-21 | 2013-09-09 | 엘지이노텍 주식회사 | 나노 와이어 조성물 및 투명전극 제조 방법 |
TWI648751B (zh) * | 2012-02-28 | 2019-01-21 | 以色列商客利福薄膜技術有限公司 | 在彈性基材上之透明導電塗層 |
KR101416629B1 (ko) * | 2012-04-06 | 2014-07-09 | 한국전기연구원 | 미세 패턴을 갖는 제품의 제조 방법, 및 이에 의해 제조되는 제품 |
KR20150013639A (ko) * | 2012-05-18 | 2015-02-05 | 유니-픽셀 디스플레이스, 인코포레이티드 | 금속나노입자들 및 나노와이어들을 포함한 잉크를 사용하여 도전성 패턴들을 형성하는 방법 |
CN103258596B (zh) * | 2013-04-27 | 2016-12-28 | 苏州诺菲纳米科技有限公司 | 导电薄膜的消影方法 |
US9920207B2 (en) | 2012-06-22 | 2018-03-20 | C3Nano Inc. | Metal nanostructured networks and transparent conductive material |
US10029916B2 (en) | 2012-06-22 | 2018-07-24 | C3Nano Inc. | Metal nanowire networks and transparent conductive material |
US9050775B2 (en) | 2012-10-12 | 2015-06-09 | Nano And Advanced Materials Institute Limited | Methods of fabricating transparent and nanomaterial-based conductive film |
EP2720086A1 (en) | 2012-10-12 | 2014-04-16 | Nano And Advanced Materials Institute Limited | Methods of fabricating transparent and nanomaterial-based conductive film |
US8709194B1 (en) * | 2013-02-25 | 2014-04-29 | Eastman Kodak Company | Assembling an electrode device |
US10020807B2 (en) | 2013-02-26 | 2018-07-10 | C3Nano Inc. | Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks |
WO2014157856A1 (ko) * | 2013-03-25 | 2014-10-02 | 전자부품연구원 | 감광성 코팅 조성물, 그를 이용한 코팅 전도막 및 그의 제조 방법 |
KR101447516B1 (ko) | 2013-03-25 | 2014-10-08 | 전자부품연구원 | 전도성 나노 구조체를 포함하는 전도성 기판 및 그의 제조 방법 |
KR101468496B1 (ko) * | 2013-07-25 | 2014-12-04 | 전자부품연구원 | 전도성 나노 물질을 포함한 감광성 코팅액 조성물 및 그를 이용한 코팅 전도막 |
KR101498187B1 (ko) * | 2013-10-10 | 2015-03-04 | 전자부품연구원 | 감광성 코팅 조성물 및 그를 이용한 투명전극용 코팅 전도막 |
US9846362B2 (en) | 2013-03-29 | 2017-12-19 | Toray Industries, Inc. | Conductive paste and method of producing conductive pattern |
US9368248B2 (en) | 2013-04-05 | 2016-06-14 | Nuovo Film, Inc. | Transparent conductive electrodes comprising metal nanowires, their structure design, and method of making such structures |
US20150014025A1 (en) * | 2013-04-05 | 2015-01-15 | Nuovo Film, Inc. | Transparent conductive electrodes comprising merged metal nanowires, their structure design, and method of making such structures |
JP2015034279A (ja) * | 2013-04-10 | 2015-02-19 | デクセリアルズ株式会社 | 透明導電膜形成用インク組成物、透明導電膜、透明電極の製造方法、及び画像表示装置 |
TW201514802A (zh) | 2013-07-16 | 2015-04-16 | Lg Innotek Co Ltd | 觸控螢幕以及包含其之觸控裝置 |
TWI510991B (zh) * | 2013-07-25 | 2015-12-01 | Henghao Technology Co Ltd | 觸控面板、導電薄膜及其製作方法 |
TWI518756B (zh) * | 2013-08-16 | 2016-01-21 | 財團法人工業技術研究院 | 圖案化的導電薄膜及其製造方法與應用 |
DE102013109755A1 (de) | 2013-09-06 | 2015-03-12 | Rent A Scientist Gmbh | Leitfähiger Klebstoff |
WO2015058785A1 (en) | 2013-10-21 | 2015-04-30 | Hewlett-Packard Indigo B.V. | Electrostatic ink compositions |
US11274223B2 (en) * | 2013-11-22 | 2022-03-15 | C3 Nano, Inc. | Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches |
US11343911B1 (en) | 2014-04-11 | 2022-05-24 | C3 Nano, Inc. | Formable transparent conductive films with metal nanowires |
CN103956431B (zh) * | 2014-04-30 | 2017-10-20 | 华南理工大学 | 一种溶液加工的有机‑无机平面异质结太阳电池及其制备 |
CN104021840A (zh) * | 2014-06-18 | 2014-09-03 | 中南大学 | 一种低温固化的高导电银浆、导电薄膜及其制备方法 |
KR102356158B1 (ko) * | 2014-06-30 | 2022-02-03 | 엘지디스플레이 주식회사 | 투명도전막의 제조방법 및 투명도전막을 포함하는 표시장치 |
US9183968B1 (en) | 2014-07-31 | 2015-11-10 | C3Nano Inc. | Metal nanowire inks for the formation of transparent conductive films with fused networks |
CN104157786A (zh) * | 2014-07-31 | 2014-11-19 | 清华大学 | 钙钛矿型太阳能电池及其制备方法 |
KR101595895B1 (ko) * | 2014-08-11 | 2016-02-19 | 주식회사 엔앤비 | 광소결로 접합된 은 나노와이어를 포함하는 투명전극용 필름, 광소결을 이용한 은 나노와이어 접합용 분산액 및 은 나노와이어의 접합 방법 |
FR3034683B1 (fr) * | 2015-04-10 | 2017-05-05 | Poly-Ink | Suspension stable de nanofils d'argent et son procede de fabrication |
DE102015105831A1 (de) * | 2015-04-16 | 2016-10-20 | Rent-A-Scientist Gmbh | Metallnanopartikelhaltige, disperse Formulierung |
WO2017034870A1 (en) | 2015-08-21 | 2017-03-02 | 3M Innovative Properties Company | Transparent conductors including metal traces and methods of making same |
CN105259715A (zh) * | 2015-11-20 | 2016-01-20 | 深圳市华星光电技术有限公司 | 图案化电极的制作方法、液晶显示面板及其制作方法 |
KR20170101005A (ko) | 2016-02-26 | 2017-09-05 | 삼성에스디아이 주식회사 | 감광성 수지 조성물 및 이를 이용한 컬러필터 |
KR101879055B1 (ko) * | 2016-06-29 | 2018-07-18 | 한양대학교 에리카산학협력단 | 나노 구조체 네트워크 및 그 제조 방법 |
US11624000B2 (en) * | 2017-05-23 | 2023-04-11 | Alpha Assembly Solutions Inc. | Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures |
WO2019195473A2 (en) * | 2018-04-03 | 2019-10-10 | The Regents Of The University Of California | Methods for photo-induced metal printing |
CN111117367B (zh) * | 2018-10-30 | 2021-06-25 | 中国科学院化学研究所 | 一种光敏性银基导电油墨、由其制备银导电结构的方法和柔性导电材料 |
TWI819208B (zh) * | 2019-04-03 | 2023-10-21 | 英屬維爾京群島商天材創新材料科技股份有限公司 | 導電膜 |
JP7543874B2 (ja) | 2020-11-20 | 2024-09-03 | 大日本印刷株式会社 | 積層体、積層体の製造方法、パウチおよびパウチの製造方法 |
CN113744927B (zh) * | 2021-08-03 | 2024-06-28 | 暨南大学 | 一种金属纳米线的光熔接方法、金属透明导电电极及金属纳米线油墨 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005229109A (ja) * | 2004-02-10 | 2005-08-25 | E I Du Pont De Nemours & Co | インクジェット印刷可能な厚膜インク組成物および方法 |
JP2006009085A (ja) | 2004-06-25 | 2006-01-12 | Toyo Ink Mfg Co Ltd | 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および非接触型メディア |
JP2006335995A (ja) | 2005-06-06 | 2006-12-14 | Hitachi Maxell Ltd | インクジェット用導電性インク、導電性パターンおよび導電体 |
Family Cites Families (194)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2426318A (en) * | 1945-11-15 | 1947-08-26 | Stanolind Oil & Gas Co | Inhibiting corrosion |
EP0100670B1 (en) | 1982-07-30 | 1986-12-03 | Mishima Paper Co. Ltd | Conductive film for packaging |
FR2537898A1 (fr) * | 1982-12-21 | 1984-06-22 | Univ Paris | Procede de reduction de composes metalliques par les polyols, et poudres metalliques obtenues par ce procede |
US4524894A (en) | 1982-12-29 | 1985-06-25 | Gerber Garment Technology, Inc. | Method and apparatus for forming pattern pieces |
US4780371A (en) | 1986-02-24 | 1988-10-25 | International Business Machines Corporation | Electrically conductive composition and use thereof |
JPS63229061A (ja) * | 1987-03-18 | 1988-09-22 | テルモ株式会社 | 膜型人工肺とその製造方法 |
DE3870012D1 (de) * | 1987-04-03 | 1992-05-21 | Ciba Geigy Ag | Antistatische und elektrisch leitende polymere und formmassen. |
JPH0794036B2 (ja) | 1988-07-05 | 1995-10-11 | 東レ株式会社 | 超純水の製造方法 |
US5063125A (en) * | 1989-12-29 | 1991-11-05 | Xerox Corporation | Electrically conductive layer for electrical devices |
US5716663A (en) * | 1990-02-09 | 1998-02-10 | Toranaga Technologies | Multilayer printed circuit |
US5225244A (en) * | 1990-12-17 | 1993-07-06 | Allied-Signal Inc. | Polymeric anti-reflection coatings and coated articles |
US5165985A (en) | 1991-06-28 | 1992-11-24 | Minnesota Mining And Manufacturing Company | Method of making a flexible, transparent film for electrostatic shielding |
JPH05194856A (ja) | 1991-09-05 | 1993-08-03 | Otsuka Chem Co Ltd | 導電性エラストマー組成物 |
US5270364A (en) | 1991-09-24 | 1993-12-14 | Chomerics, Inc. | Corrosion resistant metallic fillers and compositions containing same |
EP0554220A1 (de) | 1992-01-29 | 1993-08-04 | Ciba-Geigy Ag | Charge-Transfer Komplexe mit Ferrocenen, deren Herstellung und deren Verwendung |
DE59304518D1 (de) * | 1992-07-15 | 1997-01-02 | Ciba Geigy Ag | Beschichtetes Material, dessen Herstellung und Verwendung |
EP0588759A1 (de) * | 1992-08-20 | 1994-03-23 | Ciba-Geigy Ag | Dithiopentacenderivate, deren Herstellung und deren Verwendung als Elektronenakzeptoren in Charge-Transfer Komplexen |
JPH06162818A (ja) | 1992-11-18 | 1994-06-10 | Ajinomoto Co Inc | 活性エネルギー線硬化型導電性組成物 |
JPH06215631A (ja) | 1993-01-19 | 1994-08-05 | Ajinomoto Co Inc | 繊維状導電性物質及びこれを含有する導電性樹脂組成物 |
US5518810A (en) * | 1993-06-30 | 1996-05-21 | Mitsubishi Materials Corporation | Infrared ray cutoff material and infrared cutoff powder use for same |
US5460701A (en) * | 1993-07-27 | 1995-10-24 | Nanophase Technologies Corporation | Method of making nanostructured materials |
EP0653763A1 (en) | 1993-11-17 | 1995-05-17 | SOPHIA SYSTEMS Co., Ltd. | Ultraviolet hardenable, solventless conductive polymeric material |
US5759230A (en) * | 1995-11-30 | 1998-06-02 | The United States Of America As Represented By The Secretary Of The Navy | Nanostructured metallic powders and films via an alcoholic solvent process |
US5897945A (en) * | 1996-02-26 | 1999-04-27 | President And Fellows Of Harvard College | Metal oxide nanorods |
IT1282387B1 (it) * | 1996-04-30 | 1998-03-20 | Videocolor Spa | Rivestimento antistatico,antiabbagliante,per una superficie a riflessione-trasmissione |
JPH09324324A (ja) | 1996-06-07 | 1997-12-16 | Mitsubishi Materials Corp | 微細金属繊維及びその製法並びに該繊維を用いた導電性塗料 |
JPH1017325A (ja) | 1996-07-03 | 1998-01-20 | Sumitomo Metal Mining Co Ltd | 酸化インジウム粉末及びその製造方法 |
JPH1046382A (ja) | 1996-07-26 | 1998-02-17 | Mitsubishi Materials Corp | 微細金属繊維の製造方法及び該繊維を用いた導電性塗料 |
US6933331B2 (en) * | 1998-05-22 | 2005-08-23 | Nanoproducts Corporation | Nanotechnology for drug delivery, contrast agents and biomedical implants |
US5851507A (en) | 1996-09-03 | 1998-12-22 | Nanomaterials Research Corporation | Integrated thermal process for the continuous synthesis of nanoscale powders |
US6344271B1 (en) * | 1998-11-06 | 2002-02-05 | Nanoenergy Corporation | Materials and products using nanostructured non-stoichiometric substances |
US5905000A (en) * | 1996-09-03 | 1999-05-18 | Nanomaterials Research Corporation | Nanostructured ion conducting solid electrolytes |
US6202471B1 (en) | 1997-10-10 | 2001-03-20 | Nanomaterials Research Corporation | Low-cost multilaminate sensors |
US5952040A (en) * | 1996-10-11 | 1999-09-14 | Nanomaterials Research Corporation | Passive electronic components from nano-precision engineered materials |
US5788738A (en) * | 1996-09-03 | 1998-08-04 | Nanomaterials Research Corporation | Method of producing nanoscale powders by quenching of vapors |
US5731119A (en) * | 1996-11-12 | 1998-03-24 | Eastman Kodak Company | Imaging element comprising an electrically conductive layer containing acicular metal oxide particles and a transparent magnetic recording layer |
US5719016A (en) * | 1996-11-12 | 1998-02-17 | Eastman Kodak Company | Imaging elements comprising an electrically conductive layer containing acicular metal-containing particles |
JP3398587B2 (ja) | 1996-12-10 | 2003-04-21 | タキロン株式会社 | 成形可能な制電性樹脂成形品 |
US6379745B1 (en) * | 1997-02-20 | 2002-04-30 | Parelec, Inc. | Low temperature method and compositions for producing electrical conductors |
JP3510761B2 (ja) * | 1997-03-26 | 2004-03-29 | 太陽インキ製造株式会社 | アルカリ現像型光硬化性導電性ペースト組成物及びそれを用いて電極形成したプラズマディスプレイパネル |
US6045925A (en) * | 1997-08-05 | 2000-04-04 | Kansas State University Research Foundation | Encapsulated nanometer magnetic particles |
TW505685B (en) * | 1997-09-05 | 2002-10-11 | Mitsubishi Materials Corp | Transparent conductive film and composition for forming same |
US6514453B2 (en) | 1997-10-21 | 2003-02-04 | Nanoproducts Corporation | Thermal sensors prepared from nanostructureed powders |
JP2972702B2 (ja) * | 1998-03-17 | 1999-11-08 | 静岡日本電気株式会社 | ペン入力型携帯情報端末機 |
US5867945A (en) * | 1998-06-04 | 1999-02-09 | Scafidi; Stephen J. | Self-cleaning gutter |
US6416818B1 (en) * | 1998-08-17 | 2002-07-09 | Nanophase Technologies Corporation | Compositions for forming transparent conductive nanoparticle coatings and process of preparation therefor |
US6294401B1 (en) * | 1998-08-19 | 2001-09-25 | Massachusetts Institute Of Technology | Nanoparticle-based electrical, chemical, and mechanical structures and methods of making same |
US6241451B1 (en) * | 1998-09-08 | 2001-06-05 | Knight Manufacturing Corp. | Distributor apparatus for spreading materials |
US6541539B1 (en) * | 1998-11-04 | 2003-04-01 | President And Fellows Of Harvard College | Hierarchically ordered porous oxides |
US6855202B2 (en) * | 2001-11-30 | 2005-02-15 | The Regents Of The University Of California | Shaped nanocrystal particles and methods for making the same |
US6274412B1 (en) * | 1998-12-21 | 2001-08-14 | Parelec, Inc. | Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays |
US6265466B1 (en) * | 1999-02-12 | 2001-07-24 | Eikos, Inc. | Electromagnetic shielding composite comprising nanotubes |
US6030553A (en) * | 1999-04-01 | 2000-02-29 | Industrial Technology Research Institute | Polymer thick film resistor pastes |
JP3909791B2 (ja) | 1999-04-19 | 2007-04-25 | 共同印刷株式会社 | 透明導電膜の転写方法 |
US6881604B2 (en) * | 1999-05-25 | 2005-04-19 | Forskarpatent I Uppsala Ab | Method for manufacturing nanostructured thin film electrodes |
US6536106B1 (en) * | 1999-06-30 | 2003-03-25 | The Penn State Research Foundation | Electric field assisted assembly process |
CA2372707C (en) * | 1999-07-02 | 2014-12-09 | President And Fellows Of Harvard College | Nanoscopic wire-based devices, arrays, and method of their manufacture |
JP3882419B2 (ja) | 1999-09-20 | 2007-02-14 | 旭硝子株式会社 | 導電膜形成用塗布液およびその用途 |
US6244608B1 (en) | 1999-09-24 | 2001-06-12 | The Boler Company. | Ramp-accommodating movable subframe for a semi-trailer |
DE60043918D1 (de) | 1999-09-28 | 2010-04-15 | Kyodo Printing Co Ltd | Übertragungskörper und Verwendungsverfahren |
JP2002083518A (ja) * | 1999-11-25 | 2002-03-22 | Sumitomo Metal Mining Co Ltd | 透明導電性基材とその製造方法並びにこの透明導電性基材が適用された表示装置、および透明導電層形成用塗液とその製造方法 |
WO2001044132A1 (fr) * | 1999-12-17 | 2001-06-21 | Asahi Glass Company, Limited | Composition de dispersion de particules ultrafines, composition de couche de liaison intercouche pour verre feuillete, couche de liaison intercouche, et verre feuillete |
JP4253973B2 (ja) * | 1999-12-20 | 2009-04-15 | Jsr株式会社 | 無機造形物製造用感放射線性樹脂組成物および無機造形物の製造方法 |
JP2001205600A (ja) | 2000-01-27 | 2001-07-31 | Canon Inc | 微細構造体及びその製造方法 |
WO2001070873A2 (en) * | 2000-03-22 | 2001-09-27 | University Of Massachusetts | Nanocylinder arrays |
US6773823B2 (en) * | 2000-04-07 | 2004-08-10 | University Of New Orleans Research And Technology Foundation, Inc. | Sequential synthesis of core-shell nanoparticles using reverse micelles |
JP2001291431A (ja) | 2000-04-10 | 2001-10-19 | Jsr Corp | 異方導電性シート用組成物、異方導電性シート、その製造方法および異方導電性シートを用いた接点構造 |
US6858158B2 (en) * | 2002-01-25 | 2005-02-22 | Konarka Technologies, Inc. | Low temperature interconnection of nanoparticles |
JP4788852B2 (ja) * | 2000-07-25 | 2011-10-05 | 住友金属鉱山株式会社 | 透明導電性基材とその製造方法およびこの製造方法に用いられる透明コート層形成用塗布液と透明導電性基材が適用された表示装置 |
JP4759215B2 (ja) * | 2000-08-15 | 2011-08-31 | ハマヘッド デザイン アンド ディベラップメント、インコーポレイテッド | 胃アクセス・ポート |
AU2002220566B8 (en) * | 2000-09-25 | 2007-09-13 | Chemetall Gmbh | Method for pretreating and coating metal surfaces, prior to forming, with a paint-like coating and use of substrates so coated |
GB0025016D0 (en) * | 2000-10-12 | 2000-11-29 | Micromass Ltd | Method nad apparatus for mass spectrometry |
EP1394817A1 (en) | 2000-11-21 | 2004-03-03 | Nissan Chemical Industries Ltd. | Electro-conductive oxide particle and process for its production |
EP2233606B1 (en) * | 2000-12-12 | 2013-02-13 | Konica Corporation | Plasma discharge apparatus |
US6744425B2 (en) | 2000-12-26 | 2004-06-01 | Bridgestone Corporation | Transparent electroconductive film |
US6444495B1 (en) * | 2001-01-11 | 2002-09-03 | Honeywell International, Inc. | Dielectric films for narrow gap-fill applications |
WO2002076724A1 (en) | 2001-03-26 | 2002-10-03 | Eikos, Inc. | Coatings containing carbon nanotubes |
TW554388B (en) * | 2001-03-30 | 2003-09-21 | Univ California | Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
JP2002322558A (ja) * | 2001-04-25 | 2002-11-08 | Konica Corp | 薄膜形成方法、光学フィルム、偏光板及び画像表示装置 |
US7147687B2 (en) | 2001-05-25 | 2006-12-12 | Nanosphere, Inc. | Non-alloying core shell nanoparticles |
WO2002096262A2 (en) | 2001-05-25 | 2002-12-05 | Northwestern University | Non-alloying core shell nanoparticles |
US6697881B2 (en) * | 2001-05-29 | 2004-02-24 | Hewlett-Packard Development Company, L.P. | Method and system for efficient format, read, write, and initial copy processing involving sparse logical units |
US6706402B2 (en) * | 2001-07-25 | 2004-03-16 | Nantero, Inc. | Nanotube films and articles |
US6835591B2 (en) | 2001-07-25 | 2004-12-28 | Nantero, Inc. | Methods of nanotube films and articles |
US6934001B2 (en) * | 2001-08-13 | 2005-08-23 | Sharp Laboratories Of America, Inc. | Structure and method for supporting a flexible substrate |
KR100438408B1 (ko) * | 2001-08-16 | 2004-07-02 | 한국과학기술원 | 금속간의 치환 반응을 이용한 코어-쉘 구조 및 혼합된합금 구조의 금속 나노 입자의 제조 방법과 그 응용 |
WO2003068674A1 (fr) | 2002-02-15 | 2003-08-21 | Japan Science And Technology Agency | Structure de fils nanometriques en metal noble et leur procede de production |
EP1339082A1 (en) | 2002-02-25 | 2003-08-27 | Asahi Glass Company Ltd. | Impact-resistant film for flat display panel, and flat display panel |
US6872645B2 (en) * | 2002-04-02 | 2005-03-29 | Nanosys, Inc. | Methods of positioning and/or orienting nanostructures |
US6946410B2 (en) * | 2002-04-05 | 2005-09-20 | E. I. Du Pont De Nemours And Company | Method for providing nano-structures of uniform length |
JP4130655B2 (ja) | 2002-05-10 | 2008-08-06 | ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク | ナノ粒子の膜の電場補助的な堆積方法 |
ATE450581T1 (de) | 2002-06-13 | 2009-12-15 | Nanopowders Ind Ltd | Ein verfahren zur herstellung von transparenten und leitfähigen nano-beschichtungen und nano- pulverbeschichtungen |
JP3842177B2 (ja) | 2002-07-03 | 2006-11-08 | 独立行政法人科学技術振興機構 | 貴金属ナノチューブ及びその製造方法 |
JP2004035962A (ja) | 2002-07-04 | 2004-02-05 | Toyota Motor Corp | 金属ナノチューブの製造法 |
JP2004055298A (ja) * | 2002-07-18 | 2004-02-19 | Catalysts & Chem Ind Co Ltd | 透明導電性被膜形成用塗布液、および透明導電性被膜付基材、表示装置 |
JP4134313B2 (ja) | 2002-07-24 | 2008-08-20 | Dowaエレクトロニクス株式会社 | 導電性粉末の製造方法 |
JP4266732B2 (ja) * | 2002-08-30 | 2009-05-20 | キヤノン株式会社 | 積層型回折光学素子 |
JP4134314B2 (ja) | 2002-09-13 | 2008-08-20 | Dowaエレクトロニクス株式会社 | 導電性粉末の製造方法 |
US7067867B2 (en) * | 2002-09-30 | 2006-06-27 | Nanosys, Inc. | Large-area nonenabled macroelectronic substrates and uses therefor |
US7135728B2 (en) | 2002-09-30 | 2006-11-14 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
JP2004139838A (ja) * | 2002-10-17 | 2004-05-13 | Noritake Co Ltd | 導体ペーストおよびその利用 |
US7560160B2 (en) * | 2002-11-25 | 2009-07-14 | Materials Modification, Inc. | Multifunctional particulate material, fluid, and composition |
US6949931B2 (en) * | 2002-11-26 | 2005-09-27 | Honeywell International Inc. | Nanotube sensor |
JP3972093B2 (ja) | 2002-12-04 | 2007-09-05 | 独立行政法人物質・材料研究機構 | β−Ga2O3ナノウイスカーとその製造方法 |
JP4341005B2 (ja) | 2002-12-17 | 2009-10-07 | 三菱マテリアル株式会社 | 金属ナノワイヤー含有組成物および電磁波遮蔽フィルター |
JP2004196981A (ja) | 2002-12-19 | 2004-07-15 | Toyobo Co Ltd | 表面導電性樹脂成形体 |
KR100502821B1 (ko) * | 2002-12-26 | 2005-07-22 | 이호영 | 구리산화물 또는 구리 나노와이어로 이루어진 전자방출팁의 저온 형성 방법 및 이 방법에 의해 제조된 전자방출팁을 포함하는 디스플레이 장치 또는 광원 |
JP2007112133A (ja) | 2003-01-30 | 2007-05-10 | Takiron Co Ltd | 導電性成形体 |
JP2004230690A (ja) | 2003-01-30 | 2004-08-19 | Takiron Co Ltd | 制電性透明樹脂板 |
US20060257638A1 (en) | 2003-01-30 | 2006-11-16 | Glatkowski Paul J | Articles with dispersed conductive coatings |
JP4471346B2 (ja) | 2003-01-31 | 2010-06-02 | タキロン株式会社 | 電磁波シールド体 |
JP2004238554A (ja) | 2003-02-07 | 2004-08-26 | Toppan Forms Co Ltd | 金属ナノ微粒子を含む光輝性塗工液、光輝性金属箔 |
JP2004253326A (ja) | 2003-02-21 | 2004-09-09 | Toyobo Co Ltd | 導電性フイルム |
JP2004256702A (ja) | 2003-02-26 | 2004-09-16 | Toyobo Co Ltd | 導電性塗料 |
US7029514B1 (en) * | 2003-03-17 | 2006-04-18 | University Of Rochester | Core-shell magnetic nanoparticles and nanocomposite materials formed therefrom |
US6916842B2 (en) * | 2003-03-24 | 2005-07-12 | E. I. Du Pont De Nemours And Company | Production of 5-methyl-n-(methyl aryl)-2-pyrrolidone, 5-methyl-n-(methyl cycloalkyl)-2-pyrrolidone and 5-methyl-n-alkyl-2-pyrrolidone by reductive amination of levulinic acid esters with cyano compounds |
US6936761B2 (en) * | 2003-03-29 | 2005-08-30 | Nanosolar, Inc. | Transparent electrode, optoelectronic apparatus and devices |
CN100458471C (zh) | 2003-04-28 | 2009-02-04 | 多喜兰株式会社 | 电磁屏蔽光漫射板 |
TWI250202B (en) * | 2003-05-13 | 2006-03-01 | Eternal Chemical Co Ltd | Process and slurry for chemical mechanical polishing |
US7033416B2 (en) * | 2003-05-22 | 2006-04-25 | The United States Of America As Represented By The Secretary Of The Navy | Low temperature synthesis of metallic nanoparticles |
CN100395283C (zh) * | 2003-07-04 | 2008-06-18 | 日东电工株式会社 | 导电纤维素基薄膜 |
KR101132076B1 (ko) * | 2003-08-04 | 2012-04-02 | 나노시스, 인크. | 나노선 복합체 및 나노선 복합체로부터 전자 기판을제조하기 위한 시스템 및 프로세스 |
EP1661648A4 (en) | 2003-09-05 | 2008-06-11 | Mitsubishi Materials Corp | METAL MICROPARTICLES, COMPOSITION, AND METHOD FOR PRODUCING A METAL MICROPARTMENT |
US7062848B2 (en) * | 2003-09-18 | 2006-06-20 | Hewlett-Packard Development Company, L.P. | Printable compositions having anisometric nanostructures for use in printed electronics |
US7067328B2 (en) * | 2003-09-25 | 2006-06-27 | Nanosys, Inc. | Methods, devices and compositions for depositing and orienting nanostructures |
JP2005103723A (ja) | 2003-10-01 | 2005-04-21 | National Institute Of Advanced Industrial & Technology | 金属ナノワイヤーの単結晶化方法及び装置 |
US6982206B1 (en) * | 2003-10-02 | 2006-01-03 | Lsi Logic Corporation | Mechanism for improving the structural integrity of low-k films |
WO2005040460A1 (ja) | 2003-10-24 | 2005-05-06 | Kyoto University | 金属ナノチューブ製造装置および金属ナノチューブの製造方法 |
JP2005181392A (ja) | 2003-12-16 | 2005-07-07 | Canon Inc | 光学系 |
TWI243004B (en) | 2003-12-31 | 2005-11-01 | Ind Tech Res Inst | Method for manufacturing low-temperature highly conductive layer and its structure |
US20050165120A1 (en) * | 2004-01-22 | 2005-07-28 | Ashavani Kumar | Process for phase transfer of hydrophobic nanoparticles |
JP2005239481A (ja) | 2004-02-26 | 2005-09-08 | Nagoya Institute Of Technology | 金属内包カーボンナノチューブ凝集体、その製造方法、金属内包カーボンナノチューブ、金属ナノワイヤおよびその製造方法 |
JP2005277405A (ja) | 2004-02-27 | 2005-10-06 | Takiron Co Ltd | 画像表示装置用透光性ノイズ防止成形体 |
JP2005311330A (ja) | 2004-03-22 | 2005-11-04 | Takiron Co Ltd | 電波吸収体 |
JP2005281357A (ja) | 2004-03-29 | 2005-10-13 | Koyo Sangyo Co Ltd | 導電性塗料 |
JP4641384B2 (ja) * | 2004-04-26 | 2011-03-02 | バンドー化学株式会社 | 導電性インクおよびそれを用いた導電性被膜 |
JP2005335054A (ja) | 2004-04-27 | 2005-12-08 | Japan Science & Technology Agency | 金属ナノワイヤー及びその製造方法 |
JP4491776B2 (ja) | 2004-04-28 | 2010-06-30 | 三菱マテリアル株式会社 | 導電性ペースト等の製造方法 |
JP4524745B2 (ja) | 2004-04-28 | 2010-08-18 | 三菱マテリアル株式会社 | 金属ナノワイヤー含有導電性材料およびその用途 |
JP2006049843A (ja) | 2004-06-29 | 2006-02-16 | Takiron Co Ltd | 画像表示装置用制電性成形体 |
CN1980761B (zh) | 2004-07-08 | 2011-01-26 | 三菱麻铁里亚尔株式会社 | 金属微粒子的制造方法、通过该方法制得的金属微粒子以及含有该金属微粒子而成的组合物、光吸收材料、应用品 |
JP2006035773A (ja) | 2004-07-29 | 2006-02-09 | Takiron Co Ltd | 粘接着性導電成形体 |
JP2006035771A (ja) | 2004-07-29 | 2006-02-09 | Takiron Co Ltd | 導電層転写シート |
JP4257429B2 (ja) | 2004-09-13 | 2009-04-22 | 国立大学法人東北大学 | 原子の拡散を制御することによる金属ナノワイヤの製造方法およびこの方法により製造する金属ナノワイヤ |
JP4372653B2 (ja) | 2004-09-30 | 2009-11-25 | 住友大阪セメント株式会社 | 棒状導電性錫含有酸化インジウム微粉末の製造方法 |
JP4372654B2 (ja) | 2004-09-30 | 2009-11-25 | 住友大阪セメント株式会社 | 棒状導電性錫含有酸化インジウム微粉末の製造方法 |
US7270694B2 (en) * | 2004-10-05 | 2007-09-18 | Xerox Corporation | Stabilized silver nanoparticles and their use |
KR100637174B1 (ko) * | 2004-10-06 | 2006-10-20 | 삼성에스디아이 주식회사 | Pdp 전극 형성용 포지티브형 감광성 페이스트 조성물,이를 이용하여 제조된 pdp 전극 및 이를 포함하는 pdp |
JP2006111675A (ja) | 2004-10-13 | 2006-04-27 | Mitsubishi Materials Corp | 金属ナノロッド配向組成物およびその用途 |
JP2006133528A (ja) | 2004-11-05 | 2006-05-25 | Takiron Co Ltd | 制電性光拡散シート |
WO2006059392A1 (ja) | 2004-12-03 | 2006-06-08 | Tokyo Ohka Kogyo Co., Ltd. | 化学増幅型ホトレジスト組成物、ホトレジスト層積層体、ホトレジスト組成物製造方法、ホトレジストパターンの製造方法及び接続端子の製造方法 |
JP4665499B2 (ja) | 2004-12-10 | 2011-04-06 | 三菱マテリアル株式会社 | 金属微粒子とその製造方法とその含有組成物ならびにその用途 |
JP2006171336A (ja) | 2004-12-15 | 2006-06-29 | Takiron Co Ltd | 画像表示用透明電極体および画像表示装置 |
JP4821951B2 (ja) | 2005-02-23 | 2011-11-24 | 三菱マテリアル株式会社 | ワイヤー状の金微粒子と、その製造方法および含有組成物ならびに用途 |
JP2006239790A (ja) | 2005-03-01 | 2006-09-14 | Tohoku Univ | 金属ナノワイヤ作製法および金属ナノワイヤ |
US7489432B2 (en) * | 2005-03-25 | 2009-02-10 | Ricoh Company, Ltd. | Electrochromic display device and display apparatus |
JP2006272876A (ja) | 2005-03-30 | 2006-10-12 | Takiron Co Ltd | 導電体 |
JP2006310353A (ja) | 2005-04-26 | 2006-11-09 | Takiron Co Ltd | 電波吸収体 |
KR102103541B1 (ko) * | 2005-08-12 | 2020-04-23 | 캄브리오스 필름 솔루션스 코포레이션 | 나노와이어 기반의 투명 도전체 |
JP4974332B2 (ja) | 2005-09-07 | 2012-07-11 | 一般財団法人電力中央研究所 | ナノ構造体およびその製造方法 |
CA2622214A1 (en) * | 2005-09-12 | 2007-03-22 | Electronics For Imaging, Inc. | Metallic ink jet printing system for graphics applications |
US7341944B2 (en) * | 2005-09-15 | 2008-03-11 | Honda Motor Co., Ltd | Methods for synthesis of metal nanowires |
JP2007091859A (ja) | 2005-09-28 | 2007-04-12 | Koyo Sangyo Co Ltd | 導電性塗料 |
WO2007044184A1 (en) | 2005-10-07 | 2007-04-19 | Albemarle Corporation | Water soluble photoinitiator |
JP2007105822A (ja) | 2005-10-12 | 2007-04-26 | National Institute For Materials Science | 原子スケール金属ワイヤもしくは金属ナノクラスター、およびこれらの製造方法 |
US8329065B2 (en) * | 2005-12-06 | 2012-12-11 | Mitsubishi Rayon Co., Ltd. | Carbon nanotube-containing composition, composite, and methods for producing them |
EP1832632A1 (en) | 2006-03-07 | 2007-09-12 | DSM IP Assets B.V. | Conductive ink |
TWI397446B (zh) * | 2006-06-21 | 2013-06-01 | Cambrios Technologies Corp | 控制奈米結構形成及形狀之方法 |
US8018568B2 (en) * | 2006-10-12 | 2011-09-13 | Cambrios Technologies Corporation | Nanowire-based transparent conductors and applications thereof |
TW200837403A (en) * | 2006-10-12 | 2008-09-16 | Cambrios Technologies Corp | Functional films formed by highly oriented deposition of nanowires |
US7849424B2 (en) | 2006-10-12 | 2010-12-07 | Cambrios Technologies Corporation | Systems, devices, and methods for controlling electrical and optical properties of transparent conductors |
WO2008046058A2 (en) * | 2006-10-12 | 2008-04-17 | Cambrios Technologies Corporation | Nanowire-based transparent conductors and applications thereof |
KR100777113B1 (ko) * | 2006-12-07 | 2007-11-19 | 한국전자통신연구원 | 미세패터닝이 가능한 고 신뢰성의 cnt 에미터 제조 방법 |
JP5493269B2 (ja) | 2006-12-28 | 2014-05-14 | Dic株式会社 | 活性エネルギー線硬化型インクジェット記録用インク組成物 |
KR101356238B1 (ko) * | 2007-03-26 | 2014-01-28 | 삼성전자주식회사 | Uv 패터닝 가능한 전도성 고분자 필름의 제조방법 및이에 의해 제조되는 전도성 고분자 필름 |
JP2008243600A (ja) | 2007-03-27 | 2008-10-09 | Sekisui Chem Co Ltd | 透明導電材料、透明導電膜、透明導電膜の製造方法、及び、表示素子 |
CN101971354B (zh) | 2007-04-20 | 2012-12-26 | 凯博瑞奥斯技术公司 | 高对比度的透明导体及其形成方法 |
JP6098860B2 (ja) * | 2007-04-20 | 2017-03-22 | シーエーエム ホールディング コーポレーション | 複合透明導電体、及び機器 |
US20080292979A1 (en) * | 2007-05-22 | 2008-11-27 | Zhe Ding | Transparent conductive materials and coatings, methods of production and uses thereof |
KR100880725B1 (ko) * | 2007-06-01 | 2009-02-02 | 제일모직주식회사 | Pdp 전극용 감광성 페이스트 조성물, pdp 전극, 및이를 포함하는 플라즈마 디스플레이 패널 |
CN101348634B (zh) * | 2007-07-20 | 2010-08-04 | 北京化工大学 | 一种光固化喷墨纳米导电油墨及其制备方法和使用方法 |
US7648655B2 (en) * | 2007-10-30 | 2010-01-19 | E. I. Du Pont De Nemours And Company | Conductive composition for black bus electrode, and front panel of plasma display panel |
US7727578B2 (en) * | 2007-12-27 | 2010-06-01 | Honeywell International Inc. | Transparent conductors and methods for fabricating transparent conductors |
US8632700B2 (en) | 2008-02-26 | 2014-01-21 | Cambrios Technologies Corporation | Methods and compositions for ink jet deposition of conductive features |
KR100986000B1 (ko) * | 2008-06-09 | 2010-10-06 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US20110151195A1 (en) * | 2008-08-27 | 2011-06-23 | Kazuyuki Mitsukura | Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
EP2430639A1 (en) | 2009-05-05 | 2012-03-21 | Cambrios Technologies Corporation | Reliable and durable conductive films comprising metal nanostructures |
US20110024159A1 (en) * | 2009-05-05 | 2011-02-03 | Cambrios Technologies Corporation | Reliable and durable conductive films comprising metal nanostructures |
JP2011018636A (ja) * | 2009-06-09 | 2011-01-27 | Fujifilm Corp | 導電性組成物、並びに透明導電膜、表示素子及び集積型太陽電池 |
WO2011025782A1 (en) * | 2009-08-24 | 2011-03-03 | Cambrios Technologies Corporation | Contact resistance measurement for resistance linearity in nanostructure thin films |
KR101574320B1 (ko) * | 2009-08-24 | 2015-12-03 | 캄브리오스 테크놀로지즈 코포레이션 | 금속 나노구조체의 정제 및 이로부터 제조된 개선된 헤이즈의 투명 전도체 |
CN102762324B (zh) * | 2009-08-25 | 2016-06-08 | 凯博瑞奥斯技术公司 | 控制金属纳米结构形态的方法 |
CN102079847A (zh) * | 2009-11-27 | 2011-06-01 | 东莞市立高电子制品有限公司 | 一种光敏银浆导电胶及其制备方法 |
WO2012108853A1 (en) * | 2009-12-04 | 2012-08-16 | Cambrios Technologies Corporation | Nanostructure-based transparent conductors having increased haze and devices comprising the same |
-
2011
- 2011-02-04 SG SG10201500798UA patent/SG10201500798UA/en unknown
- 2011-02-04 EP EP18183033.2A patent/EP3409732A1/en not_active Withdrawn
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- 2011-02-04 WO PCT/US2011/023732 patent/WO2011097470A2/en active Application Filing
- 2011-02-04 CN CN201180008500.4A patent/CN102834472B/zh active Active
- 2011-02-04 KR KR1020127022701A patent/KR101899019B1/ko active IP Right Grant
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-
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- 2020-01-16 US US16/744,835 patent/US20200148904A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005229109A (ja) * | 2004-02-10 | 2005-08-25 | E I Du Pont De Nemours & Co | インクジェット印刷可能な厚膜インク組成物および方法 |
JP2006009085A (ja) | 2004-06-25 | 2006-01-12 | Toyo Ink Mfg Co Ltd | 金属微粒子分散体の製造方法、該方法で製造された金属微粒子分散体を用いた導電性インキ、および非接触型メディア |
JP2006335995A (ja) | 2005-06-06 | 2006-12-14 | Hitachi Maxell Ltd | インクジェット用導電性インク、導電性パターンおよび導電体 |
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EP2531566B1 (en) | 2018-09-12 |
US20110192633A1 (en) | 2011-08-11 |
SG183138A1 (en) | 2012-09-27 |
JP6738574B2 (ja) | 2020-08-12 |
CN102834472A (zh) | 2012-12-19 |
KR20130002320A (ko) | 2013-01-07 |
WO2011097470A2 (en) | 2011-08-11 |
JP2018199135A (ja) | 2018-12-20 |
US10550276B2 (en) | 2020-02-04 |
JP2013518974A (ja) | 2013-05-23 |
US9534124B2 (en) | 2017-01-03 |
SG10201500798UA (en) | 2015-03-30 |
JP2017185478A (ja) | 2017-10-12 |
JP6415615B2 (ja) | 2018-10-31 |
US20170088726A1 (en) | 2017-03-30 |
EP3409732A1 (en) | 2018-12-05 |
WO2011097470A3 (en) | 2012-03-01 |
CN102834472B (zh) | 2015-04-22 |
US20200148904A1 (en) | 2020-05-14 |
EP2531566A2 (en) | 2012-12-12 |
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