KR100880725B1 - Pdp 전극용 감광성 페이스트 조성물, pdp 전극, 및이를 포함하는 플라즈마 디스플레이 패널 - Google Patents
Pdp 전극용 감광성 페이스트 조성물, pdp 전극, 및이를 포함하는 플라즈마 디스플레이 패널 Download PDFInfo
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- KR100880725B1 KR100880725B1 KR1020070053742A KR20070053742A KR100880725B1 KR 100880725 B1 KR100880725 B1 KR 100880725B1 KR 1020070053742 A KR1020070053742 A KR 1020070053742A KR 20070053742 A KR20070053742 A KR 20070053742A KR 100880725 B1 KR100880725 B1 KR 100880725B1
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- 238000000034 method Methods 0.000 claims abstract description 39
- 239000011230 binding agent Substances 0.000 claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 26
- 239000002904 solvent Substances 0.000 claims abstract description 10
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 claims description 6
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000001863 hydroxypropyl cellulose Substances 0.000 claims description 6
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 claims description 6
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 claims description 6
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- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- -1 hydroxy ethyl hydroxy propyl Chemical group 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical group COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 3
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 claims description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 3
- 239000001856 Ethyl cellulose Substances 0.000 claims description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 3
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 3
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 3
- 229920001249 ethyl cellulose Polymers 0.000 claims description 3
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 3
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 3
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 claims description 2
- RUJPNZNXGCHGID-UHFFFAOYSA-N (Z)-beta-Terpineol Natural products CC(=C)C1CCC(C)(O)CC1 RUJPNZNXGCHGID-UHFFFAOYSA-N 0.000 claims description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 claims description 2
- 229940088601 alpha-terpineol Drugs 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 238000009835 boiling Methods 0.000 claims description 2
- 229920003174 cellulose-based polymer Polymers 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000003431 cross linking reagent Substances 0.000 claims description 2
- 239000002270 dispersing agent Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical group 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- QJVXKWHHAMZTBY-GCPOEHJPSA-N syringin Chemical compound COC1=CC(\C=C\CO)=CC(OC)=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QJVXKWHHAMZTBY-GCPOEHJPSA-N 0.000 claims description 2
- 238000012719 thermal polymerization Methods 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 3
- 229940071676 hydroxypropylcellulose Drugs 0.000 claims 3
- 229940071826 hydroxyethyl cellulose Drugs 0.000 claims 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 230000003078 antioxidant effect Effects 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 claims 1
- 238000010304 firing Methods 0.000 abstract description 15
- 230000015556 catabolic process Effects 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 3
- 238000007645 offset printing Methods 0.000 description 3
- JKVSAZTYCZKNDX-UHFFFAOYSA-N 1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C1=CC(C(=O)CCC)=CC=C1N1CCOCC1 JKVSAZTYCZKNDX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- IWVKTOUOPHGZRX-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.COC(=O)C(C)=C IWVKTOUOPHGZRX-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- HQEOJGGRIVORTI-UHFFFAOYSA-N 2-benzyl-2-(diethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(CC)CC)CC1=CC=CC=C1 HQEOJGGRIVORTI-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Substances [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/22—Electrodes, e.g. special shape, material or configuration
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- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (15)
- 도전성 분말 40~55중량%, 무기질계 바인더 5~15중량%, 유기비클(vehicle) 35~55중량%, 및 잔량의 용매를 포함하며, 상기 무기질계 바인더는 상기 도전성 분말 100중량부에 대하여 15~35중량부의 비율로 포함하는 것인 감광성 페이스트 조성물.
- 삭제
- 제 1 항에 있어서,상기 도전성 분말은 금, 은, 구리, 니켈, 팔라듐, 백금, 알루미늄 중 선택되는 하나 또는 이들의 합금 분말 또는 상기 금속 중 하나의 금속에 다른 금속이 코팅되어 있는 것을 특징으로 하는 감광성 페이스트 조성물.
- 제 1 항에 있어서,상기 도전성 분말은 구형이고 그 입경(D50)이 0.1~2㎛인 것을 특징으로 하는 감광성 페이스트 조성물.
- 제 1 항에 있어서,상기 무기질계 바인더는 PbO, Bi2O3, SiO2, B2O3, P2O5, ZnO, Al2O3을 포함하는 금속산화물계 유리인 것을 특징으로 하는 감광성 페이스트 조성물.
- 제 1 항에 있어서,상기 무기질계 바인더의 입경(D50)은 0.1 ~ 5 ㎛ 인 것을 특징으로 하는 감광성 페이스트 조성물.
- 제 1 항에 있어서,상기 무기질계 바인더의 연화점은 400 ~ 600℃인 것을 특징으로 하는 감광성 페이스트 조성물.
- 제 1 항에 있어서,상기 유기 비클은 친수성기을 가지는 아크릴 모노머를 공중합 시킨 아크릴계 고분자, 에틸 셀룰로오즈(Ethyl Cellulose). 히드록시 에틸 셀룰로오즈(Hydroxyethyl Cellulose), 히드록시 프로필 셀룰로오즈(Hydroxypropyl Cellulose), 히드록시 에틸 히드록시 프로필 셀룰로오즈(Hydroxyethylhydroxypropyl)를 포함하는 셀룰로오즈계 고분자를 각각 단독 또는 2종 이상이 혼합된 것을 특징으로 하는 감광성 페이스트 조성물.
- 제 7 항에 있어서,상기 유기 비클은 가교제 및 광개시제 중 적어도 하나 이상을 더 포함하고 있는 것을 특징으로 하는 감광성 페이스트 조성물.
- 제 1 항에 있어서,상기 용매는 120℃ 이상의 비점을 가지는 것을 특징으로 하는 감광성 페이스트 조성물.
- 제 1 항에 있어서,상기 용매는 메틸 셀로솔브(Methyl Cellosolve), 에틸 셀로솔브(Ethyl Cellosolve), 부틸 셀로솔브(Butyl Cellosolve), 지방족 알코올(Alcohol), α-터피 네올(Terpineol), β-터피네올, 디하이드로 터피네올(Dihydro-terpineol), 에틸렌 글리콜(Ethylene Grycol), 에틸렌 글리콜 모노 부틸 에테르(Ethylene glycol mono butyl ether), 부틸셀로솔브 아세테이트(Butyl Cellosolve acetate), 텍사놀(Texanol) 중 선택되는 하나 또는 2종 이상이 혼합된 것을 특징으로 하는 감광성 페이스트 조성물.
- 제 1 항에 있어서,상기 페이스트 조성물은 자외선 안정제, 소포제, 분산제, 레벨링제, 산화방지제, 열중합금지제 중 하나 이상의 첨가제를 더 포함하고 있는 것을 특징으로 하는 감광성 페이스트 조성물.
- 제 1 항, 제 3 내지 제 11 항 중 어느 한 항의 조성물을 이용하여 제조된 PDP용 전극.
- 제 13 항에 있어서,상기 전극의 내전압은 450 ~ 550V인 것을 특징으로 하는 PDP용 전극.
- 제 13 항의 전극을 포함하는 플라스마 디스플레이 패널.
Priority Applications (6)
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KR1020070053742A KR100880725B1 (ko) | 2007-06-01 | 2007-06-01 | Pdp 전극용 감광성 페이스트 조성물, pdp 전극, 및이를 포함하는 플라즈마 디스플레이 패널 |
JP2010510199A JP2010529487A (ja) | 2007-06-01 | 2008-05-16 | プラズマディスプレイパネル電極用感光性ペースト組成物、プラズマディスプレイパネル電極及びこれを備えるプラズマディスプレイパネル |
PCT/KR2008/002770 WO2008147063A1 (en) | 2007-06-01 | 2008-05-16 | Photosensitive paste composition for fabricating the plasma display panel electrode, plasma display panel electrode and plasma display panel thereby |
CN200880018132XA CN101681098B (zh) | 2007-06-01 | 2008-05-16 | 制造等离子显示面板电极的光敏性浆料组合物、由此的等离子显示面板电极以及等离子显示面板 |
US12/451,790 US8383013B2 (en) | 2007-06-01 | 2008-05-16 | Photosensitive paste composition for fabricating the plasma display panel electrode, plasma display panel electrode and plasma display panel thereby |
TW097119985A TWI374336B (en) | 2007-06-01 | 2008-05-30 | Photosensitive paste composition for fabricating the plasma display panel electrode, plasma display panel electrode and plasma display panel thereby |
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KR1020070053742A KR100880725B1 (ko) | 2007-06-01 | 2007-06-01 | Pdp 전극용 감광성 페이스트 조성물, pdp 전극, 및이를 포함하는 플라즈마 디스플레이 패널 |
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US (1) | US8383013B2 (ko) |
JP (1) | JP2010529487A (ko) |
KR (1) | KR100880725B1 (ko) |
CN (1) | CN101681098B (ko) |
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US8329066B2 (en) * | 2008-07-07 | 2012-12-11 | Samsung Sdi Co., Ltd. | Paste containing aluminum for preparing PDP electrode, method of preparing the PDP electrode using the paste and PDP electrode prepared using the method |
US8436537B2 (en) * | 2008-07-07 | 2013-05-07 | Samsung Sdi Co., Ltd. | Substrate structure for plasma display panel, method of manufacturing the substrate structure, and plasma display panel including the substrate structure |
SG10201500798UA (en) * | 2010-02-05 | 2015-03-30 | Cambrios Technologies Corp | Photosensitive ink compositions and transparent conductors and method of using the same |
KR101332435B1 (ko) * | 2010-11-25 | 2013-11-22 | 제일모직주식회사 | 전극 페이스트 조성물 |
CN102568651A (zh) * | 2012-01-19 | 2012-07-11 | 上海大洲电子材料有限公司 | 一种无卤素低含银量笔记本电脑键盘用银导线浆料及应用 |
EP2905787A1 (en) * | 2014-02-07 | 2015-08-12 | Heraeus Deutschland GmbH & Co. KG | Electro-conductive paste comprising an aliphatic mono-alcohol |
CN105259306B (zh) * | 2015-10-13 | 2017-07-11 | 武汉工程大学 | 一种纳米过渡金属氧化物敏感浆料及其制备方法和应用 |
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KR20060029546A (ko) * | 2004-10-02 | 2006-04-06 | 삼성에스디아이 주식회사 | 감광성 페이스트 조성물, 이를 이용하여 제조된 pdp전극, 및 이를 포함하는 pdp |
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- 2008-05-16 WO PCT/KR2008/002770 patent/WO2008147063A1/en active Application Filing
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US20100164357A1 (en) | 2010-07-01 |
WO2008147063A1 (en) | 2008-12-04 |
JP2010529487A (ja) | 2010-08-26 |
TWI374336B (en) | 2012-10-11 |
CN101681098A (zh) | 2010-03-24 |
US8383013B2 (en) | 2013-02-26 |
CN101681098B (zh) | 2013-07-03 |
KR20080105747A (ko) | 2008-12-04 |
TW200912528A (en) | 2009-03-16 |
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