KR100314557B1 - 노광장치 및 노광방법 - Google Patents
노광장치 및 노광방법 Download PDFInfo
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- KR100314557B1 KR100314557B1 KR1019997004939A KR19997004939A KR100314557B1 KR 100314557 B1 KR100314557 B1 KR 100314557B1 KR 1019997004939 A KR1019997004939 A KR 1019997004939A KR 19997004939 A KR19997004939 A KR 19997004939A KR 100314557 B1 KR100314557 B1 KR 100314557B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7026—Focusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal Substances (AREA)
- Push-Button Switches (AREA)
- Photographic Developing Apparatuses (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Power Steering Mechanism (AREA)
- Polarising Elements (AREA)
Abstract
Description
Claims (37)
- 마스크상에 형성된 패턴을 감응기판상에 투영함으로써 감응기판이 노광되는 투영노광장치로서,패턴 이미지를 감응기판상에 투영하는, 노광빔의 경로상에 배치된 투영계,상기 투영계의 이미지면측상에 배치되고, 각각이 감응기판을 유지하면서 일평면에서 독립적으로 이동할 수 있는 제 1 기판 스테이지와 제 2 기판 스테이지를 갖는 스테이지계,상기 스테이지계와 기능적으로 관련되고, 5개의 측장축을 가지며, 기판 교환 동작 및 상기 제 1 기판 스테이지의 검출 동작중 적어도 하나의 동작 동안 상기 제 1 기판 스테이지를 감시하는 제 1 간섭계,스테이지계와 기능적으로 관련되고, 5개의 측장축을 가지며, 제 2 기판 스테이지의 노광 동작 동안 상기 제 2 기판 스테이지를 감시하는 제 2 간섭계, 및상기 스테이지계, 상기 제 1 간섭계, 및 제 2 간섭계와 기능적으로 관련되고, 상기 제 1 및 제 2 간섭계의 계측 결과에 기초하여, 상기 제 2 기판 스테이지를 이동함으로써 상기 제 2 기판 스테이지상에 유지된 감응기판에 대한 노광 동작을 실행하면서, 상기 제 1 스테이지계를 이동함으로써 상기 기판 교환 동작 및 상기 검출 동작중 적어도 하나의 동작을 수행하는 제어계를 구비하는 것을 특징으로 하는 투영노광장치.
- 제 181 항에 있어서, 상기 노광 동작 동안, 제 2 기판 스테이지가 주사방향으로 이동하면서, 상기 감응기판상의 각각의 영역이 노광되는 것을 특징으로 하는 투영노광장치.
- 제 182 항에 있어서, 상기 제 1 및 제 2 간섭계의 각각은 상기 주사방향과 평행인 측장축과 상기 주사방향과 수직인 비주사방향과 평행인 측장축을 갖는 것을 특징으로 하는 투영노광장치.
- 제 183 항에 있어서, 상기 제 2 간섭계는 상기 제 2 기판 스테이지의 회전 및 틸트를 계측하는 것을 특징으로 하는 투영노광장치.
- 제 184 항에 있어서, 상기 제 2 간섭계는 상기 비주사방향과 평행인 상기 측장축을 이용하여 상기 제 2 기판 스테이지의 상기 비주사방향의 위치와 틸트를 계측하는 것을 특징으로 하는 투영노광장치.
- 제 184 항에 있어서, 상기 제 2 간섭계는 상기 비주사방향과 평행인 상기 측장축을 이용하여 상기 제 2 기판 스테이지의 상기 비주사방향의 위치, 회전 및 틸트를 계측하는 것을 특징으로 하는 투영노광장치.
- 제 184 항에 있어서, 상기 제 2 간섭계는 상기 주사방향과 평행인 상기 측장축을 이용하여 상기 제 2 기판 스테이지의 상기 주사방향의 위치와 틸트를 계측하는 것을 특징으로 하는 투영노광장치.
- 제 184 항에 있어서, 상기 제 1 간섭계는 상기 제 1 기판 스테이지의 회전과 틸트를 계측하는 것을 특징으로 하는 투영노광장치.
- 제 188 항에 있어서, 상기 제 1 간섭계는 상기 주사방향과 평행인 측장축과 상기 비주사방향과 평행인 측장축을 이용하여 상기 제 1 기판 스테이지의 틸트를 계측하는 것을 특징으로 하는 투영노광장치.
- 제 188 항에 있어서, 상기 제 1 간섭계는 상기 비주사방향과 평행인 측장축을 이용하여 상기 제 1 기판 스테이지의 회전과 틸트를 계측하는 것을 특징으로 하는 투영노광장치.
- 제 183 항에 있어서, 상기 제 1 간섭계는 상기 제 1 기판 스테이지의 회전과 틸트를 계측하는 것을 특징으로 하는 투영노광장치.
- 제 191 항에 있어서, 상기 제 1 간섭계는 상기 비주사방향과 평행인 측장축을 이용하여 제 1 기판 스테이지의 위치, 회전, 및 틸트를 계측하는 것을 특징으로 하는 투영노광장치.
- 제 192 항에 있어서, 상기 제 1 간섭계는 상기 주사방향과 평행인 측장축을 이용하여 상기 제 1 기판 스테이지의 위치와 틸트를 계측하는 것을 특징으로 하는 투영노광장치.
- 제 181 항에 있어서, 상기 제 1 간섭계는 상기 제 1 기판 스테이지의 위치, 회전, 및 틸트를 감시하고, 상기 제 2 간섭계는 상기 제 2 기판 스테이지의 위치, 회전, 및 틸트를 감시하는 것을 특징으로 하는 투영노광장치.
- 제 182 항에 있어서, 상기 제 2 기판 스테이지의 상기 노광 동작 동안, 상기 제 1 기판 스테이지와 상기 제 2 기판 스테이지는 상기 주사방향과 수직인 방향으로 서로 떨어져 이동하는 것을 특징으로 하는 투영노광장치.
- 제 182 항에 있어서, 상기 주사방향과 수직인 방향으로 상기 투영계로부터 떨어져 배치되고, 상기 검출 동작 동안 감응기판의 얼라인먼트 정보를 검출하는 마크 검출계를 더 구비하는 것을 특징으로 하는 투영노광장치.
- 제 181 항에 있어서, 상기 기판 교환 동작 및 상기 검출 동작중 적어도 하나의 동작을 수행하는 상기 제 1 기판 스테이지의 이동 영역은 상기 노광 동작을 실행하는 상기 제 2 기판 스테이지의 이동 영역을 중첩하는 것을 특징으로 하는 투영노광장치.
- 제 181 항에 있어서, 상기 제 2 기판 스테이지는 상기 제 1 기판 스테이지가 이동될때의 진동으로부터 보호되는 것을 특징으로 하는 투영노광장치.
- 투영광학계를 통해 마스크상에 형성된 패턴을 감응기판상에 투영함으로써 감응기판을 노광하는 투영노광방법으로서,각각이 감응기판을 유지하면서 2차원 평면상에 독립적으로 이동가능한 제 1 기판 스테이지와 제 2 기판 스테이지를 준비하는 단계,상기 제 2 기판 스테이지상에 유지된 감응기판에 대한 노광 동작을 실행하면서, 상기 제 1 기판 스테이지를 이용하여 기판 교환 동작 및 검출 동작중 적어도 하나의 동작을 수행하는 단계,상기 기판 교환 동작 및 상기 검출 동작중 적어도 하나의 동작 동안 5개의 측장축을 갖는 제 1 간섭계를 이용하여 상기 제 1 기판 스테이지를 감시하는 단계, 및상기 노광 동작 동안 5개의 측장축을 갖는 제 2 간섭계를 이용하여 상기 제 2 기판 스테이지를 감시하는 단계를 구비하는 것을 특징으로 하는 투영노광방법.
- 제 199 항에 있어서, 상기 노광 동작 동안, 상기 제 2 기판 스테이지를 주사방향으로 이동하면서, 상기 제 2 기판 스테이지상에 유지된 감응기판상의 각각의 영역을 노광하는 것을 특징으로 하는 투영노광방법.
- 제 200 항에 있어서, 상기 제 1 및 제 2 간섭계의 각각은 상기 주사방향과 평행인 측장축 및 상기 주사방향과 수직인 비주사방향과 평행인 측장축을 갖는 것을 특징으로 하는 투영노광방법.
- 제 201 항에 있어서, 상기 제 2 간섭계는 상기 제 2 기판 스테이지의 회전 및 틸트를 계측하는 것을 특징으로 하는 투영노광방법.
- 제 202 항에 있어서, 상기 제 2 간섭계는 상기 비주사방향과 평행인 측장축을 이용하여 상기 제 2 기판 스테이지의 상기 비주사방향의 위치와 틸트를 계측하는 것을 특징으로 하는 투영노광방법.
- 제 202 항에 있어서, 상기 제 2 간섭계는 상기 비주사방향과 평행인 측장축을 이용하여 상기 제 2 기판 스테이지의 상기 비주사방향의 위치, 회전 및 틸트를 계측하는 것을 특징으로 하는 투영노광방법.
- 제 202 항에 있어서, 상기 제 2 간섭계는 상기 주사방향과 평행인 측장축을 이용하여 상기 제 2 기판 스테이지의 상기 주사방향의 위치와 틸트를 계측하는 것을 특징으로 하는 투영노광방법.
- 제 202 항에 있어서, 상기 제 1 간섭계는 상기 제 1 기판 스테이지의 회전 및 틸트를 계측하는 것을 특징으로 하는 투영노광방법.
- 제 206 항에 있어서, 상기 제 1 간섭계는 상기 주사방향과 평행인 상기 측장축 및 비주사방향과 평행인 측장축을 이용하여 상기 제 1 기판 스테이지의 틸트를 계측하는 것을 특징으로 하는 투영노광방법.
- 제 206 항에 있어서, 상기 제 1 간섭계는 상기 비주사방향과 평행인 측장축을 이용하여 상기 제 1 기판 스테이지의 회전 및 틸트를 계측하는 것을 특징으로 하는 투영노광방법.
- 제 201 항에 있어서, 상기 제 1 간섭계는 상기 제 1 기판 스테이지의 회전 및 틸트를 계측하는 것을 특징으로 하는 투영노광방법.
- 제 209항에 있어서, 상기 제 1 간섭계는 상기 비주사방향과 평행인 측장축을 이용하여 제 1 기판 스테이지의 위치, 회전, 및 틸트를 계측하는 것을 특징으로 하는 투영노광방법.
- 제 210 항에 있어서, 상기 제 1 간섭계는 상기 주사방향과 평행인 측장축을 이용하여 상기 제 1 기판 스테이지의 위치 및 틸트를 계측하는 것을 특징으로 하는 투영노광방법.
- 제 199 항에 있어서, 상기 제 1 간섭계는 상기 제 1 기판 스테이지의 위치, 회전, 및 틸트를 계측하고, 상기 제 2 간섭계는 상기 제 2 기판 스테이지의 위치, 회전, 및 틸트를 계측하는 것을 특징으로 하는 투영노광방법.
- 제 200 항에 있어서, 상기 제 1 기판 스테이지와 상기 제 2 기판 스테이지는, 상기 제 2 기판 스테이지의 상기 노광 동작 동안, 상기 주사방향과 수직인 방향으로 서로 떨어져서 이동하는 것을 특징으로 하는 투영노광방법.
- 제 200 항에 있어서, 상기 검출 동작은 상기 주사방향과 수직인 방향으로 상기 투영계로부터 떨어져 배치된 마크 검출계를 이용하여 상기 감응기판의 얼라인먼트 정보를 검출하는 것을 포함하는 것을 특징으로 하는 투영노광방법.
- 제 199 항에 있어서, 상기 기판 교환 동작 및 상기 검출 동작중 적어도 하나의 동작을 수행하는 상기 제 1 기판 스테이지의 이동 영역이 상기 노광 동작을 실행하는 상기 제 2 기판 스테이지의 이동 영역을 중첩하는 것을 특징으로 하는 투영노광방법.
- 제 199 항에 있어서, 상기 제 2 기판 스테이지는 상기 제 1 기판 스테이지가 이동할때의 진동으로부터 보호되는 것을 특징으로 하는 투영노광방법.
- 제 199 항에 기재된 방법을 이용한 노광 공정을 포함하는 디바이스 제조방법.
Applications Claiming Priority (10)
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JP96-332847 | 1996-11-28 | ||
JP33284796A JP4078683B2 (ja) | 1996-11-28 | 1996-11-28 | 投影露光装置及び投影露光方法並びに走査露光方法 |
JP96-332845 | 1996-11-28 | ||
JP33284696A JP4029182B2 (ja) | 1996-11-28 | 1996-11-28 | 露光方法 |
JP33284496A JP4029180B2 (ja) | 1996-11-28 | 1996-11-28 | 投影露光装置及び投影露光方法 |
JP96-332846 | 1996-11-28 | ||
JP96-332843 | 1996-11-28 | ||
JP96-332844 | 1996-11-28 | ||
JP33284596A JP4029181B2 (ja) | 1996-11-28 | 1996-11-28 | 投影露光装置 |
JP33284396 | 1996-11-28 |
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KR1019997004747A Division KR100315249B1 (ko) | 1996-11-28 | 1999-05-28 | 노광장치 및 노광방법 |
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KR1019997004747A Expired - Fee Related KR100315249B1 (ko) | 1996-11-28 | 1999-05-28 | 노광장치 및 노광방법 |
KR1019997004939A Expired - Fee Related KR100314557B1 (ko) | 1996-11-28 | 1999-06-03 | 노광장치 및 노광방법 |
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KR1020020072335A Withdrawn KR20060086496A (ko) | 1996-11-28 | 2002-11-20 | 노광장치 및 노광방법 |
KR1020020072333A Withdrawn KR20060086495A (ko) | 1996-11-28 | 2002-11-20 | 노광장치 및 노광방법 |
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KR1019997004747A Expired - Fee Related KR100315249B1 (ko) | 1996-11-28 | 1999-05-28 | 노광장치 및 노광방법 |
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KR1020017006771A Expired - Fee Related KR100315250B1 (ko) | 1996-11-28 | 2001-05-30 | 노광장치 및 노광방법 |
KR1020020072335A Withdrawn KR20060086496A (ko) | 1996-11-28 | 2002-11-20 | 노광장치 및 노광방법 |
KR1020020072333A Withdrawn KR20060086495A (ko) | 1996-11-28 | 2002-11-20 | 노광장치 및 노광방법 |
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US (7) | US6400441B1 (ko) |
EP (2) | EP0951054B1 (ko) |
KR (7) | KR20030096435A (ko) |
CN (5) | CN1244020C (ko) |
AT (1) | ATE404906T1 (ko) |
AU (1) | AU5067898A (ko) |
DE (1) | DE69738910D1 (ko) |
IL (1) | IL130137A (ko) |
SG (4) | SG102627A1 (ko) |
WO (1) | WO1998024115A1 (ko) |
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