[go: up one dir, main page]

ATE404906T1 - Ausrichtvorrichtung und belichtungsverfahren - Google Patents

Ausrichtvorrichtung und belichtungsverfahren

Info

Publication number
ATE404906T1
ATE404906T1 AT97913467T AT97913467T ATE404906T1 AT E404906 T1 ATE404906 T1 AT E404906T1 AT 97913467 T AT97913467 T AT 97913467T AT 97913467 T AT97913467 T AT 97913467T AT E404906 T1 ATE404906 T1 AT E404906T1
Authority
AT
Austria
Prior art keywords
holding member
ws2b
ws1b
movable
sensitive substrate
Prior art date
Application number
AT97913467T
Other languages
English (en)
Inventor
Kenji Nishi
Kazuya Ota
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP33284796A external-priority patent/JP4078683B2/ja
Priority claimed from JP33284696A external-priority patent/JP4029182B2/ja
Priority claimed from JP33284496A external-priority patent/JP4029180B2/ja
Priority claimed from JP33284596A external-priority patent/JP4029181B2/ja
Application filed by Nikon Corp filed Critical Nikon Corp
Application granted granted Critical
Publication of ATE404906T1 publication Critical patent/ATE404906T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal Substances (AREA)
  • Push-Button Switches (AREA)
  • Photographic Developing Apparatuses (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Power Steering Mechanism (AREA)
  • Polarising Elements (AREA)
AT97913467T 1996-11-28 1997-11-28 Ausrichtvorrichtung und belichtungsverfahren ATE404906T1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP33284796A JP4078683B2 (ja) 1996-11-28 1996-11-28 投影露光装置及び投影露光方法並びに走査露光方法
JP33284696A JP4029182B2 (ja) 1996-11-28 1996-11-28 露光方法
JP33284496A JP4029180B2 (ja) 1996-11-28 1996-11-28 投影露光装置及び投影露光方法
JP33284596A JP4029181B2 (ja) 1996-11-28 1996-11-28 投影露光装置
JP33284396 1996-11-28

Publications (1)

Publication Number Publication Date
ATE404906T1 true ATE404906T1 (de) 2008-08-15

Family

ID=27531212

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97913467T ATE404906T1 (de) 1996-11-28 1997-11-28 Ausrichtvorrichtung und belichtungsverfahren

Country Status (10)

Country Link
US (7) US6400441B1 (de)
EP (2) EP0951054B1 (de)
KR (7) KR20030096435A (de)
CN (5) CN1244020C (de)
AT (1) ATE404906T1 (de)
AU (1) AU5067898A (de)
DE (1) DE69738910D1 (de)
IL (1) IL130137A (de)
SG (4) SG102627A1 (de)
WO (1) WO1998024115A1 (de)

Families Citing this family (560)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100521704B1 (ko) 1997-09-19 2005-10-14 가부시키가이샤 니콘 스테이지장치, 주사형 노광장치 및 방법, 그리고 이것으로제조된 디바이스
WO1999027568A1 (fr) * 1997-11-21 1999-06-03 Nikon Corporation Graveur de motifs a projection et procede de sensibilisation a projection
TW448487B (en) 1997-11-22 2001-08-01 Nippon Kogaku Kk Exposure apparatus, exposure method and manufacturing method of device
US6897963B1 (en) 1997-12-18 2005-05-24 Nikon Corporation Stage device and exposure apparatus
US6370487B1 (en) * 1998-04-23 2002-04-09 Micron Technology, Inc. Remote semiconductor microscopy
JP4365908B2 (ja) 1998-09-04 2009-11-18 キヤノン株式会社 面位置検出装置、露光装置およびデバイス製造方法
JP4134406B2 (ja) 1998-12-04 2008-08-20 株式会社ニコン 平面モータ装置及び露光装置
DE69943311D1 (de) 1998-12-24 2011-05-12 Canon Kk Trägerplattesteuerungsvorrichtung, Belichtungsapparat und Verfahren zur Herstellung einer Halbleitervorrichtung
US7116401B2 (en) 1999-03-08 2006-10-03 Asml Netherlands B.V. Lithographic projection apparatus using catoptrics in an optical sensor system, optical arrangement, method of measuring, and device manufacturing method
TW490596B (en) 1999-03-08 2002-06-11 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using the lithographic projection apparatus, device manufactured according to the method and method of calibrating the lithographic projection apparatus
US6924884B2 (en) 1999-03-08 2005-08-02 Asml Netherlands B.V. Off-axis leveling in lithographic projection apparatus
US7023521B2 (en) * 1999-04-13 2006-04-04 Nikon Corporation Exposure apparatus, exposure method and process for producing device
WO2001023935A1 (fr) 1999-09-29 2001-04-05 Nikon Corporation Procede et dispositif d'exposition par projection, et systeme optique de projection
WO2001023933A1 (fr) 1999-09-29 2001-04-05 Nikon Corporation Systeme optique de projection
EP1093021A3 (de) 1999-10-15 2004-06-30 Nikon Corporation Projektionsbelichtungssystem sowie ein solches System benutzendes Gerät und Verfahren
AU3271801A (en) * 1999-11-30 2001-06-12 Silicon Valley Group, Inc. Dual-stage lithography apparatus and method
JP2001160530A (ja) 1999-12-01 2001-06-12 Nikon Corp ステージ装置及び露光装置
EP1111471B1 (de) * 1999-12-21 2005-11-23 ASML Netherlands B.V. Lithographischer Projektionsapparat mit kollisionsvermeidender Vorrichtung
TW538256B (en) 2000-01-14 2003-06-21 Zeiss Stiftung Microlithographic reduction projection catadioptric objective
US6690450B2 (en) 2000-01-31 2004-02-10 Nikon Corporation Exposure method, exposure apparatus, method for producing exposure apparatus, and method for producing device
JP2001308003A (ja) 2000-02-15 2001-11-02 Nikon Corp 露光方法及び装置、並びにデバイス製造方法
US7301605B2 (en) 2000-03-03 2007-11-27 Nikon Corporation Projection exposure apparatus and method, catadioptric optical system and manufacturing method of devices
JP2001257143A (ja) 2000-03-09 2001-09-21 Nikon Corp ステージ装置及び露光装置、並びにデバイス製造方法
JP2001332490A (ja) * 2000-03-14 2001-11-30 Nikon Corp 位置合わせ方法、露光方法、露光装置、及びデバイス製造方法
JP2001345250A (ja) * 2000-06-01 2001-12-14 Canon Inc 位置合せ方法、位置合せ装置、プロファイラ、露光装置、半導体デバイス製造方法、半導体製造工場、および露光装置の保守方法
US7289212B2 (en) 2000-08-24 2007-10-30 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufacturing thereby
EP1182509B1 (de) * 2000-08-24 2009-04-08 ASML Netherlands B.V. Lithographischer Apparat, Verfahren zu dessen Kalibrierung und Verfahren zur Herstellung einer Vorrichtung
TW527526B (en) 2000-08-24 2003-04-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7561270B2 (en) 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
AU2001280175A1 (en) * 2000-08-29 2002-03-13 Nikon Corporation Exposure method and device
US6708131B1 (en) * 2000-08-30 2004-03-16 Micron Technology, Inc. Wafer alignment system
EP1186959B1 (de) * 2000-09-07 2009-06-17 ASML Netherlands B.V. Verfahren zur Eichung eines lithographischen Projektionsapparats
TW497013B (en) * 2000-09-07 2002-08-01 Asm Lithography Bv Method for calibrating a lithographic projection apparatus and apparatus capable of applying such a method
JP2002231622A (ja) 2000-11-29 2002-08-16 Nikon Corp ステージ装置及び露光装置
US6591160B2 (en) * 2000-12-04 2003-07-08 Asyst Technologies, Inc. Self teaching robot
AU2002221049A1 (en) * 2000-12-06 2002-06-18 Nikon Corporation X-ray projection exposure device, x-ray projection exposure method, and semiconductor device
JP2002289515A (ja) 2000-12-28 2002-10-04 Nikon Corp 製品の製造方法、露光装置の製造方法、露光装置、及びデバイス製造方法
US6628372B2 (en) * 2001-02-16 2003-09-30 Mccullough Andrew W. Use of multiple reticles in lithographic printing tools
JP2002323652A (ja) 2001-02-23 2002-11-08 Nikon Corp 投影光学系，該投影光学系を備えた投影露光装置および投影露光方法
JP2002280283A (ja) * 2001-03-16 2002-09-27 Canon Inc 基板処理装置
JP2002287023A (ja) 2001-03-27 2002-10-03 Nikon Corp 投影光学系、該投影光学系を備えた投影露光装置及び投影露光方法
JP2002305140A (ja) * 2001-04-06 2002-10-18 Nikon Corp 露光装置及び基板処理システム
US6859260B2 (en) * 2001-04-25 2005-02-22 Asml Holding N.V. Method and system for improving focus accuracy in a lithography system
JP2002353112A (ja) * 2001-05-25 2002-12-06 Riipuru:Kk 電子ビーム近接露光装置における電子ビームの傾き測定方法及び傾き較正方法並びに電子ビーム近接露光装置
JP2002350128A (ja) * 2001-05-30 2002-12-04 Canon Inc 立体形状計測装置並びに立体形状計測方法および位置合わせ方法
US6788385B2 (en) * 2001-06-21 2004-09-07 Nikon Corporation Stage device, exposure apparatus and method
WO2003010802A1 (fr) * 2001-07-26 2003-02-06 Nikon Corporation Appareil a etage, systeme et procede d'exposition et procede de production de dispositif
US6678038B2 (en) 2001-08-03 2004-01-13 Nikon Corporation Apparatus and methods for detecting tool-induced shift in microlithography apparatus
US6674512B2 (en) 2001-08-07 2004-01-06 Nikon Corporation Interferometer system for a semiconductor exposure system
JP2003086492A (ja) * 2001-09-12 2003-03-20 Canon Inc 露光装置及びその制御方法並びにデバイスの製造方法
US6785005B2 (en) 2001-09-21 2004-08-31 Nikon Corporation Switching type dual wafer stage
TWI225665B (en) * 2001-10-17 2004-12-21 Canon Kk Apparatus control system, apparatus control method, semiconductor exposure apparatus, semiconductor exposure apparatus control method and semiconductor device manufacturing method
US6813003B2 (en) * 2002-06-11 2004-11-02 Mark Oskotsky Advanced illumination system for use in microlithography
US6665054B2 (en) * 2001-10-22 2003-12-16 Nikon Corporation Two stage method
FR2832546B1 (fr) * 2001-11-20 2008-04-04 Centre Nat Rech Scient Dispositif de reglage d'un appareil de generation d'un faisceau de particules chargees
CN101447438B (zh) * 2001-12-14 2010-12-01 瑞萨电子株式会社 半导体器件的制造方法
TWI295070B (en) 2001-12-21 2008-03-21 Asml Netherlands Bv Semiconductor device manufacturing method,semiconductor device manufactured thereby and lithographic apparatus therefor
TW516099B (en) * 2001-12-28 2003-01-01 Nanya Technology Corp Exposure method and system with self-feedback correction
US6777143B2 (en) * 2002-01-28 2004-08-17 Taiwan Semiconductor Manufacturing Company Multiple mask step and scan aligner
CN1650401B (zh) * 2002-04-09 2010-04-21 株式会社尼康 曝光方法与曝光装置、以及器件的制造方法
EP1353233A3 (de) * 2002-04-09 2007-10-03 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
EP1353229A1 (de) * 2002-04-09 2003-10-15 ASML Netherlands B.V. Lithographischer Apparat, Verfahren zur Herstellung eines Artikels und dabei hergesteller Artikel
WO2003087934A2 (en) * 2002-04-11 2003-10-23 Zygo Corporation Interferometry system error compensation in twin stage lithography tools
JP3966211B2 (ja) * 2002-05-08 2007-08-29 株式会社ニコン 露光方法、露光装置及びデバイス製造方法
US6757110B2 (en) 2002-05-29 2004-06-29 Asml Holding N.V. Catadioptric lithography system and method with reticle stage orthogonal to wafer stage
US6995379B2 (en) 2002-06-13 2006-02-07 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
JP4546019B2 (ja) * 2002-07-03 2010-09-15 株式会社日立製作所 露光装置
EP1383007A1 (de) * 2002-07-16 2004-01-21 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
JP3862639B2 (ja) * 2002-08-30 2006-12-27 キヤノン株式会社 露光装置
US6841956B2 (en) * 2002-09-17 2005-01-11 Nikon Corporation Actuator to correct for off center-of-gravity line of force
TWI246114B (en) * 2002-09-24 2005-12-21 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
US20040081446A1 (en) * 2002-10-28 2004-04-29 Eastman Kodak Company Electronic imaging system with row-wise or column-wise image sensor reset synchronized to a mechanical shutter
AU2003284672A1 (en) 2002-12-03 2004-06-23 Nikon Corporation Contaminant removing method and device, and exposure method and apparatus
TW200412617A (en) * 2002-12-03 2004-07-16 Nikon Corp Optical illumination device, method for adjusting optical illumination device, exposure device and exposure method
US7242455B2 (en) * 2002-12-10 2007-07-10 Nikon Corporation Exposure apparatus and method for producing device
SG158745A1 (en) * 2002-12-10 2010-02-26 Nikon Corp Exposure apparatus and method for producing device
SG171468A1 (en) * 2002-12-10 2011-06-29 Nikon Corp Exposure apparatus and method for producing device
WO2004053954A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
US6744058B1 (en) * 2002-12-20 2004-06-01 Taiwan Semiconductor Manufacturing Co., Ltd Geometric compensation method for charged particle beam irradiation
US7265881B2 (en) * 2002-12-20 2007-09-04 Hewlett-Packard Development Company, L.P. Method and apparatus for measuring assembly and alignment errors in sensor assemblies
DE10261775A1 (de) * 2002-12-20 2004-07-01 Carl Zeiss Smt Ag Vorrichtung zur optischen Vermessung eines Abbildungssystems
JP3910180B2 (ja) * 2003-01-14 2007-04-25 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置のレベルセンサ
EP1439428A3 (de) * 2003-01-14 2009-05-13 ASML Netherlands B.V. Niveausensor für einen lithographischen Apparat
CN100373409C (zh) * 2003-01-27 2008-03-05 富士通株式会社 注目物体出现位置显示装置
JP3689698B2 (ja) 2003-01-31 2005-08-31 キヤノン株式会社 投影露光装置、投影露光方法および被露光部材の製造方法
JP4101076B2 (ja) * 2003-02-06 2008-06-11 キヤノン株式会社 位置検出方法及び装置
JP4652667B2 (ja) * 2003-02-13 2011-03-16 キヤノン株式会社 面位置計測方法及び走査型露光装置
EP1596425A4 (de) 2003-02-19 2007-08-01 Nikon Corp Transferverfahren, belichtungsverfahren und belichtungseinrichtung und bauelementherstellungsverfahren
KR101288767B1 (ko) 2003-02-26 2013-07-23 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
JP4001559B2 (ja) * 2003-03-04 2007-10-31 東京エレクトロン株式会社 インライン接続設定方法および装置
SG123601A1 (en) * 2003-03-10 2006-07-26 Asml Netherlands Bv Focus spot monitoring in a lithographic projectionapparatus
WO2004093159A2 (en) * 2003-04-09 2004-10-28 Nikon Corporation Immersion lithography fluid control system
KR101124179B1 (ko) 2003-04-09 2012-03-27 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
SG2014015176A (en) 2003-04-10 2015-06-29 Nippon Kogaku Kk Environmental system including vacuum scavange for an immersion lithography apparatus
KR101409565B1 (ko) 2003-04-10 2014-06-19 가부시키가이샤 니콘 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
SG10201803122UA (en) 2003-04-11 2018-06-28 Nikon Corp Immersion lithography apparatus and device manufacturing method
KR20180054929A (ko) 2003-04-11 2018-05-24 가부시키가이샤 니콘 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법
JP4315420B2 (ja) * 2003-04-18 2009-08-19 キヤノン株式会社 露光装置及び露光方法
TWI237307B (en) * 2003-05-01 2005-08-01 Nikon Corp Optical projection system, light exposing apparatus and light exposing method
CN100437358C (zh) * 2003-05-15 2008-11-26 株式会社尼康 曝光装置及器件制造方法
TWI518742B (zh) * 2003-05-23 2016-01-21 尼康股份有限公司 A method of manufacturing an exposure apparatus and an element
TWI421911B (zh) 2003-05-23 2014-01-01 尼康股份有限公司 An exposure method, an exposure apparatus, and an element manufacturing method
EP1628330A4 (de) 2003-05-28 2009-09-16 Nikon Corp Belichtungsverfahren, belichtungseinrichtung und bauelementeherstellungsverfahren
US6781674B1 (en) * 2003-05-29 2004-08-24 Asml Holding N.V. System and method to increase throughput in a dual substrate stage double exposure lithography system
JP4376116B2 (ja) * 2003-06-03 2009-12-02 東京エレクトロン株式会社 基板受け渡し位置の調整方法
US7598507B2 (en) * 2003-06-11 2009-10-06 Texas Instruments Incorporated Adjustable lithography blocking device and method
TWI409853B (zh) * 2003-06-13 2013-09-21 尼康股份有限公司 An exposure method, a substrate stage, an exposure apparatus, and an element manufacturing method
EP2275869B1 (de) * 2003-06-19 2014-01-15 Nikon Corporation Belichtungsgerät und Verfahren zur Herstellung einer Vorrichtung
TWI246848B (en) * 2003-07-03 2006-01-01 Fuji Photo Film Co Ltd Image formation device
EP1646075B1 (de) 2003-07-09 2011-06-15 Nikon Corporation Belichtungsvorrichtung und verfahren zur bauelementeherstellung
WO2005006418A1 (ja) * 2003-07-09 2005-01-20 Nikon Corporation 露光装置及びデバイス製造方法
KR101211451B1 (ko) * 2003-07-09 2012-12-12 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
CN102944981A (zh) * 2003-07-09 2013-02-27 株式会社尼康 曝光装置、器件制造方法
EP1503244A1 (de) * 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographischer Projektionsapparat und Verfahren zur Herstellung einer Vorrichtung
EP1653501B1 (de) 2003-07-28 2012-09-19 Nikon Corporation Belichtungsvorrichtung, bauelemente-herstellungsverfahren und steuerverfahren für eine belichtungsvorrichtung
US6952255B2 (en) * 2003-08-06 2005-10-04 Lam Research Corporation System and method for integrated multi-use optical alignment
KR101205263B1 (ko) * 2003-08-07 2012-11-27 가부시키가이샤 니콘 노광 방법 및 노광 장치, 스테이지 장치, 그리고 디바이스 제조 방법
KR101343655B1 (ko) 2003-08-21 2013-12-20 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
SG145780A1 (en) * 2003-08-29 2008-09-29 Nikon Corp Exposure apparatus and device fabricating method
KR101523180B1 (ko) 2003-09-03 2015-05-26 가부시키가이샤 니콘 액침 리소그래피용 유체를 제공하기 위한 장치 및 방법
JP3870182B2 (ja) * 2003-09-09 2007-01-17 キヤノン株式会社 露光装置及びデバイス製造方法
WO2005029559A1 (ja) * 2003-09-19 2005-03-31 Nikon Corporation 露光装置及びデバイス製造方法
US8208198B2 (en) 2004-01-14 2012-06-26 Carl Zeiss Smt Gmbh Catadioptric projection objective
EP3007207B1 (de) * 2003-09-26 2017-03-08 Nikon Corporation Projektionsbelichtungsvorrichtung, reinigungs- und wartungsverfahren einer projektionsbelichtungsvorrichtung und verfahren zur herstellung einer vorrichtung
JP4289961B2 (ja) * 2003-09-26 2009-07-01 キヤノン株式会社 位置決め装置
WO2005031823A1 (ja) * 2003-09-29 2005-04-07 Nikon Corporation 液浸型レンズ系及び投影露光装置、並びにデバイス製造方法
JP4438748B2 (ja) * 2003-09-29 2010-03-24 株式会社ニコン 投影露光装置、投影露光方法およびデバイス製造方法
EP2837969B1 (de) 2003-09-29 2016-04-20 Nikon Corporation Belichtungsvorrichtung, Belichtungsverfahren und Verfahren zur Herstellung der Vorrichtung
WO2005036621A1 (ja) 2003-10-08 2005-04-21 Zao Nikon Co., Ltd. 基板搬送装置及び基板搬送方法、露光装置及び露光方法、デバイス製造方法
TW201738932A (zh) 2003-10-09 2017-11-01 Nippon Kogaku Kk 曝光裝置及曝光方法、元件製造方法
DE60327119D1 (de) * 2003-10-16 2009-05-20 Asml Netherlands Bv Methode zur Herstellung einer Vorrichtung
EP1679738A4 (de) * 2003-10-28 2008-08-06 Nikon Corp Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren
TWI609409B (zh) 2003-10-28 2017-12-21 尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造方法
KR101117429B1 (ko) * 2003-10-31 2012-04-16 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
WO2005048325A1 (ja) * 2003-11-17 2005-05-26 Nikon Corporation ステージ駆動方法及びステージ装置並びに露光装置
TW201809801A (zh) 2003-11-20 2018-03-16 日商尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法、以及元件製造方法
TWI605315B (zh) * 2003-12-03 2017-11-11 Nippon Kogaku Kk Exposure device, exposure method, and device manufacturing method
US7466489B2 (en) 2003-12-15 2008-12-16 Susanne Beder Projection objective having a high aperture and a planar end surface
JP5102492B2 (ja) 2003-12-19 2012-12-19 カール・ツァイス・エスエムティー・ゲーエムベーハー 結晶素子を有するマイクロリソグラフィー投影用対物レンズ
KR100567622B1 (ko) * 2003-12-29 2006-04-04 삼성전자주식회사 반도체 소자의 패턴 선폭 측정 방법 및 장치
US8064044B2 (en) 2004-01-05 2011-11-22 Nikon Corporation Exposure apparatus, exposure method, and device producing method
JPWO2005067012A1 (ja) * 2004-01-06 2007-07-26 株式会社ニコン 露光方法及び装置並びにデバイス製造方法
US20080151365A1 (en) 2004-01-14 2008-06-26 Carl Zeiss Smt Ag Catadioptric projection objective
US7463422B2 (en) 2004-01-14 2008-12-09 Carl Zeiss Smt Ag Projection exposure apparatus
KR101288187B1 (ko) 2004-01-14 2013-07-19 칼 짜이스 에스엠티 게엠베하 반사굴절식 투영 대물렌즈
JP4843503B2 (ja) 2004-01-20 2011-12-21 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィ投影露光装置および投影レンズのための測定装置
US7072024B2 (en) 2004-01-20 2006-07-04 Nikon Corporation Lithographic projection method and apparatus
US7053980B2 (en) * 2004-01-23 2006-05-30 Asml Netherlands B.V. Lithographic alignment system
WO2005071717A1 (ja) * 2004-01-26 2005-08-04 Nikon Corporation 露光装置及びデバイス製造方法
TWI395068B (zh) * 2004-01-27 2013-05-01 尼康股份有限公司 光學系統、曝光裝置以及曝光方法
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
KR101276392B1 (ko) * 2004-02-03 2013-06-19 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
TW200537255A (en) * 2004-02-04 2005-11-16 Nikon Corp Exposure equipment and method, position control method and device manufacturing method
KR101942136B1 (ko) 2004-02-04 2019-01-24 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
TWI437618B (zh) 2004-02-06 2014-05-11 尼康股份有限公司 偏光變換元件、光學照明裝置、曝光裝置以及曝光方法
US7557900B2 (en) 2004-02-10 2009-07-07 Nikon Corporation Exposure apparatus, device manufacturing method, maintenance method, and exposure method
JP4572896B2 (ja) * 2004-02-19 2010-11-04 株式会社ニコン 露光装置及びデバイスの製造方法
US20070030467A1 (en) * 2004-02-19 2007-02-08 Nikon Corporation Exposure apparatus, exposure method, and device fabricating method
WO2005081292A1 (ja) * 2004-02-20 2005-09-01 Nikon Corporation 露光装置、供給方法及び回収方法、露光方法、ならびにデバイス製造方法
DE102004013886A1 (de) 2004-03-16 2005-10-06 Carl Zeiss Smt Ag Verfahren zur Mehrfachbelichtung, Mikrolithografie-Projektionsbelichtungsanlage und Projektionssystem
US7242475B2 (en) * 2004-03-25 2007-07-10 Asml Netherlands B.V. Method of determining aberration of a projection system of a lithographic apparatus
US7615424B2 (en) * 2004-03-25 2009-11-10 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and method for manufacturing semiconductor device using the laser irradiation apparatus
US8111373B2 (en) * 2004-03-25 2012-02-07 Nikon Corporation Exposure apparatus and device fabrication method
US7034917B2 (en) * 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7712905B2 (en) 2004-04-08 2010-05-11 Carl Zeiss Smt Ag Imaging system with mirror group
JP2005303196A (ja) * 2004-04-15 2005-10-27 Canon Inc 位置決め装置、露光装置、半導体デバイスの製造方法
KR101258033B1 (ko) 2004-04-19 2013-04-24 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
EP1747499A2 (de) 2004-05-04 2007-01-31 Nikon Corporation Vorrichtung und verfahren zur bereitstellung eines fluids für die immersionslithographie
KR20170129271A (ko) 2004-05-17 2017-11-24 칼 짜이스 에스엠티 게엠베하 중간이미지를 갖는 카타디옵트릭 투사 대물렌즈
US7486381B2 (en) * 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7385671B2 (en) * 2004-05-28 2008-06-10 Azores Corporation High speed lithography machine and method
US20070216889A1 (en) * 2004-06-04 2007-09-20 Yasufumi Nishii Exposure Apparatus, Exposure Method, and Method for Producing Device
KR101257960B1 (ko) 2004-06-04 2013-04-24 칼 짜이스 에스엠테 게엠베하 광학적 결상 시스템의 결상 품질을 측정하기 위한 시스템
EP1788617B1 (de) 2004-06-09 2013-04-10 Nikon Corporation Substrathalteeinrichtung, belichtungsvorrichtung diese enthaltend und verfahren zur bauelementeherstellung
KR101422964B1 (ko) 2004-06-09 2014-07-24 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US8373843B2 (en) * 2004-06-10 2013-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP3203321A1 (de) 2004-06-10 2017-08-09 Nikon Corporation Belichtungsvorrichtung, belichtungsverfahren und verfahren zur herstellung einer vorrichtung
US8717533B2 (en) * 2004-06-10 2014-05-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8508713B2 (en) * 2004-06-10 2013-08-13 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
KR20120026639A (ko) 2004-06-10 2012-03-19 가부시키가이샤 니콘 노광 장치, 노광 방법, 및 디바이스 제조 방법
WO2006007167A2 (en) * 2004-06-17 2006-01-19 Nikon Corporation Magnetic levitation lithography apparatus and method
TWI372262B (en) * 2004-06-23 2012-09-11 Nikon Corp Optical projection system, exposuring device, and exposuring method
JPWO2006001282A1 (ja) * 2004-06-25 2008-04-17 株式会社ニコン 位置決め装置、位置決め方法、露光装置、露光方法、及びデバイスの製造方法
US7463330B2 (en) 2004-07-07 2008-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
ATE441937T1 (de) 2004-07-12 2009-09-15 Nikon Corp Belichtungsgerät und bauelemente- herstellungsverfahren
EP1788694A4 (de) * 2004-07-15 2014-07-02 Nikon Corp Planarmotorgerät, bühnengerät, belichtungsgerät und bauelementeherstellungsverfahren
JP4677987B2 (ja) * 2004-07-21 2011-04-27 株式会社ニコン 露光方法及びデバイス製造方法
EP1811526A4 (de) * 2004-07-23 2008-04-16 Nikon Corp Halteeinrichtung, bühneneinrichtung, belichtungseinrichtung und bauelemente-herstellungsverfahren
US7256871B2 (en) * 2004-07-27 2007-08-14 Asml Netherlands B.V. Lithographic apparatus and method for calibrating the same
JP2006113533A (ja) 2004-08-03 2006-04-27 Nikon Corp 投影光学系、露光装置、および露光方法
ATE470235T1 (de) * 2004-08-03 2010-06-15 Nikon Corp Belichtungsgeräte, belichtungsverfahren und bauelemente-herstellungsverfahren
TW200615716A (en) * 2004-08-05 2006-05-16 Nikon Corp Stage device and exposure device
EP1801853A4 (de) 2004-08-18 2008-06-04 Nikon Corp Belichtungsvorrichtung und bauelementeherstellungsverfahren
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4780412B2 (ja) * 2004-09-13 2011-09-28 株式会社ニコン 投影光学系、投影光学系の製造方法、露光装置及び露光方法
SG155929A1 (en) 2004-09-17 2009-10-29 Nikon Corp Exposure apparatus, exposure method, and method for manufacturing device
EP1806828A4 (de) 2004-10-01 2016-11-09 Nikon Corp Linearmotor, bühnenvorrichtung und belichtungsvorrichtung
WO2006040890A1 (ja) * 2004-10-08 2006-04-20 Nikon Corporation 露光装置及びデバイス製造方法
KR20070068343A (ko) * 2004-10-13 2007-06-29 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
TW200628995A (en) * 2004-10-13 2006-08-16 Nikon Corp Exposure device, exposure method, and device manufacturing method
SG156635A1 (en) * 2004-10-15 2009-11-26 Nikon Corp Exposure apparatus and device manufacturing method
KR20070067683A (ko) * 2004-10-18 2007-06-28 가부시키가이샤 니콘 베어링 장치, 스테이지 장치 및 노광 장치
KR101236120B1 (ko) 2004-10-26 2013-02-28 가부시키가이샤 니콘 기판 처리 방법, 노광 장치 및 디바이스 제조 방법
WO2006049134A1 (ja) * 2004-11-01 2006-05-11 Nikon Corporation 露光装置及びデバイス製造方法
US7749250B2 (en) * 2006-02-03 2010-07-06 Biomet Sports Medicine, Llc Soft tissue repair assembly and associated method
US20070285634A1 (en) * 2004-11-19 2007-12-13 Nikon Corporation Maintenance Method, Exposure Method, Exposure Apparatus, And Method For Producing Device
JP2006156554A (ja) * 2004-11-26 2006-06-15 Canon Inc ステージ装置およびそれを用いた露光装置、デバイス製造方法
KR101220613B1 (ko) 2004-12-01 2013-01-18 가부시키가이샤 니콘 스테이지 장치 및 노광 장치
WO2006062065A1 (ja) 2004-12-06 2006-06-15 Nikon Corporation メンテナンス方法、メンテナンス機器、露光装置、及びデバイス製造方法
WO2006062074A1 (ja) * 2004-12-06 2006-06-15 Nikon Corporation 基板処理方法、露光方法、露光装置及びデバイス製造方法
US7397533B2 (en) * 2004-12-07 2008-07-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4752473B2 (ja) 2004-12-09 2011-08-17 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
KR101771334B1 (ko) 2004-12-15 2017-08-24 가부시키가이샤 니콘 기판 유지 장치, 노광 장치 및 디바이스 제조방법
US7394080B2 (en) * 2004-12-23 2008-07-01 Taiwan Semiconductor Manufacturing Company, Ltd. Mask superposition for multiple exposures
TWI453796B (zh) * 2005-01-21 2014-09-21 尼康股份有限公司 偏光變更單元以及元件製造方法
US8692973B2 (en) * 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
EP1863070B1 (de) * 2005-01-31 2016-04-27 Nikon Corporation Belichtungsvorrichtung und verfahren zur herstellung einer vorrichtung
CN100361112C (zh) * 2005-02-05 2008-01-09 上海微电子装备有限公司 步进扫描投影光刻机同步总线控制方法
US20070258068A1 (en) * 2005-02-17 2007-11-08 Hiroto Horikawa Exposure Apparatus, Exposure Method, and Device Fabricating Method
TWI424260B (zh) 2005-03-18 2014-01-21 尼康股份有限公司 A board member, a substrate holding device, an exposure apparatus and an exposure method, and a device manufacturing method
WO2006101024A1 (ja) * 2005-03-18 2006-09-28 Nikon Corporation 露光方法及び露光装置、デバイス製造方法、並びに露光装置の評価方法
US9239524B2 (en) * 2005-03-30 2016-01-19 Nikon Corporation Exposure condition determination method, exposure method, exposure apparatus, and device manufacturing method involving detection of the situation of a liquid immersion region
EP1865540A4 (de) * 2005-03-30 2010-03-17 Nikon Corp Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren
TW200644079A (en) * 2005-03-31 2006-12-16 Nikon Corp Exposure apparatus, exposure method, and device production method
US20070132976A1 (en) * 2005-03-31 2007-06-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP1865541A4 (de) * 2005-03-31 2017-06-14 Nikon Corporation Belichtungsverfahren, belichtungsvorrichtung und bauelementeherstellungsverfahren
US7161659B2 (en) * 2005-04-08 2007-01-09 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US7515281B2 (en) * 2005-04-08 2009-04-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
USRE43576E1 (en) 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
EP1873816A4 (de) * 2005-04-18 2010-11-24 Nikon Corp Belichtungseinrichtung, belichtungsverfahren und bauelemente-herstellungsverfahren
EP1876635A4 (de) 2005-04-25 2010-06-30 Nikon Corp Belichtungsverfahren, belichtungsvorrichtung sowie herstellungsverfahren für die vorrichtung
CN100555568C (zh) 2005-04-28 2009-10-28 株式会社尼康 曝光方法及曝光装置、以及元件制造方法
KR20080005376A (ko) * 2005-04-28 2008-01-11 가부시키가이샤 니콘 노광 방법 및 노광 장치, 그리고 디바이스 제조 방법
EP2660853B1 (de) 2005-05-12 2017-07-05 Nikon Corporation Optisches Projektionssystem, Belichtungsvorrichtung und Belichtungsverfahren
KR20080007383A (ko) * 2005-05-24 2008-01-18 가부시키가이샤 니콘 노광 방법 및 노광 장치, 그리고 디바이스 제조 방법
JP4410216B2 (ja) * 2005-05-24 2010-02-03 エーエスエムエル ネザーランズ ビー．ブイ． ２ステージ・リソグラフィ装置及びデバイス製造方法
US7512452B2 (en) * 2005-06-13 2009-03-31 Mauro George E Positioning system for eliminating lost motion effect
EP1895571A4 (de) 2005-06-21 2011-04-27 Nikon Corp Belichtungsvorrichtung, belichtungsverfahren, wartungsverfahren und bauelemente-herstellungsverfahren
US20070085989A1 (en) * 2005-06-21 2007-04-19 Nikon Corporation Exposure apparatus and exposure method, maintenance method, and device manufacturing method
US7924416B2 (en) * 2005-06-22 2011-04-12 Nikon Corporation Measurement apparatus, exposure apparatus, and device manufacturing method
WO2007000995A1 (ja) * 2005-06-28 2007-01-04 Nikon Corporation 露光装置及び方法、並びにデバイス製造方法
US8693006B2 (en) * 2005-06-28 2014-04-08 Nikon Corporation Reflector, optical element, interferometer system, stage device, exposure apparatus, and device fabricating method
KR20080015778A (ko) * 2005-06-29 2008-02-20 가부시키가이샤 니콘 노광 장치, 기판 처리 방법, 및 디바이스 제조 방법
KR20080026082A (ko) * 2005-06-30 2008-03-24 가부시키가이샤 니콘 노광장치 및 방법, 노광장치의 메인터넌스 방법 및디바이스 제조방법
KR101868218B1 (ko) * 2005-07-08 2018-06-15 가부시키가이샤 니콘 면 위치 검출 장치, 노광 장치 및 노광 방법
JP5353005B2 (ja) 2005-07-11 2013-11-27 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
CN101228615B (zh) * 2005-07-26 2012-03-21 富士通半导体股份有限公司 对位方法
CN101138070B (zh) * 2005-08-05 2011-03-23 株式会社尼康 载台装置及曝光装置
KR101449055B1 (ko) 2005-08-23 2014-10-08 가부시키가이샤 니콘 노광 장치, 노광 방법, 및 디바이스 제조 방법
TWI450044B (zh) 2005-08-31 2014-08-21 尼康股份有限公司 An optical element, an exposure apparatus using the same, an exposure method, and a manufacturing method of the micro-element
US8780326B2 (en) * 2005-09-09 2014-07-15 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8111374B2 (en) * 2005-09-09 2012-02-07 Nikon Corporation Analysis method, exposure method, and device manufacturing method
WO2007034838A1 (ja) 2005-09-21 2007-03-29 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
US20070070323A1 (en) * 2005-09-21 2007-03-29 Nikon Corporation Exposure apparatus, exposure method, and device fabricating method
US7948675B2 (en) * 2005-10-11 2011-05-24 Nikon Corporation Surface-corrected multilayer-film mirrors with protected reflective surfaces, exposure systems comprising same, and associated methods
US20070095739A1 (en) * 2005-10-24 2007-05-03 Nikon Corporation Utility transfer apparatus, stage apparatus, exposure apparatus, and device manufacturing method
US8681314B2 (en) * 2005-10-24 2014-03-25 Nikon Corporation Stage device and coordinate correction method for the same, exposure apparatus, and device manufacturing method
US20070127135A1 (en) * 2005-11-01 2007-06-07 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
JPWO2007052659A1 (ja) 2005-11-01 2009-04-30 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
US20070127002A1 (en) * 2005-11-09 2007-06-07 Nikon Corporation Exposure apparatus and method, and device manufacturing method
KR20080065981A (ko) 2005-11-09 2008-07-15 가부시키가이샤 니콘 노광 장치 및 방법, 및 디바이스 제조 방법
KR20080066836A (ko) * 2005-11-09 2008-07-16 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
WO2007055373A1 (ja) 2005-11-14 2007-05-18 Nikon Corporation 液体回収部材、露光装置、露光方法、及びデバイス製造方法
EP1956431A4 (de) 2005-11-15 2009-06-24 Nikon Corp Belichtungsvorrichtung, belichtungsverfahren und bauelemente-herstellungsverfahren
TW200721260A (en) 2005-11-16 2007-06-01 Nikon Corp Substrate processing method, photomask manufacturing method, photomask and device manufacturing method
US7803516B2 (en) * 2005-11-21 2010-09-28 Nikon Corporation Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus
JP2007165869A (ja) 2005-11-21 2007-06-28 Nikon Corp 露光方法及びそれを用いたデバイス製造方法、露光装置、並びに基板処理方法及び装置
EP1970944A4 (de) 2005-12-06 2010-04-28 Nikon Corp Belichtungsvorrichtung, belichtungsverfahren, optisches projektionssystem und bauelementeherstellungsverfahren
US7782442B2 (en) * 2005-12-06 2010-08-24 Nikon Corporation Exposure apparatus, exposure method, projection optical system and device producing method
KR100768849B1 (ko) * 2005-12-06 2007-10-22 엘지전자 주식회사 계통 연계형 연료전지 시스템의 전원공급장치 및 방법
WO2007066692A1 (ja) 2005-12-06 2007-06-14 Nikon Corporation 露光方法、露光装置、及びデバイス製造方法
WO2007066758A1 (ja) 2005-12-08 2007-06-14 Nikon Corporation 基板保持装置、露光装置、露光方法、及びデバイス製造方法
US8953148B2 (en) * 2005-12-28 2015-02-10 Nikon Corporation Exposure apparatus and making method thereof
WO2007077875A1 (ja) 2005-12-28 2007-07-12 Nikon Corporation 露光装置及び露光方法、並びにデバイス製造方法
TWI457977B (zh) 2005-12-28 2014-10-21 尼康股份有限公司 A pattern forming method and a pattern forming apparatus, and an element manufacturing method
KR101296546B1 (ko) * 2005-12-28 2013-08-13 가부시키가이샤 니콘 패턴 형성 방법 및 패턴 형성 장치, 노광 방법 및 노광장치, 그리고 디바이스 제조 방법
US8411271B2 (en) * 2005-12-28 2013-04-02 Nikon Corporation Pattern forming method, pattern forming apparatus, and device manufacturing method
EP2963498B8 (de) 2006-01-19 2017-07-26 Nikon Corporation Belichtungsgerät, belichtungsverfahren und verfahren zur herstellung einer vorrichtung
KR100741110B1 (ko) * 2006-02-15 2007-07-19 삼성에스디아이 주식회사 광 파이버 및 플라즈마 디스플레이 패널의 전극 형성 방법
WO2007094431A1 (ja) 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
WO2007094414A1 (ja) 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
WO2007094407A1 (ja) 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
WO2007094470A1 (ja) 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
US8134681B2 (en) * 2006-02-17 2012-03-13 Nikon Corporation Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
KR101346581B1 (ko) 2006-02-21 2014-01-02 가부시키가이샤 니콘 패턴 형성 장치 및 패턴 형성 방법, 이동체 구동 시스템 및이동체 구동 방법, 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
EP3115844B1 (de) 2006-02-21 2018-08-15 Nikon Corporation Belichtungsapparat, belichtungsverfahren und verfahren zur herstellung einer vorrichtung
EP2813893A1 (de) 2006-02-21 2014-12-17 Nikon Corporation Belichtungsvorrichtung, Belichtungsverfahren, und Verfahren zur Herstellung einer Vorrichtung
EP1993121A4 (de) * 2006-03-03 2011-12-07 Nikon Corp Belichtungsvorrichtung und bauelementeherstellungsverfahren
KR20080108226A (ko) 2006-03-03 2008-12-12 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
WO2007102484A1 (ja) 2006-03-07 2007-09-13 Nikon Corporation デバイス製造方法、デバイス製造システム及び測定検査装置
EP1995768A4 (de) 2006-03-13 2013-02-06 Nikon Corp Belichtungsvorrichtung, wartungsverfahren, belichtungsverfahren sowie herstellungsverfahren für die vorrichtung
US20070242254A1 (en) 2006-03-17 2007-10-18 Nikon Corporation Exposure apparatus and device manufacturing method
US8982322B2 (en) * 2006-03-17 2015-03-17 Nikon Corporation Exposure apparatus and device manufacturing method
WO2007109682A2 (en) * 2006-03-20 2007-09-27 Duetto Integrated Systems, Inc. Improved system and method for manufacturing laminated circuit boards
CN100590173C (zh) * 2006-03-24 2010-02-17 北京有色金属研究总院 一种荧光粉及其制造方法和所制成的电光源
JP5133239B2 (ja) * 2006-04-05 2013-01-30 シャープ株式会社 露光方法および露光装置
TW200746259A (en) 2006-04-27 2007-12-16 Nikon Corp Measuring and/or inspecting method, measuring and/or inspecting apparatus, exposure method, device manufacturing method, and device manufacturing apparatus
US7483120B2 (en) * 2006-05-09 2009-01-27 Asml Netherlands B.V. Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method
DE102006021797A1 (de) 2006-05-09 2007-11-15 Carl Zeiss Smt Ag Optische Abbildungseinrichtung mit thermischer Dämpfung
US20070267995A1 (en) * 2006-05-18 2007-11-22 Nikon Corporation Six Degree-of-Freedom Stage Apparatus
US20080024749A1 (en) * 2006-05-18 2008-01-31 Nikon Corporation Low mass six degree of freedom stage for lithography tools
US7728462B2 (en) * 2006-05-18 2010-06-01 Nikon Corporation Monolithic stage devices providing motion in six degrees of freedom
JP5217239B2 (ja) 2006-05-18 2013-06-19 株式会社ニコン 露光方法及び装置、メンテナンス方法、並びにデバイス製造方法
CN102109773A (zh) * 2006-05-22 2011-06-29 株式会社尼康 曝光方法、曝光装置以及维修方法
CN101385124B (zh) 2006-05-23 2011-02-09 株式会社尼康 维修方法、曝光方法及装置、以及组件制造方法
WO2007139017A1 (ja) * 2006-05-29 2007-12-06 Nikon Corporation 液体回収部材、基板保持部材、露光装置、及びデバイス製造方法
KR20090023545A (ko) 2006-05-31 2009-03-05 가부시키가이샤 니콘 노광 장치 및 노광 방법
US7795601B2 (en) 2006-06-01 2010-09-14 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus to improve lithography throughput
EP2037487A4 (de) 2006-06-09 2014-07-02 Nikon Corp Vorrichtung mit mobilem element, belichtungsvorrichtung, belichtungsverfahren sowie herstellungsverfahren dafür
JPWO2007142350A1 (ja) 2006-06-09 2009-10-29 株式会社ニコン パターン形成方法及びパターン形成装置、露光方法及び露光装置、並びにデバイス製造方法
EP2043134A4 (de) * 2006-06-30 2012-01-25 Nikon Corp Wartungsverfahren, belichtungsverfahren und vorrichtung und bauelementeherstellungsverfahren
US20080073563A1 (en) 2006-07-01 2008-03-27 Nikon Corporation Exposure apparatus that includes a phase change circulation system for movers
JP2008021748A (ja) * 2006-07-11 2008-01-31 Canon Inc 露光装置
JP5339056B2 (ja) * 2006-07-14 2013-11-13 株式会社ニコン 露光装置及びデバイス製造方法
DE102006034906A1 (de) * 2006-07-28 2008-01-31 Carl Zeiss Microimaging Gmbh Laser-Scanning-Mikroskop und Verfahren zu seinem Betrieb
US8570484B2 (en) * 2006-08-30 2013-10-29 Nikon Corporation Immersion exposure apparatus, device manufacturing method, cleaning method, and cleaning member to remove foreign substance using liquid
TWI609252B (zh) * 2006-08-31 2017-12-21 Nikon Corp Moving body driving system and moving body driving method, pattern forming apparatus and method, exposure apparatus and method, element manufacturing method, and determination method
SG174737A1 (en) 2006-08-31 2011-10-28 Nikon Corp Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
TWI529501B (zh) 2006-08-31 2016-04-11 尼康股份有限公司 Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, and component manufacturing method
KR20180085820A (ko) 2006-09-01 2018-07-27 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 디바이스 제조 방법, 그리고 캘리브레이션 방법
TWI584082B (zh) 2006-09-01 2017-05-21 尼康股份有限公司 Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, and component manufacturing method
TWI481968B (zh) * 2006-09-08 2015-04-21 尼康股份有限公司 A mask, an exposure device, and an element manufacturing method
WO2008029884A1 (fr) * 2006-09-08 2008-03-13 Nikon Corporation Dispositif et procédé de nettoyage, et procédé de fabrication du dispositif
US7872730B2 (en) * 2006-09-15 2011-01-18 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
KR101413891B1 (ko) 2006-09-29 2014-06-30 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
WO2008038752A1 (fr) 2006-09-29 2008-04-03 Nikon Corporation système à unité MOBILE, DISPOSITIF DE FORMATION DE MOTIF, DISPOSITIF D'EXPOSITION, PROCÉDÉ D'EXPOSITION, ET PROCÉDÉ DE FABRICATION DE DISPOSITIF
JP4999415B2 (ja) * 2006-09-29 2012-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理装置の用力供給装置及び基板処理装置の用力供給方法
US20080100909A1 (en) * 2006-10-30 2008-05-01 Nikon Corporation Optical element, liquid immersion exposure apparatus, liquid immersion exposure method, and method for producing microdevice
WO2008053918A1 (fr) * 2006-10-31 2008-05-08 Nikon Corporation Appareil de maintien de liquide, procédé de maintien de liquide, appareil d'exposition, procédé d'exposition et procédé de fabrication du dispositif
WO2008056735A1 (fr) * 2006-11-09 2008-05-15 Nikon Corporation Unité de support, système de détection de position et système d'exposition, procédé de déplacement, procédé de détection de position, procédé d'exposition, procédé d'ajustement du système de détection, et procédé de prod
US20080156356A1 (en) * 2006-12-05 2008-07-03 Nikon Corporation Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method
US20080212047A1 (en) * 2006-12-28 2008-09-04 Nikon Corporation Exposure apparatus, exposing method, and device fabricating method
US8004651B2 (en) 2007-01-23 2011-08-23 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
TW200846838A (en) * 2007-01-26 2008-12-01 Nikon Corp Support structure and exposure apparatus
US9529275B2 (en) * 2007-02-21 2016-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography scanner throughput
JP2010519722A (ja) * 2007-02-23 2010-06-03 株式会社ニコン 露光方法、露光装置、デバイス製造方法、及び液浸露光用基板
US8323855B2 (en) * 2007-03-01 2012-12-04 Nikon Corporation Pellicle frame apparatus, mask, exposing method, exposure apparatus, and device fabricating method
US20080225261A1 (en) * 2007-03-13 2008-09-18 Noriyuki Hirayanagi Exposure apparatus and device manufacturing method
US8237911B2 (en) * 2007-03-15 2012-08-07 Nikon Corporation Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
US20080225248A1 (en) * 2007-03-15 2008-09-18 Nikon Corporation Apparatus, systems and methods for removing liquid from workpiece during workpiece processing
US7830046B2 (en) * 2007-03-16 2010-11-09 Nikon Corporation Damper for a stage assembly
US8497980B2 (en) * 2007-03-19 2013-07-30 Nikon Corporation Holding apparatus, exposure apparatus, exposure method, and device manufacturing method
US8134685B2 (en) 2007-03-23 2012-03-13 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
US20080246941A1 (en) * 2007-04-06 2008-10-09 Katsura Otaki Wavefront aberration measuring device, projection exposure apparatus, method for manufacturing projection optical system, and method for manufacturing device
US8194322B2 (en) * 2007-04-23 2012-06-05 Nikon Corporation Multilayer-film reflective mirror, exposure apparatus, device manufacturing method, and manufacturing method of multilayer-film reflective mirror
US20080266651A1 (en) * 2007-04-24 2008-10-30 Katsuhiko Murakami Optical apparatus, multilayer-film reflective mirror, exposure apparatus, and device
TW201107639A (en) * 2007-04-27 2011-03-01 Edwards Japan Ltd Plate rotating device, exhaust path opening degree changing device, exhausted device, transfer device, beam device, and gate valve
CN101086627B (zh) * 2007-04-29 2010-10-06 上海微电子装备有限公司 凸点光刻机的曝光方法
US7623941B2 (en) * 2007-05-09 2009-11-24 Great Computer Corporation Method for adjusting the relative position of device of laser engraver
US8300207B2 (en) 2007-05-17 2012-10-30 Nikon Corporation Exposure apparatus, immersion system, exposing method, and device fabricating method
US20080285004A1 (en) * 2007-05-18 2008-11-20 Nikon Corporation Monolithic, Non-Contact Six Degree-of-Freedom Stage Apparatus
US20090122282A1 (en) * 2007-05-21 2009-05-14 Nikon Corporation Exposure apparatus, liquid immersion system, exposing method, and device fabricating method
KR20100031694A (ko) * 2007-05-28 2010-03-24 가부시키가이샤 니콘 노광 장치, 디바이스 제조 방법, 세정 장치, 및 클리닝 방법 그리고 노광 방법
US8164736B2 (en) * 2007-05-29 2012-04-24 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US8098362B2 (en) * 2007-05-30 2012-01-17 Nikon Corporation Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method
US20090015806A1 (en) * 2007-06-04 2009-01-15 Nikon Corporation Environmental control apparatus, stage apparatus, exposure apparatus and device manufacturing method
JP4968335B2 (ja) * 2007-06-11 2012-07-04 株式会社ニコン 計測部材、センサ、計測方法、露光装置、露光方法、及びデバイス製造方法
JP2009021555A (ja) * 2007-06-12 2009-01-29 Canon Inc 露光装置
KR100865554B1 (ko) * 2007-06-27 2008-10-29 주식회사 하이닉스반도체 노광 장치
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
US8243257B2 (en) 2007-07-24 2012-08-14 Nikon Corporation Position measurement system, exposure apparatus, position measuring method, exposure method and device manufacturing method, and tool and measuring method
US8547527B2 (en) * 2007-07-24 2013-10-01 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and pattern formation apparatus, and device manufacturing method
US8194232B2 (en) * 2007-07-24 2012-06-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method
EP2184768B1 (de) * 2007-07-24 2015-09-09 Nikon Corporation Mobilobjekt-ansteuerverfahren, mobilobjekt-ansteuersystem, strukturerzeugungsverfahren und vorrichtung, belichtungsverfahren und vorrichtung und bauelementeherstellungsverfahren
US9025126B2 (en) * 2007-07-31 2015-05-05 Nikon Corporation Exposure apparatus adjusting method, exposure apparatus, and device fabricating method
US20090051895A1 (en) * 2007-08-24 2009-02-26 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, device manufacturing method, and processing system
US8218129B2 (en) * 2007-08-24 2012-07-10 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, measuring method, and position measurement system
US8237919B2 (en) * 2007-08-24 2012-08-07 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads
US9304412B2 (en) * 2007-08-24 2016-04-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
US8867022B2 (en) * 2007-08-24 2014-10-21 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, and device manufacturing method
US8023106B2 (en) 2007-08-24 2011-09-20 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
WO2009028494A1 (ja) * 2007-08-28 2009-03-05 Nikon Corporation 位置検出装置、位置検出方法、露光装置、およびデバイス製造方法
TW200912560A (en) * 2007-09-07 2009-03-16 Nikon Corp Suspending apparatus and exposure apparatus
TW200915019A (en) * 2007-09-07 2009-04-01 Nat University Corp Yokohama Nat University Drive control method, drive control apparatus, stage control method, stage control apparatus, exposure method, exposure apparatus and measuring apparatus
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
US8421994B2 (en) * 2007-09-27 2013-04-16 Nikon Corporation Exposure apparatus
TW200916696A (en) * 2007-10-11 2009-04-16 Hannspree Inc Flat-panel display with illumination function
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
EP2179329A1 (de) 2007-10-16 2010-04-28 Nikon Corporation Optisches beleuchtungssystem, belichtungsgerät und geräteherstellungsverfahren
KR101562073B1 (ko) 2007-10-16 2015-10-21 가부시키가이샤 니콘 조명 광학 시스템, 노광 장치 및 디바이스 제조 방법
JP2009099873A (ja) * 2007-10-18 2009-05-07 Canon Inc 露光装置およびデバイス製造方法
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US20090201484A1 (en) * 2007-10-29 2009-08-13 Nikon Corporation Utilities supply member connection apparatus, stage apparatus, projection optical system support apparatus and exposure apparatus
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9013681B2 (en) * 2007-11-06 2015-04-21 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
US9256140B2 (en) * 2007-11-07 2016-02-09 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method with measurement device to measure movable body in Z direction
US8665455B2 (en) * 2007-11-08 2014-03-04 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
US8422015B2 (en) 2007-11-09 2013-04-16 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
KR100922004B1 (ko) * 2007-11-23 2009-10-14 세메스 주식회사 기판 노광 장치 및 방법
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) * 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5403263B2 (ja) * 2007-12-11 2014-01-29 株式会社ニコン 移動体装置、露光装置及びパターン形成装置、並びにデバイス製造方法
US20090147228A1 (en) * 2007-12-11 2009-06-11 Nikon Corporation Exposure apparatus, manufacturing method thereof, and maintenance method of exposure apparatus
US8711327B2 (en) * 2007-12-14 2014-04-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8964166B2 (en) * 2007-12-17 2015-02-24 Nikon Corporation Stage device, exposure apparatus and method of producing device
US20090174873A1 (en) * 2007-12-17 2009-07-09 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
SG183058A1 (en) * 2007-12-17 2012-08-30 Nikon Corp Exposure apparatus, exposure method and device manufacturing method
US20090153824A1 (en) * 2007-12-17 2009-06-18 Kla-Tencor Corporation Multiple chuck scanning stage
JP5088588B2 (ja) * 2007-12-28 2012-12-05 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
US8451425B2 (en) * 2007-12-28 2013-05-28 Nikon Corporation Exposure apparatus, exposure method, cleaning apparatus, and device manufacturing method
US8269945B2 (en) 2007-12-28 2012-09-18 Nikon Corporation Movable body drive method and apparatus, exposure method and apparatus, pattern formation method and apparatus, and device manufacturing method
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
WO2009088003A1 (ja) * 2008-01-10 2009-07-16 Nikon Corporation 露光方法及び露光装置、並びにデバイス製造方法
JP5369443B2 (ja) 2008-02-05 2013-12-18 株式会社ニコン ステージ装置、露光装置、露光方法、及びデバイス製造方法
KR20100124245A (ko) * 2008-02-08 2010-11-26 가부시키가이샤 니콘 위치 계측 시스템 및 위치 계측 방법, 이동체 장치, 이동체 구동 방법, 노광 장치 및 노광 방법, 패턴 형성 장치, 그리고 디바이스 제조 방법
JP2009200122A (ja) * 2008-02-19 2009-09-03 Canon Inc 露光装置およびデバイス製造方法
US20090218743A1 (en) * 2008-02-29 2009-09-03 Nikon Corporation Substrate holding apparatus, exposure apparatus, exposing method, device fabricating method, plate member, and wall
US20100039628A1 (en) * 2008-03-19 2010-02-18 Nikon Corporation Cleaning tool, cleaning method, and device fabricating method
US8233139B2 (en) * 2008-03-27 2012-07-31 Nikon Corporation Immersion system, exposure apparatus, exposing method, and device fabricating method
KR20100128352A (ko) * 2008-04-11 2010-12-07 가부시키가이샤 니콘 스테이지장치, 노광장치 및 디바이스 제조방법
US8654306B2 (en) * 2008-04-14 2014-02-18 Nikon Corporation Exposure apparatus, cleaning method, and device fabricating method
US20090280439A1 (en) * 2008-04-30 2009-11-12 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8786829B2 (en) * 2008-05-13 2014-07-22 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8817236B2 (en) 2008-05-13 2014-08-26 Nikon Corporation Movable body system, movable body drive method, pattern formation apparatus, pattern formation method, exposure apparatus, exposure method, and device manufacturing method
US8228482B2 (en) * 2008-05-13 2012-07-24 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
CN101910817B (zh) 2008-05-28 2016-03-09 株式会社尼康 照明光学系统、曝光装置以及器件制造方法
EP2128703A1 (de) * 2008-05-28 2009-12-02 ASML Netherlands BV Lithographische Vorrichtung und Betriebsverfahren für die Vorrichtung
EP2131243B1 (de) * 2008-06-02 2015-07-01 ASML Netherlands B.V. Lithografische Vorrichtung und Verfahren zur Positionskalibrierung eines Trägertisches
JP2009302154A (ja) * 2008-06-10 2009-12-24 Canon Inc 露光装置及びデバイス製造方法
US20100165309A1 (en) * 2008-07-10 2010-07-01 Nikon Corporation Deformation measuring apparatus, exposure apparatus, jig for the deformation measuring apparatus, position measuring method and device fabricating method
JP5087679B2 (ja) * 2008-07-30 2012-12-05 株式会社ニューフレアテクノロジー 電子ビーム装置
US20100045949A1 (en) * 2008-08-11 2010-02-25 Nikon Corporation Exposure apparatus, maintaining method and device fabricating method
US20100053588A1 (en) * 2008-08-29 2010-03-04 Nikon Corporation Substrate Stage movement patterns for high throughput While Imaging a Reticle to a pair of Imaging Locations
US8435723B2 (en) * 2008-09-11 2013-05-07 Nikon Corporation Pattern forming method and device production method
US8384875B2 (en) * 2008-09-29 2013-02-26 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US20100302526A1 (en) * 2008-11-13 2010-12-02 Nikon Corporation Drive control method for moving body, exposure method, robot control method, drive control apparatus, exposure apparatus and robot apparatus
US8902402B2 (en) * 2008-12-19 2014-12-02 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US8599359B2 (en) 2008-12-19 2013-12-03 Nikon Corporation Exposure apparatus, exposure method, device manufacturing method, and carrier method
US8760629B2 (en) 2008-12-19 2014-06-24 Nikon Corporation Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
US8773635B2 (en) 2008-12-19 2014-07-08 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8896806B2 (en) 2008-12-29 2014-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
GB0900191D0 (en) * 2009-01-07 2009-02-11 Ge Healthcare Uk Ltd Microscopy
US20100196832A1 (en) * 2009-01-30 2010-08-05 Nikon Corporation Exposure apparatus, exposing method, liquid immersion member and device fabricating method
KR101712219B1 (ko) 2009-03-10 2017-03-03 가부시키가이샤 니콘 노광 장치, 노광 방법, 및 디바이스 제조 방법
US8143602B2 (en) * 2009-03-25 2012-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. High-volume manufacturing massive e-beam maskless lithography system
US8953143B2 (en) * 2009-04-24 2015-02-10 Nikon Corporation Liquid immersion member
US8202671B2 (en) 2009-04-28 2012-06-19 Nikon Corporation Protective apparatus, mask, mask forming apparatus, mask forming method, exposure apparatus, device fabricating method, and foreign matter detecting apparatus
WO2010125813A1 (ja) * 2009-04-30 2010-11-04 株式会社ニコン 露光方法及びデバイス製造方法、並びに重ね合わせ誤差計測方法
TW201115047A (en) * 2009-05-07 2011-05-01 Nikon Corp Vibration control apparatus, vibration control method, exposure apparatus, and device manufacturing method
JPWO2010131490A1 (ja) * 2009-05-15 2012-11-01 株式会社ニコン 露光装置及びデバイス製造方法
US20100323303A1 (en) * 2009-05-15 2010-12-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, and device fabricating method
US8970820B2 (en) 2009-05-20 2015-03-03 Nikon Corporation Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method
US8792084B2 (en) 2009-05-20 2014-07-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8553204B2 (en) * 2009-05-20 2013-10-08 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US9312159B2 (en) 2009-06-09 2016-04-12 Nikon Corporation Transport apparatus and exposure apparatus
KR101499285B1 (ko) 2009-08-07 2015-03-05 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
TWI579659B (zh) * 2009-08-07 2017-04-21 尼康股份有限公司 An exposure apparatus, and an element manufacturing method
US20110037962A1 (en) * 2009-08-17 2011-02-17 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
US8488109B2 (en) 2009-08-25 2013-07-16 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8493547B2 (en) 2009-08-25 2013-07-23 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8514395B2 (en) 2009-08-25 2013-08-20 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US20110096306A1 (en) * 2009-09-28 2011-04-28 Nikon Corporation Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method
US20110199591A1 (en) * 2009-10-14 2011-08-18 Nikon Corporation Exposure apparatus, exposing method, maintenance method and device fabricating method
KR20120100959A (ko) 2009-10-30 2012-09-12 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
CN102597873B (zh) * 2009-11-05 2014-12-17 株式会社尼康 焦点测试光罩、焦点测量方法、曝光装置、及曝光方法
JP5861642B2 (ja) 2009-11-09 2016-02-16 株式会社ニコン 露光装置、露光方法、露光装置のメンテナンス方法、露光装置の調整方法、デバイス製造方法、及びダミー基板
US20110134400A1 (en) * 2009-12-04 2011-06-09 Nikon Corporation Exposure apparatus, liquid immersion member, and device manufacturing method
JP5282979B2 (ja) * 2009-12-22 2013-09-04 株式会社ブイ・テクノロジー 露光装置
US8488106B2 (en) * 2009-12-28 2013-07-16 Nikon Corporation Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method
KR20120112615A (ko) 2009-12-28 2012-10-11 가부시키가이샤 니콘 액침 부재, 액침 부재의 제조 방법, 노광 장치, 및 디바이스 제조 방법
WO2011083724A1 (ja) 2010-01-08 2011-07-14 株式会社ニコン 液浸部材、露光装置、露光方法、及びデバイス製造方法
US8841065B2 (en) * 2010-02-12 2014-09-23 Nikon Corporation Manufacturing method of exposure apparatus and device manufacturing method
KR101410846B1 (ko) * 2010-02-19 2014-06-23 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 및 디바이스 제조 방법
WO2011102109A1 (ja) 2010-02-20 2011-08-25 株式会社ニコン 光源最適化方法、露光方法、デバイス製造方法、プログラム、露光装置、リソグラフィシステム、及び光源評価方法、並びに光源変調方法
US20110205519A1 (en) * 2010-02-25 2011-08-25 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
US20110222031A1 (en) 2010-03-12 2011-09-15 Nikon Corporation Liquid immersion member, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
JP5583436B2 (ja) * 2010-03-15 2014-09-03 住友重機械工業株式会社 ラインスキャニング装置
US20120013863A1 (en) 2010-07-14 2012-01-19 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US8937703B2 (en) 2010-07-14 2015-01-20 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120013864A1 (en) 2010-07-14 2012-01-19 Nikon Corporation Liquid immersion member, immersion exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120012191A1 (en) 2010-07-16 2012-01-19 Nikon Corporation Liquid recovery apparatus, exposure apparatus, liquid recovering method, device fabricating method, program, and storage medium
US20120019804A1 (en) 2010-07-23 2012-01-26 Nikon Corporation Cleaning method, cleaning apparatus, device fabricating method, program, and storage medium
US20120019802A1 (en) 2010-07-23 2012-01-26 Nikon Corporation Cleaning method, immersion exposure apparatus, device fabricating method, program, and storage medium
US20120019803A1 (en) 2010-07-23 2012-01-26 Nikon Corporation Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program, and storage medium
KR101674248B1 (ko) * 2010-09-13 2016-11-08 가부시키가이샤 오크세이사쿠쇼 투영 노광 장치
CN102487030B (zh) * 2010-12-06 2013-12-18 上海微电子装备有限公司 双工件台夹持机构
US20120162619A1 (en) 2010-12-27 2012-06-28 Nikon Corporation Liquid immersion member, immersion exposure apparatus, exposing method, device fabricating method, program, and storage medium
US20120188521A1 (en) 2010-12-27 2012-07-26 Nikon Corporation Cleaning method, liquid immersion member, immersion exposure apparatus, device fabricating method, program and storage medium
JPWO2012115002A1 (ja) 2011-02-22 2014-07-07 株式会社ニコン 保持装置、露光装置、及びデバイスの製造方法
CN102141739B (zh) * 2011-04-01 2013-01-16 清华大学 光刻机硅片台双台交换系统
US20130016329A1 (en) 2011-07-12 2013-01-17 Nikon Corporation Exposure apparatus, exposure method, measurement method, and device manufacturing method
US9329496B2 (en) 2011-07-21 2016-05-03 Nikon Corporation Exposure apparatus, exposure method, method of manufacturing device, program, and storage medium
US9256137B2 (en) 2011-08-25 2016-02-09 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
US8601407B2 (en) 2011-08-25 2013-12-03 Taiwan Semiconductor Manufacturing Company, Ltd. Geometric pattern data quality verification for maskless lithography
US20130050666A1 (en) 2011-08-26 2013-02-28 Nikon Corporation Exposure apparatus, liquid holding method, and device manufacturing method
US8473877B2 (en) 2011-09-06 2013-06-25 Taiwan Semiconductor Manufacturing Company, Ltd. Striping methodology for maskless lithography
NL2009345A (en) 2011-09-28 2013-04-02 Asml Netherlands Bv Method of applying a pattern to a substrate, device manufacturing method and lithographic apparatus for use in such methods.
CN102378494B (zh) * 2011-10-31 2014-03-26 深南电路有限公司 一种电路板阻焊加工方法
JP6156147B2 (ja) 2011-11-17 2017-07-05 株式会社ニコン エンコーダ装置、光学装置、露光装置、及びデバイス製造方法
US20130135594A1 (en) 2011-11-25 2013-05-30 Nikon Corporation Liquid immersion member, immersion exposure apparatus, exposure method, device manufacturing method, program, and recording medium
US20130169944A1 (en) 2011-12-28 2013-07-04 Nikon Corporation Exposure apparatus, exposure method, device manufacturing method, program, and recording medium
US9207549B2 (en) 2011-12-29 2015-12-08 Nikon Corporation Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement
US9360772B2 (en) 2011-12-29 2016-06-07 Nikon Corporation Carrier method, exposure method, carrier system and exposure apparatus, and device manufacturing method
EP2620976B1 (de) * 2012-01-25 2016-07-20 Qoniac GmbH Überlagerungsmodell zur Ausrichtung und Belichtung von Halbleiterscheiben
US9543223B2 (en) 2013-01-25 2017-01-10 Qoniac Gmbh Method and apparatus for fabricating wafer by calculating process correction parameters
CN103246170B (zh) * 2012-02-09 2015-07-08 中芯国际集成电路制造(上海)有限公司 曝光装置及曝光方法
CN104272194B (zh) 2012-03-08 2017-08-25 迈普尔平版印刷Ip有限公司 处理靶材的光刻系统和方法
US9323160B2 (en) 2012-04-10 2016-04-26 Nikon Corporation Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium
US9268231B2 (en) 2012-04-10 2016-02-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US10679883B2 (en) * 2012-04-19 2020-06-09 Intevac, Inc. Wafer plate and mask arrangement for substrate fabrication
US9606447B2 (en) 2012-05-21 2017-03-28 Nikon Corporation Reflective mirror, projection optical system, exposure apparatus, and device manufacturing method
RU2525152C2 (ru) * 2012-06-25 2014-08-10 Общество с ограниченной ответственностью "ВЕСТТРЭЙД ЛТД" Способ формирования изображения микрообъекта (варианты) и устройство для его осуществления (варианты)
US9823580B2 (en) 2012-07-20 2017-11-21 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
CN103676494B (zh) * 2012-09-25 2015-11-18 上海微电子装备有限公司 用于扫描光刻机的逐场调焦调平方法
US9568828B2 (en) 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9494870B2 (en) 2012-10-12 2016-11-15 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9798252B2 (en) 2012-11-20 2017-10-24 Nikon Corporation Exposure apparatus, movable body apparatus, and device manufacturing method
EP2950328A4 (de) 2012-11-30 2017-01-25 Nikon Corporation Saugvorrichtung, eintrageverfahren, fördersystem, lichtexpositionsvorrichtung und vorrichtungsherstellungsverfahren
CN113035768B (zh) 2012-11-30 2024-07-23 株式会社尼康 搬送系统
DE102012223128B4 (de) * 2012-12-13 2022-09-01 Carl Zeiss Microscopy Gmbh Autofokusverfahren für Mikroskop und Mikroskop mit Autofokuseinrichtung
JP6119242B2 (ja) 2012-12-27 2017-04-26 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
US9720331B2 (en) 2012-12-27 2017-08-01 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
US9651873B2 (en) 2012-12-27 2017-05-16 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
US9057955B2 (en) 2013-01-22 2015-06-16 Nikon Corporation Functional film, liquid immersion member, method of manufacturing liquid immersion member, exposure apparatus, and device manufacturing method
US9352073B2 (en) 2013-01-22 2016-05-31 Niko Corporation Functional film
WO2014132923A1 (ja) 2013-02-28 2014-09-04 株式会社ニコン 摺動膜、摺動膜が形成された部材、及びその製造方法
JP5344105B1 (ja) * 2013-03-08 2013-11-20 ウシオ電機株式会社 光配向用偏光光照射装置及び光配向用偏光光照射方法
KR20180050760A (ko) 2013-05-09 2018-05-15 가부시키가이샤 니콘 광학 소자, 투영 광학계, 노광 장치 및 디바이스 제조 방법
WO2014199744A1 (ja) * 2013-06-14 2014-12-18 株式会社ニコン 基板処理装置、デバイス製造方法及び露光方法
WO2015001805A1 (ja) 2013-07-05 2015-01-08 株式会社ニコン 多層膜反射鏡、多層膜反射鏡の製造方法、投影光学系、露光装置、デバイスの製造方法
JP2015041094A (ja) * 2013-08-23 2015-03-02 株式会社東芝 露光装置、露光方法および露光プログラム
WO2015052781A1 (ja) 2013-10-08 2015-04-16 株式会社ニコン 液浸部材、露光装置及び露光方法、並びにデバイス製造方法
JP6436090B2 (ja) 2013-10-30 2018-12-12 株式会社ニコン 基板保持装置、露光装置及びデバイス製造方法
US9766559B2 (en) * 2013-10-30 2017-09-19 Taiwan Semiconductor Manufacturing Co., Ltd. Edge-dominant alignment method in exposure scanner system
KR101963012B1 (ko) 2014-01-16 2019-03-27 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
TWI768409B (zh) 2015-02-23 2022-06-21 日商尼康股份有限公司 基板處理系統及基板處理方法、以及元件製造方法
CN112068406A (zh) 2015-02-23 2020-12-11 株式会社尼康 测量装置、光刻系统、以及组件制造方法
CN111290221B (zh) 2015-02-23 2023-07-28 株式会社尼康 测量装置、光刻系统、曝光装置、测量方法、曝光方法以及元件制造方法
TWI703402B (zh) 2015-03-25 2020-09-01 日商尼康股份有限公司 布局方法、標記檢測方法、曝光方法、測量裝置、曝光裝置、以及元件製造方法
DE102015211941A1 (de) * 2015-06-26 2016-12-29 Zf Friedrichshafen Ag Verfahren und Vorrichtung zur Reduzierung eines Energiebedarfs einer Werkzeugmaschine und Werkzeugmaschinensystem
US10031427B2 (en) * 2015-09-30 2018-07-24 Applied Materials, Inc. Methods and apparatus for vibration damping stage
JP6925783B2 (ja) * 2016-05-26 2021-08-25 株式会社アドテックエンジニアリング パターン描画装置及びパターン描画方法
EP3506012A4 (de) 2016-08-24 2020-04-15 Nikon Corporation Messsystem, substratverarbeitungssystem und verfahren zur herstellung einer vorrichtung
CN109791368B (zh) 2016-09-27 2021-11-26 株式会社尼康 决定方法及装置、程序、信息记录媒体、曝光装置、布局信息提供方法、布局方法、标记检测方法、曝光方法、以及器件制造方法
EP3521932A4 (de) 2016-09-30 2020-05-27 Nikon Corporation Messsystem, substratverarbeitungssystem und vorrichtungsherstellungsverfahren
CN110431486B (zh) 2017-03-16 2022-03-15 株式会社尼康 控制装置及控制方法、曝光装置及曝光方法、元件制造方法、数据生成方法和计算机可读介质
CN106842830B (zh) * 2017-04-19 2018-05-18 广东工业大学 一种焦点探测侧面式光刻焦面位置的检测装置及方法
JP6591482B2 (ja) * 2017-05-22 2019-10-16 株式会社東海理化電機製作所 露光方法
US10585360B2 (en) * 2017-08-25 2020-03-10 Applied Materials, Inc. Exposure system alignment and calibration method
US11126096B2 (en) 2017-09-29 2021-09-21 Onto Innovation, Inc. System and method for optimizing a lithography exposure process
CN109671106B (zh) 2017-10-13 2023-09-05 华为技术有限公司 一种图像处理方法、装置与设备
CN111123667B (zh) * 2018-10-31 2021-09-24 上海微电子装备（集团）股份有限公司 光刻装置、光刻装置的垂向控制方法及曝光方法
DE102018132001A1 (de) 2018-12-12 2020-06-18 Laser Imaging Systems Gmbh Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz
CN112099315B (zh) * 2019-06-17 2021-10-22 上海微电子装备（集团）股份有限公司 一种光刻设备及其控制方法、装置和存储介质
CN112099317B (zh) * 2019-06-18 2022-03-11 上海微电子装备（集团）股份有限公司 一种光刻设备及其控制方法、装置和存储介质
NO20190876A1 (en) * 2019-07-11 2021-01-12 Visitech As Real time Registration Lithography system
WO2021047903A1 (en) * 2019-09-09 2021-03-18 Asml Holding N.V. Invariable magnification multilevel optical device with telecentric converter
CN113125109B (zh) * 2019-12-30 2023-11-24 魔门塔(苏州)科技有限公司 一种图像曝光时间量测系统及标板设备
US11687010B2 (en) 2020-02-21 2023-06-27 Onto Innovation Inc. System and method for correcting overlay errors in a lithographic process
CN115605576B (zh) 2020-06-10 2025-06-06 深圳华大生命科学研究院 生物样本图像采集装置及基因测序仪
DE102020124006B3 (de) 2020-09-15 2022-01-05 Laser Imaging Systems Gmbh Belichtungssteuerung bei photolithographischen direktbelichtungsverfahren zur leiterplatten- oder schaltkreisherstellung
JP7598939B2 (ja) * 2020-09-30 2024-12-12 株式会社日立ハイテク 荷電粒子ビーム装置
DE102020127981B3 (de) 2020-10-23 2021-12-16 Laser Imaging Systems Gmbh Wendevorrichtung zum Handhaben empfindlicher Substrate bei der Belichtung von zweidimensionalen Strukturen auf beiden Substratoberflächen
WO2022215692A1 (ja) * 2021-04-09 2022-10-13 株式会社ニコン 露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法および露光方法
EP4080265B1 (de) * 2021-04-20 2025-02-12 Leica Instruments (Singapore) Pte Ltd Mikroskopisches system und entsprechendes verfahren
US12243761B2 (en) * 2022-10-27 2025-03-04 Applied Materials, Inc. Detection and analysis of substrate support and pre-heat ring in a process chamber via imaging
CN115863197A (zh) * 2022-11-30 2023-03-28 浙江大学 键合晶圆气泡检测装置及分选系统
CN118444536B (zh) * 2024-07-04 2024-10-11 广州市艾佛光通科技有限公司 一种曝光设备及其控制方法
CN119626962B (zh) * 2025-02-13 2025-05-30 新毅东(北京)科技有限公司 一种半导体加工设备及工作方法

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB412634A (en) * 1933-01-05 1934-07-05 Ici Ltd Improvements in and relating to the manufacture of adhesive materials from rubber latex
JPS53105376A (en) 1977-02-25 1978-09-13 Hitachi Ltd Positioning unit
JPS629715Y2 (de) 1979-05-18 1987-03-06
JPS57183031A (en) 1981-05-06 1982-11-11 Toshiba Corp Method for wafer exposure and device thereof
JPS5874039A (ja) * 1981-10-28 1983-05-04 Canon Inc アライメントマ−クの検出方法
JPS58107633A (ja) * 1981-12-21 1983-06-27 Canon Inc 特殊チツプを逃げたシヨツト配列方法
US4450358A (en) * 1982-09-22 1984-05-22 Honeywell Inc. Optical lithographic system
JPS6047418A (ja) 1983-08-25 1985-03-14 Hitachi Ltd 半導体露光装置
GB2155201B (en) 1984-02-24 1988-07-13 Canon Kk An x-ray exposure apparatus
JPS6144429A (ja) 1984-08-09 1986-03-04 Nippon Kogaku Kk <Nikon> 位置合わせ方法、及び位置合せ装置
US4780617A (en) 1984-08-09 1988-10-25 Nippon Kogaku K.K. Method for successive alignment of chip patterns on a substrate
JPS61196532A (ja) 1985-02-26 1986-08-30 Canon Inc 露光装置
US4861162A (en) 1985-05-16 1989-08-29 Canon Kabushiki Kaisha Alignment of an object
JPS6387725A (ja) 1986-10-01 1988-04-19 Sumitomo Heavy Ind Ltd ステ−ジ移動機構
JPS63261850A (ja) 1987-04-20 1988-10-28 Fujitsu Ltd 縦型ｘ−ｙステ−ジ
US5140366A (en) * 1987-05-29 1992-08-18 Canon Kabushiki Kaisha Exposure apparatus with a function for controlling alignment by use of latent images
JPS6414918A (en) * 1987-07-08 1989-01-19 Nikon Corp Stepper
JP2580651B2 (ja) 1987-12-18 1997-02-12 株式会社ニコン 投影露光装置及び露光方法
US5117254A (en) 1988-05-13 1992-05-26 Canon Kabushiki Kaisha Projection exposure apparatus
JPH0652707B2 (ja) 1988-10-11 1994-07-06 キヤノン株式会社 面位置検出方法
JP2940553B2 (ja) 1988-12-21 1999-08-25 株式会社ニコン 露光方法
JP2830003B2 (ja) 1989-01-30 1998-12-02 株式会社ニコン 投影露光装置及び投影露光方法
US5151750A (en) 1989-04-14 1992-09-29 Nikon Corporation Alignment apparatus
US5249016A (en) 1989-12-15 1993-09-28 Canon Kabushiki Kaisha Semiconductor device manufacturing system
JP2897355B2 (ja) 1990-07-05 1999-05-31 株式会社ニコン アライメント方法，露光装置，並びに位置検出方法及び装置
US5117255A (en) 1990-09-19 1992-05-26 Nikon Corporation Projection exposure apparatus
NL9100215A (nl) 1991-02-07 1992-09-01 Asm Lithography Bv Inrichting voor het repeterend afbeelden van een maskerpatroon op een substraat.
US5506684A (en) * 1991-04-04 1996-04-09 Nikon Corporation Projection scanning exposure apparatus with synchronous mask/wafer alignment system
JP2505952B2 (ja) 1992-04-17 1996-06-12 キヤノン株式会社 半導体製造装置
US6023068A (en) 1991-05-30 2000-02-08 Canon Kabushiki Kaisha Semiconductor device manufacturing apparatus
JPH0567271A (ja) 1991-07-04 1993-03-19 Matsushita Electric Ind Co Ltd メデイアレンタルシヨツプ
JP3203719B2 (ja) * 1991-12-26 2001-08-27 株式会社ニコン 露光装置、その露光装置により製造されるデバイス、露光方法、およびその露光方法を用いたデバイス製造方法
US5502311A (en) 1992-01-17 1996-03-26 Nikon Corporation Method of and apparatus for detecting plane position
US5504407A (en) 1992-02-21 1996-04-02 Canon Kabushiki Kaisha Stage driving system
CN1080402A (zh) * 1992-06-18 1994-01-05 天津大学 干涉法自动调焦系统
JP3255299B2 (ja) 1992-06-19 2002-02-12 株式会社ニコン 位置検出方法及び装置、並びに露光方法及び装置
JP3275368B2 (ja) 1992-07-09 2002-04-15 株式会社ニコン 露光方法及び装置
US5477304A (en) 1992-10-22 1995-12-19 Nikon Corporation Projection exposure apparatus
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JP3316833B2 (ja) 1993-03-26 2002-08-19 株式会社ニコン 走査露光方法、面位置設定装置、走査型露光装置、及び前記方法を使用するデバイス製造方法
KR100300618B1 (ko) * 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
US5978071A (en) 1993-01-07 1999-11-02 Nikon Corporation Projection exposure apparatus and method in which mask stage is moved to provide alignment with a moving wafer stage
US6278957B1 (en) 1993-01-21 2001-08-21 Nikon Corporation Alignment method and apparatus therefor
US5591958A (en) 1993-06-14 1997-01-07 Nikon Corporation Scanning exposure method and apparatus
JP3412704B2 (ja) * 1993-02-26 2003-06-03 株式会社ニコン 投影露光方法及び装置、並びに露光装置
US5464715A (en) * 1993-04-02 1995-11-07 Nikon Corporation Method of driving mask stage and method of mask alignment
JP3301153B2 (ja) * 1993-04-06 2002-07-15 株式会社ニコン 投影露光装置、露光方法、及び素子製造方法
US5815248A (en) 1993-04-22 1998-09-29 Nikon Corporation Illumination optical apparatus and method having a wavefront splitter and an optical integrator
US5534970A (en) 1993-06-11 1996-07-09 Nikon Corporation Scanning exposure apparatus
JP2862477B2 (ja) * 1993-06-29 1999-03-03 キヤノン株式会社 露光装置及び該露光装置を用いてデバイスを製造する方法
US5699145A (en) 1993-07-14 1997-12-16 Nikon Corporation Scanning type exposure apparatus
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate
US6118515A (en) 1993-12-08 2000-09-12 Nikon Corporation Scanning exposure method
JP3387074B2 (ja) 1993-12-08 2003-03-17 株式会社ニコン 走査露光方法、及び走査型露光装置
JP3371406B2 (ja) 1994-08-26 2003-01-27 株式会社ニコン 走査露光方法
JPH07302748A (ja) * 1994-05-02 1995-11-14 Canon Inc 半導体露光装置
JPH07335524A (ja) 1994-06-06 1995-12-22 Canon Inc 位置合わせ方法
US5715064A (en) * 1994-06-17 1998-02-03 International Business Machines Corporation Step and repeat apparatus having enhanced accuracy and increased throughput
JPH08167559A (ja) 1994-12-15 1996-06-25 Nikon Corp アライメント方法及び装置
JP3039305B2 (ja) 1995-01-11 2000-05-08 キヤノン株式会社 位置合わせ装置及びそれを用いた半導体デバイスの製造方法
US5677758A (en) 1995-02-09 1997-10-14 Mrs Technology, Inc. Lithography System using dual substrate stages
US5599365A (en) 1995-03-03 1997-02-04 Ingersoll-Rand Company Mechanical fluid separator
JP4132095B2 (ja) 1995-03-14 2008-08-13 株式会社ニコン 走査型露光装置
JPH08264427A (ja) 1995-03-23 1996-10-11 Nikon Corp アライメント方法及びその装置
JPH08316134A (ja) 1995-05-24 1996-11-29 Nikon Corp 露光方法
KR100500199B1 (ko) 1995-05-29 2005-11-01 가부시키가이샤 니콘 마스크패턴을겹쳐서노광하는노광방법
KR970002483A (ko) 1995-06-01 1997-01-24 오노 시게오 노광 장치
JP3320262B2 (ja) * 1995-07-07 2002-09-03 キヤノン株式会社 走査露光装置及び方法並びにそれを用いたデバイス製造方法
US5751404A (en) 1995-07-24 1998-05-12 Canon Kabushiki Kaisha Exposure apparatus and method wherein alignment is carried out by comparing marks which are incident on both reticle stage and wafer stage reference plates
JP3237522B2 (ja) 1996-02-05 2001-12-10 ウシオ電機株式会社 ウエハ周辺露光方法および装置
JPH09320921A (ja) 1996-05-24 1997-12-12 Nikon Corp ベースライン量の測定方法及び投影露光装置
US5877845A (en) 1996-05-28 1999-03-02 Nippon Kogaku Kk Scanning exposure apparatus and method
AU4048197A (en) 1996-08-02 1998-02-25 Mrs Technology, Inc. Lithography system with remote multisensor alignment
EP0843221B1 (de) 1996-11-14 2004-05-06 Nikon Corporation Projektionsbelichtungsapparat
US6262796B1 (en) * 1997-03-10 2001-07-17 Asm Lithography B.V. Positioning device having two object holders

Also Published As

Publication number Publication date
IL130137A (en) 2003-07-06
CN1329286A (zh) 2002-01-02
US6590634B1 (en) 2003-07-08
KR20060086496A (ko) 2006-08-01
KR100315250B1 (ko) 2001-11-26
KR100315249B1 (ko) 2001-11-26
US6549269B1 (en) 2003-04-15
CN1242104A (zh) 2000-01-19
EP1944654A3 (de) 2010-06-02
EP1944654A2 (de) 2008-07-16
KR20000057310A (ko) 2000-09-15
KR100314557B1 (ko) 2001-11-17
CN1244020C (zh) 2006-03-01
SG93267A1 (en) 2002-12-17
CN1144263C (zh) 2004-03-31
DE69738910D1 (de) 2008-09-25
KR20060086495A (ko) 2006-08-01
KR20030096435A (ko) 2003-12-31
CN1244018C (zh) 2006-03-01
WO1998024115A1 (fr) 1998-06-04
EP0951054A1 (de) 1999-10-20
CN1244019C (zh) 2006-03-01
US20070109515A1 (en) 2007-05-17
US6400441B1 (en) 2002-06-04
EP0951054A4 (de) 2000-05-24
US7177008B2 (en) 2007-02-13
US6341007B1 (en) 2002-01-22
EP0951054B1 (de) 2008-08-13
CN1244021C (zh) 2006-03-01
KR100315251B1 (ko) 2001-11-26
US20040233407A1 (en) 2004-11-25
US20040032575A1 (en) 2004-02-19
IL130137A0 (en) 2000-06-01
SG102627A1 (en) 2004-03-26
CN1322972A (zh) 2001-11-21
SG88824A1 (en) 2002-05-21
CN1329287A (zh) 2002-01-02
US6798491B2 (en) 2004-09-28
AU5067898A (en) 1998-06-22
HK1024104A1 (en) 2000-09-29
CN1322971A (zh) 2001-11-21
SG88823A1 (en) 2002-05-21
US7256869B2 (en) 2007-08-14

Similar Documents

Publication Publication Date Title
DE69738910D1 (de) Ausrichtvorrichtung und belichtungsverfahren
EP1014199A3 (de) Trägerplattesteuerungsvorrichtung und Belichtungsapparat
EP1069477A3 (de) Belichtungsapparat und Verfahren zur Herstellung einer Vorrichtung unter Verwendung desselben
EP1672680A4 (de) Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren
KR970067585A (ko) 결상특성의 측정방법 및 투영노광방법
DE69625779D1 (de) Entwicklungsvorrichtung für ein Bilderzeugungsgerät
TW374936B (en) Exposure apparatus
DE69007113D1 (de) Prüfvorrichtung für thermalabbildungseinrichtungen.
DE69416771D1 (de) Inspektionsapparat für Halbleiterscheiben
DE69715514D1 (de) Entwicklerträgerelement, Entwicklungsgerät, Entwicklungsverfahren, Bilderzeugungsgerät und Arbeitseinheit
SG132679A1 (en) Exposure apparatus, exposure method, and device fabricating method
DE69103923D1 (de) Entwicklungsgerät für ein Bilderzeugungsgerät.
DE69300284D1 (de) Vorrichtung für reproduzierbare Ausrichtung von Halbleiter-Scheibe.
DE69403577D1 (de) Verfahren und Vorrichtung um sehr flache Wafer zu ätzen.
JPH10242041A (ja) 位置検出方法及びその装置並びに露光装置
DE69323753D1 (de) Diagnoseeinrichtung
DE69213357D1 (de) Modulationsverfahren für verformbare Spiegelvorrichtung (DMD)
NL1018377A1 (nl) Toestel voor meten van een brandpunt van een belichtingssysteem gebruikt voor vervaardiging van een halfgeleiderinrichting.
JPH0321842U (de)
KR950015660U (ko) 웨이퍼 테스트용 프로브 카드의 탐침 고정장치
KR970011210U (ko) 반도체소자 제조용 웨이퍼의 이.비.알(e.b.r)사이즈 측정장치
KR970064189U (ko) 웨이퍼 프로브 스테이션의 프로빙 포인트 정렬 장치
KR960027792U (ko) 반도체 장치의 센터링 측정기구
KR960025392U (ko) 웨이퍼 테스트용 프로브 카드
TW344877B (en) Method for simultaneously measuring the accuracy and critical dimension of overlay of wafer metrology pattern

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties