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SG10201803122UA - Immersion lithography apparatus and device manufacturing method - Google Patents

Immersion lithography apparatus and device manufacturing method

Info

Publication number
SG10201803122UA
SG10201803122UA SG10201803122UA SG10201803122UA SG10201803122UA SG 10201803122U A SG10201803122U A SG 10201803122UA SG 10201803122U A SG10201803122U A SG 10201803122UA SG 10201803122U A SG10201803122U A SG 10201803122UA SG 10201803122U A SG10201803122U A SG 10201803122UA
Authority
SG
Singapore
Prior art keywords
liquid
workpiece
optical element
reticle
immersion lithography
Prior art date
Application number
SG10201803122UA
Inventor
Andrew Hazelton
Hidemi Kawai
Douglas Watson
W Novak
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of SG10201803122UA publication Critical patent/SG10201803122UA/en

Links

Classifications

    • H10P76/2041—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning

Landscapes

  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

An immersion lithography apparatus (100) has a reticle stage (RST) arranged to retain a reticle (R), a working stage (9-11) arranged to retain a workpiece (W), and an optical system including an illumination source and an optical element (4) opposite the workpiece (W) for having an image pattern of the reticle (R) projected by radiation from the illumination source. A gap is defined between the optical element (4) and the workpiece (W), and a fluid-supplying device (S) serves to supply an immersion liquid into this gap such that the supplied immersion liquid contacts both the optical element (4) and the workpiece (W) during an immersion lithography process. A cleaning device (30) is incorporated for removing absorbed liquid from the optical element (4) during a cleanup process. The cleaning device (30) may make use of a cleaning liquid having affinity to the absorbed liquid, heat, a vacuum condition, ultrasonic vibrations or cavitating bubbles for the removal of the absorbed liquid. The cleaning liquid may be supplied through the same fluid-supplying device provided with a switching device such as a valve.
SG10201803122UA 2003-04-11 2004-04-02 Immersion lithography apparatus and device manufacturing method SG10201803122UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46255603P 2003-04-11 2003-04-11
US48291303P 2003-06-27 2003-06-27

Publications (1)

Publication Number Publication Date
SG10201803122UA true SG10201803122UA (en) 2018-06-28

Family

ID=33303091

Family Applications (5)

Application Number Title Priority Date Filing Date
SG10201803122UA SG10201803122UA (en) 2003-04-11 2004-04-02 Immersion lithography apparatus and device manufacturing method
SG2014015135A SG2014015135A (en) 2003-04-11 2004-04-02 Cleanup method for optics in immersion lithography
SG2009027137A SG185136A1 (en) 2003-04-11 2004-04-02 Cleanup method for optics in immersion lithography
SG2013077797A SG2013077797A (en) 2003-04-11 2004-04-02 Cleanup method for optics in immersion lithography
SG2009027129A SG189557A1 (en) 2003-04-11 2004-04-02 Cleanup method for optics in immersion lithography

Family Applications After (4)

Application Number Title Priority Date Filing Date
SG2014015135A SG2014015135A (en) 2003-04-11 2004-04-02 Cleanup method for optics in immersion lithography
SG2009027137A SG185136A1 (en) 2003-04-11 2004-04-02 Cleanup method for optics in immersion lithography
SG2013077797A SG2013077797A (en) 2003-04-11 2004-04-02 Cleanup method for optics in immersion lithography
SG2009027129A SG189557A1 (en) 2003-04-11 2004-04-02 Cleanup method for optics in immersion lithography

Country Status (9)

Country Link
US (10) US7522259B2 (en)
EP (6) EP2172809B1 (en)
JP (10) JP4837556B2 (en)
KR (11) KR101597475B1 (en)
CN (4) CN106444292A (en)
AT (1) ATE449982T1 (en)
DE (1) DE602004024295D1 (en)
SG (5) SG10201803122UA (en)
WO (1) WO2004093130A2 (en)

Families Citing this family (227)

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