[go: up one dir, main page]

AU2747999A - Projection exposure method and system - Google Patents

Projection exposure method and system

Info

Publication number
AU2747999A
AU2747999A AU27479/99A AU2747999A AU2747999A AU 2747999 A AU2747999 A AU 2747999A AU 27479/99 A AU27479/99 A AU 27479/99A AU 2747999 A AU2747999 A AU 2747999A AU 2747999 A AU2747999 A AU 2747999A
Authority
AU
Australia
Prior art keywords
exposure method
projection exposure
projection
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU27479/99A
Inventor
Yoshio Fukami
Nobutaka Magome
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU2747999A publication Critical patent/AU2747999A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AU27479/99A 1998-03-26 1999-03-16 Projection exposure method and system Abandoned AU2747999A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7926398 1998-03-26
JP10-79263 1998-03-26
PCT/JP1999/001262 WO1999049504A1 (en) 1998-03-26 1999-03-16 Projection exposure method and system

Publications (1)

Publication Number Publication Date
AU2747999A true AU2747999A (en) 1999-10-18

Family

ID=13684983

Family Applications (1)

Application Number Title Priority Date Filing Date
AU27479/99A Abandoned AU2747999A (en) 1998-03-26 1999-03-16 Projection exposure method and system

Country Status (2)

Country Link
AU (1) AU2747999A (en)
WO (1) WO1999049504A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7580111B2 (en) 2004-05-21 2009-08-25 Jsr Corporation Liquid for immersion exposure and immersion exposure method
KR101332543B1 (en) * 2003-10-22 2013-11-25 가부시키가이샤 니콘 Exposure apparatus, exposure method, and method for manufacturing device

Families Citing this family (919)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7234477B2 (en) 2000-06-30 2007-06-26 Lam Research Corporation Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
KR100866818B1 (en) 2000-12-11 2008-11-04 가부시키가이샤 니콘 Projection optical system and exposure apparatus comprising the same
JP2003086486A (en) * 2001-09-11 2003-03-20 Canon Inc Exposure equipment
DE10210899A1 (en) * 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refractive projection lens for immersion lithography
TWI238465B (en) 2002-07-24 2005-08-21 Toshiba Corp Method of forming pattern and substrate processing apparatus
EP1532489A2 (en) * 2002-08-23 2005-05-25 Nikon Corporation Projection optical system and method for photolithography and exposure apparatus and method using same
US7252097B2 (en) 2002-09-30 2007-08-07 Lam Research Corporation System and method for integrating in-situ metrology within a wafer process
US7293571B2 (en) 2002-09-30 2007-11-13 Lam Research Corporation Substrate proximity processing housing and insert for generating a fluid meniscus
US8236382B2 (en) 2002-09-30 2012-08-07 Lam Research Corporation Proximity substrate preparation sequence, and method, apparatus, and system for implementing the same
US7153400B2 (en) 2002-09-30 2006-12-26 Lam Research Corporation Apparatus and method for depositing and planarizing thin films of semiconductor wafers
US7045018B2 (en) 2002-09-30 2006-05-16 Lam Research Corporation Substrate brush scrubbing and proximity cleaning-drying sequence using compatible chemistries, and method, apparatus, and system for implementing the same
US6988327B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
US7513262B2 (en) 2002-09-30 2009-04-07 Lam Research Corporation Substrate meniscus interface and methods for operation
US7389783B2 (en) 2002-09-30 2008-06-24 Lam Research Corporation Proximity meniscus manifold
US7198055B2 (en) 2002-09-30 2007-04-03 Lam Research Corporation Meniscus, vacuum, IPA vapor, drying manifold
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US7632376B1 (en) 2002-09-30 2009-12-15 Lam Research Corporation Method and apparatus for atomic layer deposition (ALD) in a proximity system
US7614411B2 (en) 2002-09-30 2009-11-10 Lam Research Corporation Controls of ambient environment during wafer drying using proximity head
EP1420299B1 (en) * 2002-11-12 2011-01-05 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
CN101424881B (en) * 2002-11-12 2011-11-30 Asml荷兰有限公司 Lithography projection apparatus
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100470367C (en) 2002-11-12 2009-03-18 Asml荷兰有限公司 Photolithography apparatus and device manufacturing method
TWI251127B (en) 2002-11-12 2006-03-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1429188B1 (en) 2002-11-12 2013-06-19 ASML Netherlands B.V. Lithographic projection apparatus
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE60335595D1 (en) 2002-11-12 2011-02-17 Asml Netherlands Bv Immersion lithographic apparatus and method of making a device
US7372541B2 (en) 2002-11-12 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP2495613B1 (en) 2002-11-12 2013-07-31 ASML Netherlands B.V. Lithographic apparatus
SG131766A1 (en) 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE60319658T2 (en) 2002-11-29 2009-04-02 Asml Netherlands B.V. Lithographic apparatus and method of making a device
JP4423559B2 (en) 2002-12-03 2010-03-03 株式会社ニコン Pollutant removal method
TW200412617A (en) 2002-12-03 2004-07-16 Nikon Corp Optical illumination device, method for adjusting optical illumination device, exposure device and exposure method
WO2004053957A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Surface position detection apparatus, exposure method, and device porducing method
DE10257766A1 (en) 2002-12-10 2004-07-15 Carl Zeiss Smt Ag Method for setting a desired optical property of a projection lens and microlithographic projection exposure system
JP4608876B2 (en) * 2002-12-10 2011-01-12 株式会社ニコン Exposure apparatus and device manufacturing method
CN101231477B (en) * 2002-12-10 2010-11-17 株式会社尼康 Exposure apparatus and device manufacturing method
JP4352874B2 (en) 2002-12-10 2009-10-28 株式会社ニコン Exposure apparatus and device manufacturing method
WO2004053959A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Optical device and projection exposure apparatus using such optical device
WO2004053951A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure method, exposure apparatus and method for manufacturing device
JP4595320B2 (en) * 2002-12-10 2010-12-08 株式会社ニコン Exposure apparatus and device manufacturing method
JP4701606B2 (en) * 2002-12-10 2011-06-15 株式会社ニコン Exposure method, exposure apparatus, and device manufacturing method
CN101101455A (en) * 2002-12-10 2008-01-09 株式会社尼康 Method for producing device
KR101037057B1 (en) * 2002-12-10 2011-05-26 가부시키가이샤 니콘 Exposure apparatus and device manufacturing method
EP1429190B1 (en) 2002-12-10 2012-05-09 Canon Kabushiki Kaisha Exposure apparatus and method
CN100444315C (en) * 2002-12-10 2008-12-17 株式会社尼康 Exposure apparatus and device manufacturing method
US7948604B2 (en) 2002-12-10 2011-05-24 Nikon Corporation Exposure apparatus and method for producing device
EP1571701A4 (en) * 2002-12-10 2008-04-09 Nikon Corp Exposure apparatus and method for manufacturing device
US7242455B2 (en) 2002-12-10 2007-07-10 Nikon Corporation Exposure apparatus and method for producing device
AU2003289271A1 (en) * 2002-12-10 2004-06-30 Nikon Corporation Exposure apparatus, exposure method and method for manufacturing device
SG158745A1 (en) * 2002-12-10 2010-02-26 Nikon Corp Exposure apparatus and method for producing device
CN101872135B (en) 2002-12-10 2013-07-31 株式会社尼康 Exposure system and device producing method
KR101157002B1 (en) * 2002-12-10 2012-06-21 가부시키가이샤 니콘 Exposure apparatus and method for manufacturing device
JP4525062B2 (en) * 2002-12-10 2010-08-18 株式会社ニコン Exposure apparatus, device manufacturing method, and exposure system
JP4529433B2 (en) * 2002-12-10 2010-08-25 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
JP4184346B2 (en) 2002-12-13 2008-11-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Liquid removal in a method and apparatus for irradiating a spot on a layer
EP1732075A3 (en) 2002-12-19 2007-02-21 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
AU2003295177A1 (en) * 2002-12-19 2004-07-14 Koninklijke Philips Electronics N.V. Method and device for irradiating spots on a layer
DE10261775A1 (en) 2002-12-20 2004-07-01 Carl Zeiss Smt Ag Device for the optical measurement of an imaging system
JP4434762B2 (en) 2003-01-31 2010-03-17 東京応化工業株式会社 Resist composition
TWI338323B (en) 2003-02-17 2011-03-01 Nikon Corp Stage device, exposure device and manufacguring method of devices
TW200424767A (en) 2003-02-20 2004-11-16 Tokyo Ohka Kogyo Co Ltd Immersion exposure process-use resist protection film forming material, composite film, and resist pattern forming method
JPWO2004077158A1 (en) * 2003-02-25 2006-06-08 東京応化工業株式会社 Photoresist composition and method for forming resist pattern
CN101354539B (en) * 2003-02-26 2011-01-26 株式会社尼康 Exposure apparatus and method for producing device
JP4604452B2 (en) * 2003-02-26 2011-01-05 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
DE112004000333T5 (en) * 2003-02-26 2006-02-02 Tokyo Ohka Kogyo Co., Ltd., Kawasaki Silesquioxane resin, positive resist composition, resist laminate and method of forming a resist pattern
TWI621923B (en) 2003-02-26 2018-04-21 尼康股份有限公司 Exposure apparatus, exposure method, and component manufacturing method
CN100440431C (en) * 2003-03-04 2008-12-03 东京応化工业株式会社 Immersion liquid for liquid immersion exposure process and resist pattern forming method using the same
JP2004325466A (en) * 2003-03-04 2004-11-18 Tokyo Ohka Kogyo Co Ltd Resist material for immersion exposure process and resist pattern forming method using resist material
JP2005101498A (en) * 2003-03-04 2005-04-14 Tokyo Ohka Kogyo Co Ltd Immersion liquid for liquid immersion lithography process, and resist-pattern forming method using immersion liquid
JP4480717B2 (en) 2003-03-24 2010-06-16 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Method for recording a lead-out on an optical disc
EP1610361B1 (en) 2003-03-25 2014-05-21 Nikon Corporation Exposure system and device production method
JP2005099646A (en) 2003-03-28 2005-04-14 Tokyo Ohka Kogyo Co Ltd Resist composition for liquid immersion lithography process, and resist pattern forming method using it
WO2004090956A1 (en) * 2003-04-07 2004-10-21 Nikon Corporation Exposure apparatus and method for manufacturing device
KR101503992B1 (en) 2003-04-09 2015-03-18 가부시키가이샤 니콘 Exposure method and apparatus, and device manufacturing method
KR20110104084A (en) * 2003-04-09 2011-09-21 가부시키가이샤 니콘 Immersion Lithography Fluid Control System
EP1611486B1 (en) 2003-04-10 2016-03-16 Nikon Corporation Environmental system including a transport region for an immersion lithography apparatus
EP2950148B1 (en) 2003-04-10 2016-09-21 Nikon Corporation Environmental system including vaccum scavenge for an immersion lithography apparatus
EP3352010A1 (en) * 2003-04-10 2018-07-25 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
WO2004090633A2 (en) * 2003-04-10 2004-10-21 Nikon Corporation An electro-osmotic element for an immersion lithography apparatus
CN101980087B (en) * 2003-04-11 2013-03-27 株式会社尼康 Immersion exposure appratus and method
SG10201803122UA (en) 2003-04-11 2018-06-28 Nikon Corp Immersion lithography apparatus and device manufacturing method
JP4582089B2 (en) * 2003-04-11 2010-11-17 株式会社ニコン Liquid jet recovery system for immersion lithography
JP2006523958A (en) 2003-04-17 2006-10-19 株式会社ニコン Optical structure of an autofocus element for use in immersion lithography
TWI237307B (en) * 2003-05-01 2005-08-01 Nikon Corp Optical projection system, light exposing apparatus and light exposing method
KR101516142B1 (en) 2003-05-06 2015-05-04 가부시키가이샤 니콘 Projection optical system, and exposure apparatus and exposure method
US7348575B2 (en) 2003-05-06 2008-03-25 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
TWI295414B (en) * 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1477856A1 (en) * 2003-05-13 2004-11-17 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100437358C (en) 2003-05-15 2008-11-26 株式会社尼康 Exposure apparatus and device manufacturing method
TWI612557B (en) * 2003-05-23 2018-01-21 Nikon Corporation Exposure method and exposure apparatus and component manufacturing method
JP4720106B2 (en) * 2003-05-23 2011-07-13 株式会社ニコン Exposure method and device manufacturing method
JP4770129B2 (en) * 2003-05-23 2011-09-14 株式会社ニコン Exposure apparatus and device manufacturing method
TWI612556B (en) * 2003-05-23 2018-01-21 尼康股份有限公司 Exposure apparatus, exposure method, and component manufacturing method
JP2005277363A (en) * 2003-05-23 2005-10-06 Nikon Corp Exposure apparatus and device manufacturing method
JP5058550B2 (en) * 2003-05-23 2012-10-24 株式会社ニコン Exposure apparatus, exposure method, device manufacturing method, and liquid recovery method
JP5143331B2 (en) * 2003-05-28 2013-02-13 株式会社ニコン Exposure method, exposure apparatus, and device manufacturing method
KR101548832B1 (en) * 2003-05-28 2015-09-01 가부시키가이샤 니콘 Exposure method, exposure device, and device manufacturing method
TWI442694B (en) 2003-05-30 2014-06-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1486828B1 (en) 2003-06-09 2013-10-09 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1486827B1 (en) 2003-06-11 2011-11-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1489461A1 (en) * 2003-06-11 2004-12-22 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7317504B2 (en) 2004-04-08 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP3104396B1 (en) 2003-06-13 2018-03-21 Nikon Corporation Exposure method, substrate stage, exposure apparatus, and device manufacturing method
TWI564933B (en) * 2003-06-19 2017-01-01 尼康股份有限公司 An exposure apparatus, an exposure method, and an element manufacturing method
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US7675000B2 (en) 2003-06-24 2010-03-09 Lam Research Corporation System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology
JP2005019616A (en) 2003-06-25 2005-01-20 Canon Inc Immersion exposure equipment
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
JP3862678B2 (en) 2003-06-27 2006-12-27 キヤノン株式会社 Exposure apparatus and device manufacturing method
DE60308161T2 (en) * 2003-06-27 2007-08-09 Asml Netherlands B.V. Lithographic apparatus and method for making an article
EP1494079B1 (en) * 2003-06-27 2008-01-02 ASML Netherlands B.V. Lithographic Apparatus
EP1498778A1 (en) * 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1494074A1 (en) 2003-06-30 2005-01-05 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
DE60321779D1 (en) 2003-06-30 2008-08-07 Asml Netherlands Bv Lithographic apparatus and method for making an article
US7236232B2 (en) 2003-07-01 2007-06-26 Nikon Corporation Using isotopically specified fluids as optical elements
EP1652003B1 (en) * 2003-07-08 2015-01-07 Nikon Corporation Wafer table for immersion lithography
WO2005006418A1 (en) 2003-07-09 2005-01-20 Nikon Corporation Exposure apparatus and method for manufacturing device
JP4844123B2 (en) * 2003-07-09 2011-12-28 株式会社ニコン Exposure apparatus and device manufacturing method
CN102854755A (en) * 2003-07-09 2013-01-02 株式会社尼康 Exposure apparatus
CN101470361A (en) * 2003-07-09 2009-07-01 株式会社尼康 Exposure apparatus and device manufacturing method
JP4515385B2 (en) 2003-07-09 2010-07-28 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
JP4729876B2 (en) * 2003-07-09 2011-07-20 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US7738074B2 (en) * 2003-07-16 2010-06-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1498781B1 (en) * 2003-07-16 2019-04-17 ASML Netherlands B.V. Immersion lithographic apparatus and device manufacturing method
DE10333326B4 (en) 2003-07-23 2007-03-15 Evotec Technologies Gmbh Apparatus and method for testing chemical and / or biological samples and lens attachment
EP1500982A1 (en) 2003-07-24 2005-01-26 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006528835A (en) * 2003-07-24 2006-12-21 カール・ツアイス・エスエムテイ・アーゲー Microlithography projection exposure apparatus and method for introducing immersion liquid into immersion space
EP1650787A4 (en) 2003-07-25 2007-09-19 Nikon Corp Inspection method and inspection device for projection optical system, and production method for projection optical system
EP1503244A1 (en) 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
JP4492239B2 (en) * 2003-07-28 2010-06-30 株式会社ニコン Exposure apparatus, device manufacturing method, and exposure apparatus control method
JP4492600B2 (en) * 2003-07-28 2010-06-30 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
CN104122760B (en) * 2003-07-28 2017-04-19 株式会社尼康 Exposure apparatus and device manufacturing method
US7326522B2 (en) 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
US7175968B2 (en) 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
CN101436002B (en) * 2003-07-28 2011-07-27 株式会社尼康 Exposure apparatus, device manufacturing method, and control method for exposure apparatus
JP4376718B2 (en) * 2003-07-28 2009-12-02 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus, device manufacturing method, and substrate
US7779781B2 (en) 2003-07-31 2010-08-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100468624C (en) 2003-08-07 2009-03-11 株式会社尼康 Exposure method, exposure apparatus, stage apparatus, and device manufacturing method
US6844206B1 (en) 2003-08-21 2005-01-18 Advanced Micro Devices, Llp Refractive index system monitor and control for immersion lithography
KR101915921B1 (en) * 2003-08-21 2019-01-07 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device producing method
JP4265766B2 (en) * 2003-08-25 2009-05-20 東京応化工業株式会社 Resist protective film forming material for immersion exposure process, resist protective film comprising the protective film forming material, and resist pattern forming method using the resist protective film
KR101171809B1 (en) * 2003-08-26 2012-08-13 가부시키가이샤 니콘 Optical element and exposure device
US8149381B2 (en) 2003-08-26 2012-04-03 Nikon Corporation Optical element and exposure apparatus
TWI263859B (en) 2003-08-29 2006-10-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
KR101419192B1 (en) 2003-08-29 2014-07-15 가부시키가이샤 니콘 Exposure apparatus and device producing method
TWI245163B (en) 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1659620A4 (en) * 2003-08-29 2008-01-30 Nikon Corp LIQUID RECOVERY DEVICE, EXPOSURE DEVICE, EXPOSURE METHOD, AND CORRESPONDING PRODUCTION DEVICE
US7070915B2 (en) * 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
US6954256B2 (en) 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
EP2261740B1 (en) * 2003-08-29 2014-07-09 ASML Netherlands BV Lithographic apparatus
KR101162527B1 (en) 2003-09-03 2012-07-09 가부시키가이샤 니콘 Exposure apparatus and device producing method
KR101238114B1 (en) * 2003-09-03 2013-02-27 가부시키가이샤 니콘 Apparatus and method for providing fluid for immersion lithography
US7166418B2 (en) 2003-09-03 2007-01-23 Matsushita Electric Industrial Co., Ltd. Sulfonamide compound, polymer compound, resist material and pattern formation method
JP4378136B2 (en) 2003-09-04 2009-12-02 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP2005083800A (en) 2003-09-05 2005-03-31 Hitachi Ltd Defect inspection method and defect inspection apparatus
JP3870182B2 (en) 2003-09-09 2007-01-17 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP4444920B2 (en) 2003-09-19 2010-03-31 株式会社ニコン Exposure apparatus and device manufacturing method
WO2005031465A2 (en) * 2003-09-25 2005-04-07 Infineon Technologies Ag Immersion lithography method and device for illuminating a substrate
KR101248325B1 (en) * 2003-09-26 2013-03-27 가부시키가이샤 니콘 Projection exposure apparatus, cleaning and maintenance methods of projection exposure apparatus, and method of producing device
WO2005031824A1 (en) * 2003-09-29 2005-04-07 Nikon Corporation Projection exposure device, projection exposure method, and device manufacturing method
TW200513809A (en) * 2003-09-29 2005-04-16 Nippon Kogaku Kk Liquid-soaked lens system and projecting exposure apparatus as well as component manufacturing method
JP5136566B2 (en) * 2003-09-29 2013-02-06 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
KR101441840B1 (en) 2003-09-29 2014-11-04 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device manufacturing method
US7158211B2 (en) 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100490064C (en) * 2003-09-29 2009-05-20 株式会社尼康 Exposure apparatus, exposure method, and device manufacturing method
EP1519230A1 (en) 2003-09-29 2005-03-30 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1519231B1 (en) * 2003-09-29 2005-12-21 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7169530B2 (en) 2003-10-02 2007-01-30 Matsushita Electric Industrial Co., Ltd. Polymer compound, resist material and pattern formation method
US7369217B2 (en) * 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
WO2005036621A1 (en) * 2003-10-08 2005-04-21 Zao Nikon Co., Ltd. Substrate carrying apparatus, substrate carrying method, exposure apparatus, exposure method, and method for producing device
JP2005136364A (en) 2003-10-08 2005-05-26 Zao Nikon Co Ltd Substrate transport apparatus, exposure apparatus, and device manufacturing method
EP1672682A4 (en) 2003-10-08 2008-10-15 Zao Nikon Co Ltd APPARATUS AND METHOD FOR TRANSPORTING SUBSTRATE, APPARATUS AND METHOD FOR EXPOSING, AND DEVICE PRODUCING METHOD
TW200514138A (en) 2003-10-09 2005-04-16 Nippon Kogaku Kk Exposure equipment and exposure method, manufacture method of component
EP1524557A1 (en) * 2003-10-15 2005-04-20 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1524558A1 (en) 2003-10-15 2005-04-20 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1528432B1 (en) * 2003-10-28 2010-03-10 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2267537B1 (en) 2003-10-28 2017-09-13 ASML Netherlands BV Lithographic apparatus
US7352433B2 (en) 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411653B2 (en) 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
JP4605014B2 (en) 2003-10-28 2011-01-05 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
TWI511179B (en) 2003-10-28 2015-12-01 尼康股份有限公司 Optical illumination device, exposure device, exposure method and device manufacturing method
JP2005159322A (en) * 2003-10-31 2005-06-16 Nikon Corp Surface plate, stage apparatus, exposure apparatus and exposure method
CN100461336C (en) * 2003-10-31 2009-02-11 株式会社尼康 Exposure apparatus and device manufacturing method
US7113259B2 (en) 2003-10-31 2006-09-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI361450B (en) * 2003-10-31 2012-04-01 Nikon Corp Platen, stage device, exposure device and exposure method
JP2005150290A (en) * 2003-11-13 2005-06-09 Canon Inc Exposure apparatus and device manufacturing method
WO2005048326A1 (en) 2003-11-13 2005-05-26 Nikon Corporation Variable slit apparatus, illumination apparatus, exposure apparatus, exposure method, and device producing method
EP1531362A3 (en) 2003-11-13 2007-07-25 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus and pattern formation method
US7528929B2 (en) * 2003-11-14 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI512335B (en) 2003-11-20 2015-12-11 尼康股份有限公司 Beam conversion element, optical illumination device, exposure device, and exposure method
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN1890779B (en) * 2003-12-03 2011-06-08 株式会社尼康 Exposure apparatus, exposure method and device manufacturing method
US7125652B2 (en) * 2003-12-03 2006-10-24 Advanced Micro Devices, Inc. Immersion lithographic process using a conforming immersion medium
JP4513534B2 (en) * 2003-12-03 2010-07-28 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
TWI440981B (en) 2003-12-03 2014-06-11 尼康股份有限公司 Exposure apparatus, exposure method, and device manufacturing method
JP2007516613A (en) * 2003-12-15 2007-06-21 カール・ツアイス・エスエムテイ・アーゲー Objective lens as a microlithographic projection objective comprising at least one liquid lens
KR101499405B1 (en) * 2003-12-15 2015-03-05 가부시키가이샤 니콘 Stage system, exposure apparatus and exposure method
JPWO2005057635A1 (en) * 2003-12-15 2007-07-05 株式会社ニコン Projection exposure apparatus, stage apparatus, and exposure method
JP4615210B2 (en) * 2003-12-16 2011-01-19 財団法人国際科学振興財団 Immersion exposure equipment
WO2005059977A1 (en) * 2003-12-16 2005-06-30 Nikon Corporation Stage apparatus, exposure apparatus, and exposure method
JP4308638B2 (en) 2003-12-17 2009-08-05 パナソニック株式会社 Pattern formation method
JP4323946B2 (en) * 2003-12-19 2009-09-02 キヤノン株式会社 Exposure equipment
US7460206B2 (en) 2003-12-19 2008-12-02 Carl Zeiss Smt Ag Projection objective for immersion lithography
US7394521B2 (en) * 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7589818B2 (en) 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US7324274B2 (en) 2003-12-24 2008-01-29 Nikon Corporation Microscope and immersion objective lens
JP4691927B2 (en) * 2004-08-13 2011-06-01 株式会社ニコン Microscope observation device
JP2005208626A (en) * 2003-12-24 2005-08-04 Nikon Corp Microscope device and immersion objective lens
JP4954444B2 (en) * 2003-12-26 2012-06-13 株式会社ニコン Channel forming member, exposure apparatus, and device manufacturing method
JP2005191394A (en) 2003-12-26 2005-07-14 Canon Inc Exposure method and apparatus
JP2005191393A (en) 2003-12-26 2005-07-14 Canon Inc Exposure method and apparatus
KR20180117228A (en) 2004-01-05 2018-10-26 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device producing method
JP4371822B2 (en) 2004-01-06 2009-11-25 キヤノン株式会社 Exposure equipment
JP4429023B2 (en) 2004-01-07 2010-03-10 キヤノン株式会社 Exposure apparatus and device manufacturing method
KR20060128912A (en) * 2004-01-15 2006-12-14 가부시키가이샤 니콘 Exposure apparatus and device manufacturing method
US20070019179A1 (en) 2004-01-16 2007-01-25 Damian Fiolka Polarization-modulating optical element
KR101233879B1 (en) 2004-01-16 2013-02-15 칼 짜이스 에스엠티 게엠베하 Polarization-modulating optical element
JP4572539B2 (en) * 2004-01-19 2010-11-04 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
KR101135232B1 (en) 2004-01-20 2012-04-12 칼 짜이스 에스엠테 게엠베하 Microlithographic projection exposure apparatus
TWI259319B (en) * 2004-01-23 2006-08-01 Air Prod & Chem Immersion lithography fluids
US20050161644A1 (en) 2004-01-23 2005-07-28 Peng Zhang Immersion lithography fluids
WO2005071717A1 (en) 2004-01-26 2005-08-04 Nikon Corporation Exposure apparatus and device producing method
TWI260467B (en) * 2004-01-30 2006-08-21 Tokyo Ohka Kogyo Co Ltd Positive resist composition and method of forming resist pattern
US7589822B2 (en) * 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
KR20070039869A (en) * 2004-02-03 2007-04-13 브루스 더블유. 스미스 Photolithography Method Using Solution and Related Systems
US7990516B2 (en) * 2004-02-03 2011-08-02 Nikon Corporation Immersion exposure apparatus and device manufacturing method with liquid detection apparatus
WO2005076324A1 (en) * 2004-02-04 2005-08-18 Nikon Corporation Exposure apparatus, exposure method, and device producing method
JP5167572B2 (en) * 2004-02-04 2013-03-21 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
TWI379344B (en) 2004-02-06 2012-12-11 Nikon Corp Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method
US7050146B2 (en) 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4529141B2 (en) * 2004-02-09 2010-08-25 好彦 岡本 Exposure apparatus and method of manufacturing semiconductor device using the same
JP4018647B2 (en) * 2004-02-09 2007-12-05 キヤノン株式会社 Projection exposure apparatus and device manufacturing method
JP4548341B2 (en) * 2004-02-10 2010-09-22 株式会社ニコン Exposure apparatus, device manufacturing method, maintenance method, and exposure method
CN100592210C (en) * 2004-02-13 2010-02-24 卡尔蔡司Smt股份公司 Projection objective lens of microlithographic projection exposure device
TWI395069B (en) * 2004-02-18 2013-05-01 尼康股份有限公司 Projection optical system, exposure device and exposure method
JP4370992B2 (en) * 2004-02-18 2009-11-25 株式会社ニコン Optical element and exposure apparatus
WO2005081290A1 (en) * 2004-02-19 2005-09-01 Nikon Corporation Exposure apparatus and method of producing the device
JP4513590B2 (en) * 2004-02-19 2010-07-28 株式会社ニコン Optical component and exposure apparatus
WO2005081291A1 (en) * 2004-02-19 2005-09-01 Nikon Corporation Exposure apparatus and method of producing device
JP4466647B2 (en) * 2004-02-20 2010-05-26 株式会社ニコン Exposure apparatus, liquid processing method, exposure method, and device manufacturing method
JP5076497B2 (en) * 2004-02-20 2012-11-21 株式会社ニコン Exposure apparatus, liquid supply method and recovery method, exposure method, and device manufacturing method
JP4502715B2 (en) * 2004-03-05 2010-07-14 東京応化工業株式会社 Positive resist composition for immersion exposure and method for forming resist pattern
JP2005259870A (en) * 2004-03-10 2005-09-22 Nikon Corp Substrate holding apparatus, stage apparatus, exposure apparatus, and exposure method
DE102004013886A1 (en) 2004-03-16 2005-10-06 Carl Zeiss Smt Ag Multiple Exposure Method, Microlithography Projection Exposure System and Projection System
JP4220423B2 (en) 2004-03-24 2009-02-04 株式会社東芝 Resist pattern forming method
TWI518744B (en) * 2004-03-25 2016-01-21 尼康股份有限公司 Exposure apparatus, exposure method, and component manufacturing method
JP4510494B2 (en) 2004-03-29 2010-07-21 キヤノン株式会社 Exposure equipment
JP2005286068A (en) 2004-03-29 2005-10-13 Canon Inc Exposure apparatus and method
US8062471B2 (en) 2004-03-31 2011-11-22 Lam Research Corporation Proximity head heating method and apparatus
US7227619B2 (en) * 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7295283B2 (en) * 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005302880A (en) * 2004-04-08 2005-10-27 Canon Inc Immersion exposure equipment
US7852034B2 (en) 2004-04-09 2010-12-14 Nikon Corporation Drive method of moving body, stage unit, and exposure apparatus
US7898642B2 (en) * 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2490248A3 (en) * 2004-04-19 2018-01-03 Nikon Corporation Exposure apparatus and device manufacturing method
JP4521219B2 (en) 2004-04-19 2010-08-11 株式会社東芝 Drawing pattern generation method, resist pattern formation method, and exposure apparatus control method
WO2005106930A1 (en) * 2004-04-27 2005-11-10 Nikon Corporation Exposure method, exposure system, and method for fabricating device
US7379159B2 (en) 2004-05-03 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005111722A2 (en) * 2004-05-04 2005-11-24 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
JP3981368B2 (en) * 2004-05-17 2007-09-26 松下電器産業株式会社 Pattern formation method
US7616383B2 (en) 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005117075A1 (en) * 2004-05-26 2005-12-08 Nikon Corporation Correcting method, predicting method, exposuring method, reflectance correcting method, reflectance measuring method, exposure apparatus, and device manufacturing method
JP4192118B2 (en) 2004-05-31 2008-12-03 株式会社日立ハイテクノロジーズ Defect inspection apparatus and defect inspection system
KR101257960B1 (en) * 2004-06-04 2013-04-24 칼 짜이스 에스엠테 게엠베하 System for measuring the image quality of an optical imaging system
KR101264936B1 (en) * 2004-06-04 2013-05-15 가부시키가이샤 니콘 Exposure apparatus exposure method and device producing method
JP4517341B2 (en) * 2004-06-04 2010-08-04 株式会社ニコン Exposure apparatus, nozzle member, and device manufacturing method
US20080192226A1 (en) * 2004-06-07 2008-08-14 Nikon Corporation Stage Unit, Exposure Apparatus, and Exposure Method
KR101323967B1 (en) 2004-06-09 2013-10-31 가부시키가이샤 니콘 Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate
JP2005353763A (en) 2004-06-09 2005-12-22 Matsushita Electric Ind Co Ltd Exposure apparatus and pattern forming method
JP2005353762A (en) 2004-06-09 2005-12-22 Matsushita Electric Ind Co Ltd Semiconductor manufacturing apparatus and pattern forming method
KR20170016532A (en) * 2004-06-09 2017-02-13 가부시키가이샤 니콘 Exposure system and device production method
JP4826146B2 (en) * 2004-06-09 2011-11-30 株式会社ニコン Exposure apparatus and device manufacturing method
KR101178755B1 (en) * 2004-06-10 2012-08-31 가부시키가이샤 니콘 엔지니어링 Exposure equipment, exposure method and device manufacturing method
JP5130609B2 (en) * 2004-06-10 2013-01-30 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
EP3067749B1 (en) 2004-06-10 2017-10-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
TW200600829A (en) * 2004-06-16 2006-01-01 Nikon Corp Optical system, exposure device, and exposure method
US7481867B2 (en) 2004-06-16 2009-01-27 Edwards Limited Vacuum system for immersion photolithography
KR101378688B1 (en) 2004-06-21 2014-03-27 가부시키가이샤 니콘 Exposure equipment and device manufacturing method
JP4677833B2 (en) * 2004-06-21 2011-04-27 株式会社ニコン EXPOSURE APPARATUS, METHOD FOR CLEANING ITS MEMBER, EXPOSURE APPARATUS MAINTENANCE METHOD, MAINTENANCE EQUIPMENT AND DEVICE MANUFACTURING METHOD
KR101342303B1 (en) * 2004-06-21 2013-12-16 가부시키가이샤 니콘 Exposure device, exposure device member cleaning method, exposure device maintenance method, maintenance device and device manufacturing method
US8698998B2 (en) 2004-06-21 2014-04-15 Nikon Corporation Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device
US7738193B2 (en) 2004-06-29 2010-06-15 Carl Zeiss Smt Ag Positioning unit and alignment device for an optical element
WO2006001416A1 (en) 2004-06-29 2006-01-05 Nikon Corporation Management method, management system, and program
EP1761822A4 (en) * 2004-07-01 2009-09-09 Nikon Corp A dynamic fluid control system for immersion lithography
US7463330B2 (en) 2004-07-07 2008-12-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006024692A (en) 2004-07-07 2006-01-26 Toshiba Corp Resist pattern forming method
DE102004033195A1 (en) * 2004-07-09 2006-02-23 Leica Microsystems Semiconductor Gmbh Device for inspecting a microscopic component
ATE441937T1 (en) 2004-07-12 2009-09-15 Nikon Corp EXPOSURE DEVICE AND COMPONENT PRODUCTION METHOD
US8654308B2 (en) 2004-07-12 2014-02-18 Nikon Corporation Method for determining exposure condition, exposure method, exposure apparatus, and method for manufacturing device
JP4655792B2 (en) * 2004-07-12 2011-03-23 株式会社ニコン Exposure condition determination method, exposure method, exposure apparatus, and device manufacturing method
JP2006030532A (en) * 2004-07-15 2006-02-02 Tokyo Ohka Kogyo Co Ltd Resist composition and method for forming resist pattern
US20070268470A1 (en) 2004-07-16 2007-11-22 Nikon Corporation Support Method and Support Structure of Optical Member, Optical Unit, Exposure Apparatus, and Device Manufacturing Method
WO2006009169A1 (en) 2004-07-21 2006-01-26 Nikon Corporation Exposure method and method for producing device
US7161663B2 (en) 2004-07-22 2007-01-09 Asml Netherlands B.V. Lithographic apparatus
TWI396225B (en) 2004-07-23 2013-05-11 尼康股份有限公司 Image surface measuring method, exposuring method, device manufacturing method, and exposuring device
JP4368267B2 (en) * 2004-07-30 2009-11-18 東京応化工業株式会社 Resist protective film forming material and resist pattern forming method using the same
KR101337007B1 (en) 2004-08-03 2013-12-06 가부시키가이샤 니콘 Exposure equipment, exposure method and device manufacturing method
JP2006113533A (en) 2004-08-03 2006-04-27 Nikon Corp Projection optical system, exposure apparatus, and exposure method
JP4534651B2 (en) * 2004-08-03 2010-09-01 株式会社ニコン Exposure apparatus, device manufacturing method, and liquid recovery method
JP3870207B2 (en) 2004-08-05 2007-01-17 キヤノン株式会社 Immersion exposure apparatus and device manufacturing method
JP2006049757A (en) * 2004-08-09 2006-02-16 Tokyo Electron Ltd Substrate processing method
US7304715B2 (en) 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4599936B2 (en) 2004-08-17 2010-12-15 株式会社ニコン Illumination optical apparatus, adjustment method of illumination optical apparatus, exposure apparatus, and exposure method
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101187611B1 (en) * 2004-09-01 2012-10-08 가부시키가이샤 니콘 Substrate holder, stage apparatus, and exposure apparatus
JP3977364B2 (en) 2004-09-03 2007-09-19 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP4772306B2 (en) 2004-09-06 2011-09-14 株式会社東芝 Immersion optical device and cleaning method
JP2006073967A (en) * 2004-09-06 2006-03-16 Tokyo Ohka Kogyo Co Ltd Immersion liquid for liquid immersion lithography method, and resist pattern forming method using the immersion liquid
KR101106496B1 (en) 2004-09-17 2012-01-20 가부시키가이샤 니콘 Substrate holding apparatus, exposure apparatus and device manufacturing method
SG188914A1 (en) 2004-09-17 2013-04-30 Nikon Corp Exposure apparatus, exposure method, and method for manufacturing device
CN100539019C (en) * 2004-09-17 2009-09-09 株式会社尼康 Exposure apparatus, exposure method, and device manufacturing method
US7133114B2 (en) 2004-09-20 2006-11-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7522261B2 (en) 2004-09-24 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7355674B2 (en) 2004-09-28 2008-04-08 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and computer program product
CN101052916B (en) 2004-09-30 2010-05-12 株式会社尼康 Projection optics and exposure devices
US7385670B2 (en) * 2004-10-05 2008-06-10 Asml Netherlands B.V. Lithographic apparatus, cleaning system and cleaning method for in situ removing contamination from a component in a lithographic apparatus
US7894040B2 (en) 2004-10-05 2011-02-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7209213B2 (en) 2004-10-07 2007-04-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20090213357A1 (en) * 2004-10-08 2009-08-27 Dai Arai Exposure apparatus and device manufacturing method
CN100477083C (en) 2004-10-13 2009-04-08 株式会社尼康 Exposure apparatus, exposure method, and device manufacturing method
JP4625673B2 (en) * 2004-10-15 2011-02-02 株式会社東芝 Exposure method and exposure apparatus
EP1806772B1 (en) 2004-10-15 2014-08-06 Nikon Corporation Exposure apparatus and device manufacturing method
DE102004050642B4 (en) * 2004-10-18 2007-04-12 Infineon Technologies Ag Method for monitoring parameters of an immersion lithography exposure apparatus and immersion lithography exposure apparatus
US7379155B2 (en) 2004-10-18 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006114839A (en) * 2004-10-18 2006-04-27 Nikon Corp Projection optical system, exposure apparatus, and exposure method
US7119876B2 (en) 2004-10-18 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4535260B2 (en) 2004-10-19 2010-09-01 株式会社ニコン Illumination optical apparatus, exposure apparatus, and exposure method
JP2006120674A (en) 2004-10-19 2006-05-11 Canon Inc Exposure apparatus and method, device manufacturing method
KR101285951B1 (en) 2004-10-26 2013-07-12 가부시키가이샤 니콘 Substrate processing method, exposure apparatus and method for manufacturing device
CN100533662C (en) 2004-11-01 2009-08-26 株式会社尼康 Exposure apparatus and device manufacturing method
JP4463081B2 (en) 2004-11-10 2010-05-12 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP5008280B2 (en) 2004-11-10 2012-08-22 株式会社Ｓｏｋｕｄｏ Substrate processing apparatus and substrate processing method
JP2006310724A (en) 2004-11-10 2006-11-09 Dainippon Screen Mfg Co Ltd Substrate processing apparatus and substrate processing method
JP5154008B2 (en) 2004-11-10 2013-02-27 株式会社Ｓｏｋｕｄｏ Substrate processing apparatus and substrate processing method
TW200616043A (en) 2004-11-10 2006-05-16 Nikon Corp Optical projection system, exposure apparatus, exposure method and method of fabricating devices
JP4381285B2 (en) 2004-11-11 2009-12-09 株式会社Ｓｏｋｕｄｏ Substrate processing apparatus and substrate processing method
TW200636816A (en) * 2004-11-11 2006-10-16 Nikon Corp Exposure method, device manufacturing method and substrate
US7251013B2 (en) 2004-11-12 2007-07-31 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7414699B2 (en) 2004-11-12 2008-08-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7583357B2 (en) 2004-11-12 2009-09-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7423720B2 (en) 2004-11-12 2008-09-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7411657B2 (en) 2004-11-17 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7362412B2 (en) * 2004-11-18 2008-04-22 International Business Machines Corporation Method and apparatus for cleaning a semiconductor substrate in an immersion lithography system
TW201837984A (en) 2004-11-18 2018-10-16 日商尼康股份有限公司 Exposure method and exposure apparatus, and semiconductor device manufacturing methods
KR101191056B1 (en) 2004-11-19 2012-10-15 가부시키가이샤 니콘 Maintenance method, exposure method, exposure apparatus, and device producing method
US7145630B2 (en) 2004-11-23 2006-12-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7623218B2 (en) 2004-11-24 2009-11-24 Carl Zeiss Smt Ag Method of manufacturing a miniaturized device
US7161654B2 (en) * 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20080106718A1 (en) 2004-12-02 2008-05-08 Nikon Corporation Exposure Apparatus and Device Manufacturing Method
US7446850B2 (en) 2004-12-03 2008-11-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5154006B2 (en) 2004-12-06 2013-02-27 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
KR20070100865A (en) 2004-12-06 2007-10-12 가부시키가이샤 니콘 Substrate processing method, exposure method, exposure apparatus and device manufacturing method
EP1821337B1 (en) 2004-12-06 2016-05-11 Nikon Corporation Maintenance method
JP5154007B2 (en) 2004-12-06 2013-02-27 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
US7248334B2 (en) 2004-12-07 2007-07-24 Asml Netherlands B.V. Sensor shield
US7397533B2 (en) 2004-12-07 2008-07-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7196770B2 (en) 2004-12-07 2007-03-27 Asml Netherlands B.V. Prewetting of substrate before immersion exposure
US7365827B2 (en) 2004-12-08 2008-04-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4752473B2 (en) 2004-12-09 2011-08-17 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
US7352440B2 (en) 2004-12-10 2008-04-01 Asml Netherlands B.V. Substrate placement in immersion lithography
US7403261B2 (en) 2004-12-15 2008-07-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP3428724A1 (en) 2004-12-15 2019-01-16 Nikon Corporation Exposure apparatus and device fabricating method
US7880860B2 (en) 2004-12-20 2011-02-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7528931B2 (en) 2004-12-20 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4928075B2 (en) * 2004-12-24 2012-05-09 日本曹達株式会社 Organic thin film surface property conversion method
US7405805B2 (en) 2004-12-28 2008-07-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7491661B2 (en) 2004-12-28 2009-02-17 Asml Netherlands B.V. Device manufacturing method, top coat material and substrate
US7265813B2 (en) 2004-12-28 2007-09-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060147821A1 (en) 2004-12-30 2006-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7557529B2 (en) 2005-01-11 2009-07-07 Nikon Corporation Stage unit and exposure apparatus
US7450217B2 (en) 2005-01-12 2008-11-11 Asml Netherlands B.V. Exposure apparatus, coatings for exposure apparatus, lithographic apparatus, device manufacturing method, and device manufactured thereby
EP1681597B1 (en) 2005-01-14 2010-03-10 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4591093B2 (en) * 2005-01-18 2010-12-01 Ｊｓｒ株式会社 Scanning exposure method
JP2006201605A (en) * 2005-01-21 2006-08-03 Nikon Corp Microscope observation device
KR20070095399A (en) * 2005-01-25 2007-09-28 제이에스알 가부시끼가이샤 Immersion type exposure system, recycling method and supply method of liquid for immersion type exposure
US7710653B2 (en) 2005-01-28 2010-05-04 Nikon Corporation Projection optical system, exposure system, and exposure method
WO2006080516A1 (en) 2005-01-31 2006-08-03 Nikon Corporation Exposure apparatus and method for manufacturing device
US8692973B2 (en) 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
JP2006222284A (en) 2005-02-10 2006-08-24 Toshiba Corp Pattern forming method and semiconductor device manufacturing method
CN101128775B (en) 2005-02-10 2012-07-25 Asml荷兰有限公司 Immersion liquid, exposure device and exposure method
US8018573B2 (en) 2005-02-22 2011-09-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7378025B2 (en) 2005-02-22 2008-05-27 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US7224431B2 (en) 2005-02-22 2007-05-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7428038B2 (en) 2005-02-28 2008-09-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
US7282701B2 (en) 2005-02-28 2007-10-16 Asml Netherlands B.V. Sensor for use in a lithographic apparatus
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7684010B2 (en) 2005-03-09 2010-03-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, seal structure, method of removing an object and a method of sealing
JP4844186B2 (en) 2005-03-18 2011-12-28 株式会社ニコン Plate member, substrate holding apparatus, exposure apparatus and exposure method, and device manufacturing method
JP2006261606A (en) 2005-03-18 2006-09-28 Canon Inc Exposure apparatus, exposure method, and device manufacturing method
JP4072543B2 (en) 2005-03-18 2008-04-09 キヤノン株式会社 Immersion exposure apparatus and device manufacturing method
US8638422B2 (en) 2005-03-18 2014-01-28 Nikon Corporation Exposure method, exposure apparatus, method for producing device, and method for evaluating exposure apparatus
KR101240845B1 (en) 2005-03-25 2013-03-07 가부시키가이샤 니콘 Shot shape measuring method, mask
JP2006269940A (en) 2005-03-25 2006-10-05 Canon Inc Exposure apparatus and exposure method
US7330238B2 (en) 2005-03-28 2008-02-12 Asml Netherlands, B.V. Lithographic apparatus, immersion projection apparatus and device manufacturing method
US9239524B2 (en) 2005-03-30 2016-01-19 Nikon Corporation Exposure condition determination method, exposure method, exposure apparatus, and device manufacturing method involving detection of the situation of a liquid immersion region
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
USRE43576E1 (en) 2005-04-08 2012-08-14 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US7291850B2 (en) 2005-04-08 2007-11-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7283249B2 (en) 2005-04-08 2007-10-16 Asml Netherlands B.V. Lithographic apparatus and a method of calibrating such an apparatus
WO2006112436A1 (en) 2005-04-18 2006-10-26 Nikon Corporation Exposure device, exposure method, and device manufacturing method
US20060232753A1 (en) * 2005-04-19 2006-10-19 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
JP4661322B2 (en) * 2005-04-22 2011-03-30 株式会社ニコン Exposure apparatus, device manufacturing method, and liquid supply method
EP1876635A4 (en) 2005-04-25 2010-06-30 Nikon Corp EXPOSURE METHOD, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD
KR101479392B1 (en) 2005-04-28 2015-01-05 가부시키가이샤 니콘 Exposure method, exposure apparatus and device manufacturing method
US8400613B2 (en) 2005-05-02 2013-03-19 Nikon Corporation Optical element driving apparatus, projection optical system, exposure apparatus and device manufacturing method
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7317507B2 (en) 2005-05-03 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100539020C (en) 2005-05-12 2009-09-09 株式会社尼康 Projection optical system, exposure device and exposure method
KR101452145B1 (en) * 2005-05-12 2014-10-16 가부시키가이샤 니콘 Projection optical system, exposure apparatus and exposure method
US7838858B2 (en) 2005-05-31 2010-11-23 Nikon Corporation Evaluation system and method of a search operation that detects a detection subject on an object
WO2006130338A1 (en) * 2005-06-01 2006-12-07 Nikon Corporation Immersion fluid containment system and method for immersion lithography
WO2006133800A1 (en) 2005-06-14 2006-12-21 Carl Zeiss Smt Ag Lithography projection objective, and a method for correcting image defects of the same
US8717534B2 (en) 2005-06-20 2014-05-06 Carl Zeiss Smt Gmbh Lens comprising a plurality of optical element disposed in a housing
US7751027B2 (en) 2005-06-21 2010-07-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7652746B2 (en) 2005-06-21 2010-01-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006137410A1 (en) 2005-06-21 2006-12-28 Nikon Corporation Exposure apparatus, exposure method, maintenance method and device manufacturing method
US7924416B2 (en) 2005-06-22 2011-04-12 Nikon Corporation Measurement apparatus, exposure apparatus, and device manufacturing method
JP2007005525A (en) * 2005-06-23 2007-01-11 Nikon Corp Exposure apparatus and device manufacturing method
JP4522329B2 (en) 2005-06-24 2010-08-11 株式会社Sokudo Substrate processing equipment
US7834974B2 (en) 2005-06-28 2010-11-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7468779B2 (en) 2005-06-28 2008-12-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7474379B2 (en) 2005-06-28 2009-01-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7170583B2 (en) 2005-06-29 2007-01-30 Asml Netherlands B.V. Lithographic apparatus immersion damage control
US7522258B2 (en) 2005-06-29 2009-04-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing movement of clean air to reduce contamination
JP5194792B2 (en) 2005-06-30 2013-05-08 株式会社ニコン Exposure apparatus and method, exposure apparatus maintenance method, and device manufacturing method
US7766565B2 (en) 2005-07-01 2010-08-03 Sokudo Co., Ltd. Substrate drying apparatus, substrate cleaning apparatus and substrate processing system
DE602005019711D1 (en) * 2005-07-15 2010-04-15 Imec Method and system for an improved lithographic process
JP2007027631A (en) * 2005-07-21 2007-02-01 Nikon Corp Exposure method, exposure apparatus, and device manufacturing method
US7535644B2 (en) 2005-08-12 2009-05-19 Asml Netherlands B.V. Lens element, lithographic apparatus, device manufacturing method, and device manufactured thereby
US8054445B2 (en) 2005-08-16 2011-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4802604B2 (en) * 2005-08-17 2011-10-26 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
TWI430039B (en) 2005-08-23 2014-03-11 尼康股份有限公司 An exposure apparatus and an exposure method, and an element manufacturing method
US8070145B2 (en) 2005-08-26 2011-12-06 Nikon Corporation Holding unit, assembly system, sputtering unit, and processing method and processing unit
WO2007026390A1 (en) * 2005-08-30 2007-03-08 Tadahiro Ohmi Scanning exposure apparatus
US7812926B2 (en) 2005-08-31 2010-10-12 Nikon Corporation Optical element, exposure apparatus based on the use of the same, exposure method, and method for producing microdevice
TWI450044B (en) 2005-08-31 2014-08-21 尼康股份有限公司 An optical element, an exposure apparatus using the same, an exposure method, and a manufacturing method of the micro-element
TWI345685B (en) 2005-09-06 2011-07-21 Asml Netherlands Bv Lithographic method
US7426011B2 (en) 2005-09-12 2008-09-16 Asml Netherlands B.V. Method of calibrating a lithographic apparatus and device manufacturing method
US8111374B2 (en) 2005-09-09 2012-02-07 Nikon Corporation Analysis method, exposure method, and device manufacturing method
KR101388345B1 (en) 2005-09-09 2014-04-22 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device production method
WO2007034838A1 (en) 2005-09-21 2007-03-29 Nikon Corporation Exposure device, exposure method, and device fabrication method
JP4761907B2 (en) 2005-09-28 2011-08-31 株式会社Sokudo Substrate processing equipment
US7417710B2 (en) 2005-09-26 2008-08-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007096050A (en) 2005-09-29 2007-04-12 Canon Inc Exposure equipment
KR101371874B1 (en) 2005-10-05 2014-03-07 가부시키가이샤 니콘 Exposure apparatus and exposure method
US7433050B2 (en) 2005-10-05 2008-10-07 Nikon Corporation Exposure apparatus and exposure method
US7411658B2 (en) 2005-10-06 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007109741A (en) 2005-10-11 2007-04-26 Canon Inc Exposure apparatus and exposure method
JP4125315B2 (en) 2005-10-11 2008-07-30 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP2007142366A (en) 2005-10-18 2007-06-07 Canon Inc Exposure apparatus and device manufacturing method
US8681314B2 (en) 2005-10-24 2014-03-25 Nikon Corporation Stage device and coordinate correction method for the same, exposure apparatus, and device manufacturing method
US8090875B2 (en) 2005-10-28 2012-01-03 Nikon Corporation Device and method for connecting device manufacturing processing apparatuses, program, device manufacturing processing system, exposure apparatus and method, and measurement and inspection apparatus and method
EP1950795A4 (en) 2005-11-01 2010-06-02 Nikon Corp Exposure apparatus, exposure method and device manufacturing method
EP1783553A1 (en) * 2005-11-07 2007-05-09 Interuniversitair Microelektronica Centrum Method of studying interaction between immersion fluid and substrate
WO2007055199A1 (en) 2005-11-09 2007-05-18 Nikon Corporation Exposure apparatus and method, and method for manufacturing device
WO2007055373A1 (en) 2005-11-14 2007-05-18 Nikon Corporation Liquid recovery member, exposure apparatus, exposure method, and device production method
KR20080068006A (en) 2005-11-15 2008-07-22 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device manufacturing method
US7804577B2 (en) 2005-11-16 2010-09-28 Asml Netherlands B.V. Lithographic apparatus
US7864292B2 (en) 2005-11-16 2011-01-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7656501B2 (en) 2005-11-16 2010-02-02 Asml Netherlands B.V. Lithographic apparatus
US7803516B2 (en) 2005-11-21 2010-09-28 Nikon Corporation Exposure method, device manufacturing method using the same, exposure apparatus, and substrate processing method and apparatus
US7633073B2 (en) 2005-11-23 2009-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
JP2007157827A (en) * 2005-12-01 2007-06-21 Tokyo Ohka Kogyo Co Ltd Method for removing liquid and method for evaluating resist pattern using the same
US8125610B2 (en) 2005-12-02 2012-02-28 ASML Metherlands B.V. Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus
US7782442B2 (en) 2005-12-06 2010-08-24 Nikon Corporation Exposure apparatus, exposure method, projection optical system and device producing method
KR20080071552A (en) 2005-12-06 2008-08-04 가부시키가이샤 니콘 Exposure method, exposure apparatus and device manufacturing method
WO2007066679A1 (en) 2005-12-06 2007-06-14 Nikon Corporation Exposure apparatus, exposure method, projection optical system and device manufacturing method
TWI406321B (en) 2005-12-08 2013-08-21 尼康股份有限公司 A substrate holding device, an exposure apparatus, an exposure method, and an element manufacturing method
US7746447B2 (en) 2005-12-22 2010-06-29 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and method of calibrating a lithographic apparatus
US7420194B2 (en) 2005-12-27 2008-09-02 Asml Netherlands B.V. Lithographic apparatus and substrate edge seal
WO2007077925A1 (en) 2005-12-28 2007-07-12 Nikon Corporation Pattern formation method, pattern formation device, and device fabrication method
US8411271B2 (en) 2005-12-28 2013-04-02 Nikon Corporation Pattern forming method, pattern forming apparatus, and device manufacturing method
US7839483B2 (en) 2005-12-28 2010-11-23 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a control system
KR20080088579A (en) 2005-12-28 2008-10-02 가부시키가이샤 니콘 Exposure apparatus, exposure method, device manufacturing method
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4667252B2 (en) * 2006-01-16 2011-04-06 株式会社Sokudo Substrate processing equipment
TWI605491B (en) 2006-01-19 2017-11-11 尼康股份有限公司 Exposure apparatus and exposure method, and component manufacturing method
JP2007201078A (en) 2006-01-25 2007-08-09 Sokudo:Kk Substrate processing equipment
JP4771816B2 (en) 2006-01-27 2011-09-14 大日本スクリーン製造株式会社 Substrate processing equipment
JP5132108B2 (en) 2006-02-02 2013-01-30 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
WO2007088872A1 (en) * 2006-02-03 2007-08-09 Nikon Corporation Substrate processing method, substrate processing system, program, and recording medium
TW200801833A (en) 2006-02-16 2008-01-01 Nikon Corp Exposure apparatus, exposure method and device manufacturing method
KR20080102192A (en) 2006-02-16 2008-11-24 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device manufacturing method
EP1986222A4 (en) 2006-02-16 2010-09-01 Nikon Corp Exposure apparatus, exposing method, and device manufacturing method
US8134681B2 (en) 2006-02-17 2012-03-13 Nikon Corporation Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
KR101346581B1 (en) 2006-02-21 2014-01-02 가부시키가이샤 니콘 Pattern forming apparatus, pattern forming method, mobile object driving system, mobile body driving method, exposure apparatus, exposure method and device manufacturing method
KR101495471B1 (en) 2006-02-21 2015-02-23 가부시키가이샤 니콘 Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method and device manufacturing method
SG178816A1 (en) 2006-02-21 2012-03-29 Nikon Corp Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure appararus and method, and device manufacturing method
WO2007100081A1 (en) 2006-03-03 2007-09-07 Nikon Corporation Exposure method and apparatus, and device manufacturing method
EP1993121A4 (en) 2006-03-03 2011-12-07 Nikon Corp Exposure apparatus and device manufacturing method
JP5077770B2 (en) 2006-03-07 2012-11-21 株式会社ニコン Device manufacturing method, device manufacturing system, and measurement / inspection apparatus
US8045134B2 (en) 2006-03-13 2011-10-25 Asml Netherlands B.V. Lithographic apparatus, control system and device manufacturing method
WO2007105645A1 (en) 2006-03-13 2007-09-20 Nikon Corporation Exposure apparatus, maintenance method, exposure method and device manufacturing method
US7310132B2 (en) 2006-03-17 2007-12-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8982322B2 (en) 2006-03-17 2015-03-17 Nikon Corporation Exposure apparatus and device manufacturing method
US20070242254A1 (en) 2006-03-17 2007-10-18 Nikon Corporation Exposure apparatus and device manufacturing method
US7307687B2 (en) 2006-03-20 2007-12-11 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and substrate
US7760324B2 (en) 2006-03-20 2010-07-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20080013062A1 (en) 2006-03-23 2008-01-17 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8027019B2 (en) 2006-03-28 2011-09-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20080106505A (en) 2006-04-03 2008-12-08 가부시키가이샤 니콘 Projection optics, exposure apparatus, and device manufacturing method
EP1843206B1 (en) 2006-04-06 2012-09-05 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7903232B2 (en) 2006-04-12 2011-03-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7884921B2 (en) 2006-04-12 2011-02-08 Nikon Corporation Illumination optical apparatus, projection exposure apparatus, projection optical system, and device manufacturing method
US7701551B2 (en) 2006-04-14 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9477158B2 (en) 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101486589B1 (en) 2006-04-17 2015-01-26 가부시키가이샤 니콘 Illuminating optical apparatus, exposure apparatus and device manufacturing method
KR20080108459A (en) 2006-04-20 2008-12-15 아사히 가라스 가부시키가이샤 Resist protective film material for immersion lithography
US8125613B2 (en) 2006-04-21 2012-02-28 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
TW200746259A (en) 2006-04-27 2007-12-16 Nikon Corp Measuring and/or inspecting method, measuring and/or inspecting apparatus, exposure method, device manufacturing method, and device manufacturing apparatus
DE102006021797A1 (en) 2006-05-09 2007-11-15 Carl Zeiss Smt Ag Optical imaging device with thermal damping
CN101438385B (en) 2006-05-10 2011-02-16 尼康股份有限公司 Exposure apparatus and device manufacturing method
US7728462B2 (en) 2006-05-18 2010-06-01 Nikon Corporation Monolithic stage devices providing motion in six degrees of freedom
US8144305B2 (en) 2006-05-18 2012-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
SG175671A1 (en) 2006-05-18 2011-11-28 Nikon Corp Exposure method and apparatus, maintenance method and device manufacturing method
TW200818256A (en) 2006-05-22 2008-04-16 Nikon Corp Exposure method and apparatus, maintenance method, and device manufacturing method
WO2007136089A1 (en) 2006-05-23 2007-11-29 Nikon Corporation Maintenance method, exposure method and apparatus, and device manufacturing method
KR20090023545A (en) 2006-05-31 2009-03-05 가부시키가이샤 니콘 Exposure apparatus and exposure method
JPWO2007142350A1 (en) 2006-06-09 2009-10-29 株式会社ニコン Pattern forming method and pattern forming apparatus, exposure method and exposure apparatus, and device manufacturing method
JP2007335662A (en) 2006-06-15 2007-12-27 Canon Inc Exposure equipment
JP5071385B2 (en) 2006-06-16 2012-11-14 株式会社ニコン Variable slit device, illumination device, exposure apparatus, exposure method, and device manufacturing method
US7656502B2 (en) 2006-06-22 2010-02-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2008034801A (en) 2006-06-30 2008-02-14 Canon Inc Exposure apparatus and device manufacturing method
WO2008001871A1 (en) 2006-06-30 2008-01-03 Nikon Corporation Maintenance method, exposure method and apparatus and device manufacturing method
US20080073563A1 (en) 2006-07-01 2008-03-27 Nikon Corporation Exposure apparatus that includes a phase change circulation system for movers
WO2008007633A1 (en) 2006-07-12 2008-01-17 Nikon Corporation Illuminating optical apparatus, exposure apparatus and device manufacturing method
EP2040283A4 (en) 2006-07-12 2012-02-08 Nikon Corp Illuminating optical apparatus, exposure apparatus and device manufacturing method
KR101236043B1 (en) 2006-07-14 2013-02-21 가부시키가이샤 니콘 Stage apparatus, exposure apparatus, and device manufacturing method
JP4832201B2 (en) 2006-07-24 2011-12-07 大日本スクリーン製造株式会社 Substrate processing equipment
JP2008042019A (en) 2006-08-08 2008-02-21 Tokyo Electron Ltd Pattern forming method and pattern forming apparatus
JP5151981B2 (en) 2006-08-30 2013-02-27 株式会社ニコン Exposure apparatus and device manufacturing method
KR101634893B1 (en) 2006-08-31 2016-06-29 가부시키가이샤 니콘 Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
EP3418807A1 (en) 2006-08-31 2018-12-26 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
TWI655517B (en) 2006-08-31 2019-04-01 日商尼康股份有限公司 Exposure apparatus and method, and component manufacturing method
TWI623825B (en) 2006-09-01 2018-05-11 Nikon Corporation Exposure device and method, and element manufacturing method
KR101865527B1 (en) 2006-09-01 2018-06-07 가부시키가이샤 니콘 Discharge lamp, light source apparatus, exposure apparatus and exposure apparatus manufacturing method
TWI434326B (en) 2006-09-01 2014-04-11 尼康股份有限公司 Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, component manufacturing method, and correcting method
JP2008066341A (en) 2006-09-04 2008-03-21 Canon Inc Conveying apparatus, exposure apparatus and method
US7826030B2 (en) 2006-09-07 2010-11-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI457723B (en) 2006-09-08 2014-10-21 尼康股份有限公司 A mask, an exposure device, and an element manufacturing method
JP5029611B2 (en) 2006-09-08 2012-09-19 株式会社ニコン Cleaning member, cleaning method, exposure apparatus, and device manufacturing method
US8813764B2 (en) 2009-05-29 2014-08-26 Lam Research Corporation Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
US7872730B2 (en) 2006-09-15 2011-01-18 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
US8330936B2 (en) 2006-09-20 2012-12-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7557997B2 (en) 2006-09-28 2009-07-07 Nikon Corporation Immersion objective optical system, exposure apparatus, device fabrication method, and boundary optical element
JPWO2008038751A1 (en) 2006-09-28 2010-01-28 株式会社ニコン Line width measurement method, image formation state detection method, adjustment method, exposure method, and device manufacturing method
KR101549709B1 (en) 2006-11-09 2015-09-11 가부시키가이샤 니콘 Holding unit position detecting system and exposure system moving method position detecting method exposure method adjusting method of detection system and device producing method
JP2008124194A (en) 2006-11-10 2008-05-29 Canon Inc Immersion exposure method and immersion exposure apparatus
SG143137A1 (en) 2006-11-13 2008-06-27 Asml Netherlands Bv Conduit system for a lithographic apparatus, lithographic apparatus, pump, and method for substantially reducing vibrations in a conduit system
US7843548B2 (en) 2006-11-13 2010-11-30 Asml Netherlands B.V. Conduit system for a lithographic apparatus, lithographic apparatus, pump, and method for substantially reducing vibrations in a conduit system
JP5055971B2 (en) * 2006-11-16 2012-10-24 株式会社ニコン Surface treatment method, surface treatment apparatus, exposure method, exposure apparatus, and device manufacturing method
US7973910B2 (en) 2006-11-17 2011-07-05 Nikon Corporation Stage apparatus and exposure apparatus
US8045135B2 (en) 2006-11-22 2011-10-25 Asml Netherlands B.V. Lithographic apparatus with a fluid combining unit and related device manufacturing method
US8040490B2 (en) 2006-12-01 2011-10-18 Nikon Corporation Liquid immersion exposure apparatus, exposure method, and method for producing device
US8013975B2 (en) 2006-12-01 2011-09-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US20080156356A1 (en) 2006-12-05 2008-07-03 Nikon Corporation Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9632425B2 (en) 2006-12-07 2017-04-25 Asml Holding N.V. Lithographic apparatus, a dryer and a method of removing liquid from a surface
US7791709B2 (en) 2006-12-08 2010-09-07 Asml Netherlands B.V. Substrate support and lithographic process
US8416383B2 (en) 2006-12-13 2013-04-09 Asml Netherlands B.V. Lithographic apparatus and method
US8634052B2 (en) 2006-12-13 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and method involving a ring to cover a gap between a substrate and a substrate table
KR20090106555A (en) 2006-12-27 2009-10-09 가부시키가이샤 니콘 Stage apparatus, exposure apparatus and device manufacturing method
US8004651B2 (en) 2007-01-23 2011-08-23 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
US7866637B2 (en) 2007-01-26 2011-01-11 Asml Netherlands B.V. Humidifying apparatus, lithographic apparatus and humidifying method
US7755740B2 (en) * 2007-02-07 2010-07-13 Canon Kabushiki Kaisha Exposure apparatus
JP5149513B2 (en) 2007-02-15 2013-02-20 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
JP5004611B2 (en) 2007-02-15 2012-08-22 株式会社Ｓｏｋｕｄｏ Substrate processing equipment
US7692765B2 (en) 2007-02-21 2010-04-06 Asml Netherlands B.V. Lithographic apparatus and method of removing liquid
US8323855B2 (en) 2007-03-01 2012-12-04 Nikon Corporation Pellicle frame apparatus, mask, exposing method, exposure apparatus, and device fabricating method
US8237911B2 (en) 2007-03-15 2012-08-07 Nikon Corporation Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
US7830046B2 (en) 2007-03-16 2010-11-09 Nikon Corporation Damper for a stage assembly
US8134685B2 (en) 2007-03-23 2012-03-13 Nikon Corporation Liquid recovery system, immersion exposure apparatus, immersion exposing method, and device fabricating method
US7975708B2 (en) 2007-03-30 2011-07-12 Lam Research Corporation Proximity head with angled vacuum conduit system, apparatus and method
US8464736B1 (en) 2007-03-30 2013-06-18 Lam Research Corporation Reclaim chemistry
US8139199B2 (en) 2007-04-02 2012-03-20 Nikon Corporation Exposure method, exposure apparatus, light converging pattern formation member, mask, and device manufacturing method
KR20210147092A (en) 2007-04-12 2021-12-06 가부시키가이샤 니콘 Discharge lamp
US9165738B2 (en) 2007-04-12 2015-10-20 Nikon Corporation Discharge lamp, connecting cable, light source apparatus, and exposure apparatus
JPWO2008132799A1 (en) 2007-04-12 2010-07-22 株式会社ニコン Measuring method, exposure method, and device manufacturing method
US8665418B2 (en) 2007-04-18 2014-03-04 Nikon Corporation Projection optical system, exposure apparatus, and device manufacturing method
US7900641B2 (en) 2007-05-04 2011-03-08 Asml Netherlands B.V. Cleaning device and a lithographic apparatus cleaning method
US8947629B2 (en) 2007-05-04 2015-02-03 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
JP2008283052A (en) * 2007-05-11 2008-11-20 Toshiba Corp Immersion exposure apparatus and semiconductor device manufacturing method
US8300207B2 (en) 2007-05-17 2012-10-30 Nikon Corporation Exposure apparatus, immersion system, exposing method, and device fabricating method
US8435593B2 (en) 2007-05-22 2013-05-07 Asml Netherlands B.V. Method of inspecting a substrate and method of preparing a substrate for lithography
WO2008146819A1 (en) 2007-05-28 2008-12-04 Nikon Corporation Exposure apparatus, device manufacturing method, cleaning device, cleaning method and exposure method
US8164736B2 (en) 2007-05-29 2012-04-24 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US8514365B2 (en) 2007-06-01 2013-08-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8141566B2 (en) 2007-06-19 2012-03-27 Lam Research Corporation System, method and apparatus for maintaining separation of liquids in a controlled meniscus
JP2009010079A (en) 2007-06-27 2009-01-15 Canon Inc Exposure equipment
KR101538245B1 (en) 2007-07-18 2015-07-20 가부시키가이샤 니콘 Measurement method, stage apparatus, and exposure apparatus
WO2009013905A1 (en) 2007-07-24 2009-01-29 Nikon Corporation Position measuring system, exposure device, position measuring method, exposure method, device manufacturing method, tool, and measuring method
US8264669B2 (en) 2007-07-24 2012-09-11 Nikon Corporation Movable body drive method, pattern formation method, exposure method, and device manufacturing method for maintaining position coordinate before and after switching encoder head
US8547527B2 (en) 2007-07-24 2013-10-01 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and pattern formation apparatus, and device manufacturing method
US7916269B2 (en) 2007-07-24 2011-03-29 Asml Netherlands B.V. Lithographic apparatus and contamination removal or prevention method
US8194232B2 (en) 2007-07-24 2012-06-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method
JP5039468B2 (en) 2007-07-26 2012-10-03 株式会社Ｓｏｋｕｄｏ Substrate cleaning apparatus and substrate processing apparatus having the same
US7641406B2 (en) 2007-07-26 2010-01-05 Sokudo Co., Ltd. Bevel inspection apparatus for substrate processing
NL1035757A1 (en) 2007-08-02 2009-02-03 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US7924404B2 (en) 2007-08-16 2011-04-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8867022B2 (en) 2007-08-24 2014-10-21 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, and device manufacturing method
US8237919B2 (en) 2007-08-24 2012-08-07 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads
US8023106B2 (en) 2007-08-24 2011-09-20 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US8218129B2 (en) 2007-08-24 2012-07-10 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, measuring method, and position measurement system
US9304412B2 (en) 2007-08-24 2016-04-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
WO2009036192A1 (en) * 2007-09-13 2009-03-19 Applied Precision, Inc. Method of dispersing immersion liquid on a specimen substrate for high resolution imaging and lithographie
US8681308B2 (en) 2007-09-13 2014-03-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5166802B2 (en) 2007-09-13 2013-03-21 株式会社Ｓｏｋｕｄｏ Substrate processing apparatus and substrate processing method
JP5192206B2 (en) 2007-09-13 2013-05-08 株式会社Ｓｏｋｕｄｏ Substrate processing apparatus and substrate processing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
NL1035908A1 (en) 2007-09-25 2009-03-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
SG151198A1 (en) 2007-09-27 2009-04-30 Asml Netherlands Bv Methods relating to immersion lithography and an immersion lithographic apparatus
NL1035942A1 (en) 2007-09-27 2009-03-30 Asml Netherlands Bv Lithographic Apparatus and Method of Cleaning a Lithographic Apparatus.
NL1036009A1 (en) 2007-10-05 2009-04-07 Asml Netherlands Bv An Immersion Lithography Apparatus.
JPWO2009048051A1 (en) 2007-10-12 2011-02-17 株式会社ニコン Illumination optical apparatus, and exposure method and apparatus
JP5267029B2 (en) 2007-10-12 2013-08-21 株式会社ニコン Illumination optical apparatus, exposure apparatus, and device manufacturing method
EP2179330A1 (en) 2007-10-16 2010-04-28 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
JP5017232B2 (en) 2007-10-31 2012-09-05 エーエスエムエル ネザーランズ ビー．ブイ． Cleaning apparatus and immersion lithography apparatus
EP2219206A4 (en) 2007-11-06 2011-04-27 Nikon Corp CONTROL DEVICE, EXPOSURE METHOD, AND EXPOSURE DEVICE
KR101644660B1 (en) 2007-11-06 2016-08-01 가부시키가이샤 니콘 Illumination optical device and exposure device
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
JP2009117832A (en) 2007-11-06 2009-05-28 Asml Netherlands Bv Lithographic substrate preparation method, substrate, device manufacturing method, seal coating applicator, and seal coating measuring apparatus
JP5326259B2 (en) 2007-11-08 2013-10-30 株式会社ニコン Illumination optical apparatus, exposure apparatus, and device manufacturing method
US8111406B2 (en) 2007-11-14 2012-02-07 Nikon Corporation Surface position detecting apparatus, surface position detecting method, exposure apparatus, and device manufacturing method
NL1036187A1 (en) 2007-12-03 2009-06-04 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL1036211A1 (en) 2007-12-03 2009-06-04 Asml Netherlands Bv Lithographic Apparatus and Device Manufacturing Method.
NL1036253A1 (en) 2007-12-10 2009-06-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5403263B2 (en) 2007-12-11 2014-01-29 株式会社ニコン MOBILE DEVICE, EXPOSURE APPARATUS, PATTERN FORMING APPARATUS, AND DEVICE MANUFACTURING METHOD
JPWO2009078223A1 (en) 2007-12-17 2011-04-28 株式会社ニコン Spatial light modulation unit, illumination optical system, exposure apparatus, and device manufacturing method
TW200929333A (en) 2007-12-17 2009-07-01 Nikon Corp Illumination optical system, exposure apparatus, and device manufacturing method
US8964166B2 (en) 2007-12-17 2015-02-24 Nikon Corporation Stage device, exposure apparatus and method of producing device
NL1036273A1 (en) 2007-12-18 2009-06-19 Asml Netherlands Bv Lithographic apparatus and method of cleaning a surface or an immersion lithographic apparatus.
NL1036306A1 (en) 2007-12-20 2009-06-23 Asml Netherlands Bv Lithographic apparatus and in-line cleaning apparatus.
US8953141B2 (en) 2007-12-21 2015-02-10 Asml Netherlands B.V. Immersion lithographic apparatus and device manufacturing method with asymmetric acceleration profile of substrate table to maintain meniscus of immersion liquid
US8237916B2 (en) 2007-12-28 2012-08-07 Nikon Corporation Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method
US8269945B2 (en) 2007-12-28 2012-09-18 Nikon Corporation Movable body drive method and apparatus, exposure method and apparatus, pattern formation method and apparatus, and device manufacturing method
US8792079B2 (en) 2007-12-28 2014-07-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method having encoders to measure displacement between optical member and measurement mount and between measurement mount and movable body
NL1036333A1 (en) 2008-01-02 2009-07-07 Asml Netherlands Bv Immersion lithography.
JPWO2009088003A1 (en) 2008-01-10 2011-05-26 株式会社ニコン Exposure method, exposure apparatus, and device manufacturing method
NL1036432A1 (en) 2008-01-23 2009-07-27 Asml Holding Nv An immersion lithographic apparatus with immersion fluid re-circulating system.
US8339572B2 (en) 2008-01-25 2012-12-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR20100124245A (en) 2008-02-08 2010-11-26 가부시키가이샤 니콘 Position measuring system and position measuring method, mobile body device, mobile body driving method, exposure device and exposure method, pattern forming device, and device manufacturing method
US8908151B2 (en) 2008-02-14 2014-12-09 Nikon Corporation Illumination optical system, exposure apparatus, device manufacturing method, compensation filter, and exposure optical system
NL1036526A1 (en) 2008-02-14 2009-08-17 Asml Netherlands Bv Use of a coating, an article having the coating and a lithographic apparatus including the coating.
NL1036596A1 (en) 2008-02-21 2009-08-24 Asml Holding Nv Re-flow and buffer system for immersion lithography.
NL1036571A1 (en) 2008-03-07 2009-09-08 Asml Netherlands Bv Lithographic Apparatus and Methods.
NL1036631A1 (en) 2008-03-24 2009-09-25 Asml Netherlands Bv Immersion Lithographic Apparatus and Device Manufacturing Method.
TW200947149A (en) 2008-04-11 2009-11-16 Nikon Corp Stage device, exposure device and device production method
KR20110000619A (en) 2008-04-11 2011-01-04 가부시키가이샤 니콘 Spatial light modulation unit, illumination optical system, exposure apparatus, and device manufacturing method
NL1036715A1 (en) 2008-04-16 2009-10-19 Asml Netherlands Bv Lithographic apparatus.
NL1036709A1 (en) 2008-04-24 2009-10-27 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
ATE548679T1 (en) 2008-05-08 2012-03-15 Asml Netherlands Bv LITHOGRAPHIC IMMERSION APPARATUS, DRYING APPARATUS, IMMERSION METROLOGY APPARATUS AND METHOD FOR PRODUCING A DEVICE
US8421993B2 (en) 2008-05-08 2013-04-16 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
NL1036835A1 (en) 2008-05-08 2009-11-11 Asml Netherlands Bv Lithographic Apparatus and Method.
EP2131241B1 (en) 2008-05-08 2019-07-31 ASML Netherlands B.V. Fluid handling structure, lithographic apparatus and device manufacturing method
JP5097166B2 (en) 2008-05-28 2012-12-12 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus and method of operating the apparatus
CN105606344B (en) 2008-05-28 2019-07-30 株式会社尼康 Illumination optical system, illumination method, exposure device, and exposure method
NL1036924A1 (en) 2008-06-02 2009-12-03 Asml Netherlands Bv Substrate table, lithographic apparatus and device manufacturing method.
EP2131242A1 (en) 2008-06-02 2009-12-09 ASML Netherlands B.V. Substrate table, lithographic apparatus and device manufacturing method
NL2002964A1 (en) 2008-06-16 2009-12-17 Asml Netherlands Bv Lithographic Apparatus, a Metrology Apparatus and a Method of Using the Apparatus.
EP2136250A1 (en) 2008-06-18 2009-12-23 ASML Netherlands B.V. Lithographic apparatus and method
NL2002983A1 (en) 2008-06-26 2009-12-29 Asml Netherlands Bv A lithographic apparatus and a method of operating the lithographic apparatus.
JP4553037B2 (en) * 2008-06-27 2010-09-29 株式会社ニコン Immersion projection exposure apparatus with optical component cleaning mechanism and immersion optical component cleaning method
NL2003111A1 (en) 2008-07-25 2010-01-26 Asml Netherlands Bv Method of designing sets or mask patterns, sets of mask patterns, and device manufacturing method.
NL2003226A (en) 2008-08-19 2010-03-09 Asml Netherlands Bv Lithographic apparatus, drying device, metrology apparatus and device manufacturing method.
NL2003341A (en) 2008-08-22 2010-03-10 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
SG159467A1 (en) 2008-09-02 2010-03-30 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method
NL2003363A (en) 2008-09-10 2010-03-15 Asml Netherlands Bv Lithographic apparatus, method of manufacturing an article for a lithographic apparatus and device manufacturing method.
NL2003392A (en) 2008-09-17 2010-03-18 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
US8384875B2 (en) 2008-09-29 2013-02-26 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
NL2003362A (en) 2008-10-16 2010-04-19 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2003333A (en) 2008-10-23 2010-04-26 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
NL2003575A (en) 2008-10-29 2010-05-03 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2003638A (en) 2008-12-03 2010-06-07 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2003758A (en) 2008-12-04 2010-06-07 Asml Netherlands Bv A member with a cleaning surface and a method of removing contamination.
TWI438577B (en) 2008-12-08 2014-05-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP2196857A3 (en) 2008-12-09 2010-07-21 ASML Netherlands BV Lithographic apparatus and device manufacturing method
JP5001343B2 (en) 2008-12-11 2012-08-15 エーエスエムエル ネザーランズ ビー．ブイ． Fluid extraction system, immersion lithographic apparatus, and method for reducing pressure fluctuations of an immersion liquid used in an immersion lithographic apparatus
EP2199858A1 (en) 2008-12-18 2010-06-23 ASML Netherlands BV Lithographic apparatus and method of irradiating at least two target portions
US8941809B2 (en) 2008-12-22 2015-01-27 Screen Semiconductor Solutions Co., Ltd. Substrate processing apparatus and substrate processing method
JP5365641B2 (en) 2008-12-24 2013-12-11 株式会社ニコン Illumination optical system, exposure apparatus, and device manufacturing method
JP5541164B2 (en) 2008-12-24 2014-07-09 株式会社ニコン Illumination optical system, exposure apparatus, and device manufacturing method
JP5127742B2 (en) * 2009-02-18 2013-01-23 パナソニック株式会社 Pattern formation method
EP2221669A3 (en) * 2009-02-19 2011-02-09 ASML Netherlands B.V. A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method
NL2004305A (en) 2009-03-13 2010-09-14 Asml Netherlands Bv Substrate table, immersion lithographic apparatus and device manufacturing method.
JP2010251745A (en) 2009-04-10 2010-11-04 Asml Netherlands Bv Immersion lithography device and device manufacturing method
NL2004362A (en) 2009-04-10 2010-10-12 Asml Netherlands Bv A fluid handling device, an immersion lithographic apparatus and a device manufacturing method.
NL2004497A (en) 2009-05-01 2010-11-02 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
NL2004523A (en) 2009-05-08 2010-11-09 Asml Netherlands Bv Immersion lithographic apparatus and device manufacturing method.
NL2004547A (en) 2009-05-14 2010-11-18 Asml Netherlands Bv An immersion lithographic apparatus and a device manufacturing method.
NL2004540A (en) 2009-05-14 2010-11-18 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
US8619231B2 (en) 2009-05-21 2013-12-31 Nikon Corporation Cleaning method, exposure method, and device manufacturing method
EP2256553B1 (en) 2009-05-26 2016-05-25 ASML Netherlands B.V. Fluid handling structure and lithographic apparatus
JP5016705B2 (en) 2009-06-09 2012-09-05 エーエスエムエル ネザーランズ ビー．ブイ． Fluid handling structure
EP2264529A3 (en) * 2009-06-16 2011-02-09 ASML Netherlands B.V. A lithographic apparatus, a method of controlling the apparatus and a method of manufacturing a device using a lithographic apparatus
US8294878B2 (en) 2009-06-19 2012-10-23 Nikon Corporation Exposure apparatus and device manufacturing method
US8446569B2 (en) 2009-06-19 2013-05-21 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
US8355116B2 (en) 2009-06-19 2013-01-15 Nikon Corporation Exposure apparatus and device manufacturing method
US8355114B2 (en) 2009-06-19 2013-01-15 Nikon Corporation Exposure apparatus and device manufacturing method
EP2264528A1 (en) 2009-06-19 2010-12-22 ASML Netherlands B.V. Sensor and lithographic apparatus
US8472008B2 (en) 2009-06-19 2013-06-25 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method
JP5058305B2 (en) 2009-06-19 2012-10-24 エーエスエムエル ネザーランズ ビー．ブイ． Immersion lithographic apparatus, liquid confinement structure, final element of a projection system for an immersion lithographic apparatus, and substrate table
NL2004808A (en) 2009-06-30 2011-01-12 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
NL2004807A (en) 2009-06-30 2011-01-04 Asml Netherlands Bv Substrate table for a lithographic apparatus, litographic apparatus, method of using a substrate table and device manufacturing method.
NL2004820A (en) 2009-06-30 2011-01-04 Asml Netherlands Bv Lithographic apparatus and a method of measuring flow rate in a two phase flow.
TW201102765A (en) 2009-07-01 2011-01-16 Nikon Corp Grinding device, grinding method, exposure device and production method of a device
NL2004980A (en) 2009-07-13 2011-01-17 Asml Netherlands Bv Heat transfers assembly, lithographic apparatus and manufacturing method.
NL2005009A (en) 2009-07-27 2011-01-31 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
TWI579659B (en) 2009-08-07 2017-04-21 尼康股份有限公司 An exposure apparatus, and an element manufacturing method
US20110032495A1 (en) 2009-08-07 2011-02-10 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US20110037962A1 (en) 2009-08-17 2011-02-17 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
US8488109B2 (en) 2009-08-25 2013-07-16 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8514395B2 (en) 2009-08-25 2013-08-20 Nikon Corporation Exposure method, exposure apparatus, and device manufacturing method
US8493547B2 (en) 2009-08-25 2013-07-23 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
NL2005322A (en) 2009-09-11 2011-03-14 Asml Netherlands Bv A shutter member, a lithographic apparatus and device manufacturing method.
US20110143287A1 (en) 2009-09-14 2011-06-16 Nikon Corporation Catadioptric system, aberration measuring apparatus, method of adjusting optical system, exposure apparatus, and device manufacturing method
JP5410212B2 (en) 2009-09-15 2014-02-05 株式会社Ｓｏｋｕｄｏ Substrate processing apparatus, substrate processing system, and inspection peripheral exposure apparatus
NL2005120A (en) 2009-09-21 2011-03-22 Asml Netherlands Bv Lithographic apparatus, coverplate and device manufacturing method.
NL2005089A (en) 2009-09-23 2011-03-28 Asml Netherlands Bv FLUID HANDLING STRUCTURE, LITHOGRAPHIC EQUIPMENT AND DEVICE MANUFACTURING METHOD.
NL2005167A (en) 2009-10-02 2011-04-05 Asml Netherlands Bv Lithographic apparatus and a method of operating the apparatus.
WO2011052703A1 (en) 2009-10-30 2011-05-05 Nikon Corporation Exposure apparatus and device manufacturing method
NL2005478A (en) 2009-11-17 2011-05-18 Asml Netherlands Bv Lithographic apparatus, removable member and device manufacturing method.
NL2005479A (en) 2009-11-17 2011-05-18 Asml Netherlands Bv Lithographic apparatus, removable member and device manufacturing method.
NL2005528A (en) 2009-12-02 2011-06-07 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2005610A (en) 2009-12-02 2011-06-06 Asml Netherlands Bv Lithographic apparatus and surface cleaning method.
NL2005657A (en) 2009-12-03 2011-06-06 Asml Netherlands Bv A lithographic apparatus and a method of forming a lyophobic coating on a surface.
NL2005655A (en) 2009-12-09 2011-06-14 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
NL2005717A (en) 2009-12-18 2011-06-21 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
NL2005666A (en) 2009-12-18 2011-06-21 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
WO2011078070A1 (en) 2009-12-23 2011-06-30 株式会社ニコン Spatial light modulator unit, illumination optical system, exposure device, and device manufacturing method
US8488106B2 (en) 2009-12-28 2013-07-16 Nikon Corporation Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method
NL2005874A (en) 2010-01-22 2011-07-25 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
JP5246174B2 (en) * 2010-01-25 2013-07-24 株式会社ニコン Channel forming member, exposure apparatus, and device manufacturing method
NL2005951A (en) 2010-02-02 2011-08-03 Asml Netherlands Bv Lithographic apparatus and a device manufacturing method.
NL2006054A (en) 2010-02-09 2011-08-10 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
NL2005974A (en) 2010-02-12 2011-08-15 Asml Netherlands Bv Lithographic apparatus and a device manufacturing method.
NL2006127A (en) 2010-02-17 2011-08-18 Asml Netherlands Bv A substrate table, a lithographic apparatus and a method for manufacturing a device using a lithographic apparatus.
US9389519B2 (en) 2010-02-25 2016-07-12 Nikon Corporation Measuring method and measuring apparatus of pupil transmittance distribution, exposure method and exposure apparatus, and device manufacturing method
US20110205519A1 (en) 2010-02-25 2011-08-25 Nikon Corporation Polarization converting unit, illumination optical system, exposure apparatus, and device manufacturing method
NL2006076A (en) 2010-03-04 2011-09-06 Asml Netherlands Bv A lithographic apparatus and a method of manufacturing a device using a lithographic apparatus.
EP2365390A3 (en) 2010-03-12 2017-10-04 ASML Netherlands B.V. Lithographic apparatus and method
NL2006244A (en) 2010-03-16 2011-09-19 Asml Netherlands Bv Lithographic apparatus, cover for use in a lithographic apparatus and method for designing a cover for use in a lithographic apparatus.
NL2006243A (en) 2010-03-19 2011-09-20 Asml Netherlands Bv A lithographic apparatus, an illumination system, a projection system and a method of manufacturing a device using a lithographic apparatus.
NL2006389A (en) 2010-04-15 2011-10-18 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and a device manufacturing method.
EP2381310B1 (en) 2010-04-22 2015-05-06 ASML Netherlands BV Fluid handling structure and lithographic apparatus
JP5299347B2 (en) * 2010-04-26 2013-09-25 株式会社ニコン Exposure apparatus, liquid supply method, and device manufacturing method
JP5024419B2 (en) * 2010-04-26 2012-09-12 株式会社ニコン Exposure apparatus, liquid supply method, and device manufacturing method
NL2006272A (en) 2010-05-04 2011-11-07 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2006615A (en) 2010-05-11 2011-11-14 Asml Netherlands Bv Fluid handling structure, lithographic apparatus and device manufacturing method.
JP5313293B2 (en) 2010-05-19 2013-10-09 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus, fluid handling structure used in lithographic apparatus, and device manufacturing method
NL2006648A (en) 2010-06-01 2011-12-06 Asml Netherlands Bv A fluid supply system, a lithographic apparatus, a method of varying fluid flow rate and a device manufacturing method.
JP2012004465A (en) 2010-06-19 2012-01-05 Nikon Corp Illumination optical system, exposure equipment, and device manufacturing method
NL2006818A (en) 2010-07-02 2012-01-03 Asml Netherlands Bv A method of adjusting speed and/or routing of a table movement plan and a lithographic apparatus.
NL2006913A (en) 2010-07-16 2012-01-17 Asml Netherlands Bv Lithographic apparatus and method.
JP5127891B2 (en) * 2010-07-28 2013-01-23 パナソニック株式会社 Semiconductor manufacturing equipment
JP5366019B2 (en) 2010-08-02 2013-12-11 株式会社ニコン Transmission optical system, illumination optical system, exposure apparatus, and device manufacturing method
EP2423749B1 (en) 2010-08-24 2013-09-11 ASML Netherlands BV A lithographic apparatus and device manufacturing method
US20130255414A1 (en) 2010-09-09 2013-10-03 Nikon Corporation Parallel Linkage and Actuator Motor Coil Designs for Tube Carrier
NL2007453A (en) 2010-10-18 2012-04-19 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2007477A (en) 2010-10-22 2012-04-24 Asml Netherlands Bv Method of optimizing a lithographic process, device manufacturing method, lithographic apparatus, computer program product and simulation apparatus.
NL2007768A (en) 2010-12-14 2012-06-18 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
NL2007818A (en) 2010-12-20 2012-06-21 Asml Netherlands Bv Method of updating calibration data and a device manufacturing method.
NL2007802A (en) 2010-12-21 2012-06-25 Asml Netherlands Bv A substrate table, a lithographic apparatus and a device manufacturing method.
US8760630B2 (en) 2011-01-01 2014-06-24 Canon Kabushiki Kaisha Exposure apparatus and method of manufacturing device
JP5375843B2 (en) * 2011-01-31 2013-12-25 株式会社ニコン Exposure apparatus, exposure method, and device manufacturing method
EP2490073B1 (en) 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder
US20120212722A1 (en) 2011-02-21 2012-08-23 Nikon Corporation Fast Illumination Simulator Based on a Calibrated Flexible Point Spread Function
KR101962487B1 (en) 2011-02-22 2019-07-17 가부시키가이샤 니콘 Holding device, exposure device and production method for device
NL2008183A (en) 2011-02-25 2012-08-28 Asml Netherlands Bv A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method.
NL2008199A (en) 2011-02-28 2012-08-29 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2008630A (en) 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
NL2008751A (en) 2011-06-06 2012-12-10 Asml Netherlands Bv Temperature sensing probe, burl plate, lithographic apparatus and method.
US9599905B2 (en) 2011-06-07 2017-03-21 Nikon Corporation Illumination optical system, exposure apparatus, device production method, and light polarization unit
TWI661224B (en) 2011-06-13 2019-06-01 日商尼康股份有限公司 Illumination optical system, exposure apparatus and device manufacturing method
US9030057B2 (en) 2011-06-24 2015-05-12 Nikon Corporation Method and apparatus to allow a plurality of stages to operate in close proximity
NL2008980A (en) 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2008979A (en) 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009139A (en) 2011-08-05 2013-02-06 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
JP5778093B2 (en) 2011-08-10 2015-09-16 エーエスエムエル ネザーランズ ビー．ブイ． Substrate table assembly, immersion lithographic apparatus and device manufacturing method
NL2009189A (en) 2011-08-17 2013-02-19 Asml Netherlands Bv Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
SG188036A1 (en) 2011-08-18 2013-03-28 Asml Netherlands Bv Lithographic apparatus, support table for a lithographic apparatus and device manufacturing method
NL2009272A (en) 2011-08-31 2013-03-04 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009271A (en) 2011-09-15 2013-03-18 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
NL2009487A (en) 2011-10-14 2013-04-16 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
JP2013085705A (en) 2011-10-18 2013-05-13 Canon Inc Acoustic wave acquiring apparatus and control method thereof
NL2009472A (en) 2011-10-24 2013-04-25 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
JP6120001B2 (en) 2011-10-24 2017-04-26 株式会社ニコン Illumination optical system, exposure apparatus, and device manufacturing method
NL2009692A (en) 2011-12-07 2013-06-10 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
NL2009899A (en) 2011-12-20 2013-06-24 Asml Netherlands Bv A pump system, a carbon dioxide supply system, an extraction system, a lithographic apparatus and a device manufacturing method.
NL2009858A (en) 2011-12-27 2013-07-01 Asml Netherlands Bv Substrate holder, lithographic apparatus, and device manufacturing method.
WO2013113569A1 (en) 2012-02-03 2013-08-08 Asml Netherlands B.V. Substrate holder and method of manufacturing a substrate holder
US9268231B2 (en) 2012-04-10 2016-02-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
KR20150016508A (en) 2012-04-19 2015-02-12 에이에스엠엘 네델란즈 비.브이. Substrate holder, lithographic apparatus, and device manufacturing method
KR102170864B1 (en) 2012-05-02 2020-10-28 가부시키가이샤 니콘 Method for evaluating and improving pupil luminance distribution, illumination optical system and adjustment method thereof, exposure device, exposure method, and device manufacturing method
CN104303109B (en) 2012-05-17 2017-06-09 Asml荷兰有限公司 Thermal regulation unit, lithographic apparatus and device manufacturing method
KR101689226B1 (en) 2012-05-22 2016-12-23 에이에스엠엘 네델란즈 비.브이. Sensor, lithographic apparatus and device manufacturing method
CN104412164B (en) 2012-05-29 2017-09-12 Asml荷兰有限公司 Support device, photolithography device and device manufacturing method
KR101911400B1 (en) 2012-05-29 2018-10-24 에이에스엠엘 네델란즈 비.브이. Object holder and lithographic apparatus
WO2013186136A2 (en) 2012-06-11 2013-12-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8703368B2 (en) * 2012-07-16 2014-04-22 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography process
NL2011172A (en) 2012-07-23 2014-01-27 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
WO2014029603A1 (en) 2012-08-20 2014-02-27 Asml Netherlands B.V. Method of preparing a pattern, method of forming a mask set, device manufacturing method and computer program
JP6001961B2 (en) 2012-08-29 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ Substrate processing apparatus and substrate processing method
CN108613638B (en) 2012-10-02 2020-09-18 株式会社尼康 Exposure apparatus, exposure method, and device manufacturing method
JP5459629B2 (en) * 2012-10-19 2014-04-02 株式会社ニコン Exposure apparatus and device manufacturing method
CN104937696B (en) 2012-11-20 2019-03-15 株式会社尼康 Exposure apparatus, moving body apparatus, and device manufacturing method
EP2950328A4 (en) 2012-11-30 2017-01-25 Nikon Corporation Suction apparatus, carry-in method, conveyance system, light exposure device, and device production method
WO2014096299A1 (en) 2012-12-20 2014-06-26 Asml Netherlands B.V. Lithographic apparatus and table for use in such an apparatus
NL2010527A (en) 2013-03-27 2014-09-30 Asml Netherlands Bv Object holder, lithographic apparatus, device manufacturing method, and method of manufacturing an object holder.
CN104216233B (en) * 2013-06-05 2016-08-10 中芯国际集成电路制造(上海)有限公司 Exposure method
CN103439869B (en) * 2013-09-02 2016-01-27 上海华力微电子有限公司 The method of measurement pattern density
WO2015043890A1 (en) 2013-09-27 2015-04-02 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
JP5786919B2 (en) * 2013-10-28 2015-09-30 株式会社ニコン Projection optical system, exposure apparatus and exposure method
CN104570615B (en) * 2013-10-29 2017-01-18 上海微电子装备有限公司 Scanning exposure device
NL2013835A (en) 2014-01-20 2015-07-21 Asml Netherlands Bv Substrate holder, support table for a lithographic apparatus, lithographic apparatus and device manufacturing method.
US9798253B2 (en) 2014-04-30 2017-10-24 Asml Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
CN106575084B (en) 2014-07-04 2019-11-01 Asml荷兰有限公司 Lithographic apparatus and method of manufacturing devices using the lithographic apparatus
CN107106938B (en) 2014-12-19 2019-06-18 Asml荷兰有限公司 Fluid handling structure, lithographic apparatus and device fabrication method
JP2015132843A (en) * 2015-03-02 2015-07-23 株式会社ニコン Projection optical system, exposure apparatus, exposure method, and device manufacturing method
WO2016198255A1 (en) 2015-06-11 2016-12-15 Asml Netherlands B.V. Lithographic apparatus and method for loading a substrate
CN107850854B (en) 2015-07-16 2020-08-11 Asml荷兰有限公司 Inspection substrate and inspection method
NL2017128A (en) 2015-07-16 2017-01-23 Asml Netherlands Bv A lithographic apparatus, a projection system, a last lens element, a liquid control member and a device manufacturing method
CN112965341B (en) 2015-11-20 2024-06-28 Asml荷兰有限公司 Lithographic apparatus and method of operating a lithographic apparatus
KR102738396B1 (en) 2016-01-13 2024-12-06 에이에스엠엘 네델란즈 비.브이. A fluid handling structure and a lithographic apparatus
CN108604066B (en) 2016-02-08 2021-06-29 Asml荷兰有限公司 Lithographic apparatus, method for unloading a substrate, and method for loading a substrate
JP2016136273A (en) * 2016-03-07 2016-07-28 株式会社ニコン Projection optical system, exposure apparatus, exposure method, and device manufacturing method
JP6756850B2 (en) 2016-05-12 2020-09-16 エーエスエムエル ネザーランズ ビー．ブイ． Extract for lithographic equipment
CN109416516B (en) 2016-07-04 2020-08-11 Asml荷兰有限公司 Inspection substrate and inspection method
US11099490B2 (en) 2016-07-07 2021-08-24 Asml Netherlands B.V. Inspection substrate and an inspection method
NL2019453A (en) 2016-09-12 2018-03-15 Asml Netherlands Bv Fluid handling structure for lithographic apparatus
US11199771B2 (en) 2016-10-20 2021-12-14 Asml Netherlands B.V. Pressure control valve, a fluid handling structure for lithographic apparatus and a lithographic apparatus
WO2018202361A1 (en) 2017-05-05 2018-11-08 Asml Netherlands B.V. Method to predict yield of a device manufacturing process
EP3467589A1 (en) 2017-10-06 2019-04-10 ASML Netherlands B.V. Determining edge roughness parameters
CN110799903B (en) 2017-06-20 2021-11-16 Asml荷兰有限公司 Determining an edge roughness parameter
EP3432071A1 (en) 2017-07-17 2019-01-23 ASML Netherlands B.V. Information determining apparatus and method
JP7265493B2 (en) 2017-07-17 2023-04-26 エーエスエムエル ネザーランズ ビー．ブイ． Apparatus and method for measuring information
WO2019020484A1 (en) 2017-07-25 2019-01-31 Asml Netherlands B.V. Method for parameter determination and apparatus thereof
JP2018010303A (en) * 2017-08-03 2018-01-18 株式会社ニコン Light exposure device and device manufacturing method
EP3444675A1 (en) 2017-08-14 2019-02-20 ASML Netherlands B.V. Optical detector
EP3447581A1 (en) 2017-08-23 2019-02-27 ASML Netherlands B.V. A clear-out tool, a lithographic apparatus and a device manufacturing method
EP3462239A1 (en) 2017-09-27 2019-04-03 ASML Netherlands B.V. Metrology in lithographic processes
IL273145B2 (en) 2017-09-11 2024-03-01 Asml Netherlands Bv Lithographic processes in meteorology
EP3457211A1 (en) 2017-09-13 2019-03-20 ASML Netherlands B.V. A method of aligning a pair of complementary diffraction patterns and associated metrology method and apparatus
EP3467588A1 (en) 2017-10-03 2019-04-10 ASML Netherlands B.V. Method and apparatus for determining alignment properties of a beam of radiation
KR102419650B1 (en) 2017-10-12 2022-07-11 에이에스엠엘 네델란즈 비.브이. Substrate holder for use in lithographic apparatus
EP3474074A1 (en) 2017-10-17 2019-04-24 ASML Netherlands B.V. Scatterometer and method of scatterometry using acoustic radiation
EP3477389A1 (en) 2017-10-24 2019-05-01 ASML Netherlands B.V. Mark, overlay target, and methods of alignment and overlay
US11086232B2 (en) 2017-10-24 2021-08-10 Asml Netherlands B.V. Mark, overlay target, and methods of alignment and overlay
EP3480659A1 (en) 2017-11-01 2019-05-08 ASML Netherlands B.V. Estimation of data in metrology
JP7121122B2 (en) 2017-11-20 2022-08-17 エーエスエムエル ネザーランズ ビー．ブイ． Substrate holder, substrate support, method for clamping substrate in clamping system, and lithographic apparatus
US11448976B2 (en) 2017-12-13 2022-09-20 Asml Netherlands B.V. Substrate holder for use in a lithographic apparatus
CN118584764A (en) 2017-12-15 2024-09-03 Asml荷兰有限公司 Fluid handling structure, lithographic apparatus, and method of using a fluid handling structure
CN111971623A (en) 2018-04-16 2020-11-20 Asml荷兰有限公司 Cleaning device and cleaning method
US11720032B2 (en) 2018-09-24 2023-08-08 Asml Netherlands B.V. Process tool and an inspection method
WO2020108862A1 (en) 2018-11-26 2020-06-04 Asml Netherlands B.V. Method for determining root causes of events of a semiconductor manufacturing process and for monitoring a semiconductor manufacturing process
EP3705959A1 (en) 2019-03-04 2020-09-09 ASML Netherlands B.V. Method for determining root causes of events of a semiconductor manufacturing process and for monitoring a semiconductor manufacturing process
EP3891558A1 (en) 2018-12-03 2021-10-13 ASML Netherlands B.V. Method to predict yield of a semiconductor manufacturing process
JP7224712B2 (en) * 2018-12-03 2023-02-20 信越化学工業株式会社 A method for manufacturing a pellicle, a pellicle, a photomask with a pellicle, an exposure method, a method for manufacturing a semiconductor device, a method for manufacturing a liquid crystal display, and a method for manufacturing an organic EL display.
CN113168116B (en) 2018-12-07 2024-04-16 Asml荷兰有限公司 Method for determining root causes affecting yield in semiconductor manufacturing processes
JP2019091057A (en) * 2019-01-15 2019-06-13 株式会社ニコン Exposure apparatus and device manufacturing method
JP2019082711A (en) * 2019-01-15 2019-05-30 株式会社ニコン Projection optical system, exposure device, exposure method, and device manufacturing method
EP3693795A1 (en) 2019-02-06 2020-08-12 ASML Netherlands B.V. Method for decision making in a semiconductor manufacturing process
WO2020156769A1 (en) 2019-01-29 2020-08-06 Asml Netherlands B.V. Method for decision making in a semiconductor manufacturing process
CN113508340B (en) 2019-03-01 2024-11-12 Asml荷兰有限公司 Object holder including electrostatic clamp
KR102669931B1 (en) 2019-04-17 2024-05-27 에이에스엠엘 네델란즈 비.브이. Device manufacturing method and computer program
WO2021008794A1 (en) 2019-07-15 2021-01-21 Asml Netherlands B.V. Methods of alignment, overlay, configuration of marks, manufacturing of patterning devices and patterning the marks
EP3767394A1 (en) 2019-07-18 2021-01-20 ASML Netherlands B.V. Mark, overlay target, and methods of alignment and overlay
CN114402263A (en) 2019-09-13 2022-04-26 Asml荷兰有限公司 Fluid handling system and lithographic apparatus
EP4062233A1 (en) 2019-11-18 2022-09-28 ASML Netherlands B.V. A fluid handling system, method and lithographic apparatus
WO2021123135A1 (en) 2019-12-19 2021-06-24 Asml Netherlands B.V. Scatterometer and method of scatterometry using acoustic radiation
WO2021170320A1 (en) 2020-02-24 2021-09-02 Asml Netherlands B.V. Substrate support and substrate table
WO2021197730A1 (en) 2020-04-02 2021-10-07 Asml Netherlands B.V. Method for determining an inspection strategy for a group of substrates in a semiconductor manufacturing process
EP3910417A1 (en) 2020-05-13 2021-11-17 ASML Netherlands B.V. Method for determining an inspection strategy for a group of substrates in a semiconductor manufacturing process
US12287580B2 (en) 2020-07-14 2025-04-29 Asml Netherlands B.V. Fluid handling system, method and lithographic apparatus
EP4252072A1 (en) 2020-11-25 2023-10-04 ASML Netherlands B.V. A fluid handling system, method and lithographic apparatus
JP2024500207A (en) 2020-12-23 2024-01-05 エーエスエムエル ネザーランズ ビー．ブイ． Fluid handling systems, methods and lithographic apparatus
CN117178232A (en) 2021-04-15 2023-12-05 Asml荷兰有限公司 Fluid handling systems, methods, and lithography apparatus
CN117413225A (en) 2021-06-07 2024-01-16 Asml荷兰有限公司 Methods and apparatus for determining thermally induced deformation
US20240192608A1 (en) 2021-06-25 2024-06-13 Asml Netherlands B.V. An inspection tool, method and lithographic apparatus
EP4120019A1 (en) 2021-07-12 2023-01-18 ASML Netherlands B.V. Method of determining a correction for at least one control parameter in a semiconductor manufacturing process
EP4167029A1 (en) 2021-10-14 2023-04-19 ASML Netherlands B.V. A fluid extraction system, method and lithographic apparatus
US20250068085A1 (en) 2022-01-31 2025-02-27 Asml Netherlands B.V. Substrate table, lithographic apparatus, sticker, cover ring and method of operating a lithographic apparatus
KR20250022695A (en) 2022-06-15 2025-02-17 에이에스엠엘 네델란즈 비.브이. Substrate support and lithography apparatus
JP2025521408A (en) 2022-07-07 2025-07-10 エーエスエムエル ネザーランズ ビー．ブイ． Substrate holding system and lithographic apparatus
WO2024008367A1 (en) 2022-07-07 2024-01-11 Asml Netherlands B.V. A fluid handling system, method and lithographic apparatus
EP4573412A1 (en) 2022-08-19 2025-06-25 ASML Netherlands B.V. A conditioning system, arrangement and method
JP2025532903A (en) 2022-10-12 2025-10-03 エーエスエムエル ネザーランズ ビー．ブイ． Board Support Qualification
EP4617355A1 (en) * 2022-11-08 2025-09-17 MGI Tech Co., Ltd. Liquid feeding and discharging device and method, immersion objective system, gene sequencer, and biochemical detection method
EP4616252A1 (en) 2022-11-11 2025-09-17 ASML Netherlands B.V. Substrate support and lithographic apparatus
WO2024115207A1 (en) 2022-12-02 2024-06-06 Asml Netherlands B.V. A fluid handling system, method and lithographic apparatus
JP2026501995A (en) 2022-12-27 2026-01-20 エーエスエムエル ネザーランズ ビー．ブイ． Fluid handling systems and methods
JP2026502449A (en) 2023-01-12 2026-01-23 エーエスエムエル ネザーランズ ビー．ブイ． THERMAL CONDITIONING SYSTEM AND LITHOGRAPHIC APPARATUS - Patent application
CN120548511A (en) 2023-02-07 2025-08-26 Asml荷兰有限公司 Photolithography equipment and method for controlling substrate support
CN120660046A (en) 2023-02-10 2025-09-16 Asml荷兰有限公司 System for changing shape of substrate
EP4666131A1 (en) 2023-02-13 2025-12-24 ASML Netherlands B.V. Gas supply module, fluid handling system, lithographic apparatus and device manufacturing method
KR20250153200A (en) 2023-02-21 2025-10-24 에이에스엠엘 네델란즈 비.브이. A fluid handling system and method capable of reducing defects caused by liquid remaining on a substrate, and a lithography apparatus including the fluid handling system
CN120826649A (en) 2023-03-07 2025-10-21 Asml荷兰有限公司 Substrate holder, substrate support, lithography apparatus and method
CN120898168A (en) 2023-03-09 2025-11-04 Asml荷兰有限公司 Fluid processing structure
CN121002449A (en) 2023-03-13 2025-11-21 Asml荷兰有限公司 Substrate support and photolithography equipment
WO2024208512A1 (en) 2023-04-04 2024-10-10 Asml Netherlands B.V. Fluid handling system and method, and method of manufacturing devices
EP4689795A1 (en) 2023-04-05 2026-02-11 ASML Netherlands B.V. Cover ring, substrate support and lithographic apparatus
CN121039571A (en) 2023-04-26 2025-11-28 Asml荷兰有限公司 Photolithography apparatus with fluid handling structure
CN121219642A (en) 2023-06-06 2025-12-26 Asml荷兰有限公司 Heater assembly, substrate support and photolithography equipment
CN121399543A (en) 2023-06-19 2026-01-23 Asml荷兰有限公司 Substrate support
WO2025016613A1 (en) 2023-07-17 2025-01-23 Asml Netherlands B.V. Fluid handling structure, lithographic apparatus, method of controlling a fluid handling structure, method of controlling a lithographic apparatus and method of manufacturing a semiconductor device
EP4521181A1 (en) 2023-09-11 2025-03-12 ASML Netherlands B.V. Method for determining root causes of events of a semiconductor manufacturing process and for monitoring a semiconductor manufacturing process
WO2025078098A1 (en) 2023-10-12 2025-04-17 Asml Netherlands B.V. Method of monitoring performance, method of manufacturing devices, computer program and lithographic apparatus
WO2025078097A1 (en) 2023-10-12 2025-04-17 Asml Netherlands B.V. Surface member
WO2025082673A1 (en) 2023-10-18 2025-04-24 Asml Netherlands B.V. Surface member
WO2025119553A1 (en) 2023-12-04 2025-06-12 Asml Netherlands B.V. Fluid handling structure
WO2025153279A2 (en) 2024-01-18 2025-07-24 Asml Netherlands B.V. Method of determining operational data, computer program and lithographic apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57153433A (en) * 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS6265326A (en) * 1985-09-18 1987-03-24 Hitachi Ltd Exposure device
JPH06124873A (en) * 1992-10-09 1994-05-06 Canon Inc Immersion projection exposure system
JPH07220990A (en) * 1994-01-28 1995-08-18 Hitachi Ltd Pattern forming method and exposure apparatus thereof
JPH10255319A (en) * 1997-03-12 1998-09-25 Hitachi Maxell Ltd Master exposure apparatus and method
JP3747566B2 (en) * 1997-04-23 2006-02-22 株式会社ニコン Immersion exposure equipment
JP3817836B2 (en) * 1997-06-10 2006-09-06 株式会社ニコン EXPOSURE APPARATUS, ITS MANUFACTURING METHOD, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101332543B1 (en) * 2003-10-22 2013-11-25 가부시키가이샤 니콘 Exposure apparatus, exposure method, and method for manufacturing device
US7580111B2 (en) 2004-05-21 2009-08-25 Jsr Corporation Liquid for immersion exposure and immersion exposure method

Also Published As

Publication number Publication date
WO1999049504A1 (en) 1999-09-30

Similar Documents

Publication Publication Date Title
AU2747999A (en) Projection exposure method and system
AU1505699A (en) Projection exposure method and projection aligner
AU1175799A (en) Projection aligner and projection exposure method
AU4653999A (en) Exposure method and system
AU9648198A (en) Aligner and exposure method
AU2747899A (en) Photomask and projection exposure system
AU1179200A (en) Exposure method and device
AU1078700A (en) Exposure method and exposure apparatus
AU2076099A (en) Exposure method and device
AU7857300A (en) Method and system for developing software
AU1260099A (en) Projection exposure system
AU1108100A (en) System and method for positioning teeth
AU1051999A (en) Projection exposure apparatus
AU6365499A (en) Stage device, exposure system, method of device manufacture, and device
AU1233200A (en) Photoresists and processes for microlithography
AU3534299A (en) Exposure method and exposure system
AUPO615297A0 (en) Imaging system and method
AU4930099A (en) Illuminator and projection exposure apparatus
AU1689899A (en) Exposure method and exposure apparatus
AU1890999A (en) Exposure system, exposure apparatus, and coating developing exposure apparatus
GB2311650B (en) Charged-beam exposure system and charged-beam exposure method
AU8357398A (en) Exposure method and aligner
AU9762398A (en) Exposure apparatus
AU4061099A (en) Exposure method and exposure apparatus
AU9458198A (en) Projection exposure method and apparatus

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase