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TW200824489A - Light-emitting device and electronic apparatus - Google Patents

Light-emitting device and electronic apparatus Download PDF

Info

Publication number
TW200824489A
TW200824489A TW096136639A TW96136639A TW200824489A TW 200824489 A TW200824489 A TW 200824489A TW 096136639 A TW096136639 A TW 096136639A TW 96136639 A TW96136639 A TW 96136639A TW 200824489 A TW200824489 A TW 200824489A
Authority
TW
Taiwan
Prior art keywords
film
light
substrate
layer
insulating film
Prior art date
Application number
TW096136639A
Other languages
English (en)
Chinese (zh)
Inventor
Takehiko Kubota
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200824489A publication Critical patent/TW200824489A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/10—Applying interconnections to be used for carrying current between separate components within a device
    • H01L2221/1068—Formation and after-treatment of conductors
    • H01L2221/1073—Barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW096136639A 2006-10-03 2007-09-29 Light-emitting device and electronic apparatus TW200824489A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006271575A JP4245032B2 (ja) 2006-10-03 2006-10-03 発光装置および電子機器

Publications (1)

Publication Number Publication Date
TW200824489A true TW200824489A (en) 2008-06-01

Family

ID=39260455

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096136639A TW200824489A (en) 2006-10-03 2007-09-29 Light-emitting device and electronic apparatus

Country Status (5)

Country Link
US (1) US7902755B2 (ja)
JP (1) JP4245032B2 (ja)
KR (1) KR101376130B1 (ja)
CN (1) CN101160001B (ja)
TW (1) TW200824489A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9847505B2 (en) 2014-10-17 2017-12-19 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, module, electronic device, and method for manufacturing light-emitting device
US9917282B2 (en) 2015-07-30 2018-03-13 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of light-emitting device, light-emitting device, module, and electronic device

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US20090191342A1 (en) * 1999-10-25 2009-07-30 Vitex Systems, Inc. Method for edge sealing barrier films
CN101866585B (zh) * 2010-04-13 2012-06-20 深圳市锐拓显示技术有限公司 一种led显示屏用气压平衡器
KR101886801B1 (ko) 2010-09-14 2018-08-10 삼성디스플레이 주식회사 터치 스크린 패널 일체형 평판표시장치
JP2012248743A (ja) * 2011-05-30 2012-12-13 Japan Display West Co Ltd 半導体装置およびその製造方法、表示装置ならびに電子機器
JP2013016371A (ja) * 2011-07-05 2013-01-24 Seiko Epson Corp 電気光学装置および電子機器
CN104067692A (zh) * 2012-01-23 2014-09-24 株式会社爱发科 元件结构体以及元件结构体的制造方法
CN102903732A (zh) * 2012-10-12 2013-01-30 深圳市华星光电技术有限公司 有机发光二极管器件及相应的显示装置
KR101980234B1 (ko) * 2012-10-30 2019-05-21 삼성디스플레이 주식회사 유기 발광 표시 장치와, 이의 제조 방법
KR102050434B1 (ko) * 2012-10-31 2019-11-29 엘지디스플레이 주식회사 플렉서블 유기전계 발광소자 및 그 제조방법
KR102048926B1 (ko) * 2012-11-19 2019-11-27 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
JP6077279B2 (ja) * 2012-11-20 2017-02-08 株式会社ジャパンディスプレイ 表示装置
KR101473309B1 (ko) 2012-11-29 2014-12-16 삼성디스플레이 주식회사 표시 장치 및 유기 발광 표시 장치
JP6267449B2 (ja) * 2013-03-15 2018-01-24 東京エレクトロン株式会社 有機デバイスの製造方法及び有機デバイスの製造装置
KR102034253B1 (ko) 2013-04-12 2019-10-21 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
KR102117612B1 (ko) 2013-08-28 2020-06-02 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
JP2015060020A (ja) * 2013-09-18 2015-03-30 ソニー株式会社 表示装置及び電子機器
KR102218573B1 (ko) 2013-09-30 2021-02-23 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
TW201513334A (zh) * 2013-09-30 2015-04-01 Au Optronics Corp 電激發光顯示面板
WO2015136670A1 (ja) * 2014-03-13 2015-09-17 パイオニア株式会社 発光装置
JP6300231B2 (ja) 2014-06-25 2018-03-28 パナソニック株式会社 有機ｅｌ素子
US9853234B2 (en) 2014-07-30 2017-12-26 Panasonic Intellectual Property Management Co., Ltd. Organic EL device and method for producing the same
KR101667800B1 (ko) * 2014-08-29 2016-10-20 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
KR102295614B1 (ko) * 2014-09-29 2021-08-27 엘지디스플레이 주식회사 유기 발광 표시 장치
KR102317715B1 (ko) * 2014-09-30 2021-10-25 엘지디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP2016115444A (ja) * 2014-12-11 2016-06-23 ソニー株式会社 表示装置および電子機器
JP6412791B2 (ja) * 2014-12-18 2018-10-24 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置
CN105206620B (zh) * 2015-08-27 2017-02-15 京东方科技集团股份有限公司 一种薄膜封装结构及其制备方法、显示装置
KR102427249B1 (ko) 2015-10-16 2022-08-01 삼성디스플레이 주식회사 디스플레이 장치
KR102407569B1 (ko) * 2015-10-31 2022-06-10 엘지디스플레이 주식회사 유기발광 표시장치
KR102446425B1 (ko) * 2015-11-17 2022-09-23 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
KR102509079B1 (ko) * 2015-11-30 2023-03-09 엘지디스플레이 주식회사 유기 발광 표시 장치
TWI604598B (zh) * 2016-02-04 2017-11-01 Au Optronics Corp 顯示器以及顯示器的製造方法
KR102407869B1 (ko) 2016-02-16 2022-06-13 삼성디스플레이 주식회사 유기 발광 디스플레이 장치와, 이의 제조 방법
KR102451726B1 (ko) 2016-03-28 2022-10-07 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP2018036896A (ja) * 2016-08-31 2018-03-08 株式会社ジャパンディスプレイ タッチセンサ及び表示装置
KR20180060851A (ko) * 2016-11-29 2018-06-07 엘지디스플레이 주식회사 유기 발광 표시 장치
KR102354925B1 (ko) * 2017-06-14 2022-01-21 엘지디스플레이 주식회사 표시장치와 그의 제조방법
KR102583813B1 (ko) * 2017-12-13 2023-09-26 엘지디스플레이 주식회사 디스플레이 장치
CN108986667B (zh) * 2018-08-24 2020-12-04 武汉天马微电子有限公司 一种显示面板及其驱动方法、显示装置
CN109243305B (zh) * 2018-09-17 2021-10-12 京东方科技集团股份有限公司 显示面板、显示装置和显示面板的制造方法
CN110970462B (zh) * 2018-09-29 2022-10-14 京东方科技集团股份有限公司 显示基板及其制造方法、显示装置
US11239445B2 (en) * 2019-03-11 2022-02-01 Boe Technology Group Co., Ltd. Display substrate with power pad in peripheral area and method of manufacturing thereof
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9847505B2 (en) 2014-10-17 2017-12-19 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, module, electronic device, and method for manufacturing light-emitting device
US10270057B2 (en) 2014-10-17 2019-04-23 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, module, electronic device, and method for manufacturing light-emitting device
US10629843B2 (en) 2014-10-17 2020-04-21 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, module, electronic device, and method for manufacturing light-emitting device
US11189817B2 (en) 2014-10-17 2021-11-30 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, module, electronic device, and method for manufacturing light-emitting device
US11778850B2 (en) 2014-10-17 2023-10-03 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, module, electronic device, and method for manufacturing light-emitting device
US9917282B2 (en) 2015-07-30 2018-03-13 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of light-emitting device, light-emitting device, module, and electronic device
US10135037B2 (en) 2015-07-30 2018-11-20 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of light-emitting device, light-emitting device, module, and electronic device
US10804503B2 (en) 2015-07-30 2020-10-13 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of light-emitting device, light-emitting device, module, and electronic device
US11411208B2 (en) 2015-07-30 2022-08-09 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of light-emitting device, light-emitting device, module, and electronic device

Also Published As

Publication number Publication date
CN101160001B (zh) 2011-08-31
KR20080031115A (ko) 2008-04-08
US7902755B2 (en) 2011-03-08
JP2008091237A (ja) 2008-04-17
CN101160001A (zh) 2008-04-09
KR101376130B1 (ko) 2014-03-19
US20080079360A1 (en) 2008-04-03
JP4245032B2 (ja) 2009-03-25

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