LM1881 Video Sync Separator: 1 Features 3 Description
LM1881 Video Sync Separator: 1 Features 3 Description
LM1881 Video Sync Separator: 1 Features 3 Description
LM1881
SNLS384G – FEBRUARY 1995 – REVISED JUNE 2015
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM1881
SNLS384G – FEBRUARY 1995 – REVISED JUNE 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.2 Functional Block Diagram ......................................... 6
2 Applications ........................................................... 1 7.3 Feature Description................................................... 7
3 Description ............................................................. 1 7.4 Device Functional Modes........................................ 10
4 Revision History..................................................... 2 8 Application and Implementation ........................ 11
8.1 Application Information............................................ 11
5 Pin Configuration and Functions ......................... 3
8.2 Typical Applications ................................................ 11
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3 9 Power Supply Recommendations...................... 13
6.2 ESD Ratings.............................................................. 4 10 Device and Documentation Support ................. 14
6.3 Recommended Operating Conditions....................... 4 10.1 Community Resources.......................................... 14
6.4 Electrical Characteristics LM1881............................. 4 10.2 Trademarks ........................................................... 14
6.5 Dissipation Ratings ................................................... 4 10.3 Electrostatic Discharge Caution ............................ 14
6.6 Typical Characteristics .............................................. 5 10.4 Glossary ................................................................ 14
7 Detailed Description .............................................. 6 11 Mechanical, Packaging, and Orderable
7.1 Overview ................................................................... 6
Information ........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
D and P Packages
8-Pin SOIC and PDIP
Top View
Pin Functions
PIN
TYPE DESCRIPTION
NO. NAME
1 CSOUT Output Composite Sync Output
2 CVIN Input Composite Video Input
3 VSOUT Output Vertical Sync Output
4 GND — Ground
5 BPOUT Output Burst or Back Porch Timing Output
6 RSET Input Charge Current External Resistor
7 OEOUT Output Odd and Even Field Output
8 VCC Input Supply Voltage
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
Supply Voltage 13.2 V
Input Voltage 3 VP-P 6 VP-P
V
(VCC = 5) (VCC ≥ 8)
Output Sink Currents; Pins, 1, 3, 5 5 mA
Output Sink Current; Pin 7 2 mA
PDIP Package (10 sec.) 260
Soldering Information Vapor Phase (60 sec.) 215 °C
SOIC Package
Infrared (15 sec.) 220
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1) Typicals are at TJ = 25°C and represent the most likely parametric norm.
(2) Relative difference between the input clamp voltage and the minimum input voltage which produces a horizontal output pulse.
(3) Careful attention should be made to prevent parasitic capacitance coupling from any output pin (Pins 1, 3, 5 and 7) to the RSET pin (Pin
6).
(4) Delay time between the start of vertical sync (at input) and the vertical output pulse.
(1) For operation in ambient temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a
package thermal resistance of 110°C/W, junction to ambient.
Figure 1. RSET Value Selection vs Vertical Serration Pulse Figure 2. Vertical Default Sync Delay Time vs RSET
Separation
Figure 3. Burst or Black Level Gate Time vs RSET Figure 4. Vertical Pulse Width vs RSET
500
VERTICAL PULSE WIDTH (Ps)
400
300
200
100
-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
Figure 5. Vertical Pulse Width vs Temperature Figure 6. Supply Current vs Supply Voltage
7 Detailed Description
7.1 Overview
The LM1881 is designed to strip the synchronization signals from composite video sources that are in, or similar
to, the N.T.S.C. format. Input signals with positive polarity video (increasing signal voltage signifies increasing
scene brightness) from 0.5 V (p-p) to 2 V (p-p) can be accommodated. The LM1881 operates from a single
supply voltage between 5-V DC and 12-V DC. The only required external components besides a power supply
decoupling capacitor at pin 8 and a set current decoupling capacitor at pin 6, are the composite input coupling
capacitor at pin 2 and one resistor at pin 6 that sets internal current levels. The resistor on pin 6 (that is, Rset)
allows the LM1881 to be adjusted for source signals with line scan frequencies differing from 15.734 kHz. Four
major sync signals are available from the I/C; composite sync including both horizontal and vertical scan timing
information; a vertical sync pulse; a burst gate or back porch clamp pulse; and an odd and even output. The odd
and even output level identifies which video field of an interlaced video source is present at the input. The
outputs from the LM1881 can be used to gen-lock video camera/VTR signals with graphics sources, provide
identification of video fields for memory storage, recover suppressed or contaminated sync signals, and provide
timing references for the extraction of coded or uncoded data on specific video scan lines.
To better understand the LM1881 timing information and the type of signals that are used, refer to Figure 7(a-e)
which shows a portion of the composite video signal from the end of one field through the beginning of the next
field.
Figure 7. (a) Composite Video; (b) Composite Sync; (c) Vertical Output Pulse;
(d) Odd and Even Field Index; (e) Burst Gate or Back Porch Clamp
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
Figure 9. Multiple Contiguous Video Line Selector With Black Level Restoration
10.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
10.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
10.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 18-May-2015
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
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