KR101012042B1 - 전조등 광원용 led 램프 - Google Patents
전조등 광원용 led 램프 Download PDFInfo
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- KR101012042B1 KR101012042B1 KR1020030079396A KR20030079396A KR101012042B1 KR 101012042 B1 KR101012042 B1 KR 101012042B1 KR 1020030079396 A KR1020030079396 A KR 1020030079396A KR 20030079396 A KR20030079396 A KR 20030079396A KR 101012042 B1 KR101012042 B1 KR 101012042B1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/16—Laser light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/40—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by screens, non-reflecting members, light-shielding members or fixed shades
- F21S41/43—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by screens, non-reflecting members, light-shielding members or fixed shades characterised by the shape thereof
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H—ELECTRICITY
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H—ELECTRICITY
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (14)
- 단색발광의 LED 발광부와;상기 LED 발광부로부터의 광을 투영하는 투영수단과,상기 LED 발광부의 일부를 덮는 차폐부재를 구비하며,상기 차폐부재는 상기 LED 발광부로부터의 광을 상기 투영수단에 의해 조사방향으로 확대투영할 때, 상기 LED 발광부의 상기 차폐부재로 덮여지지 않는 부분의 형상이 명암경계선을 가지는 차량용 전조등에 적합한 배광특성이 얻어지는 형상으로 되고,상기 LED 발광부와 상기 차폐부재 중 적어도 하나는 상기 투영수단의 초점근방에 배치되는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 1 항에 있어서,상기 LED 발광부는 LED 칩과 형광체로 이루어진 백색 LED 발광부와 LED 칩 중 하나인 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 1 항에 있어서,상기 LED 발광부와 상기 차폐부재는 둘 다 상기 투영수단의 초점근방에 설치되는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 3 항에 있어서,상기 차폐부재는 상기 LED 발광부로부터 2㎜ 이하의 간격을 두고 설치되어 있는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,상기 차폐부재에서 상기 LED 발광부와 마주보는 측의 면에는 경면처리가 되어 있는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 5 항에 있어서,상기 차폐부재의 경면처리가 되어 있는 면의 반대측 면은 무반사 처리가 되어 있는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 5 항에 있어서,경면처리가 되어 있는 측의 상기 차폐부재의 면은, 상기 LED 발광부의 차폐가 이루어져 있지 않은 방향을 향하여 광을 반사하는 경사가 형성되어 있는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,상기 차폐부재는 상기 LED 발광부에서 최고휘도를 발생하는 부분 또는 그 근방에서 상기 LED 발광부를 차폐하는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 2 항에 있어서,상기 LED 발광부가 LED 칩이고, 상기 LED 발광부와 상기 차폐부재의 사이에 는 파장변환부재가 설치되어 있는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,상기 차폐부재는 상기 LED 발광부를 덮는 렌즈 부재 혹은 창유리 부재와 일체화하여 형성되어 있는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,상기 차폐부재를 소정 두께로 함으로써 색수차를 방지하는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 1 항 내지 제 3 항 중 어느 한 항에 있어서,상기 차폐부재는 적어도 2장의 얇은 차폐판으로 구성되고 차폐판들은 서로 소정 간격을 두어 설치됨으로써 색수차를 방지하는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 초점을 가지는 투영수단의 상기 초점 근방에 배치된 LED 발광부, 및 상기 LED 발광부의 일부를 덮는 차폐부재의 쌍을 복수개 구비하며, 각각의 상기 LED 발광부로부터의 광을 상기 투영수단에 의해 조사방향으로 확대투영할 때 각각의 상기 LED 발광부로부터의 배광을 중합한 것이 차량용 전조등에 적합한 배광이 되도록 각각의 상기 LED 발광부의 상기 차폐부재로 덮여지지 않는 부분의 형상이 상기 차량용 전조등의 명암경계선을 갖는 배광특성의 조합의 일부를 구성하는 형상으로 되어 각각의 상기 차폐부재가 대응하는 각각의 상기 LED 발광부의 일부를 덮는 것을 특징으로 하는 전조등 발광원 LED 램프.
- 제 13 항에 있어서,상기 LED 발광부는 LED 칩과 형광체로 이루어진 백색 LED 발광부와 LED 칩 중 하나인 것을 특징으로 하는 전조등 발광원 LED 램프.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003169182A JP4138586B2 (ja) | 2003-06-13 | 2003-06-13 | 光源用ledランプおよびこれを用いた車両用前照灯 |
JPJP-P-2003-00169182 | 2003-06-13 |
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KR20040107348A KR20040107348A (ko) | 2004-12-20 |
KR101012042B1 true KR101012042B1 (ko) | 2011-01-31 |
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KR1020030079396A Expired - Fee Related KR101012042B1 (ko) | 2003-06-13 | 2003-11-11 | 전조등 광원용 led 램프 |
Country Status (5)
Country | Link |
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US (4) | US7019334B2 (ko) |
EP (1) | EP1487025B1 (ko) |
JP (1) | JP4138586B2 (ko) |
KR (1) | KR101012042B1 (ko) |
CN (1) | CN100413100C (ko) |
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JP4047185B2 (ja) * | 2003-02-06 | 2008-02-13 | 株式会社小糸製作所 | 車両用前照灯及び発光モジュール |
JP4138586B2 (ja) * | 2003-06-13 | 2008-08-27 | スタンレー電気株式会社 | 光源用ledランプおよびこれを用いた車両用前照灯 |
JP4024721B2 (ja) * | 2003-06-20 | 2007-12-19 | 株式会社小糸製作所 | 車両用灯具及び光源モジュール |
JP4037337B2 (ja) * | 2003-07-24 | 2008-01-23 | 株式会社小糸製作所 | 灯具ユニットおよび車両用前照灯 |
JP4314911B2 (ja) * | 2003-08-20 | 2009-08-19 | スタンレー電気株式会社 | 車両前照灯 |
JP4140042B2 (ja) * | 2003-09-17 | 2008-08-27 | スタンレー電気株式会社 | 蛍光体を用いたled光源装置及びled光源装置を用いた車両前照灯 |
JP4402425B2 (ja) * | 2003-10-24 | 2010-01-20 | スタンレー電気株式会社 | 車両前照灯 |
FR2862424B1 (fr) * | 2003-11-18 | 2006-10-20 | Valeo Electronique Sys Liaison | Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif |
TW200522387A (en) * | 2003-12-26 | 2005-07-01 | Ind Tech Res Inst | High-power LED planarization encapsulation structure |
JP4360945B2 (ja) * | 2004-03-10 | 2009-11-11 | シチズン電子株式会社 | 照明装置 |
JP4359195B2 (ja) * | 2004-06-11 | 2009-11-04 | 株式会社東芝 | 半導体発光装置及びその製造方法並びに半導体発光ユニット |
EP1774598B1 (en) * | 2004-06-30 | 2011-09-14 | Cree, Inc. | Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices |
JP4599111B2 (ja) * | 2004-07-30 | 2010-12-15 | スタンレー電気株式会社 | 灯具光源用ledランプ |
JP2006156668A (ja) * | 2004-11-29 | 2006-06-15 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
DE102004060475A1 (de) * | 2004-12-16 | 2006-07-06 | Hella Kgaa Hueck & Co. | Scheinwerfer für Fahrzeuge |
KR100631901B1 (ko) * | 2005-01-31 | 2006-10-11 | 삼성전기주식회사 | Led 패키지 프레임 및 이를 채용하는 led 패키지 |
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JP4024721B2 (ja) * | 2003-06-20 | 2007-12-19 | 株式会社小糸製作所 | 車両用灯具及び光源モジュール |
JP2005044698A (ja) * | 2003-07-24 | 2005-02-17 | Koito Mfg Co Ltd | 車両用灯具及び光源モジュール |
JP4314911B2 (ja) * | 2003-08-20 | 2009-08-19 | スタンレー電気株式会社 | 車両前照灯 |
EP1515368B1 (en) * | 2003-09-05 | 2019-12-25 | Nichia Corporation | Light equipment |
-
2003
- 2003-06-13 JP JP2003169182A patent/JP4138586B2/ja not_active Expired - Fee Related
- 2003-09-16 US US10/662,374 patent/US7019334B2/en not_active Expired - Lifetime
- 2003-09-23 EP EP03021470.4A patent/EP1487025B1/en not_active Expired - Lifetime
- 2003-11-11 KR KR1020030079396A patent/KR101012042B1/ko not_active Expired - Fee Related
- 2003-12-05 CN CNB2003101169894A patent/CN100413100C/zh not_active Expired - Fee Related
-
2005
- 2005-11-22 US US11/283,932 patent/US7312477B2/en not_active Expired - Fee Related
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2007
- 2007-12-24 US US11/964,003 patent/US7622748B2/en not_active Expired - Fee Related
-
2009
- 2009-11-23 US US12/624,391 patent/US8093613B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001085777A (ja) | 1999-09-09 | 2001-03-30 | Toshiba Corp | 光半導体装置 |
US20010019486A1 (en) | 2000-03-01 | 2001-09-06 | Vincent Thominet | Illumination device for vehicle |
JP2002094127A (ja) | 2000-09-20 | 2002-03-29 | Sunx Ltd | 投光素子及び反射型光電センサ |
Also Published As
Publication number | Publication date |
---|---|
EP1487025B1 (en) | 2017-01-25 |
US7622748B2 (en) | 2009-11-24 |
US20060071222A1 (en) | 2006-04-06 |
CN1574402A (zh) | 2005-02-02 |
KR20040107348A (ko) | 2004-12-20 |
US7312477B2 (en) | 2007-12-25 |
JP4138586B2 (ja) | 2008-08-27 |
JP2005005193A (ja) | 2005-01-06 |
EP1487025A3 (en) | 2006-03-01 |
US20040251469A1 (en) | 2004-12-16 |
CN100413100C (zh) | 2008-08-20 |
US7019334B2 (en) | 2006-03-28 |
US20100073951A1 (en) | 2010-03-25 |
EP1487025A2 (en) | 2004-12-15 |
US8093613B2 (en) | 2012-01-10 |
US20080117646A1 (en) | 2008-05-22 |
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