JP5216362B2 - Led光源ユニット - Google Patents
Led光源ユニット Download PDFInfo
- Publication number
- JP5216362B2 JP5216362B2 JP2008038988A JP2008038988A JP5216362B2 JP 5216362 B2 JP5216362 B2 JP 5216362B2 JP 2008038988 A JP2008038988 A JP 2008038988A JP 2008038988 A JP2008038988 A JP 2008038988A JP 5216362 B2 JP5216362 B2 JP 5216362B2
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- Prior art keywords
- light
- led light
- led
- shielding electrode
- emitting
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000009826 distribution Methods 0.000 claims description 37
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/40—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by screens, non-reflecting members, light-shielding members or fixed shades
- F21S41/43—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by screens, non-reflecting members, light-shielding members or fixed shades characterised by the shape thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
- F21W2102/10—Arrangement or contour of the emitted light
- F21W2102/13—Arrangement or contour of the emitted light for high-beam region or low-beam region
- F21W2102/135—Arrangement or contour of the emitted light for high-beam region or low-beam region the light having cut-off lines, i.e. clear borderlines between emitted regions and dark regions
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
- F21W2102/30—Fog lights
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
2…LEDチップ
2a…半導体層
2b…金属層
2c…不透明基板
2d…裏面電極
2e…反射層
2f…絶縁層
3…電極
3a…ボンディング用パッド
3b…配分電極
3c…遮光電極
3d…スリット
4…金ワイヤ
5…蛍光剤
6…基板
7…エポキシ樹脂
Claims (5)
- 基板上にマウントした複数のLED発光素子の発光面に、配分電極と、不透光性であり、それぞれが所望の配光特性の一部を構成する遮光電極を設けた車両用灯具用のLED光源ユニットであって、
各LED発光素子において、配光特性の形状を形成する発光部と前記遮光電極の境界部で前記発光面を構成する半導体層と前記遮光電極は密着しており、前記遮光電極と前記半導体層の間の前記境界部を除いた部分では非導電性部材による絶縁層が前記半導体層と前記遮光電極の間に設けられ、
前記遮光電極に溶接される給電用リードワイヤーは、当該遮光電極の前記発光部の近傍となる部分に配置され、
前記基板上には前記LED発光素子が隣接して並べて配列され、それぞれのLED発光素子の前記発光部と前記遮光電極の境界部が、隣接する他のLED発光素子の境界部と直線となるようにそれぞれのLED発光素子の遮光電極が隣り合って配置されており、
前記複数のLED発光素子を所定の順序に並べて投影することで、前記遮光電極に覆われない部分である発光部からの光の総合により所望の明暗の境界線が生じる配光特性が得られるものとしたことを特徴とする車両用灯具用のLED光源ユニット。 - 前記LED発光素子の、前記遮光電極に覆われない部分には、波長変換層が設けられていることを特徴とする請求項1記載の車両用灯具用のLED光源ユニット。
- 前記遮光電極には前記発光部に沿うスリットが設けられていることを特徴とする請求項1又は請求項2に記載の車両用灯具用のLED光源ユニット。
- 前記配光特性が、車両のヘッドライトにおけるすれ違い配光であって、
前記複数のLED発光素子のうち対向車線側のLED発光素子において、前記遮光電極は、正面視において、水平の上半部に設けられ、
前記複数のLED発光素子のうち対向車線側と反対側のLED発光素子において、左15°上がりの直線として形成されていることを特徴とする請求項1〜請求項3の何れかに記載の車両用灯具用のLED光源ユニット。 - 請求項1〜請求項4の何れかに記載のLED光源ユニットと、当該LED光源ユニットからの照射光を投影する非球面レンズを含み、前記非球面レンズの焦点が前記LED発光素子上にあることを特徴とする車両用灯具。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008038988A JP5216362B2 (ja) | 2008-02-20 | 2008-02-20 | Led光源ユニット |
US12/372,831 US8142060B2 (en) | 2008-02-20 | 2009-02-18 | Light source and vehicle lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008038988A JP5216362B2 (ja) | 2008-02-20 | 2008-02-20 | Led光源ユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009199824A JP2009199824A (ja) | 2009-09-03 |
JP5216362B2 true JP5216362B2 (ja) | 2013-06-19 |
Family
ID=41116932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008038988A Expired - Fee Related JP5216362B2 (ja) | 2008-02-20 | 2008-02-20 | Led光源ユニット |
Country Status (2)
Country | Link |
---|---|
US (1) | US8142060B2 (ja) |
JP (1) | JP5216362B2 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008025397A1 (de) * | 2008-05-28 | 2009-12-24 | Osram Gesellschaft mit beschränkter Haftung | Fahrzeugbeleuchtungsvorrichtung mit mindestens zwei Halbleiter-Leuchtelementen |
JP5518533B2 (ja) * | 2010-03-12 | 2014-06-11 | 株式会社小糸製作所 | 車両用前照灯および車両用前照灯用の発光モジュール |
JP5605626B2 (ja) * | 2010-09-08 | 2014-10-15 | スタンレー電気株式会社 | 車両用灯具 |
JP5694817B2 (ja) * | 2011-03-08 | 2015-04-01 | スタンレー電気株式会社 | 発光装置及びその製造方法 |
JPWO2012144126A1 (ja) | 2011-04-20 | 2014-07-28 | パナソニック株式会社 | 光源、バックライトユニット、液晶表示装置及び照明装置 |
DE102012221908A1 (de) * | 2012-11-29 | 2014-06-05 | Osram Gmbh | Leuchtmodul für eine Fahrzeug-Leuchtvorrichtung mit Halbleiterlichtquelle |
EP3417203B1 (en) | 2016-02-23 | 2020-12-16 | MLS Automotive, Inc. | Vehicle lighting assembly and method for achieving yellow colored turn signals |
DE102018107213A1 (de) * | 2018-03-27 | 2019-10-02 | HELLA GmbH & Co. KGaA | Beleuchtungsvorrichtung für Fahrzeuge |
FR3085739B1 (fr) * | 2018-09-12 | 2021-06-25 | Valeo Vision | Module lumineux pour projecteur de vehicule automobile |
CN109584740A (zh) * | 2019-01-30 | 2019-04-05 | 华域视觉科技(上海)有限公司 | 车灯显屏 |
CN217131136U (zh) * | 2021-09-23 | 2022-08-05 | 法雷奥照明湖北技术中心有限公司 | 一种照明装置和机动车辆 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03100890U (ja) * | 1990-01-31 | 1991-10-22 | ||
CA2257156A1 (en) * | 1996-06-05 | 1997-12-11 | Sarnoff Corporation | Light emitting semiconductor device |
US6335548B1 (en) * | 1999-03-15 | 2002-01-01 | Gentex Corporation | Semiconductor radiation emitter package |
JP2003197109A (ja) * | 2001-12-25 | 2003-07-11 | Mitsubishi Electric Corp | 放電表示装置 |
US6958498B2 (en) * | 2002-09-27 | 2005-10-25 | Emcore Corporation | Optimized contact design for flip-chip LED |
JP3993088B2 (ja) * | 2002-12-26 | 2007-10-17 | 富士フイルム株式会社 | 透過型電気機械式光スイッチ素子とそのスイッチアレイ |
JP4138586B2 (ja) * | 2003-06-13 | 2008-08-27 | スタンレー電気株式会社 | 光源用ledランプおよびこれを用いた車両用前照灯 |
JP4432414B2 (ja) | 2003-09-05 | 2010-03-17 | 日亜化学工業株式会社 | 光源装置及び車両用前照灯 |
JP4806889B2 (ja) | 2003-09-05 | 2011-11-02 | 日亜化学工業株式会社 | 光源装置及び照明装置 |
JP4140042B2 (ja) * | 2003-09-17 | 2008-08-27 | スタンレー電気株式会社 | 蛍光体を用いたled光源装置及びled光源装置を用いた車両前照灯 |
JP2005183327A (ja) * | 2003-12-24 | 2005-07-07 | Stanley Electric Co Ltd | 車両前照灯 |
JP4536483B2 (ja) * | 2004-10-27 | 2010-09-01 | 株式会社小糸製作所 | 車両用照明灯具 |
JP4823866B2 (ja) * | 2006-11-13 | 2011-11-24 | 株式会社小糸製作所 | 車両用灯具の発光モジュール |
-
2008
- 2008-02-20 JP JP2008038988A patent/JP5216362B2/ja not_active Expired - Fee Related
-
2009
- 2009-02-18 US US12/372,831 patent/US8142060B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20090244921A1 (en) | 2009-10-01 |
US8142060B2 (en) | 2012-03-27 |
JP2009199824A (ja) | 2009-09-03 |
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