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FR2862424B1 - Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif - Google Patents

Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif

Info

Publication number
FR2862424B1
FR2862424B1 FR0313497A FR0313497A FR2862424B1 FR 2862424 B1 FR2862424 B1 FR 2862424B1 FR 0313497 A FR0313497 A FR 0313497A FR 0313497 A FR0313497 A FR 0313497A FR 2862424 B1 FR2862424 B1 FR 2862424B1
Authority
FR
France
Prior art keywords
cooling
manufacturing
same
electrical component
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0313497A
Other languages
English (en)
Other versions
FR2862424A1 (fr
Inventor
Jean Michel Morelle
Laurent Vivet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leoni Wiring Systems France SAS
Original Assignee
Valeo Electronique et Systemes de Liaison SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Electronique et Systemes de Liaison SA filed Critical Valeo Electronique et Systemes de Liaison SA
Priority to FR0313497A priority Critical patent/FR2862424B1/fr
Priority to CNB2004800405996A priority patent/CN100459190C/zh
Priority to US10/579,624 priority patent/US20070147009A1/en
Priority to PCT/FR2004/002923 priority patent/WO2005050747A1/fr
Priority to JP2006540509A priority patent/JP2007535801A/ja
Priority to EP04805460A priority patent/EP1685604A1/fr
Publication of FR2862424A1 publication Critical patent/FR2862424A1/fr
Application granted granted Critical
Publication of FR2862424B1 publication Critical patent/FR2862424B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0365—Manufacture or treatment of packages of means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR0313497A 2003-11-18 2003-11-18 Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif Expired - Fee Related FR2862424B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR0313497A FR2862424B1 (fr) 2003-11-18 2003-11-18 Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif
CNB2004800405996A CN100459190C (zh) 2003-11-18 2004-11-16 冷却电气元件的装置及其生产方法
US10/579,624 US20070147009A1 (en) 2003-11-18 2004-11-16 Device for cooling an electrical component and production method thereof
PCT/FR2004/002923 WO2005050747A1 (fr) 2003-11-18 2004-11-16 Dispositif de refroidissement d’un composant electrique et procede de fabrication de ce dispositif
JP2006540509A JP2007535801A (ja) 2003-11-18 2004-11-16 電気部品の冷却用装置およびその製造方法
EP04805460A EP1685604A1 (fr) 2003-11-18 2004-11-16 DISPOSITIF DE REFROIDISSEMENT D’UN COMPOSANT ELECTRIQUE ET PROCEDE DE FABRICATION DE CE DISPOSITIF

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0313497A FR2862424B1 (fr) 2003-11-18 2003-11-18 Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif

Publications (2)

Publication Number Publication Date
FR2862424A1 FR2862424A1 (fr) 2005-05-20
FR2862424B1 true FR2862424B1 (fr) 2006-10-20

Family

ID=34508558

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0313497A Expired - Fee Related FR2862424B1 (fr) 2003-11-18 2003-11-18 Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif

Country Status (6)

Country Link
US (1) US20070147009A1 (fr)
EP (1) EP1685604A1 (fr)
JP (1) JP2007535801A (fr)
CN (1) CN100459190C (fr)
FR (1) FR2862424B1 (fr)
WO (1) WO2005050747A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2899763B1 (fr) * 2006-04-06 2008-07-04 Valeo Electronique Sys Liaison Support, notamment pour composant electronique de puissance, module de puissance comprenant ce support, ensemble comprenant le module et organe electrique pilote par ce module
FR2902277B1 (fr) * 2006-06-13 2008-09-05 Valeo Electronique Sys Liaison Support pour composant electrique et dispositif electrique comprenant le support et le composant
JP4772882B2 (ja) * 2009-03-06 2011-09-14 日本航空電子工業株式会社 配線基板および発光装置
JP2011066281A (ja) * 2009-09-18 2011-03-31 Tokai Rika Co Ltd 発熱デバイス
DE102012219879A1 (de) * 2012-10-30 2014-04-30 Osram Gmbh Verfahren zum Herstellen eines LED-Moduls mit Kühlkörper
DE102013220591A1 (de) * 2013-10-11 2015-04-16 Robert Bosch Gmbh Leistungsmodul mit Kühlkörper
DE102015205354A1 (de) * 2015-03-24 2016-09-29 Osram Gmbh Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe

Family Cites Families (40)

* Cited by examiner, † Cited by third party
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JPH04196369A (ja) * 1990-11-28 1992-07-16 Hitachi Ltd 光モジュールの構造
JPH06314857A (ja) * 1993-03-04 1994-11-08 Mitsubishi Electric Corp 半導体発光装置
US5376580A (en) * 1993-03-19 1994-12-27 Hewlett-Packard Company Wafer bonding of light emitting diode layers
FI946047L (fi) * 1994-12-22 1996-06-23 Abb Industry Oy Menetelmä jäähdytyselementtien kiinnittämiseksi tehopuolijohdekomponenttiin sekä jäähdytetty tehonpuolijohde
DE19629920B4 (de) * 1995-08-10 2006-02-02 LumiLeds Lighting, U.S., LLC, San Jose Licht-emittierende Diode mit einem nicht-absorbierenden verteilten Braggreflektor
US5779924A (en) * 1996-03-22 1998-07-14 Hewlett-Packard Company Ordered interface texturing for a light emitting device
US6441943B1 (en) * 1997-04-02 2002-08-27 Gentex Corporation Indicators and illuminators using a semiconductor radiation emitter package
US6700692B2 (en) * 1997-04-02 2004-03-02 Gentex Corporation Electrochromic rearview mirror assembly incorporating a display/signal light
DE19746893B4 (de) * 1997-10-23 2005-09-01 Siemens Ag Optoelektronisches Bauelement mit Wärmesenke im Sockelteil und Verfahren zur Herstellung
US6670207B1 (en) * 1999-03-15 2003-12-30 Gentex Corporation Radiation emitter device having an integral micro-groove lens
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
US6301779B1 (en) * 1998-10-29 2001-10-16 Advanced Thermal Solutions, Inc. Method for fabricating a heat sink having nested extended surfaces
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
US6517218B2 (en) * 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
GB2361581A (en) * 2000-04-20 2001-10-24 Lite On Electronics Inc A light emitting diode device
CA2353338A1 (fr) * 2000-07-21 2002-01-21 Ats Automation Tooling Systems Inc. Dispositif et procede de fabrication d'ailerons dissipant la chaleur
US6561680B1 (en) * 2000-11-14 2003-05-13 Kelvin Shih Light emitting diode with thermally conductive structure
US6541800B2 (en) * 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED
ATE425556T1 (de) * 2001-04-12 2009-03-15 Matsushita Electric Works Ltd Lichtquellenbauelement mit led und verfahren zu seiner herstellung
US6841857B2 (en) * 2001-07-18 2005-01-11 Infineon Technologies Ag Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip
JP4045781B2 (ja) * 2001-08-28 2008-02-13 松下電工株式会社 発光装置
US20030058650A1 (en) * 2001-09-25 2003-03-27 Kelvin Shih Light emitting diode with integrated heat dissipater
US7121680B2 (en) * 2001-12-10 2006-10-17 Galli Robert D LED lighting assembly with improved heat management
CA2754097C (fr) * 2002-01-28 2013-12-10 Nichia Corporation Dispositif a semi-conducteur a base de nitrure comprenant un substrat de support, et son procede de realisation
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
JP4305896B2 (ja) * 2002-11-15 2009-07-29 シチズン電子株式会社 高輝度発光装置及びその製造方法
US7170151B2 (en) * 2003-01-16 2007-01-30 Philips Lumileds Lighting Company, Llc Accurate alignment of an LED assembly
US6903380B2 (en) * 2003-04-11 2005-06-07 Weldon Technologies, Inc. High power light emitting diode
US6831302B2 (en) * 2003-04-15 2004-12-14 Luminus Devices, Inc. Light emitting devices with improved extraction efficiency
KR20060059891A (ko) * 2003-06-04 2006-06-02 유명철 수직 구조 화합물 반도체 디바이스의 제조 방법
JP4138586B2 (ja) * 2003-06-13 2008-08-27 スタンレー電気株式会社 光源用ｌｅｄランプおよびこれを用いた車両用前照灯
US6921927B2 (en) * 2003-08-28 2005-07-26 Agilent Technologies, Inc. System and method for enhanced LED thermal conductivity
US7280288B2 (en) * 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
JP4254669B2 (ja) * 2004-09-07 2009-04-15 豊田合成株式会社 発光装置
US7256483B2 (en) * 2004-10-28 2007-08-14 Philips Lumileds Lighting Company, Llc Package-integrated thin film LED
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
US7296916B2 (en) * 2004-12-21 2007-11-20 3M Innovative Properties Company Illumination assembly and method of making same
US7777247B2 (en) * 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
JP4940883B2 (ja) * 2005-10-31 2012-05-30 豊田合成株式会社 発光装置
JP4882439B2 (ja) * 2006-01-13 2012-02-22 日亜化学工業株式会社 発光装置およびその製造方法

Also Published As

Publication number Publication date
CN1918715A (zh) 2007-02-21
US20070147009A1 (en) 2007-06-28
FR2862424A1 (fr) 2005-05-20
WO2005050747A1 (fr) 2005-06-02
CN100459190C (zh) 2009-02-04
EP1685604A1 (fr) 2006-08-02
JP2007535801A (ja) 2007-12-06

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