EP2568417B1 - Antenna device and method of setting resonant frequency of antenna device - Google Patents
Antenna device and method of setting resonant frequency of antenna device Download PDFInfo
- Publication number
- EP2568417B1 EP2568417B1 EP12188215.3A EP12188215A EP2568417B1 EP 2568417 B1 EP2568417 B1 EP 2568417B1 EP 12188215 A EP12188215 A EP 12188215A EP 2568417 B1 EP2568417 B1 EP 2568417B1
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- conductor
- antenna
- coil
- conductor layer
- antenna device
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- 239000004020 conductor Substances 0.000 claims description 171
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2216—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in interrogator/reader equipment
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/02—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
- H01Q19/062—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens for focusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/04—Screened antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
- H01Q7/06—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/24—Inductive coupling
- H04B5/26—Inductive coupling using coils
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Definitions
- the present invention relates to antenna devices used in RFID systems and short-range wireless communication systems, such systems performing communication with appliances that are communication partners through electromagnetic signals, and to methods of setting the resonant frequency of such antenna devices.
- a communication antenna is mounted in each of the appliances.
- an antenna to be mounted in a mobile electronic appliance is disclosed in JP 2006-270681 A1 .
- Fig. 1 is a view illustrating communication between a mobile information terminal 21 and a reader/writer as disclosed in JP 2006-270681 A1 when the mobile information terminal 21 and the reader/writer are in the vicinity of each other.
- a magnetic field H which is part of electromagnetic waves radiated from a transmitting/receiving antenna unit 26 of the reader/writer, is affected by metal objects such as a battery pack 25 within a main body 22 of the terminal and is weakened due to reflection, absorption and the like.
- a metal layer 30 is arranged closer to a side onto which the electromagnetic waves are incident than a communication surface CS of an antenna module 10 is.
- An induced current (eddy current) is generated due to the external magnetic field acting on the front surface of the metal layer 30 and a magnetic field H1 generated as a result of this current causes generation of an induced electric current in an antenna coil 15 of the antenna module 10.
- the metal layer 30 is arranged close to and facing the antenna module 10 so as to cover part of the antenna coil 15 and thereby inductive coupling occurs between the transmitting/receiving antenna unit 26 of the reader/writer and the antenna coil 15 of the antenna module 10 via the magnetic field component H1 that arises around the metal layer 30.
- the antenna device illustrated in Fig. 1 attempts to solve a problem in that when the antenna of the antenna device and the antenna on the communication partner side are brought close to each other and the distance therebetween becomes very small, the communication characteristics fluctuate greatly depending on the magnitude of positional displacement between the centers of the two antenna.
- the metal layer 30 is provided to induce magnetic flux in that region. Therefore, it is not necessarily the case that a substantial effect can be obtained by changing the positions of shielding members such as the battery pack 25.
- the metal layer 30 effectively acts to increase the communication range in a state in which the antenna device and the antenna on the communication partner side are spaced apart from each other.
- US 6,452,563 B1 describes an arrangement for an antenna having the general shape of a loop, directly in the proximity of at least a metallic element.
- Each metallic element comprises an orifice arranged substantially opposite the surface defined by the antenna, and a slot forming a gap width, arranged through the thickness of the metallic element, between the internal edge delimiting the orifice and the external edge of said metallic element.
- JP H 11 25244 A describes a non-contact data carrier package having a long communication distance.
- the non-contact data carrier package includes a conductive sheet arranged in the surrounding of an antenna coil so as to be overlapped on one part of the radiating face of the antenna coil.
- WO 89/07347 A1 describes concentrator adapted to concentrate signals for reception by a receiver means, said concentrator comprising a conductive portion juxtaposed said receiver means, said concentrator being aligned so as to receive said signals and cause further signals to impinge on said receiver means, and thereby enhance reception of said signals by said receiver means.
- EP 1 445 730 A1 describes a communication-capable electronic device which includes a metallic housing to accommodate electronic parts of the device, and a communication terminal that makes communications with a communication-cable IC card incorporating an antenna.
- EP 1 484 816 A1 describes a soft magnetic member provided between an antenna coil and a metal surface of a conductive member such as a metal casing.
- a current flows through the conductor layer so that a magnetic field, which is generated by the current flowing through the coil conductor, is blocked. Then, a current flows around the periphery of the opening in the conductor layer and a current flows along the periphery of the slit and around the periphery of the conductor layer due to the cut-edge effect. As a result, a magnetic field arises around the conductor layer and the communication range can be increased.
- the conductor layer causes large loops of magnetic flux to circulate, the magnetic flux reaches from the antenna device to the antenna on the communication partner side or from the antenna on the communication partner side to the antenna device, and the maximum possible range of communication between the antenna device and the antenna on the communication partner side becomes large.
- Fig. 2(A) is a view of a rear face of an electronic appliance that is equipped with the antenna device according to the first example.
- the rear face of the electronic appliance faces an antenna on a reader/writer side, which is a communication partner side.
- Fig. 2(B) is a plan view of the interior of a lower casing on the rear face side. Only the structures of principal components are illustrated in Figs. 2(A) and 2(B) .
- a conductor layer 2 is formed on an outer face of a lower casing 1.
- the conductor layer 2 is for example a vapor-deposited metal film such as an aluminum film.
- an antenna coil module 3 is arranged on an inner face of the lower casing 1 so as to partially cover the conductor opening CA.
- a camera module is to be installed in the conductor opening CA. It is necessary for the lens of the camera module to be exposed to the outside through an opening in the casing. Therefore, by arranging the conductor opening so as to coincide with the opening provided in the casing in this way, there is no need to design a special casing taking into account provision of the conductor layer 2.
- a metal film is formed on the outer face of the casing by vapor deposition or the like and the metal film may double as the conductor layer.
- Fig. 3(A) and 3(B) are a plan view and a front view of the antenna coil module 3, respectively.
- the antenna coil module 3 is equipped with a rectangular-sheet-shaped flexible substrate 33 and a magnetic sheet 39 having the same rectangular sheet-like shape as the flexible substrate 33.
- Connectors 32 are formed on the flexible substrate 33 and are used for connecting a spiral-shaped coil conductor 31, in which a winding center portion serves as a coil opening CW, and an external circuit.
- the magnetic sheet 39 is for example composed of a ferrite formed in a sheet-like shape.
- the number of windings (number of turns) of the coil conductor 31 is determined on the basis of the required inductance. If there is only one turn, a simple loop-shaped coil conductor is formed.
- the antenna coil module 3 is arranged so that the antenna coil module 3 is mounted on an inner face of the lower casing 1 of the electronic appliance as illustrated in Fig. 2(B) , and when an upper casing is stacked thereon the connectors 32 contact predetermined pins of a circuit board mounted in the upper casing.
- the circuit board is provided with a capacitor that is connected in parallel with the connectors 32.
- the resonant frequency is determined by the inductance defined by the coil conductor 31 and the magnetic sheet 39 of the antenna coil module 3 and the capacitance of the capacitor. For example, in the case where a HF band is used having a central frequency of 13.56 MHz, the resonant frequency is determined to be 13.56 MHz.
- Fig. 4(A) is a sectional view illustrating a state in which the antenna device 101 and the antenna on the reader/writer side are magnetically coupled. Furthermore, Fig. 4(B) is a sectional view illustrating a state in which there is no conductor layer 2, as a comparative example. Components of the casing of the electronic appliance are omitted from the figures.
- a current flows through the conductor layer such that the magnetic field that arises due to the current flowing through the coil conductor is blocked. Then, a current, which flows around the periphery of the opening of the conductor layer, passes along the periphery of the slit and flows around the periphery of the conductor layer due to the cut-edge effect. In addition, a current also flows through the planar portion of the conductor layer.
- magnetic flux MF attempts to bypass the conductor layer 2 along a path in which the conductor opening CA of the conductor layer 2 is on the inside and the outer edge of the conductor layer 2 is on the outside.
- the magnetic flux MF draws relatively large loops that link the inside and the outside of a coil conductor 41 of an antenna 4 on the reader/writer side.
- the antenna device 101 and the antenna 4 on the reader/writer side are magnetically coupled.
- the magnetic flux which is attempting to link the coil conductor 31 and the antenna on the communication partner side, can circulate through the coil opening CW and the conductor opening CA due to the fact that the coil opening CW and the conductor opening CA at least partially overlap when the coil conductor 31 is viewed in plan view.
- the coil conductor 31 can be made to effectively radiate a magnetic field.
- the directivity of the antenna can be made to be wider in the antenna direction of the communication partner by stacking the magnetic sheet 39 on the face of the flexible substrate 33 that is on the side farther from the antenna on the communication partner side.
- the conductor layer causes large loops of magnetic flux to circulate and therefore magnetic flux reaches from the antenna device to the antenna on the communication partner side or from the antenna on the communication partner side to the antenna device and the maximum possible range of communication between the antenna device and the antenna on the communication partner side becomes large.
- the antenna devices equipped with the antenna coil modules 3 having sizes equal to or less than 22.5 mm x 17 mm communication is not possible at any distance when the conductor layer is not provided.
- the conductor layer when the conductor layer is included, communication is possible over a wide range from 0 mm to 38 mm even in cases where the antenna device is configured so as to be equipped with a very small antenna coil module 3 such as the one having a size of 22.5 mm x 16 mm.
- the inductance value of the antenna coil module 3 in the stand alone state is determined so that the resonant frequency of the antenna device 101 once the antenna device 101 has been constructed by mounting the antenna coil module 3 inside the casing of the electronic appliance approximately coincides with the central resonant frequency of the frequency band to be used.
- the inductance of the antenna device varies in accordance with the length and width of the slit SL.
- the degree of reduction of the inductance value (increase of resonant frequency) when the conductor layer 2 is brought close to the antenna coil module 3 can be suppressed. Accordingly, the length and width of the slit SL are set so as to obtain a desired inductance value.
- the inductance varies with the positional relationship between the antenna coil module 3 and the conductor layer 2 and with the shape and size of the conductor opening CA of the conductor layer 2, the positional relationship between the antenna coil module 3 and the conductor layer 2 and the shape and size of the conductor opening CA of the conductor layer 2 are set so as to obtain a desired inductance value.
- the coil opening CW of the coil conductor 31 may be made small and the antenna coil module can be reduced in size. Furthermore, together with making the coil opening CW small, the number of coil turns can be increased and the number of values of the inductance of the antenna coil module that can be adopted can be increased. As a result, setting of the resonant frequency is simplified.
- characteristics are used for which a magnetic field cannot penetrate into the conductor layer and the emission pattern of the magnetic field at the frequency being used is caused to change due to the presence of the conductor layer.
- Stable communication can be performed with the antenna device 101 of the invention, even when there are various sizes of the antenna device 101 and the antenna 4 on the reader/writer side.
- the antenna 4 on the reader/writer side is large, magnetic flux circulates in large loops due to the presence of the conductor layer 2 and the magnetic flux from the antenna device 101 reaches the antenna 101 on the reader/writer side, and in the case in which the antenna 4 on the reader/writer side is small, the distance that the magnetic flux reaches is increased due to the presence of the conductor layer 2.
- Figs. 5 are views of an antenna device 102 according to a second example.
- Fig. 5(A) is a plan view from the inner face side of the lower casing 1 of the electronic appliance.
- Fig. 5(B) is a plan view of a state in which the antenna coil module 3 has been mounted on an inner face of the lower casing 1.
- the conductor layer 2 is provided on an inner face of the lower casing 1.
- the conductor layer 2 is formed by vapor deposition of a metal film such as aluminum or by adhesion of a metal foil. In this way, a conductor layer may be provided on an inner face of the casing.
- the slit SL of the conductor layer 2 is provided in a portion for which the distance from the conductor opening CA to the edge is short.
- the conductor layer 2 may be connected to the ground of a circuit inside the electronic appliance. By doing this, the conductor layer 2 can also serve as a conductor layer for shielding the electronic appliance.
- Figs. 6(A) and 6(B) are plan views of an antenna device 103 according to the embodiment.
- Fig. 6(A) illustrates an electric current that flows through the coil conductor 31
- Fig. 6(B) illustrates an electric current 1 that flows through the conductor layer 2.
- the antenna device 103 is equipped with the antenna coil module 3 and the conductor layer 2.
- the antenna coil module 3 is constructed by stacking the flexible substrate on which the spiral-shaped coil conductor 31 has been formed on top of a magnetic sheet. Basically, this is the same as the configuration illustrated in Fig. 3 . However, in this embodiment, the two terminals of the coil conductor extend from the flexible substrate and connectors are provided at positions separated from the coil conductor 31.
- the conductor layer 2 is provided with the conductor opening CA and the slit SL, which connects the conductor opening CA and the outer edge of the conductor layer 2.
- the coil opening CW and the conductor opening CA are aligned and overlap over almost the entire peripheries thereof.
- the entirety of the coil conductor 31 can be made to be covered by the conductor layer 2. Consequently, since the magnetic flux generated by the coil conductor 31 attempts to totally link to the conductor layer 2, a large current is generated in the conductor layer 2 in a direction opposite to that of the current that flows through the coil conductor 31 so as to block this magnetic flux.
- the large electric current I which flows around the periphery of the conductor opening CA, flows along the periphery of the slit SL, through the plane of the conductor layer and along the periphery of the conductor layer due to the cut-edge effect. Accordingly, a strong magnetic field can be generated by the conductor layer 2 and the communication range can be further widened.
- the loops of magnetic flux passing through the conductor opening CA and the coil opening CW and circulating around the conductor layer 2 are more effectively widened. Consequently, stable communication can be performed even when the electronic appliance equipped with the antenna device 103 is oriented in any direction among in-plane directions relative to the surface of the antenna on the reader/writer side.
- Fig. 7(A) and Fig. 7(B) are a plan view and a front view of an antenna coil module 13 according to a third example, respectively.
- the antenna coil module 13 is positioned so as to be in the vicinity of a conductor layer, as illustrated in Fig. 2 , similarly to as in the case of the first example. Due to the antenna coil module 13 being positioned in this way, a large electric current is generated in the conductor layer 2 and a strong magnetic field is generated around the conductor layer 2.
- the antenna coil module 13 is provided with the rectangular-plate-shaped flexible substrate 34 and the magnetic sheet 39 having the same rectangular shape.
- the spiral-shaped coil conductor 31, in which a winding center portion serves as the coil opening CW, and connectors 32, which are used for connecting to an external circuit, are formed on the flexible substrate 34.
- the coil conductor 31 is formed over two layers of the flexible substrate 34. The two layers are connected by via conductors.
- the magnetic sheet 39 is for example composed of a ferrite formed in a sheet-like shape.
- the coil conductor can be made to center on such a position as to be aligned with the inner edge of the conductor opening. Accordingly, magnetic flux, which is centered on and generated by the coil conductor 31 attempts to link to the conductor layer and therefore a large current can be made to flow in the conductor layer.
- Fig. 8 is a plan view of an antenna device 104 according to a fourth example.
- the antenna device 104 is provided with the antenna coil module 3 and the conductor layer 2.
- the antenna coil module 3 a flexible substrate on which a spiral-shaped coil conductor has been formed is stacked on top of a magnetic sheet. This configuration is similar to that illustrated in Fig. 6 .
- the coil opening CW is formed so as to be slightly smaller than the conductor opening CA.
- the conductor layer is formed on an outer face or an inner face of the casing, but the conductor layer may be arranged on an internal component of the casing. Furthermore, in the case where the casing itself is metal, the casing may be used as the conductor layer.
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Support Of Aerials (AREA)
- Near-Field Transmission Systems (AREA)
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- Aerials With Secondary Devices (AREA)
- Waveguide Connection Structure (AREA)
Description
- The present invention relates to antenna devices used in RFID systems and short-range wireless communication systems, such systems performing communication with appliances that are communication partners through electromagnetic signals, and to methods of setting the resonant frequency of such antenna devices.
- In RFID systems and short-range wireless communication systems, which have become widely used in recent years, in order to facilitate communication between mobile electronic appliances such as mobile telephones or between a mobile electronic appliance and a reader/writer, a communication antenna is mounted in each of the appliances. Among such antennas, an antenna to be mounted in a mobile electronic appliance is disclosed in
JP 2006-270681 A1 -
Fig. 1 is a view illustrating communication between amobile information terminal 21 and a reader/writer as disclosed inJP 2006-270681 A1 mobile information terminal 21 and the reader/writer are in the vicinity of each other. In the example illustrated inFig. 1 , a magnetic field H, which is part of electromagnetic waves radiated from a transmitting/receivingantenna unit 26 of the reader/writer, is affected by metal objects such as abattery pack 25 within amain body 22 of the terminal and is weakened due to reflection, absorption and the like. Ametal layer 30 is arranged closer to a side onto which the electromagnetic waves are incident than a communication surface CS of an antenna module 10 is. An induced current (eddy current) is generated due to the external magnetic field acting on the front surface of themetal layer 30 and a magnetic field H1 generated as a result of this current causes generation of an induced electric current in anantenna coil 15 of the antenna module 10. - In this example, the
metal layer 30 is arranged close to and facing the antenna module 10 so as to cover part of theantenna coil 15 and thereby inductive coupling occurs between the transmitting/receivingantenna unit 26 of the reader/writer and theantenna coil 15 of the antenna module 10 via the magnetic field component H1 that arises around themetal layer 30. - The antenna device illustrated in
Fig. 1 attempts to solve a problem in that when the antenna of the antenna device and the antenna on the communication partner side are brought close to each other and the distance therebetween becomes very small, the communication characteristics fluctuate greatly depending on the magnitude of positional displacement between the centers of the two antenna. In order to reduce the degree to which magnetic flux, which is attempting to link theantenna coil 15 of the antenna module 10 on themobile information terminal 21 side and transmitting/receivingantenna unit 26 on the reader/writer side, is blocked by metal objects such as thebattery pack 25 within the casing, themetal layer 30 is provided to induce magnetic flux in that region. Therefore, it is not necessarily the case that a substantial effect can be obtained by changing the positions of shielding members such as thebattery pack 25. - Furthermore, it is not necessarily the case that the
metal layer 30 effectively acts to increase the communication range in a state in which the antenna device and the antenna on the communication partner side are spaced apart from each other. -
US 6,452,563 B1 describes an arrangement for an antenna having the general shape of a loop, directly in the proximity of at least a metallic element. Each metallic element comprises an orifice arranged substantially opposite the surface defined by the antenna, and a slot forming a gap width, arranged through the thickness of the metallic element, between the internal edge delimiting the orifice and the external edge of said metallic element. -
JP H 11 25244 A -
WO 89/07347 A1 -
EP 1 445 730 A1 describes a communication-capable electronic device which includes a metallic housing to accommodate electronic parts of the device, and a communication terminal that makes communications with a communication-cable IC card incorporating an antenna. -
EP 1 484 816 A1 describes a soft magnetic member provided between an antenna coil and a metal surface of a conductive member such as a metal casing. - It is an object of the invention to provide an antenna device that, even when the size of the antenna device has been made small compared to that of an antenna on the communication-partner side, is capable of stable communication and is also capable of increasing the maximum possible communication range.
- This object is achieved by an antenna device according to claim 1.
- According to the invention, a current flows through the conductor layer so that a magnetic field, which is generated by the current flowing through the coil conductor, is blocked. Then, a current flows around the periphery of the opening in the conductor layer and a current flows along the periphery of the slit and around the periphery of the conductor layer due to the cut-edge effect. As a result, a magnetic field arises around the conductor layer and the communication range can be increased.
- In addition, since the conductor layer causes large loops of magnetic flux to circulate, the magnetic flux reaches from the antenna device to the antenna on the communication partner side or from the antenna on the communication partner side to the antenna device, and the maximum possible range of communication between the antenna device and the antenna on the communication partner side becomes large.
-
-
Fig. 1 is a view illustrating a situation in which communication is performed between themobile information terminal 21 and the reader/writer as disclosed inJP 2006-270681 A1 mobile information terminal 21 and the reader/writer are in the vicinity of each other. -
Fig. 2(A) is a view of a rear face of an electronic appliance that is equipped with an antenna device according to a first example. -
Fig. 2(B) is a plan view of the interior of a lower casing viewed from the rear face side. -
Fig. 3(A) is a plan view of theantenna coil module 3 andFig. 3(B) is a front view thereof. -
Fig. 4(A) is a sectional view illustrating a state in which theantenna device 101 and the antenna on the reader/writer side are magnetically coupled.Fig. 4(B) is a sectional view illustrating a state in which there is noconductor layer 2, as a comparative example. -
Figs. 5 are views of an antenna device according to a second example. -
Fig. 5(A) is a plan view of the interior of a lower casing 1 of an electronic appliance.Fig. 5(B) is a plan view of a state in which theantenna coil module 3 has been mounted on an inner face of the lower casing 1. -
Figs. 6 are plan views of anantenna device 103 according to an embodiment. Specifically,Fig. 6(A) illustrates the current that flows through acoil conductor 31 andFig. 6(B) illustrates a current 1 that flows through aconductor layer 2. -
Fig. 7(A) is a plan view of anantenna coil module 13 according to a third example andFig. 7(B) is a front view thereof. -
Fig. 8 is a plan view of anantenna device 104 according to a fifth embodiment. - An antenna device and a method of setting a resonant frequency of the antenna device according to a first example will be described with reference to
Figs. 2 to 4 . -
Fig. 2(A) is a view of a rear face of an electronic appliance that is equipped with the antenna device according to the first example. The rear face of the electronic appliance faces an antenna on a reader/writer side, which is a communication partner side.Fig. 2(B) is a plan view of the interior of a lower casing on the rear face side. Only the structures of principal components are illustrated inFigs. 2(A) and 2(B) . - As illustrated in
Fig. 2(A) , aconductor layer 2 is formed on an outer face of a lower casing 1. Theconductor layer 2 is for example a vapor-deposited metal film such as an aluminum film. A conductor opening CA and a slit SL, which connects the conductor opening CA and an outer edge of theconductor layer 2, are formed in theconductor layer 2. - As illustrated in
Fig. 2(B) , anantenna coil module 3 is arranged on an inner face of the lower casing 1 so as to partially cover the conductor opening CA. - In this example, a camera module is to be installed in the conductor opening CA. It is necessary for the lens of the camera module to be exposed to the outside through an opening in the casing. Therefore, by arranging the conductor opening so as to coincide with the opening provided in the casing in this way, there is no need to design a special casing taking into account provision of the
conductor layer 2. - In addition, in cases such as where part of an outer face of the casing is made to be metallic from a design point of view, a metal film is formed on the outer face of the casing by vapor deposition or the like and the metal film may double as the conductor layer.
- By forming the
conductor layer 2 on an inner or outer face of the casing of the electronic appliance in this way, there is no need to ensure there is a dedicated space in which to arrange theconductor layer 2 and aconductor layer 2 having a large area can be arranged. -
Fig. 3(A) and 3(B) are a plan view and a front view of theantenna coil module 3, respectively. Theantenna coil module 3 is equipped with a rectangular-sheet-shaped flexible substrate 33 and amagnetic sheet 39 having the same rectangular sheet-like shape as the flexible substrate 33.Connectors 32 are formed on the flexible substrate 33 and are used for connecting a spiral-shaped coil conductor 31, in which a winding center portion serves as a coil opening CW, and an external circuit. Themagnetic sheet 39 is for example composed of a ferrite formed in a sheet-like shape. - The number of windings (number of turns) of the
coil conductor 31 is determined on the basis of the required inductance. If there is only one turn, a simple loop-shaped coil conductor is formed. - The
antenna coil module 3 is arranged so that theantenna coil module 3 is mounted on an inner face of the lower casing 1 of the electronic appliance as illustrated inFig. 2(B) , and when an upper casing is stacked thereon theconnectors 32 contact predetermined pins of a circuit board mounted in the upper casing. - The circuit board is provided with a capacitor that is connected in parallel with the
connectors 32. The resonant frequency is determined by the inductance defined by thecoil conductor 31 and themagnetic sheet 39 of theantenna coil module 3 and the capacitance of the capacitor. For example, in the case where a HF band is used having a central frequency of 13.56 MHz, the resonant frequency is determined to be 13.56 MHz. -
Fig. 4(A) is a sectional view illustrating a state in which theantenna device 101 and the antenna on the reader/writer side are magnetically coupled. Furthermore,Fig. 4(B) is a sectional view illustrating a state in which there is noconductor layer 2, as a comparative example. Components of the casing of the electronic appliance are omitted from the figures. - Since at least part of the
coil conductor 31 of theantenna coil module 3 is covered by theconductor layer 2, a current flows through the conductor layer such that the magnetic field that arises due to the current flowing through the coil conductor is blocked. Then, a current, which flows around the periphery of the opening of the conductor layer, passes along the periphery of the slit and flows around the periphery of the conductor layer due to the cut-edge effect. In addition, a current also flows through the planar portion of the conductor layer. Accordingly, a magnetic field arises around theconductor layer 2 and since magnetic flux does not penetrate through theconductor layer 2, magnetic flux MF attempts to bypass theconductor layer 2 along a path in which the conductor opening CA of theconductor layer 2 is on the inside and the outer edge of theconductor layer 2 is on the outside. As a result, the magnetic flux MF draws relatively large loops that link the inside and the outside of acoil conductor 41 of anantenna 4 on the reader/writer side. In other words, theantenna device 101 and theantenna 4 on the reader/writer side are magnetically coupled. - Furthermore, the magnetic flux, which is attempting to link the
coil conductor 31 and the antenna on the communication partner side, can circulate through the coil opening CW and the conductor opening CA due to the fact that the coil opening CW and the conductor opening CA at least partially overlap when thecoil conductor 31 is viewed in plan view. Specifically, when the coil opening CW and the conductor opening CA overlap over almost the entire peripheries thereof when thecoil conductor 31 is viewed in plan view, thecoil conductor 31 can be made to effectively radiate a magnetic field. - In addition, large magnetic field loops can be made to arise due to the fact that the area of the
conductor layer 2 is larger than the area of the region over which thecoil conductor 31 is formed. - Furthermore, the directivity of the antenna can be made to be wider in the antenna direction of the communication partner by stacking the
magnetic sheet 39 on the face of the flexible substrate 33 that is on the side farther from the antenna on the communication partner side. - In this way, since it turns out that the magnetic flux is oriented in directions that extend beyond the
conductor layer 2, stable communication can be realized even when theantenna device 101 and the reader/writer are close to each other in a state where the center of the antenna device 101 (center of antenna coil module 3) and the center of theantenna 4 of the reader/writer are aligned. - Furthermore, since conductor loops are not formed in the
conductor layer 2 due to the fact that theconductor layer 2 is provided with the slit SL, as illustrated inFig. 4(A) , when the magnetic flux MF circulates through the conductor opening CA and around the outer edge of theconductor layer 2, eddy currents can be prevented from arising in theconductor layer 2 and losses due to such eddy currents can be suppressed. As a result, the maximum possible communication range can be secured between theantenna device 101 and theantenna 4 on the reader/writer side. - In contrast to this, as illustrated in
Fig. 4(B) , when there is noconductor layer 2, the magnetic flux MF, which passes through the coil opening CW, does not spread out in the left-right direction inFig. 4(B) (direction of spreading when theantenna module 3 is viewed in plan view) and the degree of coupling with theantenna 4 on the reader/writer side is small. Therefore, a phenomenon occurs in which communication becomes increasingly unstable the closer theantenna device 101 and the reader/writer are brought to each other. - Moreover, in the antenna device of the invention, the conductor layer causes large loops of magnetic flux to circulate and therefore magnetic flux reaches from the antenna device to the antenna on the communication partner side or from the antenna on the communication partner side to the antenna device and the maximum possible range of communication between the antenna device and the antenna on the communication partner side becomes large.
- The following table lists results obtained when the size of the
antenna coil module 3 was varied and the range over which communication can be performed between anantenna device 101 equipped with each of theantenna coil modules 3 and the antenna on the communication partner side was measured.Size of Antenna Coil Module Without Conductor Layer With Conductor Layer 22.5 mm x 20 mm 0 - 24 mm 0 - 44 mm 22.5 mm x 19 mm 0 - 23 mm 0 - 43 mm 22.5 mm x 18 mm 0 - 19 mm 0 - 41 mm 22.5 mm x 17 mm - 0 - 39 mm 22.5 mm x 16 mm - 0 - 38 mm antenna coil module 3 having a size of 22.5 mm x 18 mm, when the conductor layer is included, the maximum possible communication range is increased to 41 mm, in contrast to when the conductor layer is not provided and the maximum communication range is 19 mm. Furthermore, for example, in the case of the antenna devices equipped with theantenna coil modules 3 having sizes equal to or less than 22.5 mm x 17 mm, communication is not possible at any distance when the conductor layer is not provided. In contrast, when the conductor layer is included, communication is possible over a wide range from 0 mm to 38 mm even in cases where the antenna device is configured so as to be equipped with a very smallantenna coil module 3 such as the one having a size of 22.5 mm x 16 mm. - Setting of the central resonant frequency of the
antenna device 101 is performed as follows. In a state in which theantenna coil module 3 illustrated inFig. 2(B) is not in the vicinity of theconductor layer 2, in other words, in a stand alone state in which theantenna coil module 3 has not yet been mounted in the lower casing 1, while theantenna coil module 3 is connected in parallel with a resonance capacitor, the resonant frequency is set in advance to be lower than the central resonant frequency of the frequency band to be used. As illustrated inFigs. 2(B) and4(A) , when theantenna coil module 3 is brought close to the conductor opening CA of theconductor layer 2, since the inductance value of theantenna coil module 3 becomes smaller, the resonant frequency of theantenna device 101 increases. Consequently, the inductance value of theantenna coil module 3 in the stand alone state is determined so that the resonant frequency of theantenna device 101 once theantenna device 101 has been constructed by mounting theantenna coil module 3 inside the casing of the electronic appliance approximately coincides with the central resonant frequency of the frequency band to be used. - In addition, the inductance of the antenna device varies in accordance with the length and width of the slit SL. For example, when the slit SL is made to be large, the degree of reduction of the inductance value (increase of resonant frequency) when the
conductor layer 2 is brought close to theantenna coil module 3 can be suppressed. Accordingly, the length and width of the slit SL are set so as to obtain a desired inductance value. - Furthermore, since the inductance varies with the positional relationship between the
antenna coil module 3 and theconductor layer 2 and with the shape and size of the conductor opening CA of theconductor layer 2, the positional relationship between theantenna coil module 3 and theconductor layer 2 and the shape and size of the conductor opening CA of theconductor layer 2 are set so as to obtain a desired inductance value. - In this way, since the loops of magnetic flux are large due to the presence of the conductor layer, the coil opening CW of the
coil conductor 31 may be made small and the antenna coil module can be reduced in size. Furthermore, together with making the coil opening CW small, the number of coil turns can be increased and the number of values of the inductance of the antenna coil module that can be adopted can be increased. As a result, setting of the resonant frequency is simplified. - As described above, characteristics are used for which a magnetic field cannot penetrate into the conductor layer and the emission pattern of the magnetic field at the frequency being used is caused to change due to the presence of the conductor layer.
- Stable communication can be performed with the
antenna device 101 of the invention, even when there are various sizes of theantenna device 101 and theantenna 4 on the reader/writer side. In other words, in the case where theantenna 4 on the reader/writer side is large, magnetic flux circulates in large loops due to the presence of theconductor layer 2 and the magnetic flux from theantenna device 101 reaches theantenna 101 on the reader/writer side, and in the case in which theantenna 4 on the reader/writer side is small, the distance that the magnetic flux reaches is increased due to the presence of theconductor layer 2. -
Figs. 5 are views of anantenna device 102 according to a second example.Fig. 5(A) is a plan view from the inner face side of the lower casing 1 of the electronic appliance. Furthermore,Fig. 5(B) is a plan view of a state in which theantenna coil module 3 has been mounted on an inner face of the lower casing 1. - In the second example, the
conductor layer 2 is provided on an inner face of the lower casing 1. Theconductor layer 2 is formed by vapor deposition of a metal film such as aluminum or by adhesion of a metal foil. In this way, a conductor layer may be provided on an inner face of the casing. - Moreover, in the example illustrated in
Fig. 5 , the slit SL of theconductor layer 2 is provided in a portion for which the distance from the conductor opening CA to the edge is short. - The
conductor layer 2 may be connected to the ground of a circuit inside the electronic appliance. By doing this, theconductor layer 2 can also serve as a conductor layer for shielding the electronic appliance. -
Figs. 6(A) and 6(B) are plan views of anantenna device 103 according to the embodiment.Fig. 6(A) illustrates an electric current that flows through thecoil conductor 31 andFig. 6(B) illustrates an electric current 1 that flows through theconductor layer 2. Theantenna device 103 is equipped with theantenna coil module 3 and theconductor layer 2. Theantenna coil module 3 is constructed by stacking the flexible substrate on which the spiral-shapedcoil conductor 31 has been formed on top of a magnetic sheet. Basically, this is the same as the configuration illustrated inFig. 3 . However, in this embodiment, the two terminals of the coil conductor extend from the flexible substrate and connectors are provided at positions separated from thecoil conductor 31. - The
conductor layer 2 is provided with the conductor opening CA and the slit SL, which connects the conductor opening CA and the outer edge of theconductor layer 2. - When the
coil conductor 31 and theconductor layer 2 are viewed in plan view, the coil opening CW and the conductor opening CA are aligned and overlap over almost the entire peripheries thereof. With such a configuration, when thecoil conductor 31 is viewed in plan view, the entirety of thecoil conductor 31 can be made to be covered by theconductor layer 2. Consequently, since the magnetic flux generated by thecoil conductor 31 attempts to totally link to theconductor layer 2, a large current is generated in theconductor layer 2 in a direction opposite to that of the current that flows through thecoil conductor 31 so as to block this magnetic flux. The large electric current I, which flows around the periphery of the conductor opening CA, flows along the periphery of the slit SL, through the plane of the conductor layer and along the periphery of the conductor layer due to the cut-edge effect. Accordingly, a strong magnetic field can be generated by theconductor layer 2 and the communication range can be further widened. In addition, the loops of magnetic flux passing through the conductor opening CA and the coil opening CW and circulating around theconductor layer 2 are more effectively widened. Consequently, stable communication can be performed even when the electronic appliance equipped with theantenna device 103 is oriented in any direction among in-plane directions relative to the surface of the antenna on the reader/writer side. -
Fig. 7(A) and Fig. 7(B) are a plan view and a front view of anantenna coil module 13 according to a third example, respectively. Theantenna coil module 13 is positioned so as to be in the vicinity of a conductor layer, as illustrated inFig. 2 , similarly to as in the case of the first example. Due to theantenna coil module 13 being positioned in this way, a large electric current is generated in theconductor layer 2 and a strong magnetic field is generated around theconductor layer 2. - The
antenna coil module 13 is provided with the rectangular-plate-shapedflexible substrate 34 and themagnetic sheet 39 having the same rectangular shape. The spiral-shapedcoil conductor 31, in which a winding center portion serves as the coil opening CW, andconnectors 32, which are used for connecting to an external circuit, are formed on theflexible substrate 34. Thecoil conductor 31 is formed over two layers of theflexible substrate 34. The two layers are connected by via conductors. Themagnetic sheet 39 is for example composed of a ferrite formed in a sheet-like shape. - In this way, a strong magnetic field is generated by the coil conductor due to the
coil conductor 31 being wound over a plurality of layers, and as a result, a large current is made to flow in the conductor layer. In addition, the coil conductor can be made to center on such a position as to be aligned with the inner edge of the conductor opening. Accordingly, magnetic flux, which is centered on and generated by thecoil conductor 31 attempts to link to the conductor layer and therefore a large current can be made to flow in the conductor layer. -
Fig. 8 is a plan view of anantenna device 104 according to a fourth example. Theantenna device 104 is provided with theantenna coil module 3 and theconductor layer 2. In theantenna coil module 3, a flexible substrate on which a spiral-shaped coil conductor has been formed is stacked on top of a magnetic sheet. This configuration is similar to that illustrated inFig. 6 . However, in this example, the coil opening CW is formed so as to be slightly smaller than the conductor opening CA. - Since part of the
coil conductor 31 is covered by theconductor layer 2, a current flows through theconductor layer 2 due to the magnetic flux generated by thecoil conductor 31 as a result of this structure. - In addition, in each of the above-described examples, the conductor layer is formed on an outer face or an inner face of the casing, but the conductor layer may be arranged on an internal component of the casing. Furthermore, in the case where the casing itself is metal, the casing may be used as the conductor layer.
-
- CA
- conductor opening
- CW
- coil opening
- MF
- magnetic flux
- SL
- slit
- 1
- lower casing
- 2
- conductor layer
- 3, 13
- antenna coil module
- 4
- antenna on reader/writer side
- 31
- coil conductor
- 32
- connector
- 33, 34
- flexible substrate
- 39
- magnetic sheet
- 41
- coil conductor
- 101 - 104
- antenna device
Claims (6)
- An antenna device (103) comprising:an antenna coil module (3) including a coil conductor (31) having a loop shape or a spiral shape in which a winding center portion defines a coil opening (CW); anda conductor layer (2) including a conductor opening (CA) and a slit (SL) connecting the conductor opening (CA) and an outer edge of the conductor layer (2);wherein the conductor layer (2) is superposed on top of the coil conductor (31) of the antenna coil module (3), and is larger than an area of a region in which the coil conductor (31) is disposed;characterized in that the antenna coil module (3) further comprises a magnetic layer (39) that is arranged along the coil conductor (31); whereinthe magnetic layer (39) is arranged on a side of the coil conductor (31) that is farther from the conductor layer (2) than the coil conductor (31); andwhen the coil conductor (31) is viewed in plan view, the distance between the outer edge of the conductor layer (2) and the outer edge of the coil conductor (31) is larger than the distance between the edge of the conductor opening (CA) and the inner edge of the coil conductor (31), and the whole coil conductor (31) is arranged in the area between the edge of the conductor opening (CA) and the outer edge of the conductor layer (2).
- The antenna device according to claim 1, wherein the coil conductor (31) is wound across a plurality of layers.
- The antenna device according to claim 1, wherein, when the coil conductor (31) is viewed in plan view, the coil opening (CW) and the conductor opening (CA) overlap each other over entire peripheries thereof.
- The antenna device according to claim 1, characterised in that the antenna coil module (3) further comprises a substrate (33), wherein the coil conductor (31) is located on the substrate (33), the magnetic layer (39) being stacked on a surface of the substrate (33) opposite to a surface of the substrate (33) on which the coil conductor (31) is located.
- An electronic appliance comprising:
a metal casing (1) ; and
the antenna device (103) according to claim 1; wherein the antenna coil module (3) is provided on an inner surface of the
metal casing (1); and
the metal casing defines the conductor layer (2). - An electronic appliance comprising:the antenna device (103) according to claim 1; anda casing (1); whereinthe conductor layer (2) is located on an inner surface or an outer surface of the casing (1); andthe antenna coil module (3) is provided in the casing.
Applications Claiming Priority (2)
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JP2009103358 | 2009-04-21 | ||
EP09843679.3A EP2424041B1 (en) | 2009-04-21 | 2009-09-18 | Antenna apparatus and resonant frequency setting method of same |
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EP09843679.3A Division EP2424041B1 (en) | 2009-04-21 | 2009-09-18 | Antenna apparatus and resonant frequency setting method of same |
EP09843679.3A Division-Into EP2424041B1 (en) | 2009-04-21 | 2009-09-18 | Antenna apparatus and resonant frequency setting method of same |
EP09843679.3 Division | 2009-09-18 |
Publications (3)
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EP2568417A2 EP2568417A2 (en) | 2013-03-13 |
EP2568417A3 EP2568417A3 (en) | 2014-05-14 |
EP2568417B1 true EP2568417B1 (en) | 2018-07-04 |
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EP09843679.3A Active EP2424041B1 (en) | 2009-04-21 | 2009-09-18 | Antenna apparatus and resonant frequency setting method of same |
EP12188219.5A Withdrawn EP2568534A3 (en) | 2009-04-21 | 2009-09-18 | Antenna devie and method of setting resonant frequency of antenna device |
EP12188215.3A Active EP2568417B1 (en) | 2009-04-21 | 2009-09-18 | Antenna device and method of setting resonant frequency of antenna device |
EP10766947.5A Active EP2424042B1 (en) | 2009-04-21 | 2010-04-01 | Antenna apparatus |
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EP09843679.3A Active EP2424041B1 (en) | 2009-04-21 | 2009-09-18 | Antenna apparatus and resonant frequency setting method of same |
EP12188219.5A Withdrawn EP2568534A3 (en) | 2009-04-21 | 2009-09-18 | Antenna devie and method of setting resonant frequency of antenna device |
Family Applications After (1)
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US (11) | US20120262357A1 (en) |
EP (4) | EP2424041B1 (en) |
JP (8) | JP4687832B2 (en) |
CN (9) | CN102405556B (en) |
WO (2) | WO2010122685A1 (en) |
Families Citing this family (184)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9136600B2 (en) * | 2010-09-30 | 2015-09-15 | Murata Manufacturing Co., Ltd. | Antenna |
JP4687832B2 (en) * | 2009-04-21 | 2011-05-25 | 株式会社村田製作所 | Antenna device |
JP4930658B2 (en) * | 2009-11-20 | 2012-05-16 | 株式会社村田製作所 | ANTENNA DEVICE AND MOBILE COMMUNICATION TERMINAL |
JP5018918B2 (en) * | 2010-03-17 | 2012-09-05 | パナソニック株式会社 | ANTENNA DEVICE AND PORTABLE TERMINAL DEVICE USING THE SAME |
CN102668241B (en) * | 2010-03-24 | 2015-01-28 | 株式会社村田制作所 | Rfid system |
CN102948015B (en) * | 2010-06-18 | 2016-03-09 | 株式会社村田制作所 | Communication terminal device and antenna assembly |
JP5630503B2 (en) * | 2010-07-28 | 2014-11-26 | 株式会社村田製作所 | Antenna device and communication terminal device |
TWI469442B (en) * | 2010-10-15 | 2015-01-11 | Advanced Connectek Inc | Soft antenna |
JP5472153B2 (en) | 2010-12-24 | 2014-04-16 | 株式会社村田製作所 | Antenna device, battery pack with antenna, and communication terminal device |
JP5131413B2 (en) * | 2011-02-15 | 2013-01-30 | 株式会社村田製作所 | Antenna device and communication terminal device |
WO2012144482A1 (en) * | 2011-04-18 | 2012-10-26 | 株式会社村田製作所 | Antenna device and communication terminal device |
US20120274148A1 (en) * | 2011-04-27 | 2012-11-01 | Samsung Electro-Mechanics Co., Ltd. | Contactless power transmission device and electronic device having the same |
JP5660217B2 (en) * | 2011-07-19 | 2015-01-28 | 株式会社村田製作所 | Antenna device, RFID tag, and communication terminal device |
US10518518B2 (en) | 2013-01-18 | 2019-12-31 | Féinics Amatech Teoranta | Smart cards with metal layer(s) and methods of manufacture |
US10733494B2 (en) | 2014-08-10 | 2020-08-04 | Féinics Amatech Teoranta | Contactless metal card constructions |
JP5609922B2 (en) | 2011-08-10 | 2014-10-22 | 株式会社村田製作所 | Antenna device and communication terminal device |
WO2013042604A1 (en) * | 2011-09-20 | 2013-03-28 | 株式会社村田製作所 | Electronic equipment |
CN107069191B (en) | 2011-10-07 | 2019-10-18 | 株式会社村田制作所 | Antenna assembly and electronic equipment |
CN103843197B (en) | 2011-11-09 | 2016-04-20 | 株式会社村田制作所 | Antenna assembly and electronic equipment |
JP5549787B2 (en) * | 2012-02-01 | 2014-07-16 | 株式会社村田製作所 | Antenna device and communication terminal device |
JP5772868B2 (en) * | 2012-05-21 | 2015-09-02 | 株式会社村田製作所 | ANTENNA DEVICE AND WIRELESS COMMUNICATION DEVICE |
US8819662B2 (en) | 2012-06-11 | 2014-08-26 | Sony Corporation | Device and method for time notification for updating software |
JP5532191B1 (en) | 2012-06-28 | 2014-06-25 | 株式会社村田製作所 | Antenna device and communication terminal device |
US9083073B2 (en) | 2012-06-28 | 2015-07-14 | Intel Corporation | Thin chassis near field communication (NFC) antenna integration |
US9225388B2 (en) * | 2012-07-03 | 2015-12-29 | Intel Corporation | Transmitting magnetic field through metal chassis using fractal surfaces |
US9099765B2 (en) * | 2012-07-06 | 2015-08-04 | Blackberry Limited | Device having a quadrature near field communication antenna |
US9112280B2 (en) | 2012-07-10 | 2015-08-18 | Sony Corporation | Antenna apparatus and terminal device associated with antenna apparatus |
US10824931B2 (en) | 2012-08-30 | 2020-11-03 | Féinics Amatech Teoranta | Contactless smartcards with multiple coupling frames |
US10552722B2 (en) | 2014-08-10 | 2020-02-04 | Féinics Amatech Teoranta | Smartcard with coupling frame antenna |
JPWO2014038209A1 (en) | 2012-09-06 | 2016-08-08 | パナソニックIpマネジメント株式会社 | Antenna device and communication device |
WO2014042301A1 (en) * | 2012-09-17 | 2014-03-20 | 주식회사 이엠따블유 | Metamaterial antenna |
CN103918125B (en) * | 2012-09-26 | 2017-03-08 | 株式会社村田制作所 | Antenna assembly and possesses the electronic equipment of antenna assembly |
JP5672414B2 (en) | 2012-10-12 | 2015-02-18 | 株式会社村田製作所 | HF band wireless communication device |
JP6099352B2 (en) * | 2012-10-17 | 2017-03-22 | デクセリアルズ株式会社 | Electronic device and coil module |
CN104756317B (en) * | 2012-10-26 | 2017-09-26 | 株式会社村田制作所 | Interface, communicator and program |
JP5598641B1 (en) | 2012-12-20 | 2014-10-01 | 株式会社村田製作所 | Information terminal equipment |
CN105552561A (en) | 2012-12-21 | 2016-05-04 | 株式会社村田制作所 | Interface unit and computer |
JP2014135448A (en) * | 2013-01-11 | 2014-07-24 | Taiyo Yuden Co Ltd | Electronic component |
US11354560B2 (en) | 2013-01-18 | 2022-06-07 | Amatech Group Limited | Smartcards with multiple coupling frames |
US11928537B2 (en) | 2013-01-18 | 2024-03-12 | Amatech Group Limited | Manufacturing metal inlays for dual interface metal cards |
US11341389B2 (en) | 2013-01-18 | 2022-05-24 | Amatech Group Limited | Manufacturing metal inlays for dual interface metal cards |
US11551051B2 (en) | 2013-01-18 | 2023-01-10 | Amatech Group Limiied | Coupling frames for smartcards with various module opening shapes |
US11354558B2 (en) | 2013-01-18 | 2022-06-07 | Amatech Group Limited | Contactless smartcards with coupling frames |
US10599972B2 (en) | 2013-01-18 | 2020-03-24 | Féinics Amatech Teoranta | Smartcard constructions and methods |
WO2014112150A1 (en) | 2013-01-21 | 2014-07-24 | 株式会社 村田製作所 | Power receiving device, power transmitting device, and power transmission system |
JP5704284B2 (en) * | 2013-02-13 | 2015-04-22 | 株式会社村田製作所 | ANTENNA DEVICE AND ELECTRONIC DEVICE |
JP2014156700A (en) * | 2013-02-14 | 2014-08-28 | Denso Corp | Electronic tag and vehicle door locking-unlocking system |
WO2014128339A1 (en) * | 2013-02-22 | 2014-08-28 | Nokia Corporation | Apparatus and methods for wireless coupling |
US9024826B2 (en) * | 2013-02-25 | 2015-05-05 | Htc Corporation | Electronic devices with antennas formed with optically-transparent films and related methods |
JP6122321B2 (en) | 2013-03-19 | 2017-04-26 | デクセリアルズ株式会社 | ANTENNA DEVICE AND ELECTRONIC DEVICE |
WO2014156285A1 (en) | 2013-03-25 | 2014-10-02 | 株式会社村田製作所 | Antenna device and communication device |
CN103219579B (en) * | 2013-04-11 | 2015-05-06 | 上海安费诺永亿通讯电子有限公司 | Novel near field communication (NFC) antenna structure |
WO2014167812A1 (en) | 2013-04-12 | 2014-10-16 | パナソニック株式会社 | Antenna, antenna device and communication device |
US9819085B2 (en) | 2013-05-13 | 2017-11-14 | Amotech Co., Ltd. | NFC antenna module and portable terminal comprising same |
CN105247732B (en) * | 2013-05-13 | 2018-03-23 | 阿莫技术有限公司 | NFC antenna module and the carried terminal being made from it |
EP2897221B1 (en) * | 2013-06-14 | 2017-08-16 | Murata Manufacturing Co., Ltd. | Antenna device and communication-terminal device |
WO2014199862A1 (en) | 2013-06-14 | 2014-12-18 | 株式会社村田製作所 | Antenna device and communication-terminal device |
GB2516305A (en) * | 2013-07-19 | 2015-01-21 | Nokia Corp | Apparatus and methods for wireless communication |
EP2838157A1 (en) * | 2013-08-14 | 2015-02-18 | Samsung Electro-Mechanics Co., Ltd. | Cover for electronic device, antenna assembly, electronic device, and method for manufacturing the same |
KR101659138B1 (en) * | 2013-08-14 | 2016-09-22 | 삼성전기주식회사 | Cover for electronic device, antenna assembly, electronic device and method for manufacturing the same |
CN204905440U (en) | 2013-08-14 | 2015-12-23 | 株式会社村田制作所 | Antenna device and electronic equipment |
JP2015043567A (en) * | 2013-08-20 | 2015-03-05 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | Camera module and electronic device including the same |
US20150054704A1 (en) * | 2013-08-23 | 2015-02-26 | Samsung Sdi Co., Ltd. | Antenna module for terminal device and method for manufacturing the same |
KR101514331B1 (en) * | 2013-08-30 | 2015-04-22 | (주)파트론 | Device with loop type antenna |
CN105556747B (en) | 2013-09-17 | 2018-07-20 | 株式会社村田制作所 | Camera module and electronic equipment |
US10205489B2 (en) | 2013-10-07 | 2019-02-12 | Amotech Co., Ltd. | Rear cover and portable terminal having same |
KR101875446B1 (en) * | 2013-10-14 | 2018-07-09 | 주식회사 아모텍 | Rear cover and portable device having the same |
JP6348977B2 (en) * | 2013-11-08 | 2018-06-27 | ノキア テクノロジーズ オーユー | Coil configuration with communication coil and induction coil |
US9461500B2 (en) | 2013-11-21 | 2016-10-04 | Htc Corporation | Wireless charging receiving device and wireless charging system using the same |
CN104682005A (en) * | 2013-11-29 | 2015-06-03 | 佳邦科技股份有限公司 | Antenna structure |
JP5783344B1 (en) | 2013-12-26 | 2015-09-24 | 株式会社村田製作所 | Communication terminal device |
JP6347607B2 (en) * | 2013-12-27 | 2018-06-27 | キヤノン株式会社 | Electronics |
JP6335312B2 (en) * | 2013-12-31 | 2018-05-30 | ビーワイディー カンパニー リミテッドByd Company Limited | Near field communication (NFC) antenna assembly |
JP6374515B2 (en) * | 2014-01-06 | 2018-08-15 | ノキア テクノロジーズ オサケユイチア | Near-field coil and method |
WO2015115402A1 (en) * | 2014-01-30 | 2015-08-06 | 株式会社村田製作所 | Wireless communication apparatus |
JP5790905B1 (en) * | 2014-01-30 | 2015-10-07 | 株式会社村田製作所 | Wireless communication device |
US10186753B2 (en) * | 2014-01-31 | 2019-01-22 | Tdk Corporation | Antenna device and portable electronic device using the same |
JP5928496B2 (en) * | 2014-01-31 | 2016-06-01 | Tdk株式会社 | Antenna device and portable electronic device using the same |
JP6129091B2 (en) * | 2014-01-31 | 2017-05-17 | Tdk株式会社 | Antenna device and portable electronic device using the same |
WO2015122421A1 (en) | 2014-02-14 | 2015-08-20 | 株式会社村田製作所 | Antenna device and radio communication apparatus |
KR101762778B1 (en) | 2014-03-04 | 2017-07-28 | 엘지이노텍 주식회사 | Wireless communication and charge substrate and wireless communication and charge device |
KR102129249B1 (en) | 2014-04-28 | 2020-07-02 | 삼성전자주식회사 | Antenna apparatus and electronic device including the same |
JP6256600B2 (en) | 2014-04-30 | 2018-01-10 | 株式会社村田製作所 | ANTENNA DEVICE AND ELECTRONIC DEVICE |
US10290934B2 (en) * | 2014-04-30 | 2019-05-14 | Tdk Corporation | Antenna device |
US10014578B2 (en) | 2014-05-05 | 2018-07-03 | Nxp B.V. | Body antenna system |
US10009069B2 (en) | 2014-05-05 | 2018-06-26 | Nxp B.V. | Wireless power delivery and data link |
US10015604B2 (en) | 2014-05-05 | 2018-07-03 | Nxp B.V. | Electromagnetic induction field communication |
CN104037504B (en) * | 2014-06-13 | 2016-08-24 | 华侨大学 | A kind of trumpet type low section wide band high-gain antenna |
JP2016058825A (en) * | 2014-09-08 | 2016-04-21 | パナソニックIpマネジメント株式会社 | Electronic equipment |
KR102245184B1 (en) | 2014-11-21 | 2021-04-27 | 삼성전자주식회사 | Electronic device with antenna |
KR102257892B1 (en) * | 2014-11-26 | 2021-05-28 | 삼성전자주식회사 | Advanced NFC Antenna and Electronic Device with the same |
KR20160063191A (en) * | 2014-11-26 | 2016-06-03 | 삼성전기주식회사 | Antenna device and Near field communication device including the same |
US20160179140A1 (en) * | 2014-12-20 | 2016-06-23 | Intel Corporation | Chassis Design for Wireless-Charging Coil Integration for Computing Systems |
US10003218B2 (en) * | 2014-12-20 | 2018-06-19 | Intel Corporation | Chassis design for wireless-charging coil integration for computing systems |
US10109415B2 (en) * | 2015-01-07 | 2018-10-23 | Samsung Electronics Co., Ltd. | Wireless power receiver and external inductor connected thereto |
JP2016140026A (en) * | 2015-01-29 | 2016-08-04 | Tdk株式会社 | Antenna device |
CN207320328U (en) | 2015-02-16 | 2018-05-04 | 株式会社村田制作所 | Antenna assembly and communication terminal |
US10122182B2 (en) * | 2015-02-27 | 2018-11-06 | Qualcomm Incorporated | Multi-turn coil on metal backplate |
TWI538296B (en) * | 2015-03-31 | 2016-06-11 | 和碩聯合科技股份有限公司 | Mobile communication device with antenna |
JP6519299B2 (en) | 2015-04-28 | 2019-05-29 | Tdk株式会社 | Antenna device |
JP6627252B2 (en) * | 2015-04-28 | 2020-01-08 | Tdk株式会社 | Antenna device |
US10476304B2 (en) * | 2015-05-27 | 2019-11-12 | Qualcomm Incorporated | Wireless power receive coil for metal backed device |
CN104993215B (en) * | 2015-06-01 | 2019-06-07 | 瑞声精密制造科技(常州)有限公司 | NFC antenna structure |
JP6589403B2 (en) | 2015-06-15 | 2019-10-16 | Tdk株式会社 | Antenna device and coil component used therefor |
CN105161819A (en) * | 2015-06-23 | 2015-12-16 | 瑞声精密制造科技(常州)有限公司 | Rfid antenna structure |
US20170005395A1 (en) * | 2015-06-30 | 2017-01-05 | Tdk Corporation | Antenna device |
CN105006654A (en) * | 2015-07-08 | 2015-10-28 | 深圳市信维通信股份有限公司 | Figure-eight-shaped NFC antenna with metal rear housing |
CN105024162B (en) * | 2015-07-08 | 2018-06-26 | 深圳市信维通信股份有限公司 | A kind of NFC antenna with metal rear shell |
JP6845624B2 (en) * | 2015-07-08 | 2021-03-17 | ローム株式会社 | Power transmission device, power receiving device and contactless power supply system |
CN105024169B (en) * | 2015-07-15 | 2019-08-27 | 深圳市信维通信股份有限公司 | A kind of high performance NFC antenna structure of small size |
JP6549436B2 (en) | 2015-07-22 | 2019-07-24 | デクセリアルズ株式会社 | Antenna device |
WO2017018243A1 (en) * | 2015-07-27 | 2017-02-02 | 株式会社村田製作所 | Portable terminal device |
CN105048061B (en) * | 2015-07-27 | 2018-01-12 | 电子科技大学 | A kind of near field communication antenna device |
JP6249141B2 (en) | 2015-08-03 | 2017-12-20 | 株式会社村田製作所 | ANTENNA DEVICE AND ELECTRONIC DEVICE |
CN105098324B (en) * | 2015-08-06 | 2018-06-19 | 电子科技大学 | A kind of near field communication antenna device |
US20170077733A1 (en) * | 2015-09-10 | 2017-03-16 | Qualcomm Incorporated | Wireless power transmitting unit using metal plates |
US20170077754A1 (en) * | 2015-09-15 | 2017-03-16 | Qualcomm Incorporated | Near field communication and wireless power transfer dual mode antennas for metal backed devices |
US9787368B2 (en) * | 2015-11-06 | 2017-10-10 | Mediatek Inc. | Antenna having passive booster for near field communication |
CN105428799A (en) * | 2015-11-11 | 2016-03-23 | 威海北洋电气集团股份有限公司 | Radio-frequency antenna |
CN105870576A (en) * | 2015-11-25 | 2016-08-17 | 深圳市中天迅通信技术有限公司 | Near-field communication antenna device for metal shell communication equipment |
KR101914247B1 (en) | 2016-01-14 | 2018-11-01 | 가부시키가이샤 무라타 세이사쿠쇼 | Antenna device and electronic apparatus |
CN208423178U (en) | 2016-01-18 | 2019-01-22 | 株式会社村田制作所 | Antenna assembly and electronic equipment |
CN105552545A (en) * | 2016-01-28 | 2016-05-04 | 深圳市飞荣达科技股份有限公司 | Near field communication (NFC) antenna device and electronic device |
CN105552527A (en) * | 2016-03-08 | 2016-05-04 | 上海德门电子科技有限公司 | NFC antenna interpenetrating intersected dual-loop structure and mobile terminal |
CN105655706B (en) * | 2016-03-18 | 2018-01-19 | 广东欧珀移动通信有限公司 | Metallic terminations bonnet and terminal |
JP6642219B2 (en) * | 2016-04-07 | 2020-02-05 | 株式会社村田製作所 | Camera module and electronic equipment |
KR102533473B1 (en) * | 2016-04-26 | 2023-05-18 | 삼성전자주식회사 | Electronic Device for Transmitting Electromagnetic Wave in Multi-Direction |
US10320086B2 (en) * | 2016-05-04 | 2019-06-11 | Nxp B.V. | Near-field electromagnetic induction (NFEMI) antenna |
US10522912B2 (en) * | 2016-05-12 | 2019-12-31 | Tdk Corporation | Antenna device and mobile wireless device provided with the same |
CN107437650A (en) | 2016-05-25 | 2017-12-05 | 三星电子株式会社 | Electronic equipment including NFC antenna |
JP2016165155A (en) * | 2016-06-14 | 2016-09-08 | Tdk株式会社 | Antenna device and portable electronic apparatus using the same |
JP6693293B2 (en) * | 2016-06-21 | 2020-05-13 | 富士通株式会社 | Wireless power receiving device and electronic device using the same |
KR101824998B1 (en) * | 2016-07-13 | 2018-02-02 | 엘지전자 주식회사 | Mobile terminal |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
WO2018022755A1 (en) | 2016-07-27 | 2018-02-01 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
KR101795959B1 (en) * | 2016-08-12 | 2017-11-10 | 주식회사 이엠따블유 | An antenna including an antenna pattern formed on a top surface and a bottom surface of magnetic sheet |
CN106129585A (en) * | 2016-08-24 | 2016-11-16 | 深圳市信维通信股份有限公司 | A kind of prefix type NFC antenna |
US10003120B2 (en) | 2016-09-02 | 2018-06-19 | AQ Corporation | Smartphone antenna in flexible PCB |
USD850424S1 (en) | 2016-12-14 | 2019-06-04 | AQ Corporation | Flexible PCB dual antenna module for use in smartphone |
US10547112B2 (en) | 2016-09-02 | 2020-01-28 | AQ Corporation | Smartphone antenna in flexible PCB |
US10074891B2 (en) | 2016-09-02 | 2018-09-11 | AQ Corporation | Smartphone antenna in flexible PCB |
JP6895725B2 (en) | 2016-09-13 | 2021-06-30 | マクセル株式会社 | Power transmission device |
JP6242459B2 (en) * | 2016-10-25 | 2017-12-06 | 京セラ株式会社 | Electronics |
US10886598B2 (en) * | 2016-11-16 | 2021-01-05 | Wits Co., Ltd. | Antenna module and electronic device having the same |
TWI635655B (en) * | 2016-11-21 | 2018-09-11 | 佳邦科技股份有限公司 | Portable electronic device and antenna module thereof |
US10950941B2 (en) * | 2016-11-21 | 2021-03-16 | Microsoft Technology Licensing, Llc | Conductive structural member acting as single-ended NFC antenna |
KR102562734B1 (en) | 2016-11-24 | 2023-08-02 | 삼성전자주식회사 | Electronic Device for Including Conductive Housing |
US10790703B2 (en) * | 2016-12-19 | 2020-09-29 | Koji Yoden | Smart wireless power transfer between devices |
WO2018113341A1 (en) * | 2016-12-23 | 2018-06-28 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Housing assembly for terminal, terminal and mobile phone |
KR101962001B1 (en) * | 2017-01-19 | 2019-03-25 | 주식회사 이엠따블유 | An antenna including an antenna pattern formed on a top surface and a bottom surface of magnetic sheet and a method of forming the same |
WO2018155600A1 (en) * | 2017-02-23 | 2018-08-30 | 株式会社ヨコオ | Antenna device |
JP2018170679A (en) * | 2017-03-30 | 2018-11-01 | 株式会社村田製作所 | Antenna device and electronic apparatus |
KR102335846B1 (en) * | 2017-04-17 | 2021-12-07 | 삼성전자주식회사 | Electronic device comprising a plurality of coils |
US10622705B2 (en) * | 2017-07-07 | 2020-04-14 | Wits Co., Ltd. | Antenna module and electronic device including the same |
KR101883109B1 (en) * | 2017-07-20 | 2018-07-27 | 삼성전기주식회사 | Antenna module |
TWI655804B (en) * | 2017-08-03 | 2019-04-01 | 廣達電腦股份有限公司 | Communication device |
CN107565216A (en) | 2017-08-29 | 2018-01-09 | 广州三星通信技术研究有限公司 | The shell and electronic equipment of electronic equipment |
AU2018330181B2 (en) | 2017-09-07 | 2022-03-31 | Composecure, Llc | Transaction card with embedded electronic components and process for manufacture |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
PL4109337T3 (en) | 2017-10-18 | 2025-01-13 | Composecure Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and backlighting |
CN210489831U (en) | 2018-02-13 | 2020-05-08 | 株式会社村田制作所 | Antenna device and electronic apparatus |
JP6944415B2 (en) * | 2018-06-29 | 2021-10-06 | 株式会社日立製作所 | On-board communication device |
DE102018129569A1 (en) * | 2018-11-23 | 2020-05-28 | Infineon Technologies Ag | Smart card |
JP6546711B1 (en) * | 2019-04-10 | 2019-07-17 | 株式会社エスケーエレクトロニクス | Non-contact information carrier |
JP7182513B2 (en) * | 2019-05-24 | 2022-12-02 | 株式会社Soken | Magnetic components and power converters equipped with the same |
US20210081743A1 (en) | 2019-08-12 | 2021-03-18 | Federal Card Services, LLC | Dual interface metal cards and methods of manufacturing |
US12277462B2 (en) | 2019-08-14 | 2025-04-15 | Federal Card Services, LLC | Metal-containing dual interface smartcards |
US11113593B2 (en) | 2019-08-15 | 2021-09-07 | Federal Card Services; LLC | Contactless metal cards with fingerprint sensor and display |
US11162750B1 (en) * | 2019-09-16 | 2021-11-02 | Donald L. Weeks | Detection of firearms in a security zone using radio frequency identification tag embedded within weapon bolt carrier |
CN112566440A (en) * | 2019-09-25 | 2021-03-26 | 中兴通讯股份有限公司 | Electronic component and terminal equipment |
US11387678B2 (en) * | 2019-09-27 | 2022-07-12 | Apple Inc. | Stacked resonant structures for wireless power systems |
US11341385B2 (en) | 2019-11-16 | 2022-05-24 | Federal Card Services, LLC | RFID enabled metal transaction card with shaped opening and shaped slit |
US11303011B2 (en) | 2019-11-27 | 2022-04-12 | AQ Corporation | Smartphone antenna in flexible PCB |
WO2021138636A1 (en) * | 2019-12-30 | 2021-07-08 | Afreecar Llc | Configurable electric vehicle power and propulsion kit |
USD1032613S1 (en) | 2020-02-02 | 2024-06-25 | Federal Card Services, LLC | Smart card |
US11907790B2 (en) * | 2020-03-06 | 2024-02-20 | Hutchinson Technology Incorporated | Component identification |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
CN113708054B (en) * | 2020-05-20 | 2023-04-04 | 华为技术有限公司 | Electronic device |
DE102020116932A1 (en) * | 2020-06-26 | 2021-12-30 | Aesculap Ag | Medical instrument with transponder installation module and medical transponder communication system |
WO2023034642A1 (en) | 2021-09-06 | 2023-03-09 | Metaland Llc | Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card |
US12159180B1 (en) | 2021-11-29 | 2024-12-03 | Metaland Llc | RFID enabled metal transaction cards with coupler coil couplings and related methods |
KR102613064B1 (en) | 2023-08-14 | 2023-12-12 | 주식회사 티아이씨피 | A metal card having a contactless card function and the fabricating method thereof |
Family Cites Families (595)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3364564A (en) | 1965-06-28 | 1968-01-23 | Gregory Ind Inc | Method of producing welding studs dischargeable in end-to-end relationship |
JPS5754964B2 (en) | 1974-05-08 | 1982-11-20 | ||
JPS6193701A (en) | 1984-10-13 | 1986-05-12 | Toyota Motor Corp | Automotive antenna device |
JPS61284102A (en) * | 1985-06-11 | 1986-12-15 | Oki Electric Ind Co Ltd | Antenna for portable radio equipment |
JPS62127140U (en) | 1986-02-03 | 1987-08-12 | ||
JPH01212035A (en) | 1987-08-13 | 1989-08-25 | Secom Co Ltd | Electromagnetic field diversity reception method |
US5248989A (en) * | 1988-02-04 | 1993-09-28 | Unisan Ltd. | Magnetic field concentrator |
ZA89872B (en) * | 1988-02-04 | 1990-10-31 | Uniscan Ltd | Concentrator |
JPH0744114B2 (en) | 1988-12-16 | 1995-05-15 | 株式会社村田製作所 | Multilayer chip coil |
JPH02164105A (en) | 1988-12-19 | 1990-06-25 | Mitsubishi Electric Corp | Spiral antenna |
US5253969A (en) | 1989-03-10 | 1993-10-19 | Sms Schloemann-Siemag Aktiengesellschaft | Feeding system for strip material, particularly in treatment plants for metal strips |
JPH03171385A (en) | 1989-11-30 | 1991-07-24 | Sony Corp | Information card |
JP2662742B2 (en) | 1990-03-13 | 1997-10-15 | 株式会社村田製作所 | Bandpass filter |
JP2763664B2 (en) | 1990-07-25 | 1998-06-11 | 日本碍子株式会社 | Wiring board for distributed constant circuit |
JPH04150011A (en) | 1990-10-12 | 1992-05-22 | Tdk Corp | Composite electronic component |
JPH04167500A (en) | 1990-10-30 | 1992-06-15 | Omron Corp | Printed-circuit board management system |
JP2539367Y2 (en) | 1991-01-30 | 1997-06-25 | 株式会社村田製作所 | Multilayer electronic components |
NL9100176A (en) | 1991-02-01 | 1992-03-02 | Nedap Nv | Antenna configuration for contactless identification label - forms part of tuned circuit of ID or credit card interrogated via inductive coupling |
JP2558330Y2 (en) | 1991-02-06 | 1997-12-24 | オムロン株式会社 | Electromagnetic coupling type electronic equipment |
NL9100347A (en) | 1991-02-26 | 1992-03-02 | Nedap Nv | Integrated transformer circuit for ID or credit card - is interrogated via contactless inductive coupling using capacitor to form tuned circuit |
JPH04321190A (en) | 1991-04-22 | 1992-11-11 | Mitsubishi Electric Corp | Antenna circuit and its production for non-contact type portable storage |
JPH0745933Y2 (en) | 1991-06-07 | 1995-10-18 | 太陽誘電株式会社 | Multilayer ceramic inductance element |
DE69215283T2 (en) | 1991-07-08 | 1997-03-20 | Nippon Telegraph & Telephone | Extendable antenna system |
JP2839782B2 (en) | 1992-02-14 | 1998-12-16 | 三菱電機株式会社 | Printed slot antenna |
US5229652A (en) * | 1992-04-20 | 1993-07-20 | Hough Wayne E | Non-contact data and power connector for computer based modules |
JPH05327331A (en) | 1992-05-15 | 1993-12-10 | Matsushita Electric Works Ltd | Printed antenna |
JP3186235B2 (en) | 1992-07-30 | 2001-07-11 | 株式会社村田製作所 | Resonator antenna |
JPH0677729A (en) | 1992-08-25 | 1994-03-18 | Mitsubishi Electric Corp | Antenna integrated microwave circuit |
JP2592328Y2 (en) | 1992-09-09 | 1999-03-17 | 神鋼電機株式会社 | Antenna device |
JPH06177635A (en) | 1992-12-07 | 1994-06-24 | Mitsubishi Electric Corp | Cross dipole antenna system |
JPH06260949A (en) | 1993-03-03 | 1994-09-16 | Seiko Instr Inc | Radio equipment |
JPH07183836A (en) | 1993-12-22 | 1995-07-21 | San'eisha Mfg Co Ltd | Coupling filter device for distribution line carrier communication |
US5491483A (en) | 1994-01-05 | 1996-02-13 | Texas Instruments Incorporated | Single loop transponder system and method |
JP3427527B2 (en) | 1994-12-26 | 2003-07-22 | 凸版印刷株式会社 | Biodegradable laminate and biodegradable card |
US6096431A (en) | 1994-07-25 | 2000-08-01 | Toppan Printing Co., Ltd. | Biodegradable cards |
JP2999374B2 (en) | 1994-08-10 | 2000-01-17 | 太陽誘電株式会社 | Multilayer chip inductor |
JP3141692B2 (en) | 1994-08-11 | 2001-03-05 | 松下電器産業株式会社 | Millimeter wave detector |
DE4431754C1 (en) | 1994-09-06 | 1995-11-23 | Siemens Ag | Carrier element for ic module of chip card |
US5528222A (en) | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
JPH0887580A (en) | 1994-09-14 | 1996-04-02 | Omron Corp | Data carrier and ball game |
JP3064840B2 (en) | 1994-12-22 | 2000-07-12 | ソニー株式会社 | IC card |
JP2837829B2 (en) | 1995-03-31 | 1998-12-16 | 松下電器産業株式会社 | Inspection method for semiconductor device |
JPH08279027A (en) | 1995-04-04 | 1996-10-22 | Toshiba Corp | Radio communication card |
DE19516227C2 (en) | 1995-05-03 | 2002-02-07 | Infineon Technologies Ag | Data carrier arrangement, in particular chip card |
US5955723A (en) | 1995-05-03 | 1999-09-21 | Siemens Aktiengesellschaft | Contactless chip card |
JPH08307126A (en) | 1995-05-09 | 1996-11-22 | Kyocera Corp | Antenna storage structure |
JP3637982B2 (en) | 1995-06-27 | 2005-04-13 | 株式会社荏原電産 | Inverter-driven pump control system |
US5629241A (en) | 1995-07-07 | 1997-05-13 | Hughes Aircraft Company | Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
JP3150575B2 (en) | 1995-07-18 | 2001-03-26 | 沖電気工業株式会社 | Tag device and manufacturing method thereof |
GB2305075A (en) | 1995-09-05 | 1997-03-26 | Ibm | Radio Frequency Tag for Electronic Apparatus |
DE19534229A1 (en) | 1995-09-15 | 1997-03-20 | Licentia Gmbh | Transponder arrangement |
JPH0993029A (en) * | 1995-09-21 | 1997-04-04 | Matsushita Electric Ind Co Ltd | Antenna device |
JP3882218B2 (en) | 1996-03-04 | 2007-02-14 | ソニー株式会社 | optical disk |
JP3471160B2 (en) | 1996-03-18 | 2003-11-25 | 株式会社東芝 | Monolithic antenna |
JPH09270623A (en) | 1996-03-29 | 1997-10-14 | Murata Mfg Co Ltd | Antenna system |
JPH09284038A (en) * | 1996-04-17 | 1997-10-31 | Nhk Spring Co Ltd | Antenna equipment of non-contact data carrier |
JPH09294374A (en) | 1996-04-26 | 1997-11-11 | Hitachi Ltd | Power supply circuit |
JP3427663B2 (en) | 1996-06-18 | 2003-07-22 | 凸版印刷株式会社 | Non-contact IC card |
AUPO055296A0 (en) | 1996-06-19 | 1996-07-11 | Integrated Silicon Design Pty Ltd | Enhanced range transponder system |
US6104311A (en) | 1996-08-26 | 2000-08-15 | Addison Technologies | Information storage and identification tag |
JP3767030B2 (en) | 1996-09-09 | 2006-04-19 | 三菱電機株式会社 | Foldable wireless communication device |
BR9711887A (en) | 1996-10-09 | 2002-01-02 | Pav Card Gmbh | Connective arrangement and process for producing a smart card |
JPH10171954A (en) | 1996-12-05 | 1998-06-26 | Hitachi Maxell Ltd | Non-contact IC card |
JP3279205B2 (en) | 1996-12-10 | 2002-04-30 | 株式会社村田製作所 | Surface mount antenna and communication equipment |
JPH10193849A (en) | 1996-12-27 | 1998-07-28 | Rohm Co Ltd | Circuit chip-mounted card and circuit chip module |
JPH10193851A (en) | 1997-01-08 | 1998-07-28 | Denso Corp | Non-contact card |
DE19703029A1 (en) | 1997-01-28 | 1998-07-30 | Amatech Gmbh & Co Kg | Transmission module for a transponder device and transponder device and method for operating a transponder device |
JPH10242742A (en) | 1997-02-26 | 1998-09-11 | Harada Ind Co Ltd | Transmitting and receiving antenna |
AU734390B2 (en) | 1997-03-10 | 2001-06-14 | Precision Dynamics Corporation | Reactively coupled elements in circuits on flexible substrates |
JPH10293828A (en) | 1997-04-18 | 1998-11-04 | Omron Corp | Data carrier, coil module, reader / writer, and clothing data acquisition method |
JP3900593B2 (en) | 1997-05-27 | 2007-04-04 | 凸版印刷株式会社 | IC card and IC module |
JPH11346114A (en) | 1997-06-11 | 1999-12-14 | Matsushita Electric Ind Co Ltd | Antenna device |
JPH1125244A (en) * | 1997-06-27 | 1999-01-29 | Toshiba Chem Corp | Non-contact data carrier package |
JPH1125245A (en) * | 1997-06-27 | 1999-01-29 | Toshiba Chem Corp | Non-contact data carrier package |
JP3621560B2 (en) | 1997-07-24 | 2005-02-16 | 三菱電機株式会社 | Electromagnetic induction data carrier system |
JPH1175329A (en) | 1997-08-29 | 1999-03-16 | Hitachi Ltd | Non-contact IC card system |
JPH1185937A (en) | 1997-09-02 | 1999-03-30 | Nippon Lsi Card Kk | Non-contact lsi card and method for inspecting the same |
JPH1188241A (en) | 1997-09-04 | 1999-03-30 | Nippon Steel Corp | Data carrier system |
JP3853930B2 (en) | 1997-09-26 | 2006-12-06 | 株式会社マースエンジニアリング | Non-contact data carrier package and manufacturing method thereof |
JPH11103209A (en) | 1997-09-26 | 1999-04-13 | Fujitsu Ten Ltd | Radio wave reception equipment |
CN1179295C (en) | 1997-11-14 | 2004-12-08 | 凸版印刷株式会社 | Composite IC module and composite IC card |
JPH11149536A (en) | 1997-11-14 | 1999-06-02 | Toppan Printing Co Ltd | Composite IC card |
JP3800765B2 (en) | 1997-11-14 | 2006-07-26 | 凸版印刷株式会社 | Compound IC card |
JP3800766B2 (en) | 1997-11-14 | 2006-07-26 | 凸版印刷株式会社 | Compound IC module and compound IC card |
JPH11175678A (en) | 1997-12-09 | 1999-07-02 | Toppan Printing Co Ltd | IC module and IC card mounting the module |
JP4066520B2 (en) * | 1997-12-18 | 2008-03-26 | 株式会社デンソー | Non-contact IC card reader / writer |
JPH11220319A (en) | 1998-01-30 | 1999-08-10 | Sharp Corp | Antenna system |
JPH11219420A (en) | 1998-02-03 | 1999-08-10 | Tokin Corp | Ic card module, ic card and their manufacture |
JP2001084463A (en) | 1999-09-14 | 2001-03-30 | Miyake:Kk | Resonance circuit |
JPH11261325A (en) | 1998-03-10 | 1999-09-24 | Shiro Sugimura | Coil element and manufacturing method thereof |
JP4260917B2 (en) | 1998-03-31 | 2009-04-30 | 株式会社東芝 | Loop antenna |
EP0987789A4 (en) | 1998-03-31 | 2004-09-22 | Matsushita Electric Ind Co Ltd | Antenna unit and digital television receiver |
US5936150A (en) | 1998-04-13 | 1999-08-10 | Rockwell Science Center, Llc | Thin film resonant chemical sensor with resonant acoustic isolator |
WO1999052783A1 (en) | 1998-04-14 | 1999-10-21 | Liberty Carton Company | Container for compressors and other goods |
JP4030651B2 (en) * | 1998-05-12 | 2008-01-09 | 三菱電機株式会社 | Mobile phone |
JPH11328352A (en) | 1998-05-19 | 1999-11-30 | Tokin Corp | Connection structure between antenna and ic chip, and ic card |
US6018299A (en) | 1998-06-09 | 2000-01-25 | Motorola, Inc. | Radio frequency identification tag having a printed antenna and method |
US6107920A (en) | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
JP2000021639A (en) | 1998-07-02 | 2000-01-21 | Sharp Corp | Inductor, resonance circuit using the same, matching circuit, antenna circuit, and oscillation circuit |
JP2000022421A (en) | 1998-07-03 | 2000-01-21 | Murata Mfg Co Ltd | Chip antenna and radio device mounted with it |
JP2000021128A (en) | 1998-07-03 | 2000-01-21 | Nippon Steel Corp | Disk-shaped storage medium and its storage case |
AUPP473898A0 (en) | 1998-07-20 | 1998-08-13 | Integrated Silicon Design Pty Ltd | Metal screened electronic labelling system |
JP2000311226A (en) | 1998-07-28 | 2000-11-07 | Toshiba Corp | Radio ic card and its production and read and write system of the same |
EP0977145A3 (en) | 1998-07-28 | 2002-11-06 | Kabushiki Kaisha Toshiba | Radio IC card |
JP3956172B2 (en) | 1998-07-31 | 2007-08-08 | 吉川アールエフシステム株式会社 | Data carrier and antenna for data carrier |
JP2000059260A (en) | 1998-08-04 | 2000-02-25 | Sony Corp | Storage device |
CN1312928A (en) | 1998-08-14 | 2001-09-12 | 3M创新有限公司 | Application for a radio frequency identification system |
ATE394753T1 (en) | 1998-08-14 | 2008-05-15 | 3M Innovative Properties Co | APPLICATIONS FOR RF IDENTIFICATION SYSTEMS |
JP4411670B2 (en) | 1998-09-08 | 2010-02-10 | 凸版印刷株式会社 | Non-contact IC card manufacturing method |
JP4508301B2 (en) | 1998-09-16 | 2010-07-21 | 大日本印刷株式会社 | Non-contact IC card |
JP3632466B2 (en) | 1998-10-23 | 2005-03-23 | 凸版印刷株式会社 | Inspection device and inspection method for non-contact IC card |
JP3924962B2 (en) | 1998-10-30 | 2007-06-06 | 株式会社デンソー | ID tag for dishes |
JP2000137779A (en) | 1998-10-30 | 2000-05-16 | Hitachi Maxell Ltd | Non-contact information medium and its manufacturing method |
JP2000137785A (en) | 1998-10-30 | 2000-05-16 | Sony Corp | Manufacture of noncontact type ic card and noncontact type ic card |
US6837438B1 (en) | 1998-10-30 | 2005-01-04 | Hitachi Maxell, Ltd. | Non-contact information medium and communication system utilizing the same |
JP2000148948A (en) | 1998-11-05 | 2000-05-30 | Sony Corp | Non-contact ic label and its manufacture |
JP2000172812A (en) | 1998-12-08 | 2000-06-23 | Hitachi Maxell Ltd | Noncontact information medium |
FR2787640B1 (en) * | 1998-12-22 | 2003-02-14 | Gemplus Card Int | ARRANGEMENT OF AN ANTENNA IN A METALLIC ENVIRONMENT |
JP3088404B2 (en) | 1999-01-14 | 2000-09-18 | 埼玉日本電気株式会社 | Mobile radio terminal and built-in antenna |
JP2000222540A (en) | 1999-02-03 | 2000-08-11 | Hitachi Maxell Ltd | Non-contact type semiconductor tag |
JP2000228602A (en) | 1999-02-08 | 2000-08-15 | Alps Electric Co Ltd | Resonance line |
JP2000243797A (en) | 1999-02-18 | 2000-09-08 | Sanken Electric Co Ltd | Semiconductor wafer, and cutting method thereof, and semiconductor wafer assembly and cutting method thereof |
JP3967487B2 (en) | 1999-02-23 | 2007-08-29 | 株式会社東芝 | IC card |
JP2000251049A (en) | 1999-03-03 | 2000-09-14 | Konica Corp | Card and production thereof |
JP4106673B2 (en) | 1999-03-05 | 2008-06-25 | 株式会社エフ・イー・シー | Antenna device using coil unit, printed circuit board |
JP4349597B2 (en) | 1999-03-26 | 2009-10-21 | 大日本印刷株式会社 | IC chip manufacturing method and memory medium manufacturing method incorporating the same |
JP3751178B2 (en) | 1999-03-30 | 2006-03-01 | 日本碍子株式会社 | Transceiver |
US6542050B1 (en) | 1999-03-30 | 2003-04-01 | Ngk Insulators, Ltd. | Transmitter-receiver |
JP2000286634A (en) | 1999-03-30 | 2000-10-13 | Ngk Insulators Ltd | Antenna system and its manufacture |
JP3067764B1 (en) | 1999-03-31 | 2000-07-24 | 株式会社豊田自動織機製作所 | Mobile communication coupler, mobile body, and mobile communication method |
JP2000321984A (en) | 1999-05-12 | 2000-11-24 | Hitachi Ltd | Label with RF-ID tag |
JP4286977B2 (en) | 1999-07-02 | 2009-07-01 | 大日本印刷株式会社 | Non-contact type IC card and its antenna characteristic adjustment method |
JP3557130B2 (en) | 1999-07-14 | 2004-08-25 | 新光電気工業株式会社 | Method for manufacturing semiconductor device |
JP2001043340A (en) | 1999-07-29 | 2001-02-16 | Toppan Printing Co Ltd | Composite IC card |
JP2001066990A (en) | 1999-08-31 | 2001-03-16 | Sumitomo Bakelite Co Ltd | Protective filter and protection method of ic tag |
US6259369B1 (en) | 1999-09-30 | 2001-07-10 | Moore North America, Inc. | Low cost long distance RFID reading |
JP2001101369A (en) | 1999-10-01 | 2001-04-13 | Matsushita Electric Ind Co Ltd | RF tag |
JP3451373B2 (en) | 1999-11-24 | 2003-09-29 | オムロン株式会社 | Manufacturing method of data carrier capable of reading electromagnetic wave |
JP4186149B2 (en) | 1999-12-06 | 2008-11-26 | 株式会社エフ・イー・シー | Auxiliary antenna for IC card |
JP2001188890A (en) | 2000-01-05 | 2001-07-10 | Omron Corp | Non-contact tag |
US7334734B2 (en) | 2000-01-27 | 2008-02-26 | Hitachi Maxwell, Ltd. | Non-contact IC module |
JP2001209767A (en) | 2000-01-27 | 2001-08-03 | Hitachi Maxell Ltd | Accessee with non-contact IC module |
JP2001240046A (en) | 2000-02-25 | 2001-09-04 | Toppan Forms Co Ltd | Container and manufacturing method thereof |
JP4514880B2 (en) | 2000-02-28 | 2010-07-28 | 大日本印刷株式会社 | Book delivery, returns and inventory management system |
JP2001257292A (en) | 2000-03-10 | 2001-09-21 | Hitachi Maxell Ltd | Semiconductor device |
JP2001256457A (en) | 2000-03-13 | 2001-09-21 | Toshiba Corp | Semiconductor device, its manufacture and ic card communication system |
US6796508B2 (en) | 2000-03-28 | 2004-09-28 | Lucatron Ag | Rfid-label with an element for regulating the resonance frequency |
JP4624536B2 (en) | 2000-04-04 | 2011-02-02 | 大日本印刷株式会社 | Non-contact data carrier device |
JP4624537B2 (en) | 2000-04-04 | 2011-02-02 | 大日本印刷株式会社 | Non-contact data carrier device, storage |
JP2001291181A (en) | 2000-04-07 | 2001-10-19 | Ricoh Elemex Corp | Sensor and sensor system |
JP2001319380A (en) | 2000-05-11 | 2001-11-16 | Mitsubishi Materials Corp | Optical disk with rfid |
JP2001326526A (en) * | 2000-05-16 | 2001-11-22 | Mitsubishi Electric Corp | Shield antenna coil |
JP2001331976A (en) | 2000-05-17 | 2001-11-30 | Casio Comput Co Ltd | Optical recording type recording medium |
JP4223174B2 (en) | 2000-05-19 | 2009-02-12 | Dxアンテナ株式会社 | Film antenna |
JP2001339226A (en) | 2000-05-26 | 2001-12-07 | Nec Saitama Ltd | Antenna system |
JP2001344574A (en) | 2000-05-30 | 2001-12-14 | Mitsubishi Materials Corp | Antenna device for interrogator |
JP2001352176A (en) | 2000-06-05 | 2001-12-21 | Fuji Xerox Co Ltd | Multilayer printed wiring board and manufacturing method of multilayer printed wiring board |
WO2001095242A2 (en) | 2000-06-06 | 2001-12-13 | Battelle Memorial Institute | Remote communication system |
JP2001358527A (en) | 2000-06-12 | 2001-12-26 | Matsushita Electric Ind Co Ltd | Antenna device |
EP1172760B1 (en) | 2000-06-23 | 2004-12-01 | Toyo Aluminium Kabushiki Kaisha | Antenna coil for IC card and manufacturing method thereof |
JP2002157564A (en) | 2000-11-21 | 2002-05-31 | Toyo Aluminium Kk | Antenna coil for ic card and its manufacturing method |
CN1233104C (en) | 2000-07-04 | 2005-12-21 | 克里蒂帕斯株式会社 | Passive transponder identification system and credit-card type transponder |
JP4138211B2 (en) | 2000-07-06 | 2008-08-27 | 株式会社村田製作所 | Electronic component and manufacturing method thereof, collective electronic component, mounting structure of electronic component, and electronic apparatus |
JP2002024776A (en) | 2000-07-07 | 2002-01-25 | Nippon Signal Co Ltd:The | Ic card reader/writer |
JP2001076111A (en) | 2000-07-12 | 2001-03-23 | Hitachi Kokusai Electric Inc | Resonance circuit |
JP2002032731A (en) | 2000-07-14 | 2002-01-31 | Sony Corp | Non-contact information exchange card |
KR100758100B1 (en) | 2000-07-19 | 2007-09-11 | 가부시키가이샤 하넥스 | RDF tag housing structure, RDF tag installation structure and RDF tag communication method |
RU2163739C1 (en) | 2000-07-20 | 2001-02-27 | Криштопов Александр Владимирович | Antenna |
JP2002042076A (en) | 2000-07-21 | 2002-02-08 | Dainippon Printing Co Ltd | Non-contact data carrier and booklet therewith |
JP2002042083A (en) | 2000-07-27 | 2002-02-08 | Hitachi Maxell Ltd | Non-contact communication information carrier |
JP3075400U (en) | 2000-08-03 | 2001-02-16 | 昌栄印刷株式会社 | Non-contact IC card |
US6466007B1 (en) | 2000-08-14 | 2002-10-15 | Teradyne, Inc. | Test system for smart card and indentification devices and the like |
JP2002063557A (en) | 2000-08-21 | 2002-02-28 | Mitsubishi Materials Corp | Tag for rfid |
JP2002076750A (en) | 2000-08-24 | 2002-03-15 | Murata Mfg Co Ltd | Antenna device and radio equipment equipped with it |
JP2002143826A (en) | 2000-08-30 | 2002-05-21 | Denso Corp | System for recycling waste and system for detecting unlawful dumping |
JP3481575B2 (en) * | 2000-09-28 | 2003-12-22 | 寛児 川上 | antenna |
JP4615695B2 (en) | 2000-10-19 | 2011-01-19 | 三星エスディーエス株式会社 | IC module for IC card and IC card using it |
US6634564B2 (en) | 2000-10-24 | 2003-10-21 | Dai Nippon Printing Co., Ltd. | Contact/noncontact type data carrier module |
JP4628611B2 (en) | 2000-10-27 | 2011-02-09 | 三菱マテリアル株式会社 | antenna |
JP4432254B2 (en) | 2000-11-20 | 2010-03-17 | 株式会社村田製作所 | Surface mount antenna structure and communication device including the same |
JP2002185358A (en) | 2000-11-24 | 2002-06-28 | Supersensor Pty Ltd | Method for fitting rf transponder to container |
JP4641096B2 (en) | 2000-12-07 | 2011-03-02 | 大日本印刷株式会社 | Non-contact data carrier device and wiring member for booster antenna |
JP2002183676A (en) | 2000-12-08 | 2002-06-28 | Hitachi Ltd | Information reading device |
JP2002175920A (en) | 2000-12-08 | 2002-06-21 | Murata Mfg Co Ltd | High-frequency filter element |
JP2002183690A (en) | 2000-12-11 | 2002-06-28 | Hitachi Maxell Ltd | Non-contact IC tag device |
AU2002226093A1 (en) | 2000-12-15 | 2002-06-24 | Electrox Corp. | Process for the manufacture of novel, inexpensive radio frequency identificationdevices |
JP3788325B2 (en) | 2000-12-19 | 2006-06-21 | 株式会社村田製作所 | Multilayer coil component and manufacturing method thereof |
JP3621655B2 (en) | 2001-04-23 | 2005-02-16 | 株式会社ハネックス中央研究所 | RFID tag structure and manufacturing method thereof |
TW531976B (en) | 2001-01-11 | 2003-05-11 | Hanex Co Ltd | Communication apparatus and installing structure, manufacturing method and communication method |
KR20020061103A (en) | 2001-01-12 | 2002-07-22 | 후루까와덴끼고오교 가부시끼가이샤 | Antenna device and terminal with the antenna device |
JP2002280821A (en) | 2001-01-12 | 2002-09-27 | Furukawa Electric Co Ltd:The | Antenna system and terminal equipment |
JP2002222398A (en) | 2001-01-25 | 2002-08-09 | Jstm Kk | Non-contact data carrier |
JP2002232221A (en) | 2001-01-30 | 2002-08-16 | Alps Electric Co Ltd | Transmission and reception unit |
WO2002061675A1 (en) | 2001-01-31 | 2002-08-08 | Hitachi, Ltd. | Non-contact identification medium |
JP4662400B2 (en) | 2001-02-05 | 2011-03-30 | 大日本印刷株式会社 | Articles with coil-on-chip semiconductor modules |
JP2002246828A (en) | 2001-02-15 | 2002-08-30 | Mitsubishi Materials Corp | Antenna for transponder |
JP4396046B2 (en) | 2001-02-16 | 2010-01-13 | 株式会社デンソー | Reader / writer for ID tag |
DE60239262D1 (en) | 2001-03-02 | 2011-04-07 | Nxp Bv | MODULE AND ELECTRONIC DEVICE |
JP4712986B2 (en) | 2001-03-06 | 2011-06-29 | 大日本印刷株式会社 | Liquid container with RFID tag |
JP2002290130A (en) | 2001-03-28 | 2002-10-04 | Aiwa Co Ltd | Radio communication unit |
JP3570386B2 (en) | 2001-03-30 | 2004-09-29 | 松下電器産業株式会社 | Portable information terminal with built-in wireless function |
JP3772778B2 (en) | 2001-03-30 | 2006-05-10 | 三菱マテリアル株式会社 | Antenna coil, identification tag using the same, reader / writer device, reader device and writer device |
JP2002298109A (en) | 2001-03-30 | 2002-10-11 | Toppan Forms Co Ltd | Contactless ic medium and manufacturing method thereof |
JP2002308437A (en) | 2001-04-16 | 2002-10-23 | Dainippon Printing Co Ltd | Inspection system using rfid tag |
JP2002319812A (en) | 2001-04-20 | 2002-10-31 | Oji Paper Co Ltd | Data carrier attachment method |
JP4700831B2 (en) | 2001-04-23 | 2011-06-15 | 株式会社ハネックス | RFID tag communication distance expansion method |
JP4265114B2 (en) | 2001-04-26 | 2009-05-20 | 三菱マテリアル株式会社 | Antenna coil for tags |
JP2002325013A (en) * | 2001-04-26 | 2002-11-08 | Mitsubishi Materials Corp | Antenna coil |
JP3850680B2 (en) * | 2001-05-15 | 2006-11-29 | サクサ株式会社 | Non-contact type IC card reader / writer device |
JP2005236339A (en) | 2001-07-19 | 2005-09-02 | Oji Paper Co Ltd | IC chip assembly |
FI112550B (en) | 2001-05-31 | 2003-12-15 | Rafsec Oy | Smart label and smart label path |
JP2002362613A (en) | 2001-06-07 | 2002-12-18 | Toppan Printing Co Ltd | Laminated packaging material in which non-contact IC is laminated, packaging container using the same, and method for detecting opening of packaging container |
JP2002366917A (en) | 2001-06-07 | 2002-12-20 | Hitachi Ltd | IC card with built-in antenna |
JP4710174B2 (en) | 2001-06-13 | 2011-06-29 | 株式会社村田製作所 | Balanced LC filter |
JP2002373029A (en) | 2001-06-18 | 2002-12-26 | Hitachi Ltd | How to prevent unauthorized copying of software using IC tags |
JP4882167B2 (en) | 2001-06-18 | 2012-02-22 | 大日本印刷株式会社 | Card-integrated form with non-contact IC chip |
JP4759854B2 (en) | 2001-06-19 | 2011-08-31 | 株式会社寺岡精工 | Mounting method of IC tag to metal object and IC tag built-in marker |
JP2003087008A (en) | 2001-07-02 | 2003-03-20 | Ngk Insulators Ltd | Multilayer dielectric filter |
JP4058919B2 (en) | 2001-07-03 | 2008-03-12 | 日立化成工業株式会社 | Non-contact IC label, non-contact IC card, non-contact IC label or IC module for non-contact IC card |
JP2003026177A (en) | 2001-07-12 | 2003-01-29 | Toppan Printing Co Ltd | Non-contact package with IC chip |
JP2003030612A (en) | 2001-07-19 | 2003-01-31 | Oji Paper Co Ltd | Ic chip mounting body |
JP4670195B2 (en) | 2001-07-23 | 2011-04-13 | 凸版印刷株式会社 | Mobile phone case with non-contact IC card |
US7274285B2 (en) | 2001-07-24 | 2007-09-25 | Hewlett-Packard Development Company, L.P. | System and method for improved object identification |
DE60131270T2 (en) | 2001-07-26 | 2008-08-21 | Irdeto Access B.V. | Time Valid reasoning system |
JP3629448B2 (en) | 2001-07-27 | 2005-03-16 | Tdk株式会社 | ANTENNA DEVICE AND ELECTRONIC DEVICE HAVING THE SAME |
JP4731060B2 (en) | 2001-07-31 | 2011-07-20 | トッパン・フォームズ株式会社 | RF-ID inspection method and inspection system |
JP2003058840A (en) | 2001-08-14 | 2003-02-28 | Hirano Design Sekkei:Kk | Information protection management program utilizing rfid-loaded computer recording medium |
JP2003069335A (en) | 2001-08-28 | 2003-03-07 | Hitachi Kokusai Electric Inc | Auxiliary antenna |
JP2003067711A (en) | 2001-08-29 | 2003-03-07 | Toppan Forms Co Ltd | Article provided with ic chip mounting body or antenna part |
JP2003078336A (en) | 2001-08-30 | 2003-03-14 | Tokai Univ | Stacked spiral antenna |
JP2003078333A (en) | 2001-08-30 | 2003-03-14 | Murata Mfg Co Ltd | Radio communication apparatus |
JP4843885B2 (en) | 2001-08-31 | 2011-12-21 | 凸版印刷株式会社 | Fraud prevention label with IC memory chip |
JP4514374B2 (en) | 2001-09-05 | 2010-07-28 | トッパン・フォームズ株式会社 | RF-ID inspection system |
JP4747467B2 (en) | 2001-09-07 | 2011-08-17 | 大日本印刷株式会社 | Non-contact IC tag |
JP2003085520A (en) | 2001-09-11 | 2003-03-20 | Oji Paper Co Ltd | IC card manufacturing method |
JP2003087044A (en) | 2001-09-12 | 2003-03-20 | Mitsubishi Materials Corp | Antenna for rfid and rfid system having the antenna |
JP4845306B2 (en) | 2001-09-25 | 2011-12-28 | トッパン・フォームズ株式会社 | RF-ID inspection system |
JP2003099184A (en) | 2001-09-25 | 2003-04-04 | Sharp Corp | Information system and information processor and input pen to be used for the same system |
JP4698096B2 (en) | 2001-09-25 | 2011-06-08 | トッパン・フォームズ株式会社 | RF-ID inspection system |
JP2003110344A (en) | 2001-09-26 | 2003-04-11 | Hitachi Metals Ltd | Surface-mounting type antenna and antenna device mounting the same |
JP4196554B2 (en) | 2001-09-28 | 2008-12-17 | 三菱マテリアル株式会社 | Tag antenna coil and RFID tag using the same |
KR20040037127A (en) | 2001-09-28 | 2004-05-04 | 미쓰비시 마테리알 가부시키가이샤 | Antenna coil and rfid-use tag using it, transponder-use antenna |
JP2003132330A (en) | 2001-10-25 | 2003-05-09 | Sato Corp | RFID label printer |
JP2003134007A (en) | 2001-10-30 | 2003-05-09 | Auto Network Gijutsu Kenkyusho:Kk | Signal transmission / reception system between vehicle-mounted devices and signal transmission / reception method between vehicle-mounted devices |
JP3984458B2 (en) | 2001-11-20 | 2007-10-03 | 大日本印刷株式会社 | Manufacturing method of package with IC tag |
JP3908514B2 (en) | 2001-11-20 | 2007-04-25 | 大日本印刷株式会社 | Package with IC tag and method of manufacturing package with IC tag |
US6812707B2 (en) | 2001-11-27 | 2004-11-02 | Mitsubishi Materials Corporation | Detection element for objects and detection device using the same |
JP3894540B2 (en) | 2001-11-30 | 2007-03-22 | トッパン・フォームズ株式会社 | Interposer with conductive connection |
JP2003188338A (en) | 2001-12-13 | 2003-07-04 | Sony Corp | Circuit board and its manufacturing method |
JP3700777B2 (en) | 2001-12-17 | 2005-09-28 | 三菱マテリアル株式会社 | Electrode structure of RFID tag and method for adjusting resonance frequency using the electrode |
JP2003188620A (en) | 2001-12-19 | 2003-07-04 | Murata Mfg Co Ltd | Antenna integral with module |
JP4028224B2 (en) | 2001-12-20 | 2007-12-26 | 大日本印刷株式会社 | Paper IC card substrate having non-contact communication function |
JP3895175B2 (en) | 2001-12-28 | 2007-03-22 | Ntn株式会社 | Dielectric resin integrated antenna |
CN101308947A (en) * | 2002-01-17 | 2008-11-19 | 三菱麻铁里亚尔株式会社 | Antenna for reader/writer and reader/writer having the antenna |
JP3896965B2 (en) | 2002-01-17 | 2007-03-22 | 三菱マテリアル株式会社 | Reader / writer antenna and reader / writer equipped with the antenna |
JP2003209421A (en) | 2002-01-17 | 2003-07-25 | Dainippon Printing Co Ltd | Rfid tag having transparent antenna and production method therefor |
JP3915092B2 (en) | 2002-01-21 | 2007-05-16 | 株式会社エフ・イー・シー | Booster antenna for IC card |
JP2003216919A (en) | 2002-01-23 | 2003-07-31 | Toppan Forms Co Ltd | Rf-id media |
JP2003233780A (en) | 2002-02-06 | 2003-08-22 | Mitsubishi Electric Corp | Data communication device |
JP3998992B2 (en) | 2002-02-14 | 2007-10-31 | 大日本印刷株式会社 | Method for forming antenna pattern on IC chip mounted on web and package with IC tag |
JP2003243918A (en) | 2002-02-18 | 2003-08-29 | Dainippon Printing Co Ltd | Antenna for non-contact ic tag, and non-contact ic tag |
JP2003249813A (en) | 2002-02-25 | 2003-09-05 | Tecdia Kk | RFID tag with loop antenna |
JP2003331250A (en) * | 2002-03-05 | 2003-11-21 | Mitsubishi Materials Corp | Small disk with rfid |
US7119693B1 (en) | 2002-03-13 | 2006-10-10 | Celis Semiconductor Corp. | Integrated circuit with enhanced coupling |
JP2003288560A (en) | 2002-03-27 | 2003-10-10 | Toppan Forms Co Ltd | Interposer and inlet sheet with antistatic function |
US7129834B2 (en) | 2002-03-28 | 2006-10-31 | Kabushiki Kaisha Toshiba | String wireless sensor and its manufacturing method |
JP2003309418A (en) | 2002-04-17 | 2003-10-31 | Alps Electric Co Ltd | Dipole antenna |
JP2003308363A (en) | 2002-04-18 | 2003-10-31 | Oki Electric Ind Co Ltd | Product and related information management method |
US7135974B2 (en) | 2002-04-22 | 2006-11-14 | Symbol Technologies, Inc. | Power source system for RF location/identification tags |
JP2003317060A (en) | 2002-04-22 | 2003-11-07 | Dainippon Printing Co Ltd | Ic card |
JP2003317052A (en) | 2002-04-24 | 2003-11-07 | Smart Card:Kk | Ic tag system |
WO2003094373A1 (en) * | 2002-05-02 | 2003-11-13 | Sony Ericsson Mobile Communications Ab | Integrated antenna assembly |
JP3879098B2 (en) | 2002-05-10 | 2007-02-07 | 株式会社エフ・イー・シー | Booster antenna for IC card |
JP3979178B2 (en) | 2002-05-14 | 2007-09-19 | 凸版印刷株式会社 | Non-contact IC medium module and non-contact IC medium |
US6753814B2 (en) | 2002-06-27 | 2004-06-22 | Harris Corporation | Dipole arrangements using dielectric substrates of meta-materials |
JP3863464B2 (en) | 2002-07-05 | 2006-12-27 | 株式会社ヨコオ | Filter built-in antenna |
JP3803085B2 (en) | 2002-08-08 | 2006-08-02 | 株式会社日立製作所 | Wireless IC tag |
JP4100993B2 (en) | 2002-08-09 | 2008-06-11 | キヤノン株式会社 | Electronics |
JP2004088218A (en) | 2002-08-23 | 2004-03-18 | Tokai Univ | Planar antenna |
JP4107381B2 (en) | 2002-08-23 | 2008-06-25 | 横浜ゴム株式会社 | Pneumatic tire |
JP4273724B2 (en) | 2002-08-29 | 2009-06-03 | カシオ電子工業株式会社 | Consumables unauthorized use prevention system |
JP2004096566A (en) | 2002-09-02 | 2004-03-25 | Toenec Corp | Inductive communication equipment |
JP3925364B2 (en) | 2002-09-03 | 2007-06-06 | 株式会社豊田中央研究所 | Antenna and diversity receiver |
JP3645239B2 (en) | 2002-09-06 | 2005-05-11 | シャープ株式会社 | Dipole antenna, tag and moving object identification system using the same |
DE10393263T5 (en) | 2002-09-20 | 2005-09-15 | Fairchild Semiconductor Corp. | A high bandwidth logarithmic helix antenna method and system for a radio frequency identification tagging system |
JP3975918B2 (en) | 2002-09-27 | 2007-09-12 | ソニー株式会社 | Antenna device |
JP4232474B2 (en) * | 2002-09-27 | 2009-03-04 | ソニー株式会社 | Electronic equipment with communication function |
JP2004121412A (en) | 2002-09-30 | 2004-04-22 | Toppan Printing Co Ltd | Surgical gauze and its management device |
JP2004126750A (en) | 2002-09-30 | 2004-04-22 | Toppan Forms Co Ltd | Information write/read device, antenna and rf-id medium |
JP3958667B2 (en) | 2002-10-16 | 2007-08-15 | 株式会社日立国際電気 | Loop antenna for reader / writer, and article management shelf and book management system provided with the loop antenna |
BR0315356A (en) | 2002-10-17 | 2005-08-23 | Ambient Corp | Filter to segment power lines in communications |
JP4158483B2 (en) | 2002-10-22 | 2008-10-01 | ソニー株式会社 | IC module |
JP3659956B2 (en) | 2002-11-11 | 2005-06-15 | 松下電器産業株式会社 | Pressure measuring device and pressure measuring system |
JP3789424B2 (en) | 2002-11-20 | 2006-06-21 | 埼玉日本電気株式会社 | Mobile device |
JP2004213582A (en) | 2003-01-09 | 2004-07-29 | Mitsubishi Materials Corp | Rfid tag, reader/writer and rfid system with tag |
DE602004026549D1 (en) | 2003-02-03 | 2010-05-27 | Panasonic Corp | ANTENNA DEVICE AND THEREOF USING WIRELESS COMMUNICATION DEVICE |
JP2004234595A (en) | 2003-02-03 | 2004-08-19 | Matsushita Electric Ind Co Ltd | Information recording medium reader |
EP1445821A1 (en) | 2003-02-06 | 2004-08-11 | Matsushita Electric Industrial Co., Ltd. | Portable radio communication apparatus provided with a boom portion |
US7225992B2 (en) | 2003-02-13 | 2007-06-05 | Avery Dennison Corporation | RFID device tester and method |
JP2004253858A (en) | 2003-02-18 | 2004-09-09 | Minerva:Kk | Booster antenna device for ic tag |
JP2004280390A (en) | 2003-03-14 | 2004-10-07 | Toppan Forms Co Ltd | Rf-id media and method for manufacturing the same |
JP4010263B2 (en) | 2003-03-14 | 2007-11-21 | 富士電機ホールディングス株式会社 | Antenna and data reader |
JP4034676B2 (en) | 2003-03-20 | 2008-01-16 | 日立マクセル株式会社 | Non-contact communication type information carrier |
JP4097139B2 (en) | 2003-03-26 | 2008-06-11 | Necトーキン株式会社 | Wireless tag |
JP2004297249A (en) | 2003-03-26 | 2004-10-21 | Matsushita Electric Ind Co Ltd | Coupler between different phases and its mounting method, and coupling method between different phases |
JP2004297681A (en) | 2003-03-28 | 2004-10-21 | Toppan Forms Co Ltd | Non-contact information recording medium |
JP2004304370A (en) | 2003-03-28 | 2004-10-28 | Sony Corp | Antenna coil and communication equipment |
JP4208631B2 (en) | 2003-04-17 | 2009-01-14 | 日本ミクロン株式会社 | Manufacturing method of semiconductor device |
JP2004326380A (en) | 2003-04-24 | 2004-11-18 | Dainippon Printing Co Ltd | Rfid tag |
JP2004334268A (en) | 2003-04-30 | 2004-11-25 | Dainippon Printing Co Ltd | Paper slip ic tag, book/magazine with it, and book with it |
JP2004336250A (en) | 2003-05-02 | 2004-11-25 | Taiyo Yuden Co Ltd | Antenna matching circuit, and mobile communication apparatus and dielectric antenna having the same |
JP4080944B2 (en) | 2003-05-12 | 2008-04-23 | 株式会社ハネックス | Data carrier installation structure |
JP2004343000A (en) | 2003-05-19 | 2004-12-02 | Fujikura Ltd | Semiconductor module, non-contact integrated circuit tag having the semiconductor module, and method of manufacturing semiconductor module |
JP2004362190A (en) | 2003-06-04 | 2004-12-24 | Hitachi Ltd | Semiconductor device |
JP4828088B2 (en) | 2003-06-05 | 2011-11-30 | 凸版印刷株式会社 | IC tag |
JP2005005866A (en) | 2003-06-10 | 2005-01-06 | Alps Electric Co Ltd | Antenna-integrated module |
JP3596774B1 (en) | 2003-06-12 | 2004-12-02 | 松下電器産業株式会社 | Portable radio |
JP4210559B2 (en) | 2003-06-23 | 2009-01-21 | 大日本印刷株式会社 | Sheet with IC tag and manufacturing method thereof |
JP2005033461A (en) * | 2003-07-11 | 2005-02-03 | Mitsubishi Materials Corp | Rfid system and structure of antenna therein |
JP2005050581A (en) | 2003-07-30 | 2005-02-24 | Seiko Epson Corp | Power cord, power cord inspection device and power cord inspection method |
JP2005064799A (en) | 2003-08-11 | 2005-03-10 | Toppan Printing Co Ltd | RFID antenna for portable information terminal equipment |
JP3982476B2 (en) * | 2003-10-01 | 2007-09-26 | ソニー株式会社 | Communications system |
JP4062233B2 (en) | 2003-10-20 | 2008-03-19 | トヨタ自動車株式会社 | Loop antenna device |
JP4680489B2 (en) | 2003-10-21 | 2011-05-11 | 三菱電機株式会社 | Information record reading system |
JP2005134942A (en) | 2003-10-28 | 2005-05-26 | Mitsubishi Materials Corp | Rfid reader/writer and structure of antenna |
JP3570430B1 (en) | 2003-10-29 | 2004-09-29 | オムロン株式会社 | Loop coil antenna |
JP4402426B2 (en) | 2003-10-30 | 2010-01-20 | 大日本印刷株式会社 | Temperature change detection system |
JP4343655B2 (en) | 2003-11-12 | 2009-10-14 | 株式会社日立製作所 | antenna |
JP4451125B2 (en) | 2003-11-28 | 2010-04-14 | シャープ株式会社 | Small antenna |
JP2005165839A (en) | 2003-12-04 | 2005-06-23 | Nippon Signal Co Ltd:The | Reader/writer, ic tag, article control device, and optical disk device |
JP4177241B2 (en) | 2003-12-04 | 2008-11-05 | 株式会社日立情報制御ソリューションズ | Wireless IC tag antenna, wireless IC tag, and container with wireless IC tag |
US7494066B2 (en) | 2003-12-19 | 2009-02-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP4916658B2 (en) | 2003-12-19 | 2012-04-18 | 株式会社半導体エネルギー研究所 | Semiconductor device |
US6999028B2 (en) | 2003-12-23 | 2006-02-14 | 3M Innovative Properties Company | Ultra high frequency radio frequency identification tag |
JP4326936B2 (en) | 2003-12-24 | 2009-09-09 | シャープ株式会社 | Wireless tag |
ATE503287T1 (en) | 2003-12-25 | 2011-04-15 | Mitsubishi Materials Corp | ANTENNA DEVICE AND COMMUNICATION DEVICE |
JP4089680B2 (en) | 2003-12-25 | 2008-05-28 | 三菱マテリアル株式会社 | Antenna device |
JP2005210676A (en) | 2003-12-25 | 2005-08-04 | Hitachi Ltd | Wireless IC tag, wireless IC tag manufacturing method, and wireless IC tag manufacturing apparatus |
EP1548674A1 (en) | 2003-12-25 | 2005-06-29 | Hitachi, Ltd. | Radio IC tag, method and apparatus for manufacturing the same |
JP4218519B2 (en) * | 2003-12-26 | 2009-02-04 | 戸田工業株式会社 | Magnetic field antenna, wireless system and communication system using the same |
JP2005190417A (en) | 2003-12-26 | 2005-07-14 | Taketani Shoji:Kk | Fixed object management system and individual identifier for use therein |
JP4174801B2 (en) * | 2004-01-15 | 2008-11-05 | 株式会社エフ・イー・シー | Identification tag reader / writer antenna |
FR2865329B1 (en) | 2004-01-19 | 2006-04-21 | Pygmalyon | PASSIVE RECEIVER-RECEIVER DEVICE POWERED BY AN ELECTROMAGNETIC WAVE |
JP2005210223A (en) | 2004-01-20 | 2005-08-04 | Tdk Corp | Antenna device |
EP1706857A4 (en) | 2004-01-22 | 2011-03-09 | Mikoh Corp | A modular radio frequency identification tagging method |
KR101270180B1 (en) | 2004-01-30 | 2013-05-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | An inspection apparatus, inspenction method, and method for manufacturing a semiconductor device |
JP4271591B2 (en) | 2004-01-30 | 2009-06-03 | 双信電機株式会社 | Antenna device |
JP2005229474A (en) | 2004-02-16 | 2005-08-25 | Olympus Corp | Information terminal device |
JP4393228B2 (en) | 2004-02-27 | 2010-01-06 | シャープ株式会社 | Small antenna and wireless tag provided with the same |
JP2005252853A (en) | 2004-03-05 | 2005-09-15 | Fec Inc | Antenna for rf-id |
JP2005269537A (en) * | 2004-03-22 | 2005-09-29 | Mitsubishi Electric Corp | Radio device |
JP2005277579A (en) | 2004-03-23 | 2005-10-06 | Kyocera Corp | High frequency module and communication equipment using the same |
WO2005091434A1 (en) | 2004-03-24 | 2005-09-29 | Uchida Yoko Co.,Ltd. | Recording medium ic tag sticking sheet and recording medium |
JP2005275870A (en) | 2004-03-25 | 2005-10-06 | Matsushita Electric Ind Co Ltd | INSERTION TYPE WIRELESS COMMUNICATION MEDIUM DEVICE AND ELECTRONIC DEVICE |
JP2005284352A (en) | 2004-03-26 | 2005-10-13 | Toshiba Corp | Portable electronic equipment |
JP2005284455A (en) | 2004-03-29 | 2005-10-13 | Fujita Denki Seisakusho:Kk | RFID system |
JP4067510B2 (en) | 2004-03-31 | 2008-03-26 | シャープ株式会社 | Television receiver |
JP2005293537A (en) | 2004-04-05 | 2005-10-20 | Fuji Xynetics Kk | Cardboard with ic tag |
US8139759B2 (en) | 2004-04-16 | 2012-03-20 | Panasonic Corporation | Line state detecting apparatus and transmitting apparatus and receiving apparatus of balanced transmission system |
JP2005311205A (en) | 2004-04-23 | 2005-11-04 | Nec Corp | Semiconductor device |
JP2005306696A (en) | 2004-04-26 | 2005-11-04 | Matsushita Electric Ind Co Ltd | Magnetic ferrite, common mode noise filter and chip transformer using the same |
JP2005340759A (en) | 2004-04-27 | 2005-12-08 | Sony Corp | Magnetic core member for antenna module, antenna module, and personal digital assistant equipped with this |
JP2005322119A (en) | 2004-05-11 | 2005-11-17 | Ic Brains Co Ltd | Device for preventing illegal taking of article equipped with ic tag |
JP2005321305A (en) | 2004-05-10 | 2005-11-17 | Murata Mfg Co Ltd | Electronic component measurement jig |
JP3867085B2 (en) | 2004-05-13 | 2007-01-10 | 東芝テック株式会社 | Wireless communication device, RF tag reader / writer, and printer |
JP4191088B2 (en) | 2004-05-14 | 2008-12-03 | 株式会社デンソー | Electronic equipment |
JP2005333244A (en) | 2004-05-18 | 2005-12-02 | Mitsubishi Electric Corp | Mobile telephone set |
JP4360276B2 (en) | 2004-06-02 | 2009-11-11 | 船井電機株式会社 | Optical disc having wireless IC tag and optical disc reproducing apparatus |
JP4551122B2 (en) | 2004-05-26 | 2010-09-22 | 株式会社岩田レーベル | RFID label affixing device |
US7317396B2 (en) | 2004-05-26 | 2008-01-08 | Funai Electric Co., Ltd. | Optical disc having RFID tag, optical disc apparatus, and system for preventing unauthorized copying |
JP2005345802A (en) | 2004-06-03 | 2005-12-15 | Casio Comput Co Ltd | IMAGING DEVICE, EXCHANGE UNIT USED FOR THIS IMAGING DEVICE, EXCHANGE UNIT USE CONTROL METHOD, AND PROGRAM |
JP4348282B2 (en) | 2004-06-11 | 2009-10-21 | 株式会社日立製作所 | Wireless IC tag and method of manufacturing wireless IC tag |
JP2005352858A (en) | 2004-06-11 | 2005-12-22 | Hitachi Maxell Ltd | Communication record carrier |
JP4530140B2 (en) | 2004-06-28 | 2010-08-25 | Tdk株式会社 | Soft magnetic material and antenna device using the same |
JP4359198B2 (en) | 2004-06-30 | 2009-11-04 | 株式会社日立製作所 | IC tag mounting substrate manufacturing method |
JP4328682B2 (en) | 2004-07-13 | 2009-09-09 | 富士通株式会社 | Radio tag antenna structure for optical recording medium and optical recording medium housing case with radio tag antenna |
JP2006033312A (en) * | 2004-07-15 | 2006-02-02 | Matsushita Electric Ind Co Ltd | Antenna and antenna mounting method |
JP2004362602A (en) | 2004-07-26 | 2004-12-24 | Hitachi Ltd | RFID tag |
JP2006039947A (en) * | 2004-07-27 | 2006-02-09 | Daido Steel Co Ltd | Composite magnetic sheet |
JP2006039902A (en) | 2004-07-27 | 2006-02-09 | Ntn Corp | Uhf band radio ic tag |
JP2006042059A (en) | 2004-07-28 | 2006-02-09 | Tdk Corp | Radio communication apparatus and impedance controlling method thereof |
JP2006042097A (en) | 2004-07-29 | 2006-02-09 | Kyocera Corp | Antenna wiring board |
JP2006050200A (en) | 2004-08-04 | 2006-02-16 | Matsushita Electric Ind Co Ltd | Reader / writer |
JP4653440B2 (en) | 2004-08-13 | 2011-03-16 | 富士通株式会社 | RFID tag and manufacturing method thereof |
JP4482403B2 (en) | 2004-08-30 | 2010-06-16 | 日本発條株式会社 | Non-contact information medium |
JP4186895B2 (en) | 2004-09-01 | 2008-11-26 | 株式会社デンソーウェーブ | Coil antenna for non-contact communication device and manufacturing method thereof |
JP4125275B2 (en) | 2004-09-02 | 2008-07-30 | 日本電信電話株式会社 | Non-contact IC medium control system |
JP2005129019A (en) | 2004-09-03 | 2005-05-19 | Sony Chem Corp | Ic card |
JP2006080367A (en) | 2004-09-10 | 2006-03-23 | Brother Ind Ltd | Inductance element, RFID tag circuit element, tag tape roll, and method of manufacturing inductance element |
US20060055531A1 (en) | 2004-09-14 | 2006-03-16 | Honeywell International, Inc. | Combined RF tag and SAW sensor |
JP2006085552A (en) * | 2004-09-17 | 2006-03-30 | Oji Paper Co Ltd | Reader and / or writer device |
JP2006092630A (en) | 2004-09-22 | 2006-04-06 | Sony Corp | Optical disk and manufacturing method therefor |
JP4600742B2 (en) | 2004-09-30 | 2010-12-15 | ブラザー工業株式会社 | Print head and tag label producing apparatus |
JP2006107296A (en) | 2004-10-08 | 2006-04-20 | Dainippon Printing Co Ltd | Non-contact ic tag and antenna for non-contact ic tag |
GB2419779A (en) | 2004-10-29 | 2006-05-03 | Hewlett Packard Development Co | Document having conductive tracks for coupling to a memory tag and a reader |
WO2006048663A1 (en) | 2004-11-05 | 2006-05-11 | Qinetiq Limited | Detunable rf tags |
WO2006049068A1 (en) | 2004-11-08 | 2006-05-11 | Matsushita Electric Industrial Co., Ltd. | Antenna assembly and wireless communication system employing same |
JP4088797B2 (en) | 2004-11-18 | 2008-05-21 | 日本電気株式会社 | RFID tag |
JP2006148518A (en) | 2004-11-19 | 2006-06-08 | Matsushita Electric Works Ltd | Adjuster and adjusting method of non-contact ic card |
JP2006151402A (en) | 2004-11-25 | 2006-06-15 | Rengo Co Ltd | Corrugated box with radio tag |
US7545328B2 (en) | 2004-12-08 | 2009-06-09 | Electronics And Telecommunications Research Institute | Antenna using inductively coupled feeding method, RFID tag using the same and antenna impedance matching method thereof |
JP4281683B2 (en) | 2004-12-16 | 2009-06-17 | 株式会社デンソー | IC tag mounting structure |
JP4942998B2 (en) | 2004-12-24 | 2012-05-30 | 株式会社半導体エネルギー研究所 | Semiconductor device and manufacturing method of semiconductor device |
WO2006068286A1 (en) | 2004-12-24 | 2006-06-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP4541246B2 (en) | 2004-12-24 | 2010-09-08 | トッパン・フォームズ株式会社 | Non-contact IC module |
JP4737505B2 (en) | 2005-01-14 | 2011-08-03 | 日立化成工業株式会社 | IC tag inlet and manufacturing method of IC tag inlet |
US7714794B2 (en) | 2005-01-19 | 2010-05-11 | Behzad Tavassoli Hozouri | RFID antenna |
JP4711692B2 (en) | 2005-02-01 | 2011-06-29 | 富士通株式会社 | Meander line antenna |
JP2006232292A (en) | 2005-02-22 | 2006-09-07 | Nippon Sheet Glass Co Ltd | Container with RFID tag and RFID system |
JP2006237674A (en) | 2005-02-22 | 2006-09-07 | Suncall Corp | Patch antenna and rfid inlet |
JP2006238282A (en) | 2005-02-28 | 2006-09-07 | Matsushita Electric Ind Co Ltd | Antenna unit, transmission / reception device, wireless tag reading device, and wireless tag reading system |
JP4639857B2 (en) | 2005-03-07 | 2011-02-23 | 富士ゼロックス株式会社 | A storage box for storing articles to which RFID tags are attached, an arrangement method thereof, a communication method, a communication confirmation method, and a packaging structure. |
CA2842404C (en) | 2005-03-10 | 2016-05-10 | Gen-Probe Incorporated | Systems and methods to perform assays for detecting or quantifying analytes within samples |
JP4330575B2 (en) | 2005-03-17 | 2009-09-16 | 富士通株式会社 | Tag antenna |
JP4437965B2 (en) | 2005-03-22 | 2010-03-24 | Necトーキン株式会社 | Wireless tag |
JP4087859B2 (en) | 2005-03-25 | 2008-05-21 | 東芝テック株式会社 | Wireless tag |
JP2006270681A (en) | 2005-03-25 | 2006-10-05 | Sony Corp | Portable equipment |
JP2006287659A (en) | 2005-03-31 | 2006-10-19 | Tdk Corp | Antenna device |
EP1865574B1 (en) | 2005-04-01 | 2015-06-17 | Fujitsu Frontech Limited | Rfid tag applicable to metal and rfid tag section of the same |
JP4750450B2 (en) | 2005-04-05 | 2011-08-17 | 富士通株式会社 | RFID tag |
JP2006302219A (en) | 2005-04-25 | 2006-11-02 | Fujita Denki Seisakusho:Kk | RFID tag communication range setting device |
JP2008535372A (en) | 2005-04-26 | 2008-08-28 | イー.エム.ダブリュ.アンテナ カンパニー リミテッド | Ultra-wideband antenna with bandstop characteristics |
JP4771115B2 (en) | 2005-04-27 | 2011-09-14 | 日立化成工業株式会社 | IC tag |
JP4529786B2 (en) | 2005-04-28 | 2010-08-25 | 株式会社日立製作所 | Signal processing circuit and non-contact IC card and tag using the same |
JP4452865B2 (en) | 2005-04-28 | 2010-04-21 | 智三 太田 | Wireless IC tag device and RFID system |
US8111143B2 (en) | 2005-04-29 | 2012-02-07 | Hewlett-Packard Development Company, L.P. | Assembly for monitoring an environment |
JP4740645B2 (en) | 2005-05-17 | 2011-08-03 | 富士通株式会社 | Manufacturing method of semiconductor device |
JP2007013120A (en) | 2005-05-30 | 2007-01-18 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
US7688272B2 (en) | 2005-05-30 | 2010-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP4827618B2 (en) * | 2005-05-31 | 2011-11-30 | 株式会社半導体エネルギー研究所 | Method for manufacturing antenna, method for manufacturing semiconductor device |
JP4255931B2 (en) | 2005-06-01 | 2009-04-22 | 日本電信電話株式会社 | Non-contact IC medium and control device |
JP2007007888A (en) | 2005-06-28 | 2007-01-18 | Oji Paper Co Ltd | Non-contact IC chip mounting body mounted cardboard and manufacturing method thereof |
JP2007018067A (en) | 2005-07-05 | 2007-01-25 | Kobayashi Kirokushi Co Ltd | Rfid tag and rfid system |
JP4286813B2 (en) | 2005-07-08 | 2009-07-01 | 富士通株式会社 | Antenna and RFID tag equipped with the same |
JP2007028002A (en) | 2005-07-13 | 2007-02-01 | Matsushita Electric Ind Co Ltd | Reader / writer antenna and communication system |
WO2007013168A1 (en) | 2005-07-29 | 2007-02-01 | Fujitsu Limited | Rf tag and rf tag manufacturing method |
JP2007040702A (en) | 2005-07-29 | 2007-02-15 | Oki Electric Ind Co Ltd | Semiconductor ic, wireless ic tag and sensor |
JP4720348B2 (en) | 2005-08-04 | 2011-07-13 | パナソニック株式会社 | Antenna for RF-ID reader / writer device, RF-ID reader / writer device using the antenna, and RF-ID system |
JP4737716B2 (en) | 2005-08-11 | 2011-08-03 | ブラザー工業株式会社 | RFID tag IC circuit holder, tag tape roll, RFID tag cartridge |
JP4801951B2 (en) | 2005-08-18 | 2011-10-26 | 富士通フロンテック株式会社 | RFID tag |
JP2007065822A (en) | 2005-08-30 | 2007-03-15 | Sofueru:Kk | Radio ic tag, intermediate ic tag body, intermediate ic tag body set and method for manufacturing radio ic tag |
JP2007068073A (en) | 2005-09-02 | 2007-03-15 | Sony Corp | Information processing device |
DE102005042444B4 (en) | 2005-09-06 | 2007-10-11 | Ksw Microtec Ag | Arrangement for an RFID transponder antenna |
JP4725261B2 (en) | 2005-09-12 | 2011-07-13 | オムロン株式会社 | RFID tag inspection method |
JP4384102B2 (en) | 2005-09-13 | 2009-12-16 | 株式会社東芝 | Portable radio device and antenna device |
JP2007096655A (en) | 2005-09-28 | 2007-04-12 | Oji Paper Co Ltd | RFID tag antenna and RFID tag |
JP4075919B2 (en) | 2005-09-29 | 2008-04-16 | オムロン株式会社 | Antenna unit and non-contact IC tag |
JP4826195B2 (en) | 2005-09-30 | 2011-11-30 | 大日本印刷株式会社 | RFID tag |
JP2007116347A (en) * | 2005-10-19 | 2007-05-10 | Mitsubishi Materials Corp | Tag antenna and mobile radio equipment |
JP4774273B2 (en) | 2005-10-31 | 2011-09-14 | 株式会社サトー | RFID label and RFID label attaching method |
JP2007159083A (en) | 2005-11-09 | 2007-06-21 | Alps Electric Co Ltd | Antenna matching circuit |
CN101278439B (en) | 2005-11-22 | 2013-06-26 | 株式会社村田制作所 | Coil antenna and portable electronic apparatus |
JP4899446B2 (en) | 2005-11-24 | 2012-03-21 | Tdk株式会社 | Composite electronic component and manufacturing method thereof |
JP2007150642A (en) | 2005-11-28 | 2007-06-14 | Hitachi Ulsi Systems Co Ltd | Interrogator for wireless tag, antenna for wireless tag, wireless tag system, and wireless tag selector |
KR101346241B1 (en) | 2005-11-29 | 2013-12-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication system |
JP2007150868A (en) | 2005-11-29 | 2007-06-14 | Renesas Technology Corp | Electronic equipment and method of manufacturing the same |
US7573388B2 (en) | 2005-12-08 | 2009-08-11 | The Kennedy Group, Inc. | RFID device with augmented grain |
JP4560480B2 (en) | 2005-12-13 | 2010-10-13 | Necトーキン株式会社 | Wireless tag |
JP4815211B2 (en) | 2005-12-22 | 2011-11-16 | 株式会社サトー | RFID label and RFID label attaching method |
JP4848764B2 (en) | 2005-12-26 | 2011-12-28 | 大日本印刷株式会社 | Non-contact data carrier device |
CN100412593C (en) * | 2006-01-18 | 2008-08-20 | 华硕电脑股份有限公司 | Lens module and electronic device using same |
EP2385579A1 (en) | 2006-01-19 | 2011-11-09 | Murata Manufacturing Co., Ltd. | Wireless IC device |
JP4473825B2 (en) * | 2006-01-19 | 2010-06-02 | 原田工業株式会社 | Mobile terminal antenna |
JP4696923B2 (en) | 2006-01-19 | 2011-06-08 | 横河電機株式会社 | Antenna, wireless tag device using the antenna, and wireless tag communication device |
US7519328B2 (en) | 2006-01-19 | 2009-04-14 | Murata Manufacturing Co., Ltd. | Wireless IC device and component for wireless IC device |
WO2007083575A1 (en) | 2006-01-19 | 2007-07-26 | Murata Manufacturing Co., Ltd. | Radio ic device |
JP4728820B2 (en) * | 2006-01-26 | 2011-07-20 | シャープ株式会社 | Radio wave IC tag system and radio wave IC tag |
JP4416822B2 (en) | 2006-01-27 | 2010-02-17 | 東京特殊電線株式会社 | Tag device, transceiver device and tag system |
US20100156750A1 (en) | 2006-02-19 | 2010-06-24 | Tatsuo Ishibashi | Feeding Structure of Housing With Antenna |
CN102514827B (en) * | 2006-02-22 | 2015-02-25 | 东洋制罐株式会社 | Metal object with RFID tag |
JP4524674B2 (en) | 2006-02-23 | 2010-08-18 | ブラザー工業株式会社 | Interrogator for RFID tag communication system |
JP4755921B2 (en) | 2006-02-24 | 2011-08-24 | 富士通株式会社 | RFID tag |
JP4026080B2 (en) | 2006-02-24 | 2007-12-26 | オムロン株式会社 | Antenna and RFID tag |
JP5055478B2 (en) | 2006-02-28 | 2012-10-24 | 凸版印刷株式会社 | IC tag |
WO2007099602A1 (en) | 2006-02-28 | 2007-09-07 | Matsushita Electric Industrial Co., Ltd. | Portable radio apparatus |
JP3121577U (en) | 2006-03-02 | 2006-05-18 | 株式会社スマート | Eccentric magnetic coil system |
WO2007102360A1 (en) | 2006-03-06 | 2007-09-13 | Mitsubishi Electric Corporation | Rfid tag, method for manufacturing rfid tag and method for arranging rfid tag |
JP2007241789A (en) | 2006-03-10 | 2007-09-20 | Ic Brains Co Ltd | Wireless tag reader / writer, communication apparatus, and communication system |
JP3933191B1 (en) * | 2006-03-13 | 2007-06-20 | 株式会社村田製作所 | Portable electronic devices |
JP2007249620A (en) | 2006-03-16 | 2007-09-27 | Nec Tokin Corp | Wireless tag |
JP2007287128A (en) | 2006-03-22 | 2007-11-01 | Orient Sokki Computer Kk | Non-contact ic medium |
JP4735368B2 (en) | 2006-03-28 | 2011-07-27 | 富士通株式会社 | Planar antenna |
JP4854362B2 (en) | 2006-03-30 | 2012-01-18 | 富士通株式会社 | RFID tag and manufacturing method thereof |
JP4927625B2 (en) * | 2006-03-31 | 2012-05-09 | ニッタ株式会社 | Magnetic shield sheet, non-contact IC card communication improving method, and non-contact IC card container |
JP2007279782A (en) | 2006-04-03 | 2007-10-25 | Dainippon Printing Co Ltd | Non-contact ic tag having ic chip breakdown prevention structure, connecting element of the non-contact ic tag, and manufacturing method of the non-contact ic tag connecting element |
CN101416353B (en) | 2006-04-10 | 2013-04-10 | 株式会社村田制作所 | Wireless IC device |
CN101346852B (en) | 2006-04-14 | 2012-12-26 | 株式会社村田制作所 | Wireless IC device |
WO2007119310A1 (en) | 2006-04-14 | 2007-10-25 | Murata Manufacturing Co., Ltd. | Antenna |
JP4853095B2 (en) | 2006-04-24 | 2012-01-11 | 大日本印刷株式会社 | Non-contact data carrier, wiring board for non-contact data carrier |
ATE539463T1 (en) | 2006-04-26 | 2012-01-15 | Murata Manufacturing Co | OBJECT PROVIDED WITH POWER CIRCUIT BOARD |
US9064198B2 (en) | 2006-04-26 | 2015-06-23 | Murata Manufacturing Co., Ltd. | Electromagnetic-coupling-module-attached article |
JP2007295395A (en) | 2006-04-26 | 2007-11-08 | Fujitsu Ltd | Tag antenna and tag using the same |
EP2830006A1 (en) | 2006-04-26 | 2015-01-28 | Murata Manufacturing Co., Ltd. | Article with an electromagnetic-coupling module |
US20080068132A1 (en) | 2006-05-16 | 2008-03-20 | Georges Kayanakis | Contactless radiofrequency device featuring several antennas and related antenna selection circuit |
US7589675B2 (en) | 2006-05-19 | 2009-09-15 | Industrial Technology Research Institute | Broadband antenna |
JP2007317009A (en) * | 2006-05-26 | 2007-12-06 | Matsushita Electric Works Ltd | Socket for memory card |
JP2007324865A (en) * | 2006-05-31 | 2007-12-13 | Sony Chemical & Information Device Corp | Antenna circuit, and transponder |
JP4775440B2 (en) | 2006-06-01 | 2011-09-21 | 株式会社村田製作所 | Wireless IC device and composite component for wireless IC device |
JP5200338B2 (en) * | 2006-06-15 | 2013-06-05 | ソニー株式会社 | RFID tags and products |
JP4796904B2 (en) * | 2006-06-29 | 2011-10-19 | Necカシオモバイルコミュニケーションズ株式会社 | Data communication device |
WO2008001561A1 (en) | 2006-06-30 | 2008-01-03 | Murata Manufacturing Co., Ltd. | Optical disc |
JP3957000B1 (en) * | 2006-07-07 | 2007-08-08 | 株式会社村田製作所 | Antenna coil for board mounting and antenna device |
JP4957724B2 (en) | 2006-07-11 | 2012-06-20 | 株式会社村田製作所 | Antenna and wireless IC device |
JP2008033716A (en) | 2006-07-31 | 2008-02-14 | Sankyo Kk | Coin-type RFID tag |
JP4169062B2 (en) | 2006-08-03 | 2008-10-22 | 凸版印刷株式会社 | Wireless tag |
KR100797172B1 (en) | 2006-08-08 | 2008-01-23 | 삼성전자주식회사 | Loop antenna with integral matching circuit |
JP4836899B2 (en) | 2006-09-05 | 2011-12-14 | パナソニック株式会社 | Magnetic striped array sheet, RFID magnetic sheet, electromagnetic shielding sheet, and manufacturing method thereof |
US7981528B2 (en) | 2006-09-05 | 2011-07-19 | Panasonic Corporation | Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same |
JP4770655B2 (en) | 2006-09-12 | 2011-09-14 | 株式会社村田製作所 | Wireless IC device |
US8120462B2 (en) | 2006-09-25 | 2012-02-21 | Sensomatic Electronics, LLC | Method and system for standing wave detection for radio frequency identification marker readers |
JP2008083867A (en) * | 2006-09-26 | 2008-04-10 | Matsushita Electric Works Ltd | Memory card socket |
JP2008092131A (en) | 2006-09-29 | 2008-04-17 | Tdk Corp | Antenna element and mobile information terminal |
JP2008098993A (en) | 2006-10-12 | 2008-04-24 | Dx Antenna Co Ltd | Antenna |
JP4913529B2 (en) | 2006-10-13 | 2012-04-11 | トッパン・フォームズ株式会社 | RFID media |
JP4876842B2 (en) * | 2006-10-16 | 2012-02-15 | 大日本印刷株式会社 | IC tag label |
JP2008107947A (en) * | 2006-10-24 | 2008-05-08 | Toppan Printing Co Ltd | RFID tag |
JP2008118359A (en) | 2006-11-02 | 2008-05-22 | Nec Corp | Walkie-talkie |
US7605761B2 (en) | 2006-11-30 | 2009-10-20 | Semiconductor Energy Laboratory Co., Ltd. | Antenna and semiconductor device having the same |
DE102006057369A1 (en) | 2006-12-04 | 2008-06-05 | Airbus Deutschland Gmbh | Radio frequency identification tag for e.g. identifying metal container, has radio frequency identification scanning antenna with conductor loop that is aligned diagonally or perpendicularly to attachment surface |
JP2008167190A (en) | 2006-12-28 | 2008-07-17 | Philtech Inc | Base body sheet |
WO2008081699A1 (en) | 2006-12-28 | 2008-07-10 | Philtech Inc. | Base sheet |
JP2008182438A (en) | 2007-01-24 | 2008-08-07 | Nec Tokin Corp | Radio tag |
US7886315B2 (en) | 2007-01-30 | 2011-02-08 | Sony Corporation | Optical disc case, optical disc tray, card member, and manufacturing method |
JP2008207875A (en) | 2007-01-30 | 2008-09-11 | Sony Corp | Optical disk case, optical disk tray, card member and manufacturing method |
JP2008197714A (en) * | 2007-02-08 | 2008-08-28 | Dainippon Printing Co Ltd | Non-contact data carrier device, and auxiliary antenna for non-contact data carrier |
JP4872713B2 (en) | 2007-02-27 | 2012-02-08 | 大日本印刷株式会社 | Non-contact data carrier device |
JP5061657B2 (en) | 2007-03-05 | 2012-10-31 | 大日本印刷株式会社 | Non-contact data carrier device |
JP2008226099A (en) | 2007-03-15 | 2008-09-25 | Dainippon Printing Co Ltd | Noncontact data carrier device |
JP4865614B2 (en) | 2007-03-27 | 2012-02-01 | マグネックス・コーポレーション | RFID chip and antenna with improved range |
CN101276959B (en) * | 2007-03-30 | 2013-08-21 | 麦格耐克斯有限公司 | RFID chip with improved range as well as antenna |
JP4867753B2 (en) | 2007-03-30 | 2012-02-01 | Tdk株式会社 | ANTENNA DEVICE AND RADIO COMMUNICATION DEVICE USING THE SAME |
WO2008126458A1 (en) | 2007-04-06 | 2008-10-23 | Murata Manufacturing Co., Ltd. | Radio ic device |
WO2008133018A1 (en) * | 2007-04-13 | 2008-11-06 | Murata Manufacturing Co., Ltd. | Magnetic field coupling type antenna, magnetic field coupling type antenna module, magnetic field coupling type antenna device, and their manufacturing methods |
US7762472B2 (en) | 2007-07-04 | 2010-07-27 | Murata Manufacturing Co., Ltd | Wireless IC device |
WO2008142957A1 (en) | 2007-05-10 | 2008-11-27 | Murata Manufacturing Co., Ltd. | Wireless ic device |
WO2008140037A1 (en) | 2007-05-11 | 2008-11-20 | Murata Manufacturing Co., Ltd. | Wireless ic device |
KR101196465B1 (en) * | 2007-05-18 | 2012-11-09 | (주)엠쓰리모바일 | Barcode reader module for recognizing rfid to be loaded an rugged pda |
JP4770792B2 (en) | 2007-05-18 | 2011-09-14 | パナソニック電工株式会社 | Antenna device |
JP4867787B2 (en) | 2007-05-22 | 2012-02-01 | Tdk株式会社 | Antenna device |
JP4885093B2 (en) | 2007-06-11 | 2012-02-29 | 株式会社タムラ製作所 | Booster antenna coil |
KR101047266B1 (en) | 2007-07-04 | 2011-07-06 | 가부시키가이샤 무라타 세이사쿠쇼 | Wireless IC Devices and Components for Wireless IC Devices |
JP2009017284A (en) | 2007-07-05 | 2009-01-22 | Panasonic Corp | Antenna device |
EP2166617B1 (en) | 2007-07-09 | 2015-09-30 | Murata Manufacturing Co. Ltd. | Wireless ic device |
WO2009011400A1 (en) | 2007-07-17 | 2009-01-22 | Murata Manufacturing Co., Ltd. | Wireless ic device and electronic apparatus |
JP5167709B2 (en) | 2007-07-17 | 2013-03-21 | 株式会社村田製作所 | Wireless IC device, inspection system thereof, and method of manufacturing wireless IC device using the inspection system |
JP4561932B2 (en) | 2007-07-18 | 2010-10-13 | 株式会社村田製作所 | Wireless IC device |
US20090021352A1 (en) | 2007-07-18 | 2009-01-22 | Murata Manufacturing Co., Ltd. | Radio frequency ic device and electronic apparatus |
US7830311B2 (en) | 2007-07-18 | 2010-11-09 | Murata Manufacturing Co., Ltd. | Wireless IC device and electronic device |
JP4867830B2 (en) | 2007-07-18 | 2012-02-01 | 株式会社村田製作所 | Wireless IC device |
CN102915462B (en) | 2007-07-18 | 2017-03-01 | 株式会社村田制作所 | Wireless IC device |
JP2009037413A (en) | 2007-08-01 | 2009-02-19 | Murata Mfg Co Ltd | Radio ic device |
JP4702336B2 (en) | 2007-08-10 | 2011-06-15 | 株式会社デンソーウェーブ | Portable RFID tag reader |
JP4885092B2 (en) | 2007-09-06 | 2012-02-29 | 株式会社タムラ製作所 | Booster antenna coil |
US8717244B2 (en) | 2007-10-11 | 2014-05-06 | 3M Innovative Properties Company | RFID tag with a modified dipole antenna |
JP2009110144A (en) | 2007-10-29 | 2009-05-21 | Oji Paper Co Ltd | Coin-type RFID tag |
TW200919327A (en) | 2007-10-29 | 2009-05-01 | China Steel Corp | Three-dimensional wireless identification label adhered onto metal |
JP2009111950A (en) | 2007-11-01 | 2009-05-21 | Dainippon Printing Co Ltd | Non-contact type ic tag, and method for manufacturing non-contact type ic tag |
JP5155642B2 (en) | 2007-11-28 | 2013-03-06 | ルネサスエレクトロニクス株式会社 | ID tag |
JP2009135166A (en) | 2007-11-29 | 2009-06-18 | Nikon Corp | Exposure method and exposure device, exposure unit, and device manufacturing method |
CN101595599B (en) | 2007-12-20 | 2013-05-01 | 株式会社村田制作所 | Radio IC device |
JP2009181246A (en) | 2008-01-29 | 2009-08-13 | Toppan Forms Co Ltd | Rfid inspection system |
JP2009182630A (en) * | 2008-01-30 | 2009-08-13 | Dainippon Printing Co Ltd | Booster antenna board, booster antenna board sheet and non-contact type data carrier device |
WO2009110381A1 (en) | 2008-03-03 | 2009-09-11 | 株式会社村田製作所 | Wireless ic device and wireless communication system |
WO2009110382A1 (en) | 2008-03-03 | 2009-09-11 | 株式会社村田製作所 | Composite antenna |
JP4404166B2 (en) | 2008-03-26 | 2010-01-27 | 株式会社村田製作所 | Wireless IC device |
JP4535209B2 (en) | 2008-04-14 | 2010-09-01 | 株式会社村田製作所 | Wireless IC device, electronic apparatus, and method for adjusting resonance frequency of wireless IC device |
JP2009260758A (en) | 2008-04-18 | 2009-11-05 | Murata Mfg Co Ltd | Radio ic device |
US20090284369A1 (en) | 2008-05-13 | 2009-11-19 | Qualcomm Incorporated | Transmit power control for a wireless charging system |
JP4927781B2 (en) | 2008-05-15 | 2012-05-09 | 株式会社東海理化電機製作所 | Portable machine |
CN103295056B (en) | 2008-05-21 | 2016-12-28 | 株式会社村田制作所 | Wireless IC device |
JP5078022B2 (en) | 2008-05-22 | 2012-11-21 | Necトーキン株式会社 | Wireless tag and method of using wireless tag |
JP4557186B2 (en) | 2008-06-25 | 2010-10-06 | 株式会社村田製作所 | Wireless IC device and manufacturing method thereof |
US7934646B2 (en) * | 2008-06-25 | 2011-05-03 | International Currency Technologies Corporation | Face panel assembly with an RFID module |
JP2010015342A (en) | 2008-07-03 | 2010-01-21 | Dainippon Printing Co Ltd | Antenna sheet, inlet, and ic tag |
JP2010050844A (en) | 2008-08-22 | 2010-03-04 | Sony Corp | Loop antenna and communication device |
JP5319313B2 (en) | 2008-08-29 | 2013-10-16 | 峰光電子株式会社 | Loop antenna |
JP4618459B2 (en) | 2008-09-05 | 2011-01-26 | オムロン株式会社 | RFID tag, RFID tag set and RFID system |
JP5223584B2 (en) * | 2008-10-14 | 2013-06-26 | 富士通モバイルコミュニケーションズ株式会社 | Wireless communication device |
JP3148168U (en) | 2008-10-21 | 2009-02-05 | 株式会社村田製作所 | Wireless IC device |
JP5195275B2 (en) | 2008-10-22 | 2013-05-08 | 株式会社村田製作所 | Wireless communication system |
CN102197537B (en) | 2008-10-29 | 2014-06-18 | 株式会社村田制作所 | Wireless IC device |
CN103500873B (en) | 2009-01-09 | 2016-08-31 | 株式会社村田制作所 | Wireless ic device and wireless ic module |
JP5287289B2 (en) | 2009-01-26 | 2013-09-11 | 株式会社村田製作所 | Antenna device |
EP2408063B1 (en) | 2009-03-13 | 2018-04-18 | Murata Manufacturing Co., Ltd. | Antenna apparatus |
JP5510450B2 (en) | 2009-04-14 | 2014-06-04 | 株式会社村田製作所 | Wireless IC device |
JP4687832B2 (en) * | 2009-04-21 | 2011-05-25 | 株式会社村田製作所 | Antenna device |
JP5535752B2 (en) | 2009-04-30 | 2014-07-02 | ニッタ株式会社 | Wireless communication improving sheet body, wireless tag with wireless communication improving sheet body, and wireless tag communication system |
JP4883136B2 (en) | 2009-05-15 | 2012-02-22 | 株式会社村田製作所 | Coil antenna |
JP2011015395A (en) | 2009-06-03 | 2011-01-20 | Nippon Information System:Kk | Cloth with rfid tag, and system for managing cloth with rfid tag |
JP5304580B2 (en) | 2009-10-02 | 2013-10-02 | 株式会社村田製作所 | Wireless IC device |
JP2010051012A (en) | 2009-11-06 | 2010-03-04 | Tdk Corp | Antenna, and radio ic memory |
US9088072B2 (en) | 2009-11-20 | 2015-07-21 | Hitachi Metals, Ltd. | Antenna |
JP5521686B2 (en) | 2010-03-25 | 2014-06-18 | 株式会社村田製作所 | Antenna apparatus and wireless communication device |
JP5558960B2 (en) | 2010-07-30 | 2014-07-23 | トッパン・フォームズ株式会社 | RF-ID media inspection device |
JP4894960B2 (en) | 2011-03-15 | 2012-03-14 | 株式会社村田製作所 | Electronics |
-
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- 2009-09-18 JP JP2010509439A patent/JP4687832B2/en active Active
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- 2010-04-01 CN CN201610015357.6A patent/CN105514615A/en active Pending
- 2010-04-01 EP EP10766947.5A patent/EP2424042B1/en active Active
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- 2010-04-01 WO PCT/JP2010/056003 patent/WO2010122888A1/en active Application Filing
- 2010-04-01 CN CN201080017391.8A patent/CN102405557B/en active Active
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- 2012-09-06 US US13/604,801 patent/US9564678B2/en active Active
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