JP2003030612A - Ic chip mounting body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure a sufficient communication distance and to simplify the handling. SOLUTION: A pair of electrostatic antennas 4a and 4b are parallelly provided for two pieces on a base material 3 and an antenna label 1 including an IC chip is joined onto the electrostatic antennas 4a and 4b. The base material 3 is the liner of corrugated fiberboard for instance. For the antenna label 1, a pair of the electrostatic antennas are parallelly provided for two pieces on the base material and a fine antenna medium to which the IC chip is joined is joined onto the electrostatic antennas.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC chip mounting body on which information recorded on an IC chip can be recorded, rewritten and read in a non-contact manner. The IC chip mounting body of the present invention can be used for various purposes. For example, since it can be formed into a corrugated cardboard, it is a non-contact type used for distribution management, slips for courier service, tags for transportation, etc. It can also be used for what is called an IC tag.

[0002]

2. Description of the Related Art Logistics management and packaging package transportation management,
Optical bar codes are used in many fields in the distribution industry where tags such as luggage tags and clothing tags are used. This optical bar code is printed or printed on a base material such as paper or a plastic film.
(Japan Article Number) This is a one-dimensional barcode provided by a code or code 39. However, the amount of information of such a bar code is usually about 10 to 30 digits in number, and for example, only a country name or a product code can be specified.

A two-dimensional bar code has been devised in order to increase the amount of information that can be recorded in a bar code, and according to this, it is possible to record information for several thousand characters.
However, in order to read the information contained in the barcode, it is necessary to scan the surface of the barcode with an optical barcode reader, and the reading range is limited.
Further, once the barcode is formed by printing or printing, the information is fixed and cannot be rewritten.

On the other hand, the IC chip mounting body records necessary information on the IC chip and can record, rewrite, and read information in a short time by a communication device such as a reader / writer, if necessary. RFID (Radio Frequency
As an IC carrier called “Identification (wireless automatic identification)”, it is possible to transmit information in a contactless manner by electrostatically coupling with a reader antenna.

The IC chip used in the IC chip mounting body has a terminal for communication, and the terminal is connected to a conductive antenna. The connection may be directly joined by crimping or welding, or a joining member such as a conductive adhesive may be used. In the present invention, an IC chip and a conductive antenna coupled to the IC chip are integrated into a label and used. This label-shaped integrated product including an IC chip has already been put into practical use, and is referred to as a micro antenna medium in the present invention.

Information can be recorded on the IC chip in a non-contact manner by the electrostatic coupling method. For the communication method using the electrostatic coupling method, for example, see Japanese Patent Publication No. 11-51351.
It is described in detail in Japanese Patent No. 8 publication. Since the IC chip is used, it is possible to utilize the memory of the IC chip having an information amount of 100 bytes or more. However, in general, even in the electrostatic coupling method, there is a drawback that the communication distance between the IC carrier and the reader is limited to within several tens of mm if the antenna dimension is small only by mounting the IC chip on the conductive antenna.

Since the antenna size of the micro antenna medium is small, the distance from the reader / writer antenna, that is, the so-called communication distance, is extremely short, and recording, writing, and reading of information are required unless the micro antenna medium is brought into close contact with the reader / writer. Can't do. Therefore, it is very troublesome to handle with only a small antenna medium. Further, in some cases, even if the small antenna and the reader / writer are brought into close contact with each other, communication is often impossible, which is a problem.

When the conductive antenna of this minute antenna medium is electrically joined to another conductive antenna having a large size, the communication distance increases and communication with the reader / writer becomes easy. It is generally used as a tag in this state, but it is practical that a sufficient communication distance cannot be obtained unless the antenna size of the tag is increased.

[0009]

With a small antenna, I
Since the distance to communicate with the C chip is short, it is first considered to increase the communication distance by increasing the size of the antenna. However, simply increase the antenna dimensions,
When used as an IC tag, it is necessary to use a tag equipped with a large-sized antenna, which makes it difficult to handle each time it is attached to the package, and the cost of the tag itself is extremely high. I will upload it to. An object of the present invention is to secure a sufficient communication distance when applied as an IC tag and to simplify its handling.

[0010]

In the IC chip mounting body of the present invention, a micro antenna medium having an IC chip and a micro conductive antenna is once attached to a label having a conductive antenna of an appropriate size. wear. This label-shaped product to which a minute antenna medium is attached is called an antenna label. Information is stored in the memory of the IC chip in the state of the antenna label. After that, this antenna label is electromagnetically coupled to a large area antenna, which makes it possible to secure a sufficient communication distance when used as a tag.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION In a micro antenna medium, an IC chip needs to be electrically connected or electromagnetically coupled to a micro conductive antenna. The formed communication terminal is ACF
(Anisotropic conductive film) or ACP (anisotropic conductive paste) is used for bonding, and the micro conductive antenna is coated with a conductive adhesive to form a micro tag label. Preferably. In the present invention, this attachable micro tag label is a micro antenna medium.

This small antenna medium alone has an extremely short communication distance with the reader / writer. For example, in the case where the antennas with minute antenna dimensions of 15 mm × 10 mm are arranged in parallel with a distance of 1 mm, the communication distance is 5 mm or less, and communication cannot be performed unless the reader / writer is in close contact. Depending on the relative positional relationship with the reader / writer antenna, if the deviation from the center point of the reader / writer antenna is large, communication may not be possible at all. The size of the small antenna medium is
It is preferably about 5 mm to 20 mm square.

In order to perform stable IC chip communication, it is necessary to appropriately increase the antenna size of the tag. The size of the reader / writer antenna is 10 mm
It is about 500 mm square, and an antenna size of about 10 mm to 100 mm square is desirable for stable communication with this antenna. If it is smaller than this, the communication distance becomes short and it is not practical, and if it is larger than this, the tag cost becomes high and the handling of the tag becomes difficult.

In the present invention, it is desirable that the conductive first antenna to be combined with the minute antenna medium be in the form of a label so as to be bonded to the conductive second antenna having a large size. In the present invention, this label will be referred to as an antenna label. The first of this antenna label
The antenna has a conductive thickness of 0.5 μm to 20 μm.
The conductive layer of (1) is provided by printing or printing on a base material such as recycled recycled paper, paper, synthetic paper, PET (polyethylene terephthalate).

The material used for the conductive layer, which will be described later in detail, is mainly composed of a conductive substance and a binder. The thickness of the substrate is not particularly limited as long as it can be used as a tag, but is preferably 1 μm to 500 μm. A conductive layer is formed in a predetermined pattern on the base material by a printing method such as screen printing, flexographic printing, offset printing, or a printing method such as inkjet printing, thermal transfer printing, laser printing.

In the case of the electrostatic coupling method, the pattern of the first antenna needs to be composed of two or more patterns, for example, rectangles are juxtaposed at a certain interval. Each of the antennas is bonded to the minute antenna of the minute antenna medium. Of course, even if two or more first antenna patterns are provided, there is no problem as long as the communication is not affected. A known adhesive is preferably applied to the antenna label, and an adhesive layer is provided on the side of the base material on which the first antenna is provided, or on the opposite side.

In the present invention, the first antenna of this antenna label is formed by a printing method such as ink jet or thermal transfer, and an ID number or an optical bar code for identifying an IC chip other than the conductive antenna layer is formed at the same time when the antenna is formed. Preferably. Thereby, for example, when the chip is damaged, the tag can be identified.

When the adhesive layer is provided on the side of the conductive antenna of the antenna label, since the adhesive surface is coincident with the antenna surface, the minute antenna medium is bonded to this surface. In this case, the distance from the tag surface layer of the IC chip is longer than in the case where the micro antenna is provided on the tag surface, so that it is possible to increase the strength against external impact. In addition, since the minute antenna medium does not appear on the surface, it is possible to record arbitrary characters or patterns on the surface of the antenna label regardless of the antenna, which increases the utility value.

Although the size of the first antenna of the antenna label is naturally limited to the size of the tag or less, the size of the conductive second antenna provided on the support body to which the antenna label is attached.
Since it is necessary to sufficiently electrostatically couple with the antenna, an area of about 5% to 80% of the conductive antenna dimension area of the support is preferable.

In the present invention, in order to increase the communication distance, the first antenna label formed by joining the minute antenna mediums together is used.
The antenna is electrostatically coupled to the large area second antenna. This large-area second antenna is formed by printing or printing a conductive layer having a predetermined pattern on a base material such as recycled recycled paper, paper, or a plastic film. The material of this conductive layer is
It may be the same as the conductive layer of the first antenna of the antenna label.

The support having the second antenna often corresponds to a package such as a cardboard in a physical distribution although it depends on the product form. In the present invention, it is assumed that the antenna label is joined to this package, but the form of this package is, for example, a cardboard box body or a general cardboard. In the case of a cardboard box, the conductive antenna layer is printed in a predetermined pattern on the surface of the cardboard forming the box by flexographic printing or offset printing,
Then, it is assembled into a box through processes such as pressure treatment of folds and cutting into a predetermined shape with a Thomson blade or the like.

The corrugated cardboard is usually composed of a thick paper called a liner base paper and a core base paper sandwiched between the liner base paper. The core paper is bent in a wavy shape by a corrugator,
An adhesive is applied to the leading end of the cardboard, and a liner base paper is attached to form a single-sided cardboard, and then the liner base paper is attached to the opposite side in the same manner to form a cardboard sheet. The cardboard sheet is cut into a required size, a slit for forming a flap is formed, and then a ruled line of a bent portion is inserted, and glue is applied to a margin to form a cardboard shape.

In the present invention, the conductive antenna is formed by printing on the cardboard of these boxes. The printing method may be a known printing method, for example, flexographic printing, offset printing, gravure printing, screen printing, or the like. In order to increase the communication distance, it is necessary to make the size of the conductive antenna an appropriate size, and depending on the size of the box,
It is about 0 mm to 1000 mm, preferably about 1.2 to 20 times that of the conductive antenna provided on the antenna label. Of course, the antenna shape is not limited to two parallel rectangular shapes, and may be any shape that can be electrostatically coupled to the antenna label.

In the present invention, when a thick paper is used as the support, the antenna may be provided on the back surface of the thick paper other than the case where the conductive antenna is arranged on the front surface of the box. The micro antenna medium and the first antenna of the antenna label are electrically directly connected or electrostatically coupled, and the first antenna of the antenna label and the second antenna of the support are electrostatically coupled, so that the IC chip and the reader / writer. Communicate with. In this case, the first antenna of the antenna label may be electrostatically coupled with the base material of the antenna label, the adhesive layer, and the second antenna of the support through the cardboard of the support. It should be noted that the communication distance can be secured even when the label base material, the adhesive agent thereof, and the cardboard are non-conductive substances. In order to keep the communication distance, the thickness of the non-conductive substance is preferably within several mm, preferably within 1 mm. At least a part of the non-conductive substance may be air, that is, there may be a space (gap) between the second antenna and the first antenna.

The conductive antenna layer in the present invention is formed on each of the minute antenna medium, the antenna label and the support. The material forming the conductive layer is carbon black (particularly conductive carbon black is preferable). Graphite, a conductive metal such as gold or silver, at least one conductive compound such as an oxide of indium and tin, and
Vinyl resin, acrylic resin, waxes, ketone resin, coumarone resin, polyester resin, epoxy resin,
It is composed of at least one selected from binders such as styrene-butadiene copolymer. of course,
Additives such as dispersants, defoaming agents, thickeners, and auxiliaries may be added as necessary when used in printing ink and the like.

The conductivity of the conductive antenna layer is defined by its surface resistivity. This surface resistivity is generally assumed to be a rectangular parallelepiped, and the pair of sides to which the electrodes are attached, that is, the sides facing each other. When the length is W [mm], the distance between the pair of sides is L [mm], and the measured resistance between the electrodes is R [Ω], the surface resistivity ρs = R
It is expressed by × W ÷ L. In the present invention, the surface resistivity of the conductive layer is 1Ω / □ to obtain sufficient communication characteristics.
It is preferably 10,000 Ω / □.

[0027]

EXAMPLES The present invention will be described in more detail below with reference to examples with reference to FIGS. 1 to 4, but of course the present invention is not limited thereto. (Example 1) In an IC chip mounting body, as shown in FIG. 1, a pair of electrostatic antennas 4a and 4b are arranged in parallel on a base material 2
An antenna label 1 including an IC chip is bonded on each of the electrostatic antennas 4a and 4b. The electrostatic antennas 4a and 4b correspond to the second antenna. Here, the electrostatic antennas 4a and 4b are provided on the side where the antenna label 1 is joined, but in the present invention, the electrostatic antennas 4a and 4b are provided on the side opposite to the side where the antenna label 1 is joined. It also includes one in which the base material 3 is interposed between the electric antennas 4a and 4b. The base material 3 is, for example, a cardboard liner.

As shown in FIG. 2, the antenna label 1 has a pair of electrostatic antennas 12a and 12b arranged in parallel on a base material 10, and an IC chip is bonded onto the electrostatic antennas 12a and 12b. The micro antenna medium 14 described above is joined. The electrostatic antennas 12a and 12b are the first
It corresponds to an antenna. An adhesive layer 16 is applied to the base material 10 to bond the antenna label 1 to the base material 3.

In the above example, the adhesive layer 16 is formed on the side opposite to the side on which the micro antenna medium 14 is joined, but it may be formed on the side on which the micro antenna medium 14 is joined. Good. The adhesive layer 16 is applied to the micro antenna medium 14
When it is formed on the side where the micro antenna medium 14 is bonded, the micro antenna medium 14 side is placed inside and the adhesive 16 is sandwiched between the second antenna and the second antenna, and the base material 10 is electromagnetically coupled. Since it will be located outside, IC
It is preferable for protecting the tip 24 from external force. Further, it is more preferable to give the base material 10 cushioning properties and rigidity.

As shown in FIG. 3, the minute antenna medium 14 includes a pair of electrostatic antennas 22a and 22b on a base material 20.
2 of the IC chip 24 having a size of 1.5 mm and 2.0 mm
The two terminals 26a and 26b are connected to the respective electrostatic antennas 2 by ACP (anisotropic conductive paste) 28a and 28b.
It is joined to 2a and 22b. Conductive adhesives 30a and 30b are applied to the two electrostatic antennas 22a and 22b.

FIG. 4 shows the relative positional relationship between the micro antenna medium 14, the electrostatic antennas 12a and 12b of the first antenna, and the electrostatic antennas 22a and 22b of the second antenna.

Formation of micro antenna medium: thickness 100 μm
By printing conductive antennas 22a and 22b (compound 1 below) having a size of 10 mm × 10 mm on the paper substrate 20 of
Two pieces were provided in parallel at an interval of mm. The two terminals 26a and 26b of the IC chip 24 of 1.5 mm × 2.0 mm size are ACP
28a and 28b enable the respective conductive antennas 22
It was joined to a and 22b. Further, conductive adhesives 30a and 30b containing fine silver particles were applied to the two conductive antennas 22a and 22b to form the micro antenna medium 14. The surface resistance of the conductive antennas 22a and 22b was 900Ω / □.

[0033] [Compound 1]       Conductive carbon black 15 parts by weight           (Lion Ketjen Black)       Polyester resin (Toyobo Byron) 20 parts by weight       2 parts by weight of nonionic dispersant       Cyclohexanone 20 parts by weight       Isophorone 40 parts by weight

Formation of Conductive Thermal Transfer Ribbon: 0.5 g / m ^{2 of} paint 1 (formulation 2 below) which constitutes the anchor layer by a gravure method on a polyester film having a thickness of 4.5 μm.
After coating and drying, the coating material 2 (compound 3 below) forming the conductive ink layer is coated and dried at a basis weight of 1.6 g / m ² , and slitted into a width of 110 mm. Created. (How to adjust the ink is described below)

Formation of the conductive antennas 12a and 12b: A thermal transfer printer (made by Ishida Co., Ltd.) is applied to a synthetic paper label (Yupo Hyper Label made by Yupo Corporation) with an adhesive layer 16 provided on the synthetic paper substrate 10. L
-2000-08), a conductive antenna having a size of 35 mm x 70 mm (a pair at 5 mm intervals) was subjected to thermal transfer printing to form the conductive antennas 12a and 12b. The surface resistance of the conductive antennas 12a and 12b was 3000Ω / □.

[0036] [Formulation 2]: Ink layer ink formulation       2 parts by weight of nonionic dispersant       2 parts by weight of carbon graphite       Vinyl chloride vinyl acetate copolymer 2 parts by weight       2 parts by weight of coumarone resin       Polyethylene wax 4 parts by weight       Carnauba wax 5 parts by weight       Toluene 60 parts by weight       Methyl ethyl ketone 23 parts by weight

[0037] [Blend 3]: Ink for conductive layer       2 parts by weight of nonionic dispersant       Carbon graphite 4 parts by weight       Conductive carbon black (Ketjen black) 10 parts by weight       Kumaron resin 6 parts by weight       Vinyl resin 1 part by weight       Carnauba wax 1 part by weight       Methyl ethyl ketone 36 parts by weight       20 parts by weight of ethyl acetate       Toluene 10 parts by weight       Isopropanol 10 parts by weight

Preparation of anchor layer ink and conductive layer ink: A resin is added to a solvent and stirred to form a uniform resin liquid, and solid components such as nonionic dispersant, carbon graphite and wax are added and stirred to form a uniform dispersion. As a uniform mixed liquid ink dispersed by an attritor.

Formation of antenna label: The fine antenna medium 14 was bonded to the conductive antennas 12a and 12b formed by the thermal transfer printing. This joining was performed by joining one of the conductive antennas 12a formed by thermal transfer printing to one of the conductive antennas 22a of the micro antenna medium 14, and joining the other conductive antenna 22b to the other conductive antenna 12b.

Formation of a cardboard support having conductive antennas 4a and 4b: The flexographic ink of the following [formulation 4] was provided on the surface of the liner base paper 3 having a basis weight of 280 g / m ² by flexographic printing to form the conductive antennas 4a and 4b. Formed.

The conductive antennas 4a and 4b have a shape of 15
It had a size of 0 mm × 300 mm, and was set so as to extend in parallel with 7 mm. Conductive antennas 4a, 4b
Had a surface resistance of 1200 Ω / □. 150 g basis weight of the liner base paper 3 on which the conductive antennas 4a and 4b are formed
/ M in corrugating and the opposite surface thereof in a ² using liner material paper having a basis weight of 280 g / m ² laminated with corrugator and to form a cardboard support.

[Formulation 4] Acrylic resin 100 parts by weight Conductive carbon black 25 parts by weight (Ketjen Black manufactured by Lion Corporation) Nonionic dispersant 4 parts by weight Silicone defoamer 0.5 part by weight 220 parts by weight of toluene 90 parts by weight of ethyl acetate

Formation of IC chip mounting body: One of the conductive antennas 12a and 12b of the antenna label 1 to which the minute antenna medium 14 is bonded is attached to one conductive antenna 4a of the cardboard support and the other of the electrostatic antennas 12b.
Was attached so as to overlap with the other antenna 4b of the conductive antenna to form the IC chip mounting body of FIG.

As can be seen from the position of the adhesive layer 16 of the antenna label 1, the conductive antenna 1 of the antenna label 1
2a, 12b and cardboard support conductive antenna 4
The a and 4b are not in direct contact with each other via the adhesive layer 16, but the base material 10 of the antenna label 1 is interposed therebetween.

Characteristics of IC chip mounting body: When communication is performed on the IC chip mounting body formed as described above by a communication device (reader), the distance from the reader antenna to the electrostatic antennas 4a, 4b is up to 280 mm. It was possible. By the way, although communication is possible with the minute antenna medium 14, the communication from the reader antenna to the conductive antenna 2 is possible.
Can communicate only up to 5mm distance to 2a, 22b,
Further, in the antenna label 1 in which the minute antenna medium 14 is joined, the distance to the conductive antennas 12a and 12b is 10
Communication was possible only up to 0 mm, and a remarkable increase in the communication distance in the IC chip mounted body was recognized.

In the embodiment, the electrostatic antennas 22a and 22b of the minute antenna medium 14 and the electrostatic antennas 12a and 12b of the first antenna are electrically connected by the conductive adhesives 30a and 30b. May be performed with a non-conductive adhesive. When the electrostatic antennas 22a and 22b and the electrostatic antennas 12a and 12b are arranged so as to have a portion facing each other and overlapping with each other, the electrostatic antennas are electromagnetically joined to each other, and the electrostatic antennas 12a and 12b are also connected. It has a function as an antenna. In this case, a support or the like may be interposed between the electrostatic antennas in addition to the adhesive layer.

[0047]

The IC chip mounting body of the present invention has the IC chip and the first antenna coupled to the terminals of the IC chip, and the size larger than the first antenna.
Since it is provided so as to face the antenna and is electromagnetically coupled with the first antenna by interposing a non-electrically conductive substance, the second antenna is sufficient for application as an IC tag or the like. The communication distance can be secured and the handling can be simplified.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an IC chip package of one embodiment.

FIG. 2 is a cross-sectional view showing an antenna label according to the same embodiment.

FIG. 3 is a cross-sectional view showing a micro antenna medium in the example.

FIG. 4 is a schematic perspective view showing a relative positional relationship between a micro antenna medium and a first antenna and a second antenna in the same embodiment.

[Explanation of symbols]

1 Antenna label 3,10,20 Base material 4a, 4b second antenna 12a, 12b First antenna 14 Micro antenna medium 16 Adhesive layer 22a, 22b electrostatic antenna 26a, 26b terminals 28a, 28b Anisotropically conductive paste 30a, 30b conductive adhesive

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Toshiyuki Shimonishi             2 Oji Paper Co., Ltd. 1 Tatsumi-cho, Anan City, Tokushima Prefecture             Ceremony Company Card Media Office (72) Inventor Yasushi Kobayashi             Made by Oji 1-10-6 Shinonome, Koto-ku, Tokyo             Shinonome Research Institute, Inc. F-term (reference) 2C005 MA40 NA10 NA31 PA04                 5B035 BA03 BB09 CA01 CA23                 5J046 AA03 AA07 AA09 AB13 PA07                       PA09                 5J047 AA03 AA07 AA09 AB13 FD00

Claims (5)

[Claims] 1. An IC chip and a first antenna coupled to a terminal of the IC chip; a first antenna having a size larger than that of the first antenna and arranged to face the first antenna; An IC chip package according to an electrostatic coupling method, comprising a second antenna electromagnetically coupled with a non-electrically conductive substance interposed therebetween. 2. The first antenna is formed on a first support, and the second antenna is formed on a second support different from the first support. IC
Chip mount. 3. The IC chip mounting body according to claim 1, wherein the non-electrically conductive material includes an adhesive layer, or one or both of the first support and the second support. 4. The IC chip mounting body according to claim 1, wherein the second support is a cardboard liner. 5. The surface resistivity of the second antenna is 1 to 1.
The IC chip package according to any one of claims 1 to 4, which is in the range of 0000 Ω / □.