JPH11175678A - IC module and IC card mounting the module - Google Patents

Abstract

(57) [Summary] The present invention does not directly mount an IC chip on a terminal board, but mounts the IC chip on a board using a new flexible material, and connects the flexible board to the terminal board. Thus, an IC module in which a bending stress or a pressing force of the card is not directly applied to a mounting portion and an IC card on which the module is mounted are provided. The present invention provides an IC module in which an IC chip is mounted on a flexible wiring board without directly mounting on a connection terminal board, and the flexible wiring board is connected to a wiring board on the back side of the connection terminal board. An IC module which is mounted in a buried hole provided in a card base material to form an IC card, whereby a bending stress applied to the card is not directly applied to an IC chip mounting portion, and an IC card mounting the module.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC card for an IC card.
The present invention relates to a structure of a C module and an IC card on which the IC module is mounted.

[0002]

2. Description of the Related Art In recent years, as a card-shaped personal information recording medium, many cards called IC cards having an IC module provided with an integrated circuit such as a microprocessor and a memory have been developed. In the integrated circuit of this IC module, personal ID information (secret information) is electrically recorded from a general information recording medium, and the IC card is also used in hardware or software.
Information can be protected outside the card and inside the IC card.

For example, a typical structure of an IC module for a conventional IC card and an IC card are shown in FIG.
4A is a plan view of the IC module as viewed from the front terminal surface of the external connection terminal board, and each terminal 2 a, 2 b, and 2 c electrically connected to the IC chip 5 on the surface of the external connection terminal board 8.
2c, 2d, 2e, 2f, 2g, and 2h are provided. The central portion (indicated by a dotted line) shows the resin mold portion 4 in which the IC chip 5 and the bonding wires 6 formed on the back surface are sealed with resin. Further, FIG.
10B is a cross-sectional view of the IC module 1 shown in FIG. 10A taken along line TT and a cross section of the IC card substrate 20 on which the IC module is mounted. The wiring board 7 is connected to the terminals 2a to 2h through the through holes 3.
The IC chip 5 is connected to the IC chip 5 by a bonding wire 6 and has a resin mold portion 4 whose periphery is covered with an insulator such as BT resin, for example, and the entire mold portion 4 is formed in a downwardly convex shape. ing. Further, the exposed brim portion 9 on the back surface of the unmolded connection terminal substrate 8 on the outer periphery of the mold portion 4 is fixed to the upper portion of the buried hole 25 having a step formed at a predetermined position of the card base material 20 with an adhesive. Thus, an IC card is formed.

That is, in a conventional IC module,
Each terminal on the external connection terminal board of the IC module and I
The C chip was connected by a bonding wire, and the chip and the IC chip were completely covered with an insulator such as BT resin, including the bonding wire. In addition, in conventional IC cards, alignment is performed using the step of the rim of the outer peripheral edge of the back surface of the terminal board of the module and the buried hole provided in the card base, and the brim is adhered to the card base. It was what I was doing.

Therefore, in the conventional IC module for an IC card, when the IC card is physically bent,
There is also a problem that the wire is affected by the IC module and a force is applied to the wire to expand or contract inside the mold, and the wire is easily cut.
In addition, since the wire is completely covered with an insulator such as BT resin, including the bonding wires, when bending stress is applied to the vicinity of the module burying hole of the card base, pressure is directly transmitted to the brim portion of the external connection terminal board of the module, The IC module peels off from the card base material, peels off the molded part from the external connection terminal substrate, breaks in the wires, and the like, and stops functioning as an IC card.

[0006]

That is, the conventional IC
The physical destruction of a module is typically the destruction of an IC chip, the cutting of a bonding wire, and the peeling of a mold part. As described above, an insulator such as a BT resin is used to cover the IC chip on the back surface. Although mounted on the connection terminal board, there has been a problem that the fixed portion is peeled off by bending the IC card. Therefore, the present invention provides a method for mounting a card on a card using a new flexible material instead of directly mounting the IC chip on the terminal board, and connecting the flexible board to the terminal board of the IC module. Bending stress and force due to pressure are directly I
An object of the present invention is to provide an IC module which does not add to a mounting portion of a C chip and an IC card mounting the module.

[0007]

According to the present invention, in order to achieve the above object, each terminal provided on a connection terminal board of an IC module is electrically connected to an IC chip.
In an IC module for an IC card constituted by covering a chip and a connection portion thereof with an insulator for resin molding, an IC chip is mounted on a substrate made of a flexible material, and an IC chip and a wiring pattern on the flexible substrate are connected. An IC module in which a flexible wiring board electrically connected and formed by resin-molding the IC chip is connected to a wiring board on the back side of the connection terminal board.

In the IC module according to the first aspect, the wiring pattern on the flexible substrate and the IC
The electrical connection with the chip is characterized by being connected by any of wire bonding, solder bump, anisotropic conductor material, or the like.

Further, in the IC module according to any one of claims 1 and 2, an electrical connection portion between the wiring pattern on the flexible substrate and the IC chip and a back surface of the flexible substrate are insulated for resin molding. The flexible substrate is provided with through-holes so as to cover with the body and connect the resin mold insulators on the front and back sides.

Further, in the IC module according to any one of claims 1, 2 and 3, the electrical connection between the wiring pattern on the flexible board and the wiring board on the back side of the connection terminal board is made by wire bonding. It is characterized by being connected by one of a solder bump and an anisotropic conductor material, and the electrical connection portion is covered with an insulator for resin molding.

Further, in the IC module according to any one of claims 1, 2, 3, and 4, the electrical connection between the wiring pattern on the flexible board and the wiring board on the back side of the connection terminal board is made by an IC module. The wiring pattern of the flexible substrate is connected in parallel to the horizontal or vertical direction of the module.

Further, in the IC module according to any one of claims 1, 2, 3, 4 and 5, the electrical connection between the wiring pattern on the flexible substrate and the wiring board on the back side of the connection terminal substrate is established. , And are collectively connected to a central portion on the back surface side of the connection terminal substrate of the IC module.

An IC module constituted by electrically connecting each terminal provided on a connection terminal substrate of an IC module to an IC chip, and covering the IC chip and its connection portion with an insulator for resin molding. Is mounted on a card base made of an insulator such as polyvinyl chloride, ABS resin, or PET, and an IC chip is mounted between the back side of the connection terminal board and the card base. Characterized in that a gap is provided to such an extent that the flexible substrate and the respective surfaces do not completely adhere to each other.
It is a C card.

Further, in the IC card according to the present invention, the electrical connection between the wiring pattern on the flexible substrate and the wiring on the back side of the connection terminal substrate is arranged in a vertical direction of the IC module. Is characterized by being fixed so as to be sandwiched between the connection terminal substrate and the card base material.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION According to the present invention, an IC chip is mounted directly on a flexible substrate (for example, a copper-clad board having excellent flexibility using a base film of polyester, polyimide, etc.) instead of being directly mounted on a connection terminal substrate. This flexible board is connected to the connection terminal board to form an IC card mounted on the card base material. The IC module and the module are mounted so that the bending stress received by the card is not directly applied to the IC chip mounting portion. This is an IC card.

An embodiment will be described in detail with reference to the drawings.
FIG. 1 is an explanatory diagram showing an arrangement of a wiring board on the back surface side of a connection terminal board of an IC module. That is, the wiring board 7 is arranged in a substantially H-shape, and a wiring pattern 11 of a flexible wiring board described later is electrically connected to the wiring board 7 in the vertical direction or the horizontal direction.

FIGS. 2A and 2B show the configuration of an IC module according to an embodiment of the present invention. FIG. 2A is an explanatory view showing the configuration of a flexible wiring board, and FIG.
I using flexible wiring board with IC chip mounted
It is explanatory drawing which shows C module. That is, FIG.
As shown in FIG. 1A, a wiring pattern 11 is formed on the surface of a flexible substrate 10 (hereinafter, referred to as a flexible wiring substrate), and an IC chip 5 is formed thereon by wire bonding 6.
And a resin molded part 4 formed by covering the periphery with an insulator for resin molding (for example, BT resin, epoxy resin, silicon resin, phenolic resin, etc.).
It consists of. Note that this wiring pattern 11
Is thereafter electrically connected to the wiring board 7 on the back side of the terminal board shown in FIG. 1 in the vertical direction or in the horizontal direction. In addition, IC
As shown in FIG. 2B, an IC module using a substrate on which the chip 5 is mounted has a wiring board 7 formed on the back side of the connection terminal board 8 disposed on the right side in the vertical direction of the terminal board 8. In order to electrically connect the wiring pattern 7 and the wiring pattern 11 formed on the flexible substrate 10, wire bonding, solder bumps, or an anisotropic conductive material (for example, made of Au, Ag, Ni, Al or the like in a resin) A conductive filler is unevenly distributed in the front and back directions, a carbon fiber is oriented so as to match the pattern direction, or a thin line of Au, Ag, Ni, Al or the like is embedded in silicon rubber and slightly protruded on the surface. Are connected by the connection material 12. Further, at this time, a new resin molded portion may be formed by covering the connection portion between the wiring board 7 of the terminal substrate 8 and the wiring pattern 11 of the flexible substrate 10 with an insulator such as BT resin.

FIGS. 3A and 3B show the configuration of an IC module according to another embodiment of the present invention. FIG. 3A is an explanatory view showing the configuration of a flexible wiring board, and FIG. It is an explanatory view showing an IC module using a flexible wiring substrate. Flexible wiring boards
As shown in FIG. 3A, the wiring pattern 11 of the flexible substrate 10 and the IC chip 5 are connected by solder bumps 13. As shown in FIG. 3B, the IC module using the flexible wiring board on which the IC chip 5 is mounted has a front side (a surface on which the IC chip 5 is mounted) and a back side with the flexible wiring board interposed therebetween. (I
A flexible wiring board on which the IC chip 5 is mounted, which is formed by covering the surface of the IC chip 5 with an insulator such as BT resin and forming the resin mold portions 4 and 4 on the surface on which the C chip 5 is not mounted. The flexible substrate 10 is provided with a plurality of through holes 16 for connecting (connecting) an insulator such as a BT resin provided on the front and back in advance.

FIGS. 4A and 4B show the configuration of an IC module according to another embodiment of the present invention. FIG. 4A is an explanatory view showing the configuration of a flexible wiring board, and FIG. It is an explanatory view showing an IC module using a flexible wiring substrate. As shown in FIG.
Flexible board 10 that connects wiring pattern 11 of flexible board 10 and IC chip 5 with solder bumps 13 and connects to the back side of connection terminal board 8 of the module
A connection hole 14 is provided on the upper wiring pattern 11. Further, in an IC module using a flexible wiring board on which the IC chip is mounted, as shown in FIG. 4B, the IC chip 5 is mounted on the back side of the flexible wiring board, and the IC chip 5 faces downward. As described above, the connection terminal board 8 is connected to the wiring board 7 formed at one end in the horizontal direction on the back side. In this connection, solder 15 is applied to connection holes 14 provided in the wiring pattern 11 of the flexible substrate 10 for connection.

FIGS. 5A and 5B show the configuration of an IC module according to another embodiment of the present invention. FIG. 5A is an explanatory view showing the configuration of a flexible wiring board, and FIG. It is an explanatory view showing an IC module using a flexible wiring substrate. As shown in FIG.
In order to connect to the central portion of the wiring board 7 on the back surface side of the connection terminal substrate 8, the wiring patterns 11 are collectably connected to the central portion on the flexible substrate 10. Also, this IC
As shown in FIG. 5B, an IC module using a flexible wiring board on which a chip is mounted is formed by connecting a flexible wiring board in which a wiring pattern 11 on a flexible board 10 and an IC chip 5 are connected by solder bumps 13 to the substrate. 8 A connection material 12 (wire bonding, solder bump, anisotropic material, or the like) is connected to a connection terminal substrate 8 having a wiring board 7 formed in the center portion on the back surface side, and the flexible wiring substrate is bent inward by 180 ° to obtain an IC. The chip 5 is arranged so as to face downward. At this time, the inner surfaces of the bent flexible wiring boards are provided with a slight gap so that they do not come into contact with each other.

FIG. 6 shows an IC according to another embodiment of the present invention.
It is explanatory drawing represented by the cross section of the module. That is, the wiring pattern 11 of the flexible substrate 10 and the IC chip 5
And a connection terminal board 8 in which a wiring board 7 is formed at the center of the back side of the board 8 by connecting holes 1 formed in a flexible board 10.
4 to which solder 15 is applied and connected, and this flexible substrate 10 is bent inward so as to be substantially U-shaped,
The IC chip 5 is located between the bent flexible substrate 10 and the substrate 10.

FIG. 7 is an explanatory view showing the configuration of an IC card in which an IC module according to an embodiment of the present invention is embedded in a card base material. First, a buried hole 25 having a step for mounting an IC module is provided at a predetermined position on a card base material 20 made of an insulator such as polyvinyl chloride, ABS resin, PET or the like. Then, the IC module is fixed with an adhesive. That is, as shown in the figure, the wiring board 7 formed on the back side of the connection terminal board 8
And a brim portion 9 on the outer peripheral edge of the connection terminal board 8 including a portion where the wiring pattern 11 on the flexible board 10 is connected, and an upper portion of the burying hole 25,
By fixing the IC card 1, an IC card equipped with the IC module of the present invention is obtained. In this case, the bottom surface of the flexible substrate 10 and the bottom surface 25 of the
Since a gap is provided between the IC module and a, a cushioning property is generated so as to correspond to the pressing or bending stress applied to the IC module.

FIG. 8 shows the structure of an IC card according to another embodiment of the present invention. In the same manner as described above, a stepped buried hole 25 is provided at a predetermined position of the card base material 20.
The IC module shown in FIG. 4B is mounted in the buried hole. That is, the brim portion 9 on the outer peripheral edge of the connection terminal board 8 excluding the portion where the wiring pattern 11 on the flexible board 10 is connected, and the buried hole 2
By fixing the upper part 5 with the adhesives 21 and 21, an IC card having the IC module of the present invention is obtained. Also, as described above, the flexible substrate 10
Since a gap is provided between the bottom surface 4a of the resin mold portion 4 provided in the base member and the bottom surface 25a of the buried hole of the card base material,
Cushioning occurs to correspond to the pressing and bending stress applied to the C module.

FIG. 9 shows the structure of an IC card according to another embodiment of the present invention. In the same manner as described above, a stepped buried hole 25 is provided at a predetermined position of the card base material 20.
The IC module shown in FIG. 5B is mounted in this buried hole. That is, by fixing the brim portion 9 of the outer peripheral edge of the connection terminal substrate 8 and the upper portion of the burying hole 25 with the adhesives 21 and 21, an IC card on which the IC module of the present invention is mounted can be obtained. Further, similarly to the above, since a gap is provided between the bottom surface 4a of the resin mold portion 4 provided on the flexible substrate and the bottom surface 25a of the buried hole of the card substrate, the gap is provided so as to correspond to the pressure applied to the IC module. Cushioning occurs.

[0025]

According to the present invention, since the IC chip is not directly mounted on the connection terminal board of the IC module, an IC module having improved strength against bending stress applied to the terminal board and pressing from above the module is provided. It is possible to provide a highly reliable IC card. That is, the IC module of the present invention
By connecting the flexible wiring board on which the IC chip is mounted to the connection part on the back side of the terminal board, which is connected from the terminal on the connection terminal board with a through hole, to the part covered with an insulator such as bonding wires and BT resin The bending stress can be absorbed by the flexible wiring board portion and relieved, and the cutting and peeling of the wire can be reduced. In addition, the electrical connection between the wiring pattern on the flexible wiring board and the wiring board on the back side of the connection terminal board can be connected in parallel to the horizontal or vertical direction of the IC module or at the center. In addition, when the IC card is physically bent, a portion affected is reduced, so that a force applied to the IC module can be reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a wiring board arranged on the back side of a connection terminal board according to the present invention.

FIGS. 2A and 2B are diagrams illustrating a configuration of an IC module according to an embodiment of the present invention, wherein FIG. 2A is an explanatory diagram illustrating a configuration of a flexible wiring board, and FIG. FIG. 3 is an explanatory diagram showing an IC module using the IGBT.

3A and 3B are diagrams illustrating a configuration of an IC module according to another embodiment of the present invention, wherein FIG. 3A is an explanatory diagram illustrating a configuration of a flexible wiring board, and FIG. 3B is a diagram illustrating a flexible wiring on which an IC chip is mounted; It is explanatory drawing which shows the IC module using a board | substrate.

4A and 4B are diagrams illustrating a configuration of an IC module according to another embodiment of the present invention, wherein FIG. 4A is an explanatory diagram illustrating a configuration of a flexible wiring board, and FIG. 4B is a diagram illustrating a flexible wiring on which an IC chip is mounted; It is explanatory drawing which shows the IC module using a board | substrate.

5A and 5B are diagrams illustrating a configuration of an IC module according to another embodiment of the present invention, wherein FIG. 5A is an explanatory diagram illustrating a configuration of a flexible wiring board, and FIG. It is explanatory drawing which shows the IC module using a board | substrate.

FIG. 6 is an explanatory view showing a cross section of an IC module according to another embodiment of the present invention.

FIG. 7 is an explanatory diagram showing a configuration of an IC card in which an IC module according to an embodiment of the present invention is embedded in a card base material.

FIG. 8 is an explanatory diagram showing a configuration of an IC card according to another embodiment of the present invention.

FIG. 9 is an explanatory diagram showing a configuration of an IC card according to another embodiment of the present invention.

10A and 10B are explanatory views showing a conventional IC module, in which FIG. 10A is a plan view seen from a terminal surface, and FIG.
Is a cross-sectional view taken along the line TT.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... IC module 2 (2a-2h) ... Each terminal 3 ... Through-hole 4 ... Resin mold part 4a ... Bottom of resin mold part 5 ... IC chip 6 ... Bonding wire 7 ... Wiring board 8 ... Terminal board for external connection 9... Flange portion of terminal board 10... Flexible board 11... Wiring pattern of flexible board 12... Connection material 13... Solder bump 14... Connection hole 16. ... card base material 21 ... adhesive 25 ... buried hole 25a ... bottom surface of buried hole

Claims (8)

[Claims] An IC constituted by electrically connecting each terminal provided on a connection terminal substrate of an IC module to an IC chip, and covering the IC chip and its connection portion with an insulator of a molding resin. In an IC module for a card, a flexible wiring substrate formed by mounting an IC chip on a substrate made of a flexible material, electrically connecting the IC chip to a wiring pattern on the flexible substrate, and resin-molding the IC chip, An IC module connected to a wiring board on the back side of the connection terminal board. 2. An electric connection between the wiring pattern on the flexible substrate and the IC chip is performed by wire bonding,
The IC module according to claim 1, wherein the IC module is connected by one of a solder bump and an anisotropic conductive material. 3. An electrically connecting portion between the wiring pattern on the flexible substrate and the IC chip, a back surface of the flexible substrate is covered with a molding resin insulator, and the front and back molding resin insulators are connected. 3. The IC module according to claim 1, wherein the flexible substrate is provided with a through hole. 4. The electrical connection between the wiring pattern on the flexible substrate and the wiring board on the back side of the connection terminal substrate is made by any one of wire bonding, solder bump, anisotropic conductor material, and the like. The IC module according to claim 1, wherein the connection portion is covered with an insulator of a molding resin. 5. An electric connection between the wiring pattern on the flexible board and the wiring board on the back side of the connection terminal board, wherein the wiring pattern on the flexible board is connected in parallel with the horizontal or vertical direction of the IC module. The IC module according to any one of claims 1, 2, 3, and 4, wherein: 6. An electrical connection between the wiring pattern on the flexible substrate and the wiring board on the back side of the connection terminal board is collectively connected to a central portion on the back side of the connection terminal board of the IC module. The IC module according to any one of claims 1, 2, 3, 4, and 5, wherein 7. An IC constituted by electrically connecting each terminal provided on a connection terminal board of an IC module to an IC chip, and covering the IC chip and its connection portion with an insulator of a molding resin. In an IC card in which a module is mounted on a card base, there is a gap between the back side of the connection terminal board and the card base such that the flexible board on which the IC chip is mounted does not completely adhere to each surface. An IC card, which is provided. 8. An electrical connection between the wiring pattern on the flexible board and the wiring board on the back side of the connection terminal board is I
The I module according to claim 7, wherein when the module is arranged in the vertical direction of the C module, the module is fixed so as to be sandwiched between the connection terminal board and the card base via an adhesive.
C card.