JP2003209421A - RFID tag having transparent antenna and method of manufacturing the same - Google Patents

Abstract

(57) Abstract: Provided is an RFID tag having a transparent antenna with a beautiful design and a high designability which does not hinder display such as printing at the lower part of the tag by using an antenna pattern as a transparent body, and a method of manufacturing the same. . At least a part of a parent antenna pattern that wirelessly communicates with a reader / writer is a transparent conductive material having a total light transmittance of 50% or more and a surface resistance of 10 ⁶ Ω / □ or less. RFID with formed transparent antenna
The method is characterized by a method of manufacturing an RFID tag having a tag and a transparent antenna in which an IC chip label is separately formed into a transfer foil or a tack label, and the IC chip label is attached to the parent antenna pattern so as to be attached thereto. .

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an RFID tag and a method of manufacturing the same, and more specifically, an RFID tag in which an antenna section for wirelessly communicating with the reader / writer is formed of a transparent body, and a method of manufacturing the same. It is about.

[0002]

2. Description of the Related Art Conventionally, a goods label, a shelf label, a bar code and the like have been used to store and retrieve products, stock, and manage sales. In recent years, instead of this, the use of RFID tags has been increasing, which enables wireless communication of information and can record a large amount of information. The RFID tag includes at least an IC chip and an antenna, and can wirelessly communicate with the reader / writer through the antenna. In addition, electrostatic coupling type R
The antenna part of the FID tag is composed of two antenna patterns forming a pair. The antenna pattern is formed of conductive ink by known offset printing, gravure printing, flexo printing, silk screen printing, or the like. As a conductive ink, there is known a method of using an ink in which carbon, graphite, aluminum powder, silver powder, or a mixture thereof is dispersed in a vehicle.

However, the appearance of the two antenna patterns forming a pair has the drawback that the appearance is poor and opaque because the conductive material of the conductive ink has a metallic powder color, black, or a color tone close to it. Furthermore, in order to function as an antenna that wirelessly communicates with the reader / writer, a certain area or more is required according to the communication distance, and as a result, the antenna pattern occupies most of the RFID tag area, When it is attached to or placed on a medium such as a product or a package, which is a typical purpose, it not only impairs the appearance,
There is a problem that the display area such as the product name and the handling explanation is taken up, so that the sufficient display cannot be performed.

[0004]

Therefore, the present invention has been made to solve such a problem. It is an object of the present invention to provide an RFID tag having a transparent antenna pattern, which is beautiful and which does not hinder the display such as printing under the tag and has a high designability, and a manufacturing method thereof.

[0005]

In order to solve the above-mentioned problems, an RFID tag according to the invention of claim 1 has a total light transmittance of 50% or more of at least a part of an antenna pattern, and the antenna. Pattern surface resistance is 10 ⁶
Ω / □ or less. According to the present invention, there is provided a beautiful RFID tag having an antenna pattern as a transparent body, which does not obstruct the display such as printing under the tag. The RFID tag according to the invention of claim 2 is formed on the product itself that uses the antenna pattern or on the package of the product. ADVANTAGE OF THE INVENTION According to this invention, the cheap RF which does not require the base material which forms an antenna pattern.
An ID tag is provided. The RFID tag of the third aspect of the invention is formed by thermally transferring an antenna pattern transfer foil in which a transfer substrate, a release layer, a transparent antenna pattern layer, and a thermal adhesive layer are sequentially provided. According to the present invention, a base material for forming an antenna is not required, the shape of the antenna pattern can be easily changed, and since it can be formed later on the product itself or the packaging body of the product,
RFI that does not interfere with the manufacture of the product itself or the package of the product
D-tags are provided. The RFID tag of the invention of claim 4 is such that the transparent conductive layer contains tin oxide doped with antimony. According to the invention,
An inexpensive RFID tag having an antenna pattern that is transparent and conductive is provided.

In the RFID tag manufacturing method according to the invention of claim 5, (a) a pair of parent antenna patterns, at least a part of which is transparent, is provided on the base material in advance, (b) at least an IC chip, and In an IC chip label having a pair of child antenna patterns connected to an IC chip, an anisotropic conductive or non-conductive thermal adhesive layer is provided on the child antenna pattern surface to form an IC chip transfer foil, (c) The IC chip transfer foil is transferred such that the pair of child antenna patterns are opposed to the pair of transparent parent antenna patterns that are previously provided on the base material. According to the present invention, there is provided a method for manufacturing an RFID tag in which an IC chip label is mechanically transferred by a simple thermal transfer machine. In the RFID tag manufacturing method according to the invention of claim 6, (a) a pair of parent antenna patterns, at least a part of which is transparent, is provided on the base material in advance, (b) at least I
An IC chip label having a C chip and a pair of child antenna patterns connected to the IC chip is provided with an adhesive layer on the child antenna pattern surface to be an IC chip tack label that is separably placed on a release paper, (C) The IC chip tack label is attached such that the pair of child antenna patterns face a pair of transparent parent antenna patterns that are previously provided on the base material.
According to the present invention, there is provided a method of manufacturing an RFID tag in which an IC chip label is mechanically transferred by a simple labeler machine.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail with reference to the drawings. First, RFI used in the present invention
The D tag is an RFID (Radio Frequency)
As a medium of y Identification system, it is a tag that can communicate information wirelessly (non-contact) using radio waves. An RFID tag consists of an IC pattern and an antenna pattern provided on a base material such as paper or plastic,
A resonant circuit is formed by the antenna pattern and the capacitive element built in the IC chip. When the resonance circuit receives a calling radio wave of a constant frequency from the reader / writer,
The information stored in the memory is sent back to the reader / writer that is the transmission source. In this way, the RFID tag can communicate information with the reader / writer in a non-contact manner.

The "RFID tag" has a "contactless I"
Although it may be expressed by various names such as “C tag”, “non-contact data carrier”, “wireless IC tag”, “non-contact IC”, “non-contact IC label”, “transponder”, etc., the present invention Then, as a representative, it will be expressed as “RFID tag”, and also includes those having the names expressed as described above.

The frequency used by the RFID tag for communication is
UHF-SHF band (850-950 MHz and 2.4-
5 GHz), HF band (10 to 15 MHz), LF-MF
There is a band (100 to 500 KHz). An RFID tag of an electromagnetic induction system that uses frequencies in the UHF-SHF band and the HF band has a long communication distance but is expensive. In the present invention, although it can be applied to any RFID tag, the reading distance is relatively short, but the entire system including the RFID tag, the reader / writer and the control device is inexpensive and has a wide range of applications.
An RFID tag using an electrostatic coupling method using a frequency in the LF-MF band (100 to 500 KHz) is suitable.
Since the antenna of the electrostatically coupled RFID tag is usually printed in black with a printing ink containing carbon, it has an unsatisfactory appearance and cannot have other indications on the printed surface. The effect of making the antenna pattern transparent is extremely large.

Further, the present invention can be applied to a case where a plurality of products to which RFID tags are attached are packed in the same package. In the case of multiple products, multiple RFID tags that are affixed respond to the calling radio waves from the reader / writer all at once, resulting in data collision (collision). A method of sequentially communicating tags may be applied. In this way, product entry / exit, inventory, sales management, etc., which were carried out using luggage tags, shelf labels, bar codes, etc., can be performed by RFI.
The number of examples using D tags is increasing. Here, “adhering” means a state of being integrated by means such as adhesion or adhesion.

FIG. 1 shows an RFID showing an embodiment of the present invention.
It is a typical top view of a tag. Figure 1 shows the electrostatic coupling type R
The FID tag shown in FIG. 1 (A) is an IC chip label 10L.
1A is a plane state in which the is attached so as to be connected to both the antenna patterns 111 and 112, and FIG. 1B is a perspective state for explaining the configuration of FIG. FIG. 2 shows A of FIG.
It is a typical sectional view of an A section, a BB section, and a CC section. Figure 2
(A) is an IC chip label 10L in the AA cross section of FIG.
Is. FIG. 2B is a BB cross section of FIG.
2C shows a state in which the parent antenna patterns 111 and 112 are provided, and FIG. 2C is a cross-sectional view taken along the line CC in FIG. 1 and both parent antenna patterns 111 and 112 in FIG.
The child antenna patterns 121 and 122 are in a state of being transferred via the conductive thermal adhesive layer 130A so as to face each other, and function as an electrostatic coupling type RFID tag.
It can be used double as an antenna part and a display printing part by overlapping display printing of a product name etc. on the upper and lower parts of the antenna pattern part without any discomfort with the non-formed part.

The material of the base material 210 of the RFID tag is not particularly limited as long as it is an insulating material.
For example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymer, terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer, polyethylene terephthalate / polyethylene naphthalate Polyester resin such as co-extrusion film, polyamide resin such as nylon 6, nylon 66 and nylon 610, polyolefin resin such as polyethylene, polypropylene and polymethylpentene,
Vinyl resins such as polyvinyl chloride, acrylic resins such as polyacrylate, polymethacrylate and polymethylmethacrylate, imide resins such as polyimide / polyamideimide / polyetherimide, polyarylate / polysulfone / polyethersulfone, Polyphenylene ether polyphenylene sulfide (PP
S) ・ Engineering resins such as polyetherketone, polyether-etherketone, polyethersulfite, polystyrene, high impact polystyrene, AS resin, styrene resins such as ABS resin, cellophane, cellulose triacetate, etc. Cellulose-based films such as cellulose diacetate and nitrocellulose, and papers such as high-quality paper, coated paper, impregnated paper, synthetic paper and paperboard can be applied, but high-quality paper is usually preferably used. The thickness of the high-quality paper is usually 30 to 500 g / m.
² is applicable and 75 to 200 g / m ² is preferable. The base 210 may be mixed with additives such as colorants, antistatic agents, lubricants, and stabilizers, or a composition containing these may be applied within a range that does not affect the function.

The formation of the pair of parent antenna patterns 111 and 112 of the conventional electrostatically coupled RFID tag is performed by using the RFI.
Using conductive paint (ink) on the D tag base material 210,
It is formed by offset printing, gravure printing, flexo printing, silk screen printing, etc. Since the ink containing carbon, graphite, aluminum powder, silver powder, or a mixture thereof in a vehicle is used as the conductive ink, it is black or has a color tone close to it and is opaque.

Although the antenna pattern of the conventional RFID tag is formed of an opaque body, in the present invention, the parent antenna patterns 111 and 112 of the electrostatic coupling type RFID tag are used.
It was found that information can be wirelessly communicated with a reader / writer by forming a transparent material even with a transparent material. As for the degree of conductivity, it is sufficient that the surface resistance value of the parent antenna patterns 111 and 112 is 10 ⁶ Ω / □ or less. It is preferably 10 ⁴ Ω / □ or less, and the reliability of communication is improved. The surface resistance is JIS, K691.
According to 1, the measurement was performed with a specific resistance measuring device manufactured by Takeda Riken Co., Ltd. under the conditions of an applied voltage of 500 V, 23 ° C. and 40% RH. In addition, the parent antenna pattern 11 of the electrostatically coupled RFID tag
At least one of the materials 1 and 112 may be made of a transparent material, and of course, both of them are preferably transparent. The transparency should be readable if the display such as the print under the transparent antenna is legible.
If the total light transmittance measured by IS or K0115 is 50% or more, it is preferable because it can be easily read.

As a method of forming a transparent and conductive antenna pattern of the present invention, a thin film of metal or metal oxide is vapor-deposited on the surface of the substrate 210, or a transparent conductive paint (ink) is applied on the surface. It may be coated to form a coating film. However, it is costly to form a thin film of metal or metal oxide by a vacuum method such as vapor deposition. Therefore, it is preferable to print a transparent conductive ink. Conductive ink is
A conductive material and a binder are dissolved or dispersed in an organic solvent. As the conductive material, an organic conductor such as 7,7,8,8, -tetracyanoquinodimethane complex (TCNQ complex), or a dispersion of tin oxide compound powder or indium oxide compound powder can be applied. . Antimony-doped tin oxide (ATO) and tin-doped indium oxide (ITO) are preferable to enhance conductivity, and antimony-doped tin oxide (ATO) is particularly preferable.

As the binder, conventionally known thermoplastic resins, thermosetting resins, reactive resins, electron beam curable resins, ultraviolet curable resins, visible light curable resins and mixtures thereof are used. Examples of the thermoplastic resin include vinyl chloride vinyl acetate copolymer, vinyl chloride copolymer, vinyl chloride vinyl acetate vinyl alcohol copolymer, vinyl chloride vinyl alcohol copolymer, vinyl chloride vinylidene chloride copolymer, vinyl acrylonitrile chloride. Copolymer, acrylic ester acrylonitrile copolymer, acrylic ester vinylidene chloride copolymer, acrylic ester styrene copolymer, methacrylic ester acrylonitrile copolymer, methacrylic acid vinylidene chloride copolymer, methacrylic ester styrene Copolymer, urethane elastomer, nylon-silicone resin, nitrocellulose-polyamide resin, polyfucca vinyl, vinylidene chloride acrylonitrile copolymer, butadiene acrylonitrile copolymer, polyamide Fat, polyvinyl butyral, cellulose derivative (cellulose acetate butyrate, cellulose diacetate, cellulose triacetate, cellulose propionate, nitrocellulose, ethyl cellulose, methyl cellulose, propyl cellulose, methyl ethyl cellulose, carboxymethyl cellulose, acetyl cellulose, etc.), styrene butadiene co-weight Various synthetic rubber type thermoplastic resins such as coalesce, polyester resin, polycarbonate resin, chlorovinyl ether acrylate copolymer, amino resin and polyamide resin, and mixtures thereof are used.

As a method for printing these transparent conductive inks, known methods such as screen printing, flexographic printing, gravure printing, offset printing, gravure offset printing and the like may be used. If the thickness of the coating film is too thick, the transparency is lowered and at the same time the cost is high. Therefore, the thickness as thin as possible so as to obtain the required surface resistance may be appropriately selected. Specifically, 0.1 to 50 μm
The degree is preferably 1 to 10 μm. As for the transparency, it is sufficient that the letters and patterns underneath can be observed through the transparent antenna pattern, but the total light transmittance measured by JIS, K0115 is preferably 50% or more. It is preferable to appropriately display the product name, selling point, handling method, precautions, etc. under the transparent antenna pattern printed and applied with the transparent conductive ink. As the display, various known printing methods, transfer, handwriting and the like can be applied. When the display is performed by the same printing method as the antenna pattern, it is possible to efficiently perform the same process by increasing the number of colors required for the display.

Although the parent antenna patterns 111 and 112 are directly printed on the substrate 210 in the above, the antenna pattern is once provided with a transfer substrate, a release layer, a transparent conductive layer, and a thermal adhesive layer in this order. After making the parent antenna pattern transfer foil, heat and pressurize the parent antenna pattern shape mold,
You may heat-transfer to the base material 210. In this way, the shapes of the antenna patterns 111 and 112 are determined by the shapes drawn on the mold, and can be set freely. In the printing method, a printing plate consisting of a number of precise steps had to be produced each time in accordance with the printing method. That is, the antenna pattern 111 that changes depending on the application and the communication distance,
112 can be easily formed at low cost.

FIG. 3 is a sectional view of a transfer foil forming the antenna of the RFID tag of the present invention. 3A shows an antenna pattern transfer foil, and FIG. 3B shows a step of transferring the antenna pattern transfer foil to the base material 210. The antenna pattern transfer foil used in the transfer method is a transfer substrate 4
1, the release layer 43, the transparent conductive layer 45, and the thermal adhesive layer 47 may be sequentially provided. As the transfer substrate 41, for example, polyethylene terephthalate, polybutylene terephthalate, polypropylene, polymethyl methacrylate, polycarbonate, etc. can be applied.

Examples of the release layer 43 include acrylic resin, cellulose resin, wax, melamine resin and the like. The resin is dissolved or dispersed in a solvent, an additive such as a pigment is appropriately added, and the resin is applied by a known coating method and dried to obtain a layer having a thickness of 0.1 μm to 10 μm. Further, a peeling layer that stabilizes transfer may be provided between the release layer 43 and the transparent conductive layer 45. Further, an anisotropic conductive layer may be provided between the release layer 43 and the transparent conductive layer 45, so that the parent antenna pattern and the child antenna pattern are in a stable connected state and radio communication is stable.

As the transparent conductive layer 45, a solution obtained by dissolving or dispersing the above-described conductive material and binder in an organic solvent is applied. As the conductive material, 7,7,8,8, -tetracyanoquinodimethane complex (T
CNQ complex), a dispersion of tin oxide compound powder or indium oxide compound powder, and the like can be applied. In the case of a tin oxide-based compound, antimony is doped, and in the case of an indium oxide-based compound, tin is preferably doped to enhance conductivity. A material obtained by dissolving or dispersing a conductive material and a binder in an organic solvent, appropriately adding an additive such as a pigment, and applying and drying the coating material by a known coating method to give a thickness of 2 to 30 μm.
Obtain m layers.

As the heat-adhesive layer 47, a known heat-sensitive adhesive that melts or softens when heated to exert an adhesive effect can be used. Specifically, vinyl chloride-vinyl acetate copolymer resin, acrylic resin, Examples include polyester resins. Dissolving or dispersing the material resin in a solvent,
Additives such as pigments are appropriately added, and the coating is applied by a known coating method and dried to obtain a layer having a thickness of 2 to 30 μm.

The release layer 43 of the transfer foil, the transparent conductive layer 45,
All of the thermal adhesive layers 47 may be applied on the entire surface, and a coating method may be used instead of the printing method. Other than the above as the coating method, for example, roll coat, reverse roll coat, transfer roll coat, gravure coat, gravure reverse coat, kiss coat, comma coat, rod coat, blade coat, bar coat, wire bar coat, knife coat, Squeeze coat, air doctor coat, air knife coat, die coat, lip coat, curtain coat, flow coat, dip coat, spray coat and the like can be applied.

Using the antenna pattern transfer foil, as shown in FIG.
As in (B), it is transferred to the base material 210. The parent antenna patterns 111 and 112 may be provided not on the base material 210 but on the product itself or its package. First, the transfer foil is overlaid on the base material 210, the product itself, or a package thereof, and the mold 4 having a heated parent antenna pattern shape is formed.
It is sufficient to pressurize 9. The transparent conductive layer 45 and the thermal adhesive layer 47 are peeled from the release layer 43 of the antenna pattern transfer foil and adhered via the melted thermal adhesive layer 47, and the transparent conductive layer 45 is the base material 210, the product itself, Alternatively, it is formed into the package. The transferred transparent conductive layer 45 has a shape to the antenna patterns 111 and 112. That is, a pair of parent antenna patterns 111 and 112 is formed. The parent antenna patterns 111 and 112 formed in this way
May be a pair or one, but in the case of one, the other is provided with a conventional opaque conductive material. The shape of the parent antenna patterns 111 and 112 may be
The size and shape can be set appropriately. In printing,
Although it is limited to the printing plate, in the transfer method, it is sufficient to change the shape of the mold, and many antenna patterns 111 and 112 are required.
The shape of Further, the formation of the antenna patterns 111 and 112 by the transfer method may be performed after the product itself or the packaging body thereof is completed, and therefore does not adversely affect the production of the product itself or the packaging body.

FIG. 4 is a conceptual perspective view showing an embodiment of the present invention. The parent antenna patterns 111 and 112 of the electrostatically coupled RFID tag may be provided not on the base material but on the product itself, its package, or the package. FIG. 4 (A) shows
As an example, a cardboard box, which is a package, is printed with transparent conductive ink or the like in advance to form the parent antenna pattern 11
This is a state in which the components 1 and 112 are provided. In the printing, the transparent conductive ink is used to perform offset printing, gravure printing, flexo printing, or flex printing on the product itself or its packaging or packaging.
From silk screen printing or the like, it may be appropriately selected depending on the material and shape of the package. Further, the printing with the conductive ink may be carried out not only by printing the transparent conductive parent antenna pattern but also by printing other products such as a trade name and a description of handling. In this case, it is possible to efficiently perform the process in one step only by increasing the number of colors. Also, RF
There is no need for an ID tag base material and there is a resource saving effect.

FIG. 5 is a conceptual perspective view showing a product to which the RFID tag of the related art or the present invention is attached. Figure 5 (A)
Indicates a product to which a conventional RFID tag is attached.
There are few display parts indicated by "D". FIG. 5B shows a product to which the RFID tag of the present invention is attached.
It is possible to take a lot of the display portion represented by "HIJKLM". The position where the parent antenna patterns 111 and 112 are provided is not particularly limited, and may be directly provided at an appropriate position of the product, or if there is a nameplate label indicating a manufacturing number or the like. Also, when it is provided in the package of the product, it is not particularly limited, if there is a nameplate such as the product name directly on the packaging or at an appropriate position of the packaging,
It may be provided there. Product body or package of the product,
The material and shape of the package are not particularly limited, and various types can be used. FIG. 4B shows a state in which the child antenna patterns 121 and 122 of the IC chip label 10L are attached to the parent antenna patterns 111 and 112 provided in advance in the cardboard box so as to face each other, and as a RFID tag, a reader / writer and a wireless device are used. The function that can communicate with is expressed.

The IC chip label 10L of the electrostatic coupling type RFID tag is shown in a sectional view taken along the line AA of FIG. 2A, and the IC chip label base material 20 has a pair of two-sided child antenna patterns 121. , And 122 are electrically connected to the IC chip 10 in which an integrated circuit and / or a memory are provided on a silicon substrate. The child antenna patterns 121 and 122 are printed with conductive ink.
The conductive ink may be transparent or opaque. Due to its small area, conventional opaque conductive inks such as
It may be formed by offset, gravure, flexo, silk screen printing, etc. using an ink in which carbon, graphite, aluminum powder, silver powder, or a mixture thereof is dispersed in a vehicle, but the parent antenna pattern 11
It is more preferable to form the transparent conductive ink similar to that of Nos. 1 and 112.

An adhesive layer is provided on the surfaces of the child antenna patterns 121 and 122 to form a transfer foil, or an adhesive layer is provided on the surfaces of the child antenna patterns 121 and 122 to be releasably placed on a release paper. Only the 10 L layer of the IC chip label is punched out, and the portion other than the label is removed to form a tack label. A book having a transparent antenna by adhering or adhering the pair of child antenna patterns 121, 122 of the IC chip label 10L to the pair of parent antenna patterns 111, 112 provided in advance on the base material. It becomes the RFID tag of the invention. Here, the term “relative” means that the pair of child antenna patterns 121 and 122 and the pair of parent antenna patterns 111 and 112 face each other. That is, the child antenna pattern 121, the parent antenna pattern 111, and the child antenna pattern 1
22 and the parent antenna pattern 112 face each other, but the child antenna pattern 121 and the parent antenna pattern 112,
Also, the child antenna pattern 122 and the parent antenna pattern 111 do not face each other. Hereinafter, the same definition is used in this specification.

That is, the child antenna patterns 121 and 12
2 and the parent antenna patterns 111 and 112 are attached such that a pair of two-sided patterns face each other and partially overlap each other, as shown in the perspective view of FIG. In addition, when viewed in cross section, the parent antenna patterns 111 and 112 on the surface of the base 210 and the child antenna patterns 121 and 122 of the IC chip label 10L are configured to face each other as shown in FIG. 2C. ing. IC chip 1
When 0, the child antenna patterns 121 and 122 are electrically coupled to the parent antenna patterns 111 and 112, and communication with the reader / writer is possible via the parent antenna patterns 111 and 112. In this way, the IC chip label 1
By sticking 0L, the function as the RFID tag 11 can be exhibited.

As the RFID tag, for example, the product name "Bistatix" manufactured by Motorola, Inc. is suitable.
The IC chip 10 is a silicon substrate provided with an integrated circuit, a memory, or both. In the case of an IC memory, 100 characters can be recorded at 800 Bits, and a mark made of fluorescent ink that is usually used for product management. Sufficient information can be recorded even when compared with or barcodes. Also, if the memory is a few kilobits,
It is possible to record more than a two-dimensional barcode. Further, although information cannot be rewritten with a mark using fluorescent ink or a two-dimensional bar code, the RFID tag of the present invention has an advantage that information can be sequentially additionally recorded and rewritten as necessary.

Next, a method of manufacturing the RFID tag of the present invention will be described. FIG. 6 is a cross-sectional view of a transfer foil state of an IC chip label for explaining the RFID tag manufacturing method of the present invention. FIG. 7 is a cross-sectional view of another IC chip label in a transfer foil state for explaining the RFID tag manufacturing method of the present invention. FIG. 8 is a cross-sectional view of an IC chip label in a tack label state for explaining the RFID tag manufacturing method of the present invention.
In the present invention, in order to easily attach the IC chip label 10L to the surfaces of the parent antenna patterns 111 and 112 by aligning the positions, the anisotropic conductive thermal adhesive layer 130A is added to the IC chip label 10L as shown in FIG. Is the IC chip label 10L
After the non-conductive heat-adhesive layer 130B is provided to form a transfer foil, it is transferred to the base material on which the parent antenna pattern is provided in advance by pressure bonding with a heating die. In FIG. 8, after the adhesive layer 130C is provided to form a tack label, the adhesive layer 130C is attached to the base material on which the parent antenna pattern is provided by pressure bonding. Either method can be easily manufactured by existing existing equipment, and transfer and pressure bonding are also the same.

6 and 7 show a transfer foil for an IC chip label. Transfer substrate 230 and IC chip label substrate 20
And the IC chip label base material 2 by temporarily attaching and
The child antenna patterns 121 and 122 are formed on the 0th surface with transparent or opaque conductive ink. The conductive ink and the pattern forming method may be as described above. The IC chip 1 is attached to each of the child antenna patterns 121 and 122.
After electrically connecting the respective terminals of 0 with a conductive adhesive or the like, half cutting is performed on the outer shape of the IC chip label 10L, and unnecessary base material portions are scraped off.

Next, an anisotropic conductive thermal adhesive layer 130A or a nonconductive thermal adhesive layer 130B is provided on the surface of the IC chip 10. As a material for the non-conductive heat-adhesive layer 130B, a known heat-sensitive adhesive that melts or softens when heated to exhibit an adhesive effect can be used. Specifically, vinyl chloride-vinyl acetate copolymer resin, acrylic resin can be used. Examples thereof include resins and polyester resins. The material resin is dissolved or dispersed in a solvent, an additive such as a pigment is appropriately added, and the material resin is applied by a known method such as screen printing and dried. The thickness of the layer is usually about 0.1 to 50 μm, preferably 1 to 30 μm.

As the anisotropic conductive thermal adhesive layer 130A,
As the anisotropic conductive thermal adhesive, known ones may be used, such as furnace black, channel black, carbon particles such as acetylene black and carbon particles such as graphite, metal particles such as gold, silver, copper, nickel and aluminum, surface. A material obtained by mixing plastic particles obtained by plating gold with a metal into an insulating adhesive can be applied, and a screen printing method can be applied as a forming method thereof. In this case, if a conductive thermal adhesive is used instead of the anisotropic conductive thermal adhesive, the pair of antenna patterns 121 and 122 become conductive and lose the function as an antenna. By using the anisotropic conductive thermal adhesive, the child antenna pattern 121 and the parent antenna pattern 111 can be electrically connected to each other, and the child antenna pattern 122 and the parent antenna pattern 112 can be electrically connected to each other. The thus obtained sub-antenna pattern 121 of the transfer foil of the IC chip label 10L shown in FIGS. 6 and 7,
By aligning 122 with the parent antenna patterns 111 and 112 and stacking and pressing the heating die, only the IC chip label 10L portion is transferred and transferred, whereby an RFID tag can be obtained.

FIG. 8 shows a tack label of an IC chip label. Sub-antenna patterns 121, 122 are applied to the IC chip label base material 20 with a transparent or opaque conductive ink.
To form. As the conductive ink and the pattern forming method, those described above can be applied. The child antenna pattern 12
After electrically connecting the respective terminals of the IC chip 10 to each of the Nos. 1 and 122 with a conductive adhesive, they are temporarily attached to the release paper 220 with an adhesive. The outer shape of the IC chip label 10L is half-cut, and unnecessary base material is scraped off to obtain a tack label.

As the pressure-sensitive adhesive layer 130C, a known pressure-sensitive adhesive that adheres with pressure can be applied. The pressure-sensitive adhesive is not particularly limited, and examples thereof include acrylic acid, acrylic ester, vinyl acetate, acrylonitrile, hydrocarbon resin, alkylphenol resin, rosin, or an aqueous dispersion of a mixture thereof, and rosin triglyceride, hydrogenated. An organic solvent solution such as rosin is applied by a known coating method and dried. Also, an isobutylene-isoprene copolymer, an isobutylene-butadiene copolymer, an ethylene-styrene-containing block copolymer, etc. added with a tackifier such as an aliphatic olefin resin, rosin, or a terpene phenol resin is provided by a hot melt coating method. May be.

The adhesive layer 130C is covered with a re-separable release paper 220. The release paper 220 may be a known release paper and is adhered to a substantially flat base material such as high quality paper or polyethylene terephthalate. A release agent such as wax, cellulose acetate, or silicone is applied to the surface in contact with the agent layer.

From the tack label to the IC chip label 10
As a method of sticking L, one by one is peeled from the release paper 220, and the base material 210, the product itself, or a package thereof,
The IC chip label 1 is placed on the parent antenna patterns 111 and 112 printed on the packaging body with the transparent conductive ink.
The 0L child antenna patterns 121 and 122 may be crimped so that they overlap each other.

For the crimping, a mechanical work by a known labeler can be applied even by a manual work. In the machine, pull the release paper in the direction of 360 degrees so that the IC chip label 10
Labeler that peels off L and crimps it on the product, or I
A jet labeler or the like that allows the C chip label 10L to flow on the product can be used. Only in this way
It functions as an RFID tag and can communicate in response to the calling radio wave of the reader / writer.

Further, since the RFID tag 11 can rewrite the data, the data of the shipping inspection result,
If necessary, a test / inspection table or a product handling warning can be added. Post-delivery product management can also be performed by describing delivery information, product information, and information such as quantity. The product can be applied to all kinds of products such as daily necessities, office supplies, electric products, food products, construction civil engineering products and the like.

[0041]

Example 1 A polyethylene terephthalate film having a thickness of 50 μm (Lumirror T-60 type manufactured by Toray Industries, Inc.) was used as a base material of the RFID tag 11, and the following transparent conductive ink composition was dried. The gravure printing method is used to form a pair of parent antenna patterns 111 and 112 as shown in FIG.
Was aged for 1 day. As the transparent conductive ink composition, first, urethane-modified polyester (solid content 30
% By weight, solvent is methyl ethyl ketone / toluene (50 /
29% by weight of mixed solvent of 50) is used for the binder solution. Next, 35 wt% of antimony-doped tin oxide compound fine powder and methyl ethyl ketone / toluene = 1/1
35% by weight of the mixed solvent was mixed and stirred with a disperser, and then sand milled for dispersion. The dispersion was added to the binder solution, and 1% by weight of hexamethylene diisocyanate was added and stirred just before printing.

The surface resistance of this transparent conductive antenna pattern was measured with a surface resistance meter (LORESTA manufactured by Mitsubishi Chemical Co.).
When C200V was applied and the surface resistance was measured, it was 10
It was ⁴ Ω / □. The total light transmittance was 70% when measured with a color computer (manufactured by Suga Test Machine), and the haze was 10 or less when measured with the same color computer (manufactured by Suga Test Machine).

Separately, the transfer substrate 230 has a thickness of 25 μm.
Of polyethylene terephthalate film (manufactured by Toray Industries, Inc., Lumirror T-60 type) and using fine paper (110 g / m ² ) as the IC chip label base material 20.
It was temporarily attached so that it could be peeled off. 20 parts by weight of carbon black was dispersed on 20 faces of the IC chip label base material in 20 parts by weight of Byron 200 (manufactured by Toyobo Co., Ltd., polyester resin) and 60 parts by weight of a mixed solvent of methyl ethyl ketone / toluene (50/50). Figure 1 with ink
The child antenna patterns 121 and 122 shown in (B) are formed by a gravure printing method. The child patterns 121 and 122
After electrically connecting each terminal of the IC chip 10 to each of the IC chip 10 with a conductive adhesive, the IC chip label 1
Half-cut to an outer shape of 0L to remove unnecessary base material portions of the IC chip label base material 20.

Next, an anisotropic conductive thermal adhesive layer 130A is provided on the surface of the IC chip 10. As the anisotropic conductive thermal adhesive, a thermal adhesive containing gold-plated plastic particles on the surface is applied to the outer shape surface of the IC chip label 10L by a screen printing method so that the thickness after drying is 10 μm and dried. Then, a transfer foil was obtained.

The anisotropic conductive thermal adhesive layer 130A surface of the transfer foil and the pair of parent antenna patterns 111 and 112 of the base material on which the pair of parent antenna patterns 111 and 112 previously manufactured are formed. Align and stack so that they face each other. From the surface of the transfer foil, the IC chip label 10L made of silicon rubber, which has been heated to 150 ° C., is pressure-bonded with a mold having the outer shape to transfer the IC chip label 10L portion to obtain an RFID tag. It was

The RFID tag 11 thus obtained
Is opaque only in a small area of the IC chip label 10L, but two large parent antenna patterns 11
1, 112 were transparent. In addition, when approaching the ARCH reader / writer (product name, manufactured by Motorola), RF
There was no problem with the ID tag and reader / writer, and information could be exchanged wirelessly.

(Example 2) Anisotropically conductive thermal adhesive layer 130A
An RFID tag was obtained in the same manner as in Example 1 except that the non-conductive thermal adhesive layer 130B was used instead of. As the non-conductive thermal adhesive layer 130B, an ink prepared by dispersing 30 parts by weight of vinyl chloride vinyl acetate copolymer resin and 5 parts by weight of silica in 60 parts by weight of a mixed solvent of methyl ethyl ketone / toluene (50/50) is used. By a screen printing method, the transfer foil was applied to the outer shape surface of the IC chip label 10L so as to have a dried thickness of 10 μm and dried to obtain a transfer foil.

The RFID tag 11 thus obtained
Is opaque only in a small area of the IC chip label 10L, but two large parent antenna patterns 11
1, 112 were transparent. In addition, when it came close to the ARCH reader / writer (manufactured by Motorola, product name), R
The FID tag and the reader / writer were able to communicate wirelessly without any problems.

Example 3 First, as a base material of the RFID tag 11, a polyethylene terephthalate film having a thickness of 50 μm (Lumirror T-60 type, manufactured by Toray Industries, Inc.) was used, and transparent conductive ink was used as in Example 1. The composition is gravure-printed so that the thickness after drying is 3 μm, and 5
After aging at 0 ° C. for 1 day, a pair of parent antenna patterns 111 and 112 were formed as shown in FIG.

Then, using fine paper (110 g / m 2) as the IC chip label base material 20, the sub antenna patterns 121, 12 were made of carbon ink in the same manner as in Example 1.
Form 2. Each terminal of the IC chip 10 was electrically connected to each of the child antenna patterns 121 and 122 with a conductive adhesive. The thickness of the adhesive 130C composition liquid (comprising 35 parts by weight of an acrylic resin and 65 parts by weight of a mixed solvent of methyl ethyl ketone / toluene (50/50)) was dried to 20 μm on the surface of the IC chip 10. It was screen-printed and dried, and then laminated on a 100 μm-thick PET release paper 220 pre-coated with a silicone resin, and temporarily adhered so as to be removable. Half-cut to the outer shape of the IC chip label 10L, and unnecessary waste high-quality paper was scraped off to obtain a tack label.

From the tack label, the IC chip label 1
0 L is peeled off, and a pair of child antenna patterns 121, 12 is formed on the base material having the adhesive layer 130C surface and the pair of parent antenna patterns 111, 112 previously manufactured.
Align and stack so that 2 faces each other. Next, by pressure bonding, the IC chip label 10L portion was adhered, and the RFID tag 11 was obtained.

The RFID tag 11 thus obtained
Is opaque only in a small area of the IC chip label 10L, but two large parent antenna patterns 11
1, 112 were transparent. In addition, when it came close to the ARCH reader / writer (manufactured by Motorola, product name), R
The FID tag and the reader / writer were able to communicate wirelessly without any problems.

(Example 4) First, an antenna pattern transfer foil is prepared. Using a polyethylene terephthalate film having a thickness of 12 μm as the transfer base material 41, 10 parts by weight of cellulose acetate resin and 5 parts of polyethylene wax were applied to 85 parts by weight of a solvent (equivalent mixed solvent of methyl ethyl ketone and toluene) on one side. Dissolved or dispersed liquid,
Gravure reverse coating was performed to obtain a release layer 43 having a thickness of 1.0 μm after drying. The following transparent conductive ink composition was applied to the surface of the release layer 43 by gravure printing so that the thickness after drying was 3 μm.
A pair of parent antenna patterns 111 and 11 as shown in FIG.
2 was formed and aged at 50 ° C. for 1 day to form a transparent conductive layer 45. As the transparent conductive ink composition, first, 29% by weight of urethane-modified polyester (solid content: 30% by weight, solvent: mixed solvent of methyl ethyl ketone / toluene (50/50)) is used in a binder solution. next,
Tin-doped indium oxide compound (ITO) fine powder 3
5% by weight and 35% by weight of a mixed solvent of methyl ethyl ketone / toluene = 1/1 were blended, stirred using a disperser, and then subjected to sand mill treatment for dispersion. The dispersion was added to the binder solution, and 1% by weight of hexamethylene diisocyanate was added and stirred just before printing. A thermal adhesive layer 47 is provided on the surface of the transparent conductive layer 45. 25 parts by weight of vinyl chloride-vinyl acetate copolymer resin and silica 5
And 70 parts by weight of a solvent (equivalent mixed solvent of methyl ethyl ketone and toluene) are dissolved or dispersed in the solvent, and the coated film is dried by a reverse roll coating method so that the thickness after drying is 5 μm, and the antenna is dried. A pattern transfer foil was obtained.

Using the antenna pattern transfer foil, parent antenna patterns 111 and 112 are provided on a product package. Parent antenna patterns 111 and 1 as shown in FIG.
Create a 12-shaped mold 49, and heat the mold 49 at 150 ° C.
The parent antenna patterns 111 and 112 were formed by heating the antenna pattern transfer foil on the product package and pressurizing it from above to peel off the transfer base material.

Next, the IC chip label 10L is peeled off from the IC chip tack label used in Example 3, and the adhesive layer 130C surface and the pair of parent antenna patterns 111 and 112 which have been formed in advance are provided. To the package, Figure 4
As shown in (B), a pair of child antenna patterns 121, 1
Align and stack so that 22 faces each other. Next, by pressure bonding, the IC chip label 10L portion was adhered, and the RFID tag 11 was obtained.

RFID tag 11 thus obtained
Is opaque only in a small area of the IC chip label 10L, but two large parent antenna patterns 11
1, 112 were transparent. In addition, when it came close to the ARCH reader / writer (manufactured by Motorola, product name), R
The FID tag and the reader / writer were able to communicate wirelessly without any problems.

[0057]

EFFECTS OF THE INVENTION The conventional antenna pattern is only functional, and is rather disadvantageous in terms of design, and when it is attached to a product or its packaging, the area up to which the product name etc. should be displayed. There is a drawback of getting it. According to the RFID tag having the transparent antenna of the present invention, the antenna function can be sufficiently fulfilled, and the antenna part can display a product name for another purpose, a handling explanation, etc. Obtainable.

According to the embodiment of claim 2, the number of base materials forming the antenna pattern can be reduced. According to the third aspect of the invention, the shape of the antenna pattern that changes depending on the application can be easily formed. According to the embodiment of claim 4, a transparent and conductive antenna pattern is formed, and the parent antenna patterns 111 and 112 are provided in advance on the product itself, the packaging body, the packaging body, or the like, and the respective predetermined antenna patterns are provided. After processing and inspection, IC chip label 10
The L can be attached, and the finished product and the unfinished product can be identified.

Further, according to the inventions of claims 5 and 6, since the IC chip label 10L is in the transfer foil state, the child antenna pattern 1 of the IC chip label 10L is formed.
21 and 122 can be registered and thermally transferred to positions facing the parent antenna patterns 111 and 112. Further, according to the invention of claim 6, since the anisotropic conductive thermal adhesive is used, the anisotropic conductive thermal adhesive layer 130A may be applied to the entire surface. With a thermal adhesive having conductivity in all directions, the child antenna patterns 121 and 122 are electrically connected to each other and cannot function as an antenna.

[Brief description of drawings]

FIG. 1 is a schematic plan view of an RFID tag showing an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of an AA portion, a BB portion, and a CC portion of FIG.

FIG. 3 is a sectional view of a transfer foil forming an antenna of the RFID tag of the present invention.

FIG. 4 is a conceptual perspective view showing an embodiment of the present invention.

FIG. 5 is a conceptual perspective view showing a product to which the RFID tag of the related art or the present invention is attached.

FIG. 6 illustrates a method for manufacturing an RFID tag of the present invention I
It is sectional drawing of the transfer foil state of a C chip label.

FIG. 7 is a cross-sectional view of another IC chip label in a transfer foil state for explaining the RFID tag manufacturing method of the present invention.

FIG. 8 illustrates a method for manufacturing an RFID tag of the present invention I
It is sectional drawing of a tack label state of a C chip label.

[Explanation of symbols]

10 IC chip 11 RFID tag 12 IC board 13 Conducting member 14 antenna pattern 15, 16 Connection element 10L IC chip label 20 IC chip label base material 41 Transfer substrate 43 Release layer 45 Transparent conductive layer 47 Thermal adhesive layer 49 mold 111,112 Parent antenna pattern 121,122 small antenna pattern 130A anisotropic conductive thermal adhesive layer 130B Non-conductive thermal adhesive layer 130C adhesive layer 210 base material 220 release paper 230 Transfer substrate

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) // B65G 61/00 432 G06K 19/00 K 526 G01V 3/00 E G01S 13/75 G01S 13/80 13/76 13 / 79

Claims (6)

[Claims] 1. An electrostatic coupling type RFID tag having an IC chip and a pair of antenna patterns, wherein at least a part of the antenna patterns has a total light transmittance of 50% or more, and the antenna pattern surface resistance value is 10 ⁶
An RFID tag having a transparent antenna, which is Ω / □ or less. 2. The RFI having a transparent antenna according to claim 1, wherein the antenna pattern is formed on a product itself to be used or a package of the product.
D tag. 3. The antenna pattern is formed by thermally transferring an antenna pattern transfer foil having a transfer substrate, a release layer, a transparent conductive layer, and a thermal adhesive layer, which are sequentially provided. R having a transparent antenna according to any one of
FID tag. 4. The RFID tag having a transparent antenna according to claim 1, wherein the transparent conductive material contained in the antenna pattern is tin oxide doped with antimony. 5. A static antenna having an IC chip and a pair of antenna patterns, wherein at least a part of the antenna patterns has a total light transmittance of 50% or more and an antenna pattern surface resistance value of 10 ⁶ Ω / □ or less. In the method of manufacturing an RFID tag having an electrically coupled transparent antenna, (a) a pair of parent antenna patterns, at least a part of which is transparent, is provided on a base material in advance, (b) at least an IC chip,
An IC chip label having a pair of child antenna patterns connected to the IC chip is provided with an anisotropic conductive or non-conductive thermal adhesive layer on the child antenna pattern surface,
A chip transfer foil, wherein (c) the IC chip transfer foil is transferred such that the pair of child antenna patterns face a pair of transparent parent antenna patterns provided in advance on the base material. RF with transparent antenna
ID tag manufacturing method. 6. A static antenna having an IC chip and a pair of antenna patterns, wherein at least a part of the antenna pattern has a total light transmittance of 50% or more and a surface resistance value of the antenna pattern is 10 ⁶ Ω / □ or less. In the method of manufacturing an RFID tag having an electrically coupled transparent antenna, (a) a pair of parent antenna patterns, at least a part of which is transparent, is provided on a base material in advance, (b) at least an IC chip,
An IC chip label having a pair of child antenna patterns connected to the IC chip is provided with an adhesive layer on the child antenna pattern surface to provide an IC chip tack label that is detachably placed on a release paper, and (c) An RFID tag having a transparent antenna, characterized in that the pair of child antenna patterns of an IC chip tack label are attached so as to face a pair of transparent parent antenna patterns provided in advance on the base material. Manufacturing method.