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DE60027505D1 - Schleifmittelzusammensetzung - Google Patents

Schleifmittelzusammensetzung

Info

Publication number
DE60027505D1
DE60027505D1 DE60027505T DE60027505T DE60027505D1 DE 60027505 D1 DE60027505 D1 DE 60027505D1 DE 60027505 T DE60027505 T DE 60027505T DE 60027505 T DE60027505 T DE 60027505T DE 60027505 D1 DE60027505 D1 DE 60027505D1
Authority
DE
Germany
Prior art keywords
abrasive composition
abrasive
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60027505T
Other languages
English (en)
Other versions
DE60027505T2 (de
Inventor
Isao Ota
Tohru Nishimura
Yoshitane Watanabe
Yoshiyuki Kashima
Kiyomi Ema
Yutaka Ohmori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Application granted granted Critical
Publication of DE60027505D1 publication Critical patent/DE60027505D1/de
Publication of DE60027505T2 publication Critical patent/DE60027505T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
DE60027505T 1999-07-02 2000-07-03 Schleifmittelzusammensetzung Expired - Fee Related DE60027505T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18856299A JP4132432B2 (ja) 1999-07-02 1999-07-02 研磨用組成物
JP18856299 1999-07-02

Publications (2)

Publication Number Publication Date
DE60027505D1 true DE60027505D1 (de) 2006-06-01
DE60027505T2 DE60027505T2 (de) 2006-12-07

Family

ID=16225872

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60027505T Expired - Fee Related DE60027505T2 (de) 1999-07-02 2000-07-03 Schleifmittelzusammensetzung

Country Status (4)

Country Link
US (1) US6398827B1 (de)
EP (1) EP1065251B1 (de)
JP (1) JP4132432B2 (de)
DE (1) DE60027505T2 (de)

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US6475407B2 (en) * 1998-05-19 2002-11-05 Showa Denko K.K. Composition for polishing metal on semiconductor wafer and method of using same
WO2000015552A1 (fr) * 1998-09-10 2000-03-23 Nissan Chemical Industries, Ltd. Solution colloidale de silice moniliforme, procede de production associe et support d'enregistrement de jets d'encre
JP3338415B2 (ja) 1999-12-28 2002-10-28 山一電機株式会社 カードコネクタ
JP3429267B2 (ja) 2000-04-12 2003-07-22 山一電機株式会社 カードコネクタ
EP1287088B1 (de) 2000-05-12 2011-10-05 Nissan Chemical Industries, Ltd. Politurzusammensetzung
JP3471736B2 (ja) 2000-10-19 2003-12-02 山一電機株式会社 カードコネクタ
JP3436530B2 (ja) 2001-02-08 2003-08-11 山一電機株式会社 カードコネクタ
EP1234800A1 (de) * 2001-02-22 2002-08-28 Degussa Aktiengesellschaft Wässrige Dispersion, Verfahren zu ihrer Herstellung und Verwendung
JP3431608B2 (ja) 2001-03-06 2003-07-28 山一電機株式会社 カードコネクタ
JP3443103B2 (ja) * 2001-03-23 2003-09-02 山一電機株式会社 カードコネクタ
JP3443102B2 (ja) 2001-03-23 2003-09-02 山一電機株式会社 カードコネクタ
JP2002338232A (ja) * 2001-05-18 2002-11-27 Nippon Chem Ind Co Ltd 二次凝集コロイダルシリカとその製造方法及びそれを用いた研磨剤組成物
US6638326B2 (en) * 2001-09-25 2003-10-28 Ekc Technology, Inc. Compositions for chemical mechanical planarization of tantalum and tantalum nitride
US6685757B2 (en) * 2002-02-21 2004-02-03 Rodel Holdings, Inc. Polishing composition
US7010939B2 (en) 2002-06-05 2006-03-14 Hoya Corporation Glass substrate for data recording medium and manufacturing method thereof
JP4130614B2 (ja) * 2003-06-18 2008-08-06 株式会社東芝 半導体装置の製造方法
JP4608856B2 (ja) * 2003-07-24 2011-01-12 信越半導体株式会社 ウエーハの研磨方法
US7413550B2 (en) 2003-10-16 2008-08-19 Kimberly-Clark Worldwide, Inc. Visual indicating device for bad breath
US7837663B2 (en) * 2003-10-16 2010-11-23 Kimberly-Clark Worldwide, Inc. Odor controlling article including a visual indicating device for monitoring odor absorption
US7678367B2 (en) 2003-10-16 2010-03-16 Kimberly-Clark Worldwide, Inc. Method for reducing odor using metal-modified particles
US7488520B2 (en) 2003-10-16 2009-02-10 Kimberly-Clark Worldwide, Inc. High surface area material blends for odor reduction, articles utilizing such blends and methods of using same
US7438875B2 (en) * 2003-10-16 2008-10-21 Kimberly-Clark Worldwide, Inc. Method for reducing odor using metal-modified silica particles
US7794737B2 (en) 2003-10-16 2010-09-14 Kimberly-Clark Worldwide, Inc. Odor absorbing extrudates
US7754197B2 (en) 2003-10-16 2010-07-13 Kimberly-Clark Worldwide, Inc. Method for reducing odor using coordinated polydentate compounds
US7879350B2 (en) * 2003-10-16 2011-02-01 Kimberly-Clark Worldwide, Inc. Method for reducing odor using colloidal nanoparticles
JP2005138197A (ja) * 2003-11-04 2005-06-02 Fujimi Inc 研磨用組成物及び研磨方法
JP4311247B2 (ja) 2004-03-19 2009-08-12 日立電線株式会社 研磨用砥粒、研磨剤、研磨液の製造方法
JP4781693B2 (ja) * 2004-06-14 2011-09-28 花王株式会社 磁気ディスク基板のナノスクラッチの低減方法
JP2006080406A (ja) * 2004-09-13 2006-03-23 Catalysts & Chem Ind Co Ltd 研磨用組成物
JP4852302B2 (ja) * 2004-12-01 2012-01-11 信越半導体株式会社 研磨剤の製造方法及びそれにより製造された研磨剤並びにシリコンウエーハの製造方法
US20060196849A1 (en) * 2005-03-04 2006-09-07 Kevin Moeggenborg Composition and method for polishing a sapphire surface
JP5008350B2 (ja) 2006-07-05 2012-08-22 花王株式会社 ガラス基板用の研磨液組成物
JP5137521B2 (ja) * 2006-10-12 2013-02-06 日揮触媒化成株式会社 金平糖状シリカ系ゾルおよびその製造方法
JP2008117807A (ja) * 2006-10-31 2008-05-22 Fujimi Inc 研磨用組成物及び研磨方法
JP4907317B2 (ja) * 2006-11-30 2012-03-28 日揮触媒化成株式会社 金平糖状無機酸化物ゾル、その製造方法および前記ゾルを含む研磨剤
JP5602358B2 (ja) 2007-11-30 2014-10-08 日揮触媒化成株式会社 非球状シリカゾル、その製造方法および研磨用組成物
CN101747841A (zh) * 2008-12-05 2010-06-23 安集微电子（上海）有限公司 一种化学机械抛光液
US8628385B2 (en) * 2008-12-15 2014-01-14 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of use
US8853301B2 (en) * 2009-03-31 2014-10-07 3M Innovative Properties Company Aqueous coating composition comprising spherical silica particles and method of making and using the same
JP4941501B2 (ja) * 2009-04-20 2012-05-30 旭硝子株式会社 ガラス基板用研磨液及びその製造方法、並びに前記研磨液を用いたガラス基板の研磨方法及び前記研磨方法により得られたガラス基板
JP5377117B2 (ja) * 2009-07-01 2013-12-25 花王株式会社 粒子分散液中の非球状粒子を検出する方法
JP2013257917A (ja) * 2010-09-30 2013-12-26 Konica Minolta Advanced Layers Inc 情報記録媒体用ガラス基板、その製造方法、情報記録媒体、及びハードディスク装置
JP5564461B2 (ja) 2010-10-12 2014-07-30 株式会社フジミインコーポレーテッド 研磨用組成物
WO2013077368A1 (ja) * 2011-11-25 2013-05-30 株式会社 フジミインコーポレーテッド 研磨用組成物
TWI624535B (zh) * 2012-10-31 2018-05-21 Fujimi Inc Grinding composition
JP6436517B2 (ja) 2013-02-20 2018-12-12 株式会社フジミインコーポレーテッド 研磨用組成物
JP6156207B2 (ja) * 2013-04-02 2017-07-05 信越化学工業株式会社 合成石英ガラス基板の製造方法
JPWO2016052408A1 (ja) * 2014-09-30 2017-07-13 株式会社フジミインコーポレーテッド 研磨用組成物
WO2016084682A1 (ja) * 2014-11-27 2016-06-02 Jsr株式会社 化学機械研磨用水系分散体および化学機械研磨方法
EP3540761B1 (de) 2016-11-09 2022-01-05 Fujimi Incorporated Polierzusammensetzung und polierverfahren für siliciumwafer
JP6957232B2 (ja) * 2017-06-27 2021-11-02 花王株式会社 研磨液組成物
CN109280492A (zh) * 2017-07-21 2019-01-29 天津西美科技有限公司 一种磷化铟晶片抛光液
JP7490628B2 (ja) 2020-11-16 2024-05-27 日揮触媒化成株式会社 粒子連結型セリア系複合微粒子分散液、その製造方法および粒子連結型セリア系複合微粒子分散液を含む研磨用砥粒分散液
CN114085616A (zh) * 2021-09-27 2022-02-25 河北工业大学 基于二氧化硅纳米磨料的钽酸锂材料化学机械抛光液及其制备方法

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US2680721A (en) 1952-03-20 1954-06-08 Du Pont Process of increasing the size of unaggregated silica particles in an aqueous silicasuspension
US2900348A (en) 1954-02-02 1959-08-18 Grace W R & Co Preparation of silica sols
JPS60204390A (ja) 1984-03-29 1985-10-15 Mitsubishi Paper Mills Ltd インクジエツト記録用紙
JPS60219084A (ja) 1984-04-16 1985-11-01 Mitsubishi Paper Mills Ltd インクジエツト用記録媒体
JPS6119389A (ja) 1984-07-06 1986-01-28 Mitsubishi Paper Mills Ltd 記録用シ−ト
NO300125B1 (no) * 1988-03-16 1997-04-14 Nissan Chemical Ind Ltd Stabil væskeformig silikasol, samt fremgangsmåte ved fremstilling derav
JP2803134B2 (ja) 1988-03-16 1998-09-24 日産化学工業株式会社 細長い形状のシリカゾル及びその製造法
JPH072430B2 (ja) 1988-12-16 1995-01-18 旭硝子株式会社 記録用シート
US4959113C1 (en) * 1989-07-31 2001-03-13 Rodel Inc Method and composition for polishing metal surfaces
JP3120449B2 (ja) 1990-11-29 2000-12-25 東レ株式会社 印刷用記録媒体用シート
JP3198164B2 (ja) 1992-09-09 2001-08-13 三菱製紙株式会社 インクジェット記録用シート
JP3441142B2 (ja) * 1994-02-04 2003-08-25 日産化学工業株式会社 半導体ウェーハーの研磨方法
JPH07276789A (ja) 1994-04-05 1995-10-24 Fuji Photo Film Co Ltd 記録用シート
DE4413341C2 (de) 1994-04-18 1999-08-26 Continental Ag Meßeinrichtung mit einem Magnetfeldsensor zum berührungslosen Erfassen des lichten Abstandes zwischen zwei Bauteilen und deren Verwendung
SG68005A1 (en) 1996-12-02 1999-10-19 Fujimi Inc Polishing composition
JPH10204416A (ja) * 1997-01-21 1998-08-04 Fujimi Inkooporeetetsudo:Kk 研磨用組成物

Also Published As

Publication number Publication date
DE60027505T2 (de) 2006-12-07
EP1065251A1 (de) 2001-01-03
US6398827B1 (en) 2002-06-04
JP2001011433A (ja) 2001-01-16
EP1065251B1 (de) 2006-04-26
JP4132432B2 (ja) 2008-08-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee