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SN54HC00, SN74HC00
SCLS181F – DECEMBER 1982 – REVISED JULY 2016

SNx4HC00 Quadruple 2-Input Positive-NAND Gates

1 Features 3 Description
•
1 Wide Operating Voltage Range of 2 V to 6 V The SN54HC00 and SN74HC00 devices contain four
independent, 2-input NAND gates. They perform the
• Outputs Can Drive Up to 10 LSTTL Loads Boolean function Y = A × B or Y = A + B in positive
• Low Power Consumption: ICC 20-µA (Maximum) logic.
• Typical tpd: 8 ns
• ±4-mA Output Drive at 5 V Device Information(1)
PART NUMBER PACKAGE (PINS) BODY SIZE (NOM)
• Low Input Current: 1 µA (Maximum)
CDIP (14) 6.92 mm × 19.94 mm
• On Products Compliant to MIL-PRF-38535,
SN54HC00 CFP (14) 6.20 mm × 9.41 mm
All Parameters Are Tested Unless Otherwise
LCCC (20) 8.89 mm × 8.89 mm
Noted. On All Other Products, Production
Processing Does Not Necessarily Include Testing SN74HC00D SOIC (14) 8.65 mm × 3.91 mm
of All Parameters. SN74HC00DB SSOP (14) 6.20 mm × 5.30 mm
SN74HC00N PDIP (14) 19.30 mm × 6.35 mm
2 Applications SN74HC00NS SOP (14) 10.30 mm × 5.30 mm
• AV Receivers SN74HC00PW TSSOP (14) 5.00 mm × 4.40 mm

• Portable Audio Docks (1) For all available packages, see the orderable addendum at
the end of the data sheet.
• Blu-ray Players and Home Theater
• MP3 Players or Recorders
• Personal Digital Assistants (PDAs) Logic Diagram (Positive Logic)
• Power: Telecom or Server AC/DC Supply
(Single Controller: Analog and Digital) A
Y
• Solid State Drives (SSDs): Client and Enterprise B
• TVs: LCD, Digital, and High-Definition (HDTV) Copyright © 2016, Texas Instruments Incorporated
• Tablets: Enterprise
• Video Analytics: Server
• Wireless Headsets, Keyboards, and Mice

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54HC00, SN74HC00
SCLS181F – DECEMBER 1982 – REVISED JULY 2016 www.ti.com

Table of Contents
1 Features .................................................................. 1 8.4 Device Functional Modes.......................................... 8
2 Applications ........................................................... 1 9 Application and Implementation .......................... 9
3 Description ............................................................. 1 9.1 Application Information.............................................. 9
4 Revision History..................................................... 2 9.2 Typical Application .................................................... 9
5 Pin Configuration and Functions ......................... 3 10 Power Supply Recommendations ..................... 10
6 Specifications......................................................... 4 11 Layout................................................................... 10
6.1 Absolute Maximum Ratings ...................................... 4 11.1 Layout Guidelines ................................................ 10
6.2 ESD Ratings.............................................................. 4 11.2 Layout Example ................................................... 10
6.3 Recommended Operating Conditions....................... 4 12 Device and Documentation Support ................. 11
6.4 Thermal Information .................................................. 5 12.1 Documentation Support ........................................ 11
6.5 Electrical Characteristics........................................... 5 12.2 Related Links ........................................................ 11
6.6 Switching Characteristics .......................................... 6 12.3 Receiving Notification of Documentation Updates 11
6.7 Typical Characteristics .............................................. 6 12.4 Community Resources.......................................... 11
7 Parameter Measurement Information .................. 7 12.5 Trademarks ........................................................... 11
12.6 Electrostatic Discharge Caution ............................ 11
8 Detailed Description .............................................. 8
12.7 Glossary ................................................................ 11
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8 13 Mechanical, Packaging, and Orderable
8.3 Feature Description................................................... 8
Information ........................................................... 11

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (August 2003) to Revision F Page

• Added Applications section, Device Information table, ESD Ratings table, Typical Characteristics section, Feature
Description section, Device Functional Modes, Application and Implementation section, Power Supply
Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section ...................................................................................................................... 1
• Added Military Disclaimer to Features list .............................................................................................................................. 1
• Removed Ordering Information table; see POA at the end of data sheet.............................................................................. 1
• Changed values in the Thermal Information table to align with JEDEC standards................................................................ 5
• Deleted Operating Characteristics table; moved Cpd row to Electrical Characteristics......................................................... 5

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www.ti.com SCLS181F – DECEMBER 1982 – REVISED JULY 2016

5 Pin Configuration and Functions

D, DB, J, N, NS, PW, and W Package

14-Pin SOIC, SSOP, CDIP, PDIP, SOP, TSSOP, and CFP FK Package
Top View 20-Pin LCCC
Top View

VCC
NC
1B

1A

4B
1A 1 14 VCC

1B 2 13 4B

20

19
1Y 3 12 4A

1Y 4 18 4A
2A 4 11 4Y

NC 5 17 NC
2B 5 10 3B

2A 6 16 4Y
2Y 6 9 3A

NC 7 15 NC
GND 7 8 3Y

2B 8 14 3B

Not to scale

10

11

12

13
9
Not to scale

2Y

GND

NC

3Y

3A
Pin Functions
PIN
SOIC, SSOP, I/O DESCRIPTION
NAME CDIP, PDIP, SOP, LCCC
TSSOP, CFP
1A 1 2 I Gate 1 input
1B 2 3 I Gate 1 input
1Y 3 4 O Gate 1 output
2A 4 6 I Gate 2 input
2B 5 8 I Gate 2 input
2Y 6 9 O Gate 2 output
3A 9 13 I Gate 3 input
3B 10 14 I Gate 3 input
3Y 8 12 O Gate 3 output
4A 12 18 I Gate 4 input
4B 13 19 I Gate 4 input
4Y 11 16 O Gate 4 output
GND 7 10 — Ground pin
1, 5, 7,
NC — — No internal connection
11, 15,17
VCC 14 20 — Power pin

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SCLS181F – DECEMBER 1982 – REVISED JULY 2016 www.ti.com

6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage, VCC –0.5 7 V
(2)
Input clamp current, IIK (VI < 0 or VI > VCC) ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (2) ±20 mA
Continuous output current, IO (VO = 0 to VCC) ±25 mA
Continuous current through VCC or GND ±50 mA
Storage temperature, Tstg –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) (1)
MIN NOM MAX UNIT
VCC Supply voltage 2 5 6 V
VCC = 2 V 1.5
VIH High-level input voltage VCC = 4.5 V 3.15 V
VCC = 6 V 4.2
VCC = 2 V 0.5
VIL Low-level input voltage VCC = 4.5 V 1.35 V
VCC = 6 V 1.8
VI Input voltage 0 VCC V
VO Output voltage 0 VCC V
VCC = 2 V 1000
∆t/∆v Input transition rise and fall time VCC = 4.5 V 500 ns
VCC = 6 V 400
SN54HC00 –55 125
TA Operating free-air temperature °C
SN74HC00 –40 85

(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to Implications of Slow or Floating
CMOS Inputs application report.

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6.4 Thermal Information

SN74HC00
THERMAL METRIC (1) D (SOIC) DB (SSOP) N (PDIP) NS (SOP) PW (TSSOP) UNIT
14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
Junction-to-ambient thermal
RθJA 94.7 108.3 57.5 91 122.9 °C/W
resistance
Junction-to-case (top) thermal
RθJC(top) 54.6 60.3 45.1 48.8 51.5 °C/W
resistance
Junction-to-board thermal
RθJB 49 55.7 37.3 49.8 64.6 °C/W
resistance
Junction-to-top characterization
ψJT 21.1 25 30.3 18.4 6.6 °C/W
parameter
Junction-to-board
ψJB 48.7 55.2 37.2 49.5 64 °C/W
characterization parameter

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC = 2 V 1.9 1.998
IOH = –20 µA VCC = 4.5 V 4.4 4.499
VCC = 6 V 5.9 5.999
TA = 25°C 3.98 4.3
VOH VI = VIH or VIL IOH = –4 mA, VCC = 4.5 V SN54HC00 3.7 V
SN74HC00 3.84
TA = 25°C 5.48 5.8
IOH = –5.2 mA, VCC = 6 V SN54HC00 5.2
SN74HC00 5.34
VCC = 2 V 0.002 0.1
IOL = 20 µA VCC = 4.5 V 0.001 0.1
VCC = 6 V 0.001 0.1
TA = 25°C 0.17 0.26
VOL VI = VIH or VIL IOL = 4 mA, VCC = 4.5 V SN54HC00 0.4 V
SN74HC00 0.33
TA = 25°C 0.15 0.26
IOL = 5.2 mA, VCC = 6 V SN54HC00 0.4
SN74HC00 0.33
TA = 25°C ±0.1 ±100
II VI = VCC or 0, VCC = 6 V nA
SNx4HC00 ±1000
TA = 25°C 2
VI = VCC or 0, IO = 0,
ICC SN54HC00 40 µA
VCC = 6 V
SN74HC00 20
Ci VCC = 2 V to 6 V 3 10 pF
Power
dissipation
Cpd No load, TA = 25°C 20 pF
capacitance
per gate

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6.6 Switching Characteristics

over recommended operating free-air temperature range, CL= 50 pF, see Figure 2 (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA = 25°C 45 90
VCC = 2 V SN54HC00 135
SN74HC00 115
TA = 25°C 9 18
tpd From A or B (input) to Y (output) VCC = 4.5 V SN54HC00 27 ns
SN74HC00 23
TA = 25°C 8 15
VCC = 6 V SN54HC00 23
SN74HC00 20
TA = 25°C 38 75
VCC = 2 V SN54HC00 110
SN74HC00 95
TA = 25°C 8 15
tt To Y (output) VCC = 4.5 V SN54HC00 22 ns
SN74HC00 19
TA = 25°C 6 13
VCC = 6 V SN54HC00 19
SN74HC00 16

6.7 Typical Characteristics

50
45
40
35
30
tpd (ns)

25
20
15
10
5
CL=50pF
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VCC (V) C001

Figure 1. Propagation Delay vs VCC

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7 Parameter Measurement Information

From Output Test VCC
Under Test Point Input 50% 50%
0V
CL = 50 pF
(see Note A) tPLH tPHL

In-Phase VOH
90% 90%
Output 50% 50%
LOAD CIRCUIT 10% 10%
VOL
tr tf
tPHL tPLH
VCC
90% 90% VOH
Input 50% 50% Out-of-Phase 90% 90%
10% 10% 0 V 50% 50%
Output 10% 10%
VOL
tr tf tf tr

VOLTAGE WAVEFORM VOLTAGE WAVEFORMS

INPUT RISE AND FALL TIMES PROPAGATION DELAY AND OUTPUT TRANSITION TIMES

NOTES: A. CL includes probe and test-fixture capacitance.

B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by
generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.

Figure 2. Load Circuit and Voltage Waveforms

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SCLS181F – DECEMBER 1982 – REVISED JULY 2016 www.ti.com

8 Detailed Description

8.1 Overview
The SNx4HC00 devices perform the NAND Boolean function Y = A × B or Y = A + B in positive logic. The
devices have a wide operating range of VCC from 2 V to 6 V.

8.2 Functional Block Diagram

A
Y
B
Copyright © 2016, Texas Instruments Incorporated

8.3 Feature Description

The SNx4HC00 devices have a wide operating voltage range that operates from 2 V to 6 V. They allow inputs
and outputs up to VCC. The devices can drive outputs at 4 mA at 5-V VCC.

8.4 Device Functional Modes

Table 1 lists the functional modes for the SNx4HC00.

Table 1. Function Table

INPUTS OUTPUT
A B Y
H H L
L X H
X L H

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9 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

9.1 Application Information

The SNx4HC00 is a low-power, wide-operating-voltage NAND gate. This device can drive up to 10 LSTTL loads
and can drive 4-mA outputs at 5-V VCC.

9.2 Typical Application

S Q

Q
R
Copyright © 2016,
Texas Instruments Incorporated

Figure 3. Typical NAND Gate Application and Supply Voltage

9.2.1 Design Requirements

The SNx4HC00 devices use CMOS technology and have balanced output drive. Take care to avoid bus
contention because it drives currents that would exceed maximum limits. The high drive also creates fast edges
into light loads. Routing and load conditions must be considered to prevent ringing.

9.2.2 Detailed Design Procedure

• Recommended input conditions:
– Specified high and low levels. See VIH and VIL in Recommended Operating Conditions.
• Recommended output conditions:
– Load currents must not exceed 25 mA per output and 50 mA total for the part.
– Outputs must not be pulled above VCC.

9.2.3 Application Curve

40

35

30

25
tt (ns)

20

15

10

5
CL=50pF
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VCC (V) C002

Figure 4. Transition Time vs VCC

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10 Power Supply Recommendations

The power supply can be any voltage between the MIN and MAX supply voltage rating located in Recommended
Operating Conditions.
Each VCC pin must have a good bypass capacitor to prevent power disturbance. For devices with a single supply,
TI recommends a 0.1-µF bypass capacitor; if there are multiple VCC pins, then TI recommends 0.01-µF or
0.022-µF bypass capacitors for each power pin. It is acceptable to parallel multiple bypass capacitors to reject
different frequencies of noise. A 0.1 µF and a 1 µF are commonly used in parallel. The bypass capacitor must be
installed as close to the power pin as possible for best results.

11 Layout

11.1 Layout Guidelines

When using multiple bit logic devices inputs must never float.
In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two
inputs of a triple-input and gate are used or only 3 of the 4 buffer gates are used. Such input pins must not be left
unconnected because the undefined voltages at the outside connections result in undefined operational states.
Figure 5 specifies the rules that must be observed under all circumstances. All unused inputs of digital logic
devices must be connected to a high or low bias to prevent them from floating. The logic level that must be
applied to any particular unused input depends on the function of the device. Generally they are tied to GND or
VCC, whichever makes more sense or is more convenient. It is generally acceptable to float outputs, unless the
part is a transceiver.

11.2 Layout Example

Vcc
Input

Unused Input Output Output

Unused Input

Input

Figure 5. Layout Diagram

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12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation
For related documentation see the following:
Implications of Slow or Floating CMOS Inputs (SCBA004)

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.

Table 2. Related Links

TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY
DOCUMENTS SOFTWARE COMMUNITY
SN54HC00 Click here Click here Click here Click here Click here
SN74HC00 Click here Click here Click here Click here Click here

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

5962-8403701VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8403701VC
A
SNV54HC00J
5962-8403701VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8403701VD
A
SNV54HC00W
84037012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84037012A
SNJ54HC
00FK
8403701CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8403701CA
SNJ54HC00J
8403701DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 8403701DA
SNJ54HC00W
JM38510/65001B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
65001B2A
JM38510/65001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65001BCA
JM38510/65001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65001BDA
M38510/65001B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
65001B2A
M38510/65001BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65001BCA
M38510/65001BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
65001BDA
SN54HC00J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC00J

SN74HC00D ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00

& no Sb/Br)
SN74HC00DBR ACTIVE SSOP DB 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00DE4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00DG4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

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Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

SN74HC00DR ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00DRE4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00DRG4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00DT ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00DTE4 ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00DTG4 ACTIVE SOIC D 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00N ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU | CU SN N / A for Pkg Type -40 to 85 SN74HC00N
(RoHS)
SN74HC00N3 OBSOLETE PDIP N 14 TBD Call TI Call TI -40 to 85
SN74HC00NE4 ACTIVE PDIP N 14 25 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC00N
(RoHS)
SN74HC00NSLE OBSOLETE SO NS 14 TBD Call TI Call TI -40 to 85
SN74HC00NSR ACTIVE SO NS 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00PW ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 85
SN74HC00PWR ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00PWRE4 ACTIVE TSSOP PW 14 TBD Call TI Call TI -40 to 85

SN74HC00PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SN74HC00PWT ACTIVE TSSOP PW 14 250 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC00
& no Sb/Br)
SNJ54HC00FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84037012A
SNJ54HC
00FK

Addendum-Page 2
 PACKAGE OPTION ADDENDUM

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Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

SNJ54HC00J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8403701CA
SNJ54HC00J
SNJ54HC00W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 8403701DA
SNJ54HC00W

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3
 PACKAGE OPTION ADDENDUM

www.ti.com 15-Jul-2016

OTHER QUALIFIED VERSIONS OF SN54HC00, SN54HC00-SP, SN74HC00 :

• Catalog: SN74HC00, SN54HC00

• Automotive: SN74HC00-Q1, SN74HC00-Q1
• Military: SN54HC00
• Space: SN54HC00-SP

NOTE: Qualified Version Definitions:

• Catalog - TI's standard catalog product

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

Addendum-Page 4
 PACKAGE MATERIALS INFORMATION

www.ti.com 10-Mar-2016

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74HC00DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74HC00DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC00DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC00DR SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1
SN74HC00DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC00DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC00PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC00PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC00PWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC00PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 10-Mar-2016

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC00DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74HC00DR SOIC D 14 2500 367.0 367.0 38.0
SN74HC00DR SOIC D 14 2500 333.2 345.9 28.6
SN74HC00DR SOIC D 14 2500 364.0 364.0 27.0
SN74HC00DRG4 SOIC D 14 2500 333.2 345.9 28.6
SN74HC00DT SOIC D 14 250 367.0 367.0 38.0
SN74HC00PWR TSSOP PW 14 2000 364.0 364.0 27.0
SN74HC00PWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74HC00PWRG4 TSSOP PW 14 2000 367.0 367.0 35.0
SN74HC00PWT TSSOP PW 14 250 367.0 367.0 35.0

Pack Materials-Page 2
 MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38
0,65 0,15 M
0,22
28 15

0,25
0,09
5,60 8,20
5,00 7,40

Gage Plane

1 14 0,25

A 0°–ā8° 0,95
0,55

Seating Plane

2,00 MAX 0,05 MIN 0,10

PINS **
14 16 20 24 28 30 38
DIM

A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90

A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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