KR900007100A - 반도체장치 - Google Patents
반도체장치Info
- Publication number
- KR900007100A KR900007100A KR1019890015486A KR890015486A KR900007100A KR 900007100 A KR900007100 A KR 900007100A KR 1019890015486 A KR1019890015486 A KR 1019890015486A KR 890015486 A KR890015486 A KR 890015486A KR 900007100 A KR900007100 A KR 900007100A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/711—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using bipolar transistors as protective elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/87—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of PN-junction gate FETs
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63272586A JPH02119262A (ja) | 1988-10-28 | 1988-10-28 | 半導体装置 |
JP63-272586 | 1988-10-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900007100A true KR900007100A (ko) | 1990-05-09 |
KR920010845B1 KR920010845B1 (ko) | 1992-12-19 |
Family
ID=17515984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890015486A KR920010845B1 (ko) | 1988-10-28 | 1989-10-26 | 반도체장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4994874A (ko) |
JP (1) | JPH02119262A (ko) |
KR (1) | KR920010845B1 (ko) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2644342B2 (ja) * | 1989-09-01 | 1997-08-25 | 東芝マイクロエレクトロニクス株式会社 | 入力保護回路を備えた半導体装置 |
DE3930697A1 (de) * | 1989-09-14 | 1991-03-28 | Bosch Gmbh Robert | Steuerbare temperaturkompensierte spannungsbegrenzungseinrichtung |
KR960002094B1 (ko) * | 1990-11-30 | 1996-02-10 | 가부시키가이샤 도시바 | 입력보호회로를 갖춘 반도체장치 |
JP3033793B2 (ja) * | 1990-11-30 | 2000-04-17 | 株式会社東芝 | 半導体装置 |
US5304839A (en) * | 1990-12-04 | 1994-04-19 | At&T Bell Laboratories | Bipolar ESD protection for integrated circuits |
US5514893A (en) * | 1992-01-05 | 1996-05-07 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device for protecting an internal circuit from electrostatic damage |
US5293057A (en) * | 1992-08-14 | 1994-03-08 | Micron Technology, Inc. | Electrostatic discharge protection circuit for semiconductor device |
WO1994005042A1 (en) * | 1992-08-14 | 1994-03-03 | International Business Machines Corporation | Mos device having protection against electrostatic discharge |
US5268588A (en) * | 1992-09-30 | 1993-12-07 | Texas Instruments Incorporated | Semiconductor structure for electrostatic discharge protection |
US5365103A (en) * | 1993-02-25 | 1994-11-15 | Hewlett-Packard Company | Punchthru ESD device along centerline of power pad |
JPH07283405A (ja) * | 1994-04-13 | 1995-10-27 | Toshiba Corp | 半導体装置の保護回路 |
US5528064A (en) * | 1994-08-17 | 1996-06-18 | Texas Instruments Inc. | Structure for protecting integrated circuits from electro-static discharge |
KR100372905B1 (ko) * | 1994-09-13 | 2003-05-01 | 애질런트 테크놀로지스, 인크. | 산화물영역보호장치 |
JP3332123B2 (ja) * | 1994-11-10 | 2002-10-07 | 株式会社東芝 | 入力保護回路及びこれを用いた半導体装置 |
JP2822915B2 (ja) * | 1995-04-03 | 1998-11-11 | 日本電気株式会社 | 半導体装置 |
JP2643904B2 (ja) * | 1995-04-20 | 1997-08-25 | 日本電気株式会社 | 静電保護素子 |
US5682047A (en) * | 1995-06-07 | 1997-10-28 | Lsi Logic Corporation | Input-output (I/O) structure with capacitively triggered thyristor for electrostatic discharge (ESD) protection |
US5637887A (en) * | 1995-06-07 | 1997-06-10 | Lsi Logic Corporation | Silicon controller rectifier (SCR) with capacitive trigger |
US5745323A (en) * | 1995-06-30 | 1998-04-28 | Analog Devices, Inc. | Electrostatic discharge protection circuit for protecting CMOS transistors on integrated circuit processes |
EP0758129B1 (en) * | 1995-08-02 | 2001-05-23 | STMicroelectronics S.r.l. | Flash EEPROM with integrated device for limiting the erase source voltage |
WO1997010615A1 (en) * | 1995-09-11 | 1997-03-20 | Analog Devices, Inc. (Adi) | Electrostatic discharge protection network and method |
KR100214566B1 (ko) * | 1997-04-22 | 1999-08-02 | 구본준 | 입력 보호회로 |
US5936284A (en) * | 1997-11-03 | 1999-08-10 | Sgs-Thomson Microelectronics S.R.L. | Electrostatic discharge protection circuit and transistor |
JPH11204729A (ja) * | 1998-01-12 | 1999-07-30 | Mitsubishi Electric Corp | 半導体装置 |
GB2336241B (en) * | 1998-01-15 | 2000-06-14 | United Microelectronics Corp | Substrate-triggering electrostatic dicharge protection circuit for deep-submicron integrated circuits |
KR100493006B1 (ko) * | 1998-06-16 | 2005-08-04 | 삼성전자주식회사 | 정전기보호역할을겸하는블락가드링구조 |
US6411480B1 (en) | 1999-03-01 | 2002-06-25 | International Business Machines Corporation | Substrate pumped ESD network with trench structure |
US6304423B1 (en) * | 1999-06-08 | 2001-10-16 | Delphi Technologies, Inc. | Input protection circuit for a semiconductor device |
JP2003031669A (ja) * | 2001-07-13 | 2003-01-31 | Ricoh Co Ltd | 半導体装置 |
JP2004235199A (ja) * | 2003-01-28 | 2004-08-19 | Renesas Technology Corp | 半導体装置 |
US7541648B2 (en) * | 2005-01-21 | 2009-06-02 | Micron Technology, Inc. | Electrostatic discharge (ESD) protection circuit |
CN105912069B (zh) * | 2016-06-27 | 2018-05-01 | 无锡中感微电子股份有限公司 | 一种双极型晶体管和电流偏置电路 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS548474A (en) * | 1977-06-22 | 1979-01-22 | Hitachi Ltd | Gate protection unit |
JPS58182861A (ja) * | 1982-04-21 | 1983-10-25 | Hitachi Ltd | 半導体装置 |
JPS6132464A (ja) * | 1984-07-24 | 1986-02-15 | Nec Corp | Cmos型集積回路装置 |
JPH0656850B2 (ja) * | 1984-08-30 | 1994-07-27 | 富士通株式会社 | 半導体装置 |
JPS6173375A (ja) * | 1984-09-19 | 1986-04-15 | Hitachi Ltd | 半導体集積回路装置 |
JPS62115764A (ja) * | 1985-11-15 | 1987-05-27 | Hitachi Vlsi Eng Corp | 半導体集積回路装置 |
IT1186227B (it) * | 1985-12-03 | 1987-11-18 | Sgs Microelettronica Spa | Dispositivo di protezione contro le sovratensioni in ingresso per un circuito integrato di tipo mos |
JPH0821632B2 (ja) * | 1987-01-10 | 1996-03-04 | 三菱電機株式会社 | 半導体集積回路 |
JPS63233560A (ja) * | 1987-03-23 | 1988-09-29 | Toshiba Corp | 入力保護回路を備えた半導体集積回路 |
JPS63276265A (ja) * | 1987-05-08 | 1988-11-14 | Nec Corp | 半導体集積回路の入出力保護回路 |
US4819047A (en) * | 1987-05-15 | 1989-04-04 | Advanced Micro Devices, Inc. | Protection system for CMOS integrated circuits |
US4789917A (en) * | 1987-08-31 | 1988-12-06 | National Semiconductor Corp. | MOS I/O protection using switched body circuit design |
-
1988
- 1988-10-28 JP JP63272586A patent/JPH02119262A/ja active Pending
-
1989
- 1989-10-24 US US07/425,950 patent/US4994874A/en not_active Expired - Lifetime
- 1989-10-26 KR KR1019890015486A patent/KR920010845B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR920010845B1 (ko) | 1992-12-19 |
US4994874A (en) | 1991-02-19 |
JPH02119262A (ja) | 1990-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR900011017A (ko) | 반도체장치 | |
DE68926256D1 (de) | Komplementäre Halbleiteranordnung | |
KR900007100A (ko) | 반도체장치 | |
DE68925374D1 (de) | Halbleiterherstellungsvorrichtung | |
DE68926811D1 (de) | Halbleiterspeicheranordnung | |
DE68927295D1 (de) | Kunstharzversiegeltes halbleiterbauelement | |
DE68929504D1 (de) | Halbleiteranordnung | |
DE68917848D1 (de) | Halbleiteranordnung. | |
DE68921421D1 (de) | Halbleitervorrichtung. | |
KR900008703A (ko) | 반도체 장치 | |
DE68926124D1 (de) | Halbleiterspeicheranordnung | |
DE68928312D1 (de) | Leistungshalbleitervorrichtung | |
KR900001037A (ko) | 반도체 장치 | |
DE68928176D1 (de) | Leistungshalbleitervorrichtung | |
DE69033794D1 (de) | Halbleiteranordnung | |
DE68917971D1 (de) | Halbleitervorrichtung. | |
KR880701017A (ko) | 반도체 장치 | |
DE69031609D1 (de) | Halbleiteranordnung | |
DE68928760D1 (de) | Halbleitervorrichtung | |
KR900702572A (ko) | 반도체 장치 | |
KR900008675A (ko) | 반도체기억장치 | |
KR890015422A (ko) | 반도체 장치 | |
DE69029226D1 (de) | Halbleiteranordnung | |
KR890005864A (ko) | 반도체 장치 | |
KR900008615A (ko) | 반도체장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19891027 |
|
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19891027 Comment text: Request for Examination of Application |
|
PG1501 | Laying open of application | ||
G160 | Decision to publish patent application | ||
PG1605 | Publication of application before grant of patent |
Comment text: Decision on Publication of Application Patent event code: PG16051S01I Patent event date: 19921121 |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19930315 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19930603 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 19930603 End annual number: 3 Start annual number: 1 |
|
PR1001 | Payment of annual fee |
Payment date: 19951215 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 19961213 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 19970829 Start annual number: 6 End annual number: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 19971230 Start annual number: 7 End annual number: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 19991129 Start annual number: 8 End annual number: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20001129 Start annual number: 9 End annual number: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20011130 Start annual number: 10 End annual number: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20021128 Start annual number: 11 End annual number: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20031128 Start annual number: 12 End annual number: 12 |
|
PR1001 | Payment of annual fee |
Payment date: 20041201 Start annual number: 13 End annual number: 13 |
|
PR1001 | Payment of annual fee |
Payment date: 20051130 Start annual number: 14 End annual number: 14 |
|
PR1001 | Payment of annual fee |
Payment date: 20061201 Start annual number: 15 End annual number: 15 |
|
PR1001 | Payment of annual fee |
Payment date: 20071127 Start annual number: 16 End annual number: 16 |
|
FPAY | Annual fee payment |
Payment date: 20081120 Year of fee payment: 17 |
|
PR1001 | Payment of annual fee |
Payment date: 20081120 Start annual number: 17 End annual number: 17 |
|
EXPY | Expiration of term | ||
PC1801 | Expiration of term |