JP5575097B2 - シリコン又はシリコン系材料を含む構造化された粒子の製造方法 - Google Patents
シリコン又はシリコン系材料を含む構造化された粒子の製造方法 Download PDFInfo
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- H—ELECTRICITY
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- H01M4/00—Electrodes
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- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30608—Anisotropic liquid etching
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- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
- H01M4/049—Manufacturing of an active layer by chemical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/134—Electrodes based on metals, Si or alloys
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- H—ELECTRICITY
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- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/139—Processes of manufacture
- H01M4/1395—Processes of manufacture of electrodes based on metals, Si or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
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Description
例えば粒状又はバルク材料のシリコンを、HF、Ag+イオン及び硝酸イオンを含むエッチング溶液で処理し、それによりシリコンをエッチングして表面にエッチングされたピラーを含むシリコンとし、前記シリコンは銀の表面堆積を含み、
前記エッチングされたシリコンを使用済みエッチング溶液から分離し、
前記エッチングされたシリコンを、硝酸を用いて前記エッチングされたシリコンから銀を溶解してAg+イオンと硝酸イオンを含む溶液を形成し、Ag+イオンと硝酸イオンを含む前記溶液とさらにHFを混合してさらにエッチング溶液を形成し及び
前記さらなるエッチング溶液をさらにシリコンを処理するために使用することを含む。
4Ag+ + 4e― −>4Ag(金属)
核化は通常、約1分までに起こる。
Si + 6F− −>SiF6 2− + 4e― 半反応(1)
半反応(1)で生じた電子は、シリコンを通じて堆積した銀に伝達され、溶液中の銀イオンが元素状銀に還元される対向反応が起こる。
4Ag+ 4e― −>4Ag(金属) 半反応(2)
堆積された元素状銀は、最初に堆積した銀の島から伸張して樹状突起を形成する。この樹状突起は、同じ粒子及び他の粒子の樹状突起とお互いに固定し合ってマットを形成する。樹状突起のお互いの固定化は電気プロセスの速度を増加させる。というのは、還元半反応(2)が起こり得る、より多くのサイトが生じ電荷が非局在化するからである。このプロセスでガスが発生するかもしれないが、これは前記マットを溶液に浮かせる原因となる。
本発明のひとつの実施態様によれば、水は別として他の成分は含まなくてよい。かかるプロセスの開始の際の溶液は:
5から10M(例えば6から8M)のHF、
01から0.1MのAg+イオン、
02から0.2MのNO3 −イオン、
水、水素イオン及びヒドロキシルイオン、及び
偶然添加された成分及び不純物を含む。
反応は、8リットル容積のポリエチレン容器で行った。成分添加用及び攪拌のための孔を設けた蓋を配置した。
次の反応材料を用いた。
(第1サイクル)
それぞれ、2.56M及び3.65MのAgNO3/HNO3を含むAgNO3/HNO3溶液35mlを、3リットルの7MのHF溶液と共に反応容器に入れて混合し、その後30mlの水に溶解した5.1gのNaOH(又は4.5gのNH4OH)を添加した。反応混合物は0.0299MのAgNO3を含む。AgNO3/HNO3溶液は、以前のエッチングプロセス(以下参照)からのリサイクルされたものでもよいが、それがない場合、市販品として入手可能な硝酸銀及び硝酸から調製してもよい。
(第2サイクル)
第1サイクルから使用されたエッチング溶液を、35mlのAgNO3/HNO3溶液及び150mlの40%HFを添加しさらに30mlの水に溶解した5.1gのNaOH(又は4.5gのNH4OH)を添加することで、完全に活性を元に戻して再使用した。
(第3及びそれ以上のサイクル)
第2サイクルと同様。
(変法)
それぞれのサイクル後にAgNO3/HNO3溶液を回収し、次のサイクルに使用する代わりに、HNO3処理生成物(エッチングされたシリコン及びAgNO3/HNO3溶液)のバッチをまとめて一緒にされ、さらなるシリコン粒子のエッチングに共に使用することができる。
(コントロール)
#1及び#2の混合物中の銀及びHNO3の濃度は、それぞれ分析されてもよい。銀イオン濃度は、Fe(NO3)3を指示薬としてNH4SCNで滴定して求められる。HNO3濃度は、メチルレッドを指示薬としてNaOHに対して滴定することで求められる。最後にリサイクルされるAgNO3/HNO3溶液の成分は上で説明したように調節されることができる。必要ならば、リサイクルされるAgNO3/HNO3溶液中のAgNO3及びHNO3の濃度を一定にするために固定のAgNO3及び/又は濃硝酸を、毎回添加することで調節されることができる。
40mlのAgNO3/HNO3溶液を、3リットルの7MのHF溶液と、反応容器に入れて混合した。その後30mlの水に溶解した5.9gのNaOH(又は5.2gのMH4OH)を加えた。最終溶液は0.0033MのAgNO3を含む。
(第2サイクル)
第1サイクルから使用されたエッチング溶液を、35mlのAgNO3/HNO3溶液及び150mlの40%HFを添加しさらに30mlの水に溶解した5.1gのNaOH(又は4.5gのNH4OH)を添加することで、完全に活性を元に戻して再使用した。
(第3及びそれ以上のサイクル)
第2サイクルと同様。
Claims (10)
- シリコンをエッチングして、表面にエッチングされた構造を持つシリコンを形成するプロセスであって、
当該プロセスは、
(i)HF、Ag+ イオン及び硝酸イオンを含む第1の溶液でシリコン上に銀を堆積させるステップと、
(ii)前記銀が堆積されたシリコンをエッチングして、銀の表面堆積物を有するエッチングされたシリコンを得るステップと、
(iii)使用されたエッチング溶液から、前記エッチングされ、銀が堆積されたシリコンを分離するステップと、
(iv)硝酸による処理により、前記銀の表面堆積物を除去し、Ag+イオン及び硝酸イオンを含む溶液を形成するステップと、
(v)前記Ag+イオン及び硝酸イオンを含む溶液を、別のHFと混合し、別の溶液を形成するステップと、
(vi)前記別の溶液を使用して、さらにシリコンを処理するステップと、
を有するプロセス。 - 前記第1の溶液がさらに;
SiF6 2−イオン、
アルカリ金属及びアンモニウムイオンからなる群から選択される少なくとも1つの化合物、及び
不可避的添加物又は不純物、を含むことを特徴とする請求項1に記載のプロセス。 - 前記シリコンが、顆粒状又は塊状材料であることを特徴とする請求項1または2に記載のプロセス。
- 前記エッチングされたシリコンが、その表面にエッチングされたピラーを含むことを特徴とする請求項1乃至3のいずれか一つに記載のプロセス。
- 前記別のHFは、前記使用された第1の溶液および追加のHFを含む、請求項1乃至4のいずれか一つに記載のプロセス。
- 前記使用された第1の溶液から分離された前記エッチングされたシリコンは、前記エッチングされたシリコンから前記銀を溶解する前に、洗浄される、請求項1乃至5のいずれか一つに記載のプロセス。
- 前記第1の溶液は、
5から10MのHF、
0.01から0.1MのAg+イオン、及び
0.02から0.2MのNO3 −イオンを含む、請求項1乃至6のいずれか一つに記載のプロセス。 - 前記シリコンは、粒状シリコンであり、粒子サイズが5から500μmの範囲である、請求項3に記載のプロセス。
- 0℃から70℃で実施される、請求項1乃至8のいずれか一つに記載のプロセス。
- 1又は数ステップで、前記第1の溶液を用いて処理しエッチングされたシリコンを形成するステップの際に、前記第1の溶液に、別のNO3 −イオンが添加され、該別のNO 3 − イオンは、アルカリ金属硝酸塩又はアンモニウム硝酸塩の形で添加される、請求項1乃至9のいずれか一つに記載のプロセス。
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GB0818644.7 | 2008-10-10 | ||
GB0818644A GB2464157B (en) | 2008-10-10 | 2008-10-10 | A method of fabricating structured particles composed of silicon or a silicon-based material |
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JP (2) | JP5000787B2 (ja) |
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CN102239584B (zh) | 2014-12-10 |
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CN102239584A (zh) | 2011-11-09 |
JP2012114091A (ja) | 2012-06-14 |
TWI462379B (zh) | 2014-11-21 |
KR20110079717A (ko) | 2011-07-07 |
KR101158891B1 (ko) | 2012-06-25 |
GB2464157B (en) | 2010-09-01 |
EP2342774A1 (en) | 2011-07-13 |
JP5000787B2 (ja) | 2012-08-15 |
WO2010040986A1 (en) | 2010-04-15 |
JP2012505506A (ja) | 2012-03-01 |
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