JP2015524145A - 貫通孔が形成された導電性粒子を有する検査用ソケット及びその製造方法 - Google Patents
貫通孔が形成された導電性粒子を有する検査用ソケット及びその製造方法 Download PDFInfo
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- G—PHYSICS
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
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- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
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- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
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- G—PHYSICS
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- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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Abstract
Description
前記検査用ソケットで、前記導電性粒子は、「C」字形を有することができる。
まず、検査装置に検査用ソケットを載置させた後、被検使用デバイスを、前記検査用ソケットに載置させる。このとき、前記検査用ソケットの導電部は、被検使用デバイスの端子によって押されることにより、電気的に導通可能な状態に置かれる。このとき、検査装置から所定の電気的な信号を印加することにより、前記電気的な信号は、導電部を介して、被検査デバイスの端子に伝達され、それにより、所定の検査が行われる。
Claims (9)
- 被検査デバイスと検査装置との間に配置され、被検査デバイスの端子と検査装置のパッドとを互いに電気的に連結させる検査用ソケットにおいて、
前記被検査デバイスの端子と対応する位置ごとに配置され、厚み方向への導電性を示す導電部であって、前記導電部は、弾性絶縁物質内に、多数の導電性粒子が厚み方向に配列されて配置される導電部と、
前記それぞれの導電部を支持しながら絶縁させる絶縁性支持部と、を含んで構成されるが、
前記導電性粒子は、
ある一面と、前記一面以外の他の面とを貫通する貫通孔が設けられており、前記弾性絶縁物質は、前記貫通孔を満たしていることを特徴とする貫通孔が形成された導電性粒子を有する検査用ソケット。 - 前記導電性粒子は、
前記貫通孔が中央に設けられる円板形状によって構成されたことを特徴とする請求項1に記載の貫通孔が形成された導電性粒子を有する検査用ソケット。 - 前記貫通孔は、円形断面、星状断面または多角形断面のうちいずれか1つの断面形状を有することを特徴とする請求項2に記載の貫通孔が形成された導電性粒子を有する検査用ソケット。
- 前記貫通孔は、少なくとも2以上設けられたことを特徴とする請求項1に記載の貫通孔が形成された導電性粒子を有する検査用ソケット。
- 前記導電性粒子は、「C」字形を有することを特徴とする請求項1に記載の貫通孔が形成された導電性粒子を有する検査用ソケット。
- 前記導電性粒子は、
一側部、他側部、及び前記一側部と他側部とを連結する連結部を含んで構成されるが、前記一側部及び他側部の縁は、前記連結部から突出しており、前記貫通孔は、前記一側部の中央と、前記他側部の中央とを連通することを特徴とする請求項1に記載の貫通孔が形成された導電性粒子を有する検査用ソケット。 - 前記導電性粒子は、
中央に貫通孔が形成される円板状になるが、縁周囲には、鋭角をなす角張ったエッジが形成されていることを特徴とする請求項1に記載の貫通孔が形成された導電性粒子を有する検査用ソケット。 - 請求項1に記載の検査用ソケットの製造方法であって、
(a)基板を準備する段階と、
(b)前記基板上に成形層を形成する段階と、
(c)前記成形層のうち少なくとも一部を除去し、前記導電性粒子と対応する形状を有する空間を成形層内に設ける段階と、
(d)前記空間内にメッキ層を形成し、導電性粒子を設ける段階と、を含むことを特徴とする貫通孔が形成された導電性粒子を有する検査用ソケットの製造方法。 - 前記(c)段階で、前記空間は、フォトリソグラフィ工程またはインプリンティングによって形成されることを特徴とする請求項8に記載の貫通孔が形成された導電性粒子を有する検査用ソケット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR10-2012-0065229 | 2012-06-18 | ||
KR1020120065229A KR101339166B1 (ko) | 2012-06-18 | 2012-06-18 | 관통공이 형성된 도전성 입자를 가지는 검사용 소켓 및 그 제조방법 |
PCT/KR2013/005344 WO2013191432A1 (ko) | 2012-06-18 | 2013-06-18 | 관통공이 형성된 도전성 입자를 가지는 검사용 소켓 및 그 제조방법 |
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JP2017001124A Division JP2017103238A (ja) | 2012-06-18 | 2017-01-06 | 貫通孔が形成された導電性粒子を有する検査用ソケット及びその製造方法 |
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JP2015524145A true JP2015524145A (ja) | 2015-08-20 |
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JP2017001124A Pending JP2017103238A (ja) | 2012-06-18 | 2017-01-06 | 貫通孔が形成された導電性粒子を有する検査用ソケット及びその製造方法 |
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US (1) | US9759742B2 (ja) |
JP (2) | JP6333240B2 (ja) |
KR (1) | KR101339166B1 (ja) |
CN (1) | CN104412112B (ja) |
TW (1) | TWI504902B (ja) |
WO (1) | WO2013191432A1 (ja) |
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KR101506131B1 (ko) * | 2014-04-11 | 2015-03-26 | 주식회사 아이에스시 | 검사용 시트의 제조방법 및 검사용 시트 |
KR20160046621A (ko) * | 2014-10-21 | 2016-04-29 | 삼성전자주식회사 | 반도체 칩 패키지 테스트용 테스트 소켓 및 이의 제조 방법 |
CN105588957B (zh) * | 2014-11-12 | 2019-03-22 | 致伸科技股份有限公司 | 测试座 |
KR101525520B1 (ko) * | 2015-02-03 | 2015-06-03 | (주)티에스이 | 결합 형상의 도전성 입자를 가지는 검사용 소켓 |
KR101976701B1 (ko) * | 2015-05-15 | 2019-05-09 | 주식회사 아이에스시 | 이방 도전성 시트 |
KR101748184B1 (ko) | 2016-02-02 | 2017-06-19 | (주)티에스이 | 검사용 소켓 및 검사용 소켓의 도전성 입자 제조방법 |
KR101769882B1 (ko) | 2016-02-15 | 2017-09-05 | (주)티에스이 | 검사용 소켓 |
KR101977270B1 (ko) | 2016-02-24 | 2019-05-10 | 주식회사 아모텍 | 가이드 결합형 컨택터 및 이를 구비한 휴대용 전자장치 |
WO2017146517A1 (ko) * | 2016-02-26 | 2017-08-31 | 주식회사 아모텍 | 기능성 컨택터 및 이를 구비한 휴대용 전자장치 |
KR101887369B1 (ko) * | 2016-02-26 | 2018-09-06 | 주식회사 아모텍 | 기능성 컨택터 및 이를 구비한 휴대용 전자장치 |
KR101830935B1 (ko) | 2016-03-18 | 2018-02-22 | 주식회사 오킨스전자 | 와이어 본딩과 가압 성형을 이용한 테스트 소켓의 도전성 파티클 제조 방법 및 장치 |
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KR101739537B1 (ko) * | 2016-05-11 | 2017-05-25 | 주식회사 아이에스시 | 검사용 소켓 및 도전성 입자 |
TWI615615B (zh) * | 2016-07-13 | 2018-02-21 | 中華精測科技股份有限公司 | 探針結構 |
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Also Published As
Publication number | Publication date |
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CN104412112A (zh) | 2015-03-11 |
TW201403073A (zh) | 2014-01-16 |
WO2013191432A1 (ko) | 2013-12-27 |
US9759742B2 (en) | 2017-09-12 |
JP2017103238A (ja) | 2017-06-08 |
KR101339166B1 (ko) | 2013-12-09 |
JP6333240B2 (ja) | 2018-05-30 |
US20150153387A1 (en) | 2015-06-04 |
TWI504902B (zh) | 2015-10-21 |
CN104412112B (zh) | 2018-01-02 |
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