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TW200942973A - Substrate processing apparatus, coating apparatus and coating method - Google Patents

Substrate processing apparatus, coating apparatus and coating method

Info

Publication number
TW200942973A
TW200942973A TW097138433A TW97138433A TW200942973A TW 200942973 A TW200942973 A TW 200942973A TW 097138433 A TW097138433 A TW 097138433A TW 97138433 A TW97138433 A TW 97138433A TW 200942973 A TW200942973 A TW 200942973A
Authority
TW
Taiwan
Prior art keywords
coating
couple
substrate processing
processing apparatus
support part
Prior art date
Application number
TW097138433A
Other languages
Chinese (zh)
Other versions
TWI385712B (en
Inventor
Kenya Shinozaki
Yoshitaka Otsuka
Takashi Nakamitsu
Daisuke Ikemoto
Yousuke Mine
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200942973A publication Critical patent/TW200942973A/en
Application granted granted Critical
Publication of TWI385712B publication Critical patent/TWI385712B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The first and second holding sections of the first (left side) and the second (right side) transportation parts are equipped with adsorption pads that unite with the back (lower side) of two left corners and two right corners of the substrate respectively by the vacuum adsorption power, a couple of pad support part that restricts the displacement of perpendicular direction in two places that had a regular spacing in the direction of transportation (direction of X) and that supports each adsorption pads, and a couple of pad-actuator that moves these a couple of pad support part going up and down or moves going up and down displacement respectively independently.
TW097138433A 2007-11-06 2008-10-06 Substrate processing device, coating device and coating method TWI385712B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007288238A JP4495752B2 (en) 2007-11-06 2007-11-06 Substrate processing apparatus and coating apparatus

Publications (2)

Publication Number Publication Date
TW200942973A true TW200942973A (en) 2009-10-16
TWI385712B TWI385712B (en) 2013-02-11

Family

ID=40646308

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097138433A TWI385712B (en) 2007-11-06 2008-10-06 Substrate processing device, coating device and coating method

Country Status (4)

Country Link
JP (1) JP4495752B2 (en)
KR (1) KR101351155B1 (en)
CN (1) CN101431008B (en)
TW (1) TWI385712B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
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TWI777060B (en) * 2010-02-17 2022-09-11 日商尼康股份有限公司 Conveyor device, exposure device, and device manufacturing method
TWI798367B (en) * 2019-02-26 2023-04-11 日商東麗工程股份有限公司 Coating device

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JP4916035B2 (en) * 2009-08-28 2012-04-11 東京エレクトロン株式会社 Substrate transport apparatus and substrate transport method
KR101143321B1 (en) * 2009-10-28 2012-05-09 (주)엠피기술산업 Sliding transporting apparatus
KR101138314B1 (en) * 2009-11-23 2012-04-25 주식회사 나래나노텍 A Floating Type Film Coating Device and Method, and A Floating Type Film Coating System Having the Same
JP5254269B2 (en) * 2010-03-29 2013-08-07 大日本スクリーン製造株式会社 Substrate processing apparatus and transfer method
JP2011213435A (en) * 2010-03-31 2011-10-27 Toray Eng Co Ltd Carrying device and applying system
TW201134778A (en) * 2010-04-08 2011-10-16 Tae Sung Eng Co Ltd Apparatus for transferring of glass panel
KR101303461B1 (en) * 2010-09-03 2013-09-05 주식회사 케이씨텍 Inline type substrate coater apparatus and method thereof
JP5933920B2 (en) * 2010-12-24 2016-06-15 東京応化工業株式会社 Coating apparatus and coating method
JP5570464B2 (en) * 2011-03-24 2014-08-13 東京エレクトロン株式会社 Floating coating device
KR101296202B1 (en) * 2011-05-31 2013-08-13 정진영 Absorption type clamping device for transport device for pane members
CN103065998A (en) * 2011-10-21 2013-04-24 东京毅力科创株式会社 Processing bench device and coating processing device using same
JP5681952B2 (en) * 2012-05-31 2015-03-11 パナソニックＩｐマネジメント株式会社 Coating device
CN104227569A (en) * 2013-06-17 2014-12-24 株式会社太星技研 Tempered glass plate processing system and tempered glass plate processing method using the same
KR101521788B1 (en) * 2013-10-04 2015-05-20 주식회사 케이씨텍 Substrate coater and coating method
JP6339341B2 (en) * 2013-10-11 2018-06-06 平田機工株式会社 Processing system and processing method
KR102219882B1 (en) 2013-10-24 2021-02-24 세메스 주식회사 Apparatus and Method for treating substrate
CN106133188A (en) * 2014-03-25 2016-11-16 株式会社爱发科 Film formation device and film build method
KR102218382B1 (en) * 2014-08-21 2021-02-23 세메스 주식회사 Transfer unit, substrate treating apparatus including the unit, and substrate treating method
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JP5983810B1 (en) * 2015-04-02 2016-09-06 ウシオ電機株式会社 Light irradiation device
CN104862685B (en) * 2015-04-23 2017-06-16 西安四方超轻材料有限公司 A kind of magnesium lithium alloy surface processing device
KR102315660B1 (en) 2015-05-29 2021-10-22 세메스 주식회사 Apparatus and Method for treating substrate
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JP6651392B2 (en) * 2016-03-22 2020-02-19 東レエンジニアリング株式会社 Substrate floating transfer device
JP6659422B2 (en) * 2016-03-29 2020-03-04 アルバック成膜株式会社 Coating device, mask blank manufacturing method
WO2017221229A1 (en) * 2016-06-21 2017-12-28 Core Flow Ltd. Noncontact support platform with edge lifting
CN106183580B (en) * 2016-07-08 2019-01-18 青岛理工大学 Double-sided vacuum adsorption device, system and method with controllable regions
CN107628306A (en) * 2016-07-18 2018-01-26 上海沃迪自动化装备股份有限公司 A kind of multistation reciprocating conveyor
CN109983330B (en) * 2016-11-18 2022-07-29 东京电力控股株式会社 ACM sensor setting device and ACM sensor setting method
JP6846943B2 (en) * 2017-02-10 2021-03-24 東京エレクトロン株式会社 Coating device and coating method
JP6805017B2 (en) * 2017-02-10 2020-12-23 東京エレクトロン株式会社 Coating device and coating method
JP6987206B2 (en) * 2017-02-10 2021-12-22 東京エレクトロン株式会社 Coating device and coating method
CN107193142A (en) * 2017-07-19 2017-09-22 武汉华星光电技术有限公司 Alignment film cure system
CN108646517B (en) * 2018-05-29 2021-06-08 江西维易尔半导体设备有限公司 Wafer glue homogenizing device for photoetching machine
CN108803252B (en) * 2018-06-27 2020-10-16 合肥泰沃达智能装备有限公司 Light guide plate production and processing technology and coating exposure equipment thereof
KR102076593B1 (en) 2018-08-21 2020-02-12 세메스 주식회사 Apparatus for treating substrate
JP7101583B2 (en) * 2018-10-04 2022-07-15 東京エレクトロン株式会社 Board processing equipment and board processing method
KR102215123B1 (en) * 2018-11-26 2021-02-16 주식회사 탑 엔지니어링 Apparatus and method for inspecting surface of substrate
CN113924276B (en) * 2019-06-28 2024-10-01 Hoya株式会社 Method for manufacturing glass plate and method for manufacturing magnetic disk
JP7385389B2 (en) 2019-07-24 2023-11-22 川崎重工業株式会社 robot hand and robot
CN110293016A (en) * 2019-07-30 2019-10-01 李开词 A kind of corrugated board automatic positioning auxiliary spraying mechanism
CN110314791A (en) * 2019-07-30 2019-10-11 李开词 A kind of customization corrugated board automatic positioning flush coater
JP7299790B2 (en) * 2019-08-05 2023-06-28 東レエンジニアリング株式会社 SUBSTRATE LIFTING TRANSPORT DEVICE AND SUBSTRATE POSITION CORRECTION METHOD OF SUBSTRATE LIFTING TRANSPORT DEVICE
JP2021067925A (en) * 2019-10-21 2021-04-30 キヤノン株式会社 Support device, projection optic system, exposure device, method of adjusting support device, and method of producing article
CN111252558B (en) * 2020-02-11 2020-09-15 江苏科技大学 Contactless dip angle controllable transportation platform and control method
TW202301531A (en) * 2021-03-25 2023-01-01 日商東京威力科創股份有限公司 Substrate transfer device, coating processing device, substrate transfer method, and substrate transfer program
TW202306651A (en) * 2021-03-31 2023-02-16 日商東京威力科創股份有限公司 Substrate conveying device, coating processing device, and substrate conveying method
CN113600884B (en) * 2021-09-01 2022-04-22 安徽金元素复合材料有限公司 Metal composite board surface milling device
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JP7470749B2 (en) * 2022-08-24 2024-04-18 株式会社Ｓｃｒｅｅｎホールディングス Coating Equipment

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JP4305918B2 (en) * 2004-01-30 2009-07-29 東京エレクトロン株式会社 Floating substrate transfer processing equipment
JP4049751B2 (en) * 2004-02-05 2008-02-20 東京エレクトロン株式会社 Coating film forming device
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI777060B (en) * 2010-02-17 2022-09-11 日商尼康股份有限公司 Conveyor device, exposure device, and device manufacturing method
TWI798367B (en) * 2019-02-26 2023-04-11 日商東麗工程股份有限公司 Coating device

Also Published As

Publication number Publication date
TWI385712B (en) 2013-02-11
CN101431008B (en) 2010-10-13
JP4495752B2 (en) 2010-07-07
JP2009117571A (en) 2009-05-28
CN101431008A (en) 2009-05-13
KR101351155B1 (en) 2014-01-27
KR20090046719A (en) 2009-05-11

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees