JP2006332378A - Method and apparatus for positioning article, and for manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus capable of positioning a plurality of semiconductor circuit members with high precision without producing dust etc. in the positioning process, and to provide a method and an apparatus for manufacturing a semiconductor device using the positioning method and apparatus. <P>SOLUTION: By using the positioning apparatus 1 wherein an air current generator 4, a tilting means 5, and a sensor 7 are provided for each of a plurality of positioning stoppers 3 provided on a positioning substrate 2; the positions of the plurality of semiconductor circuit members can be detected by respective sensors 7, a control means 8 can individually control respective air current generators 4 in accordance with the detected results, and the semiconductor circuit members 10 are temporarily fixed on the positioning substrate 2 from the member 10 for which the positioning has been carried out. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an article positioning method and positioning apparatus, and a semiconductor device manufacturing method and a semiconductor device manufacturing apparatus. More specifically, the present invention has a high positioning accuracy and does not generate dust or chipping in the positioning process. The present invention relates to an article positioning method and positioning apparatus capable of positioning the articles collectively, a semiconductor device manufacturing method, and a semiconductor device manufacturing apparatus.

  In recent years, development of a system-on-panel (hereinafter abbreviated as “SOP”) in which circuits having various functions are formed on a single panel has been advanced. For example, thin film transistors (hereinafter abbreviated as “TFT”) for displaying an image on a transparent insulating substrate such as glass and driving the display unit using polycrystalline silicon having relatively high mobility. One example is the development of a driver monolithic display panel that simultaneously forms the TFT of the driver circuit portion to be formed.

  However, at present, it is extremely difficult to produce a driver circuit with the same performance as that of single crystal silicon with polycrystalline silicon, and only monolithic drivers can be made with analog drivers and low bit digital drivers. Yes. In other words, a line-sequentially driven digital driver circuit that requires even higher speed operation, or a circuit such as an oscillation circuit or a CPU cannot be formed monolithically with polycrystalline silicon. Therefore, an IC (Integrated Circuit) chip and an LSI (Large Size Integrated Circuit) chip obtained by cutting out a single crystal silicon wafer on which these circuits are separately formed are referred to as chip on glass (hereinafter abbreviated as “COG”). A circuit is incorporated in the panel by externally connecting to the liquid crystal panel using a technology or a chip on film (hereinafter abbreviated as “COF”) technology. In this COG technology, a space for joining an IC chip and a wiring pattern for connection are provided near the edge of the panel, and the IC chip cut out from the silicon wafer is provided with an anisotropic conductive film (ACF). This is a technique in which an IC chip is directly bonded to a panel by using an adhesive called “.

  However, since the conventional COG technique is a method of positioning and bonding IC chips one by one to a single liquid crystal panel, there is a problem that throughput is not good.

Therefore, Patent Documents 1 and 2 disclose a technique in which a plurality of electronic components are collectively positioned on a substrate and bonded together. By this method, it is possible to improve the throughput. As a technique disclosed in Patent Document 1, after placing a plurality of electronic components on a substrate, vibration is applied to the substrate, and a plurality of electrons are placed in a plurality of recesses provided at desired positions on the substrate. A method for positioning by dropping parts simultaneously is disclosed. In Patent Document 2, a magnetic pattern is provided at a desired position on the substrate, while a semiconductor chip is provided with a magnetic layer magnetized on the back surface. A method of positioning a semiconductor chip with a magnetic attraction force is disclosed.
JP 2003-209129 A (published July 25, 2003) Japanese Patent Laid-Open No. 03-84999 (published on April 10, 1991) Japanese Patent Laid-Open No. 02-92475 (published on April 3, 1990)

  However, the methods disclosed in Patent Document 1 and Patent Document 2 have the following problems.

That is, in Patent Document 1,
(1) Since vibration is applied to the entire board and multiple electronic components are slid at the same time, electronic components that cannot be positioned are generated because they cannot move during positioning, get caught when falling into the recess, or get over the recess. In this case, it is difficult to correct the position by moving only the electronic component.
(2) Since vibration is applied to the entire substrate and a plurality of electronic components are collectively positioned, it is necessary to continue applying vibration to the entire substrate until all the electronic components are positioned at the correct positions. Therefore, even if an electronic component is correctly positioned at an early stage, it will be displaced from the correct position while continuing to receive vibrations, and it will be disengaged from the step (concave portion) of the positioning part. Decreases.
(3) The electronic parts that have been positioned first will be vibrated while being in contact with the side walls of the recess until all the electronic parts are positioned, so dust and chipping due to rubbing and collision will occur. As a result, the bonding accuracy and yield of the subsequent process are lowered.
There is a problem.

In Patent Document 1,
(4) Since the amplitude of vibration differs between the center and the edge of the board, the larger the number of electronic components and the larger the board size, the more difficult it is to position all the electronic parts at the same time and give them the optimum vibration. .
There is also a problem.

Also in Patent Document 2,
(5) Heat is applied to the entire expanded film, and all the semiconductor chips are peeled off from the expanded film at the same time and positioned by magnetic force. Therefore, when a semiconductor chip that is not positioned properly is generated, only the semiconductor chip is moved and positioned. It is difficult to correct.
There is a problem.

  Accordingly, the present invention has been made in view of the above-described problems, and its purpose is to collectively position a plurality of semiconductor circuit members with high positioning accuracy without generating dust or chipping in the positioning process. It is an object of the present invention to provide a semiconductor circuit member positioning method and positioning apparatus capable of performing the above.

  A positioning method according to the present invention is a method for positioning an article for positioning a plurality of articles on a plurality of positioning portions provided on a positioning substrate, in order to solve the above-described problem. By moving the surface of the positioning substrate in a non-contact state and detecting the position of the article with respect to the positioning portion, the positioned article among the plurality of articles is temporarily transferred to the positioning substrate. While fixing, the article which was not positioned is moved and positioned again in the said non-contact state, It is characterized by the above-mentioned.

  Similarly, the positioning method according to the present invention is a method for positioning an article for positioning a plurality of articles on a plurality of positioning portions provided on a positioning substrate, in order to solve the above-described problem. Moving in a non-contact state with respect to the surface of the positioning substrate, a detecting step for detecting the position of the article with respect to the positioning portion, and detecting that the positioning portion has been positioned by the detecting step A fixing step of temporarily fixing the article to the positioning substrate, and the moving step, the detecting step, and the fixing step are performed independently of each other for the plurality of articles, and the positioning is performed. The moving step and the detecting step are performed again on the article that has been detected by the detecting step as being not positioned on the part. It is characterized in Rukoto.

  According to the above configuration, the correspondence between the article positioned in the positioning portion and the article not positioned in the positioning portion can be changed, so that accurate, good and quick positioning can be performed. Become.

  That is, according to the positioning method of the present invention, among a plurality of articles, an article that has not been positioned by the positioning unit can be positioned again. Therefore, positioning can be performed accurately even when positioning a plurality of articles.

  In addition, among the plurality of articles, since the articles positioned in the positioning unit are temporarily fixed sequentially to the substrate, when the articles that have not been positioned in the positioning unit are positioned again, the articles already positioned in the positioning unit are Do not move. In other words, positioning can be performed again only for an article that has not been positioned by the positioning unit among the plurality of articles.

  As a result, while positioning the article that has not been positioned by the positioning unit again, the article that has already been positioned by the positioning unit is not shifted from or detached from the positioning unit, and the positioned article is re-positioned again. There is no. Therefore, according to the method of the present invention, positioning can be performed quickly and accurately even when positioning a plurality of articles.

  In addition, since the article already positioned in the positioning unit is temporarily fixed, the possibility that the article will be rubbed with other members such as the positioning unit by re-positioning the unpositioned article is significantly reduced. Can be made.

  Thereby, it becomes possible to avoid the damage of the article | item by dust and generation | occurrence | production of dust, and all the some articles | goods can be positioned favorably.

  Furthermore, according to the above configuration, since all articles move in a non-contact state with respect to the surface of the positioning substrate, there is no possibility that the article vibrates and collides with the positioning substrate or the positioning unit during the movement. It is possible to eliminate damage to the articles and generation of dust.

  Therefore, according to the method of the present invention, it is possible to position a plurality of articles with good accuracy and good speed.

  Here, “temporarily fixed” means that the article is not fixed to the positioning substrate surface semi-permanently, but is temporarily fixed to the positioning substrate on the assumption that the article is detached from the substrate in a later process. To do. That is, the positioning device and the positioning method of the present invention usually arrange the semiconductor circuit members in advance when the article is a semiconductor circuit member and a plurality of semiconductor circuit members are arranged on another member (for example, a bonded substrate). Used to keep. For this reason, it is necessary to fix the article temporarily rather than semi-permanently.

  Further, the positioning method according to the present invention causes the article to be brought into the non-contact state by using the pressure of the gas discharged from the surface of the positioning substrate, and the weight of the article is inclined by inclining the positioning substrate. It is preferable to move using.

  Further, the positioning method according to the present invention uses the weight of the article by tilting the positioning substrate while making the non-contact state by forming a repulsive force between the article and the positioning substrate. It is preferable to move them.

  With the above configuration, since the articles are moved in a non-contact state with respect to the surface of the positioning substrate, it is possible to position all the articles satisfactorily without damaging the articles or generating dust.

  In addition, since the article is moved using the fluid force, the frequency and the amplitude are not changed by the resonance phenomenon as in the case of the vibration used for moving the electronic component in the prior art. Therefore, it is possible to move the article stably over the surface on the positioning substrate. Therefore, even when the number of articles is increased and the substrate size is increased, these are collectively collected. Easy to position.

  In the positioning method according to the present invention, the position of the article relative to the positioning unit is detected in a two-dimensional direction along the surface of the positioning substrate and in a direction perpendicular to the surface of the positioning substrate. Preferably it is detected.

  If it is said structure, it will become possible to perform positioning of an article | item with high precision.

  Specifically, the positioning method of the present invention performs two types of detection: detection in a two-dimensional direction along the surface of the positioning substrate and detection in a direction perpendicular to the surface of the positioning substrate, Based on these detection results, the article is temporarily fixed to the positioning substrate or positioned again. Thereby, according to the positioning method of the present invention, it is possible to obtain positioning accuracy of about several to 10 μm, particularly in the two-dimensional direction.

  Therefore, according to the positioning method of the present invention, for example, when a semiconductor chip as a semiconductor circuit member is bonded to and electrically connected to a bonding substrate on which a circuit or the like is formed, the semiconductor chip is positioned. However, it is possible to execute it accurately and with high accuracy.

  In the positioning method according to the present invention, the position of the article in the two-dimensional direction can be detected by imaging the article and the positioning unit using an image display unit including an imaging unit. .

  For example, the above-described configuration can be realized by a configuration in which an image display unit such as a CCD (charge coupled device) camera is used to photograph the position of the positioning unit and the article on the substrate from above. .

  In the positioning method according to the present invention, the position of the article in the two-dimensional direction can be detected using a laser beam.

  For example, a laser displacement meter that measures the displacement using laser light can be used.

  The positioning method according to the present invention may include a step of collectively bonding the plurality of articles temporarily fixed on the positioning substrate to the bonding substrate.

  With the above configuration, for example, when a semiconductor circuit member is used as the article, the semiconductor circuit member collectively bonded to the bonding substrate by the above steps is accurately and well positioned as described above. The Therefore, by using the positioning method according to the present invention, for example, a semiconductor chip can be used as a semiconductor circuit member, and bonding can be performed with high precision even when the chip is bonded to a bonding substrate on which a circuit or the like is formed. Therefore, when a semiconductor device is manufactured by electrically connecting the bonding substrate and the semiconductor chip, a highly accurate semiconductor device can be provided.

  The positioning device of the present invention is characterized by using the above-described positioning method.

  Thereby, since the correspondence with respect to the article positioned in the positioning portion and the article not positioned in the positioning portion can be changed, it is possible to provide a positioning device that performs accurate, good and quick positioning. .

  The semiconductor device manufacturing method of the present invention is characterized in that the semiconductor device is manufactured using the positioning method described above.

  As a result, a highly accurate semiconductor device can be manufactured, and the throughput can be improved as compared with the conventional one.

  A semiconductor device manufacturing apparatus according to the present invention is characterized by using the positioning method described above.

  As a result, a highly accurate semiconductor device can be manufactured, and a semiconductor device manufacturing apparatus having an improved throughput as compared with the related art can be provided.

  The positioning device according to the present invention is a positioning device for positioning a plurality of articles on a positioning substrate in order to solve the above-described problem, and the positioning substrate provided with a plurality of positioning portions, An operating means configured to move the article and temporarily fix the article to the positioning substrate; a detecting means for detecting the position of the article relative to the positioning portion; and a control means for controlling the operating means; The operation means and the detection means are provided so as to correspond to each of the plurality of positioning portions, and the control means is based on detection results of the detection means corresponding to the positioning portions. Among the plurality of articles, the article positioned in the positioning unit is temporarily fixed to the positioning substrate and positioned in the positioning unit. Moves that were not determined article again so as to position the positioning portion, is characterized by controlling the operation means corresponding to each of the positioning unit.

  According to said structure, the said operation means and the detection means are provided in the number of positioning parts, and are provided corresponding to each positioning part. Further, the control means was not positioned by the positioning section, so as to temporarily fix the semiconductor circuit member detected by the detection means to the positioning section on the positioning substrate. Since the operation means can be controlled so as to move the semiconductor circuit member detected again to position the positioning portion, the semiconductor circuit member positioned by the positioning portion and the positioning portion are positioned. Since it is possible to change the correspondence to the semiconductor circuit member that is not, it is possible to perform accurate, good and quick positioning.

  That is, according to the positioning device of the present invention, among a plurality of articles, an article that has not been positioned by the positioning unit can be positioned again. Therefore, even when positioning a plurality of articles, positioning can be performed with high accuracy.

  Further, among the plurality of articles, since the articles positioned in the positioning unit are temporarily fixed sequentially to the positioning substrate, when the article that has not been positioned in the positioning unit is positioned again, the article is already positioned in the positioning unit. The article does not move. In other words, it is possible to perform positioning again only for an article that has not been positioned by the positioning unit among the plurality of articles.

  Accordingly, the article that has already been positioned by the positioning unit and temporarily fixed to the positioning substrate is not displaced or detached from the positioning unit while repositioning the article that has not been positioned by the positioning unit. Therefore, even when positioning a plurality of articles, positioning can be performed quickly.

  In addition, with the above-described configuration, the possibility that an article that has already been positioned in the positioning portion will be rubbed with other members such as the positioning portion due to an operation for re-positioning an unpositioned article is significantly reduced. Can do.

  Thereby, it becomes possible to avoid the damage of the article | item by dust and generation | occurrence | production of dust, and all the some articles | goods can be positioned satisfactorily.

  Therefore, with the above configuration, it is possible to provide a positioning device capable of positioning a plurality of articles with high accuracy and speed.

  In the positioning device according to the present invention, it is preferable that the operation means is configured to move the article in a non-contact state with respect to the surface of the positioning substrate.

  According to the above configuration, the article does not come into contact with or collide with the positioning substrate during movement, and the article can be prevented from being damaged or dust generated.

  In the positioning device according to the present invention, the detection means detects the position of the article in a two-dimensional direction along the surface of the positioning substrate, and the surface of the positioning substrate. It is preferable to have a second detection unit that detects the position of the article in the vertical direction.

  With the above configuration, the detection means constitutes a first detection unit that detects the position of the article in the two-dimensional direction and a second detection unit that detects the position of the article in the vertical direction. Therefore, positioning can be executed with high accuracy. Specifically, in the positioning device of the present invention, the position of the article is detected by the first detection unit and the second detection unit, and the operation means is controlled based on both detection results. Thereby, especially the said 1st detection part can be used, and the clearance gap between a positioning part and articles | goods can be controlled with a high precision of about several 10 micrometers.

  Therefore, according to the positioning method of the present invention, for example, when the semiconductor chip as an article is bonded and electrically connected to a bonded substrate on which a circuit or the like is formed, It is possible to perform positioning accurately.

  In the positioning device according to the present invention, a through hole is provided in the positioning substrate, and the operation means is configured to discharge or suck gas to the surface of the positioning substrate through the through hole. It is preferable.

  With the above configuration, the article is brought into a non-contact state with respect to the surface of the positioning substrate by the gas discharged from the through hole provided on the surface of the positioning substrate. When the non-contact state is reached, for example, by providing means for tilting the positioning substrate in the operating means, the article can move on the surface of the positioning substrate by its own weight if the positioning substrate is tilted.

  Therefore, if it is set as said structure, all articles | goods can be positioned satisfactorily without the damage of articles | goods or generation | occurrence | production of dust.

  In addition, since the article is moved using the fluid force, the frequency and the amplitude are not changed by the resonance phenomenon as in the case of the vibration used for moving the electronic component in the prior art. Therefore, it is possible to stably move the article over the surface on the positioning substrate, and therefore, even when the number of articles is increased and the positioning substrate size is increased. Easy to position all at once.

  In the positioning device according to the present invention, the article is provided with an abutting member that abuts the positioning substrate and the positioning portion when the article is temporarily fixed to the positioning substrate. Is preferred.

  With the above configuration, since the article is provided with a contact member that contacts the positioning substrate and the positioning portion, in particular, the positioning substrate is detected when the article is positioned on the positioning portion. When temporarily fixed to the positioning substrate, there is no contact with the positioning substrate and the positioning portion.

  Thereby, positioning can be performed without damaging an article.

  In the positioning device according to the present invention, a first magnetic body is formed on the article, and a second magnetic body having attraction and repulsive force with respect to the first magnetic body is provided on the operating means. It is preferable that

  With the above configuration, the article provided with the contact member and the positioning substrate can be operated by attractive force and repulsive force. That is, therefore, the repulsive force is formed between the first magnetic body provided on the contact member by the operating means provided with the second magnetic body, so that the article and the positioning substrate are not in contact with each other. Can be. When the article and the positioning substrate are not in contact with each other, for example, by providing the operating means with a means for tilting the positioning substrate, if the positioning substrate is tilted, the article is weighted by the weight of the positioning substrate. The surface can be moved. On the other hand, the article can be temporarily fixed to the positioning substrate by forming an attractive force with the first magnetic body provided on the contact member by the operating means provided with the second magnetic body.

  As described above, by providing the first magnetic body and the second magnetic body, it is possible to satisfactorily position all articles without causing damage or dust.

  Further, since the article is moved using the magnetic force, the frequency and the amplitude are not changed by the resonance phenomenon as in the case of the vibration used for the movement of the electronic component in the prior art. Therefore, it is possible to stably move the article over the surface on the positioning substrate, and therefore, even when the number of articles is increased and the positioning substrate size is increased. Easy to position all at once.

  In addition, when the article itself is provided with a member corresponding to the first magnetic body, the article and the positioning substrate can be moved and temporarily fixed using magnetic force without providing the contact member. Is possible.

  In the positioning device according to the present invention, the first detection unit may include image display means including an imaging unit.

  For example, a CCD camera is used as the image display means, and the position of the positioning portion and the article on the positioning substrate is photographed from above, so that a two-dimensional direction along the surface of the positioning substrate is obtained. The position of the article can be detected.

  When a silicon chip is used as the article, the reflectance of the mirror-polished silicon chip surface is high, while the reflectance of the positioning substrate surface made of metal or glass is low. If there is a gap, the gap will appear dark on the monitor image, and it can be detected that the chip is not correctly positioned. On the contrary, if there is no gap between the silicon chip and the positioning part (that is, if the silicon chip is positioned in contact with the positioning part), a bright image of the silicon chip surface will be displayed on the monitor screen, It can be detected that the silicon chip is correctly positioned.

  Further, the image display means detects the state of the article, and then sends the detection result to the operation means, stops the discharge of gas (or formation of repulsive force) in the article that has been correctly positioned, and removes the article by vacuum suction ( Can be temporarily fixed to the positioning substrate). At this time, the second detection unit detects the distance between the front surface of the positioning substrate and the back surface of the article (or contact member) to adjust the gas discharge amount (or repulsive force), and the article is slowly It can act to transition from a non-contact state to a contact state.

  In the positioning device according to the present invention, the first detection unit can be a laser displacement meter.

  If the height of the positioning substrate surface (assumed to be set to zero) is detected by using a laser displacement meter configured to detect displacement in the direction perpendicular to the surface of the positioning substrate, This means that the article is not arranged at a predetermined position, and it can be detected that the article is not correctly positioned. On the other hand, if the height of the article (corresponding to the thickness of the semiconductor circuit member) is detected, it means that the article is at a predetermined position, and it can be detected that the article is correctly positioned.

  In addition, a semiconductor device manufacturing apparatus according to the present invention includes a positioning device having the above-described characteristics.

  With the above configuration, since the semiconductor circuit member is positioned accurately and satisfactorily on the positioning substrate, the semiconductor circuit member is then collectively bonded onto the bonding substrate on which the circuit and the like are formed, and the semiconductor When a semiconductor device is manufactured by electrically connecting the circuit member and the bonding substrate, a highly accurate semiconductor device can be manufactured.

  As a result, a highly accurate semiconductor device can be manufactured, and a semiconductor device manufacturing apparatus having an improved throughput as compared with the related art can be provided.

  As described above, the positioning method according to the present invention is a method for positioning an article for positioning a plurality of articles on a plurality of positioning portions provided on a positioning substrate, wherein the article is placed on the positioning substrate. The surface of the plurality of articles is temporarily fixed to the positioning substrate by detecting the position of the article on the positioning substrate and detecting the position of the article on the positioning substrate. At the same time, an article that has not been positioned is again moved and positioned in the non-contact state.

  Similarly, the positioning method according to the present invention is a method for positioning an article for positioning a plurality of articles on a plurality of positioning portions provided on a positioning substrate in order to solve the above-described problem. The article is positioned on the positioning portion by the moving step of moving the article in a non-contact state with respect to the surface of the positioning substrate, the detecting step of detecting the position of the article on the positioning substrate, and the detecting step. A fixing step of temporarily fixing the detected article to the positioning substrate, and the moving step, the detecting step, and the fixing step are performed independently of each other for the plurality of articles. For the article that has been detected by the detection process to have not been positioned by the positioning unit, the movement process and the detection process are performed again. It is characterized by but is executed.

  Furthermore, the positioning device according to the present invention is a positioning device that positions a plurality of articles on a positioning substrate as described above, and moves the article with a positioning substrate provided with a plurality of positioning portions. And an operating means configured to temporarily fix the article to the positioning substrate, a detecting means for detecting the position of the article on the positioning substrate, and a control means for controlling the operating means. The operation means and the detection means are provided so as to correspond to each of the plurality of positioning portions, and the control means is based on the detection results of the detection means corresponding to the positioning portions, Among the plurality of articles, the article positioned in the positioning unit is positioned on the positioning unit so as to be temporarily fixed to the positioning substrate. The never been article is moved back to position to the positioning unit, it is characterized by controlling the operation means corresponding to each of the positioning unit.

  With the above configuration, according to the present invention, since the correspondence between the semiconductor circuit member positioned at the positioning portion and the semiconductor circuit member not positioned at the positioning portion can be changed, positioning can be performed accurately and quickly. Can be performed.

  Further, according to the present invention, since the semiconductor circuit member is moved in a non-contact state with respect to the surface of the positioning substrate, the semiconductor circuit member does not collide with the positioning substrate or the positioning portion, and the semiconductor circuit member is damaged. In addition, it is possible to eliminate the generation of dust.

[Embodiment 1]
An embodiment of a positioning method and a positioning apparatus according to the present invention, and a semiconductor device manufacturing method and a semiconductor device manufacturing apparatus using the positioning method and positioning apparatus will be described.

  In the following description, various technically preferable limitations for carrying out the present invention are given, but the scope of the present invention is not limited to the following embodiments and drawings.

  Further, in the following description, a semiconductor circuit component positioning method and positioning device will be described, but the present invention is not limited to this, in addition to semiconductor circuit components, electronic components such as sensors, mechanical components, The present invention can be applied to biochemical components such as biochips.

  First, a positioning method and positioning device according to the present invention will be described below with reference to FIGS.

  FIG. 1 is a cross-sectional view showing a configuration of a positioning device 1 according to an embodiment of the present invention. The positioning device 1 shown in FIG. 1 is used to position a semiconductor chip in advance when, for example, a semiconductor device is manufactured as described later, and then the semiconductor chip is placed at a predetermined position on the bonding substrate. Can be used. Therefore, as shown in FIG. 1, the positioning device 1 according to an embodiment of the present invention includes a positioning substrate 2, a positioning stopper (positioning portion) 3, an airflow generating device 4, and an operating means 6 including an inclination means 5. , A sensor (detecting means) 7 including a first sensor portion 7a and a second sensor portion 7b, and a control means 8 are provided.

  A plurality of the positioning stoppers 3 are provided on the surface of the positioning substrate 2, and the airflow generation device 4 and the sensor 7 are disposed so as to correspond to the positioning stoppers 3. The airflow generation device 4, the operation means 6, and the sensor 7 are connected to the control means 8.

  In the positioning device 1 according to the present embodiment shown in FIG. 1, two positioning stoppers 3 are arranged on the positioning substrate 2 so that the two semiconductor circuit members can be positioned. Yes. However, in the present invention, the number of the positioning stoppers 3 is not limited to this, and needless to say, the positioning substrate 2 having three or more positioning stoppers 3 may be used.

  The positioning substrate 2 can place a plurality of semiconductor circuit members (articles) (not shown) to be positioned, and the semiconductor circuit members positioned by the positioning stopper 3 are temporarily fixed by moving the semiconductor circuit members. can do. The positioning substrate 2 can be configured using materials such as glass, silicon nitride, Kovar, and Invar.

  A plurality of through holes 9 are provided in the positioning substrate 2. One end of the through-hole 9 is open on the side where the semiconductor circuit member is temporarily fixed, and the other end is connected to the airflow generation device 4. It is comprised so that gas may flow through the inside of 9.

  Note that the positioning substrate 2 is provided with alignment markers 30 and 30 as shown in FIG. 1, assuming that, for example, a bonding substrate and a semiconductor circuit member are attached in a later step. Good.

  Moreover, in the positioning device 1 of the present embodiment, the three through holes 9 are connected to the single airflow generation device 4, but the present invention is not limited to that number.

  The positioning stopper 3 serves as a reference for positioning the semiconductor circuit member, and is disposed on the positioning substrate 2. As will be described later, the semiconductor circuit member stops at the positioning stopper 3 and is temporarily fixed there. FIG. 2 shows specific arrangement positions of the positioning substrate 2, the through hole 9, the positioning stopper 3, and the second sensor portion 7b.

  As shown in FIG. 2, the through hole 9 is formed on the entire surface of the positioning substrate 2. Further, the positioning stopper 3 is formed in an L shape as shown in FIG. As will be described later, the semiconductor circuit member stops at the positioning stopper 3 by abutting two adjacent sides in an L shape.

  The shape of the positioning stopper 3 and the height from the surface of the positioning substrate 2 (that is, the thickness of the positioning stopper 3) are not particularly limited as long as the semiconductor circuit member can be stopped. As shown in FIG. 3, it may be a positioning stopper 3a (FIG. 3 (a)) having no L-shaped corners, a semicircular positioning stopper 3b (FIG. 3 (b)), It can be appropriately set according to the shape and size of the semiconductor circuit member.

  The operation means 6 moves a plurality of semiconductor circuit members placed on the positioning substrate 2 to the positioning stoppers 3 and temporarily moves the semiconductor circuit members positioned by the positioning stoppers 3 to the positioning substrate 2. It is configured to be fixed.

  Specifically, the operating means 6 is composed of an airflow generation device 4 and an inclination means 5 as shown in FIG.

  The airflow generation device 4 is connected to one end of the through hole 9, can discharge (exhaust) gas toward the semiconductor circuit member mounting side of the positioning substrate 2, and inhale outside air from the same side (intake). it can. Thereby, although details will be described later, the semiconductor circuit member placed on the positioning substrate 2 can be brought into a non-contact state with respect to the surface of the positioning substrate 2 by exhaust. Further, the semiconductor circuit member that has been in a non-contact state can be adsorbed to the surface of the positioning substrate 2 by the intake air. By being able to adsorb, each semiconductor circuit member positioned by each positioning stopper 3 can be temporarily fixed on the positioning substrate 2.

  Here, “temporary fixing” is based on the premise that the semiconductor circuit member is not semi-permanently fixed to the surface of the positioning substrate 2 but is removed from the positioning substrate 2 in a later step. It means temporarily fixing to the positioning substrate 2. That is, the positioning device and the positioning method of the present embodiment are normally used for arranging semiconductor circuit members in advance when a plurality of semiconductor circuit members are arranged on another member (for example, a bonded substrate). For this reason, the semiconductor circuit member needs to be temporarily fixed rather than semi-permanently fixed to the positioning substrate 2.

  Each of the airflow generation devices 4 is connected to the control means 8 as shown in FIG. 1 and is controlled by the control means 8 as will be described in detail later. As the airflow generation device 4, for example, a comb or a combination of nitrogen piping and vacuum piping can be used.

  The tilting means 5 is provided for tilting the positioning substrate 2. The tilting means 5 is provided on the opposite side of the positioning substrate 2 from the side on which the semiconductor circuit member is placed, as shown in FIG. The tilting means 5 is connected to the control means 8 and is controlled by the control means 8 as will be described in detail later. As the tilting means 5, for example, a tilting stage, an elevating stage or the like can be used.

  The sensor 7 is provided to detect the position of the semiconductor circuit member on the positioning substrate 2, and is composed of a first sensor portion 7a and a second sensor portion 7b. Below, the 1st sensor part 7a and the 2nd sensor part 7b are explained in full detail.

  The first sensor unit 7a can detect the position of the semiconductor circuit member in a direction along the surface of the positioning substrate 2 (hereinafter referred to as a two-dimensional direction).

  As the first sensor unit 7a, an image display unit including an imaging unit and a display unit can be used, and a laser displacement meter can be used as described in the second embodiment. In the present embodiment, as shown in FIG. 1, an image display means (hereinafter, referred to as a first sensor unit 7a) including an imaging unit 7a-1 and a display unit 7a-2 is used. In particular, when the semiconductor circuit member is a single crystal silicon chip, the image display means is suitable because the reflectance of the surface of the single crystal silicon chip is significantly higher than the reflectance of the surface of the positioning substrate 2.

  Below, the detection principle of the 1st sensor part 7a of this embodiment is demonstrated based on Fig.4 (a) * (b). 4A and 4B are diagrams illustrating captured images of the semiconductor circuit member 10 captured by the imaging unit 7a-1 and displayed on the display unit 7a-2.

  When a single crystal silicon chip (hereinafter referred to as a semiconductor circuit member) is used as the semiconductor circuit member 10, as described above, the difference in reflectance between the semiconductor circuit member 10 and the positioning substrate 2 can be used, and imaging is performed. As seen from the image, the semiconductor circuit member 10 is displayed brighter than the positioning substrate 2. Thereby, the position of the semiconductor circuit member 10 can be detected. Specifically, as shown in FIG. 4A, if a darkly displayed area D is confirmed between the positioning stopper 3 and the semiconductor circuit member 10, a gap is formed between the semiconductor circuit member 10 and the positioning stopper 3. Therefore, it can be determined that the semiconductor circuit member 10 is not accurately positioned. On the other hand, in FIG. 4B, the region D cannot be confirmed between the positioning stopper 3 and the semiconductor circuit member 10. That is, it can be determined that the semiconductor circuit member 10 is accurately positioned on the positioning stopper 3.

  Next, the second sensor portion 7 b shown in FIGS. 1 and 2 is provided for detecting the position of the semiconductor circuit member in the direction perpendicular to the surface of the positioning substrate 2. That is, the second sensor unit 7b can detect the distance between the positioning substrate 2 and the semiconductor circuit member. As shown in FIGS. 1 and 2, the second sensor portion 7 b is disposed on the positioning substrate 2 close to the corner of the L-shaped positioning stopper 3 so that a surface to be detected is provided. Yes.

  As the second sensor unit 7b, a distance measuring sensor or a laser displacement meter can be used, but is not limited thereto.

  The control means 8 shown in FIG. 1 receives signals relating to the position of the semiconductor circuit member from the first sensor part 7a and the second sensor part 7b, and controls each airflow generating device 4 and each inclination means 5 shown in FIG. It is configured to be able to.

  Specific functions of the control means 8 will be described together with the positioning method of the present embodiment described below.

  FIGS. 5A to 5E are explanatory diagrams for explaining the positioning method of the present embodiment. 5 (a) to 5 (e) include a part where wiring for connecting members is omitted.

  First, the semiconductor circuit member 10 is placed on the positioning substrate 2 and exhausted from the airflow generator 4 toward the surface of the positioning substrate 2 (the airflow is indicated by an arrow in the figure), whereby FIG. ), The semiconductor circuit member 10 is not in contact with the surface of the positioning substrate 2. In this state, by tilting the positioning substrate 2 using the tilting means 5, the plurality of semiconductor circuit members 10 can be moved by their own weights as shown in FIG. 5B (moving step). . The airflow generation device 4 and the tilting means 5 described above are controlled by the control means.

  As shown in FIG. 5B, the position of each semiconductor circuit member 10 that is moving can be detected by using the first sensor portion 7 a and the second sensor portion 7 b provided on each positioning stopper 3. (Detection process). Specifically, the position of the semiconductor circuit member 10 in the two-dimensional direction along the surface of the positioning substrate 2 is detected by the first sensor unit 7a, and the semiconductor circuit member in the direction perpendicular to the surface of the positioning substrate 2 is used. The position of 10 is detected by the second sensor unit 7b.

  Detection signals from the first sensor portion 7a and the second sensor portion 7b of each semiconductor circuit member 10 are sent to the control means 8, respectively.

  Next, the control means 8 is positioned as shown on the left side of FIG. 5B among the plurality of semiconductor circuit members 10 based on the detection signals received from the first sensor portions 7a and the second sensor portions 7b. If it is determined that the stopper 3 is accurately positioned, the airflow generation device 4 corresponding to the positioned semiconductor circuit member 10 is controlled to cause the airflow generation device 4 to perform intake. Thereby, the semiconductor circuit member 10 accurately positioned by the positioning stopper 3 is temporarily fixed to the positioning substrate 2. Subsequently, the control means 8 controls the tilting means 5 so as to return the positioning substrate 2 to the horizontal position. Thus, as shown on the left side of FIG. 5C, the semiconductor circuit member 10 accurately positioned by the positioning stopper 3 is temporarily fixed to the positioning substrate 2 (fixing step).

  On the other hand, for the semiconductor circuit member 10 (right side of FIGS. 5B and 5C) that is determined not to be positioned by the positioning stopper 3 by the control means 8 at the time of FIG. 8 controls the airflow generation device 4 corresponding to the semiconductor circuit member 10 to exhaust again, thereby bringing the semiconductor circuit member 10 into a non-contact state again, and again as shown in FIG. The tilting means 5 is controlled so that the positioning substrate 2 is tilted, and the semiconductor circuit member 10 is positioned again.

  As a result of positioning again, the control means 8 determines that the semiconductor circuit member 10 is accurately positioned on the positioning stopper 3 based on the detection results of the corresponding first sensor portion 7a and second sensor portion 7b. Then, it can be temporarily fixed to the positioning substrate 2 through the same process as the semiconductor circuit member 10 on the left side of FIGS.

  Moreover, the control means 8 can control the airflow generation device 4 in the middle of exhausting and adjust the exhaust amount based on the detection result of the second sensor unit 7b. Thereby, switching from exhaust to intake can be performed in stages. Therefore, the collision of the semiconductor circuit member 10 with the positioning stopper 3 and the positioning substrate 2 due to abrupt switching and the damage due to the collision can be avoided.

  As described above, according to the positioning method of the present embodiment, the semiconductor circuit member 10 that has not been positioned by the positioning stopper 3 among the plurality of semiconductor circuit members 10 can be positioned again. Therefore, even when positioning a plurality of semiconductor circuit members 10, positioning can be performed accurately.

  Further, among the plurality of semiconductor circuit members 10, since the semiconductor circuit member 10 that has not been positioned by the positioning stopper 3 is re-positioned because it is temporarily fixed to the positioning substrate 2 sequentially from the one positioned by the positioning stopper 3. The semiconductor circuit member 10 that has already been positioned by the positioning stopper 3 is temporarily fixed and cannot move as shown on the left side of FIGS. In other words, positioning can be performed only for the semiconductor circuit member 10 that is not positioned by the positioning stopper 3 among the plurality of semiconductor circuit members 10.

  Thus, while the semiconductor circuit member 10 that has not been positioned by the positioning stopper 3 is positioned again, the already-positioned semiconductor circuit member 10 is positioned without being displaced from or disengaged from the corresponding positioning stopper 3. The semiconductor circuit member 10 that has been used is not repositioned. Therefore, according to the positioning method of this embodiment, positioning can be performed quickly and accurately even when positioning a plurality of semiconductor circuit members 10.

  Further, since the already positioned semiconductor circuit member 10 is temporarily fixed, another operation such as positioning stopper 3 is performed by an operation for repositioning the semiconductor circuit member 10 where the semiconductor circuit member 10 is not positioned. The possibility of rubbing the member and the semiconductor circuit member 10 can be significantly reduced.

  As a result, it is possible to avoid damage to the semiconductor circuit member 10 and generation of dust due to rubbing, and it is possible to position the plurality of semiconductor circuit members 10 in a good state.

  Further, according to the above configuration, since all the semiconductor circuit members 10 move in a non-contact state with respect to the surface of the positioning substrate 2, the semiconductor circuit members 10 move while the positioning substrate 2 and the positioning stopper 3 are moving. It is possible to eliminate the damage of the semiconductor circuit member 10 and the generation of dust.

  In the positioning method described above, two types of detection are performed: two-dimensional detection along the surface of the positioning substrate 2 and detection in the vertical direction with respect to the surface of the positioning substrate 2. Based on the above, it is determined whether the semiconductor circuit member 10 is temporarily fixed to the positioning substrate 2 or is positioned again. In particular, by performing detection in a two-dimensional direction, according to the positioning method of the present invention, a positioning accuracy of about several to 10 μm can be obtained in the two-dimensional direction.

  For example, there is no process of the present invention for determining the positioning according to the detection in the two-dimensional direction and the detection result, and positioning is performed only by alignment between the protrusion provided on the positioning substrate and the groove provided on the member to be positioned. Is performed, the accuracy in the two-dimensional direction is about several hundred μm because the clearance between the groove and the protrusion is about 0.1 mm or more.

  Therefore, according to the positioning method of the present embodiment, detection in the two-dimensional direction is performed and the detection result is fed back, so that high positioning accuracy can be obtained.

  Therefore, for example, when a semiconductor chip as a semiconductor circuit member is bonded to a bonding substrate on which a circuit or the like is formed and electrically connected, the positioning of the semiconductor chip is performed accurately and with high accuracy. Can do.

  As described above, according to the above method, the plurality of semiconductor circuit members 10 can be accurately and satisfactorily and quickly positioned.

  5A to 5E, the method for positioning the two semiconductor circuit members 10 has been described. However, the positioning device and the positioning method of the present invention are not limited to this number.

  By moving the semiconductor circuit member 10 using fluid force as in the present embodiment, fluctuations in frequency and amplitude due to a resonance phenomenon as in the case of the prior art in which electronic components are moved by vibration do not occur. By using the fluid force, it is possible to stably move the semiconductor circuit member 10 over the surface on the positioning substrate 2. Therefore, the number of the semiconductor circuit members 10 is increased and the positioning substrate 2 is increased. Even when the size of the is increased, it is easy to position them collectively.

  Further, in the positioning method of the present embodiment described with reference to FIGS. 5A to 5E, the unpositioned semiconductor circuit member 10 shown on the right side of FIGS. (D) Although positioning to the positioning stopper 3 could be completed through (e), the present invention is not limited to this, and the positioning stopper 3 is not limited to this through FIGS. 5 (d) and (e). If positioning cannot be performed, the operations shown in FIGS. 5D and 5E can be repeated until positioning is possible.

  In the present embodiment, the two members of the first sensor unit 7a and the second sensor unit 7b are provided as the sensor 7. However, if the above-described effects can be obtained, the sensor 7 can be implemented by one sensor unit. It is.

  Next, a semiconductor circuit member that is positioned using the positioning method and positioning apparatus of the present embodiment described above will be described.

  As described with reference to FIGS. 4A and 4B, in the positioning method and positioning device of the present embodiment, an image display means can be used as the first sensor unit 7a. Therefore, hereinafter, the configuration of the semiconductor circuit member 10 when a single crystal silicon chip is used as the semiconductor circuit member 10 will be described.

(Semiconductor circuit members)
FIG. 6 is a cross-sectional view showing the configuration of the semiconductor circuit member 10. A semiconductor circuit member 10 shown in FIG. 6 includes a gate oxide film on a single crystal silicon (Si) substrate (hereinafter referred to as “single crystal Si substrate”) 12 having a source / drain portion impurity implantation portion 11 formed on the surface thereof. 13 is formed, a gate electrode 14 is formed thereon, and an interlayer insulating film 15 is further formed thereon to cover the gate electrode 14 and the like. Further, a hydrogen ion implanted layer 16 is formed at a predetermined depth of the source / drain impurity implanted portion 11 in the single crystal Si substrate 12. The above process is performed by, for example, a microfabrication process of about 0.5 μm. The semiconductor circuit member 10 has a size of about 10 mm × 10 mm, for example.

  Next, a method for manufacturing the semiconductor circuit member 10 will be described with reference to FIGS.

  As shown in FIG. 7A, from the state of the single crystal silicon wafer 12a having a diameter of about 6 inches (about 15 cm) or 8 inches (about 20 cm), if necessary, LOCOS (LOCOS ( Local Oxidation of Silicon: Selective oxidation method)) Oxidation isolation (isolation) or, in some cases, shallow trench isolation, is performed for isolation, and as shown in FIG. Formation and patterning of the gate electrode 14, implantation of impurities into the source / drain impurity implantation portion 11, impurity activation, formation of the interlayer insulation film 15, and formation of the interlayer insulation film 15 by CMP (Chemical Mechanical Polishing). A process of planarization and hydrogen ion implantation into the hydrogen ion implantation layer 16 is performed. At the time of hydrogen ion implantation, a hydrogen element and another element (for example, a He element) may be co-implanted.

  In the above process, after the interlayer insulating film 15 is formed, contact hole opening (not shown), source / drain metal film formation, patterning, passivation film formation, planarization by CMP, and the hydrogen ion implantation layer are performed. The process may be advanced such as hydrogen ion implantation into 16.

  By proceeding with the above steps, as shown in FIG. 7B, a single crystal silicon wafer 10a in which semiconductor circuits each made of a single crystal Si transistor are formed in each partitioned region is completed. Next, as shown in FIG. 6, a protective film 17 is applied.

  Finally, as shown in FIG. 7C, the single crystal silicon wafer 10a is divided into chip-like semiconductor circuit members 10 by a normal blade dicing apparatus or a laser dicing method. The semiconductor circuit member 10 can be produced by the above method.

  More preferably, the semiconductor circuit member 10 may be provided with a contact member. That is, as shown in FIG. 21A, in addition to the configuration of the semiconductor circuit member 10 described with reference to FIG. 6, the semiconductor circuit member 10- (1) has a contact member 45 provided on the surface of the semiconductor substrate. May be.

  The contact member 45 can be made of a photosensitive resin such as a resist or a dry film resist.

  By providing the contact member 45, when the semiconductor circuit member 10- (1) is detected to be positioned by the positioning stopper 3 and is temporarily fixed to the positioning substrate 2, the semiconductor circuit member 10- (1) ) Other than the contact member 45 can be prevented from contacting the positioning substrate 2 and the positioning stopper 3. Thereby, positioning can be performed without damaging parts other than the contact member 45 of the semiconductor circuit member 10- (1).

  Hereinafter, a method for manufacturing the semiconductor circuit member 10- (1) in which the contact member 45 is formed will be described. For convenience of description, the same manufacturing steps as those of the semiconductor circuit member 10 described above are omitted in the following description.

  First, as shown in FIG. 22A, a single circuit in which a semiconductor circuit made of a single crystal Si transistor is formed in each of the divided regions by a method similar to the method for manufacturing the semiconductor circuit member 10 described above. A crystalline silicon wafer 10a is created.

  Next, after forming a protective film 17 as shown in FIG. 6 on the surface of the single crystal silicon wafer 10a, a photosensitive resin is applied or laminated thereon. As the protective film 17, a non-photosensitive resin or metal thin film is used. For example, a photoresist or a dry film resist is used as the photosensitive resin.

  The photosensitive resin is exposed by photolithography using the position of the semiconductor circuit device formed on the front side of the single crystal silicon wafer 10a as a reference so that the divided semiconductor circuit member 10- (1) can be positioned with high accuracy. Development is performed to form the contact member 45 (FIG. 22B). As the height of the contact member 45, it is sufficient if there is a level difference enough to cause the semiconductor circuit member 10- (1) to be caught by the positioning stopper 3 formed on the positioning substrate 2, but it is higher than the height of the positioning stopper 3. It is preferable to keep it. Specifically, a step of about 1 to 50 μm can be provided.

  Subsequently, as shown in FIG. 22 (c), the single-crystal silicon wafer 10a having the contact member 45 formed on the surface thereof is converted into a chip-like semiconductor circuit member 10 by a normal blade dicing apparatus or a laser dicing method. -Divide into (1). In general, the accuracy of external processing of a chip by a blade dancing device is about ± 10 μm, and the accuracy is not good. In addition, laser dicing using a YAG laser or the like is likely to cause chipping, and the processing accuracy is not good. However, in the present embodiment, the photosensitive resin coated or laminated on the surface of the semiconductor circuit member 10- (1) is photolithography so that the position of the semiconductor circuit device on the surface of the semiconductor circuit member 10 is reduced. And a contact member 45 (photolithographic accuracy and processing accuracy square sum: ± 0) that has been aligned (photolithographic accuracy: about ± 0.26 μm) and processed (processing accuracy: about ± 0.3 μm). Therefore, the positioning of the semiconductor circuit member 10- (1) is not affected at all even if the accuracy of the outer shape of the semiconductor circuit member 10- (1) at the time of division is poor. Accordingly, it is possible to position the semiconductor circuit member with higher accuracy than in the case of the outer shape matching without providing the contact member.

  The semiconductor circuit member 10 (or 10- (1)) manufactured in this way is positioned on the positioning substrate 2 by the positioning method and positioning device described above, and then attached to a bonding substrate on which a circuit or the like is formed. Manufacture equipment. Hereinafter, the bonded substrate will be described.

(Bonded substrate)
8A to 8D are diagrams illustrating a manufacturing process of a bonded substrate. As shown in FIG. 8D, the bonding substrate 18a is included in a mother glass 19, a silicon dioxide insulating film 20 formed on the mother glass 19, and a plurality of panels formed thereon. It consists of a polycrystalline silicon device 21 and includes a plurality of panels 18b.

  When the bonding substrate 18a is manufactured, as shown in FIG. 8A, first, a TEOS film is deposited on the mother glass 19 by a plasma CVD method to a thickness of about 50 to 200 nm to form a silicon dioxide insulating film 20. To do.

Next, an amorphous silicon film 22 is formed to a thickness of about 30 to 200 nm by plasma CVD, and a heat treatment (annealing) is performed for 30 to 60 minutes with heat of about 450 to 600 ° C. in order to release hydrogen in the amorphous silicon film 22. To do. By this heat treatment, the hydrogen content in the amorphous silicon film 22 can be reduced to 1 × 10 ¹⁹ cm ⁻³ or less. It may also serve as solid phase crystal growth.

  Next, as shown in FIG. 8B, the amorphous silicon film 22 is removed by patterning and etching only at the portion where the semiconductor circuit member 10 is joined. By performing this patterning removal, even if the mother glass 19 is sequentially irradiated with an excimer laser (λ = 308 nm) to crystallize amorphous silicon, laser light is transmitted through the portion to be bonded. The temperature of the surface of the glass 19 does not rise to the vicinity of the melting point of amorphous silicon, and thermal damage can be avoided.

  After the amorphous silicon is polycrystallized by laser irradiation, the polycrystal silicon film 23 is patterned into a transistor shape by photolithography and dry etching.

  Next, as shown in FIG. 8C, a TEOS film is deposited by about 100 nm by plasma CVD, and a gate insulating film 24 is formed. Further, a gate electrode material is formed and patterned by photolithography to form the gate electrode 34. As the gate electrode material, for example, a two-layer structure of W / TiTa is used.

  Next, as shown in FIG. 8D, after implanting impurities into the source / drain portions of the polycrystalline silicon by an ion doping method or the like, a TEOS film is deposited by a plasma CVD method to about 100 to 400 nm to form an insulating film. 25 is formed. Furthermore, by forming alignment markers 26 and 26 for alignment with the positioning substrate 2, the bonded substrate 18a is completed.

  Next, a method of attaching the semiconductor circuit member 10 (or 10- (1)) manufactured by the above manufacturing method and the bonding substrate 18a will be described.

  First, the transistor is turned upward so that the back side (single crystal Si substrate 12 side) of the semiconductor circuit member 10 (or 10- (1)) shown in FIG. 6 is imaged by the imaging unit of the first sensor unit 7a. A case where the formed surface side is disposed downward so as to be in contact with the positioning substrate 2 will be described. Here, since the transistor formation surface side of the semiconductor circuit member 10 is affixed to the bonding substrate 18a, when the positioning method of this embodiment is used, the semiconductor circuit member 10 (or 10) positioned on the positioning substrate 2 is used. -It is necessary to transfer and fix (1)) to another board (hereinafter referred to as an auxiliary board).

  Therefore, the configuration of the auxiliary substrate, the transfer fixing of the positioned semiconductor circuit member 10 (or 10- (1)) to the auxiliary substrate, the semiconductor circuit member 10 (or 10- (1)) and the bonding substrate 18a are described below. The pasting will be described.

(Transfer fixing to auxiliary board)
An example of an auxiliary substrate that can be used in this embodiment will be described with reference to FIGS. Note that the present invention is not limited to this.

  As shown in FIGS. 9A to 9C, the auxiliary substrate 27 is configured to be able to suck the semiconductor circuit member 10 (or 10- (1)) by vacuum suction. In addition to this configuration, for example, a configuration may be employed in which the semiconductor circuit member 10 (or 10- (1)) is bonded by applying or laminating an adhesive to the surface of the auxiliary substrate 27. As the adhesive, a heat peelable resin or a light peelable resin can be used. As shown in FIG. 9, groove-shaped alignment marks 28 and 28 having a depth of about 100 to 300 nm are formed on the auxiliary substrate 27.

  As shown in FIG. 9A, a plurality of semiconductor circuit members 10 (or 10- (1)) positioned on the positioning substrate 2 are moved to the auxiliary substrate 27 in a lump while maintaining their relative positions. The positioning substrate 2 and the auxiliary substrate 27 are aligned using the alignment marks 28 and 28 of the auxiliary substrate 27 and the alignment marks 30 and 30 of the positioning substrate 2 so that they can be changed. The alignment between the positioning substrate 2 and the auxiliary substrate 27 is not always necessary and can be omitted. If only the relative position of the semiconductor circuit member 10 (or 10- (1)) positioned on the positioning substrate 2 is properly transferred to the auxiliary substrate 27, in the final bonding step with the bonding substrate 18a, By aligning the alignment markers on the surface side of a certain semiconductor circuit member 10 (or 10- (1)) with the alignment markers on the bonding substrate 18a, the attachment positions of other semiconductor circuit members 10 are inevitably determined. Because. In this case, even when the attaching method via the auxiliary substrate 27 is used as described above, time-consuming alignment is only required once, so that the throughput is not lowered.

  Next, as shown in FIG. 9B, the positioning substrate 2 and the auxiliary substrate 27 are brought into close contact with each other, and the semiconductor circuit member 10 (or 10- (1)) on the positioning substrate 2 is vacuum-adsorbed to the auxiliary substrate 27. Then, the semiconductor circuit member 10 (or 10- (1)) is collectively transferred to the auxiliary substrate 27 by separating the vacuum chuck of the positioning substrate 2.

  Next, as shown in FIG. 9C, the auxiliary substrate 27 is inverted, and the protective film 17 on the surface of the plurality of semiconductor circuit members 10 is removed in a lump by removing and cleaning each auxiliary substrate 27. When the protective film 17 is formed of a thin metal film or the like, the protective film 17 is dissolved by being immersed in an acid-based etching solution or the like. In the case of the semiconductor circuit member 10- (1) in which the contact member is formed, the protective film 17 is obtained by performing ashing processing for each auxiliary substrate 27 to remove the contact member at a time, and subsequently performing a peeling cleaning process. Remove all at once. Alternatively, by dissolving the protective film 17 made of a metal film with an acid-based etching solution or the like, the contact member 45 formed thereon is lifted off together and removed at once.

  In this way, a state is obtained in which the plurality of semiconductor circuit members 10 (or 10- (1)) are transfer-fixed (transferred) to the auxiliary substrate 27 with the surface thereof protruding.

  On the other hand, the front surface side (surface side on which the transistor is formed) of the semiconductor circuit member 10 shown in FIG. 6 faces upward so that the imaging portion of the first sensor portion 7a is imaged, and the back surface side (single crystal Si substrate side) ) Is disposed so as to be in contact with the positioning substrate 2, the semiconductor surface side faces upward, so that the step of transfer fixing to the auxiliary substrate is not necessary, and the semiconductor circuit member 10 positioned on the positioning substrate is not required. If the protective film 17 on the surface is removed by a peeling cleaning process or the like, it can be directly bonded to the bonding substrate, and the process can be simplified.

  Also in this case, a contact member may be further provided on the back surface side of the semiconductor circuit member 10 as in the case described above. For example, as shown in FIG. 21B, in addition to the configuration of the semiconductor circuit member 10 described in FIG. 6, a semiconductor circuit member 10- (2) in which a contact member 45 is provided on the back surface of the semiconductor substrate may be used. Good. By adopting such a structure, the semiconductor circuit member 10- (2) can be positioned with higher accuracy than the positioning when the contact member is not provided.

(Affixing to bonded substrate)
As shown in FIGS. 10A and 10B, the surface of the insulating film 15 of the semiconductor circuit member 10 bonded onto the auxiliary substrate 27 and the surface of the insulating film 25 of the bonding substrate 18a are respectively mixed with ammonia water and excess water. Wash with a mixed solution of hydrogen oxide water and pure water (SC1 solution). By this treatment, OH groups adhere to the surfaces of the insulating film 15 and the insulating film 25 and become active for bonding. For example, instead of surface activation by SC1 cleaning, the surface may be activated by exposure to oxygen plasma.

  Next, as shown in FIG. 11A, the plurality of semiconductor circuit members 10 transfer-fixed on the auxiliary substrate 27 are attached to the bonding substrate 18a all together while maintaining the relative positions. Using the alignment marks 28 and 28 and the alignment marks 26 and 26, the auxiliary substrate 27 and the bonding substrate 18a are aligned.

  Next, the semiconductor circuit member 10 on the auxiliary substrate 27 is brought into contact with the bonding substrate 18a and pressed with a slight force. Bonding proceeds by the self-bonding force generated as a result of the surface treatment, and the semiconductor circuit member 10 is bonded (bonded) to the bonding substrate 18a.

  Next, as shown in FIG. 11B, the auxiliary substrate 27 is switched from vacuum suction to exhaust, and the semiconductor circuit member 10 is released from the auxiliary substrate 27.

  When the semiconductor circuit member 10 is disposed so that the front surface side (the surface on which the transistor is formed) faces upward and the back surface side (the single crystal Si substrate side) contacts the positioning substrate 2, the bonding substrate In the pasting step (FIGS. 10 to 11), the same processing (SC1 processing to bonding to vacuum suction release) may be performed on the assumption that the positioning substrate 2 corresponds to the auxiliary substrate 27.

  Next, as shown in FIG. 12, a TEOS film is deposited on the bonding substrate 18a to which the semiconductor circuit member 10 is bonded by a plasma CVD method to about 200 to 600 nm to form an interlayer insulating film 32 for reducing the step.

  Next, as shown in FIG. 13, the single-crystal Si substrate 12 is peeled from the hydrogen ion implanted layer 16 of the semiconductor circuit member 10 by performing a heat treatment at about 600 ° C. on the bonding substrate 18 a to which the semiconductor circuit member 10 is bonded. To do. Thereby, the front side portion of the semiconductor circuit member 10 on which the device is formed is transferred to the bonding substrate 18a, while the back side portion of the peeled semiconductor circuit member 10 is excluded as the unnecessary portion 10a. In the present embodiment, even after the semiconductor circuit member 10 is transferred to the bonding substrate 18a, the bonding substrate 18a is referred to as a bonding substrate.

  Finally, a process after the semiconductor circuit member 10 is transferred to the bonding substrate 18a having a polycrystalline Si device will be described.

  As shown in FIG. 14A, the entire surface of the bonding substrate 18a is dry-etched to thin the transferred semiconductor circuit member 10 to about 100 to 200 nm. Next, the bonding substrate 18a is subjected to heat treatment at about 600 to 650 ° C. for about 4 hours for the purpose of activating the doped impurities and recovering defects of the transferred silicon device. Further, as shown in FIG. 14B, the SiNx film is deposited to about 100 to 300 nm and the TEOS film 63 is deposited to about 400 to 1000 nm as the interlayer insulating film 36 by plasma CVD.

  Next, as shown in FIG. 15A, a contact hole 37 in the wiring portion of the single crystal Si device and the polycrystalline Si device is opened by photolithography. Subsequently, the metal film is sputtered and patterned to form a metal wiring 38. As a result, the transferred single crystal Si device composed of the semiconductor circuit member 10 and the polycrystalline Si device on the bonding substrate 18a are electrically connected to complete the hybrid device.

  Then, as shown in FIG. 15B, after bonding the bonding substrate 18a and the counter substrate 90, after injecting the liquid crystal 100 therebetween, the bonding substrate 18a is divided into a plurality of panels 40b, for example, A semiconductor device 50 is completed, which includes a polycrystalline silicon device for switching pixels and a single-crystal Si device serving as a driver IC for a scanning signal line driving circuit and a data signal line driving circuit in one liquid crystal display panel.

  The semiconductor device 50 can be manufactured through the steps as described above. That is, the manufacturing method of the semiconductor device 50 is manufactured by attaching the semiconductor circuit member 10 positioned by using the above-described positioning method, so that the highly accurate semiconductor device 50 can be manufactured. Further, since the semiconductor circuit member 10 can be positioned more quickly than in the prior art, the throughput can be improved by using the manufacturing method of the semiconductor device 50 of the present embodiment.

[Embodiment 2]
Another embodiment according to the present invention will be described below with reference to FIGS. In this embodiment, in order to explain the difference from the first embodiment, for the sake of convenience of explanation, members having the same functions as those described in the first embodiment are denoted by the same member numbers, and Description is omitted.

  FIG. 16 is a cross-sectional view showing the configuration of the positioning device 1 ′ of this embodiment. A positioning device 1 ′ shown in FIG. 16 includes a second magnetic body 40 and an adjusting means 41 in place of the through hole 9 and the airflow generation device 4 provided in the positioning device 1 described in the first embodiment. Yes. Furthermore, instead of the first sensor unit 7a provided in the positioning device 1 described in the first embodiment, a laser displacement meter is used as the first sensor unit 7a 'in this embodiment.

  In the present embodiment, in addition to the configuration of the semiconductor circuit member 10 described in the first embodiment, a first magnetic body 42 corresponding to the second magnetic body 40 is provided as shown in FIG. is necessary.

  The second magnetic body 40 provided in the positioning device 1 ′ forms an attractive force with the first magnetic body 42 of the semiconductor circuit member so that the semiconductor circuit member is not in contact with the positioning substrate 2 ′. On the contrary, by forming a repulsive force, the semiconductor circuit member positioned by the positioning stopper 3 can be temporarily fixed to the positioning substrate 2 ′.

  The said 2nd magnetic body 40 can be comprised from a magnetic thin film or a magnetic film, for example. Further, the second magnetic body 40 is connected to the adjusting means 41.

  The adjusting means 41 is provided for switching (adjusting) the attractive force or repulsive force formed between the second magnetic body 40 and the first magnetic body 42. It is configured to switch by adjusting. The adjusting means 41 is connected to the control means 8 and is configured to receive control of the control means 8. The adjustment of the second magnetic body 40 by the adjusting means 41 and the control of the adjusting means 41 by the control means 8 will be described later.

  The first sensor portion 7a 'is configured to detect the position of the semiconductor circuit member in a two-dimensional direction along the surface of the positioning substrate 2'. In the present embodiment, a case where a laser displacement meter (hereinafter referred to as a first sensor unit 7a ') is used as the first sensor unit 7a' will be described.

  The first sensor portion 7a 'is composed of a laser light source and light receiving means, and is provided so as to correspond to each of the positioning stoppers 3 as shown in FIG. The first sensor portion 7a 'is connected to the control means 8 so that a detection signal for detecting the position of the semiconductor circuit member 10' can be transmitted to the control means 8.

  Hereinafter, the specific arrangement position of the first sensor unit 7a 'and the principle of the first sensor unit 7a' will be described with reference to FIGS. 18A and 18B.

  18 (a) and 18 (b) show the positioning stopper 3 provided on the positioning substrate 2 ′ and the semiconductor circuit member to be positioned, and the arrangement position of the first sensor portion 7a ′. FIG. 18A and 18B, only the positioning substrate 2 ', the positioning stopper 3, the semiconductor circuit member 10', and the first sensor portion 7a 'are shown for convenience of explanation.

As shown in FIG. 18A, when the semiconductor circuit member 10 ′ is not accurately positioned by the positioning stopper 3, the first sensor portion 7a ′ is moved from the first sensor portion 7a ′ to the positioning substrate 2 ′. The height h ₀ up to the surface (assumed to be set to zero) is detected. On the other hand, as shown in FIG. 18B, when the semiconductor circuit member is accurately positioned on the positioning stopper 3, the first sensor portion 7a ′ has a height h _{1 of the} semiconductor circuit member (of the semiconductor circuit member 10 ′). (Corresponding to the thickness).

  By providing the first sensor portion 7a 'based on the above principle so as to correspond to each positioning stopper 3, the position of the semiconductor circuit member 10' can be detected in the two-dimensional direction.

  In the present embodiment, three first sensor portions 7a ′ are provided for each positioning stopper 3, and as shown in FIGS. 18A and 18B, on the surface of the positioning substrate 2 ′. The L-shaped positioning stopper 3 is configured to irradiate laser light to the corners and regions close to both ends. With this arrangement, the position of the semiconductor circuit member 10 'in the two-dimensional direction can be detected efficiently and accurately. However, the present invention is not limited to this number, and may be set as appropriate according to the shape of the positioning stopper 3.

  Next, the semiconductor circuit member 10 ′ provided with the first magnetic body 42 used in the present embodiment will be described.

(Semiconductor circuit members)
FIG. 17A is a cross-sectional view showing the configuration of the semiconductor circuit member 10 ′ of the present embodiment. The semiconductor circuit member 10 ′ is provided with a first magnetic body 42 in addition to the configuration of the semiconductor circuit member 10 described in the first embodiment. In the following description, the semiconductor circuit member at the time when the first magnetic body 42 is not formed is also referred to as a semiconductor circuit member.

  The manufacturing method of the semiconductor circuit member 10 ′ including the first magnetic body 42 can be manufactured based on the manufacturing method of the semiconductor circuit member 10 described in the first embodiment. First, as shown in FIG. 19A, a gate oxide film 13, a gate electrode 14, an interlayer insulating film 15, hydrogen ions are formed on a single crystal silicon wafer having a diameter of about 6 inches (about 15 cm) or 8 inches (about 20 cm). An injection layer 16 is formed to produce a single crystal silicon wafer 10a ′. Since a method for manufacturing each film including the gate oxide film 13 has already been described in the first embodiment, description thereof is omitted here. Subsequently, as shown in FIG. 19B, an Nd—Fe—B system or R—Fe is formed on the surface side (transistor formation surface side) of the single crystal silicon wafer 10a ′ by using a sputtering method or a laser ablation method. A first magnetic body 42 is formed by forming a -B-based magnetic thin film. Further, the protective film 17 may be applied on the first magnetic body 42.

  Finally, as shown in FIG. 19C, the single crystal silicon wafer 10a 'is divided in the same manner as in the first embodiment, and the chip-shaped semiconductor circuit member 10' is manufactured.

  More desirably, the semiconductor circuit member 10 ′ may be provided with a contact member. Specifically, as shown in FIG. 23A, in addition to the configuration of the semiconductor circuit member 10 ′ described in FIG. 17A, a semiconductor circuit in which a contact member 45 ′ is provided on the surface of the semiconductor substrate. The member 10 ′-(1) may be used.

  The contact member 45 ′ can be made of a photosensitive resin such as a resist or a dry film resist. Or you may comprise from the photosensitive resin containing a magnetic body.

  By providing the contact member 45 ′, when the semiconductor circuit member 10 ′-(1) is detected to be positioned on the positioning stopper 3 and is temporarily fixed to the positioning substrate 2, the semiconductor circuit member 10 ′. The part other than the contact member 45 ′ in (1) can be prevented from contacting the positioning substrate 2 and the positioning stopper 3. As a result, the portions other than the contact member 45 'of the semiconductor circuit member 10'-(1) can be positioned without damaging the semiconductor circuit member 10 '.

  As a method of manufacturing the semiconductor circuit member 10 ′-(1) in which the contact member 45 is formed, the method described in the first embodiment is similar to the method already described in the first embodiment, after the step of FIG. Resin is applied or laminated, and the photosensitive resin is formed by photolithography on the basis of the position of the semiconductor circuit device formed on the front side of the single crystal silicon wafer 10a ′ so that the semiconductor circuit member 10 ′ after the division can be positioned with high accuracy. Then, the contact member 45 is formed by exposure and development (FIG. 24A). Finally, as shown in FIG. 24B, the single-crystal silicon wafer 10a 'is divided to form a chip-like semiconductor circuit member 10'-(1).

  Next, the positioning method in this embodiment is demonstrated. 20A to 20E are explanatory diagrams for explaining the positioning method of the present embodiment. 20 (a) to 20 (e) include a part in which wiring for connecting members is omitted.

  First, the semiconductor circuit member 10 'is placed on the positioning substrate 2, and a repulsive force is formed between the second magnetic body 40 of the positioning substrate 2 and the first magnetic body 42 of the semiconductor circuit member 10'. As described above, the second magnetic body 40 is adjusted by the adjusting means 41. As a result, as shown in FIG. 20A, the semiconductor circuit member 10 'is not in contact with the surface of the positioning substrate 2'. In this state, by tilting the positioning substrate 2 using the tilting means 5, a plurality of semiconductor circuit members 10 ′ can be moved by their own weights as shown in FIG. 20B (moving step). . The airflow generation device 4 and the tilting means 5 described above are controlled by the control means.

  As shown in FIG. 20B, the position of each semiconductor circuit member 10 ′ during movement can be detected by the first sensor portion 7a ′ and the second sensor portion 7b provided in each positioning stopper 3. (Detection process). In the first sensor unit 7a ′, the position of the semiconductor circuit member 10 ′ in the two-dimensional direction along the surface of the positioning substrate 2 ′ can be detected by the method described above, and the second sensor unit 7b can detect the position of the positioning substrate 2 ′. It is possible to detect the position of the semiconductor circuit member 10 ′ in the direction perpendicular to the surface of the semiconductor circuit.

  Detection signals from the first sensor portion 7a 'and the second sensor portion 7b of each semiconductor circuit member 10' are sent to the control means 8, respectively.

  Positioning stoppers as shown on the left side of FIG. 20B among the plurality of semiconductor circuit members 10 ′ by the first sensor portion 7a ′ and the second sensor portion 7b provided so as to correspond to the respective semiconductor circuit members 10. 3 is sent to the control means 8, the control means 8 controls the adjustment means 41 and the second magnetic body corresponding to the positioned semiconductor circuit member 10 ′. 40 is controlled to form an attractive force with the first magnetic body 42. Further, the control means 8 controls the tilting means so as to return the positioning substrate 2 'to the horizontal.

  As a result, the semiconductor circuit member 10 ′ accurately positioned by the positioning stopper 3 is temporarily fixed to the positioning substrate 2 as shown on the left side of FIG. 20C (fixing step).

  On the other hand, in the state where the positioning substrate 2 is returned to the horizontal position (FIG. 20C), the semiconductor circuit member 10 ′ detected as not being positioned by the positioning stopper 3 (right side of FIGS. 20B and 20C). On the other hand, the control means 8 controls again the adjustment means 41 corresponding to the semiconductor circuit member 10 ′ so that a repulsive force is formed between the second magnetic body 40 and the first magnetic body 42. The semiconductor circuit member 10 ′ is adjusted to a non-contact state again with respect to the surface of the positioning substrate 2 ′. Then, as shown in FIG. 5 (d), the control unit 8 controls the tilting unit 5 to tilt the positioning substrate 2 'again and tries to position the semiconductor circuit member 10'.

  When it is detected that the semiconductor circuit member 10 ′ is accurately positioned on the positioning stopper 3 by the corresponding first sensor portion 7a ′ and second sensor portion 7b, FIGS. It can be temporarily fixed to the positioning substrate 2 through the same process as the semiconductor circuit member 10 on the left side of d).

Moreover, based on the detection result of the 2nd sensor part 7b, the control means 8 can control the adjustment means 41 in the middle of forming the repulsive force, and can adjust the magnetic force. Thereby, switching from repulsive force to attractive force can be performed in stages. Therefore, it is possible to avoid the collision of the semiconductor circuit member 10 ′ to the positioning stopper 3 and the positioning substrate 2 ′ due to rapid switching, and the damage due to the collision. As described above, according to the positioning method of the present embodiment, The semiconductor circuit member 10 ′ can be operated and temporarily fixed on the positioning substrate 2 ′ by forming an attractive force and a repulsive force between the second magnetic body 40 and the first magnetic body 42.

  Thus, since the semiconductor circuit member 10 ′ can be positioned on the positioning substrate 2 ′ in a non-contact state, all the semiconductor circuit members can be positioned satisfactorily without generation of damage or dust.

  Further, in this embodiment, since the semiconductor circuit member 10 ′ is moved using magnetic force (attraction and repulsion), the frequency and amplitude due to the resonance phenomenon as in the case of the vibration used for the movement of the electronic component in the prior art is increased. Fluctuation does not occur. Therefore, it is possible to stably move the semiconductor circuit member 10 'over the surface on the positioning substrate 2'. Therefore, the number of the semiconductor circuit members 10 'is increased and the size of the positioning substrate 2' is increased. Even if this becomes large, it is easy to position them collectively.

  The semiconductor circuit member 10 ′ positioned on the positioning substrate 2 ′ by the positioning method and positioning device described above is attached to a bonding substrate on which a circuit or the like is formed by the following steps to manufacture a semiconductor device.

  Next, a method for attaching the semiconductor circuit member 10 ′ (or 10 ′-(1)) manufactured by the above manufacturing method and the bonding substrate 18 a will be described.

  In the semiconductor circuit member 10 ′ (or 10 ′-(1)) as shown in FIG. 17A (or FIG. 23A), the back surface side (single crystal Si substrate 12 side) is the first sensor portion 7a. The surface of the transistor and the first magnetic body 42 formed thereon is arranged downward so as to be in contact with the positioning substrate 2 so as to be picked up by the image pickup portion '. Therefore, since the transistor formation surface side of the semiconductor circuit member 10 is affixed to the bonding substrate 18a, when the positioning method of this embodiment is used, the method is the same as the method described in Embodiment 1 above. It is necessary to transfer-fix the semiconductor circuit member 10 '(or 10'-(1)) positioned on the positioning substrate 2 to the auxiliary substrate. That is, in the steps of FIGS. 9A to 9C, the part of the positioning device 1 using vacuum suction is simply replaced with the positioning device 1 ′ using magnetic force, and the rest is processed in the same way. Then, it is transferred to the auxiliary substrate 27 at once.

  After the transfer to the auxiliary substrate 27 in a lump, when the abutment member 45 ′ is provided (10 ′-(1)), the abutment member 45 is lump in a lump by immersing it in an alkaline stripping solution. Remove. Subsequently, the protective film 17 on the surface of the semiconductor circuit member 10 ′ (or 10 ′-(1)) is removed at a time by performing ashing processing and peeling cleaning processing for each auxiliary substrate 27. When the protective film 17 is formed of a thin metal film or the like, the protective film 17 may be dissolved by immersing it in an acid-based etching solution, and the contact member 45 may be lifted off and simultaneously removed. This method is advantageous in that the contact member 45 can be removed at the same time, so that the degree of freedom in selecting the material of the contact member 45 can be expanded and the process can be simplified.

Finally, the first magnetic body 42 is removed by reactive etching, wet etching, or the like. In this manner, a state is obtained in which the plurality of semiconductor circuit members 10 ′ (or 10 ′-(1)) are transfer-fixed (transferred) to the auxiliary substrate 27 with the surface thereof protruding. Since the subsequent pasting method is the same as that of the first embodiment, the description thereof is omitted.

In the present embodiment, as shown in FIG. 17A, the first magnetic body 42 is formed on the surface side (transistor formation surface side) of the semiconductor circuit member 10 ′, but the present invention is not limited to this. Instead, the first magnetic body 42 can also be formed on the back surface side (single crystal Si substrate side) of the semiconductor circuit member as shown in FIG. In this case, the front surface side (transistor forming surface side) of the semiconductor circuit member 10 ′ is directed upward so that the imaging portion of the first sensor portion 7 a is imaged, and the back surface side (single crystal Si substrate side) is the positioning substrate. 2 is placed downward to contact 2. Therefore, since the semiconductor surface side is facing upward, the step of transfer fixing to the auxiliary substrate is not necessary, and if the protective film 17 on the surface of the semiconductor circuit member 10 ′ positioned on the positioning substrate is removed by the peeling cleaning process, It can be directly bonded to the bonding substrate, and the process can be simplified.

  The first magnetic body 42 remaining on the back side of the semiconductor circuit member 10 ′ is removed by reactive etching, wet etching, or the like after being bonded to the bonding substrate. Alternatively, the single crystal Si substrate 12 is peeled off from the hydrogen ion implanted layer 16 of the semiconductor circuit member 10 ′ by the heat treatment after bonding without being removed by etching after bonding, and is removed by lifting off together.

  Even in the case of the semiconductor circuit member 10 ′ shown in FIG. 17B, it is more preferable that the semiconductor circuit member 10 ′ further contacts the back surface side of the semiconductor circuit member 10 as shown in FIG. A member 45 may be provided. By adopting such a structure, the semiconductor circuit member 10 '-(2) can be positioned with higher accuracy than in the case of alignment without providing the contact member. In this case, after the protective film 17 on the front surface side is removed with a stripping solution and bonded to the bonding substrate, the contact member 45 on the back surface side of the semiconductor circuit member is removed together with the bonding substrate by ashing treatment such as oxygen plasma. The first magnetic body 42 may be removed by reactive etching, wet etching, or the like. However, since the single crystal Si substrate 12 is peeled off from the hydrogen ion implanted layer 16 on the back side of the single crystal Si on which the first magnetic body 42 is formed by the heat treatment after bonding, the first magnetic body 42 is not necessarily removed in advance. do not have to.

  Since the subsequent steps are the same as those in the first embodiment, description thereof is omitted.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and obtained by appropriately combining technical means disclosed in different embodiments. Such embodiments are also included in the technical scope of the present invention.

  In addition, this invention can also be paraphrased as follows. Specifically, in an apparatus that collectively positions a plurality of semiconductor components at a predetermined position on a substrate, only a sensor that senses the position of the semiconductor component and a semiconductor component at an arbitrary location is levitated based on the result of the sensor. In other words, it is a semiconductor component positioning, inspection, and correction device characterized in that it has a control mechanism for moving or lowering and can correct the positioning of the semiconductor component at an arbitrary place.

  Further, in the above, it can be said that the semiconductor device is a positioning, inspection, and correction device according to claim 1, wherein the semiconductor component is floated, moved, or lowered by fluid force or magnetic force.

  The positioning method and positioning device of the present invention detect the positions of a plurality of semiconductor circuit members, change the correspondence between the positioned semiconductor circuit members and the unpositioned semiconductor circuit members according to the detection results, and perform positioning. The formed semiconductor circuit member is temporarily fixed to the substrate, and the semiconductor circuit member that is not positioned therebetween can be positioned again. Furthermore, since the semiconductor circuit member is not in contact with the substrate during positioning, damage to the semiconductor circuit member and generation of dust can be significantly reduced.

  Therefore, batch positioning of semiconductor chips used in the semiconductor device can be performed with high accuracy and speed. The positioning method and positioning apparatus of the present invention can be applied to alignment, positioning, and batch operation processing of electronic components and biochips in addition to batch positioning of semiconductor chips.

It is sectional drawing which shows the structure of the positioning device which concerns on one Embodiment of this invention. It is the perspective view shown about the structure on the board | substrate for a positioning in the positioning apparatus shown in FIG. It is the perspective view which showed the other structure of the positioning stopper provided in the positioning apparatus shown in FIG. (A) And (b) is the figure explaining the detection principle of the 1st sensor part provided in the positioning apparatus shown in FIG. (A)-(e) is sectional drawing which each showed the process of positioning a semiconductor circuit member using the positioning device shown in FIG. It is sectional drawing which showed the structure of the semiconductor circuit member positioned by the positioning apparatus shown in FIG. (A)-(c) is the perspective view which showed the manufacturing process of the semiconductor circuit member shown in FIG. It is sectional drawing which showed the manufacture process of the bonded substrate which can be used in the manufacturing method of the semiconductor device which concerns on this invention. (A)-(c) is sectional drawing which showed the process in which the semiconductor circuit member positioned by the positioning device is transfer-fixed to an auxiliary substrate in the manufacturing method of the semiconductor device which concerns on this invention. (A) is sectional drawing which shows the process of activating the surface of the semiconductor circuit member fixed to the auxiliary substrate, (b) is sectional drawing which shows the process of activating the surface of a joining board | substrate. (A) is sectional drawing which shows the process of joining the semiconductor circuit member fixed to the auxiliary | assistant board | substrate to a joining board | substrate, (b) is a cross section which shows the process of peeling an auxiliary | assistant board | substrate from the semiconductor circuit member joined to the joining board | substrate. FIG. It is sectional drawing which shows the structure of the joining board | substrate carrying a polycrystalline silicon device after joining a semiconductor circuit member. FIG. 13 is a cross-sectional view illustrating a process of peeling a single crystal silicon film by heat treatment of a semiconductor circuit member bonded to a bonding substrate in the process illustrated in FIG. 12. (A) And (b) is sectional drawing which shows the process of forming a wiring pattern in the joining board | substrate with which the semiconductor circuit member was mounted in the manufacturing method of a semiconductor device. (A) And (b) is sectional drawing which shows the process of the continuation of FIG.14 (b). It is sectional drawing which showed the structure of the positioning device which concerns on other embodiment of this invention. (A) And (b) is sectional drawing which showed the structure of the semiconductor circuit member positioned by the positioning apparatus shown in FIG. (A) And (b) is the figure explaining the detection principle of the 1st sensor part provided in the positioning device shown in FIG. (A)-(c) is the perspective view which showed the manufacturing process of the semiconductor circuit member shown to Fig.17 (a). (A)-(e) is sectional drawing which each showed the process of positioning a semiconductor circuit member using the positioning device shown in FIG. (A) And (b) is sectional drawing which showed the other structure of the semiconductor circuit member positioned by the positioning apparatus shown in FIG. (A)-(c) is the perspective view which showed the manufacturing process of the semiconductor circuit member shown to Fig.21 (a). (A) And (b) is sectional drawing which showed the other structure of the semiconductor circuit member positioned by the positioning apparatus shown in FIG. (A) And (b) is the perspective view which showed the manufacturing process of the semiconductor circuit member shown to Fig.23 (a).

Explanation of symbols

1, 1 'positioning device 2, 2' positioning substrate (substrate)
3 Positioning stopper (positioning part)
4 Airflow generator (operating means)
5 Inclination means (operation means)
6 Operation means 7 Sensor (detection means)
7a, 7a '1st sensor part (1st detection part)
7a-1 Imaging unit 7a-2 Display unit 7b Second sensor unit (second detection unit)
8 Control means 9 Through hole 10, 10- (1), 10- (2) Semiconductor circuit member (article)
10 ', 10'-(1), 10 '-(2) Semiconductor circuit member (article)
40 Second magnetic body (operation means)
41 Adjustment means (operation means)
42 1st magnetic body (operation means)
45, 45 'contact member 50 semiconductor device

Claims (20)

An article positioning method for positioning a plurality of articles respectively on a plurality of positioning portions provided on a positioning substrate,
The article is moved in a non-contact state with respect to the surface of the positioning substrate, and the position of the article among the plurality of articles is detected by detecting the position of the article with respect to the positioning portion. A positioning method characterized by temporarily fixing an article that has not been positioned to a working substrate and moving the article again in the non-contact state. An article positioning method for positioning a plurality of articles respectively on a plurality of positioning portions provided on a positioning substrate,
A moving step of moving the article in a non-contact state with respect to the surface of the positioning substrate;
A detection step of detecting the position of the article with respect to the positioning portion;
A fixing step of temporarily fixing the article detected to be positioned on the positioning portion by the detection step to the positioning substrate;
The moving step, the detecting step, and the fixing step are performed independently for each of the plurality of articles,
The article positioning method, wherein the moving step and the detecting step are performed again on the article that has been detected by the detecting step as not being positioned by the positioning portion.   The article is brought into the non-contact state by using the pressure of gas discharged from the surface of the positioning substrate, and is moved using its own weight by inclining the positioning substrate. The positioning method according to claim 1 or 2.   The non-contact state is formed by forming a repulsive force between the article and the positioning substrate, and the article is moved using its own weight by inclining the positioning substrate. 3. The positioning method according to 1 or 2.   The position of the article with respect to the positioning part is detected in a two-dimensional direction along the surface of the positioning substrate and in a direction perpendicular to the surface of the positioning substrate. 5. The positioning method according to any one of 1 to 4.   6. The positioning method according to claim 5, wherein the position of the article in the two-dimensional direction is detected by imaging the article and the positioning unit using an image display unit including an imaging unit. .   6. The positioning method according to claim 5, wherein the position of the article in the two-dimensional direction is detected using a laser beam.   The positioning method according to claim 1, further comprising a step of collectively bonding the plurality of articles temporarily fixed on the positioning substrate to the bonding substrate.   A positioning apparatus using the positioning method according to claim 1.   A method for manufacturing a semiconductor device, comprising the positioning method according to claim 1.   9. A semiconductor device manufacturing apparatus using the positioning method according to claim 1. A positioning device for positioning a plurality of articles on a substrate,
A positioning substrate provided with a plurality of positioning portions;
Operating means configured to move the article and temporarily fix the article to the positioning substrate;
Detecting means for detecting the position of the article with respect to the positioning unit;
Control means for controlling the operation means,
The operation means and the detection means are provided so as to correspond to each of the plurality of positioning portions,
The control means, based on the detection results of the detection means corresponding to the positioning portions, so as to temporarily fix the article positioned by the positioning portion among the plurality of articles to the positioning substrate. And a positioning device that controls the operation means corresponding to each positioning unit so that an article that has not been positioned by the positioning unit is moved again to be positioned by the positioning unit.   The positioning device according to claim 12, wherein the operation unit is configured to move the article in a non-contact state with respect to a surface of the positioning substrate.   The detection means detects a position of the article in a direction perpendicular to the surface of the positioning substrate and a first detection unit that detects the position of the article in a two-dimensional direction along the surface of the positioning substrate. The positioning device according to claim 12, further comprising a second detection unit. The positioning substrate is provided with a through hole,
The positioning device according to any one of claims 12 to 14, wherein the operating means is configured to discharge or suck gas to the surface of the positioning substrate through the through hole.   16. The article according to claim 12, further comprising an abutting member that abuts against the positioning substrate and the positioning portion when the article is temporarily fixed to the positioning substrate. The positioning device according to any one of the above. A first magnetic body is formed on the article,
The positioning device according to any one of claims 12 to 14, wherein the operating means is provided with a second magnetic body having an attractive force and a repulsive force with respect to the first magnetic body.   The positioning device according to claim 14, wherein the first detection unit is provided with an image display unit including an imaging unit.   The positioning device according to claim 14, wherein the first detection unit is a laser displacement meter.   An apparatus for manufacturing a semiconductor device, comprising the positioning device according to claim 12.

Images