JP4571525B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

  The present invention relates to a technique for supplying a processing liquid onto a substrate to be processed, and more particularly to a substrate processing technique for applying a processing liquid on a substrate by a spinless method.

  Recently, in a photolithography process in a flat panel display (FPD) manufacturing process, as a resist coating method that is advantageous for increasing the size of a substrate to be processed (for example, a glass substrate), a resist solution is applied to a substrate from a long resist nozzle. 2. Description of the Related Art A spinless method is widely used in which a resist solution is applied on a substrate with a desired film thickness without requiring a rotational movement by moving or scanning a resist nozzle while discharging it in a strip shape.

A conventional resist coating apparatus using a spinless method, for example, as described in Patent Document 1, is several hundred μm between a substrate that is fixedly mounted horizontally on a stage and a discharge port of a resist nozzle provided above the stage. The following minute gap is set, and the resist solution is ejected onto the substrate while moving the resist nozzle in the scanning direction (generally in the horizontal direction perpendicular to the longitudinal direction of the nozzle). This type of resist nozzle is configured such that a nozzle body is formed in a horizontally long or long shape, and a resist solution is discharged in a strip shape from a discharge port having a very small diameter (for example, about 100 μm). When the coating process by scanning with such a long resist nozzle is completed, the substrate is taken out of the stage by the transfer robot or the transfer arm and carried out of the apparatus. Immediately after that, a subsequent new substrate is carried into the apparatus by the transfer robot and placed on the stage. Then, the same coating process as described above is repeated on the new substrate by scanning the resist nozzle.
JP-A-10-156255

In the spinless type resist coating apparatus as described above, unless a processed substrate is unloaded or unloaded from the stage to completely empty the upper surface of the stage, a subsequent new substrate is loaded or placed on the stage. I can't. For this reason, the time required for scanning the resist nozzle (T _c ), the time required for loading or unloading an unprocessed substrate onto the stage (T _in ), and the unloading of the processed substrate from the stage the time required for the operation to be carried out (T _out) and the sum of the combined coating process one cycle of the required time _{(T c + T in + T} out) is as it is now in tact time, there is a problem that it is difficult to shorten the tact time.

The present invention has been made in view of the above-described problems of the prior art, and a substrate processing apparatus and a substrate processing for shortening the tact time of a processing operation for supplying or applying a processing liquid onto a substrate to be processed by a spinless method. It aims to provide a method .

Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of forming a coating film of a processing solution on a substrate to be processed with a uniform film thickness without coating unevenness in a levitation conveyance method. .

In order to achieve the above object, a substrate processing apparatus of the present invention has a first floating region having a smaller area than a substrate to be processed, and is substantially uniform on the substrate at each position in the first floating region. A stage that provides a high levitation force, a substrate transport unit that passes the first levitation region in a predetermined substrate transport direction in a state where the substrate is floated, and the substrate that is in the middle of passing through the first levitation region A processing liquid supply unit that performs an operation of supplying a processing liquid to the surface to be processed of the substrate while substantially covering the entire region, and the processing liquid supply unit is disposed in the first floating region. A long nozzle that discharges the processing liquid from above toward the surface to be processed of the substrate, a processing liquid supply source that sends the processing liquid to the long nozzle, and a first nozzle that starts discharging the processing liquid. A second nozzle that finishes discharging the processing liquid from the nozzle position of 1 And a nozzle moving section for moving the long-type nozzle while the process liquid supply operation to location in the opposite direction to the conveying direction.

In addition, the substrate processing method of the present invention includes a carrying-in area having a size larger than the substrate to be processed, a coating area having a size smaller than the substrate, and a carrying-out having a size larger than the substrate along the transport direction on the stage. The regions are set in a line in this order, and the substrate is floated by the pressure of the gas ejected from a large number of ejection ports provided on the upper surface of the stage. In the coating region, the substrate is substantially uniform at each position in the region. giving Do levitation force, substantially while covering the entire area, the treated surface of the substrate by using a long type nozzle of the substrate the coating region in the course of transporting the substrate from the carry-region to the unloading area A process of applying a processing liquid to the substrate is performed, and during the coating process, the position of the long nozzle that supplies the processing liquid to the surface to be processed of the substrate is moved from a predetermined position at the downstream end of the coating area. Upstream end Position to move at a first speed in a direction opposite to the conveying direction.

In the present invention, while the substrate passes through the first floating region (coating region) of the stage and covers almost the entire region, the processing liquid is applied to the processing surface of the substrate (coating processing). In addition, during the coating process, the processing liquid supply position (nozzle position) with respect to the surface to be processed of the substrate is moved from the downstream side to the upstream side in the transport direction. The flying height of the substrate being transferred is maintained at a set value in the first floating region (coating region), and a coating film of the processing liquid is formed on the substrate with a constant film thickness without causing coating unevenness. it can. In addition, an operation of unloading a substrate that has been processed on the downstream side (unloading region) across the first levitation region and a new substrate that is to be processed next on the upstream side (loading region) are placed on the stage. Since the operation of carrying in the battery can be performed independently or in parallel, the tact time can be shortened.

In a preferred aspect of the substrate processing apparatus of the present invention, the long nozzle of the processing liquid supply unit has a fine-diameter discharge port extending in the horizontal direction intersecting (for example, orthogonal to) the transport direction. The nozzle moving unit may move the long nozzle in a direction opposite to the transport direction from the first nozzle position to the second nozzle position at a relatively low constant speed. Preferably, the first nozzle position may be set near the end portion on the downstream side of the first floating region, and the second nozzle position may be set near the end portion on the upstream side of the first floating region. Also, preferably, may have a nozzle lifting part of the processing liquid supply unit moves up and down the long-type nozzle, and the substrate, for example, long-type nozzles in the first nozzle position from the height position of the upper for saving It may be lowered to a processing liquid discharge height position that forms a predetermined gap, and the long nozzle may be raised or retracted from the processing liquid discharge height position to an upper height position at the second nozzle position.
In a preferred aspect, the processing liquid supply unit starts the processing liquid supply operation in a state where the front end portion of the substrate is located near the end portion on the downstream side of the first floating region in the transport direction, and The processing liquid supply operation is finished in a state where the end portion is positioned near the end portion on the upstream side of the first floating region. In this case, the substrate transport unit preferably transports the substrate at a relatively high speed in the transport direction during execution of the processing liquid supply operation, and the front end of the substrate is the downstream end of the first floating region. When reaching a predetermined position in the vicinity, it is preferable to temporarily stop the substrate in order to start the processing liquid supply operation.

  Moreover, in the substrate processing apparatus of this invention, according to the suitable one aspect | mode, the jet port which ejects many gas provided in the 1st floating area | region of the stage, and the said jet in the 1st floating area | region of a stage A balance between a suction port for sucking in a large number of gases mixed with the outlet, and a vertically upward pressure applied from the ejection port to a substrate passing through the first floating region and a vertically downward pressure applied from the suction port And a levitation control unit for controlling.

  Furthermore, according to a preferred aspect, there is provided a second floating region for floating the substrate upstream of the first floating region in the stage conveyance direction, and loading for loading the substrate into the second floating region. Parts are provided. The flying height in the second flying region should be higher than the flying height in the first flying region. The carry-in unit moves up and down between a plurality of first lift pins for supporting the substrate with the tip of the pin at the carry-in position on the stage, and the lift pins between the original position below the stage and the forward movement position above the stage. And a first lift pin lifting / lowering section.

  According to a preferred aspect, there is provided a third levitation region for floating the substrate downstream of the first levitation region in the stage conveyance direction, and unloading for unloading the substrate to the third levitation region. Parts are provided. The flying height in the third flying region should be higher than the flying height in the first flying region. The carry-out unit moves up and down between a plurality of second lift pins for supporting the substrate with the tip of the pin at the carry-in position on the stage, and the lift pins between the original position below the stage and the forward movement position above the stage. And a second lift pin lifting / lowering section.

  According to a preferred aspect, the substrate transport unit has a guide rail disposed on one or both sides of the stage so as to extend in parallel with the moving direction of the substrate, a slider movable along the guide rail, A conveyance drive unit that drives the slider to move along the guide rail, and a holding unit that extends from the slider toward the center of the stage and holds the side edge of the substrate in a detachable manner.

According to the substrate processing apparatus or the substrate processing method of the present invention, the structure and operation as described above can not only shorten the tact time of the processing operation of supplying or applying the processing liquid onto the substrate to be processed by the spinless method, but also floating the substrate. In the transport method, a coating film of the treatment liquid can be formed on the substrate with a uniform film thickness without coating unevenness.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows a coating and developing processing system as a configuration example to which the substrate processing apparatus of the present invention can be applied. This coating / development processing system is installed in a clean room and uses, for example, an LCD substrate as a substrate to be processed, and performs cleaning, resist coating, pre-baking, development, and post-baking in the photolithography process in the LCD manufacturing process. is there. The exposure process is performed by an external exposure apparatus (not shown) installed adjacent to this system.

  This coating and developing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, and an interface unit (I / F) 14.

  A cassette station (C / S) 10 installed at one end of the system includes a cassette stage 16 on which a predetermined number, for example, four cassettes C for storing a plurality of substrates G can be placed, and a side on the cassette stage 16. And a transport path 17 provided in parallel with the arrangement direction of the cassette C, and a transport mechanism 20 that is movable on the transport path 17 and that allows the substrate C to be taken in and out of the cassette C on the stage 16. The transport mechanism 20 has a means for holding the substrate G, for example, a transport arm, can be operated with four axes of X, Y, Z, and θ, and is transported on the process station (P / S) 12 side described later. And the substrate G can be transferred.

  The process station (P / S) 12 includes, in order from the cassette station (C / S) 10 side, a cleaning process unit 22, a coating process unit 24, and a development process unit 26, a substrate relay unit 23, a chemical solution supply unit 25, and It is provided in a horizontal row via (spaced) the space 27.

  The cleaning process unit 22 includes two scrubber cleaning units (SCR) 28, an upper and lower ultraviolet irradiation / cooling unit (UV / COL) 30, a heating unit (HP) 32, and a cooling unit (COL) 34. Contains.

  The coating process unit 24 includes a spinless resist coating unit (CT) 40, a vacuum drying unit (VD) 42, an upper and lower two-stage adhesion / cooling unit (AD / COL) 46, and an upper and lower two-stage heating / cooling. A unit (HP / COL) 48 and a heating unit (HP) 50 are included.

  The development process unit 26 includes three development units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 53, and a heating unit (HP) 55.

  Conveying paths 36, 51, 58 are provided in the longitudinal direction at the center of each process unit 22, 24, 26, and the conveying devices 38, 54, 60 move along the conveying paths 36, 51, 58, respectively. Each unit in the process unit is accessed to carry in / out or carry the substrate G. In this system, in each process part 22, 24, 26, a liquid processing system unit (SCR, CT, DEV, etc.) is disposed on one side of the transport paths 36, 51, 58, and heat treatment is performed on the other side. System units (HP, COL, etc.) are arranged.

  The interface unit (I / F) 14 installed at the other end of the system is provided with an extension (substrate transfer unit) 56 and a buffer stage 57 on the side adjacent to the process station 12, and is transported to the side adjacent to the exposure apparatus. A mechanism 59 is provided. The transport mechanism 59 is movable on the transport path 19 extending in the Y direction, and is used to load and unload the substrate G with respect to the buffer stage 57, and to extend from the extension (substrate transfer unit) 56 and the adjacent exposure device. The substrate G is transferred.

FIG. 2 shows a processing procedure in this coating and developing processing system. First, in the cassette station (C / S) 10, the transport mechanism 20 takes out one substrate G from a predetermined cassette C on the stage 16 and transports it to the cleaning process unit 22 of the process station (P / S) 12. It is passed to the device 38 (step S1).

  In the cleaning process section 22, the substrate G is first sequentially carried into an ultraviolet irradiation / cooling unit (UV / COL) 30, subjected to dry cleaning by ultraviolet irradiation in the first ultraviolet irradiation unit (UV), and then subjected to the next cooling unit ( In COL), the temperature is cooled to a predetermined temperature (step S2). This UV cleaning mainly removes organic substances on the substrate surface.

  Next, the substrate G is subjected to a scrubbing cleaning process by one of the scrubber cleaning units (SCR) 28 to remove particulate dirt from the substrate surface (step S3). After the scrubbing cleaning, the substrate G is subjected to dehydration treatment by heating in the heating unit (HP) 32 (step S4), and then cooled to a constant substrate temperature by the cooling unit (COL) 34 (step S5). Thus, the pretreatment in the cleaning process unit 22 is completed, and the substrate G is transferred to the coating process unit 24 by the transfer device 38 via the substrate transfer unit 23.

  In the coating process unit 24, the substrate G is first sequentially loaded into an adhesion / cooling unit (AD / COL) 46, and undergoes a hydrophobic treatment (HMDS) in the first adhesion unit (AD) (step S6). The cooling unit (COL) cools to a constant substrate temperature (step S7).

  Thereafter, the substrate G is coated with a resist solution by a spinless method in a resist coating unit (CT) 40, and then subjected to a drying process by reduced pressure in a reduced pressure drying unit (VD) 42 (step S8).

  Next, the substrate G is sequentially carried into the heating / cooling unit (HP / COL) 48, and the first heating unit (HP) performs baking after coating (pre-baking) (step S9), and then the cooling unit ( COL) to cool to a constant substrate temperature (step S10). In addition, the heating unit (HP) 50 can also be used for baking after this application | coating.

  After the coating process, the substrate G is transported to the interface unit (I / F) 14 by the transport device 54 of the coating process unit 24 and the transport device 60 of the development process unit 26, and is passed from there to the exposure apparatus (step). S11). In the exposure apparatus, a predetermined circuit pattern is exposed on the resist on the substrate G. After the pattern exposure, the substrate G is returned from the exposure apparatus to the interface unit (I / F) 14. The transport mechanism 59 of the interface unit (I / F) 14 passes the substrate G received from the exposure apparatus to the development process unit 26 of the process station (P / S) 12 via the extension 56 (step S11).

  In the development process unit 26, the substrate G is subjected to development processing in any one of the development units (DEV) 52 (step S12), and then sequentially carried into one of the heating / cooling units (HP / COL) 53, Post baking is performed in the first heating unit (HP) (step S13), and then the substrate is cooled to a constant substrate temperature in the cooling unit (COL) (step S14). A heating unit (HP) 55 can also be used for this post-baking.

The substrate G that has undergone a series of processing in the development process section 26 is returned to the cassette station (C / S) 10 by the transfer devices 60, 54, and 38 in the process station (P / S) 12 . Is stored in one of the cassettes C (step S1).

  In this coating and developing system, the present invention can be applied to, for example, the resist coating unit (CT) 40 of the coating process unit 24. An embodiment in which the present invention is applied to a resist coating unit (CT) 40 will be described below with reference to FIGS.

  FIG. 3 shows the overall configuration of the resist coating unit (CT) 40 and the vacuum drying unit (VD) 42 in this embodiment.

As shown in FIG. 3, a resist coating unit (CT) 40 and a vacuum drying unit (VD) 42 are arranged in a horizontal row on the support base or support frame 70 in the X direction. New substrate G to be subjected to the coating process is carried into the resist coating unit (CT) 40 as indicated by the arrow F _A by a conveying device 54 of the transport path 51 side (FIG. 1). Substrate G after completion of the coating process in the resist coating unit (CT) 40 is a transfer arm 74 which is movable in the X direction is guided by the guide rails 72 on the support table 70, a vacuum drying unit as indicated by the arrow F _B (VD) 42. Substrate G having been subjected to the drying treatment in a vacuum drying unit (VD) 42 is drawn off as shown by the arrow F _C by the transfer device 54 of the transport path 51 side (FIG. 1).

  The resist coating unit (CT) 40 includes a stage 76 that extends long in the X direction, and is a long type that is disposed above the stage 76 while the substrate G is transported in the same direction on the stage 76. A resist solution is supplied onto the substrate G from the resist nozzle 78, and a resist coating film having a constant film thickness is formed on the upper surface (surface to be processed) of the substrate by a spinless method. The configuration and operation of each part in the unit (CT) 40 will be described in detail later.

  The vacuum drying unit (VD) 42 includes a tray or shallow container type lower chamber 80 having an open upper surface, and a lid-shaped upper chamber configured to be tightly fitted or fitted to the upper surface of the lower chamber 80. (Not shown). The lower chamber 80 is substantially rectangular, and a stage 82 for placing and supporting the substrate G horizontally is disposed at the center, and exhaust ports 83 are provided at the four corners of the bottom surface. Each exhaust port 83 communicates with a vacuum pump (not shown) through an exhaust pipe (not shown). With the lower chamber 80 covered with the upper chamber, the sealed processing space in both chambers can be depressurized to a predetermined degree of vacuum by the vacuum pump.

  4 and 5 show a more detailed overall configuration in the resist coating unit (CT) 40 in one embodiment of the present invention.

  In the resist coating unit (CT) 40 of this embodiment, the stage 76 does not function as a mounting table for fixing and holding the substrate G as in the prior art, but a substrate for floating the substrate G in the air by the force of air pressure. It functions as a levee. Then, the linear movement type substrate transport portions 84 arranged on both sides of the stage 76 hold both side edges of the substrate G floating on the stage 76 in a detachable manner, and the stage longitudinal direction (X direction) The substrate G is transferred to the substrate.

Specifically, the stage 76 is divided into _five regions M ₁ , M ₂ , M ₃ , M ₄ , and M ₅ in the longitudinal direction (X direction) (FIG. 5). The leftmost area M ₁ is a carry-in area, and a new substrate G to be subjected to the coating process is carried into a predetermined position in this area M ₁ . In this carry-in area M ₁ , the substrate G is received from the transfer arm of the transfer device 54 (FIG. 1) and loaded onto the stage 76 so as to move up and down between the original position below the stage and the forward movement position above the stage. A plurality of possible lift pins 86 (for example, four) are provided at predetermined intervals. These lift pins 86 are driven up and down by, for example, a lift pin lift unit 85 (FIG. 13) for carrying in using an air cylinder (not shown) as a drive source.

The loading area M ₁ is also the area substrate transfer of a floating starts, high-pressure or positive pressure to the stage upper surface of the area to float the substrate G at the desired flying height or flying height H _a A number of jet outlets 88 for jetting compressed air are provided at a constant density. Here, the flying height H _a of the substrate G viewed from the upper surface of the stage 76 in the loading area M ₁ does not require a particularly high accuracy, for example if kept in the range of 100-150 .mu.m. Further, it is preferable that the size of the carry-in area M ₁ exceeds the size of the substrate G in the transport direction (X direction). Furthermore, an alignment unit (not shown) for aligning the substrate G on the stage 76 is also provided in the carry-in area M ₁ .

A region M ₃ set at the center of the stage 76 is a resist solution supply region or a coating region, and the substrate G is supplied with the resist solution R from the upper resist nozzle 78 at a predetermined position when passing through this region M _3. Receive. _On the upper surface of the stage of the coating region M ₃ , for example, an ejection port 88 that ejects high-pressure or positive-pressure compressed air to float the substrate G at a desired flying height H _b in an arrangement or distribution pattern as shown in FIG. A large number of suction ports 90 for sucking air at a negative pressure are mixed and provided at a constant density.

Here, the reason why the positive pressure outlet 88 and the negative pressure suction port 90 are mixed is to maintain the flying height _Hb at a set value (for example, 50 μm) with high accuracy. That is, the flying height H _b in the coating area M ₃ are, defines a gap S (e.g. 100 [mu] m) between the nozzle lower end (discharge port) and the substrate upper surface (surface to be processed). The gap S is an important parameter that influences the resist coating film and the resist consumption, and needs to be kept constant with high accuracy. In this embodiment, a vertical upward force by compressed air is applied from the jet outlet 88 to a portion passing through the coating region M ₃ of the substrate G, and at the same time, a vertical downward force by a negative pressure suction force is applied from the suction port 90. By applying this force, the balance of the two-way combined pressure is controlled to maintain the coating flying height _Hb at a set value (50 μm). For this flying height control, a feedback control mechanism including an altitude detection sensor (not shown) for detecting the height position of the substrate G may be provided. Note that the size of the coating region M ₃ in the transport direction (X direction) only needs to be large enough to stably form the narrow gap S as described above immediately below the resist nozzle 78, and is usually larger than the size of the substrate G. May be small, for example, about 1/3 to 1/4.

Middle area M ₂ that is set between the loading area M ₁ and the application area M ₃ are, floating coating of highly H _a (100-150 .mu.m) the flying height of the substrate G during conveyance in the carrying region M ₁ This is a transition region for changing or transitioning to the flying height H _b (50 μm) in the region M ₃ . Even in the transition region M ₂ , the jet port 88 and the suction port 90 are mixedly arranged on the upper surface of the stage 76. However, and the density of the suction port 90 gradually increases along the conveying direction, the flying of the substrate G altitude is adapted to move to H _b from progressively H _a during transport thereby.

In the region M ₄ adjacent to the downstream side of the coating region M ₃ , the flying height position of the substrate G during transportation is changed from the flying height H _b (50 μm) for coating to the flying height H _c (for example, 100 to 150 μm) for unloading. It is a transition area for changing. _On the upper surface of the stage of the transition region M ₄ , the jet ports 88 and the suction ports 90 are mixedly arranged in a distribution pattern symmetrical to the upstream transition region M ₂ described above in the transport direction.

A region M ₅ at the downstream end (right end) of the stage 76 is a carry-out region. The resist coating unit (CT) substrate G having received a coating process with 40, the transport arm 74 from a predetermined position or unloading position of the unloading area M ₅ vacuum drying unit on the downstream side next (FIG. 3) (VD) 42 ( 3). The carry-out area M ₅ is spatially symmetric with the carry-in area M ₁ described above, and below the stage in order to unload the substrate G from the stage 76 and deliver it to the transfer arm 74 (FIG. 3). a plurality of (e.g., present 4) lift pins 92 that can move up and down between the home position and the stage upper forward position at predetermined intervals together with the provided, for floating the substrate G in the flying height H _c A number of jet outlets 88 are provided at a constant density on the upper surface of the stage. The lift pin 92 is driven up and down by, for example, a lift pin lift unit 91 (FIG. 13) for carrying out using an air cylinder (not shown) as a drive source.

  The resist nozzle 78 is included in the resist solution supply unit, has a long nozzle body extending in the Y direction with a length that can cover the substrate G on the stage 76 from one end to the other end, and is provided with a resist solution supply source 93 ( It is connected to a resist solution supply pipe 94 from FIG. As shown in FIG. 3, the nozzle moving mechanism 75 (FIGS. 3 and 13) includes an inverted U-shaped or gate-shaped support 77 that horizontally supports the resist nozzle 78, and both the support 77 in the X direction. And a rectilinear drive unit 79 that linearly moves in the direction. This linear drive part 79 may be comprised by the linear motor mechanism with a guide, or a ball screw mechanism, for example. In addition, a nozzle lifting mechanism 81 (FIG. 13) with a guide for changing or adjusting the height position of the resist nozzle 78 is provided at, for example, the joint portion 83 that connects the support body 77 and the resist nozzle 78.

  As shown in FIGS. 4, 7, and 8, the substrate transport unit 84 includes a pair of guide rails 96 arranged in parallel on the left and right sides of the stage 76, and an axial direction (X direction) on each guide rail 96. A slider 98 movably attached to each other, a transport drive unit 100 for moving the slider 98 linearly on each guide rail 96, and right and left side edges of the substrate G extending from each slider 98 toward the center of the stage 76. And a holding portion 102 that holds the detachable holder.

  Here, the conveyance drive unit 100 is configured by a linear drive mechanism such as a linear motor. The holding unit 102 supports the suction pad 104 coupled to the lower surfaces of the left and right side edges of the substrate G by a vacuum suction force, and supports the suction pad 104 at the distal end, with the proximal end on the slider 98 side serving as a fulcrum. And a plate spring type pad support portion 106 that can be elastically deformed so that the height position of each can be changed. The suction pads 104 are arranged in a line at a constant pitch, and the pad support part 106 supports each suction pad 104 independently. As a result, the individual suction pads 104 and the pad support portions 106 can stably hold the substrate G at independent height positions (even at different height positions).

  As shown in FIGS. 7 and 8, the pad support portion 106 in this embodiment is attached to a plate-like pad elevating member 108 attached to the inner surface of the slider 98 so as to be elevable. A pad actuator 109 (FIG. 13) made of, for example, an air cylinder (not shown) mounted on the slider 98 causes the pad elevating member 108 to be placed at an original position (retracted position) lower than the flying height position of the substrate G. It is configured to move up and down between the forward movement position (coupling position) corresponding to the flying height position of G.

  As shown in FIG. 9, each suction pad 104 is provided with a plurality of suction ports 112 on the upper surface of a rectangular parallelepiped pad body 110 made of, for example, synthetic rubber. These suction ports 112 are slit-like long holes, but may be round or rectangular small holes. For example, a belt-like vacuum tube 114 made of synthetic rubber is connected to the suction pad 104. The pipe lines 116 of these vacuum pipes 114 respectively communicate with the vacuum source of the pad suction control unit 115 (FIG. 13).

  The pad adsorption control unit 115 (FIG. 13) also connects the conduit 116 (FIG. 9) of the vacuum pipe 114 to a compressed air source (not shown) via a switching valve (not shown). When separating 104 from the side edge of the substrate G, the switching valve is switched to the compressed air source side to supply positive pressure or high pressure compressed air to the suction pad 104.

  As shown in FIG. 4, the holding unit 102 preferably has a separation type or completely independent type in which the vacuum suction pads 104 and the pad support units 106 on one side are separated for each set. However, as shown in FIG. 10, a single plate spring provided with a notch 118 is used to form a pad support portion 120 for one row on one side, and a vacuum suction pad 104 is placed on one row on the pad support portion 120. Configuration is also possible.

As described above, a number of jet outlets 88 are provided on the upper surface of the stage 76. In this embodiment, an ejection controller that individually and automatically switches the air ejection flow rate for each ejection port 88 belonging to the carry-in area M ₁ and the carry-out area M ₅ of the stage 76 based on the relative positional relationship with the substrate G. 122 is provided in the stage 76 in the form of a flow rate switching valve.

  In FIG. 11, the structure of the ejection control part 122 by one Example is shown. The ejection control unit 122 includes a valve chamber 124 having a spherical wall surface formed inside the stage 76, and a spherical valve body 126 movably provided in the valve chamber 124. Yes. At the top and bottom of the valve chamber 124, an outlet 124a and an inlet 124b that are opposed to each other in the vertical direction are formed. The outlet 124 a communicates with the jet outlet 88 corresponding to the jet control unit 122. The inlet 124 b communicates with a compressed air supply path 128 running under the stage 76.

  FIG. 12 shows an example of a piping pattern of the compressed air supply path 128 in the stage 76. For example, compressed air from a compressed air source (not shown) such as a compressor flows through the external pipe 130 and is introduced into the compressed air introduction section 132 in the stage 76. The compressed air introduced into the compressed air introduction section 132 is distributed to a number of compressed air supply paths 128 extending from there to the stage 76.

In FIG. 11, a valve seat is formed around the outlet 124 a of the valve chamber 124. A plurality of (four) grooves 124c extending radially from the outlet 124a are formed in the valve seat at predetermined intervals (for example, 90 ° intervals) in the circumferential direction. As a result, even if the valve body 126 is in close contact with or seated on the valve seat and closes the outlet 124a, the compressed air leaks from the valve chamber 124 to the jet outlet 88 side through the groove 124c. The valve body 126 is, for example, a resin sphere having a diameter one or two times smaller than the inner diameter of the valve chamber 124, and a vertical upward force P _U corresponding to the air pressure on the inlet 124b side is applied to the lower half of the spherical surface. receiving with a vertical downward force in accordance with the air pressure in the outlet 124a side in the upper half of the sphere (reaction) subjected to P _D. Further, the gravity P _G (constant value) corresponding to the mass of the valve body 126 always acts vertically downward. The valve body 126 changes the vertical position (height position) in the valve chamber 124 according to the difference between the vertical upward force P _U and the vertical downward force (P _D + P _G ) as described above.

  In this embodiment, as shown in FIG. 11, depending on whether or not the substrate G is present above each ejection port 88, the ejection control unit 122 immediately below the ejection port 88 has a valve body in the valve chamber 124. The height position of 126 is switched to either the first position that is in close contact with the valve seat on the outlet 124a side, or the second position that is separated from the valve seat and floats in the valve chamber 124. It has become.

In other words, upward (in the strict sense approach distance below the set flying height H _a is) of the spout 88 when the substrate G is present, the spout 88 near or valve chamber immediately below the counteraction from the substrate G 124 As the air pressure in the vicinity of the outlet 124a increases, the vertical downward force (especially P _D ) acting on the valve body 126 increases so as to be equal to or slightly above the vertical upward force P _U, and the valve body 126 It is separated from the valve seat on the 124a side. As a result, the outlet 124a is opened, and the compressed air introduced into the valve chamber 124 from the inlet 124b passes through the outlet 124a at a large flow rate and is ejected from the outlet 88.

As described above, the numerous outlets 88 formed on the upper surface of the stage 76, the compression supply source for supplying the compressed air for generating the levitation force to them, the external pipe 130, the compressed air supply path 128, and the ejection control unit 122. Further, the loading region M _{1 is} provided by a suction port 90 formed in the regions M ₂ , M ₃ , and M ₄ of the stage 76 in a mixed manner with the ejection port 88 and a vacuum mechanism for applying a negative pressure suction force thereto. In the unloading region M ₅ , a stage substrate floating portion 134 (FIG. 13) for efficiently floating the substrate G at a desired height and in the coating region M ₃ for floating the substrate G to a set height position with high accuracy is configured. Yes.

  FIG. 13 shows the configuration of the control system in the resist coating unit (CT) 40 of this embodiment. The controller 136 is composed of a microcomputer, and each part in the unit, in particular, a resist solution supply source 93, a nozzle moving mechanism 75, a nozzle lifting mechanism 81, a stage substrate floating part 134, a transport driving unit 100, a pad suction control unit 115, a pad actuator. It controls the individual operations and overall operations (sequence) of the eta 109, the carry-in lift pin lift unit 85, the carry-out lift pin lift unit 91, and the like.

Next, the coating processing operation in the resist coating unit (CT) 40 of this embodiment will be described. In FIGS. 14 to 19 show the stages of the coating operation in the coating area M ₃ around.

  The controller 136 fetches and executes a resist coating processing program stored in a storage medium such as an optical disk in the main memory, and controls a series of programmed coating processing operations.

When the transport device 54 new substrate G (FIG. 1) than the untreated is carried into the carry-area M ₁ stage 76, the lift pins 86 receives the substrate G at the forward position. After the transfer device 54 has left, the lift pins 86 are lowered to lower the substrate G to the transfer height position, that is, the flying height H _a (FIG. 5). Next, an alignment unit (not shown) is operated, and a pressing member (not shown) is pressed against the floating substrate G from four directions to align the substrate G on the stage 76. When the alignment operation is completed, the pad actuator 109 is actuated immediately after that in the substrate transport section 84, and the suction pad 104 is raised (UP) from the original position (retracted position) to the forward movement position (coupled position). The suction pad 104 is vacuumed from the front, and is bonded by a vacuum suction force as soon as it comes into contact with the side edge of the floating substrate G. Immediately after the suction pad 104 is coupled to the side edge of the substrate G, the alignment unit retracts the pressing member to a predetermined position.

Next, the substrate conveying section 84 causes the straight movement at a relatively fast constant speed V _a of the slider 98 while maintaining the side edges of the substrate G from the transfer start position in the conveying direction (X direction) by the holding portion 102. In this first stage (before the coating process), when the front portion of the substrate G enters the coating region M ₃ from the carry-in region M ₁ through the transition region M ₂ , the substrate G floats as shown in FIG. Altitude gradually decreases. This is because the suction force from the suction port 90 in the application region M ₃ acts on the substrate G, and the suction force acting on the entire substrate increases as the substrate G enters the application region M ₃ . Since the change in the flying height of the substrate G is before the coating process, it does not affect the coating process.

Thus, when the front end of the substrate G reaches the set position near the end on the downstream side of the coating region M _{3 in} the transport direction, the flying height of the substrate G in the coating region M ₃ is the minimum value, that is, the set flying height for coating. The altitude H _b (for example, 50 μm) is reached, and the substrate transport section 84 stops the first stage substrate transport (FIG. 15). At this time, the resist nozzle 78 is waiting in directly above the downstream end of the coating area M _3.

As soon as the substrate G stops, the nozzle raising / lowering mechanism 81 is actuated to lower the resist nozzle 78 vertically downward, and when the distance interval or gap S between the nozzle outlet and the substrate G reaches a set value (for example, 100 μm). Stop nozzle lowering operation. Next, the resist solution supply unit starts discharging the resist solution from the resist nozzle 78 toward the upper surface of the substrate G. At this time, it is preferable to start discharging at a normal flow rate after first discharging a small amount of resist solution to completely close the gap S between the nozzle discharge port and the substrate G. On the other hand, scanning of the resist nozzle 78 is also started in the nozzle moving mechanism 75. This nozzle scanning is performed at a constant speed V _n in the direction opposite to the transport direction. Further, the substrate transport unit 84 starts the second stage substrate transport. The second stage, that substrate transport during coating is carried out at a relatively slow constant speed V _b.

Thus, in the coating region M ₃ , as shown in FIG. 17, the substrate G moves in the horizontal posture at a constant speed V _b in the transport direction (X direction), and at the same time, the long resist nozzle 78 moves in the opposite direction. By moving the liquid R at a constant speed V _n while discharging the liquid R in a strip shape at a constant flow rate, a resist liquid coating film RM is formed from the front end side to the rear end side of the substrate G. During this coating process, the substrate G moves in the X direction while covering the entire coating region M ₃ , so that the vertical upward lift from the jet port 88 and the vertical downward suction force from the suction port 90 are balanced. uniformly subjected to constant levitation force at each position in the region, in the coating area M ₃ and its vicinity stably maintain the horizontal posture at the set flying height H _b without or shake up and down. As a result, the resist solution is applied onto the substrate G in a state where the gap S between the discharge port of the resist nozzle 78 and the substrate G is maintained at a set value (100 μm) with high accuracy.

In this embodiment, a constant related to the substrate transport velocity V _b and the nozzle moving speed V _n in the coating process, that is a predetermined position near the upstream end the rear end of the substrate G is applied area M ₃ as shown in FIG. 18 At the same time, the registration nozzle 78 is set to reach the predetermined position. That is, the time T _G required for the rear end of the substrate G to reach the predetermined position from the start of application (FIG. 16) is equal to the time T ₇₈ required for the resist nozzle 78 to reach the predetermined position. Both speeds V _b and V _n are set so that Here, if the sizes of the substrate G and the coating region M ₃ in the transport direction are L _G and L _M3 , the ratio of V _b and V _n may be selected so as to satisfy the following expression (1).
T _G = (L _G −L _M3 ) / V _a , T ₇₈ = L _M3 / V _n
T _G = T ₇₈ ∴ (L _G −L _M3 ) / V _a = L _M3 / V _{n
∴ V n = V b * L} M3 / (L G -L M3) ···· (1)

Thus, when the rear end of the substrate G and the resist nozzle 78 simultaneously reach a predetermined position near the upstream end of the coating region M ₃ , the nozzle moving mechanism 75 stops scanning the resist nozzle 78 on the resist solution supply unit side, and the resist The liquid supply source 93 ends the discharge of the resist liquid R from the resist nozzle 78. Next, as shown in FIG. 19, the nozzle elevating mechanism 81 lifts the resist nozzle 78 vertically upward and retracts it from the substrate G.

On the other hand, after the rear end of the substrate G reaches the predetermined position, the substrate transport unit 84 shifts from the second-stage substrate transport to the third-stage (after application) substrate transport, and changes the substrate transport speed until then. switching from the low speed V _b high speeds V _c. In this third stage of substrate conveyance, the substrate G is conveyed all at once to the carry-out unit M ₅ . At this time, as shown in FIG. 19, flying altitude H _b when the rear end of the substrate G is moved or passed to the transport direction (X direction) within the coating area M ₃ from the predetermined position (the coating end position) progressively increases toward the H _a from. This is because the suction force of the vertically downward acting on the suction port 90 from the substrate G in the coating area M ₃ is gradually decreased as the movement of the substrate G. Since the change in the flying height of the substrate G is after the coating process, the coating process is not affected.

Thus when the substrate G is conveyed from the coating area M ₃ to the transition area M ₄ of the through and out region M ₅ arrive in the conveying end position, the substrate conveying unit 84 to stop the substrate carrying the third stage. Immediately after this, the pad suction control unit 115 stops the supply of vacuum to the suction pad 104, and at the same time, the pad actuator 109 lowers the suction pad 104 from the forward movement position (coupling position) to the original position (retraction position), and the substrate The suction pad 104 is separated from both end portions of G. At this time, the pad suction control unit 115 supplies positive pressure (compressed air) to the suction pad 104 to speed up the separation from the substrate G. Instead, the lift pins 92 rise from the original position below the stage to the forward movement position above the stage in order to unload the substrate G.

Thereafter, the unloader, that is, the transfer arm 74 accesses the unloading area M ₅ , receives the substrate G from the lift pins 92, and unloads it out of the stage 76. The substrate transport unit 84 immediately returns the substrate G to the loading region M ₁ at a high speed when the substrate G is transferred to the lift pins 92. When the processed substrate G is unloaded as described above in the unloading area M ₅ , loading, alignment, or transfer start is performed on the new substrate G to be subjected to the next coating process in the loading area M ₁ .

As described above, in this embodiment, the carry-in area M ₁ , the coating area M ₃ , and the carry-out area M ₅ are separately provided on the stage 76, and the substrate is sequentially transferred to each of these areas to carry out the substrate carry-in operation, resist The liquid supply operation and the substrate unloading operation are performed independently or in parallel in each region, whereby the time (T _IN ) required for the operation of loading one substrate G onto the stage 76 and the stage 76 The total time required for one cycle of the coating process in which the time required for transporting from the carry-in area M ₁ to the carry-out area M ₅ (T _C ) and the time required for carrying out from the carry-out area M ₅ (T _OUT ) are added. Tact time can be shortened more than (T _C + T _IN + T _OUT ).

  In addition, the substrate G is floated in the air by using the pressure of the gas ejected from the ejection port 88 provided on the upper surface of the stage 76, and the substrate G is transported from the long resist nozzle 78 while the floating substrate G is conveyed on the stage 76. Since the resist solution is supplied onto G and applied, the distance over which the long resist nozzle 78 is scanned during the application process can be made significantly shorter than the entire length of the substrate G. In addition, since the scanning of the resist nozzle 78 is performed in the direction opposite to the conveyance of the substrate G, the scanning speed can be set low. This becomes more advantageous as the substrate becomes larger, that is, as the long resist nozzle becomes heavier and longer.

Then, while the substrate G passes through the coating region M ₃ of the stage 76 and covers almost the entire region, a process of supplying the resist solution to the upper surface (surface to be processed) of the substrate G (coating process) is performed. Since the process is executed in the coating region M ₃ , the flying height H _b of the substrate G being transferred is held at a set value in the coating region M ₃ throughout the entire processing time from the start to the end of the coating process (accordingly, The gap S between the discharge port of the resist nozzle 78 and the substrate G is held at a set value), and a resist coating film having a constant film thickness without coating unevenness can be formed on the substrate G.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and various modifications can be made within the scope of the technical idea.

  For example, the holding unit 102 of the substrate transport unit 84 in the above-described embodiment has the vacuum suction type pad 104, but a pad that holds the side edge of the substrate G mechanically (for example, tightly attached) or the like. Is also possible. Also, various systems and configurations can be employed for a mechanism (pad support unit 106, pad lifting unit 108, pad actuator 109) for detachably coupling the pad 104 to the side edge of the substrate G. Moreover, although the board | substrate conveyance part 84 in the said embodiment hold | maintained and conveyed the right and left both-sides edge part of the board | substrate G, it is also possible to hold | maintain only the one side edge part of the board | substrate G, and to carry a board | substrate. In the above embodiment, a single long resist nozzle 78 is scanned to uniformly supply (apply) the resist solution over the entire upper surface of the substrate G. However, modifications such as dividing the surface to be processed on the substrate G into a plurality of areas and filling each area with individual nozzles, or independently setting the processing liquid and film thickness for each area are possible.

  The above-described embodiment relates to a resist coating apparatus in a coating / development processing system for LCD manufacturing. However, the present invention is applicable to any processing apparatus or application that supplies a processing liquid onto a substrate to be processed. Therefore, as the processing liquid in the present invention, in addition to the resist liquid, for example, a coating liquid such as an interlayer insulating material, a dielectric material, and a wiring material can be used, and a developing liquid or a rinsing liquid can also be used. The substrate to be processed in the present invention is not limited to an LCD substrate, and other flat panel display substrates, semiconductor wafers, CD substrates, glass substrates, photomasks, printed substrates, and the like are also possible.

It is a top view which shows the structure of the application | coating development processing system which can apply this invention. It is a flowchart which shows the procedure of the process in the coating and developing treatment system of embodiment. It is a schematic plan view showing the entire configuration of a resist coating unit and a vacuum drying unit in the coating and developing treatment system of the embodiment. It is a perspective view which shows the whole structure of the resist coating unit in embodiment. It is a schematic front view which shows the whole structure of the resist coating unit in embodiment. It is a top view which shows an example of the arrangement pattern of the jet nozzle and suction port in the stage application area | region of embodiment. It is a partial cross section schematic side view which shows the structure of the board | substrate conveyance part in the resist coating unit of embodiment. It is an expanded sectional view showing composition of a holding part of a substrate conveyance part in a resist application unit of an embodiment. It is a perspective view which shows the structure of the pad part of the board | substrate conveyance part in the resist coating unit of embodiment. It is a perspective view which shows one modification of the holding | maintenance part of the board | substrate conveyance part in the resist coating unit of embodiment. It is sectional drawing which shows the structure of the ejection control part in the resist application unit of embodiment. It is a fragmentary sectional view showing composition of a channel inside a stage in a resist application unit of an embodiment. It is a block diagram which shows the structure of the control system in the resist coating unit of embodiment. It is a schematic side view showing one stage of the coating processing operation in the main part of the resist coating unit of the embodiment. It is a schematic side view showing one stage of the coating processing operation in the main part of the resist coating unit of the embodiment. It is a schematic side view showing one stage of the coating processing operation in the main part of the resist coating unit of the embodiment. It is a schematic side view showing one stage of the coating processing operation in the main part of the resist coating unit of the embodiment. It is a schematic side view showing one stage of the coating processing operation in the main part of the resist coating unit of the embodiment. It is a schematic side view showing one stage of the coating processing operation in the main part of the resist coating unit of the embodiment.

Explanation of symbols

40 resist coating unit (CT)
75 Nozzle moving mechanism 76 Stage 78 Resist nozzle 81 Nozzle lifting mechanism 84 Substrate transport section 85 Loading lift pin lifting section 86 Loading lift pin 87 Alignment section 88 Jet outlet 90 Suction port 91 Unloading lift pin lifting section 92 Unloading lift pin 93 Resist liquid supply Source 100 Transport drive unit 102 Holding unit 104 Suction pad 134 Stage substrate floating part 136 Controller M ₁ loading area M ₃ coating area M ₅ unloading area

Claims (20)

A stage having a first floating region smaller in area than the substrate to be processed, and providing a substantially uniform flying force to the substrate at each position in the first floating region;
A substrate transport unit that passes the first floating region in a predetermined transport direction in a state where the substrate is floated;
A processing liquid supply unit that performs an operation of supplying a processing liquid to a surface to be processed of the substrate while the substrate covers substantially the whole area of the first floating region while passing through the first floating region. ,
The treatment liquid supply unit is
An elongated type nozzles ejecting the treatment liquid from the upper toward the target surface of the substrate in the first floating region,
A treatment liquid supply source for sending the treatment liquid to the long nozzle,
During the processing liquid supply operation, the long nozzle is moved in the direction opposite to the transport direction from the first nozzle position at which the processing liquid discharge starts to the second nozzle position at which the processing liquid discharge ends. A substrate processing apparatus, comprising: a nozzle moving unit. The long nozzle has a fine-diameter discharge port extending in a horizontal direction intersecting the transport direction;
The nozzle moving unit moves the long nozzle in a direction opposite to the transport direction from the first nozzle position to the second nozzle position at a constant speed;
The substrate processing apparatus according to claim 1.   The first nozzle position is set near an end on the downstream side of the first levitation region, and the second nozzle position is set near an end on the upstream side of the first levitation region. The substrate processing apparatus according to claim 1 or 2. The substrate processing apparatus according to claim 1, wherein the processing liquid supply unit includes a nozzle lifting / lowering unit that moves the elongated nozzle up and down.   The processing liquid supply unit starts the processing liquid supply operation in a state where the front end portion of the substrate is positioned near the end portion on the downstream side of the first floating region in the transport direction, and the rear end portion of the substrate 5. The substrate processing apparatus according to claim 1, wherein the processing liquid supply operation is finished in a state where the processing liquid supply operation ends in a state of being positioned in the vicinity of the upstream end of the first floating region.   The substrate processing apparatus according to claim 5, wherein the substrate transport unit transports the substrate at a constant speed in the transport direction during execution of the processing liquid supply operation.   The substrate transport unit temporarily stops the substrate when a front end portion of the substrate reaches a predetermined position near a downstream end portion of the first floating region in order to start the processing liquid supply operation. The substrate processing apparatus according to claim 5 or 6. A spout for ejecting a number of gases provided in the first floating region of the stage;
A suction port for sucking in a large number of gases mixed with the jet ports in the first floating region of the stage;
A levitation control unit that controls a balance between a vertical upward pressure applied from the jet port and a vertical downward pressure applied from the suction port to the substrate passing through the first floating region. The substrate processing apparatus as described in any one of 1-7.   The substrate processing apparatus according to claim 1, wherein the stage has a second floating region that floats the substrate upstream of the first floating region in the transport direction.   The substrate processing apparatus according to claim 9, wherein a flying height of the substrate in the second flying region is higher than a flying height in the first flying region.   The substrate processing apparatus according to claim 9, wherein a loading unit for loading the substrate is provided in the second floating region. The carrying-in part is
A plurality of first lift pins for supporting the substrate by a pin tip at a loading position on the stage;
The substrate processing apparatus according to claim 11, further comprising: a first lift pin lifting / lowering unit that moves the first lift pin up and down between an original position below the stage and a forward movement position above the stage.   The substrate processing apparatus according to claim 1, wherein the stage has a third floating region that floats the substrate downstream of the first floating region in the transport direction.   The substrate processing apparatus according to claim 13, wherein a flying height of the substrate in the third flying region is higher than a flying height in the first flying region.   The substrate processing apparatus according to claim 13, wherein an unloading unit for unloading the substrate is provided in the third floating region. The unloading part is
A plurality of second lift pins for supporting the substrate by a pin tip at a loading position on the stage;
The substrate processing apparatus according to claim 15, further comprising: a second lift pin raising / lowering unit that moves the second lift pin up and down between an original position below the stage and a forward movement position above the stage. The substrate transport unit is
A guide rail disposed on one or both sides of the stage so as to extend in parallel with the direction of movement of the substrate;
A slider movable along the guide rail;
A transport driving unit that drives the slider to move along the guide rail;
The substrate processing apparatus according to claim 1, further comprising: a holding portion that extends from the slider toward a center portion of the stage and detachably holds a side edge portion of the substrate. Along the transport direction on the stage, set the loading area larger than the substrate to be processed, the coating area smaller than the substrate, and the unloading area larger than the substrate in this order in a row,
The substrate is floated by the pressure of gas ejected from a large number of ejection ports provided on the upper surface of the stage, and in the coating region, a substantially uniform levitation force is given to the substrate at each position in the region,
During the transfer of the substrate from the carry-in area to the carry-out area, the processing liquid is applied to the surface to be processed of the substrate using a long nozzle while the substrate covers almost the entire area of the application area. Execute the process,
Wherein in the coating process, the transport direction of the long position of the long-shaped nozzle for supplying the processing liquid to the processing surface to a predetermined position of the upstream end portion from a predetermined position of the downstream end of the coating area of said substrate moving at a first speed in the opposite direction,
Substrate processing method.   The substrate processing method according to claim 18, wherein the substrate is moved in the transport direction at a second speed higher than the first speed after the coating process is completed.   The substrate processing method according to claim 18, wherein the substrate is moved at a third speed in the transport direction during the coating process.

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