JP4564454B2 - Coating method, coating apparatus, and coating program - Google Patents

Description

  The present invention relates to a coating method, a coating apparatus, and a coating processing program for forming a coating film of a processing liquid on a substrate to be processed using a long nozzle.

  In a photolithography process in the manufacturing process of flat panel displays (FPD) such as LCD, a long resist nozzle having a slit-like discharge port is scanned to apply a resist solution onto a substrate to be processed (glass substrate or the like). A spinless coating method is often used.

In such a spinless coating method, for example, as disclosed in Patent Document 1, a substrate is placed horizontally on a mounting table or a stage, and a substrate on the stage and a discharge port of a long resist nozzle are formed. A minute gap of several hundred μm or less is set between them, and the resist nozzle is moved in the scanning direction (generally in the horizontal direction perpendicular to the longitudinal direction of the nozzle) above the substrate, and the resist solution is discharged onto the substrate in a band shape and applied. By simply moving the long resist nozzle once from one end to the other end of the substrate, the resist coating film can be formed on the substrate with a desired film thickness without dropping the resist solution outside the substrate.
JP-A-10-156255

  In the conventional spinless coating method, there is room for improvement in the control of the film thickness of the resist coating film, and in-plane uniformity is particularly a problem. Specifically, the resist solution in the resist nozzle is connected to the resist solution film on the substrate only by stopping the pump of the resist solution supply source at the end of the coating scan and withdrawing the resist nozzle as it is outside or above the substrate. Since the liquid is drained after being discharged, there is a problem that the resist coating film tends to rise at the rear end portion of the substrate in the coating scanning direction.

  Generally, a margin area having a predetermined width is set at the peripheral edge of the upper surface (surface to be processed) of the substrate, and a device is formed in a product area inside the margin area. Therefore, in the resist coating process, if the product area is a guaranteed area where the film thickness of the resist coating film must be guaranteed, and the film thickness of the resist coating film is within a predetermined allowable range throughout the guaranteed area. In general, even if a bulge exceeding the allowable range occurs in the peripheral margin region, the film thickness profile of the resist coating film does not become defective.

  However, since the peripheral resist applied to the margin area may cause particles, it is removed in a subsequent process using a peripheral exposure machine or the like. However, if the resist film thickness is large, it may not be able to be removed completely. In this respect, the swell of the resist coating film at the coating scanning end portion becomes a problem.

  In order to suppress the swell of the resist coating film at the coating scanning end portion, the coating scanning end position is set on the substrate, the resist nozzle is temporarily stopped there, and the resist solution is stopped or stopped at rest. A so-called suck back method has been conventionally performed in which a resist solution is sucked from a substrate by reversing a pump of a supply source.

  However, when the suck-back method is used under the conventional technology, the thinning of the resist coating film by absorbing the resist solution through the resist nozzle does not stop within the margin area, but extends to the film thickness guarantee area. There was a possibility that the resist film thickness of the inside would fall below a set value or an allowable range.

  The present invention has been made in view of the problems of the prior art, and is a coating that improves coating quality by improving film thickness controllability near the coating scanning end portion in a spinless coating method using a long nozzle. It is an object to provide a method, a coating apparatus, and a coating processing program.

  In order to achieve the above object, in the first coating method of the present invention, the substrate to be processed and the discharge port of the long nozzle are opposed substantially horizontally with a minute gap therebetween, and A coating method for forming a coating film of the processing liquid on the substrate by performing coating scanning in which the nozzle is moved relatively in a horizontal direction while supplying the processing liquid from the nozzle, wherein the nozzle is formed on the substrate. A step of setting a scanning end point position for relatively stopping and a second horizontal movement speed higher than the first horizontal movement speed from the first horizontal movement speed at a final stage of the coating scan. Increasing the horizontal movement speed to a horizontal horizontal movement speed and then decreasing the second horizontal movement speed to a third horizontal movement speed substantially equal to zero to place the nozzle at the scanning end position; Scanning Reducing a gap between the substrate and the nozzle from a first distance interval to a second distance interval smaller than the first distance interval; and after the end or end of the application scan, A step of stopping the supply of the processing liquid to the substrate, and a step of causing the nozzle that arrives at the scanning end position to suck a predetermined amount of the processing liquid on the substrate.

  A first coating apparatus according to the present invention includes a substrate support unit for supporting a substrate to be processed substantially horizontally and a long length for discharging a processing liquid across a small gap on the upper surface of the substrate during coating scanning. Shaped nozzle, a processing liquid supply source for pumping the processing liquid to the nozzle during application scanning, and a scanning unit for moving the nozzle relative to the substrate during application scanning And an elevating unit for moving the nozzle in a vertical direction relative to the substrate, and the scanning unit to control the horizontal movement of the nozzle relative to the substrate at the end of coating scanning. The speed is increased once from a first horizontal movement speed to a higher second horizontal movement speed, and then a predetermined deceleration from the second horizontal movement speed to a third horizontal movement speed substantially equal to zero. Reduce the nozzle at a rate At the end of the application scan, the gap between the substrate and the nozzle is set to a predetermined scanning end point position, and the gap between the substrate and the nozzle is set to a second distance interval smaller than the first distance interval. And the processing liquid supply source is controlled to stop the pumping of the processing liquid to the nozzle after the end or end of the coating scan, and the process on the substrate through the nozzle arrived at the scanning end point position. And a controller that sucks a predetermined amount of liquid.

  In the first coating processing program of the present invention, the substrate to be processed and the discharge port of the long nozzle are opposed substantially horizontally with a minute gap, and the processing liquid is supplied from the nozzle to the substrate. A coating processing program for performing coating scanning for moving the nozzle in a relatively horizontal direction to form a coating film of the processing liquid on the substrate, and relatively stopping the nozzle on the substrate And a step of setting a scanning end point position, and at a final stage of the coating scan, a relative horizontal movement speed of the nozzle with respect to the substrate is changed from a first horizontal movement speed to a higher second horizontal movement speed. Increasing and then decreasing from the second horizontal movement speed to a third horizontal movement speed substantially equal to zero to place the nozzle at the scanning end position; Reducing the gap between the substrate and the nozzle from a first distance interval to a smaller second distance interval at a predetermined vertical movement speed at a final stage of inspection; After the completion, a step of stopping the supply of the processing liquid from the nozzle to the substrate and a step of sucking a predetermined amount of the processing liquid on the substrate by the nozzle that arrives at the scanning end point position are executed.

  In the first coating method, the coating apparatus, and the coating processing program, the long nozzle relatively moves in the horizontal direction while discharging the processing liquid onto the substrate in a band shape through a minute gap. A coating film of the processing liquid is formed from the front end side to the rear end side of the substrate in the scanning direction. During this application scanning, the processing liquid discharged onto the substrate adheres to the lower back of the nozzle in the scanning direction due to the wetting phenomenon, spreads in the height direction (swells), and forms a meniscus extending in the longitudinal direction of the nozzle. The film thickness of the coating film should be guaranteed at the end of coating scanning at a predetermined scanning position or timing (preferably inside a boundary passing through a position offset from the outer peripheral edge of the substrate by a predetermined distance toward the center of the substrate) By setting the area and at the timing when the nozzle passes near the boundary in the direction of application scanning, the scanning speed is instantaneously increased (rapid acceleration), so that the meniscus that has adhered or followed the lower back of the nozzle until then. The rising portion of the processing liquid is separated from the nozzle and left behind in the scanning direction. Immediately after the end of scanning, the processing liquid is sucked or sucked back at the scanning end position on the substrate to remove excess processing liquid at the coating scanning end portion, and the influence of sucking back (sucking action) at that time Is canceled at the left-up processing liquid swell portion, the film thickness in the film thickness guarantee region on the substrate is prevented from becoming below the allowable range.

  In the second coating method of the present invention, the substrate to be processed and the discharge port of the long nozzle are opposed substantially horizontally with a minute gap therebetween, and the processing liquid is supplied from the nozzle to the substrate. A coating method for forming a coating film of the treatment liquid on the substrate by performing a coating scan in which the nozzle is relatively moved in the horizontal direction, and a scanning end point position for relatively stopping the nozzle on the substrate And at the end of the application scan, the relative horizontal movement speed of the nozzle with respect to the substrate is reduced from the first horizontal movement speed to a second horizontal movement speed substantially equal to zero. In the final stage of the application scanning, the gap between the substrate and the nozzle is changed from the first distance interval to the second distance larger than the first distance interval. Up to distance Increasing and then decreasing from the second distance interval to a third distance interval that is smaller than the first distance interval, and processing the substrate from the nozzle at the end or end of the application scan. A step of stopping the supply of the liquid, and a step of sucking a predetermined amount of the processing liquid on the substrate by the nozzle at the scanning end point position.

  The second coating apparatus of the present invention includes a substrate support part for supporting the substrate to be processed substantially horizontally and a long length for discharging the processing liquid with a small gap on the upper surface of the substrate during the coating process. Shaped nozzle, a processing liquid supply source for pumping the processing liquid to the nozzle during the coating process, and a scanning unit for moving the nozzle in a horizontal direction relative to the substrate during the coating process And an elevating unit for moving the nozzle in a vertical direction relative to the substrate, and the scanning unit to control the horizontal movement of the nozzle relative to the substrate at the end of coating scanning. The speed is decreased from the first horizontal movement speed to a second horizontal movement speed substantially equal to zero, the nozzle is placed at a preset scanning end position, and the elevating unit is controlled to perform application scanning. In the final stage of the substrate and the nozzle Is increased from a first distance interval to a larger second distance interval, and then decreased from the second distance interval to a third distance interval smaller than the first distance interval, A processing liquid supply source is controlled to stop the pumping of the processing liquid to the nozzle after the end or end of coating scanning, and a predetermined amount of processing liquid on the substrate is passed through the nozzle at the scanning end position. And a control unit for sucking.

  Further, the second coating processing program of the present invention causes the substrate to be processed and the discharge port of the long nozzle to face each other almost horizontally with a small gap, and supplies the processing liquid to the substrate from the nozzle. A coating processing program for forming a coating film of the processing liquid on the substrate by performing coating scanning that relatively moves the nozzle in the horizontal direction, and relatively moving the nozzle on the substrate. And setting the scanning end point position to be stopped at the end of the coating scanning, and the second horizontal movement speed of the nozzle relative to the substrate is substantially equal to zero from the first horizontal movement speed. Reducing the horizontal movement speed to place the nozzle at the scanning end position, and at the end of the coating scan, the gap between the substrate and the nozzle is reduced between the first distance and the gap. Increasing from the first distance interval to a larger second distance interval and then decreasing from the second distance interval to a third distance interval smaller than the first distance interval; Thereafter, a step of stopping the supply of the processing liquid from the nozzle to the substrate and a step of causing the nozzle that has arrived at the scanning end position to absorb a predetermined amount of the processing liquid on the substrate are executed.

  In the second coating method, the coating apparatus, and the coating processing program, the long nozzle moves relatively in the horizontal direction while discharging the processing liquid onto the substrate in a band shape through a minute gap. A coating film of the processing liquid is formed from the front end side to the rear end side of the substrate in the scanning direction. During this application scanning, the processing liquid discharged onto the substrate adheres to the lower back of the nozzle in the scanning direction due to the wetting phenomenon, spreads in the height direction (swells), and forms a meniscus extending in the longitudinal direction of the nozzle. The film thickness of the coating film should be guaranteed at the end of coating scanning at a predetermined scanning position or timing (preferably inside a boundary passing through a position offset from the outer peripheral edge of the substrate by a predetermined distance toward the center of the substrate) When the area is set and the nozzle passes near the boundary in the direction of application scanning), the coating gap instantaneously increases, so that the side edge of the processing liquid is constricted inward, and the film thickness is increased accordingly. . As a result, even if the scanning speed is reduced and the coating gap is reduced simultaneously between the nozzle and the substrate immediately thereafter, the coating film is formed near the boundary between the product region and the non-product region in the scanning direction on the substrate. The spread in the side direction can be prevented or suppressed. Immediately after the end of scanning, the processing liquid is sucked or sucked back at the scanning end position on the substrate to remove excess processing liquid at the coating scanning end portion, and the influence of sucking back (sucking action) at that time Is canceled at the constricted portion, the film thickness of the processing liquid in the film thickness guarantee region on the substrate is prevented from becoming below the allowable range.

  In the third coating method of the present invention, the substrate to be processed and the discharge port of the long nozzle are opposed substantially horizontally with a minute gap therebetween, and the processing liquid is supplied from the nozzle to the substrate. A coating method for forming a coating film of the processing liquid on the substrate by performing a scan in which the nozzle is relatively moved in the horizontal direction, wherein a scan end point position for relatively stopping the nozzle on the substrate is set. And in the final stage of the coating scan, the relative horizontal movement speed of the nozzle with respect to the substrate is once increased from a first horizontal movement speed to a higher second horizontal movement speed, and then Reducing the second horizontal movement speed to a third horizontal movement speed substantially equal to zero to place the nozzle at the scanning end position; and at the end of the coating scan, the substrate and the nozzle With Increasing the first gap from a first distance interval to a larger second distance interval and then decreasing from the second distance interval to a third distance interval smaller than the first distance interval. And a step of stopping the supply of the processing liquid from the nozzle to the substrate after the end or the end of the coating scan, and causing the nozzle that has reached the scanning end position to absorb a predetermined amount of the processing liquid on the substrate. Process.

  The third coating apparatus of the present invention includes a substrate support part for supporting the substrate to be processed substantially horizontally and a long length for discharging the processing liquid with a small gap on the upper surface of the substrate during coating scanning. Shaped nozzle, a processing liquid supply source for pumping the processing liquid to the nozzle during application scanning, and a scanning unit for moving the nozzle relative to the substrate during application scanning And an elevating unit for moving the nozzle in a vertical direction relative to the substrate, and the scanning unit to control the horizontal movement of the nozzle relative to the substrate at the end of coating scanning. The speed is increased from a first horizontal movement speed to a higher second horizontal movement speed and then decreased from the second horizontal movement speed to a third horizontal movement speed substantially equal to zero. Running the nozzle in advance At the end position, the lift is controlled to increase the gap between the substrate and the nozzle from the first distance interval to a larger second distance interval at the end of the coating scan. Then, the processing distance is decreased from the second distance interval to a third distance interval smaller than the first distance interval, and the processing liquid supply source is controlled so that the processing for the nozzle is performed at the end or after the end of the coating scan. And a controller that stops the pumping of the liquid and sucks a predetermined amount of the processing liquid on the substrate through the nozzle at the scanning end point position.

  Further, the third coating processing program of the present invention causes the substrate to be processed and the discharge port of the long nozzle to face each other almost horizontally with a small gap, and supplies the processing liquid to the substrate from the nozzle. A coating processing program for forming a coating film of the processing liquid on the substrate by performing a scan that relatively moves the nozzle in the horizontal direction, and relatively moving the nozzle on the substrate. The step of setting the scanning end point position to be stopped and the second horizontal movement speed higher than the first horizontal movement speed from the first horizontal movement speed at the final stage of the application scanning, the relative horizontal movement speed of the nozzle with respect to the substrate. And then reducing the second horizontal movement speed from the second horizontal movement speed to a third horizontal movement speed substantially equal to zero to place the nozzle at the scan end position; At the end of the scan, the gap between the substrate and the nozzle is increased once from a first distance interval to a second distance interval greater than the first distance interval, and then from the second distance interval to the first distance. Reducing to a third distance interval smaller than the interval, stopping the supply of the processing liquid from the nozzle to the substrate after the end or end of the coating scan, and the nozzle that has arrived at the scan end point position And a step of sucking a predetermined amount of the processing liquid on the substrate.

  The third coating method, the coating apparatus, and the coating processing program are the film thickness control method by acceleration / deceleration of the scanning speed in the first coating method, the coating apparatus, and the coating processing program, the second coating method, the coating apparatus, and the like. Since the film thickness control method by increasing / decreasing the coating gap in the coating processing program is used in combination, the film thickness uniformity in the product region on the substrate can be further improved by the synergistic effect of both.

  In a preferred aspect of the present invention, in order to improve the spread of the processing liquid at the coating scanning end portion and the stability and reproducibility of the film thickness, the processing liquid is used after a predetermined time has elapsed since the nozzle arrived at the scanning end position. Start sucking.

  According to a preferred aspect, in the coating apparatus of the present invention, the substrate support section includes a stage that floats the substrate in the air in the coating region. In the coating region, a large number of jet ports for ejecting gas and suction ports for sucking gas are provided on the upper surface of the stage. The nozzle may be arranged at a fixed position in the application region in the horizontal conveyance direction. The scanning unit is provided with a substrate transport unit that transports the substrate floating on the stage in a predetermined transport direction corresponding to the horizontal movement and passes immediately below the nozzle. The substrate transport unit includes a guide rail disposed on one or both sides of the stage so as to extend in parallel with the direction of movement of the substrate, a slider movable along the guide rail, and the slider along the guide rail. It has a conveyance drive unit that drives to move, and a holding unit that extends from the slider toward the center of the stage and holds the side edge of the substrate in a detachable manner. Further, as a preferable aspect, the elevating unit includes a nozzle supporting unit that integrally supports the nozzle, and a nozzle support for moving the nozzle up and down from an arbitrary first height position to an arbitrary second height position. An electric actuator coupled to the nozzle and an air cylinder coupled to the nozzle support for canceling the gravity of the nozzle.

  According to the coating method, the coating apparatus, and the coating processing program of the present invention, the film thickness controllability in the vicinity of the coating scanning end portion is improved in the spinless coating method using the long nozzle by the above configuration and operation. Quality can be improved.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows a coating and developing treatment system as a configuration example to which the coating method, the coating apparatus, and the coating processing program of the present invention can be applied. This coating / development processing system is installed in a clean room and uses, for example, an LCD substrate as a substrate to be processed, and performs cleaning, resist coating, pre-baking, development, and post-baking in the photolithography process in the LCD manufacturing process. is there. The exposure process is performed by an external exposure apparatus (not shown) installed adjacent to this system.

  This coating and developing system is roughly divided into a cassette station (C / S) 10, a process station (P / S) 12, and an interface unit (I / F) 14.

  A cassette station (C / S) 10 installed at one end of the system includes a cassette stage 16 on which a predetermined number, for example, four cassettes C for storing a plurality of substrates G can be placed, and a side on the cassette stage 16. And a transport path 17 provided in parallel with the arrangement direction of the cassette C, and a transport mechanism 20 that is movable on the transport path 17 and that allows the substrate C to be taken in and out of the cassette C on the stage 16. The transport mechanism 20 has a means for holding the substrate G, for example, a transport arm, can be operated with four axes of X, Y, Z, and θ, and is transported on the process station (P / S) 12 side described later. And the substrate G can be transferred.

  The process station (P / S) 12 includes, in order from the cassette station (C / S) 10 side, a cleaning process unit 22, a coating process unit 24, and a development process unit 26, a substrate relay unit 23, a chemical solution supply unit 25, and It is provided in a horizontal row via (spaced) the space 27.

  The cleaning process unit 22 includes two scrubber cleaning units (SCR) 28, an upper and lower ultraviolet irradiation / cooling unit (UV / COL) 30, a heating unit (HP) 32, and a cooling unit (COL) 34. Contains.

  The coating process unit 24 includes a spinless resist coating unit (CT) 40, a vacuum drying unit (VD) 42, an upper and lower two-stage adhesion / cooling unit (AD / COL) 46, and an upper and lower two-stage heating / cooling. A unit (HP / COL) 48 and a heating unit (HP) 50 are included.

  The development process unit 26 includes three development units (DEV) 52, two upper and lower two-stage heating / cooling units (HP / COL) 53, and a heating unit (HP) 55.

  Conveying paths 36, 51, 58 are provided in the longitudinal direction at the center of each process unit 22, 24, 26, and the conveying devices 38, 54, 60 move along the conveying paths 36, 51, 58, respectively. Each unit in the process unit is accessed to carry in / out or carry the substrate G. In this system, in each process part 22, 24, 26, a liquid processing system unit (SCR, CT, DEV, etc.) is disposed on one side of the transport paths 36, 51, 58, and heat treatment is performed on the other side. System units (HP, COL, etc.) are arranged.

  The interface unit (I / F) 14 installed at the other end of the system is provided with an extension (substrate transfer unit) 56 and a buffer stage 57 on the side adjacent to the process station 12, and is transported to the side adjacent to the exposure apparatus. A mechanism 59 is provided. The transport mechanism 59 is movable on the transport path 19 extending in the Y direction, and is used to load and unload the substrate G with respect to the buffer stage 57, and to extend from the extension (substrate transfer unit) 56 and the adjacent exposure device. The substrate G is transferred.

  FIG. 2 shows a processing procedure in this coating and developing processing system. First, in the cassette station (C / S) 10, the transport mechanism 20 takes out one substrate G from a predetermined cassette C on the cassette stage 16, and the cleaning process unit 22 of the process station (P / S) 12. It is transferred to the conveying device 38 (step S1).

  In the cleaning process section 22, the substrate G is first sequentially carried into an ultraviolet irradiation / cooling unit (UV / COL) 30, subjected to dry cleaning by ultraviolet irradiation in the first ultraviolet irradiation unit (UV), and then subjected to the next cooling unit ( In COL), the temperature is cooled to a predetermined temperature (step S2). This UV cleaning mainly removes organic substances on the substrate surface.

  Next, the substrate G is subjected to a scrubbing cleaning process by one of the scrubber cleaning units (SCR) 28 to remove particulate dirt from the substrate surface (step S3). After the scrubbing cleaning, the substrate G is subjected to dehydration treatment by heating in the heating unit (HP) 32 (step S4), and then cooled to a constant substrate temperature by the cooling unit (COL) 34 (step S5). Thus, the pretreatment in the cleaning process unit 22 is completed, and the substrate G is transferred to the coating process unit 24 by the transfer device 38 via the substrate transfer unit 23.

  In the coating process unit 24, the substrate G is first sequentially loaded into an adhesion / cooling unit (AD / COL) 46, and undergoes a hydrophobic treatment (HMDS) in the first adhesion unit (AD) (step S6). The cooling unit (COL) cools to a constant substrate temperature (step S7).

  Thereafter, the substrate G is coated with a resist solution by a spinless method in a resist coating unit (CT) 40, and then subjected to a drying process by reduced pressure in a reduced pressure drying unit (VD) 42 (step S8).

  Next, the substrate G is sequentially carried into the heating / cooling unit (HP / COL) 48, and the first heating unit (HP) performs baking after coating (pre-baking) (step S9), and then the cooling unit ( COL) to cool to a constant substrate temperature (step S10). In addition, the heating unit (HP) 50 can also be used for baking after this application | coating.

  After the coating process, the substrate G is transported to the interface unit (I / F) 14 by the transport device 54 of the coating process unit 24 and the transport device 60 of the development process unit 26, and is passed from there to the exposure apparatus (step). S11). In the exposure apparatus, a predetermined circuit pattern is exposed on the resist on the substrate G. After the pattern exposure, the substrate G is returned from the exposure apparatus to the interface unit (I / F) 14. The transport mechanism 59 of the interface unit (I / F) 14 passes the substrate G received from the exposure apparatus to the development process unit 26 of the process station (P / S) 12 via the extension 56 (step S11).

  In the development process unit 26, the substrate G is subjected to development processing in any one of the development units (DEV) 52 (step S12), and then sequentially carried into one of the heating / cooling units (HP / COL) 53, Post baking is performed in the first heating unit (HP) (step S13), and then the substrate is cooled to a constant substrate temperature in the cooling unit (COL) (step S14). A heating unit (HP) 55 can also be used for this post-baking.

  The substrate G that has undergone a series of processing in the development process section 26 is returned to the cassette station (C / S) 10 by the transfer devices 60, 54, and 38 in the process station (P / S) 24, where the transfer mechanism 20 Is stored in one of the cassettes C (step S1).

  In this coating and developing system, the present invention can be applied to, for example, the resist coating unit (CT) 40 of the coating process unit 24. An embodiment in which the present invention is applied to a resist coating unit (CT) 40 will be described below with reference to FIGS.

  FIG. 3 shows the overall configuration of the resist coating unit (CT) 40 and the vacuum drying unit (VD) 42 in this embodiment.

As shown in FIG. 3, a resist coating unit (CT) 40 and a vacuum drying unit (VD) 42 are arranged in a horizontal row on the support base or support frame 70 in the X direction. New substrate G to be subjected to the coating process is carried into the resist coating unit (CT) 40 as indicated by the arrow F _A by a conveying device 54 of the transport path 51 side (FIG. 1). Substrate G after completion of the coating process in the resist coating unit (CT) 40 is a transfer arm 74 which is movable in the X direction is guided by the guide rails 72 on the support table 70, a vacuum drying unit as indicated by the arrow F _B (VD) 42. Substrate G having been subjected to the drying treatment in a vacuum drying unit (VD) 42 is drawn off as shown by the arrow F _C by the transfer device 54 of the transport path 51 side (FIG. 1).

  The resist coating unit (CT) 40 includes a stage 76 that extends long in the X direction, and a long shape disposed above the stage 76 while carrying the substrate G in a flat flow on the stage 76 in the same direction. A resist solution is supplied onto the substrate G from the resist nozzle 78, and a resist coating film having a constant film thickness is formed on the upper surface (surface to be processed) of the substrate by a spinless method. The configuration and operation of each part in the unit (CT) 40 will be described in detail later.

  The vacuum drying unit (VD) 42 includes a tray or shallow container type lower chamber 80 having an open upper surface, and a lid-shaped upper chamber configured to be tightly fitted or fitted to the upper surface of the lower chamber 80. (Not shown). The lower chamber 80 is substantially rectangular, and a stage 82 for placing and supporting the substrate G horizontally is disposed at the center, and exhaust ports 83 are provided at the four corners of the bottom surface. Each exhaust port 83 communicates with a vacuum pump (not shown) through an exhaust pipe (not shown). With the lower chamber 80 covered with the upper chamber, the sealed processing space in both chambers can be depressurized to a predetermined degree of vacuum by the vacuum pump.

  4 and 5 show a more detailed overall configuration in the resist coating unit (CT) 40 in one embodiment of the present invention.

  In the resist coating unit (CT) 40 of this embodiment, the stage 76 does not function as a mounting table for fixing and holding the substrate G as in the prior art, but a substrate for floating the substrate G in the air by the force of air pressure. It functions as a levee. Then, the linear movement type substrate transport portions 84 arranged on both sides of the stage 76 hold both side edges of the substrate G floating on the stage 76 in a detachable manner, and the stage longitudinal direction (X direction) The substrate G is transferred to the substrate.

Specifically, the stage 76 is divided into _five regions M ₁ , M ₂ , M ₃ , M ₄ , and M ₅ in the longitudinal direction (X direction) (FIG. 5). The leftmost area M ₁ is a carry-in area, and a new substrate G to be subjected to the coating process is carried into a predetermined position in this area M ₁ . In this carry-in area M ₁ , the substrate G is received from the transfer arm of the transfer device 54 (FIG. 1) and loaded onto the stage 76 so as to move up and down between the original position below the stage and the forward movement position above the stage. A plurality of possible lift pins 86 are provided at predetermined intervals. These lift pins 86 are driven up and down by, for example, a lift pin lift unit 85 (FIG. 13) for carrying in using an air cylinder (not shown) as a drive source.

The loading area M ₁ is also the area substrate transfer of a floating starts, high-pressure or positive pressure to the stage upper surface of the region to float in flying height or flying height H _a for carrying the substrate G A number of jet outlets 88 for jetting compressed air are provided at a constant density. Here, the flying height H _a of the substrate G in the carrying region M ₁ does not require a particularly high accuracy, for example if kept in the range of 250～350Myuemu. Further, it is preferable that the size of the carry-in area M ₁ exceeds the size of the substrate G in the transport direction (X direction). Further, an alignment unit (not shown) for aligning the substrate G on the stage 76 may be provided in the carry-in area M ₁ .

A region M ₃ set at the center of the stage 76 is a resist solution supply region or a coating region, and the substrate G is supplied with the resist solution R from the upper resist nozzle 78 when passing through the coating region M ₃ . The substrate flying height _Hb in the coating region M ₃ defines a coating gap S (for example, 240 μm) between the lower end (discharge port) of the nozzle 78 and the upper surface of the substrate (surface to be processed). The coating gap S is an important parameter that affects the film thickness of the resist coating film and the resist consumption, and must be kept constant with high accuracy. From this, on the upper surface of the stage of the application region M ₃ , for example, a jet that ejects high-pressure or positive-pressure compressed air to float the substrate G with a desired flying height H _b in an arrangement or distribution pattern as shown in FIG. An outlet 88 and a suction port 90 for sucking air with a negative pressure are mixed and provided. Then, a vertical upward force due to compressed air is applied from the jet outlet 88 to a portion passing through the coating region M ₃ of the substrate G, and simultaneously a vertical downward force due to a negative pressure suction force is applied from the suction port 90. Thus, by controlling the balance between the opposing forces, the flying height _Hb for coating is maintained in the vicinity of the set value H _S (for example, 50 μm). The size of the coating region M ₃ in the transport direction (X direction) is sufficient if it has a margin enough to stably form the narrow coating gap S as described above immediately below the resist nozzle 78, and is usually larger than the size of the substrate G. It may be small, for example, about 1/3 to 1/4.

As shown in FIG. 6, in the application region M ₃ , the jet ports 88 and the suction ports 90 are alternately arranged on a straight line C that forms an angle inclined with respect to the substrate transport direction (X direction). An appropriate offset α is provided for the pitch on the straight line C between the columns. According to such an arrangement pattern, not only can the mixing density of the nozzles 88 and the suction ports 90 be made uniform, the substrate levitation force on the stage can be made uniform, but also when the substrate G moves in the transport direction (X direction). It is also possible to make the ratio of the time facing the 88 and the suction port 90 uniform in each part of the substrate, whereby the coating film formed on the substrate G is traced or transferred by the ejection port 88 or the suction port 90. Can be prevented. At the entrance of the coating region M ₃ , the jet outlets 88 arranged in the same direction (on the straight line J) so that the tip of the substrate G stably receives a uniform levitation force in the direction (Y direction) perpendicular to the transport direction, and It is preferable to increase the density of the suction port 90. Also in the coating region M ₃ , it is preferable to arrange only the ejection port 88 at both side edges (on the straight line K) of the stage 76 in order to prevent the both side edges of the substrate G from dripping.

5 again, the middle region M _2, which is set between the loading area M ₁ and the application area M ₃ are, coating the flying height of the substrate G during transport from the flying height H _a of the loading area M ₁ it is a transition region for changing or transition to flying height H _b in the area M _3. Even in the transition region M ₂ , the jet port 88 and the suction port 90 can be mixed and arranged on the upper surface of the stage 76. In that case, the density of the suction port 90 gradually increases along the conveying direction, whereby it as the flying height of the substrate G during transport moves in H _b from progressively H _a. Alternatively, in this transition region M ₂ , a configuration in which only the ejection port 88 is provided without including the suction port 90 is also possible.

A region M ₄ adjacent to the downstream side of the coating region M ₃ is a transition region for changing the flying height of the substrate G from the flying height H _b for coating to the flying height H _c (for example, 250 to 350 μm) during transportation. It is. Even in the transition region M ₄ , the ejection port 88 and the suction port 90 may be mixed on the upper surface of the stage 76, and in this case, the density of the suction port 90 should be gradually reduced along the transport direction. . Alternatively, a configuration in which only the ejection port 88 is provided without including the suction port 90 is also possible. In addition, as shown in FIG. 6, in the transition region M ₄ as well as the coating region M ₃ , the suction port 90 (and the spray nozzle 90) is used to prevent the transfer mark from being applied to the resist coating film formed on the substrate G. It is preferable that the outlet 88) is disposed on a straight line E that forms a certain inclined angle with respect to the substrate transport direction (X direction), and an appropriate offset β is provided in the arrangement pitch between adjacent rows.

A region M ₅ at the downstream end (right end) of the stage 76 is a carry-out region. The resist coating unit (CT) substrate G having received a coating process with 40, the transport arm 74 from a predetermined position or unloading position of the unloading area M ₅ vacuum drying unit on the downstream side next (FIG. 3) (VD) 42 ( 3). In the carry-out area M ₅ , a number of jet outlets 88 for floating the substrate G with a flying height H _c for carrying out are provided on the upper surface of the stage at a constant density, and the substrate G is unloaded from the stage 76. Thus, a plurality of lift pins 92 that can be moved up and down between the original position below the stage and the forward movement position above the stage are provided at predetermined intervals for delivery to the transfer arm 74 (FIG. 3). These lift pins 92 are driven up and down by, for example, a lift pin lift unit 91 (FIG. 13) for carrying out using an air cylinder (not shown) as a drive source.

  The resist nozzle 78 has a length that can cover the substrate G on the stage 76 from one end to the other end, and has a slit-like discharge port 78a at the lower end of a long nozzle body that extends in the horizontal direction (Y direction) perpendicular to the transport direction. And is attached to a nozzle-shaped or inverted U-shaped nozzle support 130 so as to be movable up and down, and is connected to a resist solution supply pipe 94 (FIG. 4) from the resist solution supply mechanism 170 (FIGS. 12 and 13). . In FIG. 4, a vertically extending rod 136 for supporting the resist nozzle 78 constitutes a part of the nozzle lifting mechanism 75 (FIGS. 11 and 13).

  As shown in FIGS. 4, 7, and 8, the substrate transport unit 84 includes a pair of guide rails 96 arranged in parallel on the left and right sides of the stage 76, and an axial direction (X direction) on each guide rail 96. A slider 98 movably attached to each other, a transport drive unit 100 for moving the slider 98 linearly on each guide rail 96, and right and left side edges of the substrate G extending from each slider 98 toward the center of the stage 76. And a holding portion 102 that holds the detachable holder.

  Here, the conveyance drive unit 100 is configured by a linear drive mechanism such as a linear motor. The holding unit 102 supports the suction pad 104 coupled to the lower surfaces of the left and right side edges of the substrate G by a vacuum suction force, and supports the suction pad 104 at the distal end, with the proximal end on the slider 98 side serving as a fulcrum. And a plate spring type pad support portion 106 that can be elastically deformed so that the height position of each can be changed. The suction pads 104 are arranged in a line at a constant pitch, and the pad support part 106 supports each suction pad 104 independently. As a result, the individual suction pads 104 and the pad support portions 106 can stably hold the substrate G at independent height positions (even at different height positions).

  As shown in FIGS. 7 and 8, the pad support portion 106 in this embodiment is attached to a plate-like pad elevating member 108 attached to the inner surface of the slider 98 so as to be elevable. A pad actuator 109 (FIG. 13) made of an air cylinder, for example, mounted on the slider 98 moves the pad elevating member 108 from the original position (retracted position) lower than the flying height position of the substrate G and the flying height of the substrate G. It is configured to move up and down between the forward movement position (coupling position) corresponding to the position.

  As shown in FIG. 9, each suction pad 104 is provided with a plurality of suction ports 112 on the upper surface of a rectangular parallelepiped pad body 110 made of, for example, synthetic rubber. These suction ports 112 are slit-like long holes, but may be round or rectangular small holes. For example, a belt-like vacuum tube 114 made of synthetic rubber is connected to the suction pad 104. The pipe lines 116 of these vacuum pipes 114 respectively communicate with the vacuum source of the pad suction control unit 115 (FIG. 13).

  As shown in FIG. 4, the holding unit 102 preferably has a separation type or completely independent type in which the vacuum suction pads 104 and the pad support units 106 on one side are separated for each set. However, as shown in FIG. 10, a single plate spring provided with a notch 118 is used to form a pad support portion 120 for one row on one side, and a vacuum suction pad 104 is placed on one row on the pad support portion 120. Configuration is also possible.

As described above, the large number of jets 88 formed on the upper surface of the stage 76, the compressed air supply mechanism 146 (FIG. 11) for supplying compressed air for generating levitation force to them, and the coating region M _{3 of the} stage 76. A substrate G is carried in the carry-in area M ₁ and the carry-out area M ₅ by a large number of suction ports 90 formed in a mixed manner with the jet outlets 88 and a vacuum supply mechanism 148 (FIG. 11) for supplying vacuum pressure thereto. A stage substrate floating portion 145 (FIG. 13) for floating the substrate G at a set floating amount H _S suitable for stable and accurate resist coating scanning is formed in the coating region M ₃ . Has been.

FIG. 11 shows configurations of the nozzle lifting mechanism 75, the compressed air supply mechanism 146, and the vacuum supply mechanism 148. The nozzle raising / lowering mechanism 75 is attached to the gate-shaped support body 130 and the portal-shaped support body 130 that is constructed so as to straddle the coating region M _{3 in} the horizontal direction (Y direction) orthogonal to the transport direction (X direction). And a joint rod 136 that couples a prismatic horizontal support member 134 that is a moving body (elevating body) of the vertical linear motion mechanism 132 and the resist nozzle 78. Here, the drive unit of the linear motion mechanism 132 includes an electric motor 138, a ball screw 140, a guide member 142, and an air cylinder 144. The rotational force of the electric motor 138 is converted into a vertical linear motion by the ball screw mechanism (140, 142, 134), and the nozzle 78 moves up and down integrally with the horizontal support member 134 of the lifting body. The moving amount and height position of the registration nozzle 78 can be arbitrarily controlled by the rotation amount and rotation stop position of the electric motor 138. The air cylinder 144 is for canceling the gravitational force of the registration nozzle 78 and the horizontal support member 134 when the registration nozzle 78 is moved up just before the end of the application scan described later, and the piston rod 144a is connected to the horizontal support portion 134. Assist the high-speed climb by pressing against both ends of the from below. A configuration in which the joint nozzle 136 is omitted and the resist nozzle 78 is directly coupled to the horizontal support member 134 is also possible.

  The compressed air supply mechanism 146 includes a positive pressure manifold 150 connected to the jet outlet 88 for each of a plurality of areas divided on the upper surface of the stage 76, and compressed air from the compressed air supply source 152 of factory power, for example, to the positive pressure manifold 150. Compressed air supply pipe 154 and a regulator 156 provided in the middle of the compressed air supply pipe 154. The vacuum supply mechanism 148 includes a negative pressure manifold 158 connected to the suction port 90 for each of a plurality of areas divided on the upper surface of the stage 76, and a vacuum pipe that feeds vacuum from the vacuum source 160 of factory power into the negative pressure manifold 158. 162 and a throttle valve 164 provided in the middle of the vacuum pipe 162.

  FIG. 12 shows the configuration of the resist solution supply mechanism 170. The resist solution supply mechanism 170 pre-fills the resist pump 176 with the resist solution R for at least one application process (for one substrate) from the bottle 172 storing the resist solution R through the suction pipe 174 to apply the resist solution R. At the time of processing, the resist solution R is sent from the resist pump 176 to the resist nozzle 78 through the discharge pipe or the resist liquid supply pipe 94 at a predetermined pressure, and the resist liquid R is discharged onto the substrate G from the resist nozzle 78 at a predetermined flow rate. It is like that.

The bottle 172 is hermetically sealed, and pressurized gas such as N ₂ gas is supplied at a constant pressure from the gas pipe 178 toward the liquid level in the bottle. The gas pipe 178 is provided with an on-off valve 180 made of an air operated valve, for example.

  A filter 182, a deaeration module 184, and an on-off valve 186 are provided in the middle of the suction pipe 174. The filter 182 removes foreign matter (dust) in the resist solution R sent from the bottle 172, and the degassing module 184 removes bubbles in the resist solution. The on-off valve 186 is composed of, for example, an air operated valve, and turns on (fully opens) or turns off (cuts off) the flow of the resist solution R in the suction pipe 174.

  An open / close valve 188 is provided in the middle of the resist solution supply pipe 94. There is no filter or suckback valve. The on-off valve 188 is composed of, for example, an air operated valve, and turns on (fully opens) or turns off (cuts off) the flow of the resist solution R in the resist solution supply pipe 94.

  The resist pump 176 includes, for example, a syringe pump, and includes a pump main body 190 having a pump chamber, a piston 192 for arbitrarily changing the volume of the pump chamber, and a pump drive unit 194 for reciprocating the piston 192. is doing.

  FIG. 13 shows the main configuration of the control system in the resist coating unit (CT) 40 of this embodiment. The controller 200 is formed of a microcomputer, and each unit in the unit, in particular, a resist solution supply mechanism 170, a nozzle lifting mechanism 75, a stage substrate floating portion 145, a substrate transport unit 84 (a transport drive unit 100, a pad suction control unit 115, a pad actuator Eta 109), the lift pin lifting / lowering part 85 for loading, the lift pin lifting / lowering part 91 for unloading, and the like, and the overall operation (sequence) are controlled.

  Next, the coating processing operation in the resist coating unit (CT) 40 of this embodiment will be described.

  The controller 200 takes in and executes a coating process program stored in a storage medium such as an optical disk in the main memory, and controls a series of programmed coating process operations.

When the transport device 54 new substrate G (FIG. 1) than the untreated is carried into the carry-area M ₁ stage 76, the lift pins 86 receives the substrate G at the forward position. After conveying device 54 has exited, the lift pins 86 are lowered down to a height position that is floating position H _a for conveying the substrate G (Figure 5). Next, an alignment unit (not shown) is operated, and a pressing member (not shown) is pressed against the floating substrate G from four directions to align the substrate G on the stage 76. When the alignment operation is completed, the pad actuator 109 is actuated immediately after that in the substrate transport section 84, and the suction pad 104 is raised (UP) from the original position (retracted position) to the forward movement position (coupled position). The suction pad 104 is vacuumed from the front, and is bonded by a vacuum suction force as soon as it comes into contact with the side edge of the floating substrate G. Immediately after the suction pad 104 is coupled to the side edge of the substrate G, the alignment unit retracts the pressing member to a predetermined position.

  Next, the substrate transport unit 84 moves the slider 98 straight from the transport start point position to the transport direction (X direction) at a relatively high constant speed while holding the side edge of the substrate G by the holding unit 102. In this way, the substrate G moves straight in the transport direction (X direction) while floating on the stage 76, and when the front end of the substrate G reaches a set position near the position immediately below the resist nozzle 78, the substrate transport unit 84 is the first. Stop substrate transfer in stages. At this time, the nozzle raising / lowering mechanism 75 waits for the resist nozzle 78 at the upper retracted position.

When the substrate G stops, the nozzle raising / lowering mechanism 75 operates to lower the resist nozzle 78 vertically downward, and the distance between the nozzle discharge port and the substrate G or the coating gap is adjusted to the initial value (for example, 60 μm). Next, the resist solution supply mechanism 170 starts discharging the resist solution from the resist nozzle 78 toward the upper surface of the substrate G. At the same time, the substrate transport unit 84 also starts the second stage substrate transport, while the nozzle lifting mechanism 75 The resist nozzle 78 is raised until the coating gap reaches a set value S _A (for example, 240 μm) (for example, for 0.1 second), and thereafter the substrate G is moved horizontally. _A relatively low first speed V _A (for example, 50 mm / s) is selected for the second stage, that is, the substrate conveyance during coating.

Thus, in the coating region M ₃ , the substrate G moves in a horizontal posture at a constant speed V _A in the transport direction (X direction), and at the same time, the long resist nozzle 78 faces the substrate G directly below the resist solution. by discharging R a strip with a constant pump pressure P _a, the coating film RM of the resist liquid toward the rear side from the front end side of the substrate G, as shown in FIG. 14 is gradually formed. During this coating scan, the resist solution R discharged onto the substrate G adheres to the lower side surface 78b on one side of the resist nozzle 78 due to the wetting phenomenon, spreads in the height direction (swells), and extends in the longitudinal direction of the nozzle (Y direction). A meniscus RQ is formed.

In this embodiment, the scanning speed (substrate conveyance speed), the coating gap, and the pressure of the resist pump 178 change with time characteristics as shown in FIG. To do. More specifically, from the time point t ₁ when the registration nozzle 78 relatively passes through a predetermined passing point X ₁ set on the substrate G, the substrate transport unit 84 controls the scanning speed (substrate transport) under the control of the controller 200. (Speed) is once increased at a predetermined acceleration (for example, 200 mm / s ² ) from the first speed V _A (50 mm / s) to a second speed V _B (for example, 70 mm / s) that is one step higher than that. . Then, as shown in FIG. 16, the meniscus resist swelled portion RQ that has adhered or followed the lower side surface 78b of the resist nozzle 78 is separated from the resist nozzle 78 by an instantaneous increase (rapid acceleration) of the scanning speed. Then, it moves away from the resist nozzle 78 as it is.

Here, the passing point X ₁ at which the scanning speed suddenly increases or accelerates depends on the resist solution characteristics (viscosity, etc.), coating conditions (film thickness, standard scanning speed, etc.), and coating specifications (margin size, etc.). may be suitably selected, but usually divided into the upper surface (surface to be processed) inside the product region (thickness guarantee area) E _S and the outer margin area (the film thickness non-guaranteed region) E _M of the substrate G boundary (Hereinafter referred to as “guaranteed region boundary”.) It may be set near L _X.

When the scanning speed is increased to the second speed V _B at the predetermined time point t ₂ due to the rapid acceleration as described above, the substrate transport section 84 then has a value at or near zero from the second speed, that is, the peak value V _B. The scanning speed is reduced at a predetermined deceleration rate (for example, −140 mm / s ² ) to the third speed V _C that takes the following. On the other hand, in conjunction with a decrease in the scanning speed (deceleration), the predetermined distance the nozzle lift mechanism 75 under the control of the controller 200 from a predetermined time point t ₃ the resist nozzle 78 in the vertical direction (Z direction) (for example, 140 .mu.m) Only at a predetermined moving speed (for example, 280 μm / s), the coating gap is narrowed from the distance distance S _A (240 μm) to a distance distance S _C (100 μm) smaller than that.

  FIG. 17 shows how the coating gap also decreases while the scanning speed decreases between the resist nozzle 78 and the substrate G just before the end of coating scanning. As shown in the figure, the resist liquid swell RQ separated immediately before from the lower side surface 78b of the resist nozzle 78 is placed behind the resist nozzle 78 in the scanning direction (−X direction) while maintaining the swelled state.

Thus the resist nozzle 78 is stopped predetermined scanning end position X _e arrived in So once the substrate G (FIG. 18), which the resist solution supply mechanism 170 under the control of the simultaneous or one after the other controller 200 Terminates the discharge operation of the resist pump 178 (FIG. 15). Then, even after the pump pressure drops to the reference standby pressure P _s near atmospheric pressure, it remains in a rest state for a while. During this time, the resist solution R spreads from the discharge port 78a of the resist nozzle 78 to the periphery, particularly in the horizontal direction (Y direction) perpendicular to the application scan, and reaches the corner of the rear end of the substrate fully.

The resist solution supply mechanism 170 causes the resist pump 178 to perform a suction operation after a predetermined time T _s has elapsed from the time point t ₅ when the pump pressure has dropped to the reference standby pressure P _s . That is, in the configuration example of FIG. 12, the piston 192 is moved backward by a fixed stroke. The resist nozzle 78 by blotting the resist solution R on the substrate G by the pump suction operation, the resist film thickness of the coating film RM towards the inside of the substrate G from the scanning end position X _e decreases. The resist solution supply mechanism 170 immediately returns to the reference standby pressure P _s when the pump pressure is reduced to the predetermined suction pressure P _B. Thus, the resist liquid R of the fixed amount from the substrate G is sucked into the resist nozzle 78 at a scanning end position X _e immediately after the end of the application scan.

In this embodiment, a raised portion RQ is formed in the vicinity of the guaranteed region boundary L _{X in} the process of coating scanning as described above, and the resist of the raised portion RQ is removed during sucking (suckback) immediately after the end of scanning as described above. by liquid is drawn to the scanning end position X _e side, as shown in FIG. 19, guarantee area boundary L around _X (especially guaranteed area E _S) resist film thickness of the coating film RM set value or within the allowable range of Adjusted or retained.

After suck-back is performed by scanning end position X _e as described above, under the control of the controller 200, moving the nozzle lift mechanism 75 is a resist nozzle 78 upward (save) is, at the same time the substrate conveyor unit 84 resumes the substrate conveyed to the unloading area M _5. This final stage substrate conveyance is performed at a larger conveyance speed than during the application scanning. When the substrate G arrives at the conveying end position in the unloading area M _5, the substrate conveying unit 84 to stop the substrate carrying the third stage. Immediately after this, the supply of the vacuum to the suction pad 104 is stopped, and the suction pad 104 descends from the forward movement position (coupling position) to the original position (retraction position) and is separated from both end portions of the substrate G. Instead, the lift pins 92 rise from the original position below the stage to the forward movement position above the stage in order to unload the substrate G.

Thereafter, the unloader, that is, the transfer arm 74 accesses the unloading area M ₅ , receives the substrate G from the lift pins 92, and unloads it out of the stage 76. The substrate transport unit 84 immediately returns the substrate G to the loading region M ₁ at a high speed when the substrate G is transferred to the lift pins 92. When the processed substrate G is unloaded as described above in the unloading area M ₅ , loading, alignment, or transfer start is performed on the new substrate G to be subjected to the next coating process in the loading area M ₁ .

As described above, in this embodiment, at the end of the application scan, the meniscus resist swell portion RQ that has adhered or followed the lower side surface 78b on one side of the resist nozzle 78 (the back side in the scanning direction) until then, It is separated from the resist nozzle 78 by an instantaneous increase (rapid acceleration) of the scanning speed (substrate transport speed), and is left behind the resist nozzle 78 in the scanning direction, preferably near the guaranteed region boundary L _X. Then, scan end by causing the suck back to the resist nozzle 78 at a scanning end position X _e on the substrate G immediately remove excess resist liquid coating scan end portion, the influence of the suck-back at that time (blotting action) it is possible to prevent by canceling the above desertion of the resist solution protuberances RQ, the resist film thickness in the guarantee area E _s becomes below the set value also allowable range.

FIGS. 20 to 22 show, as a comparative example, the operation when the step of instantaneously increasing (rapid acceleration) the scanning speed (substrate transport speed) as described above is omitted at the end of the application scanning. In this case, as shown in FIGS. 20 and 21, the resist solution raised part RQ of the meniscus at the bottom side 78b of the resist nozzle 78 is moved to the scanning end position X _e remain attached, the resist in the vicinity of guarantee area boundary L _X The raised portion is not formed in the coating solution. Then, when the resist nozzle 78 is stopped at the scanning end position X _e performs a suck back, guarantee area boundary L resist coating liquid in the vicinity of _X is also attracted to the scanning end position X _e side result, as shown in FIG. 22, resist film thickness of the coating film RM in guarantee area E _s becomes thinner than the set value.

In the coating processing method (FIG. 15) in the above-described embodiment, the thickness of the resist coating film is controlled in the scanning direction (−X direction) at the end of coating scanning. However, when the suck back method is used, it may be necessary to control the film thickness from another angle in the horizontal direction (Y direction) orthogonal to the scanning direction. That is, in the suck back method, the scanning speed and the coating gap are reduced between the resist nozzle 78 and the substrate G at the end of the coating scan as described above. The resist coating film RM spreads over a wide range from the vicinity of the region boundary L _{X to the} vicinity of the substrate edge in the side direction (Y direction). Due to the spread of the resist coating film RM in the side direction, the resist film thickness in the guaranteed region Es near the guaranteed region boundary L _Y in the same direction is reduced. After completion, it may become thinner than the set value or set range. In such a case, the film thickness control in the scanning direction in the above embodiment may not be able to cope with it.

In order to cope with this problem, the present invention provides effective film thickness control in the horizontal direction or the side direction (Y direction) orthogonal to the scanning direction. In this embodiment, at the end of the coating scan, the scanning speed (substrate transport speed), the coating gap, and the pressure of the resist pump 178 are changed with the time characteristics as shown in FIG. Among these characteristics, what is different from the control of FIG. 15 is the time characteristic of the coating gap. That is, by causing the resist nozzle 78 to move up and down by the nozzle lifting mechanism 75 under the control of the controller 200 at the end of the coating scan, the coating gap is changed from the first distance interval S _A (eg, 240 μm). It is once increased at a predetermined vertical movement speed (for example, 600 μm / s) up to a larger second distance interval S _B (for example, 300 μm), and then the predetermined vertical distance to a minimum distance interval S _C for sucking back (for example, 100 μm). Decrease at the moving speed (for example, 400 μm / s).

The passing point at which the coating gap increases from the first distance interval S _A to the second distance interval S _B as described above is also the characteristics of the resist solution (viscosity, etc.) and application conditions (film thickness, scanning speed). Etc.) and application specifications (margin size, etc.) may be selected as appropriate, and may normally be set near the guaranteed region boundary L _X in the scanning direction.

24 to 27 show the operation when each part is controlled with the above time characteristics (FIG. 23). First, at the end of the coating scan, the coating gap instantaneously increases near the guaranteed region boundary L _{X in} combination with an instantaneous increase (rapid acceleration) of the scanning speed (substrate conveyance speed). 24, the resist liquid rising portion RQ of the meniscus is separated from the lower side surface 78b of the resist nozzle 78 in a further raised state, and the side edge portion (Y direction) of the resist coating liquid RM as shown in FIGS. (End of the) is moved inward (necked), and the film thickness is also increased. As a result, even if the scanning speed is reduced and the coating gap is reduced between the resist nozzle 78 and the substrate G immediately after that, as shown in FIG. 27, in the vicinity of the guarantee region boundary L _X in the scanning direction. Thus, spreading of the resist coating film RM in the side direction (Y direction) can be prevented or suppressed. However, to put a predetermined period of time before starting suck back in order to stabilize the film thickness applied scan end portion (T _s), the resist coating film side direction near the scanning end position X _e as shown in FIG. 27 While extending to the substrate edge in a distant place from the guarantee area boundary L _X, not very even liquid amount spread.

As understood from comparison with the comparative example (FIG. 28), in this embodiment (FIG. 27), the side edge of the resist coating film RM is narrowed inward in the vicinity of the guarantee region boundary L _{X in the} scanning direction. That is, the resist film thickness in the guaranteed area Es increases near the guaranteed area boundary L _{Y in the} side direction (Y direction). As a result, when performing the suck-back at the scanning end position X _e, it is possible to resist film thickness in the guarantee area Es is prevented from becoming thinner than the allowable range at the end of the side direction (Y-direction).

FIG. 29 shows an example of the film thickness profile on the straight line Xs passing in the scanning direction (X direction) in the guarantee area Es slightly inside the guarantee area boundary L _Y in the side direction (Y direction) at the rear end portion of the substrate G. (FIG. 29) and a comparative example (FIG. 28) are shown in comparison. As shown in FIG. 29, the thickness of the resist coating film RM in the scanning direction is scanned end position X _e exponentially decreases toward the comparative example (FIG. 28) in the margin area EM not only guaranteed area Es However, although it is thinner than the set value Ds, in the embodiment (FIG. 27), the set value Ds can be held in the guaranteed area Es.

  As described above, in this embodiment, the film thickness control method by increasing / decreasing the coating gap is used in combination with the film thickness control method by accelerating / decelerating the scanning speed, thereby further improving the film thickness uniformity by the synergistic effect of both. be able to. However, depending on the application, it is also possible to use only the film thickness control method by increasing or decreasing the coating gap as shown in FIG. 15, 23, and 30, the timing at which each parameter changes and the mutual timing relationship are merely examples, and various modifications and changes are made depending on the type of resist solution, coating conditions, coating specifications, and the like as described above. Is possible. For example, in the characteristics shown in FIG. 23, the scanning speed and the timing at which the application gap is increased or decreased are made to coincide with each other, but the timings of the two can be appropriately shifted.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea. For example, the present invention is not limited to the levitation conveyance spinless coating method as in the above embodiment. A substrate is fixedly mounted horizontally on a mounting stage, and a resist solution is discharged onto the substrate in a strip shape while the long resist nozzle is moved in the horizontal direction perpendicular to the longitudinal direction of the nozzle above the substrate. The present invention can also be applied to a spinless coating method.

  Although the above-described embodiment relates to the resist coating apparatus in the coating and developing processing system of LCD manufacturing, the present invention is applicable to any coating method for coating a processing liquid on a substrate to be processed. Therefore, as the processing liquid in the present invention, in addition to the resist liquid, for example, a coating liquid such as an interlayer insulating material, a dielectric material, and a wiring material can be used, and a developing liquid or a rinsing liquid can also be used. The substrate to be processed in the present invention is not limited to an LCD substrate, and other flat panel display substrates, semiconductor wafers, CD substrates, photomasks, printed substrates and the like are also possible.

It is a top view which shows the structure of the application | coating development processing system which can apply this invention. It is a flowchart which shows the procedure of the process in the coating and developing treatment system of embodiment. It is a schematic plan view showing the entire configuration of a resist coating unit and a vacuum drying unit in the coating and developing treatment system of the embodiment. It is a perspective view which shows the whole structure of the resist coating unit in embodiment. It is a schematic front view which shows the whole structure of the resist coating unit in embodiment. It is a top view which shows an example of the array pattern of the jet nozzle and suction inlet in the stage application | coating area | region in the said resist application unit. It is a partial cross section schematic side view which shows the structure of the board | substrate conveyance part in the said resist application unit. It is an expanded sectional view which shows the structure of the holding | maintenance part of the board | substrate conveyance part in the said resist application unit. It is a perspective view which shows the structure of the pad part of the board | substrate conveyance part in the said resist application unit. It is a perspective view which shows one modification of the holding | maintenance part of the board | substrate conveyance part in the said resist application unit. It is a figure which shows the structure of the nozzle raising / lowering mechanism, compressed air supply mechanism, and vacuum supply mechanism in the said resist application unit. It is a figure which shows the structure of the resist liquid supply mechanism in the said resist application unit. It is a block diagram which shows the main structures of the control system in the said resist application unit. It is a side view which shows one step of the application | coating scanning in embodiment. It is a timing diagram which shows the time characteristic (1st Example) of the main parameters of the application | coating scanning end stage in embodiment. It is a partial cross section side view which shows the operation | movement of the one step of the application | coating end stage in embodiment. It is a partial cross section side view which shows the operation | movement of the one step of the application | coating end stage in embodiment. It is a partial cross section side view which shows the state at the time of completion | finish of application | coating scanning in embodiment. It is a partial cross section side view which shows the state of the resist coating film at the time of completion | finish of sack back | bag in embodiment. It is a partial cross section side view which shows the operation | movement of the one step just before completion | finish of application | coating scanning in a comparative example. It is a partial cross section side view which shows the state at the time of completion | finish of application | coating scanning in a comparative example. It is a partial cross section side view which shows the state of the resist coating film at the time of completion | finish of sackback in a comparative example. It is a timing diagram which shows the time characteristic (2nd Example) of the main parameters of the application | coating scanning end stage in embodiment. It is a partial cross section side view which shows the operation | movement of the one step of the application | coating end stage in embodiment. It is a partial expanded sectional view which shows the effect | action of the one stage of the application | coating scanning final stage in embodiment. It is a partial enlarged plan view which shows the operation | movement of the one step just before completion | finish of the application | coating scanning in embodiment. It is a partial enlarged plan view showing the state just before the end of application scanning in an embodiment. It is a partial enlarged plan view showing the state just before the end of coating scanning in a comparative example. It is a figure which shows the film thickness profile of the resist coating film in the application | coating scanning termination | terminus part on a board | substrate by contrasting an Example and a comparative example. It is a timing diagram which shows the time characteristic (3rd Example) of the main parameters of the application | coating scanning end stage in embodiment.

Explanation of symbols

40 resist coating unit (CT)
75 Nozzle Lifting Mechanism 76 Stage 78 Resist Nozzle 84 Substrate Transport Unit 88 Jet Port 90 Suction Port 100 Transport Drive Unit 102 Holding Unit 104 Suction Pad 122 Position Sensor 138 Electric Motor 144 Air Cylinder 146 Compressed Air Supply Mechanism 148 Vacuum Supply Mechanism 170 Resist Liquid supply mechanism 176 resists the pump 200 controller M ₁ carrying area M ₃ coating area M ₅ out region

Claims (18)

The substrate to be processed and the discharge port of the long nozzle are opposed substantially horizontally with a small gap, and the nozzle is moved in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. A coating method for performing a coating scan to form a coating film of the treatment liquid on the substrate,
Setting a scanning end point position for relatively stopping the nozzle on the substrate;
At the end of the coating scan, the relative horizontal movement speed of the nozzle with respect to the substrate is once increased from a first horizontal movement speed to a higher second horizontal movement speed, and then the second horizontal movement speed. Reducing the travel speed to a third horizontal travel speed substantially equal to zero to place the nozzle at the scan end position;
Decreasing the gap between the substrate and the nozzle from a first distance interval to a smaller second distance interval at the end of the application scan;
A step of stopping the supply of the processing liquid to the substrate from the nozzle after the end or the end of the coating scan;
And a step of sucking a predetermined amount of the processing liquid on the substrate by the nozzle attached at the scanning end position. The substrate to be processed and the discharge port of the long nozzle are opposed substantially horizontally with a minute gap, and the nozzle is relatively moved in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. A coating method for performing a coating scan to form a coating film of the treatment liquid on the substrate,
Setting a scanning end point position for relatively stopping the nozzle on the substrate;
At the end of the application scan, the relative horizontal movement speed of the nozzle relative to the substrate is reduced from a first horizontal movement speed to a second horizontal movement speed substantially equal to zero, and the nozzle is A process of arriving at the scanning end position;
At the end of the application scan, the gap between the substrate and the nozzle is increased once from the first distance interval to a larger second distance interval, and then from the second distance interval. Reducing to a third distance interval smaller than the first distance interval;
A step of stopping the supply of the processing liquid to the substrate from the nozzle after the end or the end of the coating scan;
And a step of sucking a predetermined amount of the processing liquid on the substrate by the nozzle attached at the scanning end position.   An area where the film thickness of the coating film should be guaranteed is set inside a boundary passing through a position offset from the outer peripheral edge of the substrate by a predetermined distance toward the center of the substrate, and the nozzle is positioned in the coating scanning direction. The coating method according to claim 2, wherein the increase of the gap is started at a timing of passing through the vicinity. The substrate to be processed and the discharge port of the long nozzle are opposed substantially horizontally with a minute gap, and the nozzle is relatively moved in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. A coating method of performing a scan to form a coating film of the treatment liquid on the substrate,
Setting a scanning end point position for relatively stopping the nozzle on the substrate;
At the end of the coating scan, the relative horizontal movement speed of the nozzle with respect to the substrate is once increased from a first horizontal movement speed to a higher second horizontal movement speed, and then the second horizontal movement speed. Reducing the travel speed to a third horizontal travel speed substantially equal to zero to place the nozzle at the scan end position;
At the end of the application scan, the gap between the substrate and the nozzle is increased once from a first distance interval to a second distance interval greater than the first distance interval, and then from the second distance interval to the first distance interval. Reducing to a third distance interval smaller than the distance interval of
A step of stopping the supply of the processing liquid to the substrate from the nozzle after the end or the end of the coating scan;
And a step of sucking a predetermined amount of the processing liquid on the substrate by the nozzle attached at the scanning end position.   An area where the film thickness of the coating film should be guaranteed is set inside a boundary passing through a position offset from the outer peripheral edge of the substrate by a predetermined distance toward the center of the substrate, and the nozzle is positioned in the coating scanning direction. The coating method according to claim 1 or 4, wherein acceleration of the horizontal movement speed is started at a timing of passing through the vicinity.   The coating method according to claim 5, wherein the gap starts to increase at a timing when the nozzle passes in the vicinity of the boundary in the coating scanning direction.   The coating method according to any one of claims 1 to 6, wherein the suction of the processing liquid is started after a predetermined time has elapsed since the nozzle arrived at the scanning end point position. A substrate support for supporting the substrate to be processed substantially horizontally;
An elongated nozzle for discharging a processing liquid across a minute gap on the upper surface of the substrate during application scanning;
A treatment liquid supply source for pumping the treatment liquid to the nozzle during application scanning;
A scanning unit for moving the nozzle in a horizontal direction relative to the substrate during application scanning;
An elevating unit for moving the nozzle in a vertical direction relative to the substrate;
The scanning unit is controlled to temporarily increase the relative horizontal movement speed of the nozzle with respect to the substrate from the first horizontal movement speed to a higher second horizontal movement speed at the end of the application scan. Then, the second horizontal movement speed is decreased from the second horizontal movement speed to a third horizontal movement speed substantially equal to zero at a predetermined deceleration rate so that the nozzle arrives at a preset scanning end point position, and the lifting unit is controlled. Then, at the end of the coating scan, the gap between the substrate and the nozzle is decreased from the first distance interval to a second distance interval smaller than the first distance interval, and the processing liquid supply source is controlled to apply the coating. A control unit that stops the pumping of the processing liquid to the nozzles at the end or after the end of scanning, and sucks a predetermined amount of the processing liquid on the substrate through the nozzles at the scanning end point position. apparatus. A substrate support for supporting the substrate to be processed substantially horizontally;
An elongated nozzle for discharging a processing liquid across a small gap on the upper surface of the substrate during the coating process;
A processing liquid supply source for pumping the processing liquid to the nozzle during the coating process;
A scanning unit for moving the nozzle in a horizontal direction relative to the substrate during a coating process;
An elevating unit for moving the nozzle in a vertical direction relative to the substrate;
The scanning unit is controlled to reduce the relative horizontal movement speed of the nozzle with respect to the substrate from the first horizontal movement speed to a second horizontal movement speed substantially equal to zero at the end of the application scan. Then, the nozzle is placed at a predetermined scanning end point position, and the lift is controlled so that the gap between the substrate and the nozzle is made larger than the first distance interval at the end of the application scanning. Increasing once to a large second distance interval and then decreasing from the second distance interval to a third distance interval smaller than the first distance interval to control the treatment liquid supply to And a controller that stops pumping of the processing liquid to the nozzle after the final stage or finishes and sucks a predetermined amount of the processing liquid on the substrate through the nozzle at the scanning end point position. A substrate support for supporting the substrate to be processed substantially horizontally;
An elongated nozzle for discharging a processing liquid across a minute gap on the upper surface of the substrate during application scanning;
A treatment liquid supply source for pumping the treatment liquid to the nozzle during application scanning;
A scanning unit for moving the nozzle in a horizontal direction relative to the substrate during application scanning;
An elevating unit for moving the nozzle in a vertical direction relative to the substrate;
The scanning unit is controlled to temporarily increase the relative horizontal movement speed of the nozzle with respect to the substrate from the first horizontal movement speed to a higher second horizontal movement speed at the end of the application scan. Then, the second horizontal movement speed is decreased to a third horizontal movement speed substantially equal to zero, the nozzle is placed at a preset scanning end point position, and the elevating unit is controlled to perform application scanning. The gap between the substrate and the nozzle is increased from a first distance interval to a larger second distance interval, and then from the second distance interval to the first distance interval. Is decreased to a small third distance interval, and the processing liquid supply source is controlled to stop the pumping of the processing liquid to the nozzle after the end or end of the coating scan, and before reaching the scanning end point position. Coating apparatus and a predetermined amount sucked to the control unit of the treatment liquid on the substrate through a nozzle.   The said board | substrate support part has a stage which floats the said board | substrate in the air in the said application | coating area | region, The coating device as described in any one of Claims 8-10.   12. The coating apparatus according to claim 11, wherein in the coating region, a large number of ejection ports for ejecting gas and suction ports for sucking gas are provided on the upper surface of the stage in a mixed manner. The nozzle is disposed at a predetermined position fixed in a horizontal direction in the application region;
13. The substrate scanning unit according to claim 11, wherein the scanning unit includes a substrate transport unit that transports the substrate in a floating state on the stage in a predetermined transport direction corresponding to the horizontal movement and passes immediately below the nozzle. The coating apparatus as described. The substrate transport unit is
A guide rail disposed on one or both sides of the stage so as to extend in parallel with the direction of movement of the substrate;
A slider movable along the guide rail;
A transport driving unit that drives the slider to move along the guide rail;
The coating apparatus according to claim 13, further comprising: a holding portion that extends from the slider toward a center portion of the stage and detachably holds a side edge portion of the substrate. The elevating part is
A nozzle support for integrally supporting the nozzle;
An electric actuator coupled with the nozzle support to move the nozzle up and down from an arbitrary first height position to an arbitrary second height position;
The coating apparatus according to any one of claims 11 to 14, further comprising an air cylinder coupled to the nozzle support portion to cancel the gravity of the nozzle. The substrate to be processed and the discharge port of the long nozzle are opposed substantially horizontally with a small gap, and the nozzle is moved in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. A coating processing program for performing coating scanning and forming a coating film of the processing liquid on the substrate,
Setting a scanning end point position for relatively stopping the nozzle on the substrate;
At the end of the coating scan, the relative horizontal movement speed of the nozzle with respect to the substrate is once increased from a first horizontal movement speed to a higher second horizontal movement speed, and then the second horizontal movement speed. Reducing the travel speed to a third horizontal travel speed substantially equal to zero to place the nozzle at the scan end position;
Decreasing the gap between the substrate and the nozzle from a first distance interval to a smaller second distance interval at a predetermined vertical speed at the end of the application scan;
Stopping the supply of the processing liquid from the nozzle to the substrate at the end or after the coating scan;
And a step of causing the nozzle attached at the scanning end position to suck a predetermined amount of the processing liquid on the substrate. The substrate to be processed and the discharge port of the long nozzle are opposed substantially horizontally with a minute gap, and the nozzle is relatively moved in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. A coating processing program for performing coating scanning and forming a coating film of the processing liquid on the substrate,
Setting a scanning end point position for relatively stopping the nozzle on the substrate;
At the end of the application scan, the relative horizontal movement speed of the nozzle relative to the substrate is reduced from a first horizontal movement speed to a second horizontal movement speed substantially equal to zero, and the nozzle is A step to reach the scanning end point;
At the end of the application scan, the gap between the substrate and the nozzle is increased once from the first distance interval to a larger second distance interval, and then from the second distance interval. Reducing to a third distance interval smaller than the first distance interval;
Stopping the supply of the processing liquid from the nozzle to the substrate at the end or after the coating scan;
And a step of causing the nozzle attached at the scanning end position to suck a predetermined amount of the processing liquid on the substrate. The substrate to be processed and the discharge port of the long nozzle are opposed substantially horizontally with a minute gap, and the nozzle is relatively moved in the horizontal direction while supplying the processing liquid from the nozzle to the substrate. A coating processing program for performing scanning and forming a coating film of the processing liquid on the substrate,
Setting a scanning end point position for relatively stopping the nozzle on the substrate;
At the end of the coating scan, the relative horizontal movement speed of the nozzle with respect to the substrate is once increased from a first horizontal movement speed to a higher second horizontal movement speed, and then the second horizontal movement speed. Reducing the travel speed to a third horizontal travel speed substantially equal to zero to place the nozzle at the scan end position;
At the end of the application scan, the gap between the substrate and the nozzle is increased once from a first distance interval to a second distance interval greater than the first distance interval, and then from the second distance interval to the first distance interval. Reducing to a third distance interval smaller than the distance interval of
Stopping the supply of the processing liquid from the nozzle to the substrate at the end or after the coating scan;
And a step of causing the nozzle attached at the scanning end position to suck a predetermined amount of the processing liquid on the substrate.

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