TW202306651A - Substrate conveying device, coating processing device, and substrate conveying method - Google Patents
Substrate conveying device, coating processing device, and substrate conveying method Download PDFInfo
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Abstract
Description
本揭示,係關於基板搬送裝置、塗佈處理裝置及基板搬送方法。The present disclosure relates to a substrate transfer device, a coating processing device, and a substrate transfer method.
在專利文獻1,係揭示有如下述內容:沿著在基板之搬送方向上延伸的兩根導引軌搬送基板,並將機能液的液滴吐出至基板。 [先前技術文獻] [專利文獻] Patent Document 1 discloses that a substrate is conveyed along two guide rails extending in a substrate conveyance direction, and droplets of a functional liquid are discharged onto the substrate. [Prior Art Literature] [Patent Document]
[專利文獻1]日本特開2018-126718號公報[Patent Document 1] Japanese Patent Laid-Open No. 2018-126718
[本發明所欲解決之課題][Problems to be Solved by the Invention]
本揭示,係提供一種使基板搬送中之誤差減少的技術。 [用以解決課題之手段] The present disclosure provides a technique for reducing errors in substrate transfer. [Means to solve the problem]
本揭示之一態樣的基板搬送裝置,係具備有:一對導引軌;一對移動部;複數個主保持部;及副保持部。一對導引軌,係沿著基板之搬送方向延伸。一對移動部,係沿著一對導引軌分別移動。複數個主保持部,係分別被設置於一對移動部上,從基板的下方保持基板。副保持部,係被設置於在各移動部上相鄰的主保持部之間,從基板的下方保持基板。複數個主保持部,係具備有:第1吸附部,吸附保持基板;及調整部,調整第1吸附部的位置。副保持部,係具備有:第2吸附部,吸附保持基板;及追隨部,追隨基於第1吸附部的位置之調整的基板之移動,調整第2吸附部的位置。 [發明之效果] A substrate transfer device according to an aspect of the present disclosure includes: a pair of guide rails; a pair of moving parts; a plurality of main holding parts; and auxiliary holding parts. A pair of guide rails extend along the conveying direction of the substrate. The pair of moving parts move respectively along the pair of guide rails. A plurality of main holding parts are respectively provided on a pair of moving parts, and hold the substrate from below the substrate. The sub-holding part is provided between the main holding parts adjacent to each moving part, and holds the substrate from below the substrate. The plurality of main holding parts are provided with: a first suction part for holding the substrate by suction; and an adjustment part for adjusting the position of the first suction part. The sub-holding unit includes: a second suction unit for suction-holding the substrate; and a follow-up unit for adjusting the position of the second suction unit following the movement of the substrate based on the adjustment of the position of the first suction unit. [Effect of Invention]
根據本揭示,可使基板搬送中之誤差減少。According to the present disclosure, errors in substrate transfer can be reduced.
以下,參閱附加圖面,詳細地說明本申請案所揭示之基板搬送裝置、塗佈處理裝置及基板搬送方法的實施形態。另外,並非藉由以下所示之實施形態來限定所揭示的基板搬送裝置、塗佈處理裝置及基板搬送方法。Hereinafter, embodiments of the substrate transfer device, coating processing device, and substrate transfer method disclosed in the present application will be described in detail with reference to the attached drawings. In addition, the disclosed substrate transfer device, coating processing device, and substrate transfer method are not limited by the embodiments described below.
在以下參閱的各圖面中,係為了容易理解說明,而表示「規定相互正交之X軸方向、Y軸方向及Z軸方向,並將Z軸正方向設成為垂直向上方向」的正交座標系統。In each of the drawings referred to below, for the sake of easy understanding of the description, the orthogonality of "regulating the mutually orthogonal X-axis direction, Y-axis direction, and Z-axis direction, and setting the positive direction of the Z-axis as the vertical upward direction" is shown. coordinate system.
又,在此,係規定前後方向並規定左右方向,該前後方向,係將Y軸正方向設成為前方,將Y軸負方向設成為後方,該左右方向,係將X軸正方向設成為右方,將X軸負方向設成為左方。又,規定上下方向,該上下方向,係將Z軸正方向設成為上方,將Z軸負方向設成為下方。基板處理裝置1,係一邊從後方朝向前方沿著前後方向搬送基板S,一邊處理基板S。亦即,基板處理裝置1,係一邊沿著搬送方向(Y軸方向)搬送基板S,一邊處理基板S。Here, the front-rear direction is defined and the left-right direction is defined. In the front-rear direction, the positive direction of the Y-axis is defined as the front, and the negative direction of the Y-axis is defined as the rear. In the left-right direction, the positive direction of the X-axis is defined as the right. Set the negative direction of the X axis to the left. In addition, the up-down direction is defined, and in the up-down direction, the positive direction of the Z-axis is defined as upward, and the negative direction of the Z-axis is defined as downward. The substrate processing apparatus 1 processes the substrate S while transporting the substrate S in the front-rear direction from the rear to the front. That is, the substrate processing apparatus 1 processes the substrate S while conveying the substrate S along the conveyance direction (Y-axis direction).
<整體構成> 參閱圖1,說明關於實施形態之基板處理裝置1的整體構成。圖1,係表示實施形態的基板處理裝置1之一部分的示意平面圖。基板處理裝置1,係一邊沿水平方向搬送工件即基板S,一邊以噴墨方式對基板S進行描繪。基板S,係例如被使用於平板顯示器的基板。 <Overall composition> Referring to FIG. 1, the overall configuration of a substrate processing apparatus 1 according to the embodiment will be described. FIG. 1 is a schematic plan view showing part of a substrate processing apparatus 1 according to an embodiment. The substrate processing apparatus 1 draws on the substrate S by an inkjet method while conveying the substrate S which is a workpiece in the horizontal direction. The substrate S is, for example, a substrate used for a flat panel display.
基板處理裝置1,係具備有:上浮平台2;第1導引軌3_1;及第2導引軌3_2。又,基板處理裝置1,係具備有:第1移動部4_1;及第2移動部4_2。又,基板處理裝置1,係具備有:第1主保持部5_1;第2主保持部5_2;第3主保持部5_3;第4主保持部5_4;第1副保持部6_1;及第2副保持部6_2。又,基板處理裝置1,係具備有:複數個塗佈部7;維護部8;及控制裝置9。The substrate processing apparatus 1 is provided with: a
另外,以下,係有時將第1導引軌3_1及第2導引軌3_2統稱記載為「導引軌3」。又,有時將第1移動部4_1及第2移動部4_2統稱記載為「移動部4」。又,有時將第1主保持部5_1~第4主保持部5_4統稱記載為「主保持部5」。又,有時將第1副保持部6_1及第2副保持部6_2統稱記載為「副保持部6」。In addition, below, the 1st guide rail 3_1 and the 2nd guide rail 3_2 may be collectively described as "the
上浮平台2,係具有多數個噴出口(未圖示)。上浮平台2,係從噴出口朝向基板S之下面噴吹經壓縮的氣體(例如空氣),對基板S賦予作用於上方的力(以下,記載為「上浮力」)。上浮平台2,係以賦予上浮力的方式,調整被保持於主保持部5及副保持部6之基板S的上浮高度。亦即,上浮平台2,係從下方對被保持於主保持部5及副保持部6之基板S噴吹氣體,調整基板S的上浮高度。The
上浮平台2,係包含有搬入基板S的搬入平台及搬出基板S的搬出平台。搬入平台,係被設置於基板處理裝置1的後方側。搬出平台,係被設置於基板處理裝置1的前方側。The
另外,上浮平台2,係亦可沿著搬送方向(Y軸方向)設置複數個。位於塗佈部7之下方的上浮平台2上之基板S的上浮高度之範圍,係比其他的上浮平台2上之基板S的上浮高度之範圍窄。例如,位於塗佈部7之下方的上浮平台2上之基板S的上浮高度之範圍,係30~60μm。其他的上浮平台2上之基板S的上浮高度之範圍,係200~2000μm。In addition, a plurality of
例如,在位於塗佈部7之下方的上浮平台2中,係亦可藉由「朝向基板S之下面吐出經壓縮的空氣,並且吸引基板S與上浮平台2之間的空氣」的方式,調整基板S的上浮高度。For example, in the
第1導引軌3_1及第2導引軌3_2,係被排列於左右方向(X軸方向)且沿著搬送方向(Y軸方向)延伸。The 1st guide rail 3_1 and the 2nd guide rail 3_2 are arranged in the left-right direction (X-axis direction), and extend along a conveyance direction (Y-axis direction).
第1導引軌3_1及第2導引軌3_2,係被配置為在左右方向(X軸方向)夾著上浮平台2。第1導引軌3_1,係被配置於上浮平台2的X軸正方向側,第2導引軌3_2,係被配置於上浮平台2的X軸負方向側。第1導引軌3_1及第2導引軌3_2,係例如藉由花崗岩所構成。與搬送方向(Y軸方向)正交之導引軌3的剖面,係例如矩形狀。The 1st guide rail 3_1 and the 2nd guide rail 3_2 are arrange|positioned so that the
第1移動部4_1,係被設置於第1導引軌3_1上,沿著第1導引軌3_1移動。第2移動部4_2,係被設置於第2導引軌3_2上,沿著第2導引軌3_2移動。另外,第1移動部4_1及第2移動部4_2,係分別具有馬達等的驅動部,可各自獨立地移動。The 1st moving part 4_1 is installed on the 1st guide rail 3_1, and moves along the 1st guide rail 3_1. The 2nd moving part 4_2 is installed on the 2nd guide rail 3_2, and moves along the 2nd guide rail 3_2. In addition, the 1st moving part 4_1 and the 2nd moving part 4_2 each have a drive part, such as a motor, and can move independently.
複數個主保持部5,係分別被設置於第1移動部4_1及第2移動部4_2上,從基板S的下方保持基板S。The plurality of
具體而言,複數個主保持部5中之第1主保持部5_1及第2主保持部5_2,係被設置於第1移動部4_1上,第3主保持部5_3及第4主保持部5_4,係被設置於第2移動部4_2上。第1主保持部5_1及第2主保持部5_2,係在第1移動部4_1上,沿著搬送方向(Y軸方向)以第1主保持部5_1及第2主保持部5_2的順序排列。又,第3主保持部5_3及第4主保持部5_4,係在第2移動部4_2上,沿著搬送方向(Y軸方向)以第3主保持部5_3及第4主保持部5_4的順序排列。另外,複數個主保持部5之數量,係不限定於四個。Specifically, the first main holding part 5_1 and the second main holding part 5_2 among the plurality of
副保持部6,係被設置於在各移動部4上相鄰的主保持部5之間,從基板S的下方保持基板S。The
具體而言,第1副保持部6_1,係被設置於在第1移動部4_1上相鄰的第1主保持部5_1及第2主保持部5_2之間。又,第2副保持部6_2,係被設置於在第2移動部4_2上相鄰的第3主保持部5_3及第4主保持部5_4之間。另外,複數個副保持部6之數量,係不限定於兩個。Specifically, the first sub-holding part 6_1 is provided between the first main holding part 5_1 and the second main holding part 5_2 adjacent on the first moving part 4_1. In addition, the second sub-holding part 6_2 is provided between the third main holding part 5_3 and the fourth main holding part 5_4 adjacent on the second moving part 4_2. In addition, the number of the plurality of
在實施形態中,複數個(在此,係四個)主保持部5,係從基板S之下方保持基板S的四角。又,複數個(在此,係兩個)副保持部6,係從基板S的下方保持基板S中之未被主保持部5保持的側緣。基板S,係在藉由複數個主保持部5保持四角並藉由複數個副保持部6保持側緣且藉由上浮平台2而上浮的狀態下,藉由第1移動部4_1及第2移動部4_2,沿著搬送方向(Y軸正方向)搬送。In the embodiment, a plurality of (here, four)
如此一來,在基板處理裝置1中,係在基板S之搬送中,藉由副保持部6保持基板S中之未被主保持部5保持的側緣,藉此,可抑制所搬送的基板S之撓曲。In this way, in the substrate processing apparatus 1, during the conveyance of the substrate S, the side edge of the substrate S that is not held by the
塗佈部7,係對沿著搬送方向(Y軸正方向)所搬送的基板S塗佈機能液。機能液,係墨水。塗佈部7,係對藉由上浮平台2調整了上浮高度的基板S塗佈機能液。具體而言,塗佈部7,係藉由對基板S吐出機能液的方式,對基板S塗佈機能液。塗佈部7,係沿著左右方向(X軸方向)配置複數個。在圖1所示之例子中,係雖表示沿著左右方向(X軸方向)配置了七個塗佈部7的狀態,但塗佈部7之數量不限於此。塗佈部7,係具有吐出機能液的複數個頭部,將機能液從各頭部吐出至基板S。The
塗佈部7,係可沿著被排列於Y軸方向且沿著X軸方向延伸的一對軌道10移動。一對軌道10,係例如被設置為相對於上浮平台2向右方延伸。在上浮平台2之右方的一對軌道10間,係設置有維護部8。塗佈部7,係可在成為維護部8之上方的位置與對基板S吐出機能液的位置之間移動。塗佈部7,係藉由驅動裝置例如線性馬達,沿著一對軌道10在左右方向移動。複數個塗佈部7,係亦可獨立地在左右方向移動,且亦可一體地在左右方向移動。The
維護部8,係進行塗佈部7之頭部的維護,解除或防止塗佈部7之頭部的吐出不良等。另外,維護部8,係亦可被設置於上浮平台2的上方。The
控制裝置9,係例如電腦,具備有控制部91與記憶部92。在記憶部92,係儲存有控制在基板處理裝置1中所執行之各種處理的程式。控制部91,係藉由讀出並執行被記憶於記憶部92之程式的方式,控制基板處理裝置1的動作。The
另外,該程式,係被記錄於電腦可讀取之記憶媒體者,且亦可為從記憶媒體被安裝於控制裝置9的記憶部92者。作為電腦可讀取之記憶媒體,係例如有硬碟(HD)、軟碟片(FD)、光碟(CD)、磁光碟(MO)、記憶卡等。In addition, the program is recorded on a computer-readable storage medium, and may be installed in the
<主保持部>
其次,參閱圖2及圖3,說明關於主保持部5的構成。圖2,係實施形態之主保持部5的示意平面圖。又,圖3,係實施形態之主保持部5的示意側視圖。另外,在圖2及圖3,係雖表示第1主保持部5_1作為一例,但第2主保持部5_2~第4主保持部5_4的構成亦與第1主保持部5_1相同。
<Main holding part>
Next, referring to FIG. 2 and FIG. 3 , the configuration of the
如圖2及圖3所示般,主保持部5,係具備有:基底部50;第1調整部51;第2調整部52;轉動部53;臂部54;及第1吸附部55。As shown in FIGS. 2 and 3 , the
第1吸附部55,係吸附保持基板S。具體而言,第1吸附部55,係具備有:複數個吸附盤551。複數個吸附盤551,係被排列設置於水平方向(在此,係Y軸方向)。另外,在此,係雖表示第1吸附部55具備有三個吸附盤551時的例子,但吸附盤551之數量不限定於三個。第1吸附部55,係藉由複數個吸附盤551,吸附基板S的下面並保持基板S。The
基底部50、第1調整部51、第2調整部52、轉動部53及臂部54,係調整第1吸附部55相對於移動部4之相對位置的調整部之一例。The
基底部50,係被固定於移動部4上。第1調整部51,係被設置於基底部50上,可在基底部50上沿著左右方向(X軸方向)移動。第2調整部52,係被設置於第1調整部51上,可在第1調整部51上沿著前後方向(Y軸方向)移動。轉動部53,係被設置於第2調整部52上,可繞垂直軸(Z軸)旋轉。臂部54,係延伸於水平方向的構件,在基端部被支撐於轉動部53,並在前端部支撐第1吸附部55。The
如此一來,調整部,係使第1調整部51沿著左右方向(X軸方向)移動,藉此,可使第1吸附部55在左右方向(X軸方向)移動。亦即,第1調整部51,係可沿著左右方向(X軸方向),調整第1吸附部55相對於移動部4的位置。In this way, the adjustment unit moves the
又,調整部,係使第2調整部52沿著前後方向(Y軸方向)移動,藉此,可使第1吸附部55在前後方向(Y軸方向)移動。亦即,第2調整部52,係可沿著前後方向(Y軸方向),調整第1吸附部55相對於移動部4的位置。In addition, the adjustment unit can move the
又,調整部,係藉由「轉動部53繞垂直軸(Z軸)轉動」的方式,可使經由臂部54被支撐於轉動部53的第1吸附部55繞垂直軸(Z軸)轉動。亦即,轉動部53,係第3調整部之一例,可沿著以垂直軸(Z軸方向)為中心之圓周方向,調整第1吸附部55相對於移動部4的位置。In addition, the adjusting part can rotate the
另外,第1調整部51及第2調整部52,係分別具有馬達等的驅動部,可各自獨立地移動。另一方面,轉動部53,係例如軸承且不具有驅動部,以追隨第1調整部51及第2調整部52之動作的方式,使第1吸附部55轉動。另外,並不限於此,亦可在轉動部53設置驅動部。Moreover, the
然而,一對導引軌3,係沿著基板S之搬送方向即前後方向(Y軸方向)延伸。作為一例,一對導引軌3之前後方向(Y軸方向)上的長度,係3~7m左右。如此一來,由於一對導引軌3較長,因此,恐有難以完全筆直地形成且在左右方向(X軸方向)產生例如數μm左右的變形之虞。相同地,在一對導引軌3,係恐有在垂直方向(Z軸方向)亦產生數μm的變形之虞。又,即便假設可筆直地形成一對導引軌3,亦恐有因環境變化(例如,溫度變化)而事後產生變形之虞。However, the pair of
如此一來,當在一對導引軌3存在變形時,則複數個(在此,係四個)主保持部5中之相鄰的兩個主保持部5之間的距離發生變化。亦即,複數個主保持部5的相對位置發生變化。換言之,複數個第1吸附部55的相對位置發生變化。當複數個第1吸附部55的相對位置發生變化時,則第1吸附部55與基板S之位置關係發生變化。藉此,因第1吸附部55相對於基板S偏移而變得難以高精度地搬送基板S。特別是,如實施形態之基板處理裝置1般,在第1移動部4_1及第2移動部4_2並非一體而是獨立的情況下,複數個主保持部5之相對位置容易因導引軌3的變形而偏移。In this way, when the pair of
因此,在基板處理裝置1中,係以在搬送基板S的期間,使複數個主保持部5中之相鄰的兩個主保持部5間的距離成為預先設定之距離的方式,藉由各主保持部5之第1調整部51及第2調整部52,調整第1吸附部55相對於移動部4的位置。Therefore, in the substrate processing apparatus 1, while the substrate S is being conveyed, the distance between two adjacent
<副保持部>
其次,參閱圖4及圖5,說明關於副保持部6的構成。圖4,係實施形態之副保持部6的示意平面圖。又,圖5,係實施形態之副保持部6的示意側視圖。另外,在圖4及圖5,係雖表示第1副保持部6_1作為一例,但第2副保持部6_2的構成亦與第1副保持部6_1相同。
<Auxiliary Holder>
Next, referring to FIG. 4 and FIG. 5 , the configuration of the
如圖4及圖5所示般,副保持部6,係具備有:一對基底部61;臂部62;及第2吸附部63。As shown in FIGS. 4 and 5 , the
第2吸附部63,係吸附保持基板S。具體而言,第2吸附部63,係具備有:複數個吸附盤631。複數個吸附盤631,係被排列設置於水平方向(在此,係Y軸方向)。另外,在此,係雖表示第2吸附部63具備有三個吸附盤631時的例子,但吸附盤631之數量不限定於三個。第2吸附部63,係藉由複數個吸附盤631,吸附基板S的下面並保持基板S。The
第2吸附部63,係沿著基板S之搬送方向即前後方向(Y軸方向)的長度比第1吸附部55長。另外,沿著第2吸附部63之前後方向(Y軸方向)的長度,係亦可與沿著第1吸附部55之前後方向(Y軸方向)的長度相同,且亦可比沿著第1吸附部55之前後方向(Y軸方向)的長度短。The length of the
一對基底部61及臂部62,係追隨基於第1吸附部55的位置之調整的基板S之移動,調整第2吸附部63相對於移動部4之相對位置的追隨部之一例。The pair of
一對基底部61,係被固定於移動部4上。臂部62,係延伸於水平方向之大致T字形的構件,一對基端部經由球體61a分別可水平移動且可轉動地被支撐於一對基底部61內,並在一個前端部支撐第2吸附部63。A pair of
追隨部,係可藉由「追隨沿著左右方向(X軸方向)的基板S之移動,臂部62在左右方向(X軸方向)上移動」的方式,使被支撐於臂部62的第2吸附部63在左右方向(X軸方向)上移動。亦即,臂部62,係可追隨基於第1吸附部55的位置之調整之沿著左右方向(X軸方向)的基板S之移動,在左右方向(X軸方向)上調整第2吸附部63相對於移動部4的位置。The following part can make the
又,追隨部,係可藉由「追隨沿著前後方向(Y軸方向)的基板S之移動,臂部62在前後方向(Y軸方向)上移動」的方式,使被支撐於臂部62的第2吸附部63在前後方向(Y軸方向)上移動。亦即,臂部62,係可追隨基於第1吸附部55的位置之調整之沿著前後方向(Y軸方向)的基板S之移動,在前後方向(Y軸方向)上調整第2吸附部63相對於移動部4的位置。Also, the following part can be supported by the
又,追隨部,係可藉由「追隨沿著以垂直軸(Z軸)為中心之圓周方向的基板S之移動,臂部62繞垂直軸(Z軸)轉動」的方式,使被支撐於臂部62的第2吸附部63繞垂直軸(Z軸)轉動。亦即,臂部62,係可追隨基於第1吸附部55的位置之調整之沿著以垂直軸(Z軸)為中心之圓周方向的基板S之移動,在以垂直軸(Z軸)為中心之圓周方向上調整第2吸附部63相對於移動部4的位置。In addition, the following part can be supported by the method of "following the movement of the substrate S along the circumferential direction centered on the vertical axis (Z axis), and the
然而,在基板處理裝置1中,係在基板S之搬送中,藉由副保持部6保持基板S中之未被主保持部5保持的側緣,藉此,抑制所搬送的基板S之撓曲。而且,在基板處理裝置1中,係藉由各主保持部5之第1調整部51及第2調整部52,調整第1吸附部55相對於移動部4的位置。However, in the substrate processing apparatus 1, during the conveyance of the substrate S, the side edge of the substrate S not held by the
如此一來,藉由調整第1吸附部55相對於移動部4的位置,基板S進行移動。當基板S移動時,則副保持部6之第2吸附部63與基板S的位置關係發生變化。藉此,因基板S相對於第2吸附部63偏移而變得難以高精度地搬送基板S。In this way, the substrate S moves by adjusting the position of the
因此,在實施形態之基板處理裝置1中,係在搬送基板S的期間,藉由副保持部6之臂部62,追隨基於第1吸附部55的位置之調整的基板S之移動,調整第2吸附部63相對於移動部4的位置。藉此,抑制所搬送的基板S之撓曲,並且可抑制基板S相對於第2吸附部63的位置偏移。亦即,在搬送基板S的期間,即便在調整第1吸附部55相對於移動部4之位置的情況下,亦可適當地保持第2吸附部63與基板S的位置關係。Therefore, in the substrate processing apparatus 1 of the embodiment, while the substrate S is being conveyed, the
<基板處理裝置之處理流程>
其次,參閱圖6,說明關於實施形態之基板處理裝置1所執行的處理之程序。圖6,係表示實施形態之基板處理裝置1所執行的處理之程序的流程圖。圖6所示之各處理,係依照控制裝置9的控制來執行。
<Processing flow of substrate processing equipment>
Next, referring to FIG. 6 , the procedure of processing performed by the substrate processing apparatus 1 of the embodiment will be described. FIG. 6 is a flow chart showing a procedure of processing executed by the substrate processing apparatus 1 according to the embodiment. Each processing shown in FIG. 6 is executed under the control of the
基板處理裝置1,係進行保持工程(步驟S101)。基板處理裝置1,係藉由複數個主保持部5及副保持部6保持被搬送至上浮平台2的基板S。具體而言,基板處理裝置1,係藉由各主保持部5之第1吸附部55吸附基板S的四角且藉由副保持部6之第2吸附部63吸附基板S的側緣,藉此,保持基板S。The substrate processing apparatus 1 performs a holding process (step S101). The substrate processing apparatus 1 holds the substrate S conveyed to the floating table 2 by a plurality of main holding
基板處理裝置1,係進行搬送工程(步驟S102)。基板處理裝置1,係使一對移動部4沿著一對導引軌3移動,藉此,沿著搬送方向搬送基板S。The substrate processing apparatus 1 performs a transfer process (step S102). The substrate processing apparatus 1 transports the substrate S along the transport direction by moving the pair of moving
基板處理裝置1,係進行調整工程(步驟S103)。基板處理裝置1,係在搬送基板S的期間,藉由各主保持部5之第1調整部51及第2調整部52,調整第1吸附部55相對於移動部4的位置。此時,基板處理裝置1,係藉由副保持部6之臂部62,追隨基於第1吸附部55的位置之調整的基板S之移動,調整第2吸附部63的位置。The substrate processing apparatus 1 performs an adjustment process (step S103). The substrate processing apparatus 1 adjusts the position of the
基板處理裝置1,係進行塗佈工程(步驟S104)。基板處理裝置1,係將機能液從塗佈部7吐出至沿著搬送方向所搬送的基板S,並對基板S塗佈機能液。塗佈了機能液之基板S,係從上浮平台2被搬出。The substrate processing apparatus 1 performs a coating process (step S104). The substrate processing apparatus 1 discharges the functional liquid from the
<變形例>
基板處理裝置之構成,係不限定於實施形態中所示的構成。因此,以下,係參閱圖7~圖9,說明關於實施形態的變形例之基板處理裝置的構成。圖7,係表示變形例的基板處理裝置1A之一部分的示意平面圖。又,圖8,係變形例之副保持部11的示意平面圖。又,圖9,係變形例之副保持部11的示意平面圖。另外,在圖8及圖9,係雖表示第1副保持部11_1作為一例,但第2副保持部11_2的構成亦與第1副保持部11_1相同。
<Modifications>
The structure of the substrate processing apparatus is not limited to the structure shown in the embodiment. Therefore, below, referring to FIGS. 7 to 9 , the configuration of a substrate processing apparatus according to a modified example of the embodiment will be described. FIG. 7 is a schematic plan view showing part of a
如圖7所示般,變形例之基板處理裝置1A,係具備有第1副保持部11_1及第2副保持部11_2以代替圖1所示的第1副保持部6_1及第2副保持部6_2。另外,以下,係有時將第1副保持部11_1及第2副保持部11_2統稱記載為「副保持部11」。As shown in FIG. 7 , a
副保持部11,係被設置於在各移動部4上相鄰的主保持部5之間,從基板S的下方保持基板S。The
具體而言,第1副保持部11_1,係被設置於在第1移動部4_1上相鄰的第1主保持部5_1及第2主保持部5_2之間。又,第2副保持部11_2,係被設置於在第2移動部4_2上相鄰的第3主保持部5_3及第4主保持部5_4之間。另外,複數個副保持部11之數量,係不限定於兩個。Specifically, the first sub-holding part 11_1 is provided between the first main holding part 5_1 and the second main holding part 5_2 adjacent on the first moving part 4_1. Moreover, the second sub-holding part 11_2 is provided between the third main holding part 5_3 and the fourth main holding part 5_4 adjacent on the second moving part 4_2. In addition, the number of the plurality of auxiliary holding
如圖8及圖9所示般,副保持部11,係具備有:基底部110;第1追隨部111;第2追隨部112;轉動部113;臂部114;及第2吸附部63A。As shown in FIGS. 8 and 9 , the
第2吸附部63A,係除了厚度及沿著前後方向(Y軸方向)的長度以外,其餘與圖4及圖5所示之第2吸附部63的構成相同。第2吸附部63A之沿著前後方向(Y軸方向)的長度,係與第1吸附部55之沿著前後方向(Y軸方向)的長度相同。另外,第2吸附部63A之沿著前後方向(Y軸方向)的長度,係亦可比第1吸附部55之沿著前後方向(Y軸方向)的長度長。第2吸附部63A,係與第2吸附部63相同地,藉由複數個吸附盤551,吸附基板S的下面並保持基板S。The
基底部110、第1追隨部111、第2追隨部112、轉動部113及臂部114,係追隨基於第1吸附部55的位置之調整的基板S之移動,調整第2吸附部63相對於移動部4之相對位置的追隨部之一例。The
基底部110,係被固定於移動部4上。第1追隨部111,係被設置於基底部50上,可在基底部50上沿著左右方向(X軸方向)移動。第2追隨部112,係被設置於第1追隨部111上,可在第1追隨部111上沿著前後方向(Y軸方向)移動。轉動部113,係被設置於第2追隨部112上,可繞垂直軸(Z軸)旋轉。臂部114,係延伸於水平方向的構件,在基端部被支撐於轉動部113,並在前端部支撐第2吸附部63A。The
追隨部,係可藉由「追隨沿著左右方向(X軸方向)的基板S之移動,第1追隨部111沿著左右方向(X軸方向)移動」的方式,使第2吸附部63A在左右方向(X軸方向)上移動。亦即,第1追隨部111,係可追隨基於第1吸附部55的位置之調整之沿著左右方向(X軸方向)的基板S之移動,沿著左右方向(X軸方向)調整第2吸附部63A相對於移動部4的位置。The following part can make the
又,追隨部,係可藉由「追隨沿著前後方向(Y軸方向)的基板S之移動,使第2追隨部112沿著前後方向(Y軸方向)移動」的方式,使第2吸附部63A在前後方向(Y軸方向)上移動。亦即,第2追隨部112,係可追隨基於第1吸附部55的位置之調整之沿著前後方向(Y軸方向)的基板S之移動,沿著前後方向(Y軸方向)調整第2吸附部63A相對於移動部4的位置。In addition, the following unit can make the
又,追隨部,係可藉由「追隨沿著以垂直軸(Z軸)為中心之圓周方向的基板S之移動,轉動部113繞垂直軸(Z軸)轉動」的方式,使經由臂部114被支撐於轉動部113的第2吸附部63A繞垂直軸(Z軸)轉動。亦即,轉動部113,係第3追隨部之一例,可追隨基於第1吸附部55的位置之調整之沿著前後方向(Y軸方向)的基板S之移動,沿著以垂直軸(Z軸方向)為中心之圓周方向調整第2吸附部63A相對於移動部4的位置。In addition, the following part can make the
另外,第1追隨部111、第2追隨部112及轉動部113,係分別與各主保持部5之第1調整部51、第2調整部52及轉動部53(參閱圖2及圖3)基本上相同的構成。但是,第1追隨部111及第2追隨部112,係分別不具有驅動部,不各自獨立地移動。另外,並不限於此,亦可在第1追隨部111及第2追隨部112分別設置驅動部。In addition, the first following
<效果>
如上述般,實施形態之基板搬送裝置(例如,基板處理裝置1、1A),係具備有:一對導引軌(例如,第1導引軌3_1及第2導引軌3_2);一對移動部(例如,第1移動部4_1及第2移動部4_2);複數個主保持部(例如,第1主保持部5_1~第4主保持部5_4);及副保持部(例如,第1副保持部6_1、11_1及第2副保持部6_2、11_2)。一對導引軌,係沿著基板(例如,基板S)之搬送方向(例如,Y軸方向)延伸。一對移動部,係沿著一對導引軌分別移動。複數個主保持部,係分別被設置於一對移動部上,從基板的下方保持基板。副保持部,係被設置於在各移動部上相鄰的主保持部之間,從基板的下方保持基板。複數個主保持部,係具備有:第1吸附部(例如,第1吸附部55),吸附保持基板;及調整部(例如,第1調整部51及第2調整部52),調整第1吸附部的位置。副保持部,係具備有:第2吸附部(例如,第2吸附部63、63A),吸附保持基板;及追隨部(例如,臂部62、第1追隨部111、第2追隨部112及轉動部113),追隨基於第1吸附部的位置之調整的基板之移動,調整第2吸附部的位置。
<Effect>
As mentioned above, the substrate transfer device (for example,
藉此,在搬送基板的期間,由於即便在調整第1吸附部之位置的情況下,亦可抑制所搬送的基板之撓曲且抑制基板相對於第2吸附部的位置偏移,因此,可適當地保持第2吸附部與基板的位置關係。因此,根據實施形態之基板搬送裝置,可使基板搬送中之誤差減少。Thereby, even when the position of the first suction part is adjusted during the transfer of the substrate, it is possible to suppress the deflection of the substrate being carried and to suppress the displacement of the substrate relative to the second suction part. The positional relationship between the second suction part and the substrate is properly maintained. Therefore, according to the substrate transfer device of the embodiment, errors in substrate transfer can be reduced.
又,由於基板搬送裝置,係一邊藉由副保持部保持基板的側緣,一邊搬送基板,因此,可在基板的側緣與塗佈部(例如,塗佈部7)之間隔被保持為固定的狀態下,從塗佈部對基板吐出機能液。因此,根據實施形態之基板搬送裝置,可精度良好地對基板進行描繪。Also, since the substrate conveying device conveys the substrate while holding the side edge of the substrate by the sub-holding part, the interval between the side edge of the substrate and the coating part (for example, the coating part 7) can be kept constant. In the state, the functional liquid is discharged from the coating part to the substrate. Therefore, according to the substrate transfer device of the embodiment, it is possible to draw the substrate with high precision.
又,調整部,係亦可具備有:第1調整部(例如,第1調整部51),沿著與搬送方向正交之方向(例如,X軸方向)調整第1吸附部的位置;第2調整部(例如,第2調整部52),沿著搬送方向調整第1吸附部的位置;及第3調整部(例如,轉動部53),沿著以垂直軸(例如,Z軸)為中心之圓周方向調整第1吸附部的位置。追隨部(例如,臂部62),係亦可追隨沿著與搬送方向正交之方向、搬送方向及以垂直軸為中心之圓周方向的基板之移動,調整第2吸附部(例如,第2吸附部63)的位置。藉此,可追隨沿著與搬送方向正交之方向、搬送方向及以垂直軸為中心之圓周方向的基板之移動,調整第2吸附部的位置。Moreover, the adjustment unit may also include: a first adjustment unit (for example, the first adjustment unit 51), which adjusts the position of the first suction unit along a direction (for example, the X-axis direction) perpendicular to the conveying direction; 2. The adjustment part (for example, the second adjustment part 52) adjusts the position of the first suction part along the conveyance direction; Adjust the position of the first suction part in the circumferential direction of the center. The following part (for example, the arm part 62) can also follow the movement of the substrate along the direction perpendicular to the conveying direction, the conveying direction and the circumferential direction centered on the vertical axis, and adjust the second suction part (for example, the second The position of the adsorption part 63). Thereby, the position of the second suction portion can be adjusted following the movement of the substrate along the direction perpendicular to the conveyance direction, the conveyance direction, and the circumferential direction centered on the vertical axis.
又,調整部,係亦可具備有:第1調整部,沿著與搬送方向正交之方向調整第1吸附部的位置;第2調整部,沿著搬送方向調整第1吸附部的位置;及第3調整部,沿著以垂直軸為中心之圓周方向調整第1吸附部的位置。追隨部,係亦可具備有:第1追隨部(例如,第1追隨部111),追隨沿著與搬送方向正交之方向的基板之移動,調整第2吸附部(例如,第2吸附部63A)的位置;第2追隨部(例如,第2追隨部112),追隨沿著搬送方向的基板之移動,調整第2吸附部的位置;及第3追隨部(例如,轉動部113),追隨沿著以垂直軸為中心之圓周方向的基板之移動,調整第2吸附部的位置。藉此,可追隨沿著與搬送方向正交之方向、搬送方向及以垂直軸為中心之圓周方向的基板之移動,調整第2吸附部的位置。Moreover, the adjustment unit may also include: a first adjustment unit for adjusting the position of the first adsorption unit along a direction perpendicular to the transport direction; a second adjustment unit for adjusting the position of the first adsorption unit along the transport direction; And the third adjustment part adjusts the position of the first adsorption part along the circumferential direction centering on the vertical axis. The following section can also be equipped with: a first following section (for example, the first following section 111), which follows the movement of the substrate along a direction perpendicular to the conveying direction, and adjusts the second suction section (for example, the second suction section 111). 63A); the 2nd follow-up part (for example, the 2nd follow-up part 112), follows the movement of the substrate along the conveying direction, adjusts the position of the 2nd adsorption part; and the 3rd follow-up part (for example, the rotation part 113), The position of the second suction part is adjusted following the movement of the substrate in the circumferential direction centered on the vertical axis. Thereby, the position of the second suction portion can be adjusted following the movement of the substrate along the direction perpendicular to the conveyance direction, the conveyance direction, and the circumferential direction centered on the vertical axis.
又,第2吸附部,係沿著搬送方向的長度亦可比第1吸附部長。藉此,即便在被設置於相鄰的主保持部之間的副保持部之數量少的情況下,亦可抑制所搬送的基板之撓曲且抑制基板相對於第2吸附部的位置偏移。Moreover, the length of the 2nd adsorption|suction part along a conveyance direction may be longer than the 1st adsorption|suction part. Thereby, even when the number of sub-holding parts provided between adjacent main holding parts is small, it is possible to suppress the deflection of the conveyed substrate and suppress the positional displacement of the substrate with respect to the second suction part. .
在上述實施形態中,係雖說明了關於基板處理裝置1具備有塗佈部7且塗佈部7以噴墨方式對基板S進行描繪的例子,但對基板S之加工處理並不限於此。例如,在進行「藉由進行對基板S照射光之處理或吐出去除液之處理的方式,使基板S之表面改質或去除表層之膜」等各種加工處理的情況下,亦可應用本揭示的技術。In the above embodiment, an example was described in which the substrate processing apparatus 1 is equipped with the
另外,應當認為本次所揭示之實施形態,係在所有方面皆為例示而非限定者。實際上,上述實施形態,係可藉由多種形態來實現。又,上述實施形態,係亦可在不脫離添附之申請專利範圍及其意旨的情況下,以各種形態進行省略、置換、變更。In addition, it should be considered that the embodiment disclosed this time is an illustration and not a limitation in any respect. In fact, the above-mentioned embodiments can be realized in various forms. In addition, the above-mentioned embodiments can also be omitted, substituted, and changed in various forms without departing from the scope of the appended claims and their meaning.
1,1A:基板處理裝置
2:上浮平台
3_1:第1導引軌
3_2:第2導引軌
4_1:第1移動部
4_2:第2移動部
5_1:第1主保持部
5_2:第2主保持部
5_3:第3主保持部
5_4:第4主保持部
6_1,11_1:第1副保持部
6_2,11_2:第2副保持部
7:塗佈部
9:控制裝置
50:基底部
51:第1調整部
52:第2調整部
53:轉動部
54:臂部
55:第1吸附部
61,110:基底部
62:臂部
63,63A:第2吸附部
91:控制部
92:記憶部
111:第1追隨部
112:第2追隨部
113:轉動部
114:臂部
1,1A: Substrate processing device
2: Floating platform
3_1: The first guide rail
3_2: The second guide rail
4_1: The first mobile department
4_2: The second mobile department
5_1: The first main holding part
5_2: The second main holding part
5_3: The 3rd main holding part
5_4: The 4th main holding part
6_1, 11_1: 1st auxiliary holding part
6_2, 11_2: The 2nd auxiliary holding part
7: Coating department
9: Control device
50: Basal part
51: The first adjustment department
52: The 2nd adjustment department
53: Rotating part
54: arm
55: The first adsorption part
61,110: Basal part
62:
[圖1]圖1,係表示實施形態的基板處理裝置之一部分的示意平面圖。 [圖2]圖2,係實施形態之主保持部的示意平面圖。 [圖3]圖3,係實施形態之主保持部的示意側視圖。 [圖4]圖4,係實施形態之副保持部的示意平面圖。 [圖5]圖5,係實施形態之副保持部的示意側視圖。 [圖6]圖6,係表示實施形態之基板處理裝置所執行的處理之程序的流程圖。 [圖7]圖7,係表示變形例的基板處理裝置之一部分的示意平面圖。 [圖8]圖8,係變形例之副保持部的示意平面圖。 [圖9]圖9,係變形例之副保持部的示意平面圖。 [FIG. 1] FIG. 1 is a schematic plan view showing part of a substrate processing apparatus according to an embodiment. [FIG. 2] FIG. 2 is a schematic plan view of the main holding portion of the embodiment. [ Fig. 3 ] Fig. 3 is a schematic side view of the main holding portion of the embodiment. [FIG. 4] FIG. 4 is a schematic plan view of the sub-holding portion of the embodiment. [ Fig. 5 ] Fig. 5 is a schematic side view of the sub-holding portion of the embodiment. [FIG. 6] FIG. 6 is a flowchart showing the procedure of processing executed by the substrate processing apparatus according to the embodiment. [ Fig. 7] Fig. 7 is a schematic plan view showing part of a substrate processing apparatus according to a modified example. [ Fig. 8] Fig. 8 is a schematic plan view of a sub-holding portion of a modified example. [ Fig. 9] Fig. 9 is a schematic plan view of a sub-holding portion of a modified example.
1:基板處理裝置 1: Substrate processing device
2:上浮平台 2: Floating platform
3_1(3):第1導引軌 3_1(3): The first guide rail
3_2(3):第2導引軌 3_2(3): The second guide rail
4_1(4):第1移動部 4_1(4): 1st Mobile Division
4_2(4):第2移動部 4_2(4): The second mobile unit
5_1(5):第1主保持部 5_1(5): The first main holding part
5_2(5):第2主保持部 5_2(5): The second main holding part
5_3(5):第3主保持部 5_3(5): The 3rd main holding part
5_4(5):第4主保持部 5_4(5): The 4th main holding part
6_1(6):第1副保持部 6_1(6): The 1st auxiliary holding part
6_2(6):第2副保持部 6_2(6): The second holding part
7:塗佈部 7: Coating department
8:維護部 8:Maintenance Department
9:控制裝置 9: Control device
10:一對軌道 10: A pair of tracks
91:控制部 91: Control Department
92:記憶部 92: memory department
S:基板 S: Substrate
Claims (6)
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JP2021061719 | 2021-03-31 | ||
JP2021-061719 | 2021-03-31 |
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TW111109809A TW202306651A (en) | 2021-03-31 | 2022-03-17 | Substrate conveying device, coating processing device, and substrate conveying method |
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WO (1) | WO2022210940A1 (en) |
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JP2008302487A (en) * | 2007-06-11 | 2008-12-18 | Olympus Corp | Substrate sucking device, substrate transporting device, and outside appearance inspecting device |
JP4495752B2 (en) * | 2007-11-06 | 2010-07-07 | 東京エレクトロン株式会社 | Substrate processing apparatus and coating apparatus |
JP5608469B2 (en) * | 2010-08-20 | 2014-10-15 | 東京応化工業株式会社 | Coating device |
JP6805018B2 (en) * | 2017-02-10 | 2020-12-23 | 東京エレクトロン株式会社 | Coating device and coating method |
JP7299790B2 (en) * | 2019-08-05 | 2023-06-28 | 東レエンジニアリング株式会社 | SUBSTRATE LIFTING TRANSPORT DEVICE AND SUBSTRATE POSITION CORRECTION METHOD OF SUBSTRATE LIFTING TRANSPORT DEVICE |
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