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TW202306651A - Substrate conveying device, coating processing device, and substrate conveying method - Google Patents

Substrate conveying device, coating processing device, and substrate conveying method Download PDF

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Publication number
TW202306651A
TW202306651A TW111109809A TW111109809A TW202306651A TW 202306651 A TW202306651 A TW 202306651A TW 111109809 A TW111109809 A TW 111109809A TW 111109809 A TW111109809 A TW 111109809A TW 202306651 A TW202306651 A TW 202306651A
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substrate
unit
suction
along
adjustment
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TW111109809A
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Chinese (zh)
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三根陽介
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日商東京威力科創股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02Means for manipulating or holding work, e.g. for separate articles for particular articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

This substrate conveying device is provided with a pair of guide rails, a pair of movement units, a plurality of main holding units, and auxiliary holding units. The pair of guide rails extend in a substrate conveying direction. The pair of movement units move respectively along the pair of guide rails. The plurality of main holding units are each provided on the pair of movement units, to hold the substrate from below the substrate. Each auxiliary holding unit is provided between the main holding units that are adjacent to one another on each movement unit, to hold the substrate from below the substrate. Each of the plurality of main holding units includes a first suction attachment unit for suction-attaching the substrate, and an adjusting unit for adjusting the position of the first suction attachment unit. Each auxiliary holding unit includes a second suction attachment unit for suction-attaching the substrate, and a tracking unit for adjusting the position of the second suction attachment unit by tracking the movement of the substrate based on the adjustments of the positions of the first suction attachment units.

Description

基板搬送裝置、塗佈處理裝置及基板搬送方法Substrate transfer device, coating processing device, and substrate transfer method

本揭示,係關於基板搬送裝置、塗佈處理裝置及基板搬送方法。The present disclosure relates to a substrate transfer device, a coating processing device, and a substrate transfer method.

在專利文獻1,係揭示有如下述內容:沿著在基板之搬送方向上延伸的兩根導引軌搬送基板,並將機能液的液滴吐出至基板。 [先前技術文獻] [專利文獻] Patent Document 1 discloses that a substrate is conveyed along two guide rails extending in a substrate conveyance direction, and droplets of a functional liquid are discharged onto the substrate. [Prior Art Literature] [Patent Document]

[專利文獻1]日本特開2018-126718號公報[Patent Document 1] Japanese Patent Laid-Open No. 2018-126718

[本發明所欲解決之課題][Problems to be Solved by the Invention]

本揭示,係提供一種使基板搬送中之誤差減少的技術。 [用以解決課題之手段] The present disclosure provides a technique for reducing errors in substrate transfer. [Means to solve the problem]

本揭示之一態樣的基板搬送裝置,係具備有:一對導引軌;一對移動部;複數個主保持部;及副保持部。一對導引軌,係沿著基板之搬送方向延伸。一對移動部,係沿著一對導引軌分別移動。複數個主保持部,係分別被設置於一對移動部上,從基板的下方保持基板。副保持部,係被設置於在各移動部上相鄰的主保持部之間,從基板的下方保持基板。複數個主保持部,係具備有:第1吸附部,吸附保持基板;及調整部,調整第1吸附部的位置。副保持部,係具備有:第2吸附部,吸附保持基板;及追隨部,追隨基於第1吸附部的位置之調整的基板之移動,調整第2吸附部的位置。 [發明之效果] A substrate transfer device according to an aspect of the present disclosure includes: a pair of guide rails; a pair of moving parts; a plurality of main holding parts; and auxiliary holding parts. A pair of guide rails extend along the conveying direction of the substrate. The pair of moving parts move respectively along the pair of guide rails. A plurality of main holding parts are respectively provided on a pair of moving parts, and hold the substrate from below the substrate. The sub-holding part is provided between the main holding parts adjacent to each moving part, and holds the substrate from below the substrate. The plurality of main holding parts are provided with: a first suction part for holding the substrate by suction; and an adjustment part for adjusting the position of the first suction part. The sub-holding unit includes: a second suction unit for suction-holding the substrate; and a follow-up unit for adjusting the position of the second suction unit following the movement of the substrate based on the adjustment of the position of the first suction unit. [Effect of Invention]

根據本揭示,可使基板搬送中之誤差減少。According to the present disclosure, errors in substrate transfer can be reduced.

以下,參閱附加圖面,詳細地說明本申請案所揭示之基板搬送裝置、塗佈處理裝置及基板搬送方法的實施形態。另外,並非藉由以下所示之實施形態來限定所揭示的基板搬送裝置、塗佈處理裝置及基板搬送方法。Hereinafter, embodiments of the substrate transfer device, coating processing device, and substrate transfer method disclosed in the present application will be described in detail with reference to the attached drawings. In addition, the disclosed substrate transfer device, coating processing device, and substrate transfer method are not limited by the embodiments described below.

在以下參閱的各圖面中,係為了容易理解說明,而表示「規定相互正交之X軸方向、Y軸方向及Z軸方向,並將Z軸正方向設成為垂直向上方向」的正交座標系統。In each of the drawings referred to below, for the sake of easy understanding of the description, the orthogonality of "regulating the mutually orthogonal X-axis direction, Y-axis direction, and Z-axis direction, and setting the positive direction of the Z-axis as the vertical upward direction" is shown. coordinate system.

又,在此,係規定前後方向並規定左右方向,該前後方向,係將Y軸正方向設成為前方,將Y軸負方向設成為後方,該左右方向,係將X軸正方向設成為右方,將X軸負方向設成為左方。又,規定上下方向,該上下方向,係將Z軸正方向設成為上方,將Z軸負方向設成為下方。基板處理裝置1,係一邊從後方朝向前方沿著前後方向搬送基板S,一邊處理基板S。亦即,基板處理裝置1,係一邊沿著搬送方向(Y軸方向)搬送基板S,一邊處理基板S。Here, the front-rear direction is defined and the left-right direction is defined. In the front-rear direction, the positive direction of the Y-axis is defined as the front, and the negative direction of the Y-axis is defined as the rear. In the left-right direction, the positive direction of the X-axis is defined as the right. Set the negative direction of the X axis to the left. In addition, the up-down direction is defined, and in the up-down direction, the positive direction of the Z-axis is defined as upward, and the negative direction of the Z-axis is defined as downward. The substrate processing apparatus 1 processes the substrate S while transporting the substrate S in the front-rear direction from the rear to the front. That is, the substrate processing apparatus 1 processes the substrate S while conveying the substrate S along the conveyance direction (Y-axis direction).

<整體構成> 參閱圖1,說明關於實施形態之基板處理裝置1的整體構成。圖1,係表示實施形態的基板處理裝置1之一部分的示意平面圖。基板處理裝置1,係一邊沿水平方向搬送工件即基板S,一邊以噴墨方式對基板S進行描繪。基板S,係例如被使用於平板顯示器的基板。 <Overall composition> Referring to FIG. 1, the overall configuration of a substrate processing apparatus 1 according to the embodiment will be described. FIG. 1 is a schematic plan view showing part of a substrate processing apparatus 1 according to an embodiment. The substrate processing apparatus 1 draws on the substrate S by an inkjet method while conveying the substrate S which is a workpiece in the horizontal direction. The substrate S is, for example, a substrate used for a flat panel display.

基板處理裝置1,係具備有:上浮平台2;第1導引軌3_1;及第2導引軌3_2。又,基板處理裝置1,係具備有:第1移動部4_1;及第2移動部4_2。又,基板處理裝置1,係具備有:第1主保持部5_1;第2主保持部5_2;第3主保持部5_3;第4主保持部5_4;第1副保持部6_1;及第2副保持部6_2。又,基板處理裝置1,係具備有:複數個塗佈部7;維護部8;及控制裝置9。The substrate processing apparatus 1 is provided with: a floating platform 2; a first guide rail 3_1; and a second guide rail 3_2. Moreover, the substrate processing apparatus 1 is provided with: the 1st moving part 4_1; and the 2nd moving part 4_2. Also, the substrate processing apparatus 1 is provided with: a first main holding unit 5_1; a second main holding unit 5_2; a third main holding unit 5_3; a fourth main holding unit 5_4; a first auxiliary holding unit 6_1; Holding part 6_2. In addition, the substrate processing apparatus 1 includes: a plurality of coating units 7 ; a maintenance unit 8 ; and a control device 9 .

另外,以下,係有時將第1導引軌3_1及第2導引軌3_2統稱記載為「導引軌3」。又,有時將第1移動部4_1及第2移動部4_2統稱記載為「移動部4」。又,有時將第1主保持部5_1~第4主保持部5_4統稱記載為「主保持部5」。又,有時將第1副保持部6_1及第2副保持部6_2統稱記載為「副保持部6」。In addition, below, the 1st guide rail 3_1 and the 2nd guide rail 3_2 may be collectively described as "the guide rail 3." Moreover, the 1st moving part 4_1 and the 2nd moving part 4_2 may be collectively described as "moving part 4." In addition, the first main holding part 5_1 to the fourth main holding part 5_4 may be collectively described as "main holding part 5". In addition, the first sub-holding portion 6_1 and the second sub-holding portion 6_2 may be collectively referred to as “sub-holding portion 6 ”.

上浮平台2,係具有多數個噴出口(未圖示)。上浮平台2,係從噴出口朝向基板S之下面噴吹經壓縮的氣體(例如空氣),對基板S賦予作用於上方的力(以下,記載為「上浮力」)。上浮平台2,係以賦予上浮力的方式,調整被保持於主保持部5及副保持部6之基板S的上浮高度。亦即,上浮平台2,係從下方對被保持於主保持部5及副保持部6之基板S噴吹氣體,調整基板S的上浮高度。The floating platform 2 has a plurality of ejection ports (not shown). The floating platform 2 blows compressed gas (such as air) toward the lower surface of the substrate S from the ejection port, and applies a force (hereinafter referred to as "uplifting force") acting upward to the substrate S. The floating platform 2 adjusts the floating height of the substrate S held by the main holding part 5 and the sub holding part 6 so as to impart buoyancy force. That is, the floating platform 2 blows gas from below to the substrate S held by the main holding part 5 and the sub-holding part 6 to adjust the floating height of the substrate S.

上浮平台2,係包含有搬入基板S的搬入平台及搬出基板S的搬出平台。搬入平台,係被設置於基板處理裝置1的後方側。搬出平台,係被設置於基板處理裝置1的前方側。The floating platform 2 includes a loading platform for loading the substrate S and an unloading platform for unloading the substrate S. The carry-in platform is provided on the rear side of the substrate processing apparatus 1 . The carry-out platform is provided on the front side of the substrate processing apparatus 1 .

另外,上浮平台2,係亦可沿著搬送方向(Y軸方向)設置複數個。位於塗佈部7之下方的上浮平台2上之基板S的上浮高度之範圍,係比其他的上浮平台2上之基板S的上浮高度之範圍窄。例如,位於塗佈部7之下方的上浮平台2上之基板S的上浮高度之範圍,係30~60μm。其他的上浮平台2上之基板S的上浮高度之範圍,係200~2000μm。In addition, a plurality of floating platforms 2 may be installed along the conveyance direction (Y-axis direction). The range of the floating height of the substrate S on the floating platform 2 below the coating part 7 is narrower than the range of the floating height of the substrates S on the other floating platforms 2 . For example, the range of the floating height of the substrate S on the floating platform 2 below the coating part 7 is 30-60 μm. The range of the floating height of the substrate S on the other floating platform 2 is 200-2000 μm.

例如,在位於塗佈部7之下方的上浮平台2中,係亦可藉由「朝向基板S之下面吐出經壓縮的空氣,並且吸引基板S與上浮平台2之間的空氣」的方式,調整基板S的上浮高度。For example, in the floating platform 2 located below the coating part 7, it can also be adjusted by "spouting compressed air toward the bottom of the substrate S, and sucking the air between the substrate S and the floating platform 2". The floating height of the substrate S.

第1導引軌3_1及第2導引軌3_2,係被排列於左右方向(X軸方向)且沿著搬送方向(Y軸方向)延伸。The 1st guide rail 3_1 and the 2nd guide rail 3_2 are arranged in the left-right direction (X-axis direction), and extend along a conveyance direction (Y-axis direction).

第1導引軌3_1及第2導引軌3_2,係被配置為在左右方向(X軸方向)夾著上浮平台2。第1導引軌3_1,係被配置於上浮平台2的X軸正方向側,第2導引軌3_2,係被配置於上浮平台2的X軸負方向側。第1導引軌3_1及第2導引軌3_2,係例如藉由花崗岩所構成。與搬送方向(Y軸方向)正交之導引軌3的剖面,係例如矩形狀。The 1st guide rail 3_1 and the 2nd guide rail 3_2 are arrange|positioned so that the floating platform 2 may be sandwiched in the left-right direction (X-axis direction). The first guide rail 3_1 is arranged on the X-axis positive direction side of the floating platform 2 , and the second guide rail 3_2 is arranged on the X-axis negative direction side of the floating platform 2 . The 1st guide rail 3_1 and the 2nd guide rail 3_2 are comprised by granite, for example. The cross section of the guide rail 3 perpendicular to the conveying direction (Y-axis direction) is, for example, rectangular.

第1移動部4_1,係被設置於第1導引軌3_1上,沿著第1導引軌3_1移動。第2移動部4_2,係被設置於第2導引軌3_2上,沿著第2導引軌3_2移動。另外,第1移動部4_1及第2移動部4_2,係分別具有馬達等的驅動部,可各自獨立地移動。The 1st moving part 4_1 is installed on the 1st guide rail 3_1, and moves along the 1st guide rail 3_1. The 2nd moving part 4_2 is installed on the 2nd guide rail 3_2, and moves along the 2nd guide rail 3_2. In addition, the 1st moving part 4_1 and the 2nd moving part 4_2 each have a drive part, such as a motor, and can move independently.

複數個主保持部5,係分別被設置於第1移動部4_1及第2移動部4_2上,從基板S的下方保持基板S。The plurality of main holding parts 5 are provided on the first moving part 4_1 and the second moving part 4_2 respectively, and hold the substrate S from below the substrate S. As shown in FIG.

具體而言,複數個主保持部5中之第1主保持部5_1及第2主保持部5_2,係被設置於第1移動部4_1上,第3主保持部5_3及第4主保持部5_4,係被設置於第2移動部4_2上。第1主保持部5_1及第2主保持部5_2,係在第1移動部4_1上,沿著搬送方向(Y軸方向)以第1主保持部5_1及第2主保持部5_2的順序排列。又,第3主保持部5_3及第4主保持部5_4,係在第2移動部4_2上,沿著搬送方向(Y軸方向)以第3主保持部5_3及第4主保持部5_4的順序排列。另外,複數個主保持部5之數量,係不限定於四個。Specifically, the first main holding part 5_1 and the second main holding part 5_2 among the plurality of main holding parts 5 are arranged on the first moving part 4_1, and the third main holding part 5_3 and the fourth main holding part 5_4 , is set on the second moving part 4_2. The first main holding part 5_1 and the second main holding part 5_2 are arranged in the order of the first main holding part 5_1 and the second main holding part 5_2 along the conveyance direction (Y-axis direction) on the first moving part 4_1. Moreover, the 3rd main holding part 5_3 and the 4th main holding part 5_4 are on the 2nd moving part 4_2, along the conveyance direction (Y-axis direction) in the order of the 3rd main holding part 5_3 and the 4th main holding part 5_4 arrangement. In addition, the number of the plurality of main holding parts 5 is not limited to four.

副保持部6,係被設置於在各移動部4上相鄰的主保持部5之間,從基板S的下方保持基板S。The sub-holding unit 6 is provided between the adjacent main holding units 5 on the moving units 4 , and holds the substrate S from below the substrate S. As shown in FIG.

具體而言,第1副保持部6_1,係被設置於在第1移動部4_1上相鄰的第1主保持部5_1及第2主保持部5_2之間。又,第2副保持部6_2,係被設置於在第2移動部4_2上相鄰的第3主保持部5_3及第4主保持部5_4之間。另外,複數個副保持部6之數量,係不限定於兩個。Specifically, the first sub-holding part 6_1 is provided between the first main holding part 5_1 and the second main holding part 5_2 adjacent on the first moving part 4_1. In addition, the second sub-holding part 6_2 is provided between the third main holding part 5_3 and the fourth main holding part 5_4 adjacent on the second moving part 4_2. In addition, the number of the plurality of auxiliary holding parts 6 is not limited to two.

在實施形態中,複數個(在此,係四個)主保持部5,係從基板S之下方保持基板S的四角。又,複數個(在此,係兩個)副保持部6,係從基板S的下方保持基板S中之未被主保持部5保持的側緣。基板S,係在藉由複數個主保持部5保持四角並藉由複數個副保持部6保持側緣且藉由上浮平台2而上浮的狀態下,藉由第1移動部4_1及第2移動部4_2,沿著搬送方向(Y軸正方向)搬送。In the embodiment, a plurality of (here, four) main holding portions 5 hold the four corners of the substrate S from below the substrate S. As shown in FIG. Also, a plurality of (here, two) sub-holding portions 6 hold the side edges of the substrate S that are not held by the main holding portion 5 from below the substrate S. As shown in FIG. The substrate S is in a state where the four corners are held by a plurality of main holders 5 and the side edges are held by a plurality of auxiliary holders 6 and floated by the floating platform 2 , moved by the first moving part 4_1 and the second moving part 4_1 and the second moving part 4_1. Section 4_2 is conveyed along the conveying direction (Y-axis positive direction).

如此一來,在基板處理裝置1中,係在基板S之搬送中,藉由副保持部6保持基板S中之未被主保持部5保持的側緣,藉此,可抑制所搬送的基板S之撓曲。In this way, in the substrate processing apparatus 1, during the conveyance of the substrate S, the side edge of the substrate S that is not held by the main holder 5 is held by the sub-holding portion 6, whereby the substrate being conveyed can be suppressed. The deflection of S.

塗佈部7,係對沿著搬送方向(Y軸正方向)所搬送的基板S塗佈機能液。機能液,係墨水。塗佈部7,係對藉由上浮平台2調整了上浮高度的基板S塗佈機能液。具體而言,塗佈部7,係藉由對基板S吐出機能液的方式,對基板S塗佈機能液。塗佈部7,係沿著左右方向(X軸方向)配置複數個。在圖1所示之例子中,係雖表示沿著左右方向(X軸方向)配置了七個塗佈部7的狀態,但塗佈部7之數量不限於此。塗佈部7,係具有吐出機能液的複數個頭部,將機能液從各頭部吐出至基板S。The coating unit 7 is for coating the functional liquid on the substrate S being transported along the transport direction (Y-axis positive direction). Functional fluid, ink. The coating unit 7 is for coating the functional liquid on the substrate S whose floating height has been adjusted by the floating platform 2 . Specifically, the application unit 7 applies the functional liquid to the substrate S by discharging the functional liquid onto the substrate S. A plurality of application parts 7 are arranged along the left-right direction (X-axis direction). In the example shown in FIG. 1 , although seven application parts 7 are arranged along the left-right direction (X-axis direction), the number of application parts 7 is not limited to this. The application unit 7 has a plurality of heads for discharging the functional liquid, and discharges the functional liquid onto the substrate S from each head.

塗佈部7,係可沿著被排列於Y軸方向且沿著X軸方向延伸的一對軌道10移動。一對軌道10,係例如被設置為相對於上浮平台2向右方延伸。在上浮平台2之右方的一對軌道10間,係設置有維護部8。塗佈部7,係可在成為維護部8之上方的位置與對基板S吐出機能液的位置之間移動。塗佈部7,係藉由驅動裝置例如線性馬達,沿著一對軌道10在左右方向移動。複數個塗佈部7,係亦可獨立地在左右方向移動,且亦可一體地在左右方向移動。The applicator 7 is movable along a pair of rails 10 arranged in the Y-axis direction and extending in the X-axis direction. The pair of rails 10 is, for example, provided to extend rightward with respect to the floating platform 2 . Between a pair of rails 10 on the right side of the floating platform 2, a maintenance unit 8 is arranged. The coating unit 7 is movable between a position above the maintenance unit 8 and a position where the functional liquid is discharged onto the substrate S. As shown in FIG. The coating unit 7 moves in the left-right direction along a pair of rails 10 by a driving device such as a linear motor. The plurality of application parts 7 can also independently move in the left-right direction, and can also move in the left-right direction integrally.

維護部8,係進行塗佈部7之頭部的維護,解除或防止塗佈部7之頭部的吐出不良等。另外,維護部8,係亦可被設置於上浮平台2的上方。The maintenance part 8 performs maintenance of the head part of the coating part 7, and removes or prevents the discharge failure of the head part of the coating part 7, etc. In addition, the maintenance part 8 can also be arranged above the floating platform 2 .

控制裝置9,係例如電腦,具備有控制部91與記憶部92。在記憶部92,係儲存有控制在基板處理裝置1中所執行之各種處理的程式。控制部91,係藉由讀出並執行被記憶於記憶部92之程式的方式,控制基板處理裝置1的動作。The control device 9 is, for example, a computer, and includes a control unit 91 and a memory unit 92 . The memory unit 92 stores programs for controlling various processes executed in the substrate processing apparatus 1 . The control unit 91 controls the operation of the substrate processing apparatus 1 by reading and executing the program stored in the memory unit 92 .

另外,該程式,係被記錄於電腦可讀取之記憶媒體者,且亦可為從記憶媒體被安裝於控制裝置9的記憶部92者。作為電腦可讀取之記憶媒體,係例如有硬碟(HD)、軟碟片(FD)、光碟(CD)、磁光碟(MO)、記憶卡等。In addition, the program is recorded on a computer-readable storage medium, and may be installed in the memory unit 92 of the control device 9 from the storage medium. Examples of computer-readable storage media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards.

<主保持部> 其次,參閱圖2及圖3,說明關於主保持部5的構成。圖2,係實施形態之主保持部5的示意平面圖。又,圖3,係實施形態之主保持部5的示意側視圖。另外,在圖2及圖3,係雖表示第1主保持部5_1作為一例,但第2主保持部5_2~第4主保持部5_4的構成亦與第1主保持部5_1相同。 <Main holding part> Next, referring to FIG. 2 and FIG. 3 , the configuration of the main holding unit 5 will be described. Fig. 2 is a schematic plan view of the main holding portion 5 of the embodiment. 3 is a schematic side view of the main holding portion 5 of the embodiment. In addition, in FIG. 2 and FIG. 3, although the 1st main holding part 5_1 is shown as an example, the structure of the 2nd main holding part 5_2 - the 4th main holding part 5_4 is also the same as the 1st main holding part 5_1.

如圖2及圖3所示般,主保持部5,係具備有:基底部50;第1調整部51;第2調整部52;轉動部53;臂部54;及第1吸附部55。As shown in FIGS. 2 and 3 , the main holding portion 5 includes: a base portion 50 ; a first adjustment portion 51 ; a second adjustment portion 52 ; a rotation portion 53 ; an arm portion 54 ;

第1吸附部55,係吸附保持基板S。具體而言,第1吸附部55,係具備有:複數個吸附盤551。複數個吸附盤551,係被排列設置於水平方向(在此,係Y軸方向)。另外,在此,係雖表示第1吸附部55具備有三個吸附盤551時的例子,但吸附盤551之數量不限定於三個。第1吸附部55,係藉由複數個吸附盤551,吸附基板S的下面並保持基板S。The first suction unit 55 suction-holds the substrate S. As shown in FIG. Specifically, the first suction unit 55 includes a plurality of suction disks 551 . The plurality of suction pads 551 are arranged in a row in the horizontal direction (here, the Y-axis direction). In addition, although the example in which the 1st adsorption|suction part 55 was equipped with the three adsorption pads 551 was shown here, the number of adsorption pads 551 is not limited to three. The first suction unit 55 sucks the lower surface of the substrate S and holds the substrate S by a plurality of suction pads 551 .

基底部50、第1調整部51、第2調整部52、轉動部53及臂部54,係調整第1吸附部55相對於移動部4之相對位置的調整部之一例。The base part 50 , the first adjustment part 51 , the second adjustment part 52 , the rotation part 53 and the arm part 54 are examples of adjustment parts for adjusting the relative position of the first suction part 55 with respect to the moving part 4 .

基底部50,係被固定於移動部4上。第1調整部51,係被設置於基底部50上,可在基底部50上沿著左右方向(X軸方向)移動。第2調整部52,係被設置於第1調整部51上,可在第1調整部51上沿著前後方向(Y軸方向)移動。轉動部53,係被設置於第2調整部52上,可繞垂直軸(Z軸)旋轉。臂部54,係延伸於水平方向的構件,在基端部被支撐於轉動部53,並在前端部支撐第1吸附部55。The base part 50 is fixed on the moving part 4 . The first adjustment part 51 is provided on the base part 50 and is movable in the left-right direction (X-axis direction) on the base part 50 . The second adjustment part 52 is provided on the first adjustment part 51 and is movable in the front-rear direction (Y-axis direction) on the first adjustment part 51 . The rotating part 53 is provided on the second adjusting part 52 and is rotatable around a vertical axis (Z axis). The arm part 54 is a member extending in the horizontal direction, is supported by the rotation part 53 at the base end part, and supports the first adsorption part 55 at the front end part.

如此一來,調整部,係使第1調整部51沿著左右方向(X軸方向)移動,藉此,可使第1吸附部55在左右方向(X軸方向)移動。亦即,第1調整部51,係可沿著左右方向(X軸方向),調整第1吸附部55相對於移動部4的位置。In this way, the adjustment unit moves the first adjustment unit 51 in the left-right direction (X-axis direction), thereby moving the first suction unit 55 in the left-right direction (X-axis direction). That is, the first adjustment unit 51 can adjust the position of the first adsorption unit 55 relative to the moving unit 4 along the left-right direction (X-axis direction).

又,調整部,係使第2調整部52沿著前後方向(Y軸方向)移動,藉此,可使第1吸附部55在前後方向(Y軸方向)移動。亦即,第2調整部52,係可沿著前後方向(Y軸方向),調整第1吸附部55相對於移動部4的位置。In addition, the adjustment unit can move the first suction unit 55 in the front-rear direction (Y-axis direction) by moving the second adjustment unit 52 in the front-rear direction (Y-axis direction). That is, the second adjustment unit 52 can adjust the position of the first adsorption unit 55 relative to the moving unit 4 along the front-rear direction (Y-axis direction).

又,調整部,係藉由「轉動部53繞垂直軸(Z軸)轉動」的方式,可使經由臂部54被支撐於轉動部53的第1吸附部55繞垂直軸(Z軸)轉動。亦即,轉動部53,係第3調整部之一例,可沿著以垂直軸(Z軸方向)為中心之圓周方向,調整第1吸附部55相對於移動部4的位置。In addition, the adjusting part can rotate the first suction part 55 supported by the rotating part 53 via the arm part 54 around the vertical axis (Z axis) by "rotating the rotating part 53 around the vertical axis (Z axis)". . That is, the rotating part 53 is an example of the third adjustment part, and can adjust the position of the first adsorption part 55 relative to the moving part 4 along the circumferential direction centered on the vertical axis (Z-axis direction).

另外,第1調整部51及第2調整部52,係分別具有馬達等的驅動部,可各自獨立地移動。另一方面,轉動部53,係例如軸承且不具有驅動部,以追隨第1調整部51及第2調整部52之動作的方式,使第1吸附部55轉動。另外,並不限於此,亦可在轉動部53設置驅動部。Moreover, the 1st adjustment part 51 and the 2nd adjustment part 52 each have a drive part, such as a motor, and can move independently. On the other hand, the rotating part 53 is, for example, a bearing without a driving part, and rotates the first adsorption part 55 so as to follow the movement of the first adjusting part 51 and the second adjusting part 52 . In addition, it is not limited to this, and a drive unit may be provided on the rotation unit 53 .

然而,一對導引軌3,係沿著基板S之搬送方向即前後方向(Y軸方向)延伸。作為一例,一對導引軌3之前後方向(Y軸方向)上的長度,係3~7m左右。如此一來,由於一對導引軌3較長,因此,恐有難以完全筆直地形成且在左右方向(X軸方向)產生例如數μm左右的變形之虞。相同地,在一對導引軌3,係恐有在垂直方向(Z軸方向)亦產生數μm的變形之虞。又,即便假設可筆直地形成一對導引軌3,亦恐有因環境變化(例如,溫度變化)而事後產生變形之虞。However, the pair of guide rails 3 extends along the front-back direction (Y-axis direction) which is the conveyance direction of the substrate S. As shown in FIG. As an example, the length of the pair of guide rails 3 in the front-back direction (Y-axis direction) is about 3 to 7 m. In this way, since the pair of guide rails 3 are long, it may be difficult to form them completely straight, and there may be a possibility of deformation of, for example, about several μm in the left-right direction (X-axis direction). Similarly, the pair of guide rails 3 may be deformed by several μm in the vertical direction (Z-axis direction). Also, even if it is assumed that the pair of guide rails 3 can be formed straight, there is a possibility of subsequent deformation due to environmental changes (for example, temperature changes).

如此一來,當在一對導引軌3存在變形時,則複數個(在此,係四個)主保持部5中之相鄰的兩個主保持部5之間的距離發生變化。亦即,複數個主保持部5的相對位置發生變化。換言之,複數個第1吸附部55的相對位置發生變化。當複數個第1吸附部55的相對位置發生變化時,則第1吸附部55與基板S之位置關係發生變化。藉此,因第1吸附部55相對於基板S偏移而變得難以高精度地搬送基板S。特別是,如實施形態之基板處理裝置1般,在第1移動部4_1及第2移動部4_2並非一體而是獨立的情況下,複數個主保持部5之相對位置容易因導引軌3的變形而偏移。In this way, when the pair of guide rails 3 is deformed, the distance between two adjacent main holding parts 5 among the plurality (here, four) of the main holding parts 5 changes. That is, the relative positions of the plurality of main holders 5 change. In other words, the relative positions of the plurality of first adsorption parts 55 change. When the relative positions of the plurality of first adsorption parts 55 change, the positional relationship between the first adsorption parts 55 and the substrate S changes. Thereby, since the 1st adsorption|suction part 55 deviates with respect to the board|substrate S, it becomes difficult to convey the board|substrate S with high precision. In particular, as in the substrate processing apparatus 1 of the embodiment, when the first moving part 4_1 and the second moving part 4_2 are not integrated but independent, the relative positions of the plurality of main holding parts 5 are easily affected by the position of the guide rails 3. deformed and shifted.

因此,在基板處理裝置1中,係以在搬送基板S的期間,使複數個主保持部5中之相鄰的兩個主保持部5間的距離成為預先設定之距離的方式,藉由各主保持部5之第1調整部51及第2調整部52,調整第1吸附部55相對於移動部4的位置。Therefore, in the substrate processing apparatus 1, while the substrate S is being conveyed, the distance between two adjacent main holding parts 5 among the plurality of main holding parts 5 becomes a preset distance, and each The first adjustment part 51 and the second adjustment part 52 of the main holding part 5 adjust the position of the first suction part 55 relative to the moving part 4 .

<副保持部> 其次,參閱圖4及圖5,說明關於副保持部6的構成。圖4,係實施形態之副保持部6的示意平面圖。又,圖5,係實施形態之副保持部6的示意側視圖。另外,在圖4及圖5,係雖表示第1副保持部6_1作為一例,但第2副保持部6_2的構成亦與第1副保持部6_1相同。 <Auxiliary Holder> Next, referring to FIG. 4 and FIG. 5 , the configuration of the sub-holding portion 6 will be described. Fig. 4 is a schematic plan view of the sub-holding portion 6 of the embodiment. In addition, FIG. 5 is a schematic side view of the sub-holding portion 6 of the embodiment. In addition, in FIG. 4 and FIG. 5, although the 1st sub-holding part 6_1 is shown as an example, the structure of the 2nd sub-holding part 6_2 is also the same as that of the 1st sub-holding part 6_1.

如圖4及圖5所示般,副保持部6,係具備有:一對基底部61;臂部62;及第2吸附部63。As shown in FIGS. 4 and 5 , the auxiliary holding portion 6 includes: a pair of base portions 61 ; an arm portion 62 ; and a second adsorption portion 63 .

第2吸附部63,係吸附保持基板S。具體而言,第2吸附部63,係具備有:複數個吸附盤631。複數個吸附盤631,係被排列設置於水平方向(在此,係Y軸方向)。另外,在此,係雖表示第2吸附部63具備有三個吸附盤631時的例子,但吸附盤631之數量不限定於三個。第2吸附部63,係藉由複數個吸附盤631,吸附基板S的下面並保持基板S。The second suction unit 63 suction-holds the substrate S. As shown in FIG. Specifically, the second suction unit 63 includes a plurality of suction disks 631 . The plurality of suction disks 631 are arranged in a row in the horizontal direction (here, the Y-axis direction). In addition, although the example in which the 2nd adsorption|suction part 63 was equipped with the three adsorption pads 631 was shown here, the number of adsorption pads 631 is not limited to three. The second suction unit 63 sucks the lower surface of the substrate S and holds the substrate S by a plurality of suction pads 631 .

第2吸附部63,係沿著基板S之搬送方向即前後方向(Y軸方向)的長度比第1吸附部55長。另外,沿著第2吸附部63之前後方向(Y軸方向)的長度,係亦可與沿著第1吸附部55之前後方向(Y軸方向)的長度相同,且亦可比沿著第1吸附部55之前後方向(Y軸方向)的長度短。The length of the second suction part 63 along the front-back direction (Y-axis direction) which is the conveyance direction of the substrate S is longer than that of the first suction part 55 . In addition, the length along the front-back direction (Y-axis direction) of the second suction portion 63 may be the same as the length along the front-back direction (Y-axis direction) of the first suction portion 55 , and may be longer than the length along the first suction portion 55 . The length of the adsorption|suction part 55 in the front-back direction (Y-axis direction) is short.

一對基底部61及臂部62,係追隨基於第1吸附部55的位置之調整的基板S之移動,調整第2吸附部63相對於移動部4之相對位置的追隨部之一例。The pair of base part 61 and arm part 62 is an example of a follower part that adjusts the relative position of the second suction part 63 with respect to the moving part 4 following the movement of the substrate S based on the position adjustment of the first suction part 55 .

一對基底部61,係被固定於移動部4上。臂部62,係延伸於水平方向之大致T字形的構件,一對基端部經由球體61a分別可水平移動且可轉動地被支撐於一對基底部61內,並在一個前端部支撐第2吸附部63。A pair of base parts 61 are fixed on the moving part 4 . The arm portion 62 is a substantially T-shaped member extending in the horizontal direction, and a pair of base ends are respectively horizontally movable and rotatably supported in a pair of base portions 61 via balls 61a, and a second end is supported at a front end. Adsorption part 63.

追隨部,係可藉由「追隨沿著左右方向(X軸方向)的基板S之移動,臂部62在左右方向(X軸方向)上移動」的方式,使被支撐於臂部62的第2吸附部63在左右方向(X軸方向)上移動。亦即,臂部62,係可追隨基於第1吸附部55的位置之調整之沿著左右方向(X軸方向)的基板S之移動,在左右方向(X軸方向)上調整第2吸附部63相對於移動部4的位置。The following part can make the second arm part 62 supported by the arm part 62 move in the left-right direction (X-axis direction) by following the movement of the substrate S along the left-right direction (X-axis direction). 2. The suction unit 63 moves in the left-right direction (X-axis direction). That is, the arm portion 62 can follow the movement of the substrate S along the left-right direction (X-axis direction) based on the adjustment of the position of the first suction portion 55, and adjust the second suction portion in the left-right direction (X-axis direction). 63 relative to the position of the moving part 4.

又,追隨部,係可藉由「追隨沿著前後方向(Y軸方向)的基板S之移動,臂部62在前後方向(Y軸方向)上移動」的方式,使被支撐於臂部62的第2吸附部63在前後方向(Y軸方向)上移動。亦即,臂部62,係可追隨基於第1吸附部55的位置之調整之沿著前後方向(Y軸方向)的基板S之移動,在前後方向(Y軸方向)上調整第2吸附部63相對於移動部4的位置。Also, the following part can be supported by the arm part 62 in such a way that "following the movement of the substrate S along the front-back direction (Y-axis direction), the arm part 62 moves in the front-back direction (Y-axis direction)". The second suction part 63 moves in the front-rear direction (Y-axis direction). That is, the arm part 62 can follow the movement of the substrate S along the front-back direction (Y-axis direction) based on the adjustment of the position of the first suction part 55, and adjust the second suction part in the front-back direction (Y-axis direction). 63 relative to the position of the moving part 4.

又,追隨部,係可藉由「追隨沿著以垂直軸(Z軸)為中心之圓周方向的基板S之移動,臂部62繞垂直軸(Z軸)轉動」的方式,使被支撐於臂部62的第2吸附部63繞垂直軸(Z軸)轉動。亦即,臂部62,係可追隨基於第1吸附部55的位置之調整之沿著以垂直軸(Z軸)為中心之圓周方向的基板S之移動,在以垂直軸(Z軸)為中心之圓周方向上調整第2吸附部63相對於移動部4的位置。In addition, the following part can be supported by the method of "following the movement of the substrate S along the circumferential direction centered on the vertical axis (Z axis), and the arm part 62 rotates around the vertical axis (Z axis)". The second suction portion 63 of the arm portion 62 rotates around a vertical axis (Z axis). That is, the arm portion 62 can follow the movement of the substrate S along the circumferential direction centered on the vertical axis (Z axis) based on the adjustment of the position of the first suction portion 55, and the vertical axis (Z axis) as the The position of the second suction part 63 relative to the moving part 4 is adjusted in the circumferential direction of the center.

然而,在基板處理裝置1中,係在基板S之搬送中,藉由副保持部6保持基板S中之未被主保持部5保持的側緣,藉此,抑制所搬送的基板S之撓曲。而且,在基板處理裝置1中,係藉由各主保持部5之第1調整部51及第2調整部52,調整第1吸附部55相對於移動部4的位置。However, in the substrate processing apparatus 1, during the conveyance of the substrate S, the side edge of the substrate S not held by the main holder 5 is held by the sub-holding portion 6, thereby suppressing the deflection of the substrate S being conveyed. song. In addition, in the substrate processing apparatus 1 , the position of the first suction unit 55 relative to the moving unit 4 is adjusted by the first adjustment unit 51 and the second adjustment unit 52 of each main holding unit 5 .

如此一來,藉由調整第1吸附部55相對於移動部4的位置,基板S進行移動。當基板S移動時,則副保持部6之第2吸附部63與基板S的位置關係發生變化。藉此,因基板S相對於第2吸附部63偏移而變得難以高精度地搬送基板S。In this way, the substrate S moves by adjusting the position of the first suction unit 55 relative to the moving unit 4 . When the substrate S moves, the positional relationship between the second suction portion 63 of the auxiliary holding portion 6 and the substrate S changes. Thereby, since the board|substrate S deviates with respect to the 2nd adsorption|suction part 63, it becomes difficult to convey the board|substrate S with high precision.

因此,在實施形態之基板處理裝置1中,係在搬送基板S的期間,藉由副保持部6之臂部62,追隨基於第1吸附部55的位置之調整的基板S之移動,調整第2吸附部63相對於移動部4的位置。藉此,抑制所搬送的基板S之撓曲,並且可抑制基板S相對於第2吸附部63的位置偏移。亦即,在搬送基板S的期間,即便在調整第1吸附部55相對於移動部4之位置的情況下,亦可適當地保持第2吸附部63與基板S的位置關係。Therefore, in the substrate processing apparatus 1 of the embodiment, while the substrate S is being conveyed, the arm portion 62 of the sub-holding portion 6 follows the movement of the substrate S based on the adjustment of the position of the first suction portion 55 to adjust the second suction portion 55 . 2 The position of the suction unit 63 relative to the moving unit 4. Thereby, while suppressing the deflection of the conveyed board|substrate S, the positional displacement of the board|substrate S with respect to the 2nd adsorption|suction part 63 can be suppressed. That is, even when the position of the first suction unit 55 relative to the moving unit 4 is adjusted while the substrate S is being transferred, the positional relationship between the second suction unit 63 and the substrate S can be appropriately maintained.

<基板處理裝置之處理流程> 其次,參閱圖6,說明關於實施形態之基板處理裝置1所執行的處理之程序。圖6,係表示實施形態之基板處理裝置1所執行的處理之程序的流程圖。圖6所示之各處理,係依照控制裝置9的控制來執行。 <Processing flow of substrate processing equipment> Next, referring to FIG. 6 , the procedure of processing performed by the substrate processing apparatus 1 of the embodiment will be described. FIG. 6 is a flow chart showing a procedure of processing executed by the substrate processing apparatus 1 according to the embodiment. Each processing shown in FIG. 6 is executed under the control of the control device 9 .

基板處理裝置1,係進行保持工程(步驟S101)。基板處理裝置1,係藉由複數個主保持部5及副保持部6保持被搬送至上浮平台2的基板S。具體而言,基板處理裝置1,係藉由各主保持部5之第1吸附部55吸附基板S的四角且藉由副保持部6之第2吸附部63吸附基板S的側緣,藉此,保持基板S。The substrate processing apparatus 1 performs a holding process (step S101). The substrate processing apparatus 1 holds the substrate S conveyed to the floating table 2 by a plurality of main holding parts 5 and sub holding parts 6 . Specifically, in the substrate processing apparatus 1, the four corners of the substrate S are sucked by the first suction parts 55 of each main holding part 5 and the side edges of the substrate S are sucked by the second suction parts 63 of the sub-holding parts 6, thereby , holding the substrate S.

基板處理裝置1,係進行搬送工程(步驟S102)。基板處理裝置1,係使一對移動部4沿著一對導引軌3移動,藉此,沿著搬送方向搬送基板S。The substrate processing apparatus 1 performs a transfer process (step S102). The substrate processing apparatus 1 transports the substrate S along the transport direction by moving the pair of moving parts 4 along the pair of guide rails 3 .

基板處理裝置1,係進行調整工程(步驟S103)。基板處理裝置1,係在搬送基板S的期間,藉由各主保持部5之第1調整部51及第2調整部52,調整第1吸附部55相對於移動部4的位置。此時,基板處理裝置1,係藉由副保持部6之臂部62,追隨基於第1吸附部55的位置之調整的基板S之移動,調整第2吸附部63的位置。The substrate processing apparatus 1 performs an adjustment process (step S103). The substrate processing apparatus 1 adjusts the position of the first suction unit 55 relative to the moving unit 4 by the first adjustment unit 51 and the second adjustment unit 52 of each main holding unit 5 while the substrate S is being transferred. At this time, the substrate processing apparatus 1 adjusts the position of the second suction part 63 by following the movement of the substrate S based on the adjustment of the position of the first suction part 55 by the arm part 62 of the sub-holding part 6 .

基板處理裝置1,係進行塗佈工程(步驟S104)。基板處理裝置1,係將機能液從塗佈部7吐出至沿著搬送方向所搬送的基板S,並對基板S塗佈機能液。塗佈了機能液之基板S,係從上浮平台2被搬出。The substrate processing apparatus 1 performs a coating process (step S104). The substrate processing apparatus 1 discharges the functional liquid from the coating unit 7 onto the substrate S conveyed along the conveying direction, and applies the functional liquid to the substrate S. The substrate S coated with the functional liquid is carried out from the floating platform 2 .

<變形例> 基板處理裝置之構成,係不限定於實施形態中所示的構成。因此,以下,係參閱圖7~圖9,說明關於實施形態的變形例之基板處理裝置的構成。圖7,係表示變形例的基板處理裝置1A之一部分的示意平面圖。又,圖8,係變形例之副保持部11的示意平面圖。又,圖9,係變形例之副保持部11的示意平面圖。另外,在圖8及圖9,係雖表示第1副保持部11_1作為一例,但第2副保持部11_2的構成亦與第1副保持部11_1相同。 <Modifications> The structure of the substrate processing apparatus is not limited to the structure shown in the embodiment. Therefore, below, referring to FIGS. 7 to 9 , the configuration of a substrate processing apparatus according to a modified example of the embodiment will be described. FIG. 7 is a schematic plan view showing part of a substrate processing apparatus 1A according to a modified example. In addition, FIG. 8 is a schematic plan view of a sub-holding portion 11 of a modified example. In addition, FIG. 9 is a schematic plan view of a sub-holding portion 11 of a modified example. In addition, in FIG. 8 and FIG. 9, although the 1st sub-holding part 11_1 is shown as an example, the structure of the 2nd sub-holding part 11_2 is also the same as that of the 1st sub-holding part 11_1.

如圖7所示般,變形例之基板處理裝置1A,係具備有第1副保持部11_1及第2副保持部11_2以代替圖1所示的第1副保持部6_1及第2副保持部6_2。另外,以下,係有時將第1副保持部11_1及第2副保持部11_2統稱記載為「副保持部11」。As shown in FIG. 7 , a substrate processing apparatus 1A according to a modified example is provided with a first sub-holding unit 11_1 and a second sub-holding unit 11_2 instead of the first sub-holding unit 6_1 and the second sub-holding unit shown in FIG. 1 . 6_2. In addition, below, the 1st sub-holding part 11_1 and the 2nd sub-holding part 11_2 may be collectively described as "sub-holding part 11."

副保持部11,係被設置於在各移動部4上相鄰的主保持部5之間,從基板S的下方保持基板S。The sub-holding part 11 is provided between the adjacent main holding parts 5 on the respective moving parts 4, and holds the substrate S from below the substrate S. As shown in FIG.

具體而言,第1副保持部11_1,係被設置於在第1移動部4_1上相鄰的第1主保持部5_1及第2主保持部5_2之間。又,第2副保持部11_2,係被設置於在第2移動部4_2上相鄰的第3主保持部5_3及第4主保持部5_4之間。另外,複數個副保持部11之數量,係不限定於兩個。Specifically, the first sub-holding part 11_1 is provided between the first main holding part 5_1 and the second main holding part 5_2 adjacent on the first moving part 4_1. Moreover, the second sub-holding part 11_2 is provided between the third main holding part 5_3 and the fourth main holding part 5_4 adjacent on the second moving part 4_2. In addition, the number of the plurality of auxiliary holding parts 11 is not limited to two.

如圖8及圖9所示般,副保持部11,係具備有:基底部110;第1追隨部111;第2追隨部112;轉動部113;臂部114;及第2吸附部63A。As shown in FIGS. 8 and 9 , the sub-holding portion 11 includes: a base portion 110 ; a first following portion 111 ; a second following portion 112 ; a rotating portion 113 ; an arm portion 114 ; and a second adsorption portion 63A.

第2吸附部63A,係除了厚度及沿著前後方向(Y軸方向)的長度以外,其餘與圖4及圖5所示之第2吸附部63的構成相同。第2吸附部63A之沿著前後方向(Y軸方向)的長度,係與第1吸附部55之沿著前後方向(Y軸方向)的長度相同。另外,第2吸附部63A之沿著前後方向(Y軸方向)的長度,係亦可比第1吸附部55之沿著前後方向(Y軸方向)的長度長。第2吸附部63A,係與第2吸附部63相同地,藉由複數個吸附盤551,吸附基板S的下面並保持基板S。The second adsorption portion 63A has the same configuration as the second adsorption portion 63 shown in FIGS. 4 and 5 except for the thickness and the length along the front-rear direction (Y-axis direction). The length along the front-back direction (Y-axis direction) of the second suction portion 63A is the same as the length along the front-back direction (Y-axis direction) of the first suction portion 55 . In addition, the length along the front-back direction (Y-axis direction) of the second adsorption portion 63A may be longer than the length along the front-back direction (Y-axis direction) of the first adsorption portion 55 . The second suction unit 63A, similarly to the second suction unit 63 , holds the substrate S by suctioning the lower surface of the substrate S by a plurality of suction pads 551 .

基底部110、第1追隨部111、第2追隨部112、轉動部113及臂部114,係追隨基於第1吸附部55的位置之調整的基板S之移動,調整第2吸附部63相對於移動部4之相對位置的追隨部之一例。The base part 110, the first following part 111, the second following part 112, the rotating part 113 and the arm part 114 follow the movement of the substrate S based on the adjustment of the position of the first suction part 55, and adjust the relative position of the second suction part 63. An example of the relative position follower of the moving part 4.

基底部110,係被固定於移動部4上。第1追隨部111,係被設置於基底部50上,可在基底部50上沿著左右方向(X軸方向)移動。第2追隨部112,係被設置於第1追隨部111上,可在第1追隨部111上沿著前後方向(Y軸方向)移動。轉動部113,係被設置於第2追隨部112上,可繞垂直軸(Z軸)旋轉。臂部114,係延伸於水平方向的構件,在基端部被支撐於轉動部113,並在前端部支撐第2吸附部63A。The base part 110 is fixed on the moving part 4 . The first tracking part 111 is provided on the base part 50 and is movable in the left-right direction (X-axis direction) on the base part 50 . The second tracking part 112 is provided on the first tracking part 111 and is movable on the first tracking part 111 in the front-rear direction (Y-axis direction). The rotating part 113 is provided on the second following part 112 and is rotatable around a vertical axis (Z axis). The arm part 114 is a member extending in the horizontal direction, is supported by the rotation part 113 at the base end part, and supports the second adsorption part 63A at the front end part.

追隨部,係可藉由「追隨沿著左右方向(X軸方向)的基板S之移動,第1追隨部111沿著左右方向(X軸方向)移動」的方式,使第2吸附部63A在左右方向(X軸方向)上移動。亦即,第1追隨部111,係可追隨基於第1吸附部55的位置之調整之沿著左右方向(X軸方向)的基板S之移動,沿著左右方向(X軸方向)調整第2吸附部63A相對於移動部4的位置。The following part can make the second suction part 63A move in the left-right direction (X-axis direction) by following the movement of the substrate S along the left-right direction (X-axis direction), and the first follow-up part 111 moves along the left-right direction (X-axis direction). Move in the left-right direction (X-axis direction). That is, the first following part 111 can follow the movement of the substrate S along the left-right direction (X-axis direction) based on the adjustment of the position of the first suction part 55, and adjust the second position along the left-right direction (X-axis direction). The position of the adsorption unit 63A relative to the moving unit 4 .

又,追隨部,係可藉由「追隨沿著前後方向(Y軸方向)的基板S之移動,使第2追隨部112沿著前後方向(Y軸方向)移動」的方式,使第2吸附部63A在前後方向(Y軸方向)上移動。亦即,第2追隨部112,係可追隨基於第1吸附部55的位置之調整之沿著前後方向(Y軸方向)的基板S之移動,沿著前後方向(Y軸方向)調整第2吸附部63A相對於移動部4的位置。In addition, the following unit can make the second suction unit 112 move along the front-rear direction (Y-axis direction) by following the movement of the substrate S along the front-back direction (Y-axis direction)”. The portion 63A moves in the front-rear direction (Y-axis direction). That is, the second following part 112 can follow the movement of the substrate S along the front-back direction (Y-axis direction) based on the adjustment of the position of the first suction part 55, and adjust the second position along the front-back direction (Y-axis direction). The position of the adsorption unit 63A relative to the moving unit 4 .

又,追隨部,係可藉由「追隨沿著以垂直軸(Z軸)為中心之圓周方向的基板S之移動,轉動部113繞垂直軸(Z軸)轉動」的方式,使經由臂部114被支撐於轉動部113的第2吸附部63A繞垂直軸(Z軸)轉動。亦即,轉動部113,係第3追隨部之一例,可追隨基於第1吸附部55的位置之調整之沿著前後方向(Y軸方向)的基板S之移動,沿著以垂直軸(Z軸方向)為中心之圓周方向調整第2吸附部63A相對於移動部4的位置。In addition, the following part can make the rotating part 113 rotate around the vertical axis (Z axis) by following the movement of the substrate S along the circumferential direction centered on the vertical axis (Z axis). 114 is rotated around the vertical axis (Z axis) by the second suction portion 63A supported by the rotation portion 113 . That is, the rotating part 113 is an example of the third following part, and can follow the movement of the substrate S along the front-back direction (Y-axis direction) based on the adjustment of the position of the first suction part 55, along the vertical axis (Z The position of the second suction part 63A relative to the moving part 4 is adjusted in the circumferential direction centered on the axial direction).

另外,第1追隨部111、第2追隨部112及轉動部113,係分別與各主保持部5之第1調整部51、第2調整部52及轉動部53(參閱圖2及圖3)基本上相同的構成。但是,第1追隨部111及第2追隨部112,係分別不具有驅動部,不各自獨立地移動。另外,並不限於此,亦可在第1追隨部111及第2追隨部112分別設置驅動部。In addition, the first following part 111, the second following part 112 and the rotating part 113 are respectively connected with the first adjusting part 51, the second adjusting part 52 and the rotating part 53 of each main holding part 5 (referring to Fig. 2 and Fig. 3 ). Basically the same composition. However, each of the first following unit 111 and the second following unit 112 does not have a drive unit, and does not move independently of each other. In addition, the present invention is not limited thereto, and drive units may be provided in the first tracking unit 111 and the second tracking unit 112 respectively.

<效果> 如上述般,實施形態之基板搬送裝置(例如,基板處理裝置1、1A),係具備有:一對導引軌(例如,第1導引軌3_1及第2導引軌3_2);一對移動部(例如,第1移動部4_1及第2移動部4_2);複數個主保持部(例如,第1主保持部5_1~第4主保持部5_4);及副保持部(例如,第1副保持部6_1、11_1及第2副保持部6_2、11_2)。一對導引軌,係沿著基板(例如,基板S)之搬送方向(例如,Y軸方向)延伸。一對移動部,係沿著一對導引軌分別移動。複數個主保持部,係分別被設置於一對移動部上,從基板的下方保持基板。副保持部,係被設置於在各移動部上相鄰的主保持部之間,從基板的下方保持基板。複數個主保持部,係具備有:第1吸附部(例如,第1吸附部55),吸附保持基板;及調整部(例如,第1調整部51及第2調整部52),調整第1吸附部的位置。副保持部,係具備有:第2吸附部(例如,第2吸附部63、63A),吸附保持基板;及追隨部(例如,臂部62、第1追隨部111、第2追隨部112及轉動部113),追隨基於第1吸附部的位置之調整的基板之移動,調整第2吸附部的位置。 <Effect> As mentioned above, the substrate transfer device (for example, substrate processing device 1, 1A) of the embodiment is equipped with: a pair of guide rails (for example, the first guide rail 3_1 and the second guide rail 3_2); moving part (for example, the first moving part 4_1 and the second moving part 4_2); a plurality of main holding parts (for example, the first main holding part 5_1 ~ the 4th main holding part 5_4); and auxiliary holding parts (for example, the first sub-holding parts 6_1, 11_1 and second sub-holding parts 6_2, 11_2). The pair of guide rails extend along the conveyance direction (for example, the Y-axis direction) of the substrate (for example, the substrate S). The pair of moving parts move respectively along the pair of guide rails. A plurality of main holding parts are respectively provided on a pair of moving parts, and hold the substrate from below the substrate. The sub-holding part is provided between the main holding parts adjacent to each moving part, and holds the substrate from below the substrate. A plurality of main holding parts are equipped with: a first adsorption part (for example, the first adsorption part 55), which absorbs and holds the substrate; and an adjustment part (for example, the first adjustment part 51 and the second adjustment part 52), which adjusts the first The position of the adsorption part. The auxiliary holding part is provided with: the 2nd suction part (for example, the 2nd suction part 63, 63A), suction holds the substrate; The rotation unit 113) adjusts the position of the second suction unit following the movement of the substrate based on the adjustment of the position of the first suction unit.

藉此,在搬送基板的期間,由於即便在調整第1吸附部之位置的情況下,亦可抑制所搬送的基板之撓曲且抑制基板相對於第2吸附部的位置偏移,因此,可適當地保持第2吸附部與基板的位置關係。因此,根據實施形態之基板搬送裝置,可使基板搬送中之誤差減少。Thereby, even when the position of the first suction part is adjusted during the transfer of the substrate, it is possible to suppress the deflection of the substrate being carried and to suppress the displacement of the substrate relative to the second suction part. The positional relationship between the second suction part and the substrate is properly maintained. Therefore, according to the substrate transfer device of the embodiment, errors in substrate transfer can be reduced.

又,由於基板搬送裝置,係一邊藉由副保持部保持基板的側緣,一邊搬送基板,因此,可在基板的側緣與塗佈部(例如,塗佈部7)之間隔被保持為固定的狀態下,從塗佈部對基板吐出機能液。因此,根據實施形態之基板搬送裝置,可精度良好地對基板進行描繪。Also, since the substrate conveying device conveys the substrate while holding the side edge of the substrate by the sub-holding part, the interval between the side edge of the substrate and the coating part (for example, the coating part 7) can be kept constant. In the state, the functional liquid is discharged from the coating part to the substrate. Therefore, according to the substrate transfer device of the embodiment, it is possible to draw the substrate with high precision.

又,調整部,係亦可具備有:第1調整部(例如,第1調整部51),沿著與搬送方向正交之方向(例如,X軸方向)調整第1吸附部的位置;第2調整部(例如,第2調整部52),沿著搬送方向調整第1吸附部的位置;及第3調整部(例如,轉動部53),沿著以垂直軸(例如,Z軸)為中心之圓周方向調整第1吸附部的位置。追隨部(例如,臂部62),係亦可追隨沿著與搬送方向正交之方向、搬送方向及以垂直軸為中心之圓周方向的基板之移動,調整第2吸附部(例如,第2吸附部63)的位置。藉此,可追隨沿著與搬送方向正交之方向、搬送方向及以垂直軸為中心之圓周方向的基板之移動,調整第2吸附部的位置。Moreover, the adjustment unit may also include: a first adjustment unit (for example, the first adjustment unit 51), which adjusts the position of the first suction unit along a direction (for example, the X-axis direction) perpendicular to the conveying direction; 2. The adjustment part (for example, the second adjustment part 52) adjusts the position of the first suction part along the conveyance direction; Adjust the position of the first suction part in the circumferential direction of the center. The following part (for example, the arm part 62) can also follow the movement of the substrate along the direction perpendicular to the conveying direction, the conveying direction and the circumferential direction centered on the vertical axis, and adjust the second suction part (for example, the second The position of the adsorption part 63). Thereby, the position of the second suction portion can be adjusted following the movement of the substrate along the direction perpendicular to the conveyance direction, the conveyance direction, and the circumferential direction centered on the vertical axis.

又,調整部,係亦可具備有:第1調整部,沿著與搬送方向正交之方向調整第1吸附部的位置;第2調整部,沿著搬送方向調整第1吸附部的位置;及第3調整部,沿著以垂直軸為中心之圓周方向調整第1吸附部的位置。追隨部,係亦可具備有:第1追隨部(例如,第1追隨部111),追隨沿著與搬送方向正交之方向的基板之移動,調整第2吸附部(例如,第2吸附部63A)的位置;第2追隨部(例如,第2追隨部112),追隨沿著搬送方向的基板之移動,調整第2吸附部的位置;及第3追隨部(例如,轉動部113),追隨沿著以垂直軸為中心之圓周方向的基板之移動,調整第2吸附部的位置。藉此,可追隨沿著與搬送方向正交之方向、搬送方向及以垂直軸為中心之圓周方向的基板之移動,調整第2吸附部的位置。Moreover, the adjustment unit may also include: a first adjustment unit for adjusting the position of the first adsorption unit along a direction perpendicular to the transport direction; a second adjustment unit for adjusting the position of the first adsorption unit along the transport direction; And the third adjustment part adjusts the position of the first adsorption part along the circumferential direction centering on the vertical axis. The following section can also be equipped with: a first following section (for example, the first following section 111), which follows the movement of the substrate along a direction perpendicular to the conveying direction, and adjusts the second suction section (for example, the second suction section 111). 63A); the 2nd follow-up part (for example, the 2nd follow-up part 112), follows the movement of the substrate along the conveying direction, adjusts the position of the 2nd adsorption part; and the 3rd follow-up part (for example, the rotation part 113), The position of the second suction part is adjusted following the movement of the substrate in the circumferential direction centered on the vertical axis. Thereby, the position of the second suction portion can be adjusted following the movement of the substrate along the direction perpendicular to the conveyance direction, the conveyance direction, and the circumferential direction centered on the vertical axis.

又,第2吸附部,係沿著搬送方向的長度亦可比第1吸附部長。藉此,即便在被設置於相鄰的主保持部之間的副保持部之數量少的情況下,亦可抑制所搬送的基板之撓曲且抑制基板相對於第2吸附部的位置偏移。Moreover, the length of the 2nd adsorption|suction part along a conveyance direction may be longer than the 1st adsorption|suction part. Thereby, even when the number of sub-holding parts provided between adjacent main holding parts is small, it is possible to suppress the deflection of the conveyed substrate and suppress the positional displacement of the substrate with respect to the second suction part. .

在上述實施形態中,係雖說明了關於基板處理裝置1具備有塗佈部7且塗佈部7以噴墨方式對基板S進行描繪的例子,但對基板S之加工處理並不限於此。例如,在進行「藉由進行對基板S照射光之處理或吐出去除液之處理的方式,使基板S之表面改質或去除表層之膜」等各種加工處理的情況下,亦可應用本揭示的技術。In the above embodiment, an example was described in which the substrate processing apparatus 1 is equipped with the coating unit 7 and the coating unit 7 draws the substrate S by inkjet, but the processing of the substrate S is not limited to this. For example, this disclosure can also be applied in the case of performing various processing such as "modifying the surface of the substrate S or removing a film on the surface by performing a treatment of irradiating the substrate S with light or a treatment of discharging a removal solution". Technology.

另外,應當認為本次所揭示之實施形態,係在所有方面皆為例示而非限定者。實際上,上述實施形態,係可藉由多種形態來實現。又,上述實施形態,係亦可在不脫離添附之申請專利範圍及其意旨的情況下,以各種形態進行省略、置換、變更。In addition, it should be considered that the embodiment disclosed this time is an illustration and not a limitation in any respect. In fact, the above-mentioned embodiments can be realized in various forms. In addition, the above-mentioned embodiments can also be omitted, substituted, and changed in various forms without departing from the scope of the appended claims and their meaning.

1,1A:基板處理裝置 2:上浮平台 3_1:第1導引軌 3_2:第2導引軌 4_1:第1移動部 4_2:第2移動部 5_1:第1主保持部 5_2:第2主保持部 5_3:第3主保持部 5_4:第4主保持部 6_1,11_1:第1副保持部 6_2,11_2:第2副保持部 7:塗佈部 9:控制裝置 50:基底部 51:第1調整部 52:第2調整部 53:轉動部 54:臂部 55:第1吸附部 61,110:基底部 62:臂部 63,63A:第2吸附部 91:控制部 92:記憶部 111:第1追隨部 112:第2追隨部 113:轉動部 114:臂部 1,1A: Substrate processing device 2: Floating platform 3_1: The first guide rail 3_2: The second guide rail 4_1: The first mobile department 4_2: The second mobile department 5_1: The first main holding part 5_2: The second main holding part 5_3: The 3rd main holding part 5_4: The 4th main holding part 6_1, 11_1: 1st auxiliary holding part 6_2, 11_2: The 2nd auxiliary holding part 7: Coating department 9: Control device 50: Basal part 51: The first adjustment department 52: The 2nd adjustment department 53: Rotating part 54: arm 55: The first adsorption part 61,110: Basal part 62: arm 63,63A: The second adsorption part 91: Control Department 92: memory department 111: The first follow-up department 112: The second follow-up department 113: Rotating part 114: arm

[圖1]圖1,係表示實施形態的基板處理裝置之一部分的示意平面圖。 [圖2]圖2,係實施形態之主保持部的示意平面圖。 [圖3]圖3,係實施形態之主保持部的示意側視圖。 [圖4]圖4,係實施形態之副保持部的示意平面圖。 [圖5]圖5,係實施形態之副保持部的示意側視圖。 [圖6]圖6,係表示實施形態之基板處理裝置所執行的處理之程序的流程圖。 [圖7]圖7,係表示變形例的基板處理裝置之一部分的示意平面圖。 [圖8]圖8,係變形例之副保持部的示意平面圖。 [圖9]圖9,係變形例之副保持部的示意平面圖。 [FIG. 1] FIG. 1 is a schematic plan view showing part of a substrate processing apparatus according to an embodiment. [FIG. 2] FIG. 2 is a schematic plan view of the main holding portion of the embodiment. [ Fig. 3 ] Fig. 3 is a schematic side view of the main holding portion of the embodiment. [FIG. 4] FIG. 4 is a schematic plan view of the sub-holding portion of the embodiment. [ Fig. 5 ] Fig. 5 is a schematic side view of the sub-holding portion of the embodiment. [FIG. 6] FIG. 6 is a flowchart showing the procedure of processing executed by the substrate processing apparatus according to the embodiment. [ Fig. 7] Fig. 7 is a schematic plan view showing part of a substrate processing apparatus according to a modified example. [ Fig. 8] Fig. 8 is a schematic plan view of a sub-holding portion of a modified example. [ Fig. 9] Fig. 9 is a schematic plan view of a sub-holding portion of a modified example.

1:基板處理裝置 1: Substrate processing device

2:上浮平台 2: Floating platform

3_1(3):第1導引軌 3_1(3): The first guide rail

3_2(3):第2導引軌 3_2(3): The second guide rail

4_1(4):第1移動部 4_1(4): 1st Mobile Division

4_2(4):第2移動部 4_2(4): The second mobile unit

5_1(5):第1主保持部 5_1(5): The first main holding part

5_2(5):第2主保持部 5_2(5): The second main holding part

5_3(5):第3主保持部 5_3(5): The 3rd main holding part

5_4(5):第4主保持部 5_4(5): The 4th main holding part

6_1(6):第1副保持部 6_1(6): The 1st auxiliary holding part

6_2(6):第2副保持部 6_2(6): The second holding part

7:塗佈部 7: Coating department

8:維護部 8:Maintenance Department

9:控制裝置 9: Control device

10:一對軌道 10: A pair of tracks

91:控制部 91: Control Department

92:記憶部 92: memory department

S:基板 S: Substrate

Claims (6)

一種基板搬送裝置,其特徵係,具備有: 一對導引軌,沿著基板之搬送方向延伸; 一對移動部,沿著前述一對導引軌分別移動; 複數個主保持部,分別被設置於前述一對移動部上,從前述基板的下方保持前述基板;及 副保持部,被設置於在各前述移動部上相鄰的前述主保持部之間,從前述基板的下方保持前述基板, 前述複數個主保持部,係具備有: 第1吸附部,吸附保持前述基板;及 調整部,調整前述第1吸附部的位置, 前述副保持部,係具備有: 第2吸附部,吸附保持前述基板;及 追隨部,追隨基於前述第1吸附部的位置之調整的前述基板之移動,調整前述第2吸附部的位置。 A substrate conveying device is characterized in that it has: A pair of guide rails extending along the conveying direction of the substrate; A pair of moving parts respectively move along the aforementioned pair of guide rails; a plurality of main holding parts are respectively provided on the pair of moving parts, and hold the substrate from below the substrate; and The auxiliary holding part is provided between the main holding parts adjacent to each of the moving parts, and holds the substrate from below the substrate, The above-mentioned plurality of main holding parts are equipped with: the first adsorption unit adsorbs and holds the substrate; and The adjustment part adjusts the position of the aforementioned first adsorption part, The above-mentioned auxiliary holding part is equipped with: the second adsorption unit adsorbs and holds the substrate; and The following unit follows the movement of the substrate based on the adjustment of the position of the first suction unit, and adjusts the position of the second suction unit. 如請求項1之基板搬送裝置,其中, 前述調整部,係具備有: 第1調整部,沿著與前述搬送方向正交之方向調整前述第1吸附部的位置; 第2調整部,沿著前述搬送方向調整前述第1吸附部的位置;及 第3調整部,沿著以垂直軸為中心之圓周方向調整前述第1吸附部的位置, 前述追隨部,係追隨沿著與前述搬送方向正交之方向、前述搬送方向及以前述垂直軸為中心之圓周方向的前述基板之移動,調整前述第2吸附部的位置。 The substrate transfer device according to claim 1, wherein, The aforementioned adjustment department is equipped with: The first adjustment unit adjusts the position of the first suction unit along a direction perpendicular to the conveying direction; a second adjustment unit that adjusts the position of the first suction unit along the conveying direction; and The third adjustment part adjusts the position of the first adsorption part along the circumferential direction centered on the vertical axis, The following unit adjusts the position of the second suction unit by following the movement of the substrate in a direction perpendicular to the transport direction, the transport direction, and a circumferential direction centered on the vertical axis. 如請求項1之基板搬送裝置,其中, 前述調整部,係具備有: 第1調整部,沿著與前述搬送方向正交之方向調整前述第1吸附部的位置; 第2調整部,沿著前述搬送方向調整前述第1吸附部的位置;及 第3調整部,沿著以垂直軸為中心之圓周方向調整前述第1吸附部的位置, 前述追隨部,係具備有: 第1追隨部,追隨沿著與前述搬送方向正交之方向的前述基板之移動,調整前述第2吸附部的位置; 第2追隨部,追隨沿著前述搬送方向的前述基板之移動,調整前述第2吸附部的位置;及 第3追隨部,追隨沿著以前述垂直軸為中心之圓周方向的前述基板之移動,調整前述第2吸附部的位置。 The substrate transfer device according to claim 1, wherein, The aforementioned adjustment department is equipped with: The first adjustment unit adjusts the position of the first suction unit along a direction perpendicular to the conveying direction; a second adjustment unit that adjusts the position of the first suction unit along the conveying direction; and The third adjustment part adjusts the position of the first adsorption part along the circumferential direction centered on the vertical axis, The aforementioned follow-up department includes: the first following unit follows the movement of the substrate along the direction perpendicular to the conveying direction, and adjusts the position of the second suction unit; the second following unit adjusts the position of the second suction unit by following the movement of the substrate along the conveying direction; and The third following unit follows the movement of the substrate along the circumferential direction centering on the vertical axis, and adjusts the position of the second suction unit. 如請求項1~3中任一項之基板搬送裝置,其中, 前述第2吸附部,係沿著前述搬送方向的長度比前述第1吸附部長。 The substrate transfer device according to any one of claims 1 to 3, wherein, The second adsorption portion is longer in length along the conveyance direction than the first adsorption portion. 一種塗佈處理裝置,其特徵係,具備有: 如請求項1~4項中任一項之基板搬送裝置;及 塗佈部,對藉由前述基板搬送裝置所搬送的前述基板塗佈機能液。 A coating processing device is characterized in that it has: Such as the substrate transfer device in any one of the claims 1 to 4; and The coating unit applies a functional liquid to the substrate conveyed by the substrate conveying device. 一種基板搬送方法,係基板搬送裝置中之基板搬送方法,該基板搬送裝置,係具備有:一對導引軌,沿著基板之搬送方向延伸;一對移動部,沿著前述一對導引軌分別移動;複數個主保持部,分別被設置於前述一對移動部上,從前述基板的下方保持前述基板;及副保持部,被設置於在各前述移動部上相鄰的前述主保持部之間,從前述基板的下方保持前述基板,前述複數個主保持部,係具備有:第1吸附部,吸附保持前述基板;及調整部,調整前述第1吸附部的位置,前述副保持部,係具備有:第2吸附部,吸附保持前述基板;及追隨部,追隨基於前述第1吸附部的位置之調整的前述基板之移動,調整前述第2吸附部的位置,該基板搬送方法,其特徵係,包含有: 「藉由前述複數個主保持部及前述副保持部來保持前述基板」之工程; 「藉由使前述一對移動部沿著前述一對導引軌移動的方式,搬送前述基板」之工程;及 「在搬送前述基板的期間,藉由前述調整部調整前述第1吸附部的位置,並且藉由前述追隨部,追隨基於前述第1吸附部的位置之調整的前述基板之移動,調整前述第2吸附部的位置」之工程。 A substrate conveying method, which is a substrate conveying method in a substrate conveying device, the substrate conveying device is provided with: a pair of guide rails extending along the conveying direction of the substrate; a pair of moving parts extending along the pair of guide rails The rails move separately; a plurality of main holding parts are respectively provided on the aforementioned pair of moving parts, and hold the aforementioned substrate from below the aforementioned substrate; Between the parts, hold the above-mentioned substrate from below the above-mentioned substrate, and the above-mentioned plurality of main holding parts are equipped with: a first adsorption part, which absorbs and holds the above-mentioned substrate; A part comprising: a second suction part for holding the substrate by suction; and a follow-up part for following the movement of the substrate based on the adjustment of the position of the first suction part and adjusting the position of the second suction part. The substrate transfer method , whose features include: The process of "holding the above-mentioned substrate by the above-mentioned plurality of main holding parts and the above-mentioned auxiliary holding parts"; The process of "transporting the aforementioned substrate by moving the aforementioned pair of moving parts along the aforementioned pair of guide rails"; and "During the transfer of the substrate, the position of the first suction part is adjusted by the adjustment part, and the movement of the substrate based on the adjustment of the position of the first suction part is followed by the follow-up part to adjust the second suction part. The position of the adsorption part" project.
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