JP4652351B2 - Substrate support apparatus and substrate support method - Google Patents

Description

  The present invention relates to a substrate processing apparatus that processes a substrate such as a glass substrate, a substrate support apparatus that supports the substrate, and an inspection apparatus.

Conventionally, a substrate processing apparatus places a thin plate-like substrate (work) such as a glass substrate on a stage, performs positioning through the stage, and performs precision patterning on the substrate. When pattern formation is performed on a substrate, considerable accuracy is required, and it is required to accurately place the substrate to be processed at a predetermined position on the surface plate.
In recent years, in the field of displays such as liquid crystal color filters, the G6 generation (1500 mm × 1800 mm), the G7 generation (1870 mm × 2200 mm), etc., tend to increase the size of the glass substrate and increase the device weight, device cost, etc. is there.
In order to reduce the weight of the apparatus and reduce the cost, an air slider type thin plate conveying apparatus has been proposed (see, for example, [Patent Document 1]).

  Moreover, regarding the substrate position accuracy in the vertical direction, high accuracy is required in the processing region, but high accuracy is not required in the transfer region other than the processing region. Therefore, in a substrate support device that supports a substrate using an air levitation device, cost reduction can be achieved by providing an air levitation device having different levitation accuracy in the processing region and the transfer region. In this case, the air levitation device in the processing area where high accuracy is required improves the levitation accuracy by using both air pressure extrusion and suction, so the substrate flying height in the processing area is the same as the substrate flying height in the transfer area. Smaller.

JP 2004-238133 A

  However, if the floating amount of the substrate is different between the processing region and the transfer region, there is a problem that the behavior of the substrate becomes unstable when the substrate moves between the transfer region and the processing region. For this reason, the time and the movement distance necessary for stabilizing the behavior of the substrate are increased. Further, the substrate may be bent or fluttered, and the substrate may be broken and damaged. Furthermore, the thickness of the substrate tends to be thin, for example, 0.5 mm from the conventional 0.7 mm, and the possibility of the substrate being broken and broken is high.

  The present invention has been made in view of the above problems, and provides a substrate processing apparatus, a substrate support apparatus, and the like that can carry and process a substrate in a stable state while maintaining processing accuracy. The purpose is to do.

In order to achieve the above-described object, the first invention is a substrate support apparatus having a transfer area in which a substrate is transferred and a processing area in which a processing process is performed on the substrate by a processing apparatus. And at least a single-axis movement support device that is provided over the processing region and supports the substrate and moves in a predetermined direction, and a transfer region air levitation device that is provided in the transfer region and supports the substrate by air levitation And a processing region air levitation device that is provided in the processing region and supports the substrate by levitating the substrate, and when the substrate is transferred from the transport region to the processing region, the transport region and the processing to eliminate the vertical position change of the substrate due to the difference in flying height of the substrate in a region, the height of the upper surface of the transfer area air floating devices, high of the upper surface of the working area air floating device A substrate supporting device, characterized in that installed lower.

  A substrate support apparatus according to a first aspect of the present invention includes a transfer area air levitation device with low required accuracy and a processing area air levitation device with high required accuracy. The height of the substrate support surface (upper surface) of the transfer region air levitation device is lower than the height of the substrate support surface (upper surface) of the processing region air levitation device. Desirably, the difference between the height of the substrate support surface of the processing area air levitation apparatus and the height of the substrate support surface of the transfer area air levitation apparatus is determined by the amount of floating of the substrate by the transfer area air levitation apparatus and the height of the substrate by the processing area air levitation apparatus. It should be approximately equal to the difference from the flying height. Moreover, you may provide the alignment support apparatus which supports a board | substrate and performs alignment of a board | substrate.

In the substrate support apparatus according to the first aspect of the present invention, the vertical position of the substrate does not change when transferring from the transfer region to the processing region. Thereby, since bending and fluttering of a board | substrate are suppressed, damage to a board | substrate can be prevented.
Further, since the behavior and posture of the substrate in the processing region are stabilized, the entire range of the processing region can be set as a processable region. Thereby, the apparatus length of a board | substrate support apparatus can be shortened.

A second invention is a substrate support method for supporting a substrate that is transported in a transport region and processed in a processing region by a processing device, and that supports the substrate over the transport region and the processing region, and in a predetermined direction. A moving support step for moving the substrate in the transfer region, a transfer region air levitation step for supporting the substrate by air levitation in the transfer region, and a processing region air levitation device in the processing region for air levitation. And a processing region air levitation step for supporting the substrate, and the substrate by the transport region air levitation step to eliminate a vertical position change of the substrate when the substrate is transferred from the transport region to the processing region. the difference between the flying height of the substrate flying height and by the working area air floating step of, prior to the said machining area So that substantially equal to the difference between the height of the upper surface of the transfer area air floating device in the processing region height and the conveyance area of the upper surface of the air floating device, the height of the upper surface of the transfer area air floating device, the working area air It is a substrate support method characterized by being installed lower than the height of the upper surface of the levitation device .

  2nd invention is invention regarding the board | substrate support method which supports the board | substrate conveyed in a conveyance area | region and processed by a processing apparatus in a process area | region.

  According to the present invention, it is possible to provide a substrate processing apparatus, a substrate support apparatus, and the like that can carry and process a substrate in a stable state while maintaining processing accuracy.

  Hereinafter, preferred embodiments of a substrate processing apparatus and the like according to the present invention will be described in detail with reference to the accompanying drawings. In the following description and the accompanying drawings, the same reference numerals are given to components having substantially the same functional configuration, and redundant description will be omitted.

(1. Configuration of the substrate processing apparatus 1)
First, the configuration of the substrate processing apparatus 1 according to the embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a schematic perspective view of the substrate processing apparatus 1.
FIG. 2 is a YZ plane sectional view of the substrate processing apparatus 1.
The X direction indicates the transport direction of the substrate 3, the Y direction indicates the movement direction of the processing device 17, the Z direction indicates the vertical rotation axis, and the θ direction indicates the rotation direction. The X axis, the Y axis, and the Z axis are perpendicular to each other.

  The substrate processing apparatus 1 includes an X-direction movement support device 5, an alignment support device 7, a transfer area air levitation device 11, a processing area air levitation device 13, a transfer area air levitation device 15, a processing device 17, a Y direction movement device 19, and an alignment. It comprises a camera 21, a gantry 23, a base 24, and the like.

The substrate processing apparatus 1 is an apparatus that forms a fine-pitch pattern such as a color filter or an electronic circuit by processing the substrate 3 with a processing apparatus 17.
.
The substrate 3 is an object to be processed, and is, for example, a substrate such as a glass substrate, a silicon wafer, or a printed substrate.

The X-direction movement support device 5 is a device that supports the substrate 3 and moves it in the X direction and performs positioning in the X direction. The X-direction movement support device 5 includes a guide mechanism 27 and a movement actuator 29.
The guide mechanism 27 is, for example, a slider, a slide rail, or an air slide. The moving actuator 29 is, for example, a step motor, a servo motor, or a linear motor.
In addition, an X-direction movement support device 5 is installed at the center in the X direction of the transfer area air levitation device 11, the processing area air levitation device 13, and the transfer area air levitation device 15.

  The alignment support device 7 is provided above the X-direction movement support device 5. The alignment support device 7 includes an air pad 31 and a rotation actuator 33. The alignment support device 7 rotates the substrate 3 in the θ direction to perform alignment processing, and is movable in the X direction while supporting the substrate 3.

The air pad 31 is provided on the upper surface of the alignment support device 7. The air pad 31 is a support surface that supports the substrate 3 from below. The air pad 31 adsorbs and fixes and supports the substrate 3 or blows air to the substrate 3 to support it in a non-contact manner.
Adsorption of the substrate 3 is performed by reducing the pressure or vacuum of the air between the air pad 31 and the substrate 3 (vacuum, intake air). Non-contact support of the substrate 3 is performed by sending air between the air pad 31 and the substrate 3 (blow, pressurized air). The air pad 31 is provided with a small hole (not shown) for sucking or blowing air.
The rotation actuator 33 is, for example, a direct drive motor.

  The conveyance area air levitation device 11, the processing area air levitation device 13, and the conveyance area air levitation device 15 are provided in the conveyance area 51, the processing area 53, and the conveyance area 55, respectively. The conveyance area air levitation device 11, the processing area air levitation device 13, and the conveyance area air levitation device 15 are air floats, and have a function of supporting the substrate 3 in a non-contact manner by pushing up or sucking the substrate 3 with air pressure ( Porous plate). The transfer area air levitation device 11, the processing area air levitation device 13, and the transfer area air levitation device 15 are devices that realize predetermined Z-direction accuracy (relative distance accuracy between the substrate 3 and the processing device 17). The Z direction accuracy of the processing region air levitation device 13 is higher than the Z direction accuracy of the conveyance region air levitation device 11 and the conveyance region air levitation device 15.

FIG. 3 is a graph showing the flying height of the substrate 3.
If the Z direction accuracy is different, the flying height of the substrate 3 is also different. The flying height of the substrate 3 in the processing area air levitation apparatus 13 requiring high accuracy is “h2”, and the flying height of the substrate 3 in the conveyance area air levitation apparatus 11 and the conveyance area air levitation apparatus 15 where high accuracy is not required. “H1”. However, “h2 <h1”.

  A step corresponding to the floating amount of the substrate 3 is provided between the processing region air levitation device 13 and the conveyance region air levitation device 11 and the conveyance region air levitation device 15. The heights of the upper surfaces of the transfer area air levitation device 11 and the transfer area air levitation device 15 are made to be lower than the height of the upper surface of the processing area air levitation device 13 by the difference in the flying height “h1−h2” of the substrate 3. In addition, each device is assembled.

  The processing device 17 is a device that performs processing on the substrate 3, and is, for example, an inkjet head unit, a die coat unit, a laser irradiation head unit, or the like. The processing device 17 is provided in the gantry 23 via the Y-direction moving device 19. The Y-direction moving device 19 performs positioning by moving the processing device 17 in the Y direction.

  The alignment camera 21 images a predetermined portion (an alignment mark, a pattern, or the like formed on the substrate) of the substrate 3 in order to detect the θ direction angle and XY coordinates of the substrate 3 that is attracted and fixed to the alignment support device 7. It is a camera. The alignment camera 21 is fixedly supported on the frame 20 of the substrate processing apparatus 1. A plurality of alignment cameras 21 may be provided, or alignment cameras 21 having different fields of view (for example, for high accuracy and coarse accuracy) may be provided.

The alignment support device 7 can perform alignment processing in the transport region 51 by providing the alignment camera 21 in the transport region 51.
Further, since the alignment support device 7 can move in the X direction while supporting the substrate 3, the alignment process of the substrate 3 may be performed in the processing region 53 by providing the alignment camera 21 in the processing region 53. As described above, by performing the alignment process in the vicinity of the processing portion, it is possible to improve the alignment accuracy with respect to the processing.

(2. Process control)
Next, process control of the substrate processing apparatus 1 will be described with reference to FIG.
FIG. 4 is a diagram showing a flow of process control of the substrate processing apparatus 1.
A captured image of the alignment camera 21 is input to the image processing device 37. The image processing device 37 performs a process of extracting the θ direction angle and XY coordinates of the substrate 3 based on the captured image. The stage controller 39 compares the extracted data with predetermined data to calculate their deviation, and calculates the control amount so as to reduce the deviation.

The servo amplifier θ41 sends a control signal to the alignment support device 7 based on the θ direction control amount sent from the stage controller 39. The alignment support device 7 performs alignment in the θ direction of the substrate 3.
The servo amplifier X43 sends a control signal to the X-direction movement support device 5 based on the X-direction control amount sent from the stage controller 39. The X direction movement support device 5 moves the substrate 3 in the X direction.
The servo amplifier Y45 sends a control signal to the Y-direction moving device 19 based on the Y-direction control amount sent from the stage controller 39. The Y direction moving device 19 moves the processing device 17 in the Y direction.
The process system 47 adjusts the processing timing of the processing apparatus 17 based on the control amount sent from the stage controller 39.

(3. Operation of substrate processing apparatus 1)
Next, the operation of the substrate processing apparatus 1 will be described with reference to FIG.

FIG. 5 is a flowchart showing the operation of the substrate processing apparatus 1.
The substrate processing apparatus 1 sequentially performs each process of a conveyance process (step 101), a correction amount calculation process (step 102), an alignment process (step 103), and a processing process (step 104).

(3-1. Conveyance process: Step 101)
The transport area air levitation device 11 levitates the substrate 3 and supports it in a non-contact manner. The substrate processing apparatus 1 sucks and fixes the substrate 3 by the air pad 31 of the alignment support device 7. The substrate processing apparatus 1 moves the alignment support device 7 and the substrate 3 in the X direction by the X direction movement support device 5 and conveys them to the processing region air levitation device 13.

(3-2. Correction amount calculation process: Step 102)
The processing region air levitation device 13 levitates the substrate 3 and supports it in a non-contact manner. The substrate processing apparatus 1 images the alignment mark attached to the substrate 3 by the alignment camera 21, and calculates the correction amount in the θ direction, the X direction deviation amount, and the Y direction deviation amount based on the XY coordinates of the alignment mark.

(3-3. Alignment process: Step 103)
The processing region air levitation device 13 levitates the substrate 3 and supports it in a non-contact manner. The substrate processing apparatus 1 performs alignment processing by rotating the substrate 3 in the θ direction by the rotation actuator 33 based on the θ direction correction amount calculated by the processing in step 102.

(3-4. Processing: Step 104)
The processing region air levitation device 13 levitates the substrate 3 to support it in a non-contact manner, and maintains the Z-direction accuracy of the entire substrate 3. The substrate processing apparatus 1 may suck and fix the substrate 3 by the air pad 31 of the alignment support device 7 or may support it in a non-contact manner by extruding and sucking with air pressure.
The substrate processing apparatus 1 positions the processing apparatus 17 in the Y direction based on the Y direction deviation amount, adjusts the start timing and stop timing of the processing process based on the X direction deviation amount, and the processing apparatus 17 applies the substrate 3 to the substrate 3. Process.

  In addition, in order to improve the relative distance accuracy (Z direction accuracy) between the substrate 3 and the processing device 17, a sensor for measuring the position of the substrate 3 is provided on the processing device 17 side, and feedback is performed in real time. The air pressure of the levitation device 13 may be controlled.

  Through the above process, the substrate processing apparatus conveys the substrate 3 in the X direction by the X-direction moving support device 5, positions the substrate 3 in the θ direction by the alignment support device 7, and performs the Z direction by the processing region air levitation device 13. The substrate 3 is processed while maintaining accuracy.

(4. Behavior and posture of substrate 3)
Next, the behavior and posture of the substrate 3 will be described with reference to FIGS.

(4-1. In the case of the substrate processing apparatus 1 according to the embodiment of the present invention)
6-8 is a figure which shows the behavior and attitude | position of the board | substrate 3 in the board | substrate processing apparatus 1 which concerns on embodiment of this invention.
FIG. 6 is an XZ plane sectional view of the substrate processing apparatus 1. 7 is a cross-sectional view taken along line AA in FIG. 8 is a cross-sectional view taken along the line BB in FIG. For ease of understanding, some illustrations of the frame 20 and the gantry 23 are omitted.

The flying height of the substrate 3 from the upper surface of the transfer area air levitation device 11 and the transfer area air levitation device 15 is “h1”. The flying height of the substrate 3 from the upper surface of the processing region air levitation apparatus 13 is “h2”.
The heights of the upper surfaces of the transfer area air levitation device 11 and the transfer area air levitation device 15 are lower than the height of the upper surface of the processing area air levitation device 13 by “h1−h2”. Therefore, when the substrate 3 moves across the transfer area 51 to the processing area 53 to the transfer area 55, the position of the substrate 3 in the Z direction is always kept constant.

  As shown in FIG. 6, the Z-direction position of the substrate 3 is constant in the X direction across the transfer area 51 to the processing area 53 to the transfer area 55. As shown in FIGS. 7 and 8, the substrate 3 maintains the horizontal posture in the Y direction in both the transport region 51 and the processing region 53, and no bending or the like occurs.

Thus, in the substrate processing apparatus 1 according to the embodiment of the present invention, the position of the substrate 3 in the Z direction does not change when transferring from the transfer region 51 to the processing region 53. Thereby, since the bending and flapping of the board | substrate 3 are suppressed, damage to the board | substrate 3 can be prevented.
Further, since the behavior and posture of the substrate 3 in the processing region 53 are stabilized, the entire range of the processing region 53 can be set as the processable region 54. Thereby, the apparatus length of the substrate processing apparatus 1 can be shortened.

(4-2. In the case of the conventional substrate processing apparatus 101)
9 to 11 are views showing the behavior and posture of the substrate 3 in the conventional substrate processing apparatus 101.
FIG. 9 is an XZ plane sectional view of a conventional substrate processing apparatus 101. 10 is a cross-sectional view taken along the line CC of FIG. 11 is a cross-sectional view taken along the line DD of FIG. For ease of understanding, some illustrations of the frame 20 and the gantry 23 are omitted.
A conventional substrate processing apparatus 101 includes a transfer area air levitation device 111, a processing area air levitation device 113, and a transfer area air levitation device 115.

The flying height of the substrate 3 from the upper surface of the transfer area air levitation device 111 and the transfer area air levitation device 115 is “h1”. The flying height of the substrate 3 from the upper surface of the processing region air levitation device 113 is “h2”.
The heights of the upper surfaces of the transfer area air levitation device 111 and the transfer area air levitation device 115 are the same as the heights of the upper surfaces of the processing area air levitation device 113. Accordingly, when the substrate 3 moves across the transfer area 51 to the processing area 53 to the transfer area 55, the position of the substrate 3 in the Z direction is higher in the transfer area 51 and the transfer area 55 and lower in the processing area 53.

  As shown in FIG. 9, the position in the Z direction of the substrate 3 changes in the X direction when transferring from the transfer area 51 to the processing area 53 and when transferring from the processing area 53 to the transfer area 55. As shown in FIG. 11, in the processing region 53, the substrate 3 maintains a horizontal posture in the Y direction, and no bending or the like occurs. However, the alignment support device 7 sucks and supports the substrate 3 at the position in the Z direction of the substrate 3 in the processing region 53 even during the transport in the transport region 51. Therefore, as shown in FIG. 10, in the transfer area 51, the substrate 3 cannot maintain the horizontal posture in the Y direction, and the central portion sinks, causing bending or the like.

As described above, in the conventional substrate processing apparatus 101, the position of the substrate 3 in the Z direction changes when transferring from the transfer region 51 to the processing region 53. Further, in the transfer area 51, the central portion is in a sinking posture, and the substrate 3 cannot maintain a horizontal posture. As a result, there is a problem in that the substrate 3 may be damaged due to bending or flapping of the substrate 3.
In addition, since the behavior and posture of the substrate 3 in the processing region 53 are not stable, the substrate cannot be processed in the vicinity of the substrate loading portion and the substrate discharging portion in the processing region 53. Accordingly, the workable area 154 is narrower than the work area 53. Accordingly, there is a problem that the apparatus length of the substrate processing apparatus 101 becomes long.

(5. Air float configuration and control)
FIG. 12 is a diagram illustrating an aspect of the arrangement of the air float units.
FIG. 13 is a diagram illustrating one mode of block control of the air float.

  The configuration and control of the transfer area air levitation device 11, the processing area air levitation device 13, and the transfer area air levitation device 15 can take various forms.

As shown in FIG. 12, a plurality of air float units 91 may be arranged to constitute the transfer area air levitation device 11, the processing area air levitation device 13, and the transfer area air levitation device 15.
It is desirable to arrange the air float unit 91 according to the required accuracy. For example, in the low-precision transfer area 51 and the transfer area 55, the air float units 91 are arranged sparsely with a large interval, and in the high-precision processing area 53, the intervals between the air float units 91 are reduced and arranged densely. It is desirable to do.

  As shown in FIG. 13, when an integrated air float is used, an air flow path (air system) may be provided for each of the plurality of blocks 93 to control the air region range, air flow rate, and air pressure. .

  Thus, the Z direction accuracy of the substrate 3 can be adjusted by controlling the air flow rate and air pressure of the air float. For example, even when unevenness or inclination exists on the surface of the substrate supported by the air float, the accuracy can be improved by controlling the air flow rate and air pressure in the vicinity of the region. In the case of a stone surface plate, it is difficult to improve the position accuracy after installation.

(6. Top surface end shape of processing region air levitation device 13)
FIG. 14 is an XZ plane sectional view of the machining area air levitation device 13.
Since there is a step between the processing area air levitation device 13 and the conveyance area air levitation device 11 and the conveyance area air levitation device 15, the substrate 3 may collide with the side surface of the processing area air levitation device 13. .

In FIG. 14, an R portion 63 is provided at the upper surface end of the machining area air levitation device 13.
Thereby, even when the substrate 3 is in contact with the side surface of the processing region air levitation device 13, the substrate 3 is guided upward by the R portion 63, so that the movement of the substrate 3 can be continued.

(7. Others)
The number of axes and the installation position of the X-direction movement support device 5 are not particularly limited. Regarding the number of axes, at least one axis may be provided according to the size, shape, and weight of the substrate 3. Regarding the installation position, not only the position of supporting the central part of the substrate 3 but also the position of supporting a part other than the central part of the substrate 3 may be used.

  In the above-described embodiment, the alignment support device 7 is described as being provided above the X-direction movement support device 5, supports the substrate 3, performs alignment processing, and is movable in the X direction. The alignment support device may be fixedly arranged in the conveyance region or the processing region.

  Moreover, although the above-mentioned embodiment demonstrated the board | substrate processing apparatus which processes a board | substrate, it can also apply to the inspection apparatus which test | inspects inspection objects, such as a board | substrate and printed matter. In the inspection apparatus, an area corresponding to the processing area of the substrate processing apparatus may be set as the inspection area, and the inspection object may be inspected in the inspection area.

  The preferred embodiments of the substrate processing apparatus according to the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be apparent to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea disclosed in the present application, and these are naturally within the technical scope of the present invention. Understood.

Schematic perspective view of substrate processing apparatus 1 YZ plane sectional view of substrate processing apparatus 1 Graph showing the flying height of the substrate 3 The figure which shows the flow of the process control of the substrate processing apparatus 1 Flow chart showing the operation of the substrate processing apparatus 1 XZ plane sectional view of substrate processing apparatus 1 AA line sectional view of FIG. BB sectional view of FIG. XZ plane sectional view of a conventional substrate processing apparatus 101 CC sectional view of FIG. DD sectional view of FIG. The figure which shows the one aspect | mode of arrangement | positioning of an air float unit The figure which shows the one aspect | mode of block control of an air float XZ plane sectional view of machining area air levitation device 13

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ......... Substrate processing device 3 ......... Substrate 5 ......... X-direction movement support device 6 ......... Dove groove 7 ...... Alignment support device 11, 15 ......... Transfer area air levitation device 13 ......... Processing Area air levitation device 17 ......... Processing device 19 ......... Y direction moving device 20 ......... Frame 21 ......... Alignment camera 23 ......... Gantry 24 ......... Base 27 ......... Guide mechanism 29 ......... Movement Actuator 31 ... Air pad 33 ... Rotary actuator 37 ... Image processing device 39 ... Stage controller 41 ... Servo amplifier θ
43 ......... Servo Amplifier X
45 ......... Servo amplifier Y
47 ... Process system 51, 55 ... Transfer area 53 ... Processing area 54 ... Processable area 63 ... R section 91 ... Air float unit 93 ... Block 101 ... Substrate Processing equipment (conventional)
111, 115 ... Transfer area air levitation device (conventional)
113 ......... Air levitation device for machining area (conventional)
154 ... Processable area (conventional)

Claims (3)

A substrate support device having a transport region in which a substrate is transported and a processing region in which processing by the processing device is performed on the substrate,
An at least one-axis movement support device that is provided over the transfer region and the processing region and supports the substrate and moves in a predetermined direction;
A transport region air levitation device provided in the transport region and supporting the substrate by air levitation;
A processing region air levitation device provided in the processing region and supporting the substrate by air levitation;
Comprising
In order to eliminate a vertical position change of the substrate due to a difference in floating amount of the substrate in the transfer region and the processing region when the substrate is transferred from the transfer region to the processing region, the transfer region air levitation device substrate supporting device the height of the upper surface, characterized in that installed the lower than the height of the upper surface of the working area air floating device.   The difference between the height of the upper surface of the processing region air levitation device and the height of the upper surface of the transfer region air levitation device is the amount of floating of the substrate by the conveyance region air levitation device and the height of the substrate by the processing region air levitation device. The substrate support apparatus according to claim 1, wherein the substrate support apparatus is substantially equal to a difference from the quantity. A substrate support method for supporting a substrate that is transported in a transport region and processed by a processing device in a processing region,
A moving support step for supporting the substrate over the transport area and the processing area and moving the substrate in a predetermined direction;
A transport region air levitation step for supporting the substrate by air levitation by a transport region air levitation device in the transport region;
A processing region air levitation step for supporting the substrate by air levitation by a processing region air levitation device in the processing region;
Comprising
In order to eliminate the vertical position change of the substrate when the substrate is transferred from the transfer region to the processing region, the amount of floating of the substrate by the transfer region air levitation step and the amount of the substrate by the processing region air levitation step are reduced. as the difference between the flying height, approximately equal to the difference between the height of the upper surface of the transfer area air floating device in the height and the conveyance area of the upper surface of the working area air floating device in the working area, the transport area air floating A substrate supporting method , wherein the height of the upper surface of the apparatus is set lower than the height of the upper surface of the processing region air levitation device .

Images