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SE521666C2 - Monteringsstruktur för en effekttransistormodul med ett strålningskyldon - Google Patents

Monteringsstruktur för en effekttransistormodul med ett strålningskyldon

Info

Publication number
SE521666C2
SE521666C2 SE9702923A SE9702923A SE521666C2 SE 521666 C2 SE521666 C2 SE 521666C2 SE 9702923 A SE9702923 A SE 9702923A SE 9702923 A SE9702923 A SE 9702923A SE 521666 C2 SE521666 C2 SE 521666C2
Authority
SE
Sweden
Prior art keywords
power transistor
transistor module
mounting
mounting structure
radiation
Prior art date
Application number
SE9702923A
Other languages
English (en)
Swedish (sv)
Other versions
SE9702923L (sv
SE9702923D0 (sv
Inventor
Takahiro Ishigami
Hitoshi Tanifuji
Yoshihiko Kikkawa
Yoshihiro Iwasaki
Hiroaki Suzuki
Makoto Tanikawa
Masahito Mori
Isao Kawasaki
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of SE9702923D0 publication Critical patent/SE9702923D0/xx
Publication of SE9702923L publication Critical patent/SE9702923L/
Publication of SE521666C2 publication Critical patent/SE521666C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
SE9702923A 1997-03-21 1997-08-14 Monteringsstruktur för en effekttransistormodul med ett strålningskyldon SE521666C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06808997A JP3416450B2 (ja) 1997-03-21 1997-03-21 パワートランジスタモジュールの実装構造

Publications (3)

Publication Number Publication Date
SE9702923D0 SE9702923D0 (sv) 1997-08-14
SE9702923L SE9702923L (sv) 1998-09-22
SE521666C2 true SE521666C2 (sv) 2003-11-25

Family

ID=13363672

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9702923A SE521666C2 (sv) 1997-03-21 1997-08-14 Monteringsstruktur för en effekttransistormodul med ett strålningskyldon

Country Status (4)

Country Link
US (1) US5946192A (ja)
JP (1) JP3416450B2 (ja)
CN (1) CN1109362C (ja)
SE (1) SE521666C2 (ja)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD428850S (en) * 1998-09-18 2000-08-01 Spectrian Power stack basic power module architecture
JP3886295B2 (ja) * 1999-06-15 2007-02-28 松下冷機株式会社 冷凍システムのパワー制御装置およびコンプレッサ
US6249435B1 (en) * 1999-08-16 2001-06-19 General Electric Company Thermally efficient motor controller assembly
JP4142227B2 (ja) * 2000-01-28 2008-09-03 サンデン株式会社 車両用電動圧縮機のモータ駆動用インバータ装置
US6342766B1 (en) * 2000-09-13 2002-01-29 General Electric Company Power module for high intensity discharge lamp
US6385046B1 (en) * 2000-09-14 2002-05-07 Sun Microsystems, Inc. Heat sink assembly having inner and outer heatsinks
JP2002134973A (ja) * 2000-10-19 2002-05-10 Matsushita Electric Ind Co Ltd ヒートシンク装置及び電子機器
FR2818491B1 (fr) * 2000-12-19 2004-03-12 Siemens Ag Dispositif de refroidissement pour circuit electronique et procede de realisation de ce dispositif
EP1406303A4 (en) * 2001-07-09 2007-12-12 Daikin Ind Ltd POWER MODULE AND AIR CONDITIONING
ES1050831Y (es) * 2001-12-27 2002-09-16 Lear Automotive Eeds Spain Conector electronico integrado
JP3958589B2 (ja) * 2002-01-23 2007-08-15 株式会社オートネットワーク技術研究所 電気接続箱
US6583988B1 (en) * 2002-02-05 2003-06-24 Whelen Engineering Company, Inc. Encapsulated power supply
US6881077B2 (en) * 2002-07-22 2005-04-19 Siemens Vdo Automotive Corporation Automotive control module housing
JP2004072907A (ja) * 2002-08-06 2004-03-04 Sumitomo Wiring Syst Ltd 電気接続箱
WO2004112450A1 (ja) * 2003-06-12 2004-12-23 Fujitsu Limited 基板実装方法及び実装構造
TW200506586A (en) * 2003-08-07 2005-02-16 Wincomm Corp Fanless heat sink for computer equipment
US6999317B2 (en) * 2003-08-12 2006-02-14 Delphi Technologies, Inc. Thermally enhanced electronic module with self-aligning heat sink
US6980437B2 (en) * 2004-03-03 2005-12-27 Tyco Electronics Corporation Pluggable electronic receptacle with heat sink assembly
US7113405B2 (en) * 2004-05-27 2006-09-26 Eaton Power Quality Corporation Integrated power modules with a cooling passageway and methods for forming the same
FR2871534B1 (fr) * 2004-06-15 2006-08-04 Siemens Vdo Automotive Sas Groupe moto ventilateur a commande electronique refroidie par air ambiant pulse
EP1761709B1 (de) * 2004-06-24 2009-09-23 Continental Teves AG & Co. oHG Steuergerätegehäuse für eine elektronische bremse
JP2006093404A (ja) * 2004-09-24 2006-04-06 Sumitomo Wiring Syst Ltd 電気接続箱
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
CN100397600C (zh) * 2005-04-26 2008-06-25 佛山市顺德区顺达电脑厂有限公司 晶体管模块组装方法及其治具
CN100334717C (zh) * 2005-05-14 2007-08-29 河北华整实业有限公司 一种电力电子功率器件模块
US7242593B2 (en) * 2005-07-08 2007-07-10 Ims Inc. Thermally efficient motor housing assembly
US7532474B2 (en) * 2006-02-21 2009-05-12 3Com Corporation Apparatus for dissipating heat from electronic components in an enclosed housing
JP4692323B2 (ja) * 2006-02-21 2011-06-01 パナソニック株式会社 空気調和機
DE102006018854A1 (de) * 2006-04-22 2007-11-22 Sma Technologie Ag Gehäuse eines Stromrichters
DE102006061215A1 (de) * 2006-08-12 2008-02-21 Diehl Ako Stiftung & Co. Kg Leistungselektronik mit Kühlkörper
US7733659B2 (en) * 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
US7554805B2 (en) * 2007-06-25 2009-06-30 Shuttle Inc. Heat dissipation structure for electronic devices
FR2920491B1 (fr) * 2007-09-03 2013-07-19 Siemens Vdo Automotive Groupe moto-ventilateur avec carte electronique de commande refroidie par air pulse
JP5125355B2 (ja) * 2007-09-27 2013-01-23 ダイキン工業株式会社 空気調和装置
JP5094562B2 (ja) * 2008-05-29 2012-12-12 三菱電機株式会社 屋外用制御基板及び空気調和機の室外機
DE102008041366A1 (de) * 2008-08-20 2010-02-25 Robert Bosch Gmbh Elektronikmodul
US7724526B2 (en) * 2008-10-10 2010-05-25 Delphi Technologies, Inc. Electronic module with heat sink
JP4973702B2 (ja) * 2009-02-02 2012-07-11 ダイキン工業株式会社 電装品モジュール及び冷却部材の結合方法、及び空気調和装置
CN101907908B (zh) * 2009-06-04 2013-03-13 富准精密工业(深圳)有限公司 电子设备及其机箱
DE102009026886A1 (de) * 2009-06-10 2010-12-16 Robert Bosch Gmbh Formteil zur Aufnahme mehrerer elektrischer Bauteile
EP2299582B1 (de) * 2009-09-18 2015-03-11 SMA Solar Technology AG Wechselrichter mit einem Gehäuse und darin angeordneten elektrischen und elektronischen Bauteilen
KR100972447B1 (ko) * 2009-10-01 2010-07-26 김지희 무접점 릴레이
JP5236771B2 (ja) * 2011-04-18 2013-07-17 株式会社ソニー・コンピュータエンタテインメント 電子機器
CN102306638A (zh) * 2011-08-31 2012-01-04 昆山锦泰电子器材有限公司 带有半导体三极管的组装散热片
CN103096674B (zh) * 2011-11-02 2015-11-11 纬创资通股份有限公司 固定机构、电子装置及固定电子组件的方法
JP5773904B2 (ja) * 2012-02-07 2015-09-02 三菱電機株式会社 電気品箱および空気調和機
CN103369924B (zh) * 2012-04-17 2016-05-04 苏州方林科技股份有限公司 散热片及应用该散热片的电源模组
CN107591998A (zh) * 2013-11-26 2018-01-16 台达电子企业管理（上海）有限公司 电源转换装置与其电源转换板组件
JP6335515B2 (ja) * 2014-01-15 2018-05-30 三菱電機株式会社 半導体素子の保護構造および空気調和機の室外機
JP6349807B2 (ja) * 2014-03-14 2018-07-04 オムロン株式会社 電子機器
AT515828B1 (de) * 2014-05-23 2022-02-15 Fronius Int Gmbh Kühlvorrichtung und Wechselrichtergehäuse mit einer solchen Kühlvorrichtung
KR102257795B1 (ko) * 2014-08-29 2021-05-28 한온시스템 주식회사 전동 압축기
US10128723B2 (en) * 2015-07-07 2018-11-13 Milwaukee Electric Tool Corporation Printed circuit board spacer
AU2016395713B2 (en) * 2016-03-04 2019-06-20 Mitsubishi Electric Corporation Electrical Component module, and outdoor unit of air-conditioning apparatus
EP3214911A1 (en) * 2016-03-04 2017-09-06 Thomson Licensing Apparatus comprising a housing with an improved cooling
JP2017187214A (ja) * 2016-04-05 2017-10-12 三菱重工サーマルシステムズ株式会社 冷却装置、冷凍サイクル装置、及び冷却装置の製造方法
DE102017212968B4 (de) * 2016-08-05 2024-02-01 Robert Bosch Gmbh Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren
EP3416467B1 (en) * 2017-06-13 2022-05-04 ABB Schweiz AG Heat exchanger structure for a rack assembly
CN109579242B (zh) * 2019-01-21 2024-12-31 广东美的暖通设备有限公司 控制器和空调器
US11425842B2 (en) * 2020-09-14 2022-08-23 Hewlett Packard Enterprise Development Lp Thermal design of an access point
CN112530876B (zh) * 2020-12-22 2023-05-09 江西龙芯微科技有限公司 一种集成电路sip封装结构
DE102023205498A1 (de) * 2023-06-13 2024-12-19 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung und Verfahren zur Entwärmung eines Elektronikbauteils eines Kraftfahrzeugs

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3219571A1 (de) * 1982-05-25 1983-12-01 Festo-Maschinenfabrik Gottlieb Stoll, 7300 Esslingen Gehaeuse fuer elektronische schaltungen
DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts
JP2570410B2 (ja) * 1988-12-22 1997-01-08 日本電気株式会社 電子回路パッケージ
JPH0521670A (ja) * 1991-07-12 1993-01-29 Sumitomo Electric Ind Ltd ヒートシンク、ヒートシンクの製造方法および製造装置
JPH06123449A (ja) * 1992-10-12 1994-05-06 Hitachi Ltd 空気調和機の室外ユニット
JPH0886473A (ja) * 1994-09-20 1996-04-02 Fujitsu General Ltd 空気調和機の室外機
US5740013A (en) * 1996-07-03 1998-04-14 Hewlett-Packard Company Electronic device enclosure having electromagnetic energy containment and heat removal characteristics

Also Published As

Publication number Publication date
JP3416450B2 (ja) 2003-06-16
CN1194467A (zh) 1998-09-30
US5946192A (en) 1999-08-31
SE9702923L (sv) 1998-09-22
JPH10267326A (ja) 1998-10-09
CN1109362C (zh) 2003-05-21
SE9702923D0 (sv) 1997-08-14

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