JPS5515246A - Bonding method for semiconductor substrate - Google Patents
Bonding method for semiconductor substrateInfo
- Publication number
- JPS5515246A JPS5515246A JP8820078A JP8820078A JPS5515246A JP S5515246 A JPS5515246 A JP S5515246A JP 8820078 A JP8820078 A JP 8820078A JP 8820078 A JP8820078 A JP 8820078A JP S5515246 A JPS5515246 A JP S5515246A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- bonding
- solder
- supporter
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 239000010931 gold Substances 0.000 abstract 6
- 229910015365 Au—Si Inorganic materials 0.000 abstract 4
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 239000010408 film Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8820078A JPS5515246A (en) | 1978-07-18 | 1978-07-18 | Bonding method for semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8820078A JPS5515246A (en) | 1978-07-18 | 1978-07-18 | Bonding method for semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5515246A true JPS5515246A (en) | 1980-02-02 |
Family
ID=13936247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8820078A Pending JPS5515246A (en) | 1978-07-18 | 1978-07-18 | Bonding method for semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5515246A (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60205370A (ja) * | 1984-03-30 | 1985-10-16 | Tokyo Keiki Co Ltd | 加速度計 |
| CN111785614A (zh) * | 2020-06-18 | 2020-10-16 | 上海空间电源研究所 | 一种降低电压损耗的键合结构及其制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4939223A (ja) * | 1972-08-23 | 1974-04-12 | ||
| JPS5286064A (en) * | 1976-01-12 | 1977-07-16 | Hitachi Ltd | Semiconductor device |
-
1978
- 1978-07-18 JP JP8820078A patent/JPS5515246A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4939223A (ja) * | 1972-08-23 | 1974-04-12 | ||
| JPS5286064A (en) * | 1976-01-12 | 1977-07-16 | Hitachi Ltd | Semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60205370A (ja) * | 1984-03-30 | 1985-10-16 | Tokyo Keiki Co Ltd | 加速度計 |
| CN111785614A (zh) * | 2020-06-18 | 2020-10-16 | 上海空间电源研究所 | 一种降低电压损耗的键合结构及其制备方法 |
| CN111785614B (zh) * | 2020-06-18 | 2022-04-12 | 上海空间电源研究所 | 一种降低电压损耗的键合结构及其制备方法 |
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