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JPS5660025A - Bonding method for semiconductor element - Google Patents

Bonding method for semiconductor element

Info

Publication number
JPS5660025A
JPS5660025A JP13549579A JP13549579A JPS5660025A JP S5660025 A JPS5660025 A JP S5660025A JP 13549579 A JP13549579 A JP 13549579A JP 13549579 A JP13549579 A JP 13549579A JP S5660025 A JPS5660025 A JP S5660025A
Authority
JP
Japan
Prior art keywords
whereon
glass fibers
bonding
solder bump
scattered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13549579A
Other languages
Japanese (ja)
Other versions
JPS6119107B2 (en
Inventor
Shigeki Iguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP13549579A priority Critical patent/JPS5660025A/en
Publication of JPS5660025A publication Critical patent/JPS5660025A/en
Publication of JPS6119107B2 publication Critical patent/JPS6119107B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To perform the reliable bonding of a thin wiring on the solder bump and the bonding substrate of the subject semiconductor element by a method wherein glass fibers with the prescribed diameter are scattered on the bonding substrate and a semiconductor wafer whereon a solder bump has been formed is placed on said substrate. CONSTITUTION:A semiconductor wafer 1, whereon an electrode pad 2 consisting of three-layer thin films of Cr, Cu and Au is formed, is soaked in a solder vessel and a solder bump 8 is formed on the electrode pad 2. Then glass fibers 7 with a radius of approximately 9mu-12mu are scattered on a bonding substrate 5 whereon the prescribed thin film wiring has been provided. On the glass fibers 7 scattered in such way as above, the semiconductor wafer 1 whereon the solder bump has been provided is placed, a bonding is performed using the conventional method and the electrode pad 2 and the thin wiring 6 are bonded with solder 8. In consequence, the glass fibers perform as a stand-off, thereby making the stand-off to be useless.
JP13549579A 1979-10-19 1979-10-19 Bonding method for semiconductor element Granted JPS5660025A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13549579A JPS5660025A (en) 1979-10-19 1979-10-19 Bonding method for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13549579A JPS5660025A (en) 1979-10-19 1979-10-19 Bonding method for semiconductor element

Publications (2)

Publication Number Publication Date
JPS5660025A true JPS5660025A (en) 1981-05-23
JPS6119107B2 JPS6119107B2 (en) 1986-05-15

Family

ID=15153066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13549579A Granted JPS5660025A (en) 1979-10-19 1979-10-19 Bonding method for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5660025A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021534A (en) * 1983-07-15 1985-02-02 Seiko Epson Corp circuit mounting structure
JP2003298167A (en) * 2002-03-29 2003-10-17 Toshiba Corp Optical semiconductor device
US7232740B1 (en) 2005-05-16 2007-06-19 The United States Of America As Represented By The National Security Agency Method for bumping a thin wafer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6021534A (en) * 1983-07-15 1985-02-02 Seiko Epson Corp circuit mounting structure
JP2003298167A (en) * 2002-03-29 2003-10-17 Toshiba Corp Optical semiconductor device
US7232740B1 (en) 2005-05-16 2007-06-19 The United States Of America As Represented By The National Security Agency Method for bumping a thin wafer

Also Published As

Publication number Publication date
JPS6119107B2 (en) 1986-05-15

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