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JP4879308B2 - ペリクル剥離用冶具および剥離方法 - Google Patents

ペリクル剥離用冶具および剥離方法 Download PDF

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Publication number
JP4879308B2
JP4879308B2 JP2009248548A JP2009248548A JP4879308B2 JP 4879308 B2 JP4879308 B2 JP 4879308B2 JP 2009248548 A JP2009248548 A JP 2009248548A JP 2009248548 A JP2009248548 A JP 2009248548A JP 4879308 B2 JP4879308 B2 JP 4879308B2
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JP
Japan
Prior art keywords
pellicle
photomask
jig
adhesive layer
peeling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009248548A
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English (en)
Japanese (ja)
Other versions
JP2011095453A (ja
Inventor
一敏 関原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2009248548A priority Critical patent/JP4879308B2/ja
Priority to KR1020100045927A priority patent/KR101564115B1/ko
Priority to CN201010225329XA priority patent/CN102053482B/zh
Priority to TW099122972A priority patent/TWI423382B/zh
Publication of JP2011095453A publication Critical patent/JP2011095453A/ja
Priority to HK11109232.6A priority patent/HK1155232A1/xx
Application granted granted Critical
Publication of JP4879308B2 publication Critical patent/JP4879308B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2009248548A 2009-10-29 2009-10-29 ペリクル剥離用冶具および剥離方法 Expired - Fee Related JP4879308B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009248548A JP4879308B2 (ja) 2009-10-29 2009-10-29 ペリクル剥離用冶具および剥離方法
KR1020100045927A KR101564115B1 (ko) 2009-10-29 2010-05-17 펠리클 박리용 지그 및 박리 방법
CN201010225329XA CN102053482B (zh) 2009-10-29 2010-07-12 防尘薄膜组件剥离用夹具及剥离方法
TW099122972A TWI423382B (zh) 2009-10-29 2010-07-13 防塵薄膜組件剝離用夾具及剝離方法
HK11109232.6A HK1155232A1 (en) 2009-10-29 2011-09-01 Pellicle peeling jig and peeling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009248548A JP4879308B2 (ja) 2009-10-29 2009-10-29 ペリクル剥離用冶具および剥離方法

Publications (2)

Publication Number Publication Date
JP2011095453A JP2011095453A (ja) 2011-05-12
JP4879308B2 true JP4879308B2 (ja) 2012-02-22

Family

ID=43957952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009248548A Expired - Fee Related JP4879308B2 (ja) 2009-10-29 2009-10-29 ペリクル剥離用冶具および剥離方法

Country Status (5)

Country Link
JP (1) JP4879308B2 (zh)
KR (1) KR101564115B1 (zh)
CN (1) CN102053482B (zh)
HK (1) HK1155232A1 (zh)
TW (1) TWI423382B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6125348B2 (ja) * 2013-06-24 2017-05-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6376601B2 (ja) * 2015-05-18 2018-08-22 信越化学工業株式会社 ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法
US11183410B2 (en) * 2017-04-24 2021-11-23 Photronics, Inc. Pellicle removal tool
CN110756403B (zh) * 2019-10-08 2020-10-02 东莞市欧珀精密电子有限公司 一种显示屏组件擦胶的夹具及其加工方法
JP7292420B2 (ja) * 2019-12-13 2023-06-16 三井化学株式会社 ペリクルのデマウント方法、及び、ペリクルのデマウント前処理装置
US20220390829A1 (en) * 2019-12-13 2022-12-08 Mitsui Chemicals, Inc. Pellicle demounting method, and pellicle demounting device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181036A (ja) * 1988-01-14 1989-07-19 Fujitsu General Ltd 空気調和機の風向調節装置
JPH02247651A (ja) * 1989-03-20 1990-10-03 Fujitsu Ltd ペリクル除去装置
JP2520964B2 (ja) * 1989-09-25 1996-07-31 本田技研工業株式会社 複数ロ―ラ式シャシ―ダイナモメ―タ
JP2002131892A (ja) * 2000-10-27 2002-05-09 Asahi Kasei Electronics Co Ltd ペリクルの剥離方法及びその装置
JP2006146085A (ja) * 2004-11-24 2006-06-08 Shin Etsu Chem Co Ltd 大型ペリクル
JP4677632B2 (ja) 2005-07-08 2011-04-27 レーザーテック株式会社 ペリクルライナー又はペリクルの剥離装置、剥離方法及びパターン基板の製造方法
JP2007241204A (ja) * 2006-03-08 2007-09-20 Sigma Meltec Ltd ペリクル剥離方法および装置
JP4637053B2 (ja) * 2006-05-15 2011-02-23 信越化学工業株式会社 ペリクルおよびペリクル剥離装置
JP2007333910A (ja) * 2006-06-14 2007-12-27 Shin Etsu Chem Co Ltd ペリクル
JP4999634B2 (ja) 2007-05-08 2012-08-15 松下精機株式会社 ペクリル剥離装置及びその方法
KR101264571B1 (ko) * 2007-07-06 2013-05-14 아사히 가세이 이-매터리얼즈 가부시키가이샤 대형 펠리클 프레임체 및 그 프레임체의 파지 방법
DE102007063383B4 (de) * 2007-12-18 2020-07-02 HAP Handhabungs-, Automatisierungs- und Präzisionstechnik GmbH Vorrichtung und Verfahren zur Entfernung von Pelliclen von Masken

Also Published As

Publication number Publication date
CN102053482B (zh) 2012-11-21
KR101564115B1 (ko) 2015-10-28
HK1155232A1 (en) 2012-05-11
TW201115680A (en) 2011-05-01
TWI423382B (zh) 2014-01-11
KR20110047110A (ko) 2011-05-06
CN102053482A (zh) 2011-05-11
JP2011095453A (ja) 2011-05-12

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