JP6376601B2 - ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法 - Google Patents
ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法 Download PDFInfo
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- JP6376601B2 JP6376601B2 JP2015100677A JP2015100677A JP6376601B2 JP 6376601 B2 JP6376601 B2 JP 6376601B2 JP 2015100677 A JP2015100677 A JP 2015100677A JP 2015100677 A JP2015100677 A JP 2015100677A JP 6376601 B2 JP6376601 B2 JP 6376601B2
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Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
そして、本発明のペリクル装着方法では、ペリクル支持手段は、ペリクルをペリクル収納容器から取り出してフォトマスクに貼り付ける工程まで用いられることが好ましい。
ここで、外寸対角長とは、図10に示すように、矩形のペリクルの長辺外形と短辺外形を延長して交差した点間の長さである。一般的な矩形のペリクルフレームでは、角部の外側に幾ばくかのR面取りが成されているが、このR部を無視した対角の長さである。
したがって、本発明が適用される「剛性が低いペリクル」は、材質にも左右されることではあるが、材質が一般的なアルミニウム合金の場合、スタンドオフ/外寸対角長が0.003を下回るようなサイズのペリクルが好ましい。
したがって、本発明が適用される「スタンドオフの小さいペリクル」は、ペリクル10の辺長にもよるが、スタンドオフの具体的な数値が0.2〜6mm位までのペリクルが好ましい。
ここで、支持体16のペリクル締結側の平面度は、その大きさにもよるが、締結したペリクルにうねりなどが生じて取り付けに不具合が発生することを防止するために、少なくとも0.5mm、好ましくは0.2mm以下とすることが好ましい。
なお、このペリクルフレーム11は、その垂直方向の剛性が極めて低く、ハンドリングすることができなかったため、これらの作業は、ペリクルフレーム11をアルミニウム製の平板(図示しない)上に載置したまま行った。
11 ペリクルフレーム
12 ペリクル膜接着層
13 マスク粘着層
14 ペリクル膜
15 セパレータ
16 支持体
17 締結手段
18 把持部
20 ペリクル支持手段
60 ペリクル支持手段(円形)
61 支持体(円形)
62 締結手段
70 ペリクル収納容器
71 ペリクル収納容器本体
72 蓋体
73 固定部
91 フォトマスク
Claims (6)
- スタンドオフ/外寸対角長の値が0.0001〜0.003であるペリクルを支持するためのペリクル支持手段であって、ペリクルフレームの外形と略一致する矩形又は円形をなす枠状の支持体と、該枠状の支持体に設けられ、該支持体と前記ペリクルフレームとを締結する微粘着性物質から成るもので、その粘着力が垂直方向に0.5mm/sの速度で引き剥がした場合に0.01〜0.5Nの範囲である締結手段と、前記枠状の支持体にハンドリングに使用するために設けられた把持部とを備え、前記ペリクルフレームのペリクル膜接着層側に脱着可能に設けられていることを特徴とするペリクル支持手段。
- 前記微粘着性物質は、前記支持体に複数個所に分割して配置されていることを特徴とする請求項1に記載のペリクル支持手段。
- 前記微粘着性物質は、シリコーンまたはウレタンから選択されるゲル状物質であることを特徴とする請求項1または2に記載のペリクル支持手段。
- スタンドオフ/外寸対角長の値が0.0001〜0.003であり、ペリクル膜がペリクルフレームの一面に接着層を介して接着されたペリクルと、該ペリクルを支持する前記請求項1乃至3の何れかに記載のペリクル支持手段とを備え、該ペリクル支持手段が前記微粘着性物質を介して前記ペリクルフレームのペリクル膜接着層側に脱着可能に設けられていることを特徴とするペリクル支持装置。
- 請求項1から3の何れかに記載のペリクル支持手段に支持された前記ペリクルを被装着面に貼り付けた後に、前記ペリクルフレームに設けられた前記ペリクル支持手段を取り外すことを特徴とするペリクルの装着方法。
- 前記ペリクル支持手段は、前記ペリクルをペリクル収納容器から取り出してフォトマスクに貼り付ける工程まで用いられることを特徴とする請求項5に記載のペリクルの装着方法。
Priority Applications (4)
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JP2015100677A JP6376601B2 (ja) | 2015-05-18 | 2015-05-18 | ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法 |
TW105114794A TWI624859B (zh) | 2015-05-18 | 2016-05-13 | 防塵薄膜組件以及其安裝方法 |
CN201610323191.4A CN106168735B (zh) | 2015-05-18 | 2016-05-16 | 防尘薄膜组件以及其安装方法 |
KR1020160060003A KR102666696B1 (ko) | 2015-05-18 | 2016-05-17 | 펠리클 및 그 장착 방법 |
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JP2015100677A JP6376601B2 (ja) | 2015-05-18 | 2015-05-18 | ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法 |
Publications (2)
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JP2016218162A JP2016218162A (ja) | 2016-12-22 |
JP6376601B2 true JP6376601B2 (ja) | 2018-08-22 |
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Country Status (4)
Country | Link |
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JP (1) | JP6376601B2 (ja) |
KR (1) | KR102666696B1 (ja) |
CN (1) | CN106168735B (ja) |
TW (1) | TWI624859B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6706575B2 (ja) * | 2016-12-22 | 2020-06-10 | 信越化学工業株式会社 | ペリクルフレーム及びこれを用いたペリクル |
JP2018180252A (ja) * | 2017-04-12 | 2018-11-15 | 日本特殊陶業株式会社 | ペリクル枠及びその製造方法 |
JP6921412B2 (ja) * | 2018-01-25 | 2021-08-18 | 株式会社ブイ・テクノロジー | ペリクルフレーム把持装置及びペリクルフレーム把持方法 |
JP7061288B2 (ja) * | 2018-08-28 | 2022-04-28 | 日本軽金属株式会社 | フラットパネルディスプレイ用ペリクル枠体及びその製造方法 |
JP7040427B2 (ja) * | 2018-12-03 | 2022-03-23 | 信越化学工業株式会社 | ペリクル、ペリクル付露光原版、露光方法及び半導体の製造方法 |
US20220390829A1 (en) * | 2019-12-13 | 2022-12-08 | Mitsui Chemicals, Inc. | Pellicle demounting method, and pellicle demounting device |
KR20230035093A (ko) * | 2020-08-20 | 2023-03-10 | 아사히 가세이 가부시키가이샤 | 얼라인먼트 유닛용의 방진 구조체 |
JP7063962B2 (ja) * | 2020-09-23 | 2022-05-09 | 信越化学工業株式会社 | ペリクルフレーム及びペリクル |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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US6736386B1 (en) * | 2001-04-10 | 2004-05-18 | Dupont Photomasks, Inc. | Covered photomask holder and method of using the same |
US7316869B2 (en) * | 2003-08-26 | 2008-01-08 | Intel Corporation | Mounting a pellicle to a frame |
JP4478557B2 (ja) * | 2004-12-08 | 2010-06-09 | 大日本印刷株式会社 | 大型ペリクル、ペリクル搬送方法、ペリクルケース及びペリクル移載装置 |
JP4478558B2 (ja) * | 2004-12-08 | 2010-06-09 | 大日本印刷株式会社 | 大型ペリクルの搬送方法、搬送用治具及びペリクルケース |
JP4677632B2 (ja) * | 2005-07-08 | 2011-04-27 | レーザーテック株式会社 | ペリクルライナー又はペリクルの剥離装置、剥離方法及びパターン基板の製造方法 |
KR101264571B1 (ko) * | 2007-07-06 | 2013-05-14 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 대형 펠리클 프레임체 및 그 프레임체의 파지 방법 |
JP4879308B2 (ja) * | 2009-10-29 | 2012-02-22 | 信越化学工業株式会社 | ペリクル剥離用冶具および剥離方法 |
JP5202557B2 (ja) * | 2010-03-05 | 2013-06-05 | 信越化学工業株式会社 | ペリクルハンドリング治具 |
JP5528190B2 (ja) * | 2010-04-23 | 2014-06-25 | 信越化学工業株式会社 | ペリクル収納容器 |
JP2012103638A (ja) * | 2010-11-15 | 2012-05-31 | Shin Etsu Chem Co Ltd | ペリクルハンドリング治具 |
JP5854511B2 (ja) * | 2012-10-16 | 2016-02-09 | 信越化学工業株式会社 | ペリクルおよびペリクルの貼付け方法 |
JP5984187B2 (ja) | 2013-04-22 | 2016-09-06 | 信越化学工業株式会社 | ペリクルとフォトマスクのアセンブリ |
JP6004582B2 (ja) * | 2013-04-30 | 2016-10-12 | 信越化学工業株式会社 | ペリクル |
JP6261004B2 (ja) | 2014-01-20 | 2018-01-17 | 信越化学工業株式会社 | Euv用ペリクルとこれを用いたeuv用アセンブリーおよびその組立方法 |
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2015
- 2015-05-18 JP JP2015100677A patent/JP6376601B2/ja active Active
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2016
- 2016-05-13 TW TW105114794A patent/TWI624859B/zh active
- 2016-05-16 CN CN201610323191.4A patent/CN106168735B/zh active Active
- 2016-05-17 KR KR1020160060003A patent/KR102666696B1/ko active Active
Also Published As
Publication number | Publication date |
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KR20160135665A (ko) | 2016-11-28 |
CN106168735A (zh) | 2016-11-30 |
TWI624859B (zh) | 2018-05-21 |
TW201705210A (zh) | 2017-02-01 |
JP2016218162A (ja) | 2016-12-22 |
KR102666696B1 (ko) | 2024-05-20 |
CN106168735B (zh) | 2020-01-03 |
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