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CN106168735B - 防尘薄膜组件以及其安装方法 - Google Patents

防尘薄膜组件以及其安装方法 Download PDF

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Publication number
CN106168735B
CN106168735B CN201610323191.4A CN201610323191A CN106168735B CN 106168735 B CN106168735 B CN 106168735B CN 201610323191 A CN201610323191 A CN 201610323191A CN 106168735 B CN106168735 B CN 106168735B
Authority
CN
China
Prior art keywords
pellicle
thin film
frame
dustproof
photomask
Prior art date
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Application number
CN201610323191.4A
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English (en)
Chinese (zh)
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CN106168735A (zh
Inventor
关原一敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Publication date
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Publication of CN106168735A publication Critical patent/CN106168735A/zh
Application granted granted Critical
Publication of CN106168735B publication Critical patent/CN106168735B/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
CN201610323191.4A 2015-05-18 2016-05-16 防尘薄膜组件以及其安装方法 Active CN106168735B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-100677 2015-05-18
JP2015100677A JP6376601B2 (ja) 2015-05-18 2015-05-18 ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法

Publications (2)

Publication Number Publication Date
CN106168735A CN106168735A (zh) 2016-11-30
CN106168735B true CN106168735B (zh) 2020-01-03

Family

ID=57358982

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610323191.4A Active CN106168735B (zh) 2015-05-18 2016-05-16 防尘薄膜组件以及其安装方法

Country Status (4)

Country Link
JP (1) JP6376601B2 (ja)
KR (1) KR102666696B1 (ja)
CN (1) CN106168735B (ja)
TW (1) TWI624859B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6706575B2 (ja) * 2016-12-22 2020-06-10 信越化学工業株式会社 ペリクルフレーム及びこれを用いたペリクル
JP2018180252A (ja) * 2017-04-12 2018-11-15 日本特殊陶業株式会社 ペリクル枠及びその製造方法
JP6921412B2 (ja) * 2018-01-25 2021-08-18 株式会社ブイ・テクノロジー ペリクルフレーム把持装置及びペリクルフレーム把持方法
JP7061288B2 (ja) * 2018-08-28 2022-04-28 日本軽金属株式会社 フラットパネルディスプレイ用ペリクル枠体及びその製造方法
JP7040427B2 (ja) * 2018-12-03 2022-03-23 信越化学工業株式会社 ペリクル、ペリクル付露光原版、露光方法及び半導体の製造方法
JP7204009B2 (ja) * 2019-12-13 2023-01-13 三井化学株式会社 ペリクルのデマウント方法、及び、ペリクルのデマウント装置
WO2022039166A1 (ja) * 2020-08-20 2022-02-24 旭化成株式会社 アライメントユニット用の防塵構造体
JP7063962B2 (ja) * 2020-09-23 2022-05-09 信越化学工業株式会社 ペリクルフレーム及びペリクル

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6736386B1 (en) * 2001-04-10 2004-05-18 Dupont Photomasks, Inc. Covered photomask holder and method of using the same
US7316869B2 (en) * 2003-08-26 2008-01-08 Intel Corporation Mounting a pellicle to a frame
JP4478557B2 (ja) * 2004-12-08 2010-06-09 大日本印刷株式会社 大型ペリクル、ペリクル搬送方法、ペリクルケース及びペリクル移載装置
JP4478558B2 (ja) * 2004-12-08 2010-06-09 大日本印刷株式会社 大型ペリクルの搬送方法、搬送用治具及びペリクルケース
JP4677632B2 (ja) * 2005-07-08 2011-04-27 レーザーテック株式会社 ペリクルライナー又はペリクルの剥離装置、剥離方法及びパターン基板の製造方法
WO2009008294A1 (ja) * 2007-07-06 2009-01-15 Asahi Kasei E-Materials Corporation 大型ペリクルの枠体及び該枠体の把持方法
JP4879308B2 (ja) * 2009-10-29 2012-02-22 信越化学工業株式会社 ペリクル剥離用冶具および剥離方法
JP5202557B2 (ja) * 2010-03-05 2013-06-05 信越化学工業株式会社 ペリクルハンドリング治具
JP5528190B2 (ja) * 2010-04-23 2014-06-25 信越化学工業株式会社 ペリクル収納容器
JP2012103638A (ja) * 2010-11-15 2012-05-31 Shin Etsu Chem Co Ltd ペリクルハンドリング治具
JP5854511B2 (ja) * 2012-10-16 2016-02-09 信越化学工業株式会社 ペリクルおよびペリクルの貼付け方法
JP5984187B2 (ja) 2013-04-22 2016-09-06 信越化学工業株式会社 ペリクルとフォトマスクのアセンブリ
JP6004582B2 (ja) * 2013-04-30 2016-10-12 信越化学工業株式会社 ペリクル
JP6261004B2 (ja) * 2014-01-20 2018-01-17 信越化学工業株式会社 Ｅｕｖ用ペリクルとこれを用いたｅｕｖ用アセンブリーおよびその組立方法

Also Published As

Publication number Publication date
CN106168735A (zh) 2016-11-30
TWI624859B (zh) 2018-05-21
TW201705210A (zh) 2017-02-01
KR20160135665A (ko) 2016-11-28
KR102666696B1 (ko) 2024-05-20
JP2016218162A (ja) 2016-12-22
JP6376601B2 (ja) 2018-08-22

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