KR102666696B1 - 펠리클 및 그 장착 방법 - Google Patents
펠리클 및 그 장착 방법 Download PDFInfo
- Publication number
- KR102666696B1 KR102666696B1 KR1020160060003A KR20160060003A KR102666696B1 KR 102666696 B1 KR102666696 B1 KR 102666696B1 KR 1020160060003 A KR1020160060003 A KR 1020160060003A KR 20160060003 A KR20160060003 A KR 20160060003A KR 102666696 B1 KR102666696 B1 KR 102666696B1
- Authority
- KR
- South Korea
- Prior art keywords
- pellicle
- frame
- support means
- film
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 abstract description 40
- 238000003860 storage Methods 0.000 abstract description 29
- 230000007547 defect Effects 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 description 14
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 230000037303 wrinkles Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000428 dust Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000013464 silicone adhesive Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 2
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
- 239000010962 carbon steel Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 208000010201 Exanthema Diseases 0.000 description 1
- 102100040287 GTP cyclohydrolase 1 feedback regulatory protein Human genes 0.000 description 1
- 101710185324 GTP cyclohydrolase 1 feedback regulatory protein Proteins 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- -1 LSI and ultra-LSI Substances 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 201000005884 exanthem Diseases 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910001234 light alloy Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 206010037844 rash Diseases 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015100677A JP6376601B2 (ja) | 2015-05-18 | 2015-05-18 | ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法 |
| JPJP-P-2015-100677 | 2015-05-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160135665A KR20160135665A (ko) | 2016-11-28 |
| KR102666696B1 true KR102666696B1 (ko) | 2024-05-20 |
Family
ID=57358982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020160060003A Active KR102666696B1 (ko) | 2015-05-18 | 2016-05-17 | 펠리클 및 그 장착 방법 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6376601B2 (ja) |
| KR (1) | KR102666696B1 (ja) |
| CN (1) | CN106168735B (ja) |
| TW (1) | TWI624859B (ja) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6706575B2 (ja) * | 2016-12-22 | 2020-06-10 | 信越化学工業株式会社 | ペリクルフレーム及びこれを用いたペリクル |
| JP2018180252A (ja) * | 2017-04-12 | 2018-11-15 | 日本特殊陶業株式会社 | ペリクル枠及びその製造方法 |
| JP6921412B2 (ja) * | 2018-01-25 | 2021-08-18 | 株式会社ブイ・テクノロジー | ペリクルフレーム把持装置及びペリクルフレーム把持方法 |
| JP7061288B2 (ja) * | 2018-08-28 | 2022-04-28 | 日本軽金属株式会社 | フラットパネルディスプレイ用ペリクル枠体及びその製造方法 |
| JP7040427B2 (ja) * | 2018-12-03 | 2022-03-23 | 信越化学工業株式会社 | ペリクル、ペリクル付露光原版、露光方法及び半導体の製造方法 |
| JP7204009B2 (ja) * | 2019-12-13 | 2023-01-13 | 三井化学株式会社 | ペリクルのデマウント方法、及び、ペリクルのデマウント装置 |
| CN115956224A (zh) * | 2020-08-20 | 2023-04-11 | 旭化成株式会社 | 对准单元用的防尘构造体 |
| JP7063962B2 (ja) * | 2020-09-23 | 2022-05-09 | 信越化学工業株式会社 | ペリクルフレーム及びペリクル |
| JP7700323B1 (ja) | 2024-01-17 | 2025-06-30 | エスアンドエス テック カンパニー リミテッド | フォトマスクにペリクルを装着するためのフレーム組立体 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010102357A (ja) * | 2007-07-06 | 2010-05-06 | Asahi Kasei E-Materials Corp | 大型ペリクルの枠体及び該枠体の把持方法 |
| JP2011095453A (ja) * | 2009-10-29 | 2011-05-12 | Shin-Etsu Chemical Co Ltd | ペリクル剥離用冶具および剥離方法 |
| JP2015156014A (ja) | 2014-01-20 | 2015-08-27 | 信越化学工業株式会社 | Ｅｕｖ用ペリクルとこれを用いたｅｕｖ用アセンブリーおよびその組立方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6736386B1 (en) * | 2001-04-10 | 2004-05-18 | Dupont Photomasks, Inc. | Covered photomask holder and method of using the same |
| US7316869B2 (en) * | 2003-08-26 | 2008-01-08 | Intel Corporation | Mounting a pellicle to a frame |
| JP4478558B2 (ja) * | 2004-12-08 | 2010-06-09 | 大日本印刷株式会社 | 大型ペリクルの搬送方法、搬送用治具及びペリクルケース |
| JP4478557B2 (ja) * | 2004-12-08 | 2010-06-09 | 大日本印刷株式会社 | 大型ペリクル、ペリクル搬送方法、ペリクルケース及びペリクル移載装置 |
| JP4677632B2 (ja) * | 2005-07-08 | 2011-04-27 | レーザーテック株式会社 | ペリクルライナー又はペリクルの剥離装置、剥離方法及びパターン基板の製造方法 |
| JP5202557B2 (ja) * | 2010-03-05 | 2013-06-05 | 信越化学工業株式会社 | ペリクルハンドリング治具 |
| JP5528190B2 (ja) * | 2010-04-23 | 2014-06-25 | 信越化学工業株式会社 | ペリクル収納容器 |
| JP2012103638A (ja) * | 2010-11-15 | 2012-05-31 | Shin Etsu Chem Co Ltd | ペリクルハンドリング治具 |
| JP5854511B2 (ja) * | 2012-10-16 | 2016-02-09 | 信越化学工業株式会社 | ペリクルおよびペリクルの貼付け方法 |
| JP5984187B2 (ja) | 2013-04-22 | 2016-09-06 | 信越化学工業株式会社 | ペリクルとフォトマスクのアセンブリ |
| JP6004582B2 (ja) * | 2013-04-30 | 2016-10-12 | 信越化学工業株式会社 | ペリクル |
-
2015
- 2015-05-18 JP JP2015100677A patent/JP6376601B2/ja active Active
-
2016
- 2016-05-13 TW TW105114794A patent/TWI624859B/zh active
- 2016-05-16 CN CN201610323191.4A patent/CN106168735B/zh active Active
- 2016-05-17 KR KR1020160060003A patent/KR102666696B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010102357A (ja) * | 2007-07-06 | 2010-05-06 | Asahi Kasei E-Materials Corp | 大型ペリクルの枠体及び該枠体の把持方法 |
| JP2011095453A (ja) * | 2009-10-29 | 2011-05-12 | Shin-Etsu Chemical Co Ltd | ペリクル剥離用冶具および剥離方法 |
| JP2015156014A (ja) | 2014-01-20 | 2015-08-27 | 信越化学工業株式会社 | Ｅｕｖ用ペリクルとこれを用いたｅｕｖ用アセンブリーおよびその組立方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106168735B (zh) | 2020-01-03 |
| KR20160135665A (ko) | 2016-11-28 |
| TWI624859B (zh) | 2018-05-21 |
| JP6376601B2 (ja) | 2018-08-22 |
| CN106168735A (zh) | 2016-11-30 |
| TW201705210A (zh) | 2017-02-01 |
| JP2016218162A (ja) | 2016-12-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20160517 |
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| AMND | Amendment | ||
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Patent event date: 20240214 Comment text: Decision to Grant Registration Patent event code: PX07013S01D Patent event date: 20240126 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20230926 Comment text: Decision to Refuse Application Patent event code: PX07011S01I Patent event date: 20210303 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I |
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| X701 | Decision to grant (after re-examination) | ||
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20240513 Patent event code: PR07011E01D |
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| PR1002 | Payment of registration fee |
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| PG1601 | Publication of registration |