TW202018314A - Inspection instruction information generation device, substrate inspection system, inspection instruction information generation method, and inspection instruction information generation program - Google Patents

Abstract

The present invention is based on the conductive structure information D1 showing how the planar conductor IP, the conductive portion P, the wiring W, and the via V of the substrate are conductively connected. The substrate includes a conductor layer Lc and a substrate surface provided with a plurality of conductive portions P F, the wiring layer L, and the through-hole V, when there are a plurality of groups of conductive portions P mutually conducting via the wiring W of the wiring layer L, the following inspection instruction information generation process is performed: from each group Each pair of conductive portions P is selected as the first selected conductive portion, and information indicating the selected pairs of first selected conductive portions is generated as inspection instruction information D2.

Description

Inspection instruction information generation device, substrate inspection system, inspection instruction information generation method, and inspection instruction information generation program

The present invention relates to an inspection instruction information generating device for generating inspection instruction information for instructing an inspection site when inspecting a substrate, a substrate inspection system for inspecting using the inspection instruction information, an inspection instruction information generation method, and an inspection instruction information generation program .

Conventionally, there has been known a substrate inspection device in which a measurement object is to be penetrated from a surface of one side of a circuit substrate to a surface of another side like a via provided in a circuit substrate In this case, a measurement current is flowed into the measurement object, and the voltage generated in the measurement object is measured, thereby measuring the resistance value of the measurement object based on the current value and the voltage value (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-117991

[Problems to be solved by the invention]

In addition, in a substrate including a conductor that expands into a plane (hereinafter, referred to as a plane conductor), conductive parts such as pads, bumps, and wiring on the surface of the substrate and the plane conductor are electrically charged in the thickness direction of the substrate The structure of the substrate is connected.

FIG. 22 is a conceptual schematic diagram showing a multilayer substrate WB as an example of a substrate including a planar conductor IP as a conductor pattern expanded into a planar inner layer. The multilayer substrate WB shown in FIG. 22 is provided with conductive portions PA and conductive portions PB such as pads or wiring patterns on its substrate surface BS. The conductive portion PA and the conductive portion PB are electrically connected to the planar conductor IP through the through hole RA and the through hole RB. In the example of the multilayer substrate WB, the planar conductor IP corresponds to the planar conductor.

In addition, as a method of manufacturing a substrate, there is a method of forming a printed wiring board on both area layers of the metal plate using a conductive metal plate as a base, and peeling the formed substrate from the base metal plate to form Two printed circuit boards. In this method of manufacturing a substrate, the substrate (hereinafter referred to as an intermediate substrate) in a state before the substrate is peeled off from the underlying metal plate has a form in which the metal plate is sandwiched between two substrates. Such an intermediate substrate is also called a carrier substrate.

FIG. 23 is a conceptual schematic diagram showing an example of such an intermediate substrate MB. The intermediate substrate MB shown in FIG. 23 is provided with the substrate WB1 on one side of the metal plate MP, and the substrate WB2 is provided on the other side of the metal plate MP. On the substrate surface BS1 of the substrate WB1, conductive portions PA1, conductive portions PB1, ..., and conductive portions PF1 such as pads or wiring patterns are provided. On the contact surface BS2 of the substrate WB1 with the metal plate MP, a conductive portion PA2 such as a pad or a wiring pattern, a conductive portion PB2,..., A conductive portion PF2 are provided. The metal plate MP is, for example, a conductive metal plate having a thickness of about 1 mm to 10 mm.

The conductive portions PA1 to PF1 are electrically connected to the conductive portions PA2 to PF2 through the through holes RA to RF. Since the conductive parts PA2 to PF2 are in close contact with the metal plate MP, the conductive parts PA1 to PF1 are electrically connected to the metal plate MP through the through holes RA to RF. The conductive portion PA1 is paired with the through hole RA, the conductive portion PB1 is paired with the through hole RB, and the conductive portion is paired with the through hole, respectively. The substrate WB2 is configured in the same manner as the substrate WB1, so its description is omitted. In the example of the intermediate substrate MB, the metal plate MP corresponds to a planar conductor.

As an inspection of the multilayer substrate WB, the intermediate substrate MB, and the like, the resistance values Ra and Rb of the through holes RA and RB may be measured.

In FIG. 24, R1 to R4 represent the resistance of the equivalent resistance of the planar conductor IP. In order to measure the resistance value Ra and the resistance value Rb of the through hole RA and the through hole RB, it may be considered to cause the measurement current I to flow between the conductive portion PA1 and the conductive portion PB1, and to measure the generation between the conductive portion PA1 and the conductive portion PB1 The voltage V is calculated using the resistance value as V/I. Thereby, through V/I, the resistance values Ra, Rb and resistance of the planar conductor IP of the through-hole RA and the through-hole RB at two locations on the current path from the conductive portion PA1 to the conductive portion PB1 can be obtained The sum of the resistance value R ₁ of R1.

Here, in FIG. 24, the conductive portions PA1 to PE1 are arranged on a straight line due to the relationship of the paper surface. However, in an actual substrate, the conductive portion PA1 to the conductive portion PE1 are two-dimensionally distributed on the substrate surface. Therefore, if a pair of conductive portions PA1 and PC1 are selected to flow into the current I ₁ and another pair of conductive portions PB1 and PD1 are selected to flow into the current I ₂ for resistance measurement, they exist in the current path of the current I ₁ and the current I ₂ . Repeated situation.

In the example shown in FIG. 24, a repetition of current occurs in the resistor R2. In this case, the voltage V between the conductive portion PA1 and the conductive portion PC1 = I ₁ (Ra + R ₁ + R ₂ + Rc) + I ₂ R ₂ . If I ₁ = I ₂ , V/I ₁ = (Ra + R ₁ + R ₂ + Rc) + R ₂ , so the resistance value (Ra + R ₁ + R ₂ + Rc) to be measured is added to the resistance value R ₂ As a result, the accuracy of resistance measurement decreases.

Therefore, in order not to repeat the measurement current, it is necessary to sequentially perform inspections one by one between the pair of conductive portions, and there is a problem that the inspection time of the entire substrate increases.

An object of the present invention is to provide an inspection instruction information generating device that generates inspection instruction information indicating an inspection site that is easy to shorten the inspection time of a substrate, a substrate inspection system including the inspection instruction information generating device, an inspection instruction information generation method, and inspection instruction information Generate programs.

An inspection instruction information generating device according to an example of the present invention includes a storage section that stores conductive structure information indicating how a planar conductor, a conductive section, a wiring, and a via of a substrate are electrically connected. The substrate includes: The conductive layer of the layer of the conductive planar conductor, the substrate surface provided with the plurality of conductive portions, the wiring layer as a layer laminated between the conductor layer and the substrate surface, A through hole connecting the wiring of the wiring layer to the plurality of conductive portions, and a through hole connecting the wiring of the wiring layer to the planar conductor of the conductor layer; and the inspection instruction information generating portion, when there are a plurality of When the groups of the conductive parts that are connected to each other through the wiring of the wiring layer, based on the conductive structure information, perform the following inspection instruction information generation process: select a pair of the conductive parts from each group The part serves as a first selection conductive part, and records information indicating the selected pairs of first selection conductive parts as inspection instruction information.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate based on the inspection instruction information. The inspection processing unit performs the following steps: (c1) A plurality of pairs of first selection conductive portions indicated by the inspection instruction information, simultaneously performing a first current supply process that causes current to flow between the pair of first selection conductive portions, and detecting the pair of first selection conductive portions Voltage, based on the current and the voltage, inspect the through holes and wiring of the current path between the first selected conductive portions of each pair.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate based on the inspection instruction information. The inspection processing unit performs the following steps: (c1) A plurality of pairs of first selection conductive portions indicated by the inspection instruction information, simultaneously performing a first current supply process that causes current to flow between the pair of first selection conductive portions, and detecting the pair of first selection conductive portions Voltage, based on the current and the voltage, checking the through-holes and wiring of the current path between the first selection conductive portions of each pair; and (c2) performing the execution differently from the first current supply process Current flows into the second current supply process between the pair of second selection conductive parts indicated by the inspection instruction information, and detects the voltage between the pair of second selection conductive parts, based on the current and the voltage To inspect the through holes and wiring of the current path between the paired second selection conductive portions.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, and the inspection processing unit according to the inspection instruction information In sequence, the following steps are performed for each wiring layer: (c1) For a plurality of pairs of first selection conductive portions indicated by the inspection instruction information, a first flow of current between the paired first selection conductive portions is performed at the same time Current supply processing, and detecting the voltage between the pair of first selection conductive parts, and checking the through holes and wiring of the current path between the pair of first selection conductive parts based on the current and the voltage, When the result of the inspection of the (c1) step is defective, the (c1) step for the wiring layer whose sequence is next to the following is not executed.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate based on the inspection instruction information. The inspection processing unit performs the following steps: (c1) A plurality of pairs of first selection conductive portions indicated by the inspection instruction information, simultaneously performing a first current supply process that causes current to flow between the pair of first selection conductive portions, and detecting the pair of first selection conductive portions Voltage, based on the current and the voltage, check the through holes and wiring of the current path between the first selected conductive portions of each pair, and in the step (c1), simultaneously execute The instruction information is checked to determine the first current supply process of the plurality of pairs of first selection conductive portions corresponding to one side of the conductor layer, and to the corresponding position of the other side of the conductor layer The first current supply process of the plurality of pairs of first selection conductive parts.

In addition, the inspection instruction information generation method of an example of the present invention includes an inspection instruction information generation process based on conductive structure information indicating how the planar conductors, conductive portions, wirings, and vias of the substrate are electrically connected, The substrate includes a conductor layer as a layer provided with the planar conductor expanded into a planar conductivity, a substrate surface provided with a plurality of the conductive portions, and a layer laminated on the conductor layer and the substrate The wiring layer of the layer between the surfaces, the through-hole connecting the wiring of the wiring layer to the plurality of conductive portions, and the through-hole connecting the wiring of the wiring layer to the planar conductor of the conductor layer Hole, when there are a plurality of groups of the conductive parts that are connected to each other via the wiring of the wiring layer, the following inspection instruction information generation process is performed: a pair of the conductive parts is selected from each group As the first selection conductive part, information representing the selected pairs of first selection conductive parts is generated as the inspection instruction information.

Hereinafter, embodiments of the present invention will be described based on the drawings. In addition, the configuration given the same symbol in each figure shows the same configuration, and the description thereof is omitted. The substrate inspection system 1 shown in FIG. 1 includes an inspection instruction information generating device 3 and a substrate inspection device 2.

The inspection instruction information generating device 3 shown in FIG. 1 includes an inspection instruction information generating section 31 and a storage section 32. The inspection instruction information generating device 3 is constituted by using a computer such as a personal computer, for example, including: a central processing unit (CPU) that performs prescribed arithmetic processing, and a random access memory (RAM) that temporarily stores data ), non-volatile storage devices such as Hard Disk Drive (HDD) and/or flash memory, communication circuits, and peripheral circuits of these.

Furthermore, the inspection instruction information generating device 3 functions as the inspection instruction information generating section 31 by executing, for example, an inspection instruction information generating program of an embodiment of the present invention that has been stored in a non-volatile storage device. The storage unit 32 is configured using, for example, the non-volatile storage device.

The storage structure 32 stores the conductive structure information D1. The conductive structure information D1 can be sent to the inspection instruction information generating device 3 from the outside through, for example, a communication circuit that is not shown, thereby storing the transmitted conductive structure information D1 in the storage section 32, or can be generated by the inspection instruction information The device 3 reads the conductive structure information D1 that has been stored in a storage medium such as a Universal Serial Bus (USB) memory, etc., and stores the conductive structure information D1 in the storage portion 32, and various methods can be used to conduct The structure information D1 is stored in the storage unit 32.

The conductive structure information D1 is information indicating how the planar conductor IP of the substrate B, the conductive portion P, the wiring W of each wiring layer L, and the via hole V described later are electrically connected. As the conductive structure information D1, for example, so-called gerber data (net data) and/or a netlist (netlist) used in the manufacture of a substrate can be used.

The inspection instruction information generating section 31 generates inspection instruction information D2 for the substrate inspection apparatus 2 based on the conductive structure information D1, and the inspection instruction information D2 is used to indicate the pair of the conductive portion P that should flow current for inspection. The inspection instruction information generating unit 31 may also transmit the inspection instruction information D2 to the substrate inspection apparatus 2 via, for example, a communication circuit not shown. Alternatively, the inspection instruction information generating unit 31 may write the inspection instruction information D2 into the storage medium. Moreover, the user can also cause the substrate inspection device 2 to read the inspection instruction information D2 from the storage medium. The details of the operation of the inspection instruction information generating unit 31 will be described later.

The substrate inspection apparatus 2 shown in FIG. 1 is an apparatus for inspecting the substrate B of the inspection target substrate.

The substrate B is, for example, an intermediate substrate or a multilayer substrate, and may also be a printed wiring substrate, a film carrier, a flexible substrate, a ceramic multilayer wiring substrate, a semiconductor substrate such as a semiconductor wafer and a semiconductor wafer, and a package for semiconductor packaging Substrates, electrode plates for liquid crystal displays or plasma displays, and intermediate substrates in the process of manufacturing these substrates, or so-called carrier substrates. The multilayer substrate WB shown in FIG. 22 and the intermediate substrate MB shown in FIG. 23 correspond to an example of the substrate B as the substrate to be inspected.

The substrate inspection apparatus 2 shown in FIG. 1 has a frame 112. In the internal space of the frame body 112, a substrate fixing device 110, a measurement unit 121, a measurement unit 122, a moving mechanism 125, and a control unit 20 are mainly provided. The substrate fixing device 110 is configured to fix the substrate B at a predetermined position.

The measurement unit 121 is located above the substrate B fixed to the substrate fixing device 110. The measurement unit 122 is located below the substrate B fixed to the substrate fixing device 110. The measurement unit 121 and the measurement unit 122 include a measurement jig 4U and a measurement jig 4L for contacting a probe with a plurality of conductive parts provided on the substrate B.

A plurality of probes Pr are attached to the measuring jig 4U and the measuring jig 4L. The measuring jig 4U and the measuring jig 4L are arranged and held so as to correspond to the arrangement of the conductive portion of the measurement object provided on the surface of the substrate B. The moving mechanism 125 appropriately moves the measuring unit 121 and the measuring unit 122 within the housing 112 in response to the control signal from the control unit 20, and causes the probe Pr of the measuring jig 4U and the measuring jig 4L to contact the respective conductors of the substrate B unit.

In addition, the substrate inspection apparatus 2 may include only one of the measurement unit 121 and the measurement unit 122, and the substrate B may be provided with a conductive portion on only one surface. In addition, the substrate inspection apparatus 2 may reverse the front and back of the substrate to be inspected, and the measurement on both sides thereof may be performed by any one measurement section.

The control unit 20 includes, for example, the following components: a CPU (Central Processing Unit) that performs predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, and a read-only memory (Read Only Memory, which stores a predetermined control program) ROM), HDD (Hard Disk Drive) and other non-volatile storage units 22, and these peripheral circuits. Furthermore, the control unit 20 functions as the inspection processing unit 21 by executing, for example, a control program that has been stored in the storage unit 22.

The measurement unit 121 shown in FIG. 2 includes a scanner unit 13, a plurality of measurement blocks 12, and a plurality of probes Pr. In addition, the measurement unit 122 has the same configuration as the measurement unit 121, and therefore its description is omitted.

The measurement block 12 includes a power supply section CS, a power supply section CM, and a voltage detection section VM. The power supply unit CS and the power supply unit CM are constant current circuits that output a current I corresponding to the control signal from the control unit 20. The power supply unit CS causes the current I to flow in the direction supplied to the scanner unit 13, and the power supply unit CM causes the current I to flow in the direction introduced from the scanner unit 13. The voltage detection unit VM is a voltage detection circuit that measures the voltage and transmits the voltage value to the control unit 20.

The scanner unit 13 is, for example, a switching circuit configured using switching elements such as transistors or relay switches. The scanner unit 13 corresponds to a plurality of measurement blocks 12 and includes a plurality of current terminals +F and current terminals -F for supplying the current I for resistance measurement to the substrate B, and for detecting that the current I is applied to the substrate B The voltage detection terminal +S and the voltage detection terminal -S of the voltage generated between the conductive parts of. In addition, a plurality of probes Pr are electrically connected to the scanner unit 13. The scanner unit 13 switches the connection relationship between the current terminal +F, the current terminal -F, the voltage detection terminal +S, and the voltage detection terminal -S and the plurality of probes Pr in response to the control signal from the control unit 20.

One end of the output terminal of the power supply CS is connected to circuit ground, and the other end is connected to the current terminal +F. One end of the output terminal of the power supply unit CM is connected to the circuit ground, and the other end is connected to the current terminal -F. One end of the voltage detection part VM is connected to the voltage detection terminal +S, and the other end is connected to the voltage detection terminal -S.

In addition, the scanner unit 13 can electrically connect the current terminal +F, the current terminal -F, the voltage detection terminal +S, and the voltage detection terminal -S to any probe Pr in response to the control signal from the control unit 20. In this way, the scanner unit 13 can make the current I flow between any conductive parts contacted by the probe Pr in response to the control signal from the control unit 20, and use the voltage detection unit VM to measure the generated between the conductive parts Voltage V.

Since a plurality of measurement blocks 12 are provided, current supply and voltage measurement can be simultaneously performed between a plurality of conductive parts.

In addition, the power supply unit CS and the power supply unit CM only need to allow the current I to flow into the substrate B via the scanner unit 13, and it is not limited to an example in which one end of the power supply unit CS and the power supply unit CM is connected to circuit ground. For example, the current loop may be formed by connecting one end of the power supply CS and one end of the power supply CM.

In this way, the control unit 20 can output the control signal to the scanner unit 13 and use the plurality of power supply units CS and CM to make the current I flow between arbitrary pairs of probes Pr and use the plurality of voltage detection units VM to detect the voltage between any pair of probes Pr.

FIG. 3 also serves as an explanatory diagram illustrating the conductive structure information D1 of the substrate B. The conductive structure information D1 is not necessarily data represented by an image, but in the following description, for ease of understanding, the structure represented by the conductive structure information D1 is represented and explained using a diagram.

The substrate B shown in FIG. 3 is a multilayer substrate formed by stacking five substrates B1 to B5. Let one surface of the substrate B be the substrate surface F1 and the other surface be the substrate surface F2. The boundary between the substrate B1 and the substrate B2 is the wiring layer L1, the boundary between the substrate B2 and the substrate B3 is the wiring layer L2, the boundary between the substrate B3 and the substrate B4 is the conductor layer Lc, and the boundary between the substrate B4 and the substrate 5 Let the wiring layer L4.

Conductive portions P1 to P7 are provided on the substrate surface F1, and conductive portions P11 to P17 are provided on the substrate surface F2. The conductive portion P1 to the conductive portion P7 and the conductive portion P11 to the conductive portion P17 serve as inspection points where pads, bumps, wiring, electrodes, and the like are contacted by the probe Pr.

The conductor layer Lc is provided with a planar conductor IP that is a conductor expanded into a planar or mesh shape. The wiring layer L1 is provided with wiring W11 and wiring W12, the wiring layer L2 is provided with wiring W21 and wiring W22, and the wiring layer L4 is provided with wiring W41, wiring W42, wiring W43 and wiring W44, and wiring W45. The planar conductor IP can be expanded into a sheet shape, that is, a planar shape, or a conductor having the following shape: combining conductor patterns such as wiring into a regular or irregular mesh shape (mesh shape), in The same layer as a whole expands into a plane.

In addition, FIG. 3 shows an example in which the planar conductor IP extends to substantially the entire area of the substrate B, but the planar conductor IP is not necessarily limited to an example extending to substantially the entire area of the substrate B. The planar conductor IP may be provided only in a part of the substrate B. For example, the wiring W may be provided in a region of the substrate B of the conductor layer Lc where the planar conductor IP is not provided.

The substrate B shown in FIG. 4 includes a planar conductor IPa and a planar conductor IPd that are electrically separated from each other. The planar conductor IPa can be used as an analog ground, for example, and the planar conductor IPd can be used as a digital ground, for example. As shown in FIG. 4, the substrate B may also include a plurality of planar conductors IP insulated from each other.

The wiring W41, the wiring W42, and the wiring W43 are one wiring in which the wiring W41, the wiring W42, and the wiring W43 of the wiring layer L4 are connected, but for convenience of description, each part of the one wiring W41, W42, W43 is called wiring W41, wiring W42, and wiring W43. Similarly, the wiring W44 and the wiring W45 are one wiring formed by connecting the wiring W44 and the wiring W45, and the wiring W44 and the wiring W45 are a part of the one wiring W44 and W45, respectively.

In addition, the substrate B is provided with a through hole V11 to a through hole V17 penetrating the substrate B1, a through hole V21 to a through hole V27 penetrating the substrate B2, a through hole V31 to a through hole V36 penetrating the substrate B3, and a through hole The through-holes V41 to V45 of the substrate B4 are provided with the through-holes V51 to V57 penetrating the substrate B5.

The conductive structure information stored in the storage section 22 includes information indicating the conductive sections P1 to P7, the conductive section P11 to the conductive section P17, the wiring W11, the wiring W12, the wiring W21, the wiring W22, the wiring W41 to the wiring W45 , Through-hole V11 to through-hole V17, through-hole V21 to through-hole V27, through-hole V31 to through-hole V36, through-hole V41 to through-hole V45, through-hole V51 to through-hole V57, and how the planar conductor IP is connected Information, for example, information indicating the connection relationship illustrated in FIG. 3.

Hereinafter, the conductive parts such as the conductive part P1 to the conductive part P7, the conductive part P11 to the conductive part P17 are collectively referred to as the conductive part P, and the wirings such as the wiring W11, wiring W12, wiring W21, wiring W22, wiring W41 to wiring W45 are collectively referred to as wiring W, collectively referred to as vias V11 to vias V17, vias V21 to vias V27, vias V31 to vias V36, vias V41 to vias V45, vias V51 to vias V57, etc. The wiring layer L1, the wiring layer L2, and the wiring layer L4 are collectively referred to as a wiring layer L.

Each conductive portion P is conductively connected to the planar conductor IP via the via hole V or the wiring W. In this way, the wiring structure where each conductive portion P is conductively connected to the planar conductor IP is generally used for circuit ground or power pattern connection purposes. Furthermore, the substrate B may of course also include wiring or pads that are not connected to the circuit ground or the power supply pattern.

When the substrate B is mounted on the substrate fixing device 110, the probe Pr of the measuring unit 121 is brought into contact with the conductive parts P1 to P7 by the moving mechanism 125, and the probe Pr of the measuring unit 122 is brought into contact with each other The conductive part P11 to the conductive part P17. As a result, the measurement unit 121 and the measurement unit 122 can cause the current I to flow between any pair of conductive portions P, and detect the voltage between the pair of conductive portions P.

In order to use the so-called four-terminal resistance measurement method for the resistance measurement, the measurement unit 121 and the measurement unit 122 may contact the probe Pr for current supply and the probe Pr for voltage measurement with one conductive portion P, in order to use the so-called two-terminal In the resistance measurement by the resistance measurement method, one probe P serving as both current supply and voltage measurement may be brought into contact with one conductive portion P.

The inspection processing section 21 controls the measurement section 121 and the measurement section 122 to supply the current I from the power supply section CS (see FIG. 2) to one of the pair of conductive sections P selected as described later, and the power supply section CM (refer to FIG. 2) and draw a current I from the other, thereby supplying the current I between the conductive parts P, and detecting the voltage between the conductive parts P, and checking based on the current and the voltage Substrate B. The inspection processing unit 21 may perform resistance measurement using the four-terminal resistance measurement method or the two-terminal resistance measurement method based on the current and the voltage, and perform inspection of the substrate B based on the resistance value.

Hereinafter, the case where the inspection processing unit 21 performs the current supply and voltage detection by controlling the measurement unit 121 and the measurement unit 122 will be described as if the inspection processing unit 21 supplies the current and the detection voltage. The details of the operation of the inspection processing unit 21 will be described later.

Next, the operation of the inspection instruction information generating device 3 will be described. The case where the inspection instruction information corresponding to the substrate B shown in FIG. 3 is generated will be described as an example. 5 and 6 are explanatory diagrams illustrating an example of the changed conductive structure information D1 during the execution of the inspection instruction information generation method when generating the inspection instruction information corresponding to the substrate B shown in FIG. 3. Hereinafter, referring to FIGS. 5 to 14, the operation of the inspection instruction information generation device 3 that executes the inspection instruction information generation method according to the inspection instruction information generation program according to an embodiment of the present invention will be described.

In the following flowchart, the same process is given the same step number and its description is omitted.

First, the inspection instruction information generating unit 31 performs a process of simplifying the connection structure represented by the conductive structure information D1 as a pre-process when grouping the conductive parts P of the substrate B. Specifically, when the inspection instruction information generating section 31 is connected in parallel to the wiring W of the plurality of wiring layers L, the wiring W connected in parallel is replaced with the wiring closest to the substrate surface F1 among the wirings W In the manner of W, the conductive structure information D1 is copied and changed to generate the conductive structure information D1' (step S1: (d) process).

Specifically, in the substrate B shown in FIG. 3, the wiring W11 and the wiring W21 of the plurality of wiring layers L1 and the wiring layer L2 are connected in parallel through the via holes V21 and the via holes V22. In this case, for the conductive structure information D1, as shown in FIG. 5, the two wires W11 and W21 are replaced with the one wire W11 among the wires W11 and W21 that is closest to the substrate surface F1 to generate the conductive structure information D1 '. At this time, one end of the through-hole V22 becomes open, so it can also be treated as the absence of the through-hole V22 on the document. This simplifies the wiring structure of the substrate B, and hence the subsequent processing becomes easy.

Then, when the inspection instruction information generating section 31 connects the through holes V or the rows of the through holes V in parallel through the wiring W and the planar conductor IP, the through holes V or the through holes V connected in parallel Replace the row with a through hole or a row of through holes, and change the conductive structure information D1' (step S2: (e) process).

Specifically, in the substrate B shown in FIG. 3, the via holes V24 and the via holes V33 are connected in series to form a row, and the via holes V25 and the via holes V34 are connected in series to form a row. Furthermore, the rows of the vias V24 and V33 and the rows of the vias V25 and V34 are connected in parallel by the wiring W12 and the planar conductor IP. In addition, through the wiring W22 and the planar conductor IP, the via hole V32 and the via hole V33 are connected in parallel.

In this case, for example, as shown in FIG. 5, for the conductive structure information D1 ′, the rows of the through-holes V24 and V33 and the rows of the through-holes V25 and V34 are replaced with any row, for example, through-hole V24 In the row of the through holes V33, the through holes V32 and the through holes V33 are replaced with one through hole V, for example, through holes V32.

In addition, the through-hole V41 and the through-hole V42 are connected in parallel by the series wiring of the wiring W41, the wiring W42, and the wiring W43 and the planar conductor IP. In this case, for example, as shown in FIG. 5, on the conductive structure information D1, the via holes V41 and V42 are replaced by one via hole V, for example, the via hole V41. In addition, the via hole V43, the via hole V44, and the via hole V45 are connected in parallel by the wiring W44, the wiring W45, and the planar conductor IP. In this case, for example, as shown in FIG. 5, for the conductive structure information D1 ′, the via hole V43, the via hole V44, and the via hole V45 are replaced by one via hole V, for example, the via hole V43. This simplifies the wiring structure of the substrate B, and hence the subsequent processing becomes easy.

Furthermore, the inspection instruction information generating section 31 does not necessarily need to perform steps S1 and S2, and the conductive structure information D1 representing the actual wiring structure of the substrate B shown in FIG. 3 may be used as the conductive structure information D1′. Perform subsequent processing.

Then, the inspection instruction information generating section 31 converts the data structure of the conductive structure information D1' into a tree structure (step S3: (m) process). The conductive structure information D1' that has been converted into a tree structure is called conductive structure information D1''. As shown in FIG. 6, in the conductive structure information D1'', one wiring W is expressed by a node N, the planar conductor IP is expressed by a root node NR, and the through hole V serves as a branch M, which connects the conductive portion P and the node Or the branch M that connects the nodes to each other is expressed.

In addition, the inspection instruction information generating section 31 does not necessarily need to perform step S3, and may use the conductive structure information D1, the conductive structure information D1' representing the wiring structure data of the substrate B to perform subsequent processing. In the following description, the processing for the node N is the same as the processing for the wiring W corresponding to the node N, the processing for the root node NR is the same as the processing for the planar conductor IP, and the processing for the branch M corresponds to The processing of the wiring W at the node N is the same.

In the example of the conductive structure information D1'' of the tree structure shown in FIG. 6, the node N11 corresponds to the wiring W11 (W21), the node N12 corresponds to the wiring W12, the node N21 corresponds to the wiring W22, and the node N41 corresponds to the wiring W41, wiring W42, wiring W43, and node N42 correspond to wiring W44 and wiring W45. In addition, the branch M11 corresponds to the through-hole V11 (V21), the branch M12 corresponds to the through-hole V12 (V22), the branch M13 corresponds to the through-hole V14, the branch M14 corresponds to the through-hole V15, and the branch M22 corresponds to the through-hole V24 (V25) , Branch Mr1 corresponds to through-hole V21, through-hole V31, branch Mr2 corresponds to through-hole V32 (V33), branch Mr3 corresponds to through-hole V16, through-hole V26, through-hole V35, branch Mr4 corresponds to through-hole V17, through-hole V27, through hole V36, branch M41 corresponds to through hole V51, branch M42 corresponds to through hole V52, branch M43 corresponds to through hole V53, branch M44 corresponds to through hole V54, branch M45 corresponds to through hole V55, branch M46 corresponds to Through hole V56, branch M47 corresponds to through hole V57, branch Mr5 corresponds to through hole V41 (V42), and branch Mr6 corresponds to through hole V43 (V44, V45).

Then, the inspection instruction information generating section 31 selects the wiring layer L1 closest to the substrate surface F1 as the first selection layer LL1, and selects the wiring layer L4 closest to the substrate surface F2 as the second selection layer LL2 (step S4: (f) step) . The processing from step S4 to step S27 and from step S101 to step S501 corresponds to an example of the inspection instruction information generation processing.

Then, the inspection instruction information generating section 31 executes the first process (step S5). Referring to FIG. 11, the inspection instruction information generating portion 31 groups the conductive portions P of the substrate surface F1 that are mutually connected via the node N (wiring W) of the first selection layer LL1 based on the conductive structure information D1″ (step S101 : (F) step (a) step).

Here, the first selection layer LL1 is the wiring layer L1, so in the conductive structure information D1'' of the tree structure shown in FIG. 6, the conductive portion P1 that is conducted through the node N11 of the first selection layer LL1 The conductive portion P2 is grouped, and the conductive portion P4 and the conductive portion P5 that are turned on via the node N12 of the first selection layer LL1 are grouped.

Then, the inspection instruction information generating section 31 selects two conductive sections from the conductive sections P included in each group as a pair of first selection conductive sections for each group grouped in step S101, and Corresponding to the first selection layer LL1 and recorded in the inspection instruction information D2 (step S102: (b) process of (f) process). The first selected conductive part is information indicating a conductive part (inspection part) that can be inspected at the same time.

In the example of FIG. 6, the conductive portion P1 and the conductive portion P2 are selected as the first selected conductive portion from the group of the conductive portion P1 and the conductive portion P2 corresponding to the wiring layer L1, and the group of the conductive portion P4 and the conductive portion P5 The conductive part P4 and the conductive part P5 in the group are selected as the first selected conductive part. Hereinafter, the pair of the conductive portion P1 and the conductive portion P2 is expressed as the conductive portion pairs P1 and P2.

Then, when among the groups grouped by step S101, there is a group having the conductive part P that is not selected as the first selection conductive part, the check instruction information generating part 31 is directed to the group, Select two conductive parts P including the conductive part P that is not selected as the first selected conductive part as a pair of second selected conductive parts, and correspond to the first selected layer LL1 and record in the inspection instruction information D2 (step S103: (f) step (b) step). The second selected conductive portion is information indicating a conductive portion (inspected portion) that should be inspected at different times than the first selected conductive portion.

In the example of FIG. 6, in the group of the conductive part P1, the conductive part P2, and the group of the conductive part P4, the conductive part P5, there is no group having the conductive part P not selected as the first selected conductive part Therefore, the inspection instruction information generating unit 31 shifts the processing to the next step S104.

Then, based on the conductive structure information D1'', the inspection instruction information generating section 31 groups the conductive sections P of the substrate surface F2 that are mutually connected via the node N (wiring W) of the second selection layer LL2 (step S104: ( f) Process (a) process).

Here, the second selection layer LL2 is the wiring layer L4, so in the conductive structure information D1'' of the tree structure shown in FIG. 6, the conductive portion P11, which is conducted through the node N41 of the second selection layer LL2, The conductive portion P12, the conductive portion P13, and the conductive portion P14 are grouped, and the conductive portion P15, the conductive portion P16, and the conductive portion P17 turned on via the node N42 of the second selection layer LL2 are grouped.

Then, the inspection instruction information generating section 31 selects two conductive sections from the conductive sections P included in each group as a pair of first selection conductive sections for each group grouped in step S104, and Corresponding to the second selection layer LL2 and recorded in the inspection instruction information D2 (step S105: (b) process of (f) process).

In the example of FIG. 6, any group of conductive parts P11, P12, P13, and P14 is selected as the first selected conductive part from the group of conductive part P11, conductive part P12, conductive part P13, and conductive part P14. In the group of the conductive portion P16 and the conductive portion P17, for example, any one of the conductive portion P15 and the conductive portion P16 is selected as the first selected conductive portion.

Then, when among the groups grouped by step S104, there is a group having the conductive part P that is not selected as the first selection conductive part, the check instruction information generating part 31 is directed to the group, The two conductive parts P including the conductive part P that is not selected as the first selected conductive part are selected as a pair of second selected conductive parts, and are associated with the second selected layer LL2 and recorded in the inspection instruction information D2 (step S106: (f) step (b) step), and then ends the first step and shifts the process to step S7 (FIG. 7).

In the example of FIG. 6, among the groups of the conductive portion P11, the conductive portion P12, the conductive portion P13, and the conductive portion P14, and the group of the conductive portion P15, the conductive portion P16, and the conductive portion P17, have not been selected as the first The conductive portion P13, the conductive portion P14, and the conductive portion P17 of the conductive portion are selected. In this case, the inspection instruction information generating section 31 selects the pair of conductive sections P13, P14, and the pair of conductive sections P16, P17 as the second selection conductive section.

Returning to FIG. 7, the inspection instruction information generating unit 31 checks the flag Fip1 that is the control flag used for the control process (step S7 ).

When the flag Fip1 is 1 (YES in step S7), it means that the flag Fip1 has been set to 1 in step S12 to be described later, which is more on the substrate surface F1 side of the conductor layer Lc than the conductor layer Lc The generation of the inspection instruction information D2 corresponding to each wiring layer L close to the substrate surface F1 side has ended. Therefore, the inspection instruction information generating unit 31 does not execute steps S11 to S16, but shifts to step S17 (FIG. 9 ).

When the flag Fip1 is not 1 (NO in step S7), it is checked that the instruction information generating section 31 shifts to step S11 (FIG. 8), and whether the conductor layer Lc is adjacent to the surface of the first selection layer LL1 away from the substrate Check on the side of F1 (step S11).

When the conductor layer Lc is adjacent to the side of the first selection layer LL1 away from the substrate surface F1 (Yes in step S11), the inspection instruction information generating section 31 sets the flag Fip1 to 1 (step S12), and in order to select The conductive part P of the inspection of the through hole V connected to the substrate surface F1 side of the planar conductor IP shifts the process to step S301 (FIG. 12 ).

On the other hand, when the conductor layer Lc is not adjacent to the side of the first selection layer LL1 away from the substrate surface F1 (No in step S11), the inspection instruction information generating section 31 selects the surface away from the substrate surface adjacent to the first selection layer LL1 The wiring layer L on the side of F1 serves as a new first selection layer LL1 (step S13: (g) step). With this, steps S14 to S16 are executed with the new first selection layer LL1 as the processing target.

For example, in the example shown in FIG. 6, the first selection layer LL1 is currently the wiring layer L1. The conductor layer Lc is not adjacent to the side of the wiring layer L1 away from the substrate surface F1 (No in step S11), and the wiring layer L2 adjacent to the side of the wiring layer L1 away from the substrate surface F1 becomes a new first selection layer LL1 (step S13).

Then, the inspection instruction information generating section 31 corresponds to each node N of the first selection layer LL1 according to the conductive structure information D1'', and for a branch M (through hole V) connected to the side of one of the nodes N away from the root node NR ), select a conductive portion P on the substrate surface F1 that is electrically connected to the opposite side of the node N, that is, conductive. The inspection instruction information generating unit 31 groups the selected conductive parts P for each corresponding node N (step S14: (g1) process).

In the example shown in FIG. 6, the wiring layer L2 as the first selection layer LL1 has the node N21. The branch M21 and the branch M22 are connected to the node N21. As the conductive portion P of the substrate surface F1 that directly or indirectly conducts to the side opposite to the node N21 of the branch M21, there is a conductive portion P3. Therefore, the conductive portion P3 corresponding to the branch M21 is selected. As the conductive portion P of the substrate surface F1 that directly or indirectly conducts to the side opposite to the node N21 of the branch M22, there are a conductive portion P4 and a conductive portion P5. Select any one of the conductive portion P4 and the conductive portion P5, for example, the conductive portion P4 is the conductive portion P corresponding to the branch M22. With this, the conductive portion P3 and the conductive portion P4 are grouped corresponding to the node N21.

Then, the inspection instruction information generating section 31 selects any two conductive sections from the conductive sections P included in each group as a pair of first selection conductive sections for each group grouped in step S14 , And corresponding to the first selection layer LL1 and recorded in the inspection instruction information D2 (step S15: (g2) process (b) process).

In the example shown in FIG. 6, two conductive portions P3 and P4 are selected from the conductive portions P3 and P4 grouped in step S14 as a pair of first selected conductive portions.

For example, as shown in the conductive structure information D1'' of the tree structure shown in FIG. 16, when the node N11 is not connected to the root node NR but is connected to the node N21 through the branch M23, in step S14, as The conductive portion P of the substrate surface F1 that is directly or indirectly connected to the opposite side of the node N21 of the branch M23 has a conductive portion P1 and a conductive portion P2. Select any one of the conductive portion P1 and the conductive portion P2, for example, the conductive portion P1 as the conductive portion P corresponding to the branch M23. Then, the conductive portion P1, the conductive portion P3, and the conductive portion P4, to which the conductive portion P3 and the conductive portion P4 are added to the conductive portion P1, are grouped corresponding to the node N21.

Furthermore, in step S15, two conductive parts are selected from the conductive part P1, the conductive part P3, and the conductive part P4, for example, the conductive part P1, the conductive part P3 as a pair of first selected conductive parts.

Then, when there is a group having the conductive part P that is not selected as the first selection conductive part in the group grouped by step S14, the check instruction information generating part 31 selects for the group The two conductive portions P including the conductive portion P that is not selected as the first selected conductive portion serve as a pair of second selected conductive portions and are associated with the first selected layer LL1 and recorded in the inspection instruction information D2 (step S16 : (G2) step (b) step), and then move to step S17 (FIG. 9).

On the other hand, when there is no group having the conductive part P that is not selected as the first selection conductive part in the group grouped by step S14, the inspection instruction information generating part 31 directly proceeds to step S17 Transfer.

Then, the inspection instruction information generating section 31 checks the flag Fip2 which is a control flag used for control processing (step S17).

When the flag Fip2 is 1 (YES in step S17), it means that the flag Fip2 has been set to 1 in step S19 to be described later, and the substrate surface F2 side of the conductor layer Lc is closer to the substrate surface than the conductor layer Lc The inspection of each wiring layer L on the F2 side indicates that the generation of information D2 has ended. Therefore, the inspection instruction information generating unit 31 does not execute steps S18 to S24, but shifts to step S26 (FIG. 10).

When the flag Fip2 is not 1 (No in step S17), the check instruction information generating section 31 shifts to step S18, and checks whether the conductor layer Lc is adjacent to the side of the second selection layer LL2 away from the substrate surface F2 (step S18).

When the conductor layer Lc is adjacent to the side of the second selection layer LL2 away from the substrate surface F2 (Yes in step S18), the inspection instruction information generating section 31 sets the flag Fip2 to 1 (step S19), and in order to select The inspected conductive portion P of the through hole V connected to the substrate surface F2 side of the planar conductor IP shifts the process to step S401 (FIG. 13 ).

For example, in the example shown in FIG. 6, if the current second selection layer LL2 is the wiring layer L4, the conductor layer Lc is adjacent to the side of the wiring layer L4 away from the substrate surface F2 (Yes in step S18), so the The flag Fip2 is set to 1 (step S19) and moves to step S401 (FIG. 13).

Referring to FIG. 13, in step S401, the inspection instruction information generating section 31 selects one of the branches M (through holes V) connected to the substrate surface F2 side of the root node NR (planar conductor IP) opposite to the root node NR Side is electrically connected, that is, the conductive portion P is turned on, thereby grouping the selected conductive portion P as the conductive portion corresponding to the substrate surface F2 side of the root node NR (step S401: (h) step) .

In the example shown in FIG. 6, the branch Mr5 and the branch Mr6 are connected to the substrate surface F2 side of the root node NR. As the conductive portion P that is in conduction with the branch Mr5, there are a conductive portion P11, a conductive portion P12, a conductive portion P13, and a conductive portion P14. As the conductive portion P that is in conduction with the branch Mr6, there are a conductive portion P15, a conductive portion P16, and a conductive portion P17. Therefore, in step S401, any one of the conductive part P11, the conductive part P12, the conductive part P13, and the conductive part P14 is selected, for example, the conductive part P11, the arbitrary one from the conductive part P15, the conductive part P16, the conductive part P17 One, for example, the conductive portion P15. With this, the conductive portion P11 and the conductive portion P15 are grouped.

Then, the inspection instruction information generating section 31 selects two conductive sections P from the conductive sections P grouped in step S401 as a pair of first selection conductive sections, and corresponds to the substrate surface F2 side of the root node NR Recorded in the inspection instruction information D2 (step S402: (h) process).

In step S402, two conductive portions P are selected from the conductive portions P11 and P15 grouped in step S401 as a pair of first selected conductive portions. In this case, the conductive parts P grouped by step S401 are only the conductive parts P11 and P15, so the two conductive parts P11 and P15 are selected as a pair of first selected conductive unit.

Then, when there is a group having the conductive part P that is not selected as the first selection conductive part in the group grouped by step S401, the check instruction information generating part 31 selects for the group The two conductive portions P including the conductive portion P that is not selected as the first selected conductive portion serve as a pair of second selected conductive portions and are associated with the substrate surface F2 side of the root node NR and recorded in the inspection instruction information D2 (Step S403), and then the process shifts to step S26 (FIG. 10).

At present, among the groups grouped by step S401, there is no group having the conductive part P that is not selected as the first selected conductive part, so the inspection instruction information generating part 31 directly proceeds to step S26 ( Figure 10) Transfer.

Furthermore, the inspection instruction information generating section 31 can also select multiple pairs of conductive sections P in such a manner as to include all the conductive sections P selected in step S401, and serve as multiple pairs of first selected conductive sections and the substrate surface F2 of the root node NR The side establishes a correspondence and records it in the inspection instruction information D2, instead of performing steps S402 and S403.

In this case, in the inspection by the inspection processing unit 21 described later, a plurality of pairs of first selection conductive portions corresponding to the substrate surface F2 side of the root node NR are simultaneously supplied with current, and the inspection is performed. If current is supplied to the plurality of pairs of conductive portions P at the same time, a repeat of the current path occurs. However, the root node NR, that is, the resistance of the planar conductor IP is very small compared to the wiring W. Therefore, even if the current path overlaps in the planar conductor IP, the influence on the voltage measurement result is small.

Therefore, a plurality of pairs of conductive portions P are selected in such a manner as to include all the conductive portions P selected in step S401, and are recorded in the inspection instruction information as a plurality of pairs of the first selected conductive portions are associated with the substrate surface F2 side of the root node NR D2, instead of performing Steps S402 and S403, during the inspection by the inspection processing section 21 described later, current can be supplied to a plurality of pairs of first selection conductive portions at the same time, thereby shortening the inspection time.

On the other hand, when the conductor layer Lc is not adjacent to the side of the second selection layer LL2 far away from the substrate surface F2 (No in step S18), the inspection instruction information generating section 31 selects the surface far away from the substrate surface adjacent to the second selection layer LL2 The wiring layer L on the side of F2 serves as a new second selection layer LL2 (step S21: (g) step). With this, steps S22 to S24 are executed with the new second selection layer LL2 as the processing target.

Then, the inspection instruction information generating section 31 corresponds to each node N of the second selection layer LL2 according to the conductive structure information D1'', for a branch M (through hole V) connected to the side of one of the nodes N away from the root node NR ), select a conductive portion P on the substrate surface F2 that is electrically connected to the opposite side of the node N, that is, to conduct. Then, the inspection instruction information generating unit 31 groups the selected conductive parts P for each corresponding node N (step S22: (g1) process).

Then, the inspection instruction information generating section 31 selects any two conductive sections from the conductive sections P included in each group as a pair of first selection conductive sections for each group grouped in step S22 , And corresponding to the second selection layer LL2 and recorded in the inspection instruction information D2 (step S23: (g2) process (b) process).

Then, when there is a group having the conductive part P that is not selected as the first selection conductive part in the group grouped by step S22, the check instruction information generating part 31 selects for the group The two conductive portions P including the conductive portion P that is not selected as the first selected conductive portion serve as a pair of second selected conductive portions and are associated with the second selected layer LL2 and recorded in the inspection instruction information D2 (step S24 : (G2) step (b) step), and then move to step S26 (FIG. 10).

On the other hand, when there is no group having the conductive part P that is not selected as the first selection conductive part in the group grouped by step S22, the check instruction information generating part 31 directly from step S23 Move to step S26 (FIG. 10).

In the example shown in FIG. 6, at present, there is no conductive portion P having the conductive portion P that is not selected as the first selected conductive portion in the processing corresponding to the wiring layer L2 and the substrate surface F2 side of the planar conductor IP For the group, the inspection instruction information generating unit 31 does not record the inspection instruction information D2 and shifts the process from step S23 to step S26 (FIG. 10 ).

Then, the inspection instruction information generating unit 31 checks whether inspection instruction information D2 corresponding to the substrate surface F1 and the substrate surface F2 side of all the wiring layers L and the planar conductor IP has been generated (step S26).

When the inspection instruction information D2 corresponding to the substrate surface F1 and the substrate surface F2 side of all the wiring layers L and the planar conductor IP has been generated (YES in step S26), the process is shifted to step S27. On the other hand, when the wiring layer L or the substrate surface F1 of the planar conductor IP that does not produce the corresponding inspection instruction information D2 still remains (NO in step S26), the process proceeds to step S11 (FIG. 8 ) Transfer.

In step S11, the inspection instruction information generating section 31 checks whether the conductor layer Lc is adjacent to the side of the first selection layer LL1 away from the substrate surface F1 (step S11). In the example shown in FIG. 6, at present, the first selection layer LL1 is the wiring layer L2. The conductor layer Lc is adjacent to the side of the wiring layer L2 away from the substrate surface F1 (YES in step S11), so the inspection instruction information generating section 31 sets the flag Fip1 to 1 (step S12), and moves the processing to step S301 (FIG. 12) Transfer.

In step S301, the inspection instruction information generating section 31 selects one of the branches M (through holes V) connected to the substrate surface F1 side of the root node NR (planar conductor IP) to conduct on the side opposite to the root node NR The conductive portion P thereby groups the selected conductive portion P as a conductive portion corresponding to the substrate surface F1 side of the root node NR (step S301: (h) step).

In the example shown in FIG. 6, the branch Mr1, the branch Mr2, the branch Mr3, and the branch Mr4 are connected to the substrate surface F1 side of the root node NR. As the conductive portion P that is in conduction with the branch Mr1, there are a conductive portion P1 and a conductive portion P2. As the conductive portion P that is in conduction with the branch Mr2, there are a conductive portion P3, a conductive portion P4, and a conductive portion P5. As the conductive portion P that is in conduction with the branch Mr3, there is a conductive portion P6. As the conductive portion P that is in conduction with the branch Mr4, there is a conductive portion P7.

Therefore, in step S301, any one of the conductive part P1 and the conductive part P2 is selected, for example, the conductive part P1, and any one of the conductive part P3, the conductive part P4, and the conductive part P5 is selected, for example, the conductive part P3, and The conductive part P6 and the conductive part P7 are selected. Thereby, the conductive portion P1, the conductive portion P3, the conductive portion P6, and the conductive portion P7 are grouped.

Then, the inspection instruction information generating section 31 selects any two conductive sections P from the conductive sections P grouped in step S301 as a pair of first selection conductive sections, and establishes it with the substrate surface F1 side of the root node NR Correspondingly, it is recorded in the inspection instruction information D2 (step S302: (h) process).

In the example shown in FIG. 6, any two conductive portions P are selected from the conductive portion P1, the conductive portion P3, the conductive portion P6, and the conductive portion P7 grouped by step S301, for example, the conductive portion P1 The conductive portion P3 serves as a pair of first selective conductive portions.

Then, when there is a group having the conductive part P that is not selected as the first selection conductive part in the group grouped by step S301, the check instruction information generating part 31 selects for the group The two conductive portions P including the conductive portion P that is not selected as the first selected conductive portion serve as a pair of second selected conductive portions and are associated with the substrate surface F1 side of the root node NR and recorded in the inspection instruction information D2 (Step S303), and then the process shifts to step S17 (FIG. 9).

In step S302, among the conductive portion P1, the conductive portion P3, the conductive portion P6, and the conductive portion P7 grouped by the step S301, the conductive portion P6 and the conductive portion P7 are not selected as the first selection conductive portion, so The inspection instruction information generating section 31 selects the group including the conductive section P1, the conductive section P3, the conductive section P6, and the conductive section P7 having the conductive section P not selected as the first selection conductive section, A conductive part P6 of the selective conductive part and two conductive parts P of the conductive part P7 serve as a pair of second selective conductive parts. In this case, the conductive part P6 and the conductive part P7 are selected as a pair of second selective conductive parts (step S303).

In step S303, for example, the conductive parts included in the group are the conductive part P1, the conductive part P3, and the conductive part P6, and the conductive part not selected as the first selected conductive part is only the conductive part P6. In the case of one, any one of the conductive portion P6, the conductive portion P1, and the conductive portion P3 is selected as a pair of second selected conductive portions.

In addition, similar to the above steps S402 and S403, the inspection instruction information generating unit 31 can also select multiple pairs of conductive parts P in a manner including all the conductive parts P selected in step S301, and serve as the first Instead of performing steps S302 and S303, the selected conductive portion is associated with the substrate surface F1 side of the root node NR and recorded in the inspection instruction information D2. For example, the inspection instruction information generating section 31 may also make the conductive section P1, the conductive section P3, and the conductive section P6 from the conductive section P1, the conductive section P3, the conductive section P6, and the conductive section P7 grouped in step S301. The conductive portions P7 are paired, and the conductive portion P1, the conductive portions P3 and the conductive portions P6, and the conductive portion P7 are associated with the plurality of pairs of first selected conductive portions and the substrate surface F1 side of the root node NR and recorded in the inspection instruction information D2 .

Then, in step S17 (FIG. 9 ), the current flag Fip2 is 1, so the inspection instruction information generating unit 31 shifts the process to step S26 (FIG. 10 ).

In step S26, the processes from step S5 to step S403 have been performed on all the wiring layers L and the substrate surface F1 and the substrate surface F2 side of the planar conductor IP (Yes in step S26), so in order to prevent the omission of the inspection site Instead, the second process is performed (step S27).

Referring to FIG. 14, the inspection instruction information generating unit 31 searches for any pair of wires W sandwiched between the pair of the first selection conductive part and the pair of the second selection conductive part that are not selected in steps S1 to S403 (step S501 : (J) Process).

In the example shown in FIG. 6, in steps S1 to S403, the pair of conductive parts P1, P2, the pair of conductive parts P1, P3, the pair of conductive parts P3, P4, the pair of conductive parts P4, P5, the pair of conductive parts P11, P12, conductive part pair P11, P15, conductive part pair P15, P16 as the first selected conductive part pair, and select conductive part pair P6, P7, conductive part pair P13, P14, conductive part pair P16, P17 as the first Second, select the pair of conductive parts.

Therefore, on the substrate surface F1 side, the conductive portions P1 to P7 are continuously selected as a first selection conductive portion and a second selection conductive portion in series, so there is no pair and second selection that are not the first selection conductive portion Wiring W sandwiched between any pair of pairs of conductive portions. On the other hand, on the substrate surface F2 side, the pair of conductive portions P11 and P12 and the pair of conductive portions P13 and P14 become discontinuous.

15 is an explanatory diagram for explaining the second step. FIG. 15 is a partially enlarged view of the vicinity of the conductive portion P11 to the conductive portion P14 of FIG. 5.

In the examples shown in FIGS. 6 and 15, in steps S1 to S403, the pair of conductive portions P11, P12 and the pair of conductive portions P13, P14 are selected as the pair of the first selected conductive portion and the pair of the second selected conductive portion Yes, but the conductive part pairs P12 and P13 are not selected. As a result, the wiring W42 shown in FIG. 15 is not sandwiched by any of the pair of the first selection conductive portion and the pair of the second selection conductive portion.

Then, the inspection instruction information generating unit 31 checks whether or not there is a matching wire W (step S503), and if there is a matching wire W (YES in step S503), the process moves to step S504. On the other hand, if there is no matching wire W (NO in step S503), the inspection instruction information generating section 31 ends the processing. In the example shown in FIG. 6, the wiring W42 matches.

In step S504, the inspection instruction information generating section 31 connects one end of the matching wire W without conducting through the wire W, and the other end with the conducting wire P without conducting through the wire W As a pair of third selection conductive portions that should be inspected at different times from the first selection conductive portion, it is recorded in the inspection instruction information D2 (step S504: (k) step).

In the example shown in FIG. 15, for example, a conductive portion P12 that matches one end T1 of the wiring W42 without conducting through the wiring W42, and a conductive portion P13 that does not conduct with the other end T2 of the wiring W42 through the wiring W42 are selected as A pair of third selection conductive portions (step S504).

Then, the check instruction information generating section 31 checks whether the substrate B includes a plurality of conductor layers Lc (step S505), and when there are a plurality of conductor layers Lc (YES in step S505), the process moves to step S506. On the other hand, if there are no multiple conductor layers Lc (NO in step S505), the inspection instruction information generating unit 31 ends the process.

In step S506, the inspection instruction information generating section 31 checks whether there is a through-hole V connecting the planar conductors IP of the plurality of conductor layers Lc to each other (step S506). And if there is this through-hole V (YES in step S506), it will transfer to step S507. On the other hand, if the through hole V does not exist (NO in step S506), the inspection instruction information generating unit 31 ends the processing.

The substrate B shown in FIG. 17 includes two conductor layers Lc, and is provided with a through hole Vc that connects the planar conductors IP of the two conductor layers Lc to each other. In order to check the conduction of the via hole Vc, it is necessary to allow current to flow between the conductive portion P of the substrate surface F1 and the conductive portion P of the substrate surface F2.

Therefore, in step S507, the inspection instruction information generating section 31 regards one of the conductive portions P of the substrate surface F1 and one of the conductive portions P of the substrate surface F2 as the inspection that should not be performed at the same time as the first selected conductive portion A pair of fourth selection conductive parts are recorded in the inspection instruction information D2 (step S507: (1) process), and the process is ended.

A pair of fourth selected conductive portions is recorded in the inspection instruction information D2. As a result, the substrate inspection device 2 can inspect the through hole Vc by inspection based on the inspection instruction information D2.

In addition, among the first selection conductive portion, the second selection conductive portion, the third selection conductive portion, and the fourth selection conductive portion selected in step S1 to step S507, only the fourth selection for inspecting the via Vc The conductive portion selects the conductive portion P of the substrate surface F1 and the conductive portion P of the substrate surface F2 as the pair of conductive portions P to be inspected, and the selection of the pair of conductive portions P from both sides of the substrate B is set to the minimum necessary.

When an electric current flows between the pair of conductive portions P of the substrate B and the voltage is measured for inspection, the external electromagnetic field overlaps the detection voltage as noise. In the surface on one side of the substrate B, an external electromagnetic field is applied in substantially the same manner, so on the surface side on the side of the substrate B, the noise voltage caused by the external electromagnetic field becomes substantially fixed. Therefore, when measuring the voltage between the pair of conductive portions P on one side of the substrate B, the noise overlapping the measurement voltage becomes a common mode, and as a result, the noise The effect of voltage is reduced.

On the other hand, between the two surfaces of the substrate B, the intensity of the electromagnetic field applied to the front and back of the substrate B is poor, and the noise voltage caused by the external electromagnetic field is generated on one side and the other side of the substrate B difference. Therefore, when the voltage between the pair of conductive portions P is measured across both sides of the substrate B, the noise overlapping the measured voltage becomes a normal mode, and as a result, the noise voltage directly matches the measured voltage overlapping. As a result, the influence of noise changes when the voltage between the pair of conductive portions P is measured across both sides of the substrate B compared to the case of measuring the voltage between the pair of conductive portions P on the side of the substrate B Big.

According to step S1 to step S507, the conductive portion P across the two sides of the substrate B is set as the minimum fourth selected conductive portion required for inspection of the through-hole Vc, and besides that, the surface on the side of the substrate B The inner conductive part P is set as the pair of the first selection conductive part, the pair of the second selection conductive part, and the pair of the third selection conductive part, so the influence of noise when the inspection based on the inspection instruction information D2 is performed cut back.

In addition, when inspecting the through holes between the two surfaces of the substrate B, the probe Pr of the measuring jig 4U must be in contact with the conductive portion P of the substrate surface F1 of the substrate B, and the probe Pr of the measuring jig 4L can be in contact with the substrate of the substrate B The conductive portion P of the surface F2. At this time, when any of the probe Pr of the measuring jig 4U and the probe Pr of the measuring jig 4L has poor contact, it is not possible to determine in which probe Pr the poor contact has occurred.

Therefore, the probes Pr of the two measuring jigs are temporarily separated from the substrate B, and then the probes Pr of the two measuring jigs are brought into contact with the substrate B again to perform re-inspection. It is necessary to repeat this re-inspection multiple times before the probes Pr of the two measuring jigs contacting both sides of the substrate B normally contact the conductive portion P. If the separation and contact of the probe Pr with respect to the conductive portion P are repeated in this manner, the inspection time is prolonged, and the conductive portion P is easily damaged.

According to steps S1 to S507, the inspection of the conductive portion P across the two sides of the substrate B is minimized, and most of them become the inspection of the conductive portions P provided on one side of the substrate B, thereby reducing the cause of poor contact The re-inspection of is easy to reduce the risk of damage to the conductive part P.

As described above, the inspection instruction information generating device 3 can generate inspection instruction information D2 through the processes of steps S1 to S507. In addition, according to step S1 to step S507, the order in which the inspection instruction information D2 has been recorded for each corresponding substrate surface corresponds to the order of the pair of conductive parts that should cause the substrate inspection apparatus 2 to perform inspection. Specifically, the inspection instruction information D2 is sequentially recorded from the layer corresponding to the substrate surface F1 and the substrate surface F2.

Step S15, Step S16, Step S23, Step S24, Step S102, Step S103, Step S105, Step S106, Step S302, Step S303, Step S402, Step S403, Step S504 by the inspection instruction information generating unit 31 , The process of step S507, and each conductive part pair to be inspected is associated with the substrate surface, the layer, and the types of the first selection conductive part, the second selection conductive part, the third selection conductive part, and the fourth selection conductive part , The inspection instruction information D2 shown in FIG. 18 is generated. Here, "layer" means each layer of the wiring layer L and the conductor layer Lc.

In FIG. 18, the substrate surface F1 is associated with the five conductive portion pairs, and the order in which the inspection should be performed is indicated in the order of top-down. Similarly, the substrate surface F2 is associated with the six conductive portion pairs, and the order in which the inspection should be performed is indicated in a top-down order.

The inspection instruction information D2 obtained in the above manner is sent to the substrate inspection device 2 by, for example, a communication circuit omitting the illustration, or the inspection instruction information D2 is stored in a storage medium such as a USB memory, and the substrate inspection device 2 is read This storage medium is inserted to store the inspection instruction information D2 in the storage unit 22.

Next, the operation of the substrate inspection device 2 will be described. Hereinafter, the case where the inspection instruction information D2 shown in FIG. 18 is stored in the storage unit 22 will be described as an example.

Referring to FIG. 19, based on the inspection instruction information D2, the inspection processing unit 21 selects the layer with the highest order among the layers on the substrate surface F1 side as the inspection layer LT1 (step S51 ). In the example shown in FIG. 18, the first (topmost) layer in the order corresponding to the substrate surface F1 is the wiring layer L1, and therefore the wiring layer L1 is used as the inspection layer LT1.

Then, based on the inspection instruction information D2, the inspection processing unit 21 selects the layer with the highest order among the layers on the substrate surface F2 side as the inspection layer LT2 (step S52). In the example shown in FIG. 18, the first (uppermost) layer in the order corresponding to the substrate surface F2 is the wiring layer L4, so the wiring layer L4 is used as the inspection layer LT2.

Then, the inspection processing unit 21 executes a first current supply process that simultaneously causes the measurement current to flow between the paired conductive portions for the conductive portion pair of the first selection conductive portion of the inspection layer LT1 and the inspection layer LT2 (step S53: (c1 ) Process). In the example shown in FIG. 18, the inspection layer LT1 is currently the wiring layer L1, and the inspection layer LT2 is the wiring layer L4. Therefore, the inspection processing section 21 is directed to the conductive portion that is the first selective conductive portion of the wiring layer L1 and the wiring layer L4. For P1 and P2, the pair of conductive parts P4 and P5, the pair of conductive parts P11 and P12, and the pair of conductive parts P15 and P16 flow simultaneously with the measurement current.

Then, the inspection processing section 21 detects the voltage between the pair of conductive sections of the first selection conductive section of the inspection layer LT1 and the inspection layer LT2, and checks the through-hole V of the current path between the conductive sections based on the voltage and the measurement current And wiring W (step S54: (c1) process).

In the example of FIG. 18, the inspection processing unit 21 causes current to flow into the pair of conductive parts P1, P2, the pair of conductive parts P4, P5, the pair of conductive parts P11, P12, the pair of conductive parts P15, P16, and detects each Pair voltage. Further, the inspection processing unit 21 divides the voltage between the pairs by the current flowing into the pairs, for example, thereby calculating the resistance value between the pairs. The inspection processing unit 21 compares each calculated resistance value with, for example, a reference value previously stored in the storage unit 22, and if each resistance value is less than the reference value, the substrate B is judged to be good, and if each resistance value exceeds the reference value, Then, the substrate B is judged to be defective.

In step S54, the inspection processing unit 21 reports the determination result to the user by a method such as a display unit such as a display device (not shown). Furthermore, the inspection processing unit 21 does not need to report the determination result to the user.

In step S54, the through-hole V and the wiring W are inspected, the through-hole V and the conductive part pair P1, P2, the conductive part pair P4, P5, and the conductive part pair P11, P12 that have been selected as the first selection conductive part , And the branch M11, branch M12, branch M13, branch M14, branch M41, branch M42, branch M45, branch M46 of the current path between the pair of conductive parts P15, P16, the wiring W corresponds to the node N11, node N12, node N41, and node N42 correspond.

In step S53, current can be simultaneously flowed into the pair of conductive parts P1, P2, the pair of conductive parts P4, P5, the pair of conductive parts P11, P12, and the pair of conductive parts P15, P16 that have been selected as the first selection conductive part The voltage between each pair is measured, so it is easy to shorten the inspection time of the substrate.

In addition, it is assumed that when a current has simultaneously flowed into a plurality of pairs of conductive portion pairs P that are turned on via the same node N (wiring W), there is a possibility that the wiring W that repeatedly flows in the current for measurement may occur. In this case, the voltage due to the repetition of the current becomes a measurement error, so there is a possibility that the inspection accuracy will be lowered.

On the other hand, in the inspection instruction information D2, the conductive part pair P of the first selection conductive part is selected so that the current does not overlap even if the measurement current flows into each layer at the same time. Therefore, in steps S51 to S54, the pair of conductive portions P that simultaneously flow into the measurement current is determined based on the inspection instruction information D2, thereby reducing the risk of lowering the inspection accuracy and shortening the inspection time of the substrate.

Then, when the substrate B is determined to be defective in step S54 (YES in step S55), the inspection processing unit 21 ends the processing without executing the subsequent processing. On the other hand, when the substrate B is not determined to be defective in step S54 (NO in step S55), the inspection processing unit 21 shifts the process to step S61 (FIG. 20 ).

In step S61, the inspection processing unit 21 executes the pair of conductive portions of the second selection conductive portion of the inspection layer LT1 and the inspection layer LT2 differently from the first current supply process and causes the measurement current to flow between the pair of conductive portions Second current supply process (step S61: (c2) step).

Then, the inspection processing section 21 detects the voltage between the pair of conductive sections of the second selection conductive section of the inspection layer LT1 and the inspection layer LT2, and checks the current between the paired second selection conductive sections based on the voltage and the measurement current Via hole V and wiring W of the path (step S62: (c2) process). The inspection processing unit 21 uses the same method as in the case of step S54 to perform inspection and report of its judgment result.

The supply and inspection of the measurement current in step S61 and step S62 are not performed at the same time as step S53, that is, when the measurement current in step S53 does not flow.

In step S61 and step S62, the inspection of the second selection conductive portion is not performed simultaneously with the inspection of the first selection conductive portion, thereby preventing the repetition of the measurement current. The processes of step S61 and step S62 for the conductive part pair of the second selection conductive part of the inspection layer LT1 and the conductive part pair of the second selection conductive part of the inspection layer LT2 may also be performed simultaneously.

In the example of FIG. 18, the inspection layer LT1 is currently the wiring layer L1, and the inspection layer LT2 is the wiring layer L4, so there is no conductive portion pair of the second selection conductive portion of the inspection layer LT1 (wiring layer L1), so the The second current supply process of the conductive part pair of the second selective conductive part of the inspection layer LT1 (wiring layer L1). The inspection processing section 21 executes step S61 and step S62 for the pair of conductive portions P13 and P14 and the pair of conductive portions P16 and P17 that are the second selection conductive portions of the wiring layer L1 and the wiring layer L4 differently from step S53 and step S54 .

Then, when the substrate B is determined to be defective in the inspection of step S62 (YES in step S63), the inspection processing unit 21 ends the processing without executing the subsequent processing. On the other hand, when the substrate B is not determined to be defective in the inspection of step S62 (NO in step S63), the inspection processing unit 21 shifts the processing to step S64.

In step S64, the inspection processing unit 21 checks whether any of the cases where the inspection layer LT1 and the inspection layer LT2 are the conductor layer Lc, and one is the conductor layer Lc and the other is not (step S64 ). When both the inspection layer LT1 and the inspection layer LT2 are not the conductor layer Lc, and either one is the conductor layer Lc and the other is not the case (NO in step S64), the inspection processing section 21 Step S65 transitions, when either the inspection layer LT1 or the inspection layer LT2 is the conductor layer Lc, or either one is the conductor layer Lc and the other does not have the inspection layer described later (YES in step S64) ), the inspection processing unit 21 moves to step S71 (FIG. 21 ). At present, since neither the inspection layer LT1 nor the inspection layer LT2 is the conductor layer Lc (NO in step S64), the process moves to step S65.

In step S65, if the inspection layer LT1 is not the conductor layer Lc, the inspection processing unit 21 sets the next layer among the layers on the substrate surface F1 side as the inspection layer LT1 based on the inspection instruction information D2 (step S65). When the current inspection layer LT1 is the conductor layer Lc, the inspection processing unit 21 does not set a new inspection layer LT1. Then, if the inspection layer LT2 is not the conductor layer Lc, the inspection processing unit 21 sets the next layer among the layers on the substrate surface F2 side to the inspection layer LT2 based on the inspection instruction information D2 (step S66), and proceeds to the step S53 (Figure 19) transfer. When the current inspection layer LT2 is the conductor layer Lc, the inspection processing unit 21 does not set a new inspection layer LT2.

At present, the inspection layer LT1 is the wiring layer L1, and the inspection layer LT2 is the wiring layer L4. Therefore, the inspection processing unit 21 sets the new inspection layer LT1 as the wiring layer L2 and sets the new inspection layer LT2 as the conductor layer Lc. S53 (Figure 19) transfer.

In step S53, the inspection processing unit 21 performs the pair of conductive portions P3 and P4 as the first selected conductive portion of the wiring layer L2 and the pair of conductive portions P11 and P15 of the first selected conductive portion as the conductive layer Lc of the substrate surface F2 At the same time, the current for measurement flows at the same time, and the voltage between the pair of conductive parts P3 and P4 and the voltage between the pair of conductive parts P11 and P15 are detected, and the through hole V of the current path between the conductive parts is checked based on the voltage and the current for measurement And wiring W (step S53, step S54: (c1) process).

Hereinafter, if NO in step S55, the inspection processing unit 21 moves to step S61. According to the inspection instruction information D2 shown in FIG. 18, since there is no second selection conductive portion corresponding to the wiring layer L2 and the conductor layer Lc of the substrate surface F2, steps S61 to S63 are not executed and the process moves to step S64.

In step S64, since it does not correspond to either the case where the inspection layer LT1 and the inspection layer LT2 are both the conductor layer Lc, and either one is the conductor layer Lc and the other does not have the inspection layer, the process moves to step S65, The inspection processing unit 21 sets the conductor layer Lc, which is the next layer of the wiring layer L2 on the substrate surface F1 side of the inspection instruction information D2, to the inspection layer LT1 (step S65). In step S66, since the inspection layer LT2 is the conductor layer Lc, the inspection processing unit 21 does not set a new inspection layer LT2, and then moves to step S53.

In step S53, the inspection processing unit 21 flows a measurement current to the conductive pair pairs P1 and P3 that are the first selected conductive parts of the conductor layer Lc on the substrate surface F1 side, and detects the voltage between the conductive pair pairs P1 and P3 according to The voltage and the measurement current are used to inspect the through-hole V and the wiring W of the current path between the conductive parts (step S53, step S54: (c1) step).

Hereinafter, if NO in step S55, the inspection processing unit 21 moves to step S61. According to the inspection instruction information D2 shown in FIG. 18, the second selected conductive portion of the conductor layer Lc on the substrate surface F1 side is a pair of conductive portions P6, P7. Therefore, the inspection processing section 21 performs step S61 and step 62 on the conductive section pairs P6 and P7.

Hereinafter, if NO in step S63, the inspection processing unit 21 moves to step S64. At present, the inspection layer LT1 is set to the conductor layer Lc in the step S65, and the inspection layer LT2 is set to none in the step S66 (YES in step S64), so the process moves to step S71 (FIG. 21).

In step S71, the inspection processing unit 21 executes the third of the conductive portions of the third selected conductive portion differently from the first current supply processing and the second current supply processing, and causes the measurement current to flow into the third conductive portion between the pair of conductive portions. Current supply processing (step S71).

Then, the inspection processing section 21 detects the voltage between the pair of conductive sections of the third selection conductive section, and checks the via hole V and the wiring W of the current path between the conductive sections based on the voltage and the measurement current (step S72). The inspection processing unit 21 uses the same method as in the case of step S54 to perform inspection and report of its judgment result.

In the example of FIG. 18, there is no third selection conductive portion corresponding to the substrate surface F1, and the third selection conductive portion corresponding to the substrate surface F2 is the pair of conductive portions P12, P13. Therefore, the inspection processing unit 21 and the first current supply process and the second current supply process do not execute the third current supply process (step S71) in which the measurement current flows into the conductive part pair between the conductive parts of P12 and P13 at different times (step S71 ). The conductive portion checks the voltage between the conductive portions of P12 and P13 based on the voltage and the measurement current, and checks the via V and the wiring W of the current path between the conductive portions (step S72).

In the example of FIG. 18, the wiring W42 of the current path between the pair of conductive portions P12 and P13 shown in FIG. 15 is inspected. As a result, the risk of inspection leakage of the wiring W can be reduced, and the inspection accuracy of the substrate B can be improved.

Then, the inspection processing unit 21 executes the fourth current supply process for causing the current for measurement to flow between the paired conductive parts differently from the first current supply process to the third current supply process for the conductive part pair of the fourth selected conductive part (Step S73).

Then, the inspection processing section 21 detects the voltage between the pair of conductive sections of the fourth selected conductive section, and checks the via V and the wiring W of the current path between the conductive sections based on the voltage and the measurement current (step S74), Then end the process. The inspection processing unit 21 uses the same method as in the case of step S54 to perform inspection and report of its judgment result.

In the example of FIG. 18, since there is no fourth selection conductive portion, the inspection processing portion 21 ends the processing without performing steps S73 and S74.

According to steps S73 and S74, for example, the through-hole Vc of the substrate B shown in FIG. 17 can be inspected, the substrate B includes two conductor layers Lc, and the planar conductors IP connecting the two conductor layers Lc are provided to each other Through hole Vc.

In addition, the inspection instruction information generating device 3 sorts the inspection instruction information D2 in order from the layer corresponding to the substrate surface F1 and the substrate surface F2 for each substrate surface. As a result, the substrate inspection apparatus 2 defines the inspection sequence by step S51, step S52, step S65, and step S66, whereby the wiring layer L can be sequentially inspected from the substrate surface F1 or the substrate surface F2 .

In general, the closer the substrate B is to the substrate surface F1 and the substrate surface F2, the greater the number of wires W provided in the wiring layer L. The greater the number of wires W provided in the wiring layer L, the greater the number of pairs of conductive portions corresponding to the first selection conductive portion of one layer. The greater the number of pairs of conductive parts of the first selection conductive part, the greater the number of pairs of conductive parts that can be simultaneously inspected in step S53.

Therefore, the number of simultaneous inspections in the early stage of the inspection can be increased by sequentially setting the wiring layer L as the inspection target since it approaches the substrate surface F1 and the substrate surface F2. If the number of simultaneous inspections in the initial stage of the inspection can be increased, the defect of the substrate B can be detected in the early stage of the inspection. Therefore, in the case where the inspection is terminated when a defect is detected as in steps S55 and S63, by sequentially approaching the substrate surface F1 and the substrate surface F2, by sequentially setting the wiring layer L as the inspection object, the detection can be shortened The time before the defect and increase the possibility of shortening the inspection time.

In addition, the example in which the inspection instruction information generating device 3 and the substrate inspection device 2 are configured as separate devices is shown, but the inspection instruction information generating device 3 and the substrate inspection device 2 may be configured as a single device. For example, the configuration may be such that the substrate inspection device 2 includes an inspection instruction information generating unit 31 and a storage unit 32, whereby the substrate inspection device 2 also serves as an inspection instruction information generating device. In this case, a substrate inspection system is constituted by a substrate inspection device that also serves as an inspection instruction information generating device.

In addition, the inspection instruction information generation device 3 and the inspection instruction information generation method do not necessarily need to execute all the processes shown in FIGS. 7 to 14, and the inspection processing unit 21 does not necessarily need to execute all the processes shown in FIGS. 19 to 21.

The inspection instruction information generating device 3 and the inspection instruction information generation method can generate the following inspection instruction information D2 even when only steps S101 and S102 are executed, for example: the wiring layer L1 adjacent to the substrate surface F1 can be easily shortened Inspection time of the wiring W and the through hole V connecting the wiring layer L1 adjacent to the substrate surface F1 and the conductive portion P. In this case, the inspection processing unit 21 only needs to execute step S53 and step S54.

In addition, an example in which the wiring layer L and the conductive portion P are provided on both surfaces of the conductor layer Lc is shown, but the wiring layer L and the conductive portion P may be provided on only one surface of the conductor layer Lc. For example, the substrate B may not include the substrate B4 and the substrate B5. In this case, there is no need to perform processing related to the selection layer LL2, for example, steps S18 to S24, steps S104 to S106, steps S401 to S403, step S52, step S66, etc. are not required.

In addition, the inspection processing unit 21 may be configured to continue inspection even if a defect is detected during the inspection without performing steps S55 and S63. In addition, the inspection instruction information generating device 3 and the inspection instruction information generation method are not necessarily limited to step S4, step S13, and step S21, and the conductive portions are sequentially recorded from the layer corresponding to the substrate surface F1 and the substrate surface F2. For example of checking instruction information D2. The inspection instruction information generating device 3 and the inspection instruction information generation method may also record the conductive portion pair in the inspection instruction information D2 in any order.

That is, the inspection instruction information generating device of an example of the present invention is an inspection instruction information generating device for inspecting a substrate including a conductor as a layer provided with a conductive planar conductor expanded into a planar or mesh shape A layer, a substrate surface provided with a plurality of conductive portions, a wiring layer as a layer laminated between the conductor layer and the substrate surface, a via hole connecting the wiring of the wiring layer to the conductive portion, and A through-hole that connects the wiring of the wiring layer to the planar conductor of the conductor layer, the inspection instruction information generating device includes: a storage unit that stores the planar conductor representing the substrate, the conductive portion, Information on the conductive structure of the wiring and how the through-hole is connected; and an inspection instruction information generating section, when there are a plurality of groups of the conductive sections that are mutually connected through the wiring of the wiring layer, according to For the conductive structure information, the following inspection instruction information generation process is performed: a pair of the conductive parts is selected as the first selected conductive part from each group, and the selected pairs of the first selected conductive parts are represented. Is recorded as inspection instruction information.

In addition, the inspection instruction information generation method of an example of the present invention includes an inspection instruction information generation process based on conductive structure information indicating how the planar conductors, conductive portions, wirings, and vias of the substrate are electrically connected, The substrate includes a conductor layer as a layer provided with the planar conductor expanded into a planar or mesh shape, a substrate surface provided with a plurality of the conductive portions, and a layer laminated on the conductor layer and A wiring layer of the layer between the substrate surfaces, a via hole connecting the wiring of the wiring layer to the plurality of conductive portions, and a connection between the wiring of the wiring layer and the planar conductor of the conductor layer Through holes, when there are a plurality of groups of the conductive parts that are mutually connected via the wiring of the wiring layer, execute the following inspection instruction information generation process: select a pair of the conductive from each of the groups The part serves as a first selection conductive part, and information representing the selected pairs of first selection conductive parts is generated as inspection instruction information.

In addition, the inspection instruction information generation program of an example of the present invention causes the computer to conduct electrical connection information indicating how the planar conductors, conductive portions, wirings, and vias of the substrate are electrically connected. The substrate includes: Or a mesh-like conductive conductor layer of the planar conductor layer, a substrate surface provided with the plurality of conductive portions, a wiring layer as a layer laminated between the conductor layer and the substrate surface, Through holes connecting the wiring of the wiring layer to the plurality of conductive portions, and through holes connecting the wiring of the wiring layer to the planar conductor of the conductor layer, when there are a plurality of When the group of the conductive parts that are connected to each other is connected to each other, the following inspection instruction information generation process is performed: a pair of the conductive parts from each group is selected as the first selected conductive part, and the The information of the selected pairs of first selection conductive parts is generated as inspection instruction information.

When there is a group of a plurality of conductive parts that are electrically connected to each other via the wiring of the wiring layer, even if a current flows between the conductive parts of a certain group, the current does not flow into other groups. Therefore, according to the above-mentioned configuration, when there are a plurality of groups of conductive parts that are mutually connected through the wiring of the wiring layer, by inspection instruction information generation processing, one of each group is selected from the groups according to the conductive structure information The pair of conductive parts serves as the first selection conductive part, and the information indicating the selected pairs of the first selection conductive parts is recorded as the inspection instruction information. Therefore, a pair of first selection conductive parts is selected from one group, and thus a plurality of pairs of first selection conductive parts belong to different groups. Therefore, even if a current flows into a plurality of pairs of the first selection conductive portions indicated by the inspection instruction information at the same time, the current will not be repeated. Therefore, a plurality of pairs of first selection conductive portions based on the inspection instruction information obtained in the above manner are used as inspection sites, whereby inspection of multiple locations can be performed at the same time, and as a result, it is easy to shorten the inspection time of the substrate.

In addition, it is preferable that the inspection instruction information generating process includes the following steps: (a) based on the conductive structure information, grouping the conductive portions that are mutually connected via the wiring of the wiring layer into groups with each other; and ( b) For the plurality of grouped groups, select two conductive parts from the conductive parts included in each group as the pair of first selection conductive parts, and The first selection conductive portion is set as an inspection site that can be inspected at the same time, and is recorded in the inspection instruction information.

According to this configuration, in (a), the conductive portions that are connected to each other via the wiring of the wiring layer are grouped with each other, that is, if a current is flowed into the plurality of conductive portion pairs, there is an overlap that generates a current path each other The possibility of conducting parts grouped with each other. In addition, in (b), for a plurality of grouped groups, that is, even if a current flows between pairs of conductive parts in the group, no overlap with the current paths of other groups will occur. A plurality of groups of the relationship are targeted, and two conductive parts are selected from the conductive parts included in each group as a pair of first selected conductive parts, and the selected pairs of first selected conductive parts are set It is recorded in the inspection instruction information for the inspection site that can be inspected at the same time. Therefore, a pair of first selection conductive parts is selected from one group, and thus a plurality of pairs of first selection conductive parts belong to different groups. Therefore, even if a current flows into a plurality of pairs of the first selection conductive portions indicated by the inspection instruction information at the same time, the current will not be repeated. Therefore, a plurality of pairs of first selection conductive portions based on the inspection instruction information obtained in the above manner are used as inspection sites, whereby inspection of multiple locations can be performed at the same time, and as a result, it is easy to shorten the inspection time of the substrate.

In addition, it is preferable that the step (b) further includes, when there is a group having a conductive portion that is not selected as the first selection conductive portion, for the group, the unselected The two conductive portions of the conductive portions of the first selection conductive portion are recorded as the pair of second selection conductive portions that should be inspected at different times from the pair of first selection conductive portions, and are recorded in the inspection instruction information.

According to this configuration, it is possible to reduce the risk of missing the conductive portion that is not selected as the first selection conductive portion from the inspection site.

In addition, it is preferable that the substrate includes multiple layers of the wiring layer, and further includes a plurality of through holes connecting the plurality of wiring layers, and the inspection instruction information generating section further performs the following steps: (d) In the case where the wires of the wiring layer are connected in parallel, before the step (a), the plurality of wires connected in parallel are replaced with the one closest to the substrate surface among the wires , Change the conductive structure information, and execute the inspection instruction information generation process based on the conductive structure information changed by the step (d).

According to this configuration, the conductive structure information is simplified, so the inspection instruction information generation process is executed based on the simplified conductive structure information. As a result, the execution of the inspection instruction information generation process becomes easy.

In addition, it is preferable that the inspection instruction information generating section further executes the following steps: (e) when the wiring and the row of the through holes are connected in parallel by the wiring and the planar conductor, Before the step (a), the conductive structure information changed by the step (d) is changed in such a manner that the parallel-connected through-hole or through-hole row is replaced with a through-hole or a row of through-holes, And based on the conductive structure information changed by the step (e), the inspection instruction information generating process is executed.

According to this configuration, the conductive structure information is simplified, so the inspection instruction information generation process is executed based on the simplified conductive structure information. As a result, the execution of the inspection instruction information generation process becomes easy.

In addition, it is preferable that the substrate includes multiple layers of the wiring layer, and further includes a plurality of through holes connecting the plurality of wiring layers, and the inspection instruction information generating section (f) divides the plurality of wiring layers , The wiring layer closest to the substrate surface as the processing target to perform the steps (a) and (b), (g) for the wiring layer other than the wiring layer closest to the substrate surface, the The other wiring layers are respectively processed. (g1) For each wiring of the wiring layer to be processed, corresponding to one of the wirings, the one connected to the side of the one wiring remote from the conductor layer A through hole, selecting one of the conductive parts electrically connected on the opposite side of the one through hole of the one through hole, thereby grouping the selected conductive parts for each corresponding wiring, (G2) For the grouped group in the step (g1), the step (b) is performed, and the step (b) combines the first selected conductive portion of each pair with the processing The object's wiring layer is correlated and recorded in the inspection instruction information.

According to this configuration, it is possible to record, in the inspection instruction information, the conductive portion pair that becomes the inspection site for inspecting the substrate including the plurality of wiring layers and the plurality of through holes connecting the plurality of wiring layers.

In addition, it is preferable that the step (b) starts from selecting the wiring layer close to the substrate surface as the processing target in the steps (f) and (g), and sequentially selecting the plurality of pairs of first The selected conductive part is sorted for each wiring layer and recorded in the inspection instruction information.

In general, the closer the substrate is to the substrate surface, the greater the number of wires provided in the wiring layer. The greater the number of wirings provided in the wiring layer, the greater the number of pairs of first selection conductive portions with respect to the wiring layer to be processed, that is, pairs of conductive portions that can simultaneously flow into the measurement current during inspection. Therefore, if the wiring layers close to the surface of the substrate are selected as the processing target, a plurality of pairs of first selection conductive parts are sequentially sorted for each wiring layer and recorded in the inspection instruction information, then the inspection can be carried out according to the inspection The order in which the instruction information is sorted selects the wiring layer to be inspected, and the measurement current flows into the first selection conductive portion pair corresponding to the wiring layer for inspection. If the inspection is performed in this way, the number of simultaneous inspections in the early stage of the inspection can be increased. If the number of simultaneous inspections at the initial stage of the inspection can be increased, defects in the substrate can be detected at the early stage of the inspection.

In addition, it is preferable that (h) for each through-hole connected to one side of the planar conductor, select one of the conductive portions electrically connected on the opposite side to the planar conductor, thereby applying this The selected conductive part is grouped as a conductive part corresponding to one side of the planar conductor, and two conductive parts are selected from the grouped conductive parts as a pair of first selected conductive parts, and the The selected pair of first selection conductive parts is recorded in the inspection instruction information.

According to this configuration, the through hole connected to the planar conductor can be inspected.

In addition, it is preferable that the inspection instruction information generating process further includes the following steps: (j) searching for the inclusion of the first selection conductive portion but not by the second selection conductive portion The wiring; and (k) a conductive portion that is connected to one end of the searched wiring without passing through the wiring, and a conductive portion that is connected to the other end of the wiring without passing through the wiring as the A pair of third selection conductive portions that are not simultaneously inspected for the first selection conductive portion are recorded in the inspection instruction information.

According to this configuration, it is possible to reduce the risk of omission of the recording of the inspection target portion of the inspection instruction information.

In addition, it is preferable that the substrate surface and the wiring layer are provided on both sides of the conductor layer, respectively, and the inspection instruction information generation unit performs the inspection instruction information generation process on both sides of the conductor layer.

According to this configuration, it is possible to generate inspection instruction information corresponding to the substrates provided with the substrate surface and the wiring layer on both sides of the conductor layer, respectively.

In addition, it is preferable that the substrate includes a plurality of the conductor layers and a through hole that connects the planar conductors of the plurality of conductor layers to each other, and the inspection instruction information generation process further includes the following steps: (L) One of the conductive portions on the substrate surface on one side of the two substrate surfaces and one of the conductive portions on the substrate surface on the other side should be different from the pair of first selective conductive portions A pair of fourth selection conductive parts that are inspected from time to time are recorded in the inspection instruction information.

According to this configuration, for a substrate including a plurality of conductor layers and a through-hole connecting the planar conductors of the plurality of conductor layers to each other, a pair of first 4. The selected conductive part is recorded in the inspection instruction information.

In addition, it is preferable that the inspection instruction information generating section further executes the following steps: (m) The via hole corresponds to a node, the wiring corresponds to a branch, and the planar conductor corresponds to a root node. This converts the conductive structure information into a tree structure data structure, and executes the inspection instruction information generation processing based on the conductive structure information converted into a tree structure by the (m) process.

According to this configuration, the conductive structure information is simplified, so the inspection instruction information generation process is executed based on the simplified conductive structure information. As a result, the execution of the inspection instruction information generation process becomes easy.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate based on the inspection instruction information. The inspection processing unit performs the following steps: (c1) A plurality of pairs of first selection conductive portions indicated by the inspection instruction information, simultaneously performing a first current supply process that causes current to flow between the pair of first selection conductive portions, and detecting the pair of first selection conductive portions Voltage, based on the current and the voltage, inspect the through holes and wiring of the current path between the first selected conductive portions of each pair.

According to this configuration, the first current supply process is simultaneously performed on a plurality of pairs of first selection conductive portions based on the inspection instruction information, thereby avoiding repetition of the measurement current, and simultaneously performing inspections at multiple locations, as a result, the substrate is easily shortened Inspection time.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate based on the inspection instruction information. The inspection processing unit performs the following steps: (c1) A plurality of pairs of first selection conductive portions indicated by the inspection instruction information, simultaneously performing a first current supply process that causes current to flow between the pair of first selection conductive portions, and detecting the pair of first selection conductive portions Voltage, based on the current and the voltage, checking the through-holes and wiring of the current path between the first selection conductive portions of each pair; and (c2) performing the execution differently from the first current supply process Current flows into the second current supply process between the pair of second selection conductive parts indicated by the inspection instruction information, and detects the voltage between the pair of second selection conductive parts, based on the current and the voltage To inspect the through holes and wiring of the current path between the paired second selection conductive portions.

According to this configuration, it is possible to perform inspection of the through hole or the wiring on the current path connected to the conductive portion that is not selected as the first selection conductive portion.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, and the inspection processing unit according to the inspection instruction information In sequence, the following steps are performed for each wiring layer: (c1) For a plurality of pairs of first selection conductive portions indicated by the inspection instruction information, a first flow of current between the paired first selection conductive portions is performed at the same time Current supply processing, and detecting the voltage between the pair of first selection conductive parts, and checking the through holes and wiring of the current path between the pair of first selection conductive parts based on the current and the voltage, When the result of the inspection of the (c1) step is defective, the (c1) step for the wiring layer whose sequence is next to the following is not executed.

According to this configuration, since the person approaching the surface of the substrate, the wiring layer is sequentially inspected as the processing target, whereby the defect of the substrate can be detected early in the inspection. In addition, in the case where the result of the inspection is bad, the inspection of the wiring layer in the next and subsequent order is not performed. As a result, the defect is quickly detected and the inspection is ended at the time when the defect is detected, so it is easy to shorten the inspection time.

In addition, a substrate inspection system according to an example of the present invention includes the inspection instruction information generating device and an inspection processing unit that inspects the substrate based on the inspection instruction information. The inspection processing unit performs the following steps: (c1) A plurality of pairs of first selection conductive portions indicated by the inspection instruction information, simultaneously performing a first current supply process that causes current to flow between the pair of first selection conductive portions, and detecting the pair of first selection conductive portions Voltage, based on the current and the voltage, check the through holes and wiring of the current path between the first selected conductive portions of each pair, and in the step (c1), simultaneously execute The instruction information is checked to determine the first current supply process of the plurality of pairs of first selection conductive portions corresponding to one side of the conductor layer, and to the corresponding position of the other side of the conductor layer The first current supply process of the plurality of pairs of first selection conductive parts.

According to this configuration, when inspecting the substrate provided with the substrate surface and the wiring layer on both sides of the conductor layer, the inspection on one side of the conductor layer and the inspection on the other side can be performed at the same time, so it is easy to shorten the inspection time.

That is, the inspection instruction information generation device, inspection instruction information generation method, and inspection instruction information generation program of such a configuration can generate the inspection instruction information as follows: indicating an inspection site that is easy to shorten the inspection time of the substrate. In addition, the substrate inspection system of such a configuration is easy to shorten the inspection time of the substrate.

This application is based on Japanese Patent Application No. 2018-172302 filed on September 14, 2018, and the contents thereof are included in this application. In addition, the specific embodiments or examples used in the first embodiment always clarify the technical content of the present invention, and the present invention should not be limited to such specific examples for narrow interpretation.

1: substrate inspection system 2: substrate inspection device 3: inspection instruction information generating device 4U, 4L: measuring jig 12: measuring block 13: scanner unit 20: control unit 21: inspection processing unit 22, 32: storage unit 31: Inspection instruction information generating part 110: substrate fixing device 112: frame 121, 122: measuring part 125: moving mechanism B, B1 to B5, WB1, WB2: substrate BS, BS1, F1, F2: substrate surface BS2: contact surface CS , CM: power supply D1, D1', D1'': conductive structure information D2: inspection instruction information +F, -F: current terminals Fip1, Fip2: flags I, I ₁ , I ₂ : current IP, IPa, IPd : Planar conductors L, L1, L2, L4: wiring layer Lc: conductor layer LL1: first selection layer LL2: second selection layer (selection layer) LT1, LT2: inspection layers M, M11 to M14, M21 to M23, M41～M47, Mr1～Mr6: branch MB: intermediate substrate MP: metal plates N, N11, N12, N21, N41, N42: node NR: root node P, P1～P7, P11～P17, PA, PB, PA1～ PF1, PA2 to PF2: conductive parts Pr: probes R1 to R4: resistances RA to RF, V, V11 to V17, V21 to V27, V31 to V36, V41 to V45, V51 to V57, Vc: through hole +S, -S: Voltage detection terminal T1: One end T2: The other end VM: Voltage detection section W, W11, W12, W21, W22, W41 to W45: Wiring WB: Multilayer substrates S1 to S7, S11 to S16, S17 to S24, S26 , S27, S51 to S55, S61 to S66, S71 to S74, S101 to S106, S301 to S303, S401 to S403, S501 to S507: Steps

FIG. 1 is a schematic diagram conceptually showing the configuration of a substrate inspection system 1 according to an embodiment of the present invention. FIG. 2 is a block diagram showing an example of the electrical configuration of the measurement unit shown in FIG. 1. 3 is a cross-sectional view showing an example of a substrate to be inspected. 4 is a plan view showing an example of a substrate to be inspected. FIG. 5 is a diagram illustrating an example of the conductive structure information D1′ obtained by simplifying the conductive structure information D1 of the substrate B shown in FIG. 3. FIG. 6 is a diagram illustrating the use of a tree structure to express the conductive structure information D1 ″ of the conductive structure information D1 ′ shown in FIG. 5. 7 is a flowchart showing an example of the operation of an inspection instruction information generation method and an inspection instruction information generation device using the inspection instruction information generation method according to an embodiment of the present invention. 8 is a flowchart showing an example of the operation of an inspection instruction information generation method and an inspection instruction information generation device using the inspection instruction information generation method according to an embodiment of the present invention. 9 is a flowchart showing an example of the operation of an inspection instruction information generation method and an inspection instruction information generation device using the inspection instruction information generation method according to an embodiment of the present invention. 10 is a flowchart showing an example of the operation of a substrate inspection method according to an embodiment of the present invention and a substrate inspection apparatus using the substrate inspection method. 11 is a flowchart showing an example of the first step of the inspection instruction information generating method according to an embodiment of the present invention. 12 is a flowchart showing an example of processing related to a branch connected to a root node in the method for generating inspection instruction information according to an embodiment of the present invention. 13 is a flowchart showing an example of processing related to a branch connected to a root node in the inspection instruction information generating method according to an embodiment of the present invention. 14 is a flowchart showing an example of a second step of the method for generating inspection instruction information according to an embodiment of the present invention. Fig. 15 is a partially enlarged view of Fig. 5. FIG. 16 is an explanatory diagram showing another example of the conductive structure information D1″ shown in FIG. 6. 17 is an explanatory diagram showing another example of the substrate shown in FIG. 3. 18 is an explanatory diagram showing a table format of an example of inspection instruction information. FIG. 19 is a flowchart showing an example of the operation of the substrate inspection apparatus shown in FIG. 1. 20 is a flowchart showing an example of the operation of the substrate inspection apparatus shown in FIG. 1. 21 is a flowchart showing an example of the operation of the substrate inspection apparatus shown in FIG. 1. 22 is a conceptual schematic diagram showing an example of a substrate including a planar conductor. 23 is a conceptual schematic diagram showing an example of a substrate including planar conductors. FIG. 24 is an explanatory diagram for explaining a measurement method of measuring the resistance values of the through holes and the planar conductor IP of the multilayer substrate WB shown in FIG. 22.

S101~S106: Steps

Claims (18)

An inspection instruction information generating device is an inspection instruction information generating device for inspecting a substrate, the substrate including a conductor layer as a layer provided with a conductive planar conductor expanded into a planar or mesh shape, Substrate surface of each conductive portion, a wiring layer as a layer laminated between the conductor layer and the substrate surface, a via hole connecting the wiring of the wiring layer to the conductive portion, and the wiring layer The through hole of the wiring of the conductor and the planar conductor of the conductor layer, the inspection instruction information generating device includes: A storage part, storing conductive structure information indicating how the planar conductor, the conductive part, the wiring, and the through hole of the substrate are conductively connected; and The inspection instruction information generating section, when there are a plurality of groups of the conductive sections that are mutually connected via the wiring of the wiring layer, perform the following inspection instruction information generation processing based on the conductive structure information: Each group selects one pair of the conductive parts as the first selection conductive part, and records information indicating the selected pairs of the first selection conductive parts as inspection instruction information. The inspection instruction information generation device as described in item 1 of the patent application scope, wherein the inspection instruction information generation processing includes the following steps: (A) grouping the conductive parts that are connected to each other via the wiring of the wiring layer based on the conductive structure information; and (B) For the plurality of grouped groups, select two conductive parts from the conductive parts included in each group as the pair of first selection conductive parts, and The selected multiple pairs of the first selection conductive portions are set as inspection sites that can be inspected simultaneously and recorded in the inspection instruction information. The inspection instruction information generating device as described in item 2 of the patent application scope, wherein the step (b) further proceeds in the case where there is a group of conductive parts not selected as the first selection conductive part In the group, two conductive portions including the conductive portion that is not selected as the first selected conductive portion are used as a pair of second selected conductive portions that should be inspected at different times from the multiple pairs of first selected conductive portions , Recorded in the inspection instruction information. The inspection instruction information generating device according to item 2 or item 3 of the patent application scope, wherein the substrate includes a plurality of the wiring layers, and further includes a plurality of through holes connecting the plurality of wiring layers, The inspection instruction information generating unit further executes the following process: (d) in the case where the wirings of the plurality of wiring layers are connected in parallel, before the (a) process, to connect the plurality of parallel connected Replacing the wiring with the one closest to the substrate surface among the wirings, changing the conductive structure information, and Based on the conductive structure information changed by the step (d), the inspection instruction information generating process is executed. The inspection instruction information generating device as described in item 4 of the patent application scope, wherein the inspection instruction information generating section further performs the following steps: (e) by connecting the wiring and the planar conductor If the rows of holes or through-holes are connected in parallel, before the step (a), replace the rows of through-holes or through-holes connected in parallel with one through-hole or row of through-holes. Information of the conductive structure changed in the step (d), and Based on the conductive structure information changed by the step (e), the inspection instruction information generating process is executed. The inspection instruction information generating device according to any one of claims 2 to 5, wherein the substrate includes multiple layers of the wiring layer, and further includes a plurality of through holes connecting the plurality of wiring layers , The inspection instruction information generating unit (f) executes the steps (a) and (b) using the wiring layer closest to the substrate surface among the plurality of wiring layers as a processing target, (G) For other wiring layers other than the wiring layer closest to the substrate surface, the other wiring layers are respectively treated as objects, (G1) For each wiring of the wiring layer to be processed, corresponding to one of the wirings, for one through hole connected to the side of the one wiring away from the conductor layer, select one of the The conductive portions of the through holes electrically connected to the opposite side of the wiring, thereby grouping the selected conductive portions for each corresponding wiring, (G2) For the grouped group in the (g1) process, perform the (b) process, and In the step (b), the first selection conductive portion of each pair is associated with the wiring layer to be processed and recorded in the inspection instruction information. The inspection instruction information generating device according to item 6 of the patent application scope, wherein the step (b) is selected from the steps (f) and (g), and the wiring layer close to the substrate surface is selected as the process Starting from the target person, the pairs of first selection conductive portions are sequentially sorted for the respective wiring layers and recorded in the inspection instruction information. The inspection instruction information generating device according to any one of the items 1 to 7 of the patent application scope, wherein (h) for each through hole connected to one side of the planar conductor, select one The conductive portion electrically connected to the opposite side of the planar conductor, thereby grouping the selected conductive portion as a conductive portion corresponding to one side of the planar conductor, from the group Two conductive parts are selected as a pair of first selection conductive parts among the converted conductive parts, and the selected pair of first selection conductive parts are recorded in the inspection instruction information. The inspection instruction information generation device as described in item 3 of the patent application scope, wherein the inspection instruction information generation processing further includes the following steps: (J) Explore the wiring that is not sandwiched by the first selection conductive portion and not sandwiched by the second selection conductive portion; and (K) A conductive portion that is connected to one end of the searched wiring without passing through the wiring, and a conductive portion that is connected to the other end of the wiring without passing through the wiring are regarded as A pair of third selection conductive portions that are not simultaneously checked by the selection conductive portion are recorded in the inspection instruction information. The inspection instruction information generating device according to any one of items 1 to 9 of the patent application scope, wherein the substrate surface and the wiring layer are provided on both sides of the conductor layer, and The inspection instruction information generation unit performs the inspection instruction information generation process on both sides of the conductor layer. The inspection instruction information generating device according to item 10 of the patent application range, wherein the substrate includes a plurality of the conductor layers, and a through hole connecting the planar conductors of the plurality of conductor layers to each other, and The inspection instruction information generation processing further includes the following steps: (L) One of the conductive portions on the substrate surface on one side of the two substrate surfaces and one of the conductive portions on the substrate surface on the other side should be different from the pair of first selective conductive portions A pair of fourth selection conductive parts that are inspected from time to time are recorded in the inspection instruction information. The inspection instruction information generating device according to any one of the first to eleventh items of the patent application scope, wherein the inspection instruction information generating section further performs the following process: (m) making the through hole correspond to a node, Making the wiring correspond to a branch, and making the planar conductor correspond to a root node, thereby converting the conductive structure information into a tree structure data structure, and Based on the conductive structure information converted into a tree structure by the (m) process, the inspection instruction information generation process is performed. A substrate inspection system, including: The inspection instruction information generating device as described in any one of items 1 to 12 of the patent application scope; and The inspection processing unit inspects the substrate according to the inspection instruction information; and The inspection processing unit performs the following steps: (C1) For a plurality of pairs of first selection conductive portions indicated by the inspection instruction information, a first current supply process that causes current to flow between the pair of first selection conductive portions is simultaneously performed, and the paired first selection is detected The voltage between the conductive parts is selected, and the through holes and wiring of the current path between the first selected conductive parts of the pairs are inspected based on the current and the voltage. A substrate inspection system, including: The inspection instruction information generating device as described in item 3 of the patent application scope; and The inspection processing unit inspects the substrate according to the inspection instruction information; and The inspection processing unit performs the following steps: (C1) For a plurality of pairs of first selection conductive portions indicated by the inspection instruction information, a first current supply process that causes current to flow between the pair of first selection conductive portions is simultaneously performed, and the paired first selection is detected Selecting the voltage between the conductive parts, and checking the through holes and wiring of the current path between the first selected conductive parts of each pair based on the current and the voltage; and (C2) The second current supply process that causes a current to flow between the pair of second selection conductive portions indicated by the inspection instruction information is not performed at the same time as the first current supply process, and the paired first Two select the voltage between the conductive parts, and check the through holes and wiring of the current path between the pair of second selected conductive parts based on the current and the voltage. A substrate inspection system, including: The inspection instruction information generating device as described in item 7 of the patent application scope; and The inspection processing section inspects the substrate according to the inspection instruction information; The inspection processing section performs the following steps for each wiring layer in the order indicated by the inspection instruction information: (c1) For multiple pairs of first selection conductive portions indicated by the inspection instruction information, simultaneously executes A current flows into the first current supply process between the pair of first selection conductive parts, and the voltage between the pair of first selection conductive parts is detected, and based on the current and the voltage, the first A via hole and wiring for selecting a current path between conductive parts, and When the result of the inspection of the (c1) step is defective, the (c1) step for the wiring layer whose sequence is next to the following is not executed. A substrate inspection system, including: The inspection instruction information generating device as described in item 10 of the patent application scope; and The inspection processing section inspects the substrate according to the inspection instruction information; The inspection processing section executes the following steps: (c1) For a plurality of pairs of first selection conductive sections indicated by the inspection instruction information, a first current supply process that causes current to flow between the paired first selection conductive sections is simultaneously performed And detect the voltage between the pair of first selection conductive parts, and check the through holes and wiring of the current path between the first selection conductive parts of each pair based on the current and the voltage, and In the step (c1), the first current supply process for the plurality of pairs of first selection conductive portions that correspond to one side of the conductor layer by the inspection instruction information, And the first current supply process for the pairs of first selection conductive portions that correspond to the other side of the conductor layer. A method for generating inspection instruction information includes an inspection instruction information generation process, the inspection instruction information generation process based on conductive structure information indicating how a planar conductor, a conductive portion, a wiring, and a via of a substrate are electrically connected. The substrate includes: A conductor layer provided with a layer of conductive planar conductors expanded into a planar or mesh shape, a substrate surface provided with a plurality of the conductive portions, and a layer laminated on the conductor layer and the substrate surface A wiring layer of an interlayer, a through hole connecting the wiring of the wiring layer to the plurality of conductive portions, and a through hole connecting the wiring of the wiring layer to the planar conductor of the conductor layer, When there are a plurality of groups of the conductive parts that are mutually connected via the wiring of the wiring layer, the following inspection instruction information generation process is performed: a pair of the conductive parts is selected from each group as the The first selection conductive part, and generates information indicating the selected pairs of first selection conductive parts as inspection instruction information. An inspection instruction information generating program that causes a computer to provide information on the conductive structure indicating how the planar conductors, conductive portions, wiring, and through holes of the substrate are connected. The substrate includes: Conductive layer of the planar conductor layer, a substrate surface provided with a plurality of conductive portions, a wiring layer as a layer laminated between the conductor layer and the substrate surface, the wiring layer Through holes that connect the wiring to the plurality of conductive portions, and through holes that connect the wiring of the wiring layer to the planar conductor of the conductor layer, When there are a plurality of groups of the conductive parts that are mutually connected via the wiring of the wiring layer, the following inspection instruction information generation process is performed: a pair of the conductive parts is selected from each group as the The first selection conductive part, and generates information indicating the selected pairs of first selection conductive parts as inspection instruction information.

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