KR20210060542A - Inspection instruction information generating device, board inspection system, inspection instruction information generating method and inspection instruction information generating program - Google Patents

Abstract

A planar conductor (IP) and a conductive portion (P) in a substrate including a conductor layer (Lc), a substrate surface (F) provided with a plurality of conductive portions (P), a wiring layer (L), and a via (V). ), on the basis of the conductive structure information D1 indicating how the wiring W and the via V are connected to each other through the wiring W of the wiring layer L, there are a plurality of groups of conductive portions P that are connected to each other through the wiring W of the wiring layer L. If there is, test instruction information generation that selects a pair of conductive parts P from the respective groups as a first select conductive part, and generates information indicating the selected plurality of pairs of first select conductive parts as test instruction information D2. The process was made to run.

Description

Inspection instruction information generating device, board inspection system, inspection instruction information generating method and inspection instruction information generating program

The present invention relates to an inspection instruction information generating apparatus for generating inspection instruction information for instructing an inspection point when inspecting a substrate, a substrate inspection system for performing inspection using the inspection instruction information, a method for generating inspection instruction information, and inspection instruction information It relates to the generation program.

When making a measurement object that penetrates from one surface to the other surface of a circuit board, such as a via provided in a conventional circuit board, by passing a measurement current through the measurement object and measuring the voltage generated in the measurement object, the A substrate inspection apparatus is known that measures the resistance value of the object to be measured from a current value and a voltage value (see, for example, Patent Document 1).

Japanese Patent Application Publication No. 2012-117991

By the way, in a board having a conductor widening in a planar shape (hereinafter referred to as a planar conductor), conductive portions such as pads, bumps, and wiring on the surface of the substrate and the planar conductor are electrically connected in the thickness direction of the substrate. There is a substrate of the structure.

22 is a conceptual schematic diagram showing a multilayer substrate WB, which is an example of a substrate including a planar conductor IP, which is a conductor pattern widening in a planar shape, on an inner layer of the substrate. In the multilayer substrate WB shown in FIG. 22, conductive portions PA and PB such as pads and wiring patterns are provided on the substrate surface BS. The conductive portions PA and PB are electrically connected to the planar conductor IP by vias RA and RB. In the example of the multilayer substrate WB, the planar conductor IP corresponds to the planar conductor.

Further, as a method of manufacturing a substrate, there is a method of forming two printed wiring boards by laminating and forming a printed wiring board on both sides of the metal plate based on a conductive metal plate, and peeling the formed substrate from the underlying metal plate. In such a method of manufacturing a substrate, the substrate in a state before the substrate is peeled from the underlying metal plate (hereinafter referred to as an intermediate substrate) has a mode in which the metal plate is sandwiched between two substrates. This intermediate substrate is also referred to as a carrier substrate.

23 is a conceptual schematic diagram showing an example of such an intermediate substrate MB. In the intermediate substrate MB shown in FIG. 23, a substrate WB1 is provided on one surface of the metal plate MP, and a substrate WB2 is provided on the other surface of the metal plate MP. Conductive portions PA1, PB1, ..., PF1 such as pads and wiring patterns are provided on the substrate surface BS1 of the substrate WB1. Conductive portions PA2, PB2, ..., PF2 such as pads and wiring patterns are provided on the contact surface BS2 of the substrate WB1 with the metal plate MP. The metal plate MP is, for example, a metal plate having conductivity of about 1 mm to 10 mm in thickness.

The conductive parts PA1 to PF1 are electrically connected to the conductive parts PA2 to PF2 by vias RA to RF. Since the conductive parts PA2 to PF2 are in close contact with the metal plate MP and are in conduction, the conductive parts PA1 to PF1 are electrically connected to the metal plate MP by vias RA to RF. The conductive portion PA1 and the via RA are paired, the conductive portion PB1 and the via RB are paired, and the conductive portion and the via are paired, respectively. Since the substrate WB2 is configured similarly to the substrate WB1, its description will be omitted. In the example of the intermediate substrate MB, the metal plate MP corresponds to a planar conductor.

As an inspection of the multilayer substrate WB or the intermediate substrate MB, the resistance values Ra and Rb of the vias RA and RB may be measured in some cases.

In Fig. 24, the resistance of the equivalent resistance of the planar conductor IP is indicated by R1 to R4. In order to measure the resistance values Ra and Rb of the vias RA and RB, a measurement current I is passed between the conductive part PA1 and the conductive part PB1, and between the conductive part PA1 and the conductive part PB1. It is considered that the generated voltage V is measured and the resistance value is calculated as V/I. Thereby, by V/I, the resistance values Ra and Rb of the two vias RA and RB on the current path from the conductive part PA1 to the conductive part PB1 and the resistance R1 of the planar conductor IP The sum of the resistance values R ₁ of is obtained.

Here, in FIG. 24, the conductive parts PA1 to PE1 are described in a straight line and side by side due to the circumstances of the paper. However, in an actual substrate, the conductive portions PA1 to PE1 are two-dimensionally distributed and disposed on the substrate surface. Therefore, when a pair of conductive parts (PA1, PC1) is selected and the current I ₁ is passed for resistance measurement, and the other pair of conductive parts (PB1, PD1) is selected and the current I ₂ is passed, the current I ₁ , There are cases where redundancy occurs in the current path of I _2.

In the example shown in Fig. 24, current overlap occurs in the resistor R2. In this case, the voltage between the conductive parts PA1 and PC1 is V=I ₁ (Ra+R ₁ +R ₂ +Rc)+I ₂ R ₂ . If I ₁ =I ₂ , then V/I ₁ =(Ra+R ₁ +R ₂ +Rc)+R ₂ , so the resistance to the resistance value to be measured (Ra+R ₁ +R ₂ +Rc) As a result of obtaining a resistance value to which the value R ₂ has been added, the resistance measurement accuracy is degraded.

Therefore, there has been a problem that the inspection time of the entire substrate must be increased because the inspection must be performed one by one between a pair of conductive portions so as not to cause overlapping of the current for measurement.

An object of the present invention is an inspection instruction information generating device for generating inspection instruction information indicating an inspection point where it is easy to shorten the inspection time of a substrate, a substrate inspection system including the inspection instruction information generating device, and a method for generating inspection instruction information , And inspection instruction information generation program.

An apparatus for generating inspection instruction information according to an example of the present invention includes a conductor layer, which is a layer provided with a conductive planar conductor that expands in a planar shape, a substrate surface on which a plurality of conductive parts are provided, and a wiring layer that is a layer laminated between the conductor layer and the substrate surface. And, a via connecting the wiring of the wiring layer and the plurality of conductive portions, and a via connecting the wiring of the wiring layer and the planar conductor of the conductor layer, wherein the planar conductor, the conductive portion, the wiring, and When there is a storage unit storing conductive structure information indicating how the vias are connected to each other, and a plurality of groups of the conductive parts that are connected to each other through the wiring of the wiring layer, based on the conductive structure information, the respective An inspection instruction information generation unit is provided for performing inspection instruction information generation processing in which the conductive portions are selected from the group as a first selected conductive portion pair by pair, and information indicating the selected plurality of pairs of first selected conductive portions is recorded as inspection instruction information. do.

Further, a substrate inspection system according to an example of the present invention includes the above-described inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, and the inspection processing unit includes (c1) the inspection instruction information. For a plurality of pairs of first selective conductive portions indicated by the instruction information, a first current supply process for passing current between the paired first selective conductive portions is executed in parallel, and the voltage between the paired first selective conductive portions Is detected, and based on the current and voltage, a process of inspecting vias and wirings in the current paths between the first selected conductive portions of each pair is performed.

Further, a substrate inspection system according to an example of the present invention includes the above-described inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, and the inspection processing unit includes (c1) the inspection instruction information. For a plurality of pairs of first selective conductive portions indicated by the instruction information, a first current supply process for passing current between the paired first selective conductive portions is executed in parallel, and the voltage between the paired first selective conductive portions And, based on the current and voltage, a step of inspecting vias and wirings of the current paths between the first selected conductive portions of each pair, and (c2) a second selection consisting of a pair indicated by the inspection instruction information. A second current supply process in which a current flows between the conductive parts in parallel to the first current supply process is executed, a voltage between the second selected conductive parts in the pair is detected, and based on the current and voltage, A step of inspecting the vias and wirings of the current path between the paired second selective conductive portions is performed.

Further, a substrate inspection system according to an example of the present invention includes the above-described inspection instruction information generating device and an inspection processing unit that inspects the substrate based on the inspection instruction information, and the inspection processing unit includes the inspection instruction information For each of the wiring layers according to the order indicated by (c1), a first current supply process of passing a current between the pair of first selected conductive parts with respect to the plurality of pairs of first selected conductive parts indicated by the inspection instruction information is performed in parallel. A step of detecting a voltage between the paired first selective conductive portions, and inspecting vias and wirings of the current paths between the pair of first selective conductive portions based on the current and voltage, If the inspection result of the step (c1) is defective, the step (c1) is not performed for the wiring layer whose order is next or later.

Further, a substrate inspection system according to an example of the present invention includes the above-described inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, and the inspection processing unit includes (c1) the inspection instruction information. For a plurality of pairs of first selective conductive portions indicated by the instruction information, a first current supply process for passing current between the paired first selective conductive portions is executed in parallel, and the voltage between the paired first selective conductive portions And, based on the current and voltage, a step of inspecting vias and wirings of the current path between the first selected conductive portions of each pair is performed, and in the step (c1), according to the inspection instruction information The first current supply processing to the plurality of pairs of first selective conductive portions corresponding to one side of the conductor layer, and the plurality of pairs of first selective conductive portions corresponding to the other side of the conductor layer. The first current supply process is executed in parallel.

In addition, the method of generating inspection instruction information according to an example of the present invention includes a conductor layer, which is a layer provided with a conductive planar conductor that expands in a planar shape, a substrate surface provided with a plurality of conductive parts, and stacked between the conductor layer and the substrate surface. The planar conductor, the conductive portion, and the above in a substrate having a wiring layer serving as a layer, a via connecting the wiring of the wiring layer and the plurality of conductive portions, and a via connecting the wiring of the wiring layer and the planar conductor of the conductor layer. When there are a plurality of groups of the conductive parts that are connected to each other through the wiring of the wiring layer, based on the conductive structure information indicating how the wiring and the via are connected to each other, the conductive part is first selected from each of the groups. And an inspection instruction information generation step of performing inspection instruction information generation processing for selecting a pair of conductive portions at a time and generating information indicating the selected plurality of pairs of first selected conductive portions as inspection instruction information.

1 is a schematic diagram conceptually showing a configuration of a substrate inspection system 1 according to an embodiment of the present invention.
FIG. 2 is a block diagram showing an example of an electrical configuration of a measurement unit shown in FIG. 1.
3 is a cross-sectional view showing an example of a substrate to be inspected.
4 is a plan view showing an example of a substrate to be inspected.
FIG. 5 shows an example of the conductive structure information D1' in which the conductive structure information D1 of the substrate B shown in FIG. 3 is simplified.
FIG. 6 shows the conductive structure information D1'' in which the conductive structure information D1' shown in FIG. 5 is expressed by a tree structure.
7 is a flowchart showing an example of the operation of the inspection instruction information generating method according to the embodiment of the present invention, and the inspection instruction information generating apparatus using the inspection instruction information generating method.
8 is a flowchart showing an example of the operation of the inspection instruction information generating method according to the embodiment of the present invention and the inspection instruction information generating apparatus using the inspection instruction information generating method.
9 is a flowchart showing an example of the operation of the inspection instruction information generating method according to the embodiment of the present invention and the inspection instruction information generating apparatus using the inspection instruction information generating method.
10 is a flowchart showing an example of an operation of a substrate inspection method according to an embodiment of the present invention, and a substrate inspection apparatus using the substrate inspection method.
11 is a flowchart showing an example of a first step in a method for generating inspection instruction information according to an embodiment of the present invention.
12 is a flowchart showing an example of processing related to a branch connected to a root node in a method for generating inspection instruction information according to an embodiment of the present invention.
13 is a flowchart showing an example of processing related to a branch connected to a root node in a method for generating inspection instruction information according to an embodiment of the present invention.
14 is a flowchart showing an example of a second step in the method for generating inspection instruction information according to an embodiment of the present invention.
15 is a partially enlarged view of FIG. 5.
16 is an explanatory diagram showing another example of the conductive structure information D1″ shown in FIG. 6.
17 is an explanatory diagram showing another example of the substrate shown in FIG. 3.
18 is an explanatory diagram in tabular form showing an example of inspection instruction information.
19 is a flowchart showing an example of the operation of the substrate inspection apparatus shown in FIG. 1.
20 is a flowchart showing an example of the operation of the substrate inspection apparatus shown in FIG. 1.
21 is a flowchart showing an example of the operation of the substrate inspection apparatus shown in FIG. 1.
22 is a conceptual schematic diagram showing an example of a substrate provided with a planar conductor.
23 is a conceptual schematic diagram showing an example of a substrate provided with a planar conductor.
FIG. 24 is an explanatory view for explaining a measurement method for measuring the resistance values of the vias and planar conductor IP of the multilayer substrate WB shown in FIG. 22.

Hereinafter, embodiments according to the present invention will be described based on the drawings. In addition, configurations denoted with the same reference numerals in each drawing indicate the same configuration, and description thereof will be omitted. The substrate inspection system 1 shown in FIG. 1 includes an inspection instruction information generating device 3 and a substrate inspection device 2.

The inspection instruction information generating device 3 shown in FIG. 1 includes an inspection instruction information generating unit 31 and a storage unit 32. The inspection instruction information generation device 3 is configured using a computer such as a personal computer, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, and a random access memory (RAM) that temporarily stores data. ), a nonvolatile memory device such as a hard disk drive (HDD) and/or a flash memory, a communication circuit, and peripheral circuits thereof.

Then, the inspection instruction information generating device 3 functions as the inspection instruction information generating unit 31, for example, by executing the inspection instruction information generating program according to the embodiment of the present invention stored in the nonvolatile memory device. do. The storage unit 32 is configured using, for example, the nonvolatile memory device described above.

The conductive structure information D1 is stored in the storage unit 32. The conductive structure information D1 may be transmitted from the outside to the inspection instruction information generating device 3 through, for example, a communication circuit (not shown), so that the transmitted conductive structure information D1 may be stored in the storage unit 32, for example. For example, by reading the conductive structure information D1 stored in a storage medium such as a USB (Universal Serial Bus) memory, the inspection instruction information generating device 3, the conductive structure information D1 may be stored in the storage unit 32, or in various ways. The conductive structure information D1 can be stored in the storage unit 32.

The conductive structure information D1 is information showing how the planar conductor IP, the conductive portion P, the wiring W and the via V of each wiring layer L of the substrate B described later are electrically connected. As the conductive structure information D1, for example, so-called Gerber data and/or a netlist used for manufacturing a substrate can be used.

The inspection instruction information generation unit 31 generates inspection instruction information D2 for instructing the pair of conductive portions P to pass current to the substrate inspection apparatus 2 for inspection, based on the conductive structure information D1. do. The inspection instruction information generation unit 31 may transmit the inspection instruction information D2 to the substrate inspection apparatus 2 through a communication circuit (not shown), for example. Alternatively, the inspection instruction information generation unit 31 may write inspection instruction information D2 to the storage medium. Then, the user may have the substrate inspection apparatus 2 read the inspection instruction information D2 from the storage medium. Details of the operation of the inspection instruction information generation unit 31 will be described later.

The board|substrate inspection apparatus 2 shown in FIG. 1 is an apparatus for inspecting the board|substrate B which is a board|substrate to be inspected to be inspected.

The substrate (B) is, for example, an intermediate substrate or a multilayer substrate, such as a printed wiring substrate, a film carrier, a flexible substrate, a ceramic multilayer wiring substrate, a semiconductor substrate such as a semiconductor chip and a semiconductor wafer, a package substrate for a semiconductor package, a liquid crystal display, or Electrode plates for plasma displays, intermediate substrates in the process of manufacturing these substrates, or so-called carrier substrates may be used. The multilayer substrate WB shown in FIG. 22 and the intermediate substrate MB shown in FIG. 23 correspond to an example of the substrate B as a substrate to be inspected.

The substrate inspection apparatus 2 shown in FIG. 1 has a housing 112. In the inner space of the housing 112, a substrate fixing device 110, a measurement unit 121, a measurement unit 122, a moving mechanism 125, and a control unit 20 are mainly provided. The substrate fixing device 110 is configured to fix the substrate B at a predetermined position.

The measurement unit 121 is positioned above the substrate B fixed to the substrate fixing device 110. The measurement unit 122 is located under the substrate B fixed to the substrate fixing device 110. The measurement units 121 and 122 are provided with measurement jigs 4U and 4L for bringing the probe into contact with a plurality of conductive portions provided on the substrate B.

A plurality of probes Pr are provided in the measuring jigs 4U and 4L. The measurement jig 4U, 4L arranges and holds a plurality of probes Pr so as to correspond to the arrangement of the conductive portion to be measured provided on the surface of the substrate B. The movement mechanism 125 appropriately moves the measurement units 121 and 122 within the housing 112 in accordance with a control signal from the control unit 20, so that the probe Pr of the measurement jig 4U, 4L is mounted on the substrate. Make contact with each of the conductive parts in (B).

Further, the substrate inspection apparatus 2 may be provided with only one of the measurement portions 121 and 122, and the substrate B may have a conductive portion provided only on one side. Moreover, the board|substrate inspection apparatus 2 may make the board|substrate to be inspected inverted front and back by either measuring part, and may make it measure both sides.

The control unit 20 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, and a ROM (Read Only Memory) that stores a predetermined control program. ), a nonvolatile storage unit 22 such as a hard disk drive (HDD), and peripheral circuits thereof. Then, the control unit 20 functions as the inspection processing unit 21 by executing the control program stored in the storage unit 22, for example.

The measurement unit 121 shown in Fig. 2 includes a scanner unit 13, a plurality of measurement blocks 12, and a plurality of probes Pr. In addition, since the measurement part 122 is comprised similarly to the measurement part 121, its description is abbreviate|omitted.

The measurement block 12 includes power supply units CS and CM and a voltage detection unit VM. The power supply units CS and CM are constant current circuits that output a current I according to a control signal from the control unit 20. The power supply unit CS flows a current I in the direction supplied to the scanner unit 13, and the power supply unit CM flows a current I in the direction drawn from the scanner unit 13. The voltage detection unit VM is a voltage detection circuit that measures a voltage and transmits the voltage value to the control unit 20.

The scanner unit 13 is a switching circuit configured using, for example, a switching element such as a transistor or a relay switch. The scanner unit 13 includes current terminals +F and -F for supplying a current I for resistance measurement to the substrate B, and a voltage detection for detecting a voltage generated between the conductive portions of the substrate B by the current I. A plurality of terminals +S and -S are provided corresponding to the plurality of measurement blocks 12. Further, a plurality of probes Pr are electrically connected to the scanner unit 13. The scanner unit 13 switches the connection relationship between the current terminals +F and -F and the voltage detection terminals +S and -S, and the plurality of probes Pr in accordance with a control signal from the control unit 20.

In the power supply unit CS, one end of the output terminal is connected to the circuit ground, and the other end is connected to the current terminal +F. In the power supply unit CM, one end of the output terminal is connected to the circuit ground, and the other end is connected to the current terminal -F. The voltage detection unit VM has one end connected to the voltage detection terminal +S, and the other end connected to the voltage detection terminal -S.

In addition, the scanner unit 13 can connect the current terminals +F and -F and the voltage detection terminals +S and -S to an arbitrary probe Pr in accordance with a control signal from the control unit 20. . Thereby, the scanner unit 13, in accordance with the control signal from the control unit 20, passes the current I between the arbitrary conductive parts that the probe Pr is in contact with, and detects the voltage V generated between the conductive parts. It is possible to measure by VM).

Since a plurality of measurement blocks 12 are provided, current supply and voltage measurement can be performed in parallel between a plurality of conductive parts.

Further, the power supply units CS and CM only need to be able to pass current I through the substrate B through the scanner unit 13, and are not limited to the example in which one end of the power supply units CS and CM is connected to the circuit ground. For example, the configuration may be such that one end of the power supply unit CS and one end of the power supply unit CM are connected to form a current loop.

Accordingly, the control unit 20 outputs a control signal to the scanner unit 13 to allow the current I to flow between a plurality of arbitrary pairs of probes Pr by the plurality of power supply units CS, CM, and an arbitrary plurality of The voltage between the pair of probes Pr can be detected by a plurality of voltage detection units VM.

FIG. 3 also serves as an explanatory diagram showing the conductive structure information D1 of the substrate B. As shown in FIG. The conductive structure information D1 is not necessarily data displayed as an image, but in the following description, in order to facilitate understanding, a structure represented by the conductive structure information D1 is shown in drawings and described.

The substrate B shown in FIG. 3 is a multilayer substrate on which five substrates B1 to B5 are stacked. One surface of the substrate B is a substrate surface F1, and the other surface is a substrate surface F2. The boundary between the boards B1 and B2 is the wiring layer L1, the boundary between the boards B2 and B3 is the wiring layer L2, and the boundary between the boards B3 and B4 is the conductor layer Lc and the boards B4 and B5. The boundary is the wiring layer L4.

Conductive portions P1 to P7 are provided on the substrate surface F1, and conductive portions P11 to P17 are provided on the substrate surface F2. The conductive portions P1 to P7 and P11 to P17 serve as inspection points where probes Pr such as pads, bumps, wirings, and electrodes come into contact with each other.

The conductor layer Lc is provided with a planar conductor IP, which is a conductor that expands in a planar shape or a mesh shape. Wiring layers W11 and W12 are provided in the wiring layer L1, wirings W21 and W22 are provided in the wiring layer L2, and the wirings W41, W42, W43 and the wirings W44, W45 are provided in the wiring layer L4. There is this. The planar conductor (IP) may be a single sheet type, that is, a shape that expands to a planar shape, or a regular or irregular mesh type (net-eye type) in which conductor patterns such as wiring are combined to form a shape that expands in a planar shape as a whole in the same layer. It may be a conductor to have.

In addition, although FIG. 3 shows an example in which the planar conductor IP is broadened substantially all over the substrate B, the planar conductor IP is not necessarily limited to the example in which the planar conductor IP is broadened substantially throughout the substrate B. . The planar conductor IP may be provided only in a partial region of the substrate B. For example, the wiring W may be provided in a region in the conductor layer Lc where the planar conductor IP of the substrate B is not provided.

The substrate B shown in FIG. 4 includes a planar conductor IPa and a planar conductor IPd electrically separated from each other. The planar conductor IPa is used, for example, as an analog ground, and the planar conductor IPd is used, for example, as a digital ground. As shown in Fig. 4, the substrate B may be provided with a plurality of planar conductors IP insulated from each other.

The wiring W41, W42, W43 is one wiring to which the wiring W41, the wiring W42, and the wiring W43 of the wiring layer L4 are connected, but for convenience of explanation, one wiring W41, W42, W43 Each part of is referred to as a wiring W41, a wiring W42, and a wiring W43. Similarly, the wirings W44 and W45 are one wiring in which the wiring W44 and the wiring W45 are connected, and the wiring W44 and the wiring W45 are each part of one wiring W44 and W45.

Further, the substrate B is provided with vias V11 to V17 penetrating the substrate B1, vias V21 to V27 penetrating the substrate B2, and vias penetrating the substrate B3. V31 to V36 are provided, vias V41 to V45 penetrating through the substrate B4 are provided, and vias V51 to V57 penetrating the substrate B5.

The conductive structure information stored in the storage unit 22 includes these conductive parts P1 to P7, P11 to P17, wirings W11, W12, W21, W22, W41 to W45, and vias V11 to V17, V21 to V27. , V31 to V36, V41 to V45, V51 to V57), and information indicating how the planar conductor IP is electrically connected, for example, information indicating the connection relationship shown in FIG. 3 is included.

Hereinafter, conductive parts such as conductive parts P1 to P7 and P11 to P17 are collectively referred to as a conductive part P, and wires such as wires W11, W12, W21, W22, W41 to W45, etc. are collectively referred to as the wiring W ), vias (V11 to V17, V21 to V27, V31 to V36, V41 to V45, V51 to V57) and the like are collectively referred to as vias (V), and wiring layers (L1, L2, L4) are collectively referred to as wiring layers ( It is called L).

Each of the conductive portions P is electrically connected to the planar conductor IP through a via V or a wiring W. In this way, the wiring structure in which each of the conductive portions P is electrically connected to the planar conductor IP is generally used for connection of a circuit ground or a power supply pattern. In addition, the substrate B may of course also include wirings or pads that are not connected to the circuit ground or the power supply pattern.

When the substrate B is installed in the substrate fixing device 110, the probes Pr of the measurement unit 121 are brought into contact with the conductive portions P1 to P7 by the movement mechanism 125, and the measurement unit ( Each of the probes Pr of 122) abuts against the conductive portions P11 to P17. Thereby, the measurement units 121 and 122 allow the current I to flow between any pair of conductive portions P, and detect the voltage between the pair of conductive portions P.

The measurement units 121 and 122 may make a current supply probe Pr and a voltage measurement probe Pr contact one conductive portion P for resistance measurement by a so-called 4-terminal resistance measurement method. In order to measure the resistance by the two-terminal resistance measurement method, one probe Pr serving as both current supply and voltage measurement may be brought into contact with one conductive portion P.

The inspection processing unit 21 controls the measurement units 121 and 122 to supply a current I from the power supply unit CS (see Fig. 2) to one of the selected pair of conductive units P as described later. , By pulling out the current I by the power supply unit CM (see Fig. 2) from the other side, the current I is supplied between the conductive parts P, the voltage between the conductive parts P is detected, and the current and voltage The substrate B is inspected on the basis of. The inspection processing unit 21 can perform resistance measurement by, for example, a 4-terminal resistance measurement method or a 2-terminal resistance measurement method based on the current and voltage, and inspect the substrate B based on the resistance value.

Hereinafter, the fact that the inspection processing unit 21 performs current supply and voltage detection by controlling the measurement units 121 and 122 will be described simply as the inspection processing unit 21 supplies current and detects voltage. Details of the operation of the inspection processing unit 21 will be described later.

Next, the operation of the above-described inspection instruction information generating device 3 will be described. A case of generating inspection instruction information corresponding to the substrate B shown in FIG. 3 will be described as an example. 5 and 6 are explanatory diagrams showing an example of the conductive structure information D1 changed in the execution process of the inspection instruction information generation method in the case of generating inspection instruction information corresponding to the substrate B shown in Fig. 3. . Hereinafter, the operation of the inspection instruction information generating device 3 that executes the inspection instruction information generating method based on the inspection instruction information generating program according to an embodiment of the present invention will be described with reference to FIGS. 5 to 14.

Incidentally, in the following flowchart, the same step numbers are assigned to the same processing, and the description thereof is omitted.

First, the inspection instruction information generation unit 31 performs a process of simplifying the connection structure indicated by the conductive structure information D1 as a pre-process in grouping each conductive portion P of the substrate B. Specifically, when the wirings W of the plurality of wiring layers L are connected in parallel, the inspection instruction information generation unit 31 selects the parallel connected wirings W among the wirings W. The conductive structure information D1 is duplicated and changed so as to replace the wiring W closest to the substrate surface F1, and the conductive structure information D1' is generated (step S1: (d) step).

Specifically, in the substrate B shown in FIG. 3, the wirings W11 and W21 of the plurality of wiring layers L1 and L2 are connected in parallel by vias V21 and V22. In this case, with respect to the conductive structure information D1, as shown in Fig. 5, two wirings W11 and W21 are transferred to one wiring W11 closest to the substrate surface F1 among the wirings W11 and W21. Substitute to generate conductive structure information D1'. At this time, since one end of the via V22 is opened, it is possible to treat the via V22 not present on the data. Thereby, since the wiring structure of the substrate B is simplified, subsequent processing becomes easy.

Next, the inspection instruction information generation unit 31, when the vias V or the rows of vias V are connected in parallel by the wiring W and the planar conductor IP, the parallel connected vias V ) Or the conductive structure information D1' is changed so that the row of vias V is replaced with one or a row of vias (step S2: (e) step).

Specifically, in the substrate B shown in Fig. 3, vias V24 and V33 are connected in series to form a row, and vias V25 and V34 are connected in series to form a row. Then, the rows of vias V24 and V33 and the rows of vias V25 and V34 are connected in parallel by the wiring W12 and the planar conductor IP. Further, the via V32 and the via V33 are connected in parallel by the wiring W22 and the planar conductor IP.

In this case, for example, as shown in FIG. 5, for the conductive structure information D1', the columns of the vias V24 and V33 and the columns of the vias V25 and V34 are set to either one of the columns, for example via V24. , V33), and the via (V32) and via (V33) are replaced with one via (V), for example, via (V32).

Further, the via V41 and the via V42 are connected in parallel by the series wiring of the wirings W41, W42, and W43 and the planar conductor IP. In this case, for example, as shown in FIG. 5, on the conductive structure information D1, the vias V41 and V42 are replaced with one via V, for example, via V41. Further, vias V43, V44 and V45 are connected in parallel by wirings W44 and W45 and planar conductor IP. In this case, for example, as shown in FIG. 5, the vias V43, V44, and V45 are replaced with one via V, for example, via V43 for the conductive structure information D1'. Thereby, since the wiring structure of the substrate B is simplified, subsequent processing becomes easy.

In addition, the inspection instruction information generation unit 31 does not necessarily need to execute steps S1 and S2, and transfers the conductive structure information D1 in the data format indicating the actual wiring structure of the substrate B shown in FIG. 3 to the conductive structure information D1. You may perform the subsequent processing by setting it as'.

Next, the inspection instruction information generation unit 31 converts the data structure of the conductive structure information D1' into a tree structure (step S3: (m) step). The conductive structure information D1' converted into a tree structure is referred to as conductive structure information D1''. As shown in Fig. 6, in the conductive structure information D1'', one wiring W is represented by one node N, the planar conductor IP is represented by a root node NR, and the via V is, It is expressed as a branch M connecting the conductive part P and nodes, or a branch M connecting the nodes.

In addition, the inspection instruction information generation unit 31 does not necessarily need to execute step S3, and performs subsequent processing using the conductive structure information D1 and the conductive structure information D1' in a data format indicating the wiring structure of the substrate B. You can do it. In the following description, the processing for the node N is equivalent to the processing for the wiring W corresponding to the node N, and the processing for the root node NR is equivalent to the processing for the planar conductor IP, The processing for the branch M is equivalent to the processing for the wiring W corresponding to the node N.

In the example of the conductive structure information D1'' of the tree structure shown in Fig. 6, the node N11 corresponds to the wiring W11 (W21), the node N12 corresponds to the wiring W12, and the node N21 corresponds to the wiring W22. The node N41 corresponds to the wirings W41, W42, and W43, and the node N42 corresponds to the wirings W44 and W45. In addition, branch M11 is via (V11 (V21)), branch M12 is via (V12 (V22)), branch M13 is via (V14), branch M14 is via (V15), branch M22 is via (V24 (V25)) , Branch Mr1 is via (V21, V31), branch Mr2 is via (V32(V33)), branch Mr3 is via (V16, V26, V35), branch Mr4 is via (V17, V27, V36), branch M41 is via (V51), branch M42 is via (V52), branch M43 is via (V53), branch M44 is via (V54), branch M45 is via (V55), branch M46 is via (V56), branch M47 is via (V57) ), branch Mr5 corresponds to the via (V41(V42)), and branch Mr6 corresponds to the via (V43(V44, V45)), respectively.

Next, the inspection instruction information generation unit 31 selects the wiring layer L1 closest to the substrate surface F1 as a first selection layer LL1 and the wiring layer L4 closest to the substrate surface F2 as a second selection. It is selected as the layer LL2 (step S4: (f) step). The processing of steps S4 to S27 and S101 to S501 corresponds to an example of the inspection instruction information generation processing.

Next, the inspection instruction information generation unit 31 executes the first process (step S5). Referring to FIG. 11, the inspection instruction information generation unit 31 includes a substrate surface that is connected to each other through a node N (wiring W) of the first selection layer LL1 based on the conductive structure information D1''. The conductive parts P of F1) are grouped together (step S101: step (a) of step (f)).

Here, since the first selection layer LL1 is the wiring layer L1, in the tree-structured conductive structure information D1 ″ shown in FIG. 6, a conductive portion that conducts through the node N11 of the first selection layer LL1 ( P1 and P2 are grouped, and conductive portions P4 and P5 conducting through the node N12 of the first selection layer LL1 are grouped.

Next, for each group grouped in step S101, the inspection instruction information generation unit 31 selects two conductive parts as a pair of first selected conductive parts from among the conductive parts P included in the respective groups. , In correspondence with the first selection layer LL1, and recorded in the inspection instruction information D2 (step S102: step (b) of step (f)). The first selective conductive portion is information indicating a conductive portion (inspection location) that can be inspected in parallel.

In the example of FIG. 6, as the first selective conductive part, a conductive part from the group of conductive parts P1 and P2 corresponding to the wiring layer L1, from the group of conductive parts P1 and P2, and the group of conductive parts P4 and P5. (P4, P5) is selected. Hereinafter, the pair of the conductive part P1 and the conductive part P2 is expressed as the conductive part pair P1, P2.

Next, the inspection instruction information generation unit 31, in each group grouped in step S101, if there is a group having a conductive portion P not selected as the first selected conductive portion, the first selected conductive portion 1 Selecting two conductive parts P including the conductive parts P not selected as the selected conductive parts as a pair of second selective conductive parts, and correlating with the first selection layer LL1 to test instruction information D2 (Step S103: step (b) of step (f)). The second selective conductive portion is information indicating a conductive portion (inspection location) to be inspected in parallel with the first selective conductive portion.

In the example of FIG. 6, among the group of the conductive parts P1 and P2 and the group of the conductive parts P4 and P5, there is no group having a conductive part P that is not selected as the first selection conductive part, so the inspection instruction information The generation unit 31 transfers the process to the next step S104.

Next, the inspection instruction information generation unit 31, based on the conductive structure information D1'', of the substrate surface F2 that is connected to each other through the node N (wiring W) of the second selection layer LL2. The conductive parts P are grouped together (step S104: step (a) of step (f)).

In this case, since the second selection layer LL2 is the wiring layer L4, in the conductive structure information D1'' of the tree structure shown in FIG. 6, a conductive portion that conducts through the node N41 of the second selection layer LL2 ( P11, P12, P13, P14 are grouped, and conductive portions P15, P16, P17, which conduct through the node N42 of the second selection layer LL2, are grouped.

Next, for each group grouped in step S104, the inspection instruction information generation unit 31 selects two conductive parts as a pair of first selected conductive parts from among the conductive parts P included in the respective groups. , In correspondence with the second selection layer LL2, and recorded in the inspection instruction information D2 (step S105: step (b) of step (f)).

In the example of FIG. 6, as the first selective conductive part, from the group of conductive parts P11, P12, P13, P14, for example, conductive parts P11, P12, and conductive parts P15, P16, P17. Conductive portions P15 and P16, for example, are selected from the group.

Next, the inspection instruction information generation unit 31, in each group grouped in step S104, if there is a group having a conductive portion P not selected as the first selected conductive portion, the first selected conductive portion 1 Selecting two conductive portions P, including the conductive portions P not selected as the selected conductive portions, as a pair of second selective conductive portions, and correlating with the second selection layer LL2, inspection instruction information D2 (Step S106: step (b) of step (f)), the first step is terminated, and the process shifts to step S7 (FIG. 7).

In the example of FIG. 6, in the group of the conductive parts P11, P12, P13, P14 and the group of the conductive parts P15, P16, P17, conductive parts P13, P14 that are not selected as the first selection conductive parts, and There is a conductive part P17. In this case, the inspection instruction information generation unit 31 selects the pair of conductive portions P13 and P14 and the pair of conductive portions P16 and P17 as the second selection conductive portions.

Returning to Fig. 7, the inspection instruction information generation unit 31 checks the flag Fip1, which is a control flag for controlling the processing (step S7).

When the flag Fip1 is 1 (Yes in step S7), the flag Fip1 is already set to 1 in step S12 described later, and the substrate surface of the conductor layer Lc is higher than the substrate surface F1 side and the conductor layer Lc. It means that generation of inspection instruction information D2 corresponding to each wiring layer L on the (F1) side has already been completed. Therefore, the inspection instruction information generation unit 31 proceeds to step S17 (Fig. 9) without executing steps S11 to S16.

When the flag Fip1 is not 1 ("No" in step S7), the inspection instruction information generation unit 31 proceeds to step S11 (Fig. 8), and from the substrate surface F1 of the first selection layer LL1 It is checked whether or not the conductor layer Lc is adjacent to the far side (step S11).

When the conductor layer Lc is adjacent to the side away from the substrate surface F1 of the first selection layer LL1 (Yes in step S11), the inspection instruction information generation unit 31 sets the flag Fip1 to 1 (Step S12), the process shifts to Step S301 (Fig. 12) in order to select the conductive portion P to be used for inspection of the via V connected to the substrate surface F1 side of the planar conductor IP. .

On the other hand, when the conductor layer Lc is not adjacent to the side away from the substrate surface F1 of the first selection layer LL1 ("No" in step S11), the inspection instruction information generation unit 31 The wiring layer L adjacent to the side away from the substrate surface F1 of the 1st selection layer LL1 is selected as the new 1st selection layer LL1 (step S13: (g) process). Thereby, steps S14 to S16 are performed with the new first selection layer LL1 as a processing target.

For example, in the example shown in Fig. 6, the first selection layer LL1 is now the wiring layer L1. The conductor layer Lc is not adjacent to the side away from the substrate surface F1 of the wiring layer L1 (No in step S11), and a wiring layer adjacent to the side away from the substrate surface F1 of the wiring layer L1 ( L2) becomes a new first selection layer LL1 (step S13).

Next, the inspection instruction information generation unit 31 corresponds to each of the nodes N of the first selection layer LL1, based on the conductive structure information D1'', on the side away from the root node NR of the one node N. For one branch M (via V) connected to the node N, one conductive portion P of the substrate surface F1 that is electrically connected, that is, conducting, is selected from the side opposite to the node N. The inspection instruction information generation unit 31 groups the selected conductive portions P for each corresponding node N (step S14: (g1) step).

In the example shown in FIG. 6, the node N21 is in the wiring layer L2 which is the 1st selection layer LL1. Branch M21 and branch M22 are connected to the node N21. As the conductive part P of the substrate surface F1 which is directly or indirectly connected to the side opposite to the node N21 of the branch M21, there is a conductive part P3. Accordingly, the conductive portion P3 corresponding to the branch M21 is selected. As the conductive portions P of the substrate surface F1 that are directly or indirectly connected to the side opposite to the node N21 of the branch M22, there are conductive portions P4 and P5. Any one of the conductive parts P4 and P5, for example, the conductive part P4 is selected as the conductive part P corresponding to the branch M22. Thereby, the conductive parts P3 and P4 are grouped in correspondence with the node N21.

Next, for each group grouped in step S14, the inspection instruction information generation unit 31 uses any two conductive portions among the conductive portions P included in the respective groups as a pair of first selected conductive portions. It is selected and recorded in the inspection instruction information D2 in association with the first selection layer LL1 (step S15: step (b) of step (g2)).

In the example shown in Fig. 6, two conductive parts P3 and P4 are selected as a pair of first selective conductive parts among the conductive parts P3 and P4 grouped in step S14.

For example, in the case where node N11 is not connected to the root node NR but is connected to the node N21 and the branch M23, such as the tree structure conductive structure information D1″ shown in FIG. 16, in step S14, the node N21 of the branch M23 is As the conductive portions P of the substrate surface F1, which are directly or indirectly connected to the opposite side of and, there are conductive portions P1 and P2. Any one of the conductive parts P1 and P2, for example, the conductive part P1 is selected as the conductive part P corresponding to the branch M23. Then, the conductive portions P1, P3, and P4 in which the conductive portions P1 are added to the above-described conductive portions P3 and P4 are grouped corresponding to the node N21.

In addition, in step S15, two conductive parts, for example, conductive parts P1 and P3, among the conductive parts P1, P3, and P4 are selected as a pair of first selective conductive parts.

Next, if there is a group having a conductive portion P not selected as a first selection conductive portion among the groups grouped in step S14, the inspection instruction information generating unit 31 is Two conductive portions P including a conductive portion P not selected as the selected conductive portion are selected as a pair of second selective conductive portions, and are associated with the first selection layer LL1 to provide inspection instruction information D2. It records (step S16: (b) process of the (g2) process), and it advances to step S17 (FIG. 9).

On the other hand, the inspection instruction information generation unit 31 proceeds to step S17 as it is when there is no group having a conductive portion P not selected as the first selection conductive portion among the groups grouped in step S14.

Next, the inspection instruction information generation unit 31 checks the flag Fip2, which is a control flag for controlling the processing (step S17).

When the flag Fip2 is 1 (Yes in step S17), the flag Fip2 is already set to 1 in step S19 to be described later, and the substrate surface of the conductor layer Lc is higher than the substrate surface F2 side and the conductor layer Lc. It means that the generation of the inspection instruction information D2 for each wiring layer L on the (F2) side has already been completed. Therefore, the inspection instruction information generation unit 31 proceeds to step S26 (FIG. 10) without executing steps S18 to S24.

When the flag Fip2 is not 1 ("No" in step S17), the inspection instruction information generation unit 31 proceeds to step S18, and a conductor is placed on the side away from the substrate surface F2 of the second selection layer LL2. It is checked whether or not the layers Lc are adjacent (step S18).

When the conductor layer Lc is adjacent to the side away from the substrate surface F2 of the second selection layer LL2 (Yes in step S18), the inspection instruction information generation unit 31 sets the flag Fip2 to 1 (Step S19), the process shifts to Step S401 (Fig. 13) in order to select the conductive portion P to be used for inspection of the via V connected to the substrate surface F2 side of the planar conductor IP. do.

For example, in the example shown in Fig. 6, if the second selection layer LL2 is now the wiring layer L4, the conductor layer Lc is adjacent to the side away from the substrate surface F2 of the wiring layer L4 ( For "Yes" in step S18), the flag Fip2 becomes 1 (step S19), and the flow proceeds to step S401 (FIG. 13).

Referring to Fig. 13, in step S401, the inspection instruction information generation unit 31 is configured for each branch M (via V) connected to the substrate surface F2 side of the root node NR (planar conductor IP). , By selecting one conductive part (P) that is electrically connected to the side opposite to the root node NR, that is, a conductive part (P) is selected, the selected conductive part (P) is grouped as a conductive part corresponding to the substrate surface (F2) side of the root node NR. (Step S401: (h) step).

In the example shown in Fig. 6, the branches Mr5 and Mr6 are connected to the substrate surface F2 side of the root node NR. The conductive parts P11, P12, P13, and P14 are provided as conductive parts P that are connected to the branch Mr5. The conductive portions P15, P16, and P17 are provided as the conductive portions P that are connected to the branch Mr6. Therefore, in step S401, any one of the conductive parts P11, P12, P13, P14, for example, the conductive part P11 is selected, and any one of the conductive parts P15, P16, P17, For example, the conductive part P15 is selected. Thereby, the conductive parts P11 and P15 are grouped.

Next, the inspection instruction information generation unit 31 selects two conductive portions P from among the conductive portions P grouped in step S401 as a pair of first selected conductive portions, and the substrate surface of the root node NR In correspondence with the (F2) side, it is recorded in the inspection instruction information D2 (step S402: (h) step).

In step S402, two conductive portions P from among the conductive portions P11 and P15 grouped in step S401 are selected as a pair of first selective conductive portions. In this case, since there are only two conductive parts P11 and P15 grouped in step S401, these two conductive parts P11 and P15 are selected as a pair of first selective conductive parts.

Next, when there is a group having a conductive portion P not selected as the first selection conductive portion among the groups grouped in step S401, the inspection instruction information generation unit 31 is Two conductive parts (P) including conductive parts (P) that are not selected as the selected conductive parts are selected as a pair of second selective conductive parts, and the inspection is instructed in correspondence with the substrate surface (F2) side of the root node NR. It is recorded in the information D2 (step S403), and the process advances to step S26 (FIG. 10).

Now, among the groups grouped in step S401, since there is no group having the conductive portion P not selected as the first selected conductive portion, the inspection instruction information generating portion 31 proceeds as it is in step S26 (Fig. 10). Transition to.

In addition, instead of executing steps S402 and S403, the inspection instruction information generation unit 31 selects a plurality of pairs of conductive parts P so as to include all the conductive parts P selected in step S401, and As the first selective conductive portion, it may be recorded in the inspection instruction information D2 in correspondence with the substrate surface F2 side of the root node NR.

In this case, in the inspection by the inspection processing unit 21 to be described later, current is supplied in parallel to the plurality of pairs of first selective conductive portions corresponding to the substrate surface F2 side of the root node NR, so that the inspection is performed. . When current is supplied to the plurality of pairs of conductive portions P in parallel, overlapping of current paths occurs. However, since the electrical resistance of the root node NR, that is, the planar conductor (IP), is very small compared to the wiring (W), even if the current path overlap occurs in the planar conductor (IP), the effect on the voltage measurement result is small. .

Therefore, instead of executing steps S402 and S403, a plurality of pairs of conductive parts P are selected so as to include all the conductive parts P selected in step S401, and the root node NR is selected as the plurality of pairs of first selected conductive parts. By recording the inspection instruction information D2 in correspondence with the substrate surface F2 side, in the inspection by the inspection processing unit 21 to be described later, current is supplied in parallel to the plurality of pairs of first selective conductive portions, thereby shortening the inspection time. It is possible.

On the other hand, when the conductor layer Lc is not adjacent to the side away from the substrate surface F2 of the second selection layer LL2 ("No" in step S18), the inspection instruction information generation unit 31 2 The wiring layer L adjacent to the side away from the substrate surface F2 of the selection layer LL2 is selected as the new second selection layer LL2 (step S21: step (g)). Thereby, steps S22 to S24 are executed with the new second selection layer LL2 as a processing target.

Next, the inspection instruction information generation unit 31 corresponds to each node N of the second selection layer LL2, based on the conductive structure information D1'', and the side away from the root node NR of the one node N. For one branch M (via V) connected to the node N, one conductive portion P of the substrate surface F2 that is electrically connected, that is, conducting, is selected from the opposite side to the node N. Then, the inspection instruction information generation unit 31 groups the selected conductive portions P for each corresponding node N (step S22: (g1) step).

Next, for each group grouped in step S22, the inspection instruction information generation unit 31 uses any two conductive portions among the conductive portions P included in the respective groups as a pair of first selected conductive portions. It is selected and recorded in the inspection instruction information D2 in correspondence with the second selection layer LL2 (step S23: (b) step of step (g2)).

Next, if there is a group having a conductive portion P not selected as a first selection conductive portion among the groups grouped in step S22, the inspection instruction information generation unit 31 is Two conductive portions P including a conductive portion P not selected as the selected conductive portion are selected as a pair of second selective conductive portions, and are associated with the second selective layer LL2 to the inspection instruction information D2. It records (step S24: (b) process of the (g2) process), and it advances to step S26 (FIG. 10).

On the other hand, when there is no group having a conductive part P not selected as the first selected conductive part among the groups grouped in step S22, the inspection instruction information generating part 31 is as it is from step S23 to step S26 (Fig. 10). ).

In the example shown in Fig. 6, in the processing corresponding to the wiring layer L2 and the substrate surface F2 side of the planar conductor IP, a group having a conductive portion P not selected as the first selective conductive portion Since is not present, the inspection instruction information generation unit 31 shifts the process from step S23 to step S26 (FIG. 10) without recording the inspection instruction information D2.

Next, the inspection instruction information generation unit 31 checks whether the generation of inspection instruction information D2 corresponding to the substrate surfaces F1 and F2 of all the wiring layers L and the planar conductor IP has been completed (step S26).

When all the wiring layers L and the inspection instruction information D2 corresponding to the substrate surfaces F1 and F2 of the planar conductor IP have been generated (Yes in step S26), the process proceeds to step S27. On the other hand, when the substrate surface (F1, F2) side of the wiring layer L or the planar conductor IP for which the corresponding inspection instruction information D2 has not yet been generated remains (No in Step S26), Step S11 (Fig. The processing is carried out to 8).

In step S11, the inspection instruction information generation unit 31 checks whether or not the conductor layer Lc is adjacent to the side away from the substrate surface F1 of the first selection layer LL1 (step S11). In the example shown in Fig. 6, the first selection layer LL1 is now the wiring layer L2. Since the conductor layer Lc is adjacent to the side of the wiring layer L2 away from the substrate surface F1 (Yes in step S11), the inspection instruction information generation unit 31 sets the flag Fip1 to 1 (step S12). ), the process shifts to step S301 (Fig. 12).

In step S301, the inspection instruction information generation unit 31, for each branch M (via V) connected to the substrate surface F1 side of the root node NR (planar conductor IP), is different from the root node NR. By selecting one conductive portion P that conducts on the opposite side, the selected conductive portion P is grouped as a conductive portion corresponding to the substrate surface F1 side of the root node NR (step S301: (h) step).

In the example shown in Fig. 6, the branches Mr1, Mr2, Mr3, and Mr4 are connected to the substrate surface F1 side of the root node NR. The conductive parts P1 and P2 are provided as the conductive parts P that are connected to the branch Mr1. The conductive parts P3, P4, and P5 are provided as the conductive parts P that are connected to the branch Mr2. As the conductive part P that is connected to the branch Mr3, there is a conductive part P6. As the conductive portion P that is connected to the branch Mr4, there is a conductive portion P7.

Therefore, in step S301, any one of the conductive parts P1, P2, for example, the conductive part P1, is selected, and any one of the conductive parts P3, P4, P5, for example, is conductive. The portion P3 is selected, and the conductive portions P6 and P7 are selected. Thereby, the conductive parts P1, P3, P6, P7 are grouped.

Next, the inspection instruction information generation unit 31 selects any two conductive portions P from among the conductive portions P grouped in step S301 as a pair of first selected conductive portions, and the root node NR is In correspondence with the substrate surface F1 side, the inspection instruction information D2 is recorded (step S302: (h) step).

In the example shown in FIG. 6, among the conductive parts P1, P3, P6, and P7 grouped in step S301, any two conductive parts P, for example, the conductive parts P1, P3, are a pair of first and second conductive parts P1, P3, P6, and P7. 1 Selection is selected as a conductive part.

Next, if there is a group having a conductive portion P not selected as a first selection conductive portion among the groups grouped in step S301, the inspection instruction information generation unit 31 is Two conductive parts (P), including conductive parts (P) not selected as the selected conductive parts, are selected as a pair of second selective conductive parts, and are instructed to be inspected in correspondence with the substrate surface (F1) side of the root node NR. It is recorded in the information D2 (step S303), and the process advances to step S17 (FIG. 9).

In step S302, of the conductive parts P1, P3, P6, and P7 grouped in step S301, the conductive parts P6 and P7 are not selected as the first selection conductive parts, so the inspection instruction information generation unit 31 , With respect to a group of conductive portions P1, P3, P6, P7 having a conductive portion P not selected as the first selective conductive portion, conductive portions P6, P7 that are not selected as the first selective conductive portion. The two conductive parts P including, in this case, the conductive parts P6 and P7 are selected as a pair of second selective conductive parts (step S303).

In step S303, for example, when the conductive parts included in the group are three of the conductive parts P1, P3, and P6, and only one conductive part P6 is not selected as the first selective conductive part, the conductive part P6 ) And any one of the conductive portions P1 and P3 are selected as a pair of second selective conductive portions.

In addition, as in the above-described steps S402 and S403, instead of executing steps S302 and S303, the inspection instruction information generation unit 31 includes a plurality of pairs of conductive portions ( P) may be selected and recorded in the inspection instruction information D2 in association with the substrate surface F1 side of the root node NR as a plurality of pairs of first selected conductive portions. For example, the inspection instruction information generation unit 31 pairs the conductive parts P1, P3 and the conductive parts P6, P7 from the conductive parts P1, P3, P6, and P7 grouped in step S301, respectively. As a result, the conductive parts P1 and P3 and the conductive parts P6 and P7 may be associated with the substrate surface F1 side of the root node NR as a plurality of pairs of first selected conductive parts, and recorded in the inspection instruction information D2.

Next, in step S17 (Fig. 9), since the flag Fip2 is now 1, the inspection instruction information generation unit 31 shifts the process to step S26 (Fig. 10).

In step S26, the processing of steps S5 to S403 is completed for all the wiring layers L and the substrate surfaces F1 and F2 of the planar conductor IP (Yes in step S26). The second process is executed in order to prevent omission of (step S27).

Referring to Fig. 14, the inspection instruction information generation unit 31 searches for a wiring W not caught in either of the pair of the first and second selective conductive portions selected in steps S1 to S403 (step S501. : (j) process).

In the example shown in Fig. 6, in steps S1 to S403, as a pair of first selective conductive parts, a pair of conductive parts P1 and P2, a pair of conductive parts P1 and P3, a pair of conductive parts P3 and P4, and a pair of conductive parts ( P4, P5), a pair of conductive parts (P11, P12), a pair of conductive parts (P11, P15), and a pair of conductive parts (P15, P16) are selected, and as a pair of the second selected conductive parts, a pair of conductive parts (P6, P7), a pair of conductive parts (P13, P14) and a pair of conductive parts (P16, P17) are selected.

Then, on the substrate surface F1 side, as the first and second selective conductive portions, the conductive portions P1 to P7 are successively selected in a beaded manner, so that any pair of the first and second selective conductive portions There is no wiring (W) that is not caught in the thing. On the other hand, on the side of the substrate surface F2, there is a discontinuity between the pair of conductive portions P11 and P12 and the pair of conductive portions P13 and P14.

15 is an explanatory diagram for explaining a second process. FIG. 15 is a partial enlarged view of the vicinity of the conductive portions P11 to P14 of FIG. 5.

In the example shown in Figs. 6 and 15, in steps S1 to S403, a pair of conductive parts P11 and P12 and a pair of conductive parts P13 and P14 are selected as a pair of the first and second selective conductive parts. The sub-pairs P12 and P13 are not selected. As a result, the wiring W42 shown in FIG. 15 is not caught in any of the pair of the first and second selective conductive portions.

Next, the inspection instruction information generation unit 31 checks the presence or absence of the corresponding wiring W (step S503), and if there is a corresponding wiring W (YES in step S503), the process proceeds to step S504. do. On the other hand, if there is no corresponding wiring W (No in step S503), the inspection instruction information generation unit 31 ends the processing. In the example shown in FIG. 6, the wiring W42 corresponds.

In step S504, the inspection instruction information generation unit 31 relates to a conductive portion P that is connected to one end of the corresponding wiring W without passing through the wiring W, and the other end of the wiring W. The conductive portion P, which conducts without passing through the wiring W, is recorded in the inspection instruction information D2 as a pair of third selective conductive portions to be inspected in parallel with the first selective conductive portion (step S504: (k) process).

In the example shown in Fig. 15, for example, a conductive portion P12 that is connected to one end T1 of the corresponding wiring W42 without passing through the wiring W42, and the other end T2 of the wiring W42. On the other hand, a conductive portion P13 that conducts without passing through the wiring W42 is selected as a pair of third selective conductive portions (step S504).

Next, the inspection instruction information generation unit 31 checks whether or not the substrate B has a plurality of conductor layers Lc (step S505), and when there are a plurality of conductor layers Lc (in step S505, " Yes"), the flow proceeds to step S506. On the other hand, if there is no plurality of conductor layers Lc (No in step S505), the inspection instruction information generation unit 31 ends the process.

In step S506, the inspection instruction information generation unit 31 checks the presence or absence of a via V connecting the planar conductors IP of the plurality of conductor layers Lc to each other (step S506). Then, if the via V is present (YES in step S506), the flow proceeds to step S507. On the other hand, if the via V does not exist (No in step S506), the inspection instruction information generation unit 31 ends the processing.

The board|substrate B shown in FIG. 17 is provided with two conductor layers Lc, and the via Vc which connects the planar conductor IP of the two conductor layers Lc is provided. In order to inspect the conduction of the via Vc, it is necessary to pass a current between the conductive portion P of the substrate surface F1 and the conductive portion P of the substrate surface F2.

Therefore, in step S507, the inspection instruction information generation unit 31 selects one of the conductive parts P of the substrate surface F1 and one of the conductive parts P of the substrate surface F2 to the first The selected conductive portion is recorded in the inspection instruction information D2 as a pair of fourth selective conductive portions to be inspected in parallel with the selected conductive portion (step S507: (l) step), and the process is terminated.

As a result of the pair of fourth selective conductive portions being recorded in the inspection instruction information D2, the substrate inspection apparatus 2 can inspect the via Vc by inspection based on the inspection instruction information D2.

In addition, among the first, second, third and fourth selective conductive portions selected in steps S1 to S507, the conductive portion P of the substrate surface F1 and the conductive portion P of the substrate surface F2 A, only the fourth selection conductive part for inspecting the via (Vc) is selected as the pair of conductive parts (P) to be inspected, and a pair of conductive parts (P) is selected from both sides of the substrate (B). It is minimally necessary to do.

When inspection is performed by measuring the voltage by passing a current between the pair of conductive portions P of the substrate B, an external electromagnetic field is superimposed on the detected voltage as noise. Since the external electromagnetic field is applied substantially equally to one side of the substrate B, the noise voltage induced by the foreign electromagnetic field on one side of the substrate B becomes substantially constant. Therefore, when measuring the voltage between the pair of conductive parts P on one side of the substrate B, noise superimposed on the measured voltage becomes a common mode. As a result, the effect of noise applied to the measured voltage is reduced. Is reduced.

On the other hand, between both sides of the substrate (B), there is a difference in the intensity of the electromagnetic field applied from the front and back of the substrate (B), resulting in a difference in noise voltage induced by the foreign electromagnetic field on one side and the other side of the substrate (B). do. Therefore, when measuring the voltage between the pair of conductive parts P across both sides of the substrate B, the noise superimposed on the measured voltage enters the normal mode, and as a result, the noise voltage is superimposed on the measured voltage as it is. . As a result, than the case of measuring the voltage between the pair of conductive portions P in one side of the substrate B, the voltage between the pair of conductive portions P over both sides of the substrate B is measured. The influence of shift noise increases.

According to steps S1 to S507, the conductive portion P spanning between both sides of the substrate B becomes the minimum fourth selective conductive portion required for inspecting the via Vc, and the other Since the conductive portion P is a pair of the first, second, and third selective conductive portions, the influence of noise when the inspection based on the inspection instruction information D2 is performed is reduced.

In addition, when inspecting vias between both sides of the substrate B, the probe Pr of the measuring jig 4U is brought into contact with the conductive portion P of the substrate surface F1 of the substrate B, and the substrate It is necessary to bring the probe Pr of the measuring jig 4L into contact with the conductive portion P of the substrate surface F2 in (B). At this time, if any one of the probe Pr of the measuring jig 4U and the probe Pr of the measuring jig 4L has a contact failure, it is not possible to specify which probe Pr has a contact failure. .

Therefore, both probes Pr are once separated from the substrate B, and both probes Pr are brought into contact with the substrate B again to perform re-inspection. Such re-inspection needs to be repeated many times until both probes Pr contacting both surfaces of the substrate B normally contact the conductive portion P. In this way, if the distance and contact of the probe Pr with respect to the conductive portion P are repeated, the inspection time is extended and the conductive portion P is liable to be scratched.

According to steps S1 to S507, the inspection of the conductive portions P across both sides of the substrate B is minimized, and most of them are inspections between the conductive portions P provided on one side of the substrate B, so contact failure. It is easy to reduce the re-inspection caused by and reduce the risk of scratches on the conductive portion P.

As described above, the inspection instruction information generating device 3 can generate inspection instruction information D2 by the processing of steps S1 to S507. In addition, according to steps S1 to S507, the order recorded in the inspection instruction information D2 for each corresponding substrate surface corresponds to the order of the pairs of conductive parts to be inspected for the substrate inspection apparatus 2. Specifically, it is recorded in the inspection instruction information D2 in order from the side corresponding to the layer close to the substrate surfaces F1 and F2.

Each conductive part to be inspected by the processing of steps S15, S16, S23, S24, S102, S103, S105, S106, S302, S303, S402, S403, S504, S507 by the inspection instruction information generation unit 31 The pair is associated with the substrate surface, the layer, and the types of the first, second, third, and fourth selective conductive portions, and the inspection instruction information D2 shown in Fig. 18 is generated. Here, "layer" means each layer of the wiring layer (L) and the conductor layer (Lc).

In FIG. 18, the order in which five pairs of conductive parts are correlated with the board|substrate surface F1, and the inspection should be performed in order from top to bottom is shown. Similarly, six pairs of conductive parts are associated with the substrate surface F2, and the order in which the inspection should be performed in the order of top to bottom is shown.

The inspection instruction information D2 thus obtained is transmitted to the board inspection apparatus 2 by, for example, a communication circuit not shown, or the inspection instruction information D2 is stored in a storage medium such as a USB memory, and the storage medium is stored. By making the board|substrate inspection apparatus 2 read, it can store in the memory|storage part 22.

Next, the operation of the above-described substrate inspection apparatus 2 will be described. Hereinafter, a case where the inspection instruction information D2 shown in Fig. 18 is stored in the storage unit 22 will be described as an example.

Referring to Fig. 19, the inspection processing unit 21 selects, as the inspection layer LT1, the first layer among the layers on the substrate surface F1 side based on the inspection instruction information D2 (step S51). In the example shown in FIG. 18, since the most-preceding layer (top) corresponding to the substrate surface F1 is the wiring layer L1, the wiring layer L1 becomes the inspection layer LT1.

Next, the inspection processing unit 21 selects, as the inspection layer LT2, the layer in the most ordered order among the layers on the substrate surface F2 side based on the inspection instruction information D2 (step S52). In the example shown in FIG. 18, since the most-preceding layer (top) corresponding to the substrate surface F2 is the wiring layer L4, the wiring layer L4 becomes the inspection layer LT2.

Next, the inspection processing unit 21 performs a first current supply process for passing a measurement current in parallel between the pair of conductive portions with respect to the pair of conductive portions of the first selective conductive portions in the inspection layers LT1 and LT2. It is executed (step S53: (c1) step). In the example shown in Fig. 18, since the inspection layer LT1 is now the wiring layer L1 and the inspection layer LT2 is the wiring layer L4, the inspection processing unit 21 is the first selective conduction of the wiring layers L1 and L4. The negative conductive part pair (P1, P2), the conductive part pair (P4, P5), the conductive part pair (P11, P12), and the conductive part pair (P15, P16) are parallelly passed the measurement current.

Next, the inspection processing unit 21 detects a voltage between the pair of conductive portions of the first selective conductive portion in the inspection layers LT1 and LT2, and based on the voltage and the current for measurement, the voltage between the conductive portions is The via V and the wiring W of the current path are inspected (step S54: (c1) step).

In the example of Fig. 18, the inspection processing unit 21 is between each pair of a pair of conductive parts (P1, P2), a pair of conductive parts (P4, P5), a pair of conductive parts (P11, P12), and a pair of conductive parts (P15, P16). A current is passed and the voltage between each pair is detected. Then, the inspection processing unit 21 calculates a resistance value between each pair, for example, by dividing the voltage between the pair by the current flowing between the pair. The inspection processing unit 21 compares each calculated resistance value with, for example, a reference value previously stored in the storage unit 22, and if each resistance value is less than or equal to the reference value, the substrate B is determined to be good, and each resistance is If the value exceeds the reference value, the substrate B is determined to be defective.

In step S54, the inspection processing unit 21 reports the determination result to the user by, for example, displaying on a notification unit such as a display device (not shown). In addition, the inspection processing unit 21 does not necessarily have to report the determination result to the user.

In step S54, the current path between each pair of the conductive part pair (P1, P2), the conductive part pair (P4, P5), the conductive part pair (P11, P12), and the conductive part pair (P15, P16) selected as the first selected conductive part. The vias V corresponding to the branches M11, M12, M13, M14, M41, M42, M45, and M46 and the wiring W corresponding to the nodes N11, N12, N41, and N42 are inspected.

In step S53, in parallel between each pair of the conductive portion pair (P1, P2), the conductive portion pair (P4, P5), the conductive portion pair (P11, P12), and the conductive portion pair (P15, P16) selected as the first selected conductive portion. Since a current can flow and the voltage between each pair can be measured, it becomes easy to shorten the inspection time of a board|substrate.

In addition, if current is passed in parallel between a plurality of pairs of conductive parts (P) conducting through the same node N (wiring (W)), there is a risk of occurrence of a wiring (W) in which the current for measurement overlaps and flows. . In this case, since the voltage generated by the overlapping of currents becomes a measurement error, there is a fear that the inspection accuracy is deteriorated.

On the other hand, in the inspection instruction information D2, the conductive portion pair P of the first selective conductive portion is selected so that current overlap does not occur even when the measurement current is passed in parallel for each layer. Therefore, in steps S51 to S54, by determining the conductive part pair P to pass in parallel with the measurement current based on the inspection instruction information D2, it is possible to shorten the inspection time of the substrate while reducing the fear of lowering the inspection accuracy. It is made possible.

Next, when the board|substrate B is determined to be defective in step S54 (YES in step S55), the inspection processing unit 21 ends the processing without executing the subsequent processing. On the other hand, when the substrate B is not determined to be defective in step S54 (No in step S55), the inspection processing unit 21 transfers the process to step S61 (FIG. 20).

In step S61, the inspection processing unit 21 measures the pair of conductive portions of the second selective conductive portion in the inspection layers LT1 and LT2, in parallel to the first current supply processing between the paired conductive portions. The second current supply process for passing the current is executed (step S61: (c2) step).

Next, the inspection processing unit 21 detects a voltage between the pair of conductive portions of the second selection conductive portion in the inspection layers LT1 and LT2, and based on the voltage and the current for measurement, the second selection becomes a pair. The via V and the wiring W of the current path between the conductive parts are inspected (step S62: (c2) step). The inspection processing unit 21 reports the inspection and the determination result in the same manner as in the case of Step S54.

The supply and inspection of the measurement current in steps S61 and S62 are performed not in parallel with the step S53, that is, at a timing at which the measurement current in step S53 does not flow.

In steps S61 and S62, by performing the inspection on the second selectively conductive portion in parallel with the inspection on the first selectively conductive portion, overlapping of the measurement current is prevented. The processes of steps S61 and S62 for the pair of conductive portions of the second selectively conductive portion in the inspection layer LT1 and the pair of conductive portions of the second selectively conductive portion in the inspection layer LT2 may be executed in parallel.

In the example of Fig. 18, since the inspection layer LT1 is now the wiring layer L1 and the inspection layer LT2 is the wiring layer L4, the second selective conductive portion in the inspection layer LT1 (wiring layer L1) is The conductive part pair does not exist, and therefore, the second current supply processing to the conductive part pair of the second selective conductive part in the inspection layer LT1 (wiring layer L1) is not executed. The inspection processing unit 21 performs steps S61 and S62 in parallel to the steps S53 and S54 for the pair of conductive parts P13 and P14, which are second selective conductive parts of the wiring layers L1 and L4, and the pair of conductive parts P16 and P17. Run with

Next, when the board|substrate B is determined to be defective in the inspection of step S62 (YES in step S63), the inspection processing unit 21 ends the processing without executing the subsequent processing. On the other hand, when the board B is not determined to be defective in the inspection in step S62 (No in step S63), the inspection processing unit 21 transfers the process to step S64.

In step S64, the inspection processing unit 21 corresponds to the case where both the inspection layers LT1 and LT2 are the conductor layer Lc, and the case where one is the conductor layer Lc and the other is none. Whether or not it is checked (step S64). When neither of the case where both of the inspection layers LT1 and LT2 are the conductor layer Lc, and the case where one of the conductor layers Lc and the other is none ("No" in step S64), The inspection processing unit 21 proceeds to step S65, and when both of the inspection layers LT1 and LT2 are a conductor layer Lc, or when one is a conductor layer Lc and the other is a case where there is no inspection layer to be described later. In the case of any of them (Yes in step S64), the inspection processing unit 21 proceeds to step S71 (FIG. 21). Now, since neither of the inspection layers LT1 and LT2 is the conductor layer Lc (No in Step S64), the flow proceeds to Step S65.

In step S65, if the inspection layer LT1 is not the conductor layer Lc, the inspection processing unit 21 selects a layer in the next order among the layers on the substrate surface F1 side based on the inspection instruction information D2. It is set as the inspection layer LT1 (step S65). When the current inspection layer LT1 is the conductor layer Lc, the inspection processing unit 21 assumes that the new inspection layer LT1 is absent. Next, if the inspection layer LT2 is not the conductor layer Lc, the inspection processing unit 21 determines the next layer of each layer on the side of the substrate surface F2 based on the inspection instruction information D2 as an inspection layer ( LT2) (step S66), and the flow proceeds to step S53 (Fig. 19). When the current inspection layer LT2 is the conductor layer Lc, the inspection processing unit 21 assumes that the new inspection layer LT2 is absent.

Now, since the inspection layer LT1 is the wiring layer L1 and the inspection layer LT2 is the wiring layer L4, the inspection processing unit 21 uses the new inspection layer LT1 as the wiring layer L2, and a new inspection layer ( Using LT2) as the conductor layer Lc, the flow proceeds to step S53 (FIG. 19).

In step S53, the inspection processing unit 21 is a pair of conductive portions P3 and P4 that are first selective conductive portions of the wiring layer L2, and a first selective conductive portion of the conductor layer Lc on the substrate surface F2. A current for measurement is passed to the pair of conductive parts (P11, P15) in parallel to detect the voltage between the pair of conductive parts (P3, P4) and the voltage between the pair of conductive parts (P11, P15), based on the voltage and the current for measurement. Then, the via V and the wiring W of the current path between the conductive portions are inspected (steps S53, S54: (c1) step).

Hereinafter, the inspection processing unit 21 proceeds to step S61 if it is "No" in step S55. According to the inspection instruction information D2 shown in FIG. 18, since the second selective conductive portion corresponding to the wiring layer L2 and the conductor layer Lc of the substrate surface F2 does not exist, steps S61 to S63 are not executed and steps Move to S64.

In step S64, it does not correspond to either the case where both of the inspection layers LT1 and LT2 are the conductor layer Lc, and the case where one of the conductor layers Lc and the other is without the inspection layer is not applicable, so step S65 At the transfer to, the inspection processing unit 21 sets the conductor layer Lc, which is a layer in the next order of the wiring layer L2 on the substrate surface F1 side in the inspection instruction information D2, as the inspection layer LT1 (step S65). ). In step S66, since the inspection layer LT2 is the conductor layer Lc, the inspection processing unit 21 determines that there is no new inspection layer LT2 and proceeds to step S53 again.

In step S53, the inspection processing unit 21 passes a current for measurement to the pair of conductive portions P1 and P3 that are the first selective conductive portions of the conductor layer Lc on the side of the substrate surface F1, and the conductive portion pair P1, The voltage between P3) is detected, and the via (V) and the wiring (W) of the current path between the conductive parts are inspected based on the voltage and the current for measurement (steps S53, S54: (c1) step ).

Hereinafter, the inspection processing unit 21 proceeds to step S61 if it is "No" in step S55. According to the inspection instruction information D2 shown in FIG. 18, the second selective conductive portion of the conductor layer Lc on the side of the substrate surface F1 is a pair of conductive portions P6 and P7. Accordingly, the inspection processing unit 21 executes steps S61 and 62 with respect to the pair of conductive parts P6 and P7.

Hereinafter, the inspection processing unit 21 proceeds to step S64 if it is "No" in step S63. Now, the inspection layer LT1 becomes the conductor layer Lc in the above-described step S65, and the inspection layer LT2 is set to be absent in the above-described step S66 (Yes in step S64). ).

In step S71, the inspection processing unit 21 performs the third current supply processing for passing a measurement current between the pair of conductive portions with respect to the pair of conductive portions of the third selective conductive portion compared to the first and second current supply processing. It is executed in parallel (step S71).

Next, the inspection processing unit 21 detects the voltage between the pair of conductive parts of the third selective conductive part, and based on the voltage and the current for measurement, the via V and the wiring ( W) is inspected (step S72). The inspection processing unit 21 reports the inspection and the determination result by the same method as in the case of Step S54.

In the example of FIG. 18, the third selective conductive portion corresponding to the substrate surface F1 does not exist, and the third selective conductive portion corresponding to the substrate surface F2 is a pair of conductive portions P12 and P13. Accordingly, the inspection processing unit 21 executes the third current supply processing for passing a measurement current between the conductive portions of the conductive portion pair P12 and P13 in a non-parallel manner with the first and second current supply processing (step S71). , The voltage between the conductive parts of the conductive part pair P12, P13 is detected, and the via V and the wiring W of the current path between the conductive parts are inspected based on the voltage and the current for measurement (step S72).

In the example of FIG. 18, the wiring W42 of the current path between the pair of conductive parts P12 and P13 shown in FIG. 15 is inspected. Thereby, the possibility of omission of inspection of the wiring W can be reduced, and inspection accuracy of the substrate B can be improved.

Next, the inspection processing unit 21 performs a fourth current supply processing for passing a measurement current between the pair of conductive portions with respect to the pair of conductive portions of the fourth selective conductive portion in a non-parallel manner with the first to third current supply processing. To execute (step S73).

Next, the inspection processing unit 21 detects the voltage between the pair of conductive parts of the fourth selective conductive part, and based on the voltage and the current for measurement, the via V and the wiring ( W) is inspected (step S74), and the process is ended. The inspection processing unit 21 reports the inspection and the determination result by the same method as in the case of Step S54.

In the example of Fig. 18, since the fourth selective conductive portion does not exist, the inspection processing portion 21 ends the processing without executing steps S73 and S74.

According to steps S73 and S74, for example, the via Vc for connecting the planar conductors IP of the two conductor layers Lc with two conductor layers Lc as shown in FIG. 17 is provided. The via Vc of the prepared substrate B may be inspected.

In addition, the inspection instruction information D2 is ordered from the side corresponding to the layer close to the substrate surfaces F1 and F2 for each substrate surface by the inspection instruction information generating device 3. As a result, the board inspection apparatus 2 determines the inspection order in steps S51, S52, S65, and S66, so that the wiring layer L is sequentially inspected from the side closer to the substrate surfaces F1 and F2. I can.

In general, as the substrate B is closer to the substrate surfaces F1 and F2, the number of wirings W provided in the wiring layer L tends to increase. As the number of wirings W provided in the wiring layer L increases, the number of pairs of conductive portions of the first selective conductive portion corresponding to one layer increases. As the number of conductive part pairs of the first selective conductive part increases, the number of conductive part pairs that can be inspected in parallel in step S53 increases.

Therefore, the number of parallel inspections at an early stage of the inspection can be increased by making the wiring layer L an inspection object in order from the side closer to the substrate surfaces F1 and F2. If the number of parallel inspections at the initial stage of inspection can be increased, a defect of the substrate B can be detected at an early stage of inspection. Therefore, in the case where the inspection is terminated when a defect is detected as in steps S55 and S63, the wiring layer L is sequentially subjected to inspection from the side closer to the substrate surfaces F1 and F2 to detect the defect. It is possible to increase the possibility of shortening the inspection time by shortening the time required.

In addition, although an example in which the inspection instruction information generation device 3 and the board inspection device 2 are configured as separate devices is shown, the inspection instruction information generation device 3 and the board inspection device 2 are configured as a single device. It may be. For example, since the board|substrate inspection apparatus 2 includes the inspection instruction information generation|generation part 31 and the storage part 32, the board|substrate inspection apparatus 2 may be structured as an inspection instruction information generation|generation apparatus. In this case, a substrate inspection system is constituted by one substrate inspection device that also serves as an inspection instruction information generating device.

In addition, the inspection instruction information generating device 3 and the inspection instruction information generating method do not necessarily have to execute all the flows shown in Figs. 7 to 14, and the inspection processing unit 21 must be There is no need to run the flow.

The inspection instruction information generating device 3 and the inspection instruction information generating method include, for example, the wiring W of the wiring layer L1 adjacent to the substrate surface F1, and the substrate surface even when only steps S101 and S102 are executed. The inspection instruction information D2 capable of easily shortening the inspection time of the via V connecting the wiring layer L1 and the conductive portion P adjacent to (F1) can be generated. In this case, the inspection processing unit 21 just needs to execute steps S53 and S54.

In addition, although an example in which the wiring layer L and the conductive portion P are provided on both surfaces of the conductor layer Lc has been shown, the wiring layer L and the conductive portion P may be provided only on one side of the conductor layer Lc. . For example, the substrate B does not have to be provided with the substrates B4 and B5. In this case, the processing related to the second selection layer LL2 is not required to be executed, and steps S18 to S24, S104 to S106, S401 to S403, S52, S66, and the like are not required to be executed.

Further, the inspection processing unit 21 may be configured to continue the inspection even when a defect is detected during the inspection without executing steps S55 and S63. In addition, the inspection instruction information generation device 3 and the inspection instruction information generation method always inspect pairs of conductive parts in order from the side corresponding to the layer close to the substrate surfaces F1 and F2 by steps S4, S13, and S21. It is not limited to the example of recording in the instruction information D2. In the inspection instruction information generating apparatus 3 and inspection instruction information generating method, a pair of conductive parts may be recorded in the inspection instruction information D2 in an arbitrary order.

That is, the inspection instruction information generating apparatus according to an example of the present invention includes a conductor layer, which is a layer provided with a planar or mesh-like conductive planar conductor, a substrate surface on which a plurality of conductive parts are provided, and between the conductor layer and the substrate surface. The planar conductor and the conductor in a substrate having a wiring layer that is a layer laminated on the substrate, a via connecting the wiring of the wiring layer and the plurality of conductive portions, and a via connecting the wiring of the wiring layer and the planar conductor of the conductor layer. In the case where there are a plurality of groups of conductive parts that are connected to each other through a storage part, a storage part for storing conductive structure information indicating how a part, the wire and the via are connected to each other through the wire of the wire layer, the conductive structure information On the basis of the test, the conductive parts are selected from each group as a first selected conductive part one by one, and information indicating the selected plurality of pairs of first selected conductive parts is recorded as test instruction information. And an instruction information generation unit.

In addition, a method of generating inspection instruction information according to an example of the present invention includes a conductor layer, which is a layer provided with a planar conductor of conductive widening in a planar shape or a mesh shape, a substrate surface provided with a plurality of conductive portions, and between the conductor layer and the substrate surface. The planar conductor and the conductor in a substrate having a wiring layer that is a layer laminated on the substrate, a via connecting the wiring of the wiring layer and the plurality of conductive portions, and a via connecting the wiring of the wiring layer and the planar conductor of the conductor layer. When there are a plurality of groups of the conductive parts that are connected to each other through the wiring of the wiring layer, based on the conductive structure information indicating how the part, the wiring and the via are connected to each other, the conductive part from each of the groups. And an inspection instruction information generation step of performing inspection instruction information generation processing for selecting a pair as the first selective conductive portions and generating information indicating the selected plurality of pairs of first selective conductive portions as inspection instruction information.

In addition, the inspection instruction information generation program according to an example of the present invention includes a conductor layer, which is a layer provided with a planar conductor of conductive widening in a planar shape or a mesh shape, a substrate surface provided with a plurality of conductive parts, and between the conductor layer and the substrate surface. The planar conductor and the conductor in a substrate having a wiring layer that is a layer laminated on the substrate, a via connecting the wiring of the wiring layer and the plurality of conductive portions, and a via connecting the wiring of the wiring layer and the planar conductor of the conductor layer. When there are a plurality of groups of the conductive parts that are connected to each other through the wiring of the wiring layer, based on the conductive structure information indicating how the part, the wiring and the via are connected to each other, the conductive part from each of the groups. The computer executes an inspection instruction information generation process for selecting a pair as the first selective conductive portions, and generating information indicating the selected plurality of pairs of first selective conductive portions as inspection instruction information.

When there are a plurality of groups of conductive parts that conduct each other through the wiring of the wiring layer, even if a current flows between the conductive parts of a certain group, the current does not flow through the other groups. Therefore, according to these configurations, when there are a plurality of groups of conductive parts that are connected to each other through the wiring of the wiring layer, based on the conductive structure information, by the inspection instruction information generation process, the conductive parts from the respective groups are first selected. Each pair is selected as a part, and information indicating the selected plurality of pairs of first selected conductive parts is recorded as inspection instruction information. Then, since a pair of first selective conductive parts are selected from one group, the plurality of pairs of first selective conductive parts belong to separate groups, respectively. In that case, overlapping of currents does not occur even if current is passed in parallel to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information. Accordingly, by making the plurality of pairs of first selective conductive portions based on the inspection instruction information obtained in this way as inspection locations, inspection of a plurality of locations can be carried out in parallel, and as a result, it becomes easy to shorten the inspection time of the substrate.

In addition, the inspection instruction information generation process includes: (a) a step of grouping the conductive parts that are connected to each other through the wiring of the wiring layer, based on the conductive structure information, and (b) the grouped plurality of groups. On the other hand, among the conductive parts included in each group, two conductive parts are selected as the pair of first selective conductive parts, and the selected plurality of pairs of first selective conductive parts are inspected as test points that can be inspected in parallel. It is preferable to include a process of recording in.

According to this configuration, in (a), conductive parts that are conductive to each other through the wiring of the wiring layer, that is, conductive parts that may cause overlapping of current paths with each other if current is passed through a plurality of conductive part pairs are grouped. In addition, for a plurality of grouped groups, that is, targeting a plurality of groups in a relationship in which overlap with the current paths of other groups does not occur even if current is passed between pairs of conductive parts in the group, in (b) , Two conductive parts from among the conductive parts included in the respective groups are selected as a pair of first selective conductive parts, and the selected plurality of pairs of first selective conductive parts are recorded in the inspection instruction information as test points that can be inspected in parallel. . Then, since a pair of first selective conductive parts are selected from one group, the plurality of pairs of first selective conductive parts belong to separate groups, respectively. Therefore, with respect to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, overlapping of currents does not occur even if currents are passed in parallel. Accordingly, by making the plurality of pairs of first selective conductive portions based on the inspection instruction information obtained in this way as inspection locations, inspection of a plurality of locations can be carried out in parallel, and as a result, it becomes easy to shorten the inspection time of the substrate.

In addition, in the step (b), when there is a group having a conductive portion not selected as the first selective conductive portion, with respect to the group, two conductive portions including the conductive portion not selected as the first selective conductive portion. It is preferable that the conductive portion is recorded in the inspection instruction information as a pair of second selective conductive portions to be inspected in parallel with the plurality of pairs of first selective conductive portions.

According to this configuration, it is possible to reduce the possibility that a conductive portion not selected as the first selective conductive portion is omitted from the inspection point.

In addition, the substrate further includes a plurality of vias connecting the plurality of wiring layers, the plurality of wiring layers, and (d) the wiring of the plurality of wiring layers are connected in parallel. If yes, prior to the step (a), a step of changing the conductive structure information is further performed so that the plurality of wirings connected in parallel are replaced with one of the wirings closest to the substrate surface. , It is preferable to execute the inspection instruction information generation process on the basis of the conductive structure information changed in the step (d).

According to this configuration, since the conductive structure information is simplified, the inspection instruction information generation process is executed based on the simplified conductive structure information. As a result, it becomes easy to execute the inspection instruction information generation process.

In addition, the inspection instruction information generation unit (e) when the vias or rows of vias are connected in parallel by the wiring and the planar conductor, prior to the step (a), the parallel connected vias or vias In order to replace the row with one or a row of vias, the process of changing the conductive structure information changed in the (d) process is additionally executed, and the inspection instruction information is generated based on the conductive structure information changed in the (e) process. It is desirable to carry out the processing.

According to this configuration, since the conductive structure information is simplified, the inspection instruction information generation process is executed based on the simplified conductive structure information. As a result, it becomes easy to execute the inspection instruction information generation process.

In addition, the substrate includes a plurality of wiring layers, and further includes a plurality of vias for connecting between the plurality of wiring layers, and the inspection instruction information generation unit comprises (f) the most of the plurality of wiring layers on the substrate surface. The steps (a) and (b) are performed with the adjacent wiring layer as a processing object, (g) with respect to the wiring layers other than the wiring layer closest to the substrate surface, each of the other wiring layers is a processing object, and (g1 ) For each wiring of the wiring layer to be processed, corresponding to the one wiring, for one via connected to the side away from the conductor layer of the one wiring, the side opposite to the wiring of the one via By selecting one of the conductive parts electrically connected to each of the corresponding wires, the selected conductive parts are grouped, and (g2) the (b) step is performed for the group grouped in the (g1) step. In the step (b), it is preferable that the first selective conductive portions of each pair are recorded in the inspection instruction information in correspondence with the wiring layer to be processed.

According to this configuration, it becomes possible to record a pair of conductive portions serving as inspection points for inspecting a substrate having a plurality of wiring layers and a plurality of vias connecting the plurality of wiring layers in the inspection instruction information.

In the (b) process, in the (f) and (g) processes, the plurality of pairs of first selected conductive portions are sequentially selected for each wiring layer, starting with the wiring layer close to the substrate surface as a processing target. It is preferable to add and record it in the inspection instruction information.

In general, as the substrate is closer to the substrate surface, the number of wirings provided in the wiring layer tends to increase. As the number of wirings provided in the wiring layer increases, the number of pairs of first selective conductive portions with respect to the wiring layer to be processed, that is, the pair of conductive portions capable of passing a measurement current in parallel at the time of inspection increases. Therefore, if a plurality of pairs of first selected conductive portions are sequentially assigned to each wiring layer and recorded in the inspection instruction information in order from the one selected by the wiring layer close to the substrate surface as a processing target, the inspection instruction information is sequentially assigned at the time of inspection. The wiring layer to be inspected is sequentially selected, and a current for measurement can be passed through a pair of first selected conductive portions corresponding to the wiring layer to perform inspection. By performing the inspection in this way, the number of parallel inspections at the early stage of the inspection can be increased. If the number of parallel inspections at the initial stage of inspection can be increased, defects of the substrate can be detected early in the inspection.

In addition, (h) for each via connected to one side of the planar conductor, one conductive part electrically connected on the opposite side to the planar conductor is selected, so that the selected conductive part corresponds to one side of the planar conductor. It is preferable to group as and to select two conductive parts as a pair of first selective conductive parts among the grouped conductive parts, and to record the selected pair of first selective conductive parts in the inspection instruction information.

According to this configuration, the via connected to the planar conductor can be inspected.

In addition, the inspection instruction information generation process includes (j) a step of searching for the wiring not pinched in the pair of the first selective conductive portions and not pinched in the pair of the second selective conductive portions, and (k) the search Conductive parts that conduct with one end of the wires without passing through the wires and conductive parts with which the other end of the wires conducts without passing through the wires should be inspected in parallel with the plurality of pairs of first selected conductive parts. It is preferable to further include a step of recording the inspection instruction information as a pair of third selective conductive portions.

According to this configuration, it is possible to reduce the possibility of omission of records of the inspection instruction information at the inspection target location.

In addition, it is preferable that the substrate surface and the wiring layer are provided on both sides of the conductor layer, and the inspection instruction information generation unit performs the inspection instruction information generation process on both sides of the conductor layer.

According to this configuration, it becomes possible to generate, on both sides of the conductor layer, inspection instruction information corresponding to the substrate on which the substrate surface and the wiring layer are provided, respectively.

In addition, the substrate includes a plurality of the conductor layers and vias for connecting the planar conductors of the plurality of conductor layers, and the inspection instruction information generation process includes: (l) The inspection as a pair of fourth selective conductive portions to be inspected in parallel with one of the conductive portions on one substrate surface and one of the conductive portions on the other substrate surface in parallel with the plurality of pairs of first selective conductive portions. It is preferable to further include a step of recording the instruction information.

According to this configuration, even for a substrate provided with a plurality of conductor layers and vias for connecting planar conductors of the plurality of conductor layers, a pair of fourth selective conductive portions for inspecting the vias connecting the planar conductors. Can be recorded in the inspection instruction information.

In addition, the inspection instruction information generation unit further executes a step of (m) converting the conductive structure information into a data structure of a tree structure by matching the via to a node, the wiring branch, and the planar conductor to a root node, , It is preferable to execute the inspection instruction information generation process based on the conductive structure information converted to the tree structure in the step (m).

According to this configuration, since the conductive structure information is simplified, the inspection instruction information generation process is executed based on the simplified conductive structure information. As a result, execution of the inspection instruction information generation process becomes easy.

Further, a substrate inspection system according to an example of the present invention includes the above-described inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, and the inspection processing unit includes (c1) the inspection instruction information. For a plurality of pairs of first selective conductive portions indicated by the instruction information, a first current supply process for passing current between the paired first selective conductive portions is executed in parallel, and the voltage between the paired first selective conductive portions Is detected, and based on the current and voltage, a process of inspecting vias and wirings in the current paths between the first selected conductive portions of each pair is performed.

According to this configuration, by executing the first current supply processing in parallel with respect to the plurality of pairs of first selected conductive portions based on the inspection instruction information, it is possible to perform inspections at a plurality of locations in parallel while avoiding overlapping of the measured currents. As a result, it becomes easy to shorten the inspection time of the substrate.

Further, a substrate inspection system according to an example of the present invention includes the above-described inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, and the inspection processing unit includes (c1) the inspection instruction information. For a plurality of pairs of first selective conductive portions indicated by the instruction information, a first current supply process for passing current between the paired first selective conductive portions is executed in parallel, and the voltage between the paired first selective conductive portions And, based on the current and voltage, a step of inspecting vias and wirings of the current paths between the first selected conductive portions of each pair, and (c2) a second selection consisting of a pair indicated by the inspection instruction information. A second current supply process in which a current flows between the conductive parts in parallel to the first current supply process is executed, a voltage between the second selected conductive parts in the pair is detected, and based on the current and voltage, A step of inspecting the vias and wirings of the current path between the paired second selective conductive portions is performed.

According to this configuration, it is possible to inspect vias or wirings on a current path connected to a conductive portion not selected as the first selective conductive portion.

Further, a substrate inspection system according to an example of the present invention includes the above-described inspection instruction information generating device and an inspection processing unit that inspects the substrate based on the inspection instruction information, and the inspection processing unit includes the inspection instruction information For each of the wiring layers according to the order indicated by (c1), a first current supply process of passing a current between the pair of first selected conductive parts with respect to the plurality of pairs of first selected conductive parts indicated by the inspection instruction information is performed in parallel. A step of detecting a voltage between the paired first selective conductive portions, and inspecting vias and wirings of the current paths between the pair of first selective conductive portions based on the current and voltage, If the inspection result of the step (c1) is defective, the step (c1) is not performed for the wiring layer whose order is next or later.

According to this configuration, by sequentially inspecting the wiring layers as processing targets from the side closer to the substrate surface, defects in the substrate can be detected early in the inspection. And, if the result of the inspection is defective, the inspection of the wiring layer in the next or later sequence is not performed. As a result, the defect is detected quickly, and the inspection is terminated when the defect is detected, so it is easy to shorten the inspection time.

Further, a substrate inspection system according to an example of the present invention includes the above-described inspection instruction information generating device, and an inspection processing unit that inspects the substrate based on the inspection instruction information, and the inspection processing unit includes (c1) the inspection instruction information. For a plurality of pairs of first selective conductive portions indicated by the instruction information, a first current supply process for passing current between the paired first selective conductive portions is executed in parallel, and the voltage between the paired first selective conductive portions And, based on the current and voltage, a step of inspecting vias and wirings of the current path between the first selected conductive portions of each pair is performed, and in the step (c1), according to the inspection instruction information The first current supply processing to the plurality of pairs of first selective conductive portions corresponding to one side of the conductor layer, and the plurality of pairs of first selective conductive portions corresponding to the other side of the conductor layer. The first current supply process is executed in parallel.

According to this configuration, in the case of inspecting a substrate on both sides of the conductor layer, the substrate surface and the wiring layer, respectively, the inspection on one side of the conductor layer and the inspection on the other side can be performed in parallel, thereby shortening the inspection time. It is easy to do.

That is, the inspection instruction information generating apparatus, inspection instruction information generating method, and inspection instruction information generating program having such a configuration can generate inspection instruction information indicating inspection points where it is easy to shorten the inspection time of the substrate. In addition, it is easy to shorten the inspection time of the substrate with the substrate inspection system of this configuration.

This application is based on Japanese Patent Application No. 2018-172302 filed on September 14, 2018, the content of which is incorporated herein. In addition, specific embodiments or examples made in the terms for carrying out the invention are intended to clarify the technical content of the present invention to the last, and the present invention is limited only to such specific examples and is not to be construed by agreement. .

1: board inspection system
2: board inspection device
3: Test instruction information generating device
4U, 4L: measuring jig
12: measuring block
13: scanner unit
20: control unit
21: inspection processing unit
22: memory
31: inspection instruction information generation unit
32: memory
110: board fixing device
112: housing
121, 122: measurement unit
125: movement mechanism
B, B1 to B5: substrate
BS, BS1: substrate surface
BS2: contact surface
CS, CM: power supply
D1, D1', D1'': conductive structure information
D2: Inspection instruction information
F1, F2: substrate surface
Fip1, Fip2: flags
I, I ₁ , I ₂ : Current
IP, IPa, IPd: planar conductor
L, L1, L2, L4: wiring layer
Lc: conductor layer
LL1: first selective layer
LL2: second optional layer
LT1, LT2: inspection layer
M, M11 to M14, M21 to M23, M41 to M47, Mr1 to Mr6: branch
MB: intermediate board
MP: metal plate
N, N11, N12, N21, N41, N42: node
NR: root node
P, P1 to P7, P11 to P17: conductive part
PA, PB, PA1 to PF1, PA2 to PF2: conductive part
Pr: probe
RA to RF: Via
T1: First
T2: the other end
V, V11 to V17, V21 to V27, V31 to V36, V41 to V45, V51 to V57, Vc: via
VM: voltage detection unit
W, W11, W12, W21, W22, W41 to W45: wiring
WB: multilayer substrate
WB1, WB2: substrate

Claims (18)

A conductor layer that is a layer on which a planar conductor of conductive widening in a planar shape or a mesh shape is provided, a substrate surface on which a plurality of conductive parts are provided, a wiring layer that is a layer stacked between the conductor layer and the substrate surface, and the wiring of the wiring layer and the plurality of Conductivity showing how the planar conductor, the conductive part, the wiring, and the via are connected to each other in a substrate having a via connecting a conductive portion and a via connecting the wiring layer of the wiring layer and the planar conductor of the conductor layer A memory unit for storing structural information,
When there are a plurality of groups of the conductive parts that are connected to each other through the wiring of the wiring layer, based on the conductive structure information, a pair of the conductive parts are selected from each group as a first selection conductive part, and the selected plurality An inspection instruction information generation device comprising: an inspection instruction information generation unit that executes inspection instruction information generation processing for recording information indicating a pair of first selective conductive portions as inspection instruction information. The method of claim 1, wherein the inspection instruction information generation process,
(a) a step of grouping the conductive parts that are conductive to each other through the wiring of the wiring layer based on the conductive structure information, and
(b) For the plurality of grouped groups, two conductive parts are selected from among conductive parts included in each group as the pair of first selective conductive parts, and the selected plurality of pairs of first selective conductive parts are parallel. And a step of recording the inspection instruction information as an inspection point capable of being inspected. The method according to claim 2, wherein the step (b) further comprises, when there is a group having a conductive portion not selected as the first selective conductive portion, a conductive portion not selected as the first selective conductive portion, with respect to the group. The inspection instruction information generating apparatus, wherein two conductive portions including the plurality of pairs of first selective conductive portions are recorded in the inspection instruction information as a pair of second selective conductive portions to be inspected in parallel with the plurality of pairs of first selective conductive portions. The substrate according to claim 2 or 3, wherein the substrate further includes a plurality of layers of the wiring layers and a plurality of vias connecting the plurality of wiring layers,
The inspection instruction information generation unit,
(d) When the wirings of the plurality of wiring layers are connected in parallel, prior to the step (a), the plurality of parallel connected wirings is replaced with one of the wirings closest to the substrate surface. , Additionally performing a process of changing the conductive structure information,
The inspection instruction information generating apparatus, which executes the inspection instruction information generating process based on the conductive structure information changed in the step (d). The method of claim 4, wherein the inspection instruction information generation unit,
(e) When the vias or rows of vias are connected in parallel by the wiring and the planar conductor, prior to the step (a), the parallel connected vias or rows of vias are converted into one or a row of vias. In order to substitute, a process of changing the conductive structure information changed in the step (d) is additionally performed,
The inspection instruction information generating apparatus, which executes the inspection instruction information generating process based on the conductive structure information changed in the step (e). The substrate according to any one of claims 2 to 5, wherein the substrate includes a plurality of wiring layers, and further includes a plurality of vias connecting the plurality of wiring layers,
The inspection instruction information generation unit,
(f) performing the steps (a) and (b) with the wiring layer closest to the substrate surface among the plurality of wiring layers as a treatment object,
(g) with respect to the wiring layers other than the wiring layer closest to the substrate surface, each of the other wiring layers is a target of processing,
(g1) For each wiring of the wiring layer to be processed, corresponding to the one wiring, for one via connected to the side away from the conductor layer of the one wiring, the wiring of the one via and Groups the selected conductive parts for each corresponding wiring by selecting one conductive part electrically connected from the opposite side,
(g2) for the group grouped in the step (g1), the step (b) is performed,
In the step (b), the first selected conductive portion of each pair is recorded in the inspection instruction information in correspondence with the wiring layer to be processed. The method according to claim 6, wherein the step (b) comprises, in the steps (f) and (g), the first selected conductive portions of the plurality of pairs in order from one selected by using a wiring layer close to the substrate surface as a processing target. An apparatus for generating inspection instruction information, which is sequentially assigned to each wiring layer and recorded in the inspection instruction information. The conductivity according to any one of claims 1 to 7, wherein (h) for each via connected to one side of the planar conductor, one conductive portion electrically connected on the opposite side to the planar conductor is selected, A portion is grouped as a conductive portion corresponding to one side of the planar conductor, two conductive portions are selected as a pair of first selective conductive portions from the grouped conductive portions, and the selected pair of first selective conductive portions is inspected. An inspection instruction information generating device that records in instruction information. The method of claim 3, wherein the inspection instruction information generation process,
(j) a step of searching for the wiring that is not pinched in the pair of the first selective conductive portions and is not pinched in the pair of the second selective conductive portions; and
(k) A conductive portion that conducts with respect to one end of the searched wiring without passing through the wiring, and a conductive portion that conducts with respect to the other end of the wiring without passing through the wiring, is different from that of the plurality of pairs of first selective conductive portions. The inspection instruction information generating apparatus further comprising a step of recording the inspection instruction information as a pair of third selective conductive portions to be inspected in parallel. The method according to any one of claims 1 to 9, wherein the substrate surface and the wiring layer are provided on both sides of the conductor layer, respectively,
The inspection instruction information generation unit, wherein the inspection instruction information generation process is performed on both sides of the conductor layer. The method according to claim 10, wherein the substrate comprises a plurality of the conductor layers and vias for connecting the planar conductors of the plurality of conductor layers,
The inspection instruction information generation process,
(l) One of the conductive portions on one substrate surface and one of the conductive portions on the other substrate surface on the two substrate surfaces should be inspected in parallel with the plurality of pairs of first selective conductive portions. The inspection instruction information generation apparatus further comprising a step of recording the inspection instruction information as a pair of fourth selective conductive portions. The method of any one of claims 1 to 11, wherein the inspection instruction information generation unit,
(m) a process of converting the conductive structure information into a data structure of a tree structure is further executed by matching the via to a node, the wiring branch, and the planar conductor to a root node,
The inspection instruction information generating apparatus, which executes the inspection instruction information generating process based on the conductive structure information converted to the tree structure in the step (m). The inspection instruction information generating device according to any one of claims 1 to 12, and
Including an inspection processing unit for inspecting the substrate based on the inspection instruction information,
The inspection processing unit,
(c1) With respect to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, a first current supplying process for passing current between the paired first selective conductive portions is executed in parallel, and the paired first A substrate inspection system, comprising: detecting a voltage between selected conductive portions, and performing a step of inspecting vias and wirings of a current path between the pair of first selective conductive portions based on the current and voltage. The inspection instruction information generating device according to claim 3;
Including an inspection processing unit for inspecting the substrate based on the inspection instruction information,
The inspection processing unit,
(c1) With respect to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, a first current supplying process for passing current between the paired first selective conductive portions is executed in parallel, and the paired first A step of detecting a voltage between selected conductive parts, and inspecting vias and wirings of a current path between the first selective conductive parts of each pair based on the current and voltage;
(c2) A second current supply process for passing a current between the pair of second selected conductive parts indicated by the inspection instruction information in parallel to the first current supply process is executed, and the second selection becomes the pair. A substrate inspection system, wherein a step of detecting a voltage between conductive portions and inspecting a via and a wiring of a current path between the paired second selective conductive portions based on the current and voltage is performed. The inspection instruction information generating device according to claim 7,
Including an inspection processing unit for inspecting the substrate based on the inspection instruction information,
The inspection processing unit,
For each wiring layer in the order indicated by the inspection instruction information,
(c1) With respect to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, a first current supplying process for passing current between the paired first selective conductive portions is executed in parallel, and the paired first A step of detecting a voltage between the selected conductive parts and inspecting the vias and wirings of the current path between the pair of first selective conductive parts based on the current and the voltage is performed,
When the inspection result of the step (c1) is defective, the step (c1) is not performed for the wiring layer in the next or subsequent step in the sequence. The inspection instruction information generating device according to claim 10,
Including an inspection processing unit for inspecting the substrate based on the inspection instruction information,
The inspection processing unit,
(c1) With respect to the plurality of pairs of first selective conductive portions indicated by the inspection instruction information, a first current supplying process for passing current between the paired first selective conductive portions is executed in parallel, and the paired first A step of detecting a voltage between the selected conductive parts and inspecting the vias and wirings of the current path between the pair of first selective conductive parts based on the current and the voltage is performed,
In the step (c1), the first current supply processing for the plurality of pairs of first selective conductive portions corresponding to one side of the conductor layer according to the inspection instruction information, and the other side of the conductor layer The substrate inspection system, wherein the first current supply processing is executed in parallel to the paired first selective conductive portions. A conductor layer, which is a layer on which a planar conductor of conductive widening in a planar shape or a mesh shape is provided, a substrate surface on which a plurality of conductive parts are provided, a wiring layer that is a layer stacked between the conductor layer and the substrate surface, and the wiring of the wiring layer and the plurality of Conductivity showing how the planar conductor, the conductive part, the wiring, and the via are connected to each other in a substrate having a via connecting a conductive portion and a via connecting the wiring layer of the wiring layer and the planar conductor of the conductor layer Based on the structure information,
When there are a plurality of groups of the conductive parts communicating with each other through the wiring of the wiring layer, a pair of the conductive parts are selected from each of the groups as a first selection conductive part, and the selected plurality of pairs of first selected conductive parts A method of generating inspection instruction information, including an inspection instruction information generation step of executing inspection instruction information generation processing for generating indicated information as inspection instruction information. A conductor layer, which is a layer on which a planar conductor of conductive widening in a planar shape or a mesh shape is provided, a substrate surface on which a plurality of conductive parts are provided, a wiring layer that is a layer stacked between the conductor layer and the substrate surface, and the wiring of the wiring layer and the plurality of Conductivity showing how the planar conductor, the conductive part, the wiring, and the via are connected to each other in a substrate having a via connecting a conductive portion and a via connecting the wiring layer of the wiring layer and the planar conductor of the conductor layer Based on the structure information,
When there are a plurality of groups of the conductive parts communicating with each other through the wiring of the wiring layer, a pair of the conductive parts are selected from each of the groups as a first selection conductive part, and the selected plurality of pairs of first selected conductive parts An inspection instruction information generation program for causing a computer to execute inspection instruction information generation processing for generating indicated information as inspection instruction information.

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