JP6885612B2 - Resistance measuring device and resistance measuring method - Google Patents

Description

The present invention relates to a resistance measuring device for measuring the resistance of a substrate and a resistance measuring method.

Conventionally, when a measurement target is a via formed on a circuit board that penetrates from one surface of the circuit board to the other surface, a measurement current is passed through the measurement target to measure the measurement target. There is known a substrate inspection device that measures the resistance value of the measurement target from the current value and the voltage value by measuring the voltage generated in the above (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2012-117991

By the way, in a substrate provided with a conductor that expands in a planar shape (hereinafter referred to as a planar conductor), conductive portions such as pads, bumps, and wirings on the substrate surface and the planar conductor are electrically electrically connected in the thickness direction of the substrate. There is a board with a connected structure. 7 and 8 are conceptual schematic views showing an example of such a substrate.

FIG. 7 is a conceptual schematic diagram showing a multilayer substrate WB which is an example of a substrate having a planar inner layer pattern IP on the inner layer of the substrate. In the multilayer board WB shown in FIG. 7, conductive portions PA and PB such as pads and wiring patterns are formed on the board surface BS. The conductive portions PA and PB are electrically connected to the inner layer pattern IP by connecting portions RA and RB such as vias and wiring patterns. In the example of the multilayer board WB, the inner layer pattern IP corresponds to the planar conductor.

In addition, as a method for manufacturing a substrate, a conductive metal plate is used as a base, and printed wiring boards are laminated on both sides of the metal plate, and the formed substrate is peeled off from the base metal plate to form two printed wiring boards. There is a way to form a substrate. In such a method for manufacturing a substrate, the substrate in a state before the substrate is peeled off from the base metal plate (hereinafter referred to as an intermediate substrate) has an aspect in which the metal plate is sandwiched between two substrates. ..

FIG. 8 is a conceptual schematic diagram showing an example of such an intermediate substrate B. In the intermediate substrate B shown in FIG. 8, the substrate WB1 is formed on one surface of the metal plate MP, and the substrate WB2 is formed on the other surface of the metal plate MP. Conductive portions PA1, PB1, ..., PZ1 such as pads and wiring patterns are formed on the substrate surface BS1 of the substrate WB1. Conductive portions PA2, PB2, ..., PZ2 such as pads and wiring patterns are formed on the contact surface BS2 of the substrate WB1 with the metal plate MP. The metal plate MP is, for example, a metal plate having a thickness of about 1 mm to 10 mm and having conductivity.

The conductive portions PA1 to PZ1 are electrically connected to the conductive portions PA2 to PZ2 by connecting portions RA to RZ such as vias and wiring patterns. Since the conductive portions PA2 to PZ2 are in close contact with and conductive to the metal plate MP, the conductive portions PA1 to PZ1 are electrically connected to the metal plate MP by the connecting portions RA to RZ. The conductive portion PA1 and the connecting portion RA are paired, the conductive portion PB1 and the connecting portion RB are paired, and the conductive portion and the connecting portion are paired, respectively. Since the substrate WB2 has the same configuration as the substrate WB1, the description thereof will be omitted. In the example of the intermediate substrate B, the metal plate MP corresponds to a planar conductor.

As an inspection of the multilayer board WB, the intermediate board B, etc., the resistance values Ra to Rz of the connecting portions RA to RZ may be measured.

FIG. 9 is an explanatory diagram for explaining a measurement method for measuring the resistance values Ra and Rb of the connection portions RA and RB of the intermediate substrate B shown in FIG. In order to measure the resistance values Ra and Rb of the connecting portions RA and RB, a measurement current I is passed between the conductive portion PA1 and the conductive portion PB1 and a voltage generated between the conductive portion PA1 and the conductive portion PB1. It is conceivable to measure V and calculate the resistance value as V / I. In this case, the resistance value calculated by V / I is Ra + Rb.

However, there is a need to individually measure the resistance value of each connection portion instead of the total resistance value of the two connection portions.

An object of the present invention is to electrically connect a conductive planar conductor that spreads in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion thereof to the planar conductor. It is an object of the present invention to provide a resistance measuring device capable of individually measuring the resistance of each connecting portion of a substrate to be measured, which has a pair with the connecting portion to be formed, and a resistance measuring method.

A resistance measuring device according to one aspect of the present invention has a conductive planar conductor that spreads in a plane, a substrate surface facing the planar conductor, and a conductive portion provided on the substrate surface and the conductive portion thereof. A resistance measuring device for measuring the resistance of the connection portion of the substrate to be measured, which has a pair with a connection portion electrically connected to the shaped conductor and has three or more pairs. The current supply section for supplying a preset supply current to the supply-side conductive section, which is one of the conductive sections, and the supply-side conductive section, which is one of the conductive sections, are different from each other. A current lead-in portion for drawing a preset pull-in current from the lead-in side conductive portion, and a conductive portion for voltage measurement which is a conductive portion different from the supply-side conductive portion and the pull-in side conductive portion of each of the conductive portions. The supply side voltage detection unit that detects the supply side voltage, which is the voltage between the unit and the supply side conductive unit, and the lead-in side voltage, which is the voltage between the voltage measurement conductive unit and the lead-in side conductive unit. The resistance value of the connection portion paired with the supply-side conductive portion is calculated based on the lead-in side voltage detection unit to be detected, the supply current and the supply-side voltage, and is based on the lead-in current and the lead-in side voltage. It is provided with a resistance calculation unit for calculating the resistance value of the connection portion paired with the lead-in side conductive portion.

Further, in the resistance measuring method according to one aspect of the present invention, a conductive planar conductor that spreads in a plane shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion thereof are formed. A resistance measuring method for measuring the resistance of the connecting portion of a substrate to be measured, which has a pair with a connecting portion electrically connected to the planar conductor and has three or more pairs. The current supply step of supplying a preset supply current to the supply-side conductive portion, which is one of the above conductive portions, and the supply-side conductive portion, which is one of the conductive portions, are different from each other. A current drawing step of drawing a preset pulling current from the pull-in side conductive part, and a voltage measurement conductive part which is a conductive part different from the supply side conductive part and the pull-in side conductive part of each of the conductive parts. The supply-side voltage detection step of detecting the supply-side voltage, which is the voltage between the supply-side conductive portion, and the lead-in side voltage, which is the voltage between the voltage-measuring conductive portion and the lead-in-side conductive portion, are detected. The resistance value of the connection portion paired with the supply side conductive portion is calculated based on the pull-in side voltage detection step and the supply current and the supply side voltage, and the pull-in current and the pull-in side voltage are used as the basis for calculating the resistance value. It includes a resistance calculation step of calculating the resistance value of the connecting portion paired with the lead-in side conductive portion.

It is a schematic diagram conceptually showing the structure of the resistance measuring apparatus which uses the resistance measuring method which concerns on one Embodiment of this invention. It is a block diagram which shows an example of the electric structure of the measuring part shown in FIG. It is a flowchart which shows an example of the operation of the resistance measuring apparatus shown in FIG. It is a flowchart which shows an example of the operation of the resistance measuring apparatus shown in FIG. It is explanatory drawing for demonstrating operation of the resistance measuring apparatus shown in FIG. It is explanatory drawing for demonstrating operation of the resistance measuring apparatus shown in FIG. It is a conceptual schematic diagram which shows the multilayer board which is an example of the board which provided the planar inner layer pattern in the board inner layer. It is a conceptual schematic diagram which shows an example of an intermediate substrate. It is explanatory drawing for demonstrating the measuring method for measuring the resistance value of the intermediate substrate shown in FIG.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings. It should be noted that the configurations with the same reference numerals in the respective figures indicate that they are the same configurations, and the description thereof will be omitted. FIG. 1 is a schematic diagram conceptually showing the configuration of a resistance measuring device 1 using the resistance measuring method according to the embodiment of the present invention. The resistance measuring device 1 shown in FIG. 1 is a device for measuring the resistance of the substrate to be measured to be measured. The resistance measuring device 1 may be a substrate inspection device that determines the quality of the substrate to be measured based on the measured resistance value.

The substrate to be measured is, for example, an intermediate substrate or a multilayer substrate, and is a package substrate for a semiconductor package, a film carrier, a printed wiring board, a flexible substrate, a ceramic multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, and these substrates. It may be an intermediate substrate in the process of manufacturing. The multilayer substrate WB shown in FIG. 7 and the intermediate substrate B shown in FIG. 8 correspond to an example of the substrate to be measured. FIG. 1 shows an example in which an intermediate substrate B is attached to a resistance measuring device 1 as a substrate to be measured. An arbitrary number of conductive portions PA1, PB1, ..., PZ1 are provided. Hereinafter, the conductive portions PA1, PB1, ..., PZ1 are collectively referred to as the conductive portion P.

The resistance measuring device 1 shown in FIG. 1 has a housing 112. The substrate fixing device 110, the measuring unit 121, the measuring unit 122, the measuring unit moving mechanism 125, and the control unit 20 are mainly provided in the internal space of the housing 112. The substrate fixing device 110 is configured to fix the intermediate substrate B to be measured at a predetermined position.

The measuring unit 121 is located above the intermediate substrate B fixed to the substrate fixing device 110. The measuring unit 122 is located below the intermediate board B fixed to the board fixing device 110. The measuring units 121 and 122 are provided with measuring jigs 4U and 4L for bringing the probe into contact with the conductive portion P formed on the intermediate substrate B.

A plurality of probes Pr are attached to the measuring jigs 4U and 4L. The measuring jigs 4U and 4L arrange and hold a plurality of probes Pr so as to correspond to the arrangement of the conductive portion P to be measured formed on the surface of the intermediate substrate B. The measuring unit moving mechanism 125 appropriately moves the measuring units 121 and 122 in the housing 112 in response to the control signal from the control unit 20, and moves the probe Pr of the measuring jigs 4U and 4L to each conductive unit P of the intermediate substrate B. To contact.

The resistance measuring device 1 may include only one of the measuring units 121 and 122. Then, the resistance measuring device 1 may invert the substrate to be measured upside down and measure both sides of the substrate sequentially by one of the measuring units.

The control unit 20 is, for example, a CPU (Central Processing Unit) that executes a predetermined arithmetic process, a RAM (Random Access Memory) that temporarily stores data, and a ROM (Read Only Memory) that stores a predetermined control program. It is configured to include a storage unit such as an HDD (Hard Disk Drive) or a peripheral circuit thereof. Then, the control unit 20 functions as the conductive unit selection unit 21 and the resistance calculation unit 22 by executing the control program stored in the storage unit, for example.

FIG. 2 is a block diagram showing an example of the electrical configuration of the measuring unit 121 shown in FIG. Since the measuring unit 122 is configured in the same manner as the measuring unit 121, the description thereof will be omitted. The measurement unit 121 shown in FIG. 2 includes a plurality of measurement blocks M1 to Mn (n is a natural number), a scanner unit 31, and a plurality of probe Prs. The measurement blocks M1 to Mn correspond to an example of the set. Each of the measurement blocks M1 to Mn includes a current supply unit CS, a current lead-in unit CM, a supply-side voltage detection unit VM1, and a lead-in side voltage detection unit VM2, respectively.

The scanner unit 31 is a switching circuit configured by using a switching element such as a transistor or a relay switch. The scanner unit 31 detects the voltage generated between the current terminals + F and −F for supplying the current I for resistance measurement to the intermediate substrate B and the conductive portion P of the intermediate substrate B due to the current I. It has n sets of terminals + S1, −S1, + S2, −S2, and has an arbitrary number of ground terminals G connected to the circuit ground. Further, a plurality of probe Prs are electrically connected to the scanner unit 31. The scanner unit 31 is located between the current terminal + F, −F, the voltage detection terminal + S1, −S1, + S2, −S2, the ground terminal G, and the plurality of probes Pr in response to the control signal from the control unit 20. Switch the connection relationship.

One end of the output terminal of the current supply unit CS is connected to the circuit ground, and the other end is connected to the current terminal + F. The current supply unit CS is a constant current circuit that supplies a preset supply current Io to the current terminal + F in response to a control signal from the control unit 20.

One end of the current drawing portion CM is connected to the current terminal −F, and the other end is connected to the circuit ground. The current drawing unit CM is a constant current circuit that draws a preset drawing current Ii from the current terminal −F to the circuit ground in response to a control signal from the control unit 20.

An oxide film may be formed on the surface of each conductive portion P due to oxidation. When an oxide film is formed on the surface of the conductive portion P, the contact resistance with the probe Pr increases, so that the accuracy of resistance measurement decreases. Such an oxide film can be removed by passing a current equal to or higher than a predetermined oxide film removal current value. The oxide film removal current value is, for example, 20 mA. A rated current value is set for the probe Pr as an upper limit value of a current value that can be passed without damaging the probe. The rated current value of the probe Pr is, for example, a current value of less than 40 mA, for example, 30 mA.

The pull-in current Ii and the supply current Io are set to, for example, 20 mA or more and 30 mA or less. As a result, the oxide film on the surface of the conductive portion P is removed without damaging the probe Pr, and the accuracy of resistance measurement is improved.

It is preferable that the total of the supply currents Io supplied from the current supply units CS of the measurement blocks M1 to Mn and the total of the draw-in currents Ii drawn by the current draw-in units CM of the measurement blocks M1 to Mn are substantially equal. If the sum of each supply current Io and the sum of each lead current Ii are approximately equal, substantially all of the current supplied from the n current supply units CS to the intermediate board B is provided by the n current draw units CM to the intermediate board B. Since it is drawn from, the leakage current from the intermediate substrate B to the outside is suppressed.

Further, it is more preferable that each supply current Io and each lead current Ii are substantially equal to each other. When each supply current Io and each lead-in current Ii are substantially equal to each other, the currents flowing between the connection portions in each portion of the intermediate substrate B are equalized, and as a result, the potential of the metal plate MP is stabilized. As a result, the resistance measurement accuracy is improved.

One end of the supply-side voltage detection unit VM1 is connected to the voltage detection terminal + S1, and the other end is connected to the voltage detection terminal −S1. The supply-side voltage detection unit VM1 is a voltage detection circuit that measures the voltage between the voltage detection terminals + S1 and −S1 and transmits the voltage value as the supply-side voltage V1 to the control unit 20.

One end of the lead-in side voltage detection unit VM2 is connected to the voltage detection terminal + S2, and the other end is connected to the voltage detection terminal −S2. The lead-in side voltage detection unit VM2 is a voltage detection circuit that measures the voltage between the voltage detection terminals + S2 and S2 and transmits the voltage value as the draw-in side voltage V2 to the control unit 20.

The scanner unit 31 arbitrarily sets the ground terminal G and the current terminals + F, −F and the voltage detection terminals + S1, −S1, + S2, −S2 of the measurement blocks M1 to Mn according to the control signal from the control unit 20. It is made conductively connectable to the probe Pr of. As a result, the scanner unit 31 causes a current to flow between the arbitrary conductor units with which the probe Pr is in contact in response to the control signal from the control unit 20, and detects the voltage generated between the arbitrary conductor units as the supply side voltage. It is made possible to connect an arbitrary conductor part to the circuit ground by measuring by the part VM1 and the lead-in side voltage detection part VM2. The scanner unit 31 corresponds to an example of a grounding unit.

The conductive portion selection unit 21 includes n supply-side conductive portions, n lead-in-side conductive portions, and n (conducting-side conductive portions) corresponding to the measurement blocks M1 to Mn from among the conductive portions P with which the probe Pr is in contact. Or 2n) voltage measuring conductive parts and an arbitrary number of grounding conductive parts are selected. The resistance value of the connection portion paired with the conductive portion P selected as the supply side conductive portion and the lead-in side conductive portion is calculated by the resistance calculation unit 22. Therefore, the conductive portion selection unit 21 finally resists by sequentially selecting a new conductive portion P paired with the connection portion for which the resistance value has not been calculated as the supply side conductive portion and the lead-in side conductive portion. The resistance value of all the connections for which the value is to be measured is measured.

The conductive section selection section 21 connects the probe Pr in contact with the supply side conductive section and the current supply section CS (current terminal + F) by the scanner section 31, and connects with the probe Pr in contact with the lead-in side conductive section. Connect the current lead-in part CM (current terminal-F), connect the probe Pr in contact with the supply side conductive part, and connect one end (voltage detection terminal + S1) of the supply side voltage detection part VM1 to conduct voltage measurement. The probe Pr in contact with the unit and the other end (voltage detection terminal-S1) of the voltage detection unit VM1 on the supply side are connected, and the probe Pr in contact with the conductive part for voltage measurement and the voltage detection unit VM2 on the lead-in side One end (voltage detection terminal + S2) is connected, and the probe Pr in contact with the lead-in side conductive portion is connected to the other end (voltage detection terminal-S2) of the lead-in side voltage detection unit VM2.

As a result, the conductive section selection section 21 causes the current supply section CS and the current lead-in section CM to flow a current between the supply-side conductive section and the lead-in side conductive section via the metal plate MP, and the supply-side voltage detection section VM1. The supply side voltage V1 between the supply side conductive part and the voltage measurement conductive part is detected by the lead-in side voltage detection part VM2, and the pull-in side voltage V2 between the pull-in side conductive part and the voltage measurement conductive part is detected by the lead-in side voltage detection part VM2. Let me.

The resistance calculation unit 22 corresponds to the measurement blocks M1 to Mn, and based on the supply current Io of each measurement block and the supply side voltage V1, determines the resistance value of the connection portion paired with the supply side conductive portion of each measurement block. calculate. Further, the resistance calculation unit 22 corresponds to the measurement blocks M1 to Mn, and the resistance of the connection portion paired with the lead-in side conductive portion of each measurement block based on the pull-in current Ii and the pull-in side voltage V2 of each measurement block. Calculate the value.

Next, the operation of the resistance measuring device 1 described above will be described. Taking the case where the substrate to be measured is the intermediate substrate B as an example, a resistance measuring method for measuring the resistance of the substrate WB1 using the measuring unit 121 will be described. The case of measuring the resistance of the substrate WB2 using the measuring unit 122 is the same as the case of measuring the resistance of the substrate WB1 using the measuring unit 121, and thus the description thereof will be omitted.

3 and 4 are flowcharts showing an example of the operation of the resistance measuring device 1 using the resistance measuring method according to the embodiment of the present invention. 5 and 6 are explanatory views for explaining the operation of the resistance measuring device 1 shown in FIG. The explanatory views shown in FIGS. 5 and 6 illustrate a case where the intermediate substrate B is measured. In FIGS. 5 and 6, the description of the scanner unit 31 is omitted for the sake of simplicity.

First, the control unit 20 moves the measurement unit 121 by the measurement unit movement mechanism 125, and brings the probe Pr of the measurement jig 4U into contact with the intermediate substrate B fixed to the substrate fixing device 110 (step S1). In the examples shown in FIGS. 5 and 6, a case where resistance is measured by a so-called four-terminal measuring method is illustrated, and two probes Pr come into contact with each conductive portion P.

The resistance measuring device 1 is not limited to an example in which resistance is measured by a four-terminal measuring method, and the probe Pr is brought into contact with each conductive portion one by one, and one probe Pr is used for both current supply and voltage measurement. May be.

Next, the conductive portion selection unit 21 selects a grounding conductive portion from the conductive portions P in contact with the probe Pr, and further comprises n supply-side conductive portions corresponding to the measurement blocks M1 to Mn. The n lead-in side conductive portions and the n conductive portions for voltage measurement are selected (step S2: conductive portion selection step).

Since the resistance value of two connection parts can be measured corresponding to one measurement block, if the number of connection parts to be measured is less than 2n, the conductivity on the supply side depends on the number of connection parts to be measured. The part, the lead-in side conductive part, and the voltage measurement conductive part may be selected. At least one conductive portion for grounding may be selected, and a plurality of conductive portions may be selected.

The conductive section selection section 21 supplies the supply side conductive section, the lead-in side conductive section, and the voltage measurement conductive section selected by the scanner section 31 to the current supply section CS, the current lead-in section CM, and the current lead-in section CM of the measurement blocks M1 to Mn. It is connected to the side voltage detection unit VM1 and the lead-in side voltage detection unit VM2, and the grounding conductive part and the circuit ground are connected.

FIG. 5 shows the selected supply-side conductive part, lead-in side conductive part, voltage measurement conductive part, and grounding conductive part, current supply part CS, current lead-in part CM, supply-side voltage detection part VM1, and lead-in side voltage. It is explanatory drawing which shows an example of the connection relation with a detection part VM2 and a circuit ground.

In the example shown in FIG. 5, the conductive portion PA1 is selected as the supply side conductive portion, the conductive portion PC1 is selected as the lead-in side conductive portion, and the conductive portion PB1 is selected as the voltage measurement conductive portion corresponding to the measurement block M1. ing. Corresponding to the measurement block M2, the conductive part PD1 is selected as the supply side conductive part, the conductive part PF1 is selected as the lead-in side conductive part, and the conductive part PE1 is selected as the voltage measurement conductive part. Hereinafter, as for the other conductive portion P, the supply side conductive portion, the lead-in side conductive portion, the voltage measurement conductive portion, and the grounding conductive portion are appropriately selected. As the grounding conductive portion, the conductive portion PZ1 is selected.

Next, the control unit 20 supplies the supply current Io from the current supply units CS of the measurement blocks M1 to Mn to each supply-side conductive unit (step S3: current supply step). In the current supply process, for example, an ammeter is connected in series with the current supply unit CS, and the current actually supplied from the current supply unit CS to the supply side conductive unit is measured as the supply current Io, and is measured by this ammeter. The supplied current Io may be used in the resistance calculation step of step S7 described later.

Next, the control unit 20 draws the pull-in current Ii from each lead-in side conductive part by the current pull-in part CM of the measurement blocks M1 to Mn (step S4: current pull-in step). In the current drawing step, for example, an ammeter is connected in series with the current drawing part CM, and the current actually drawn from the drawing side conductive part by the current drawing part CM is measured as the drawing current Ii, and the current is measured by this ammeter. The pull-in current Ii may be used in the resistance calculation step of step S7, which will be described later.

Next, in the measurement blocks M1 to Mn, the supply-side voltage detection unit VM1 detects the supply-side voltage V1 between the supply-side conductive unit and the voltage measurement conductive unit (step S5: supply-side voltage detection step). ..

In this case, as is clear from the current path shown by the broken line in FIG. 5, the connecting portions paired with the conductive portions PB1, PE1, ..., PW1 which are the conductive portions for voltage measurement corresponding to the measurement blocks M1 to Mn. No current flows through the RB, RE, ..., RW, so no voltage is generated at this point. As a result, each supply-side voltage V1 measured by each supply-side voltage detection unit VM1 does not include the voltage generated by the connection units RB, RE, ..., RW. Therefore, each supply-side voltage V1 has a supply current Io in the connection portions RA, RD, ..., RV paired with the supply-side conductive portions PA1, PD1, ..., PV1 corresponding to the measurement blocks M1 to Mn. It is almost equal to the voltage generated by the flow.

Next, in the measurement blocks M1 to Mn, the lead-in side voltage detection unit VM2 detects the pull-in side voltage V2 between the lead-in side conductive part and the voltage measurement conductive part (step S6: pull-in side voltage detection step). ..

In this case, as is clear from the current path shown by the broken line in FIG. 5, the connecting portions paired with the conductive portions PB1, PE1, ..., PW1 which are the conductive portions for voltage measurement corresponding to the measurement blocks M1 to Mn. No current flows through the RB, RE, ..., RW, so no voltage is generated at this point. As a result, each lead-in side voltage V2 measured by each lead-in side voltage detection unit VM2 does not include the voltage generated by the connection units RB, RE, ..., RW. Therefore, each lead-in voltage V2 has a lead-in current Ii in the connection portions RC, RF, ..., RX paired with the lead-in side conductive portions PC1, PF1, ..., PX1 corresponding to the measurement blocks M1 to Mn. It is almost equal to the voltage generated by the flow.

Next, based on the supply-side voltage V1 and the lead-in side voltage V2 detected corresponding to the measurement blocks M1 to Mn, and the lead-in current Ii and the supply current Io, the resistance calculation unit 22 uses the following equation (1). Based on (2), the resistance value Ro of the connection portion paired with the supply side conductive portion corresponding to the measurement blocks M1 to Mn and the resistance value Ri of the connection portion paired with the lead-in side conductive portion are calculated ( Step S7: Resistance calculation step).
Resistance value of the connection part paired with the conductive part on the supply side Ro = V1 / Io ... (1)
Resistance value of the connection part paired with the lead-in side conductive part Ri = V2 / Ii ... (2)

In the example shown in FIG. 5, the resistance values Ra, Rd, ..., Rv of the connection portions RA, RD, ..., RV are calculated as the resistance values Ro, and the connection portions RC, RF, ..., RX The resistance values Rc, Rf, ..., Rx are calculated as the resistance values Ri.

Thereby, the resistance values Ra, Rc, Rd, Rf, ..., Rv, Rx of the connection portions RA, RC, RD, RF, ..., RV, RX can be individually measured. In this case, voltage detection can be performed at two locations in each of the measurement blocks M1 to Mn. Therefore, the voltage detection for resistance measurement can be performed in parallel for the connection portion that is twice the number n of the measurement blocks, so that the resistance measurement time can be shortened.

Further, since the supply current Io and the lead-in current Ii are current values equal to or higher than the oxide film removal current value and lower than the rated current value of the probe Pr, the probe Pr is not damaged and the surface of each conductive portion P is oxidized. The membrane can be removed. As a result, the resistance measurement accuracy of each connection portion can be improved.

In FIG. 5, if the current lead-in portion CM is not provided and the lead-in side conductive portions PC1, PF1, ..., PX1 are directly connected to the circuit ground, the measurement blocks M1 to Mn. The current supply unit CS is connected in parallel to the metal plate MP, and the lead-in side conductive units PC1, PF1, ..., PX1 are also connected in parallel to the metal plate MP.

Therefore, the current supplied from the current supply unit CS of the measurement blocks M1 to Mn is the resistance value of the current path from each current supply unit CS to the circuit ground via the lead-in side conductive units PC1, PF1, ..., PX1. The current flows through the lead-in side conductive portions PC1, PF1, ..., PX1 is distributed according to the above.

As a result, the current flowing through the lead-in side conductive portions PC1, PF1, ..., PX1 may exceed the rated current value of the probe Pr or may not reach the oxide film removal current value. The probe Pr that comes into contact with the lead-in side conductive part in which the flowing current exceeds the rated current value is damaged, and the lead-in side conductive part in which the flowing current is less than the oxide film removal current value does not remove the oxide film. The calculation accuracy of the resistance value of the connecting portion paired with is lowered.

On the other hand, according to the resistance measuring device 1, the current flowing through the lead-in side conductive portions PC1, PF1, ..., PX1 is equal to or more than the oxide film removing current value and equal to or less than the rated current value of the probe Pr depending on each current supply unit CS. Therefore, the resistance measurement accuracy of each connection portion can be improved without damaging the probe Pr.

Further, if the grounding conductive portion PZ1 is not connected to the circuit ground, the metal plate MP will be connected to the circuit ground via the internal impedance of the current supply portion CS or the current lead-in portion CM. The potential of the metal plate MP becomes unstable. When the potential of the metal plate MP becomes unstable, the voltage measurement by the supply side voltage detection unit VM1 and the lead-in side voltage detection unit VM2 becomes unstable, and as a result, the measurement accuracy of the supply side voltage V1 and the pull-in side voltage V2 decreases. The accuracy of calculating the resistance value of each connection may decrease.

On the other hand, according to the resistance measuring device 1, the grounding conductive portion PZ1 is connected to the circuit ground by the scanner unit 31 (grounding portion), and the metal plate MP is connected to the circuit ground via the low resistance connecting portion RZ. , The potential of the metal plate MP is stabilized. As a result, the measurement accuracy of the supply side voltage V1 and the lead-in side voltage V2 is improved, and the calculation accuracy of the resistance value of each connection portion is improved.

Next, the conductive portion selection unit 21 confirms whether or not the resistance values of all the connection portions RA to RZ to be measured have been calculated (step S11). Then, if the resistance values of all the connection portions RA to RZ to be measured have been calculated (YES in step S11), the conductive portion selection unit 21 ends the process.

On the other hand, if there is a connection portion for which the resistance value has not been calculated yet (NO in step S11), the conductive portion selection portion 21 is paired with the connection portion for which the probe Pr is in contact and the resistance value has not been calculated. N supply-side conductive parts and n lead-in-side conductive parts corresponding to the measurement blocks M1 to Mn are newly selected from the conductive parts, and the conductive parts other than the newly selected conductive parts are further selected. Among them, the grounding conductive portion and n voltage measuring conductive portions corresponding to the measurement blocks M1 to Mn are newly selected (step S12).

Then, the conductive section selection section 21 uses the scanner section 31 to newly select the supply side conductive section, the lead-in side conductive section, and the voltage measurement conductive section by using the current supply section CS and the current lead-in section of the measurement blocks M1 to Mn. It is connected to the part CM, the supply side voltage detection part VM1, and the lead-in side voltage detection part VM2, the newly selected grounding conductive part is connected to the circuit ground, and the processing of step S3 and subsequent steps is repeated again.

FIG. 6 shows a newly selected supply-side conductive part, a lead-in side conductive part, a voltage measurement conductive part, and a grounding conductive part, a current supply part CS, a current pull-in part CM, a supply-side voltage detection part VM1, and a lead-in part. It is explanatory drawing which shows an example of the connection relation with a side voltage detection part VM2, and a circuit ground.

In the example shown in FIG. 6, the conductive part PB1 is selected as the supply side conductive part, the conductive part PE1 is selected as the lead-in side conductive part, and the conductive part PC1 and the conductive part are selected as the voltage measurement conductive part corresponding to the measurement block M1. PD1 is selected. In this way, a plurality of conductive portions may be used as the conductive portions for voltage measurement.

Further, corresponding to the measurement block Mn, the conductive portion PW1 is selected as the supply side conductive portion, the conductive portion PZ1 is selected as the lead-in side conductive portion, and the conductive portion PX1 is selected as the voltage measurement conductive portion. Hereinafter, as for the other conductive portion P, the supply side conductive portion, the lead-in side conductive portion, the voltage measurement conductive portion, and the grounding conductive portion are appropriately selected. As the grounding conductive part, the conductive part PA1 is selected.

In the example shown in FIG. 6, in step S2, the conductive part for voltage measurement or the conductive part for grounding is used, and the conductive parts PB1, PE1, PW1, PZ1 whose resistance has not been measured are used as the conductive part on the supply side or the conductive part on the lead-in side. , The resistance value of the connection portion paired with the conductive portions PB1, PE1, PW1, PZ1 is measured.

Hereinafter, the processes of steps S3 to S11 are repeated based on the newly selected conductive portion on the supply side, the conductive portion on the lead-in side, and the conductive portion for voltage measurement, and finally the resistance values of all the connection portions to be measured. Is measured.

As described above, according to the processes of steps S1 to S12, the planar conductor such as the conductive intermediate substrate B extending in a planar shape, the substrate surface BS1 facing the planar conductor, and the conductive portion PA1 provided on the substrate surface BS1. Resistance values Ra to Rz of the connection portions RA to RZ of the substrate to be measured such as the intermediate substrate B having a pair of the connection portions RA to RZ for electrically connecting the PZ1 and the conductive portions PA1 to PZ1 to the planar conductor. Can be measured individually.

The number of measurement blocks may be one. Even if the number of measurement blocks is one, the resistances of the two connecting portions corresponding to the measurement blocks can be individually measured. Further, it is not necessary to provide the grounding conductive portion, and the scanner unit 31 does not have to connect the grounding conductive portion to the circuit ground.

Further, an example is shown in which a plurality of probes Pr are arranged so as to correspond to the arrangement of the conductive parts of the substrate to be inspected. The supply-side voltage detection unit VM1, the lead-in-side voltage detection unit VM2, and the circuit ground may be electrically connected to the conductive unit.

A resistance measuring device according to one aspect of the present invention has a conductive planar conductor that spreads in a plane, a substrate surface facing the planar conductor, and a conductive portion provided on the substrate surface and the conductive portion thereof. A resistance measuring device for measuring the resistance of the connection portion of the substrate to be measured, which has a pair with a connection portion electrically connected to the shaped conductor and has three or more pairs. The current supply section for supplying a preset supply current to the supply-side conductive section, which is one of the conductive sections, and the supply-side conductive section, which is one of the conductive sections, are different from each other. A current lead-in portion for drawing a preset pull-in current from the lead-in side conductive portion, and a conductive portion for voltage measurement which is a conductive portion different from the supply-side conductive portion and the pull-in side conductive portion of each of the conductive portions. The supply side voltage detection unit that detects the supply side voltage, which is the voltage between the unit and the supply side conductive unit, and the lead-in side voltage, which is the voltage between the voltage measurement conductive unit and the lead-in side conductive unit. The resistance value of the connection portion paired with the supply-side conductive portion is calculated based on the lead-in side voltage detection unit to be detected, the supply current and the supply-side voltage, and is based on the lead-in current and the lead-in side voltage. It is provided with a resistance calculation unit for calculating the resistance value of the connection portion paired with the lead-in side conductive portion.

According to this configuration, the supply current is supplied to the supply side conductive part by the current supply part, and the draw current is drawn from the pull-in side conductive part by the current pulling part, and as a result, the supply side conductive part and the supply side conductive part are paired. A current flows through the connection portion, the planar conductor, the connection portion paired with the lead-in side conductive portion, and the lead-in side conductive portion. However, no current flows through the connection portion paired with the voltage measurement conductive portion, and therefore no voltage is generated at this connection portion. Therefore, the supply side is the voltage between the voltage measurement conductive portion and the supply side conductive portion. The voltage includes the voltage generated at the connection portion paired with the supply side conductive portion, and does not include the voltage generated at the other connection portion. As a result, the resistance value calculated by the resistance calculation unit based on the supply current and the supply side voltage becomes substantially equal to the resistance value of the connection portion paired with the supply side conductive portion. Similarly, the lead-in side voltage, which is the voltage between the voltage measurement conductive portion and the lead-in side conductive portion, includes the voltage generated at the connection portion paired with the pull-in side conductive portion, and is generated at the other connection portions. The voltage is not included. As a result, the resistance value calculated by the resistance calculation unit based on the lead-in current and the draw-in side voltage becomes substantially equal to the resistance value of the connection portion paired with the lead-in side conductive portion. Thereby, the resistance value of the connection portion paired with the supply side conductive portion and the resistance value of the connection portion paired with the lead-in side conductive portion can be individually measured.

Further, a plurality of sets including the current supply section, the current lead-in section, the supply-side voltage detection section, and the pull-in-side voltage detection section are provided, and the supply-side conductive section, the above-mentioned, corresponding to each of the sets. The lead-in side conductive part and the voltage measurement conductive part are set, and the resistance calculation part corresponds to each set based on the supply current and the supply side voltage detected corresponding to each set. The resistance value of the connection portion paired with the supply side conductive portion is calculated, and based on the pull-in current and the pull-in side voltage detected corresponding to each set, the pull-in side conductivity corresponding to each set is obtained. It is preferable to calculate the resistance value of the connecting portion paired with the portion.

According to this configuration, it is possible to measure the resistance value of the connection part paired with the supply side conductive part and the resistance value measurement of the connection part paired with the lead-in side conductive part in parallel for each set. Therefore, it is possible to shorten the resistance measurement time.

Further, it is preferable that the total of the supply currents corresponding to the respective sets and the total of the lead-in currents corresponding to the respective sets are substantially equal.

According to this configuration, almost all the current supplied from the current supply unit of each set to the substrate to be measured is drawn from the substrate to be measured by the current drawing unit of each set, so that a leakage current flows from the substrate to be measured to the outside. Is suppressed.

Further, it is preferable that the supply current and the lead-in current are substantially equal to each other.

According to this configuration, the potential of the planar conductor is stabilized as a result of equalizing the currents flowing between the connecting portions in each portion of the substrate to be measured. As a result, the resistance measurement accuracy is improved.

Further, in order to contact each of the conductive parts in order to supply a current by the current supply unit, draw a current by the current drawing unit, detect a voltage by the supply side voltage detecting unit, and detect a voltage by the drawing side voltage detecting unit. The supply current and the lead-in current are set to be equal to or higher than the oxide film removing current value for removing the oxide film generated on the surface of each conductive portion and equal to or lower than the rated current value of the probe. Is preferable.

According to this configuration, a current that is equal to or higher than the oxide removal current value for removing the oxide film and less than or equal to the rated current value of the probe flows through each probe, so that the probe is not damaged and is conductive. The oxide film on the surface of the portion can be removed to improve the accuracy of resistance measurement.

Further, among the conductive portions, it is preferable to further include a grounding portion for connecting the supply side conductive portion, the lead-in side conductive portion, and the grounding conductive portion different from the voltage measuring conductive portion to the circuit ground. ..

According to this configuration, the grounding conductive portion is connected to the circuit ground by the grounding portion, and the planar conductor is connected to the circuit ground via the connecting portion, so that the potential of the planar conductor is stabilized. As a result, the measurement accuracy of the supply side voltage and the lead-in side voltage is improved, and the calculation accuracy of the resistance value of each connection portion is improved.

Further, in the resistance measuring method according to one aspect of the present invention, a conductive planar conductor that spreads in a plane shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion thereof are formed. A resistance measuring method for measuring the resistance of the connecting portion of a substrate to be measured, which has a pair with a connecting portion electrically connected to the planar conductor and has three or more pairs. The current supply step of supplying a preset supply current to the supply-side conductive portion, which is one of the above conductive portions, is different from the supply-side conductive portion, which is one of the conductive portions. A current drawing step of drawing a preset pull-in current from the lead-in side conductive part, and a voltage measurement conductive part which is a conductive part different from the supply-side conductive part and the pull-in side conductive part of each of the conductive parts. The supply-side voltage detection step of detecting the supply-side voltage, which is the voltage between the supply-side conductive portion, and the lead-in side voltage, which is the voltage between the voltage-measuring conductive portion and the lead-in-side conductive portion, are detected. The resistance value of the connection portion paired with the supply side conductive portion is calculated based on the pull-in side voltage detection step and the supply current and the supply side voltage, and the pull-in current and the pull-in side voltage are used as the basis for calculating the resistance value. It includes a resistance calculation step of calculating the resistance value of the connecting portion paired with the lead-in side conductive portion.

According to this configuration, the supply current is supplied to the supply-side conductive portion in the current supply process, and the draw-in current is drawn from the draw-in side conductive portion in the current draw-in process, resulting in pairing with the supply-side conductive portion and the supply-side conductive portion. A current flows through the connection portion, the planar conductor, the connection portion paired with the lead-in side conductive portion, and the lead-in side conductive portion. However, no current flows through the connection portion paired with the voltage measurement conductive portion, and therefore no voltage is generated in this connection portion. Therefore, the supply is the voltage between the voltage measurement conductive portion and the supply side conductive portion. The side voltage includes the voltage generated at the connection portion paired with the supply side conductive portion, and does not include the voltage generated at the other connection portion. As a result, the resistance value calculated based on the supply current and the supply side voltage in the resistance calculation step becomes substantially equal to the resistance value of the connection portion paired with the supply side conductive portion. Similarly, the lead-in side voltage, which is the voltage between the voltage measurement conductive portion and the lead-in side conductive portion, includes the voltage generated at the connection portion paired with the pull-in side conductive portion, and is generated at the other connection portions. The voltage is not included. As a result, the resistance value calculated based on the pull-in current and the pull-in side voltage in the resistance calculation step becomes substantially equal to the resistance value of the connection portion paired with the pull-in side conductive portion. Thereby, the resistance value of the connection portion paired with the supply side conductive portion and the resistance value of the connection portion paired with the lead-in side conductive portion can be individually measured.

In the resistance measuring device and the resistance measuring method having such a configuration, a conductive planar conductor that spreads in a plane, a substrate surface facing the planar conductor, and a conductive portion provided on the substrate surface and the conductive portion thereof are surfaced. The resistance of the connection portion of the substrate to be measured, which has a pair with the connection portion electrically connected to the conductor, can be individually measured.

This application is based on Japanese Patent Application No. 2016-233892 filed on December 1, 2016, the contents of which are included in the present application. In addition, the specific embodiment or example made in the section of the mode for carrying out the invention merely clarifies the technical content of the present invention, and the present invention is described in such a specific example. It should not be construed in a narrow sense.

1 Resistance measuring device 4U, 4L Measuring jig 20 Control unit 21 Conductive unit selection unit 22 Resistance calculation unit 31 Scanner unit 110 Board fixing device 112 Housing 121, 122 Measuring unit 125 Measuring unit Moving mechanism B Intermediate board (measured board)
BS, BS1 Substrate surface BS2 Contact surface CM Current lead-in part CS Current supply part G Ground terminal Ii Pull-in current Io Supply current IP Inner layer pattern (planar conductor)
M1-Mn measurement block (set)
MP metal plate (planar conductor)
P, PA1 to PZ1 Conductive part Pr Probe RA to RZ Connection part Ra to Rz Resistance value V1 Supply side voltage V2 Pull-in side voltage VM1 Supply side voltage detection part VM2 Pull-in side voltage detection part WB Multilayer board (measured board)
WB1, WB2 board

Claims (6)

A conductive planar conductor that spreads in a planar shape, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and a connecting portion that electrically connects the conductive portion to the planar conductor. A resistance measuring device for measuring the resistance of the connection portion of the substrate to be measured, which has a pair of pairs and has three or more pairs.
A current supply unit for supplying a preset supply current to the supply-side conductive unit, which is one of the three or more conductive units, and a current supply unit.
A current drawing unit for drawing a preset drawing current from a drawing side conductive part that is one of the conductive parts and is different from the supply side conductive part.
Supply that detects the supply side voltage, which is the voltage between the voltage measurement conductive part, which is a conductive part different from the supply side conductive part and the lead-in side conductive part, and the supply side conductive part in each of the conductive parts. Side voltage detector and
A lead-in side voltage detection unit that detects a lead-in side voltage, which is a voltage between the voltage measurement conductive portion and the lead-in side conductive portion,
The resistance value of the connection portion paired with the supply side conductive portion is calculated based on the supply current and the supply side voltage, and paired with the lead-in side conductive portion based on the pull-in current and the pull-in side voltage. It is equipped with a resistance calculation unit that calculates the resistance value of the connection unit.
The current supply unit includes first and second terminals, the first terminal is connected to the circuit ground, the second terminal is connected to the supply side conductive unit side, and the first terminal to the second terminal. The supply current is supplied to
The current lead-in portion includes third and fourth terminals, the third terminal is connected to the lead-in side conductive portion side, the fourth terminal is connected to the circuit ground, and the third terminal to the fourth terminal. The lead-in current is drawn into the terminal,
A plurality of sets including the current supply unit, the current lead-in unit, the supply-side voltage detection unit, and the lead-in side voltage detection unit are provided.
The supply side conductive part, the lead-in side conductive part, and the voltage measurement conductive part are set corresponding to each of the above sets.
The resistance calculation unit calculates the resistance value of the connection portion paired with the supply-side conductive portion corresponding to each set based on the supply current and the supply-side voltage corresponding to each set, and each of the above-mentioned resistance calculation units. A resistance measuring device that calculates the resistance value of a connection portion paired with the lead-in side conductive portion corresponding to each set based on the pull-in current corresponding to the set and the lead-in side voltage. The resistance measuring device according to claim 1, wherein the total of the supply currents corresponding to the respective sets and the total of the lead-in currents corresponding to the respective sets are substantially equal to each other. The resistance measuring device according to claim 1 or 2, wherein the supply current and the lead-in current are substantially equal to each other. A probe for contacting each of the conductive parts in order to supply a current by the current supply unit, draw a current by the current drawing unit, detect a voltage by the supply side voltage detecting unit, and detect a voltage by the drawing side voltage detecting unit. With
The supply current and the lead-in current are set to be equal to or more than the oxide film removing current value for removing the oxide film generated on the surface of each conductive portion and equal to or less than the rated current value of the probe, according to claims 1 to 3. The resistance measuring device according to any one item. The resistance measuring device further includes a grounding portion for connecting the supply side conductive portion, the lead-in side conductive portion, and a grounding conductive portion different from the voltage measuring conductive portion to the circuit ground among the conductive portions. The resistance measuring apparatus according to any one of claims 1 to 4. A resistance measuring method for measuring the resistance of the connection portion using the resistance measuring device according to claim 1.
The supply side conductive part, the lead-in side conductive part, and the voltage measurement conductive part are set corresponding to each of the above sets.
Based on the supply current corresponding to each set and the supply side voltage, the resistance value of the connection portion paired with the supply side conductive portion corresponding to each set is calculated, and the lead-in corresponding to each set is calculated. A resistance measuring method for calculating a resistance value of a connection portion paired with the lead-in side conductive portion corresponding to each set based on a current and the lead-in side voltage.

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