JP2006047172A - Apparatus, method and program for inspecting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily detect a position where a short circuit exists between two flat patterns. <P>SOLUTION: A control section 76 is equipped with a current supplying section 76b which outputs an instruction signal to a current generating section 742 in order to start and stop supplying it with current; a reference measuring section 76c which measures a reference potential difference V0 being a potential difference occurring across the flat patterns under such a condition that either the flat pattern for power supply 221 or the flat pattern for ground 231 is supplied with current; a comparison measuring section 76d which measures a comparison potential difference Vi being a potential difference occurring across wiring patterns 211G connected to the flat pattern for ground 231; and a position determining section 76e determining the position where the short circuit SH exists by using the reference potential difference V0 and the comparison potential difference Vi. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention provides a substrate inspection apparatus, a substrate inspection program, and a substrate inspection method that are in pressure contact with a predetermined inspection point set on a wiring pattern of a substrate to be inspected and inspect the electrical characteristics of the substrate to be inspected and the substrate to be inspected. About. In particular, a wiring pattern, a first insulating substrate, a first solid pattern, a second insulating substrate, and a second solid pattern are sequentially stacked, and the wiring patterns are arranged in the first and second insulating substrates. 1st and 2nd wiring pattern which has the 1st and 2nd wiring pattern which is the wiring pattern electrically connected with the said 1st and 2nd solid pattern through the via | veer provided, respectively, The said 1st and 2nd wiring pattern The present invention relates to a substrate inspection apparatus, a substrate inspection program, and a substrate inspection method for detecting the occurrence position of a short circuit between the first and second solid patterns in a substrate to be inspected having at least one of three or more wiring patterns.

  The wiring pattern on a circuit board needs to accurately transmit electrical signals to electrical components such as ICs and resistors mounted on the circuit board. Between wiring points to be inspected for printed wiring boards, circuit wiring boards with wiring patterns formed on liquid crystal panels and plasma display panels, or wiring patterns formed on substrates such as semiconductor wafers The resistance value is measured and the quality is inspected.

  Further, in the case of a short circuit between a power solid pattern and a ground solid pattern in a multi-layer substrate having a power solid pattern and a ground solid pattern, manufacturing the substrate by investigating the cause of the short circuit Manufacturing processes have been improved to prevent the occurrence of short circuits in the process.

  However, in the multilayer substrate having the power supply solid pattern and the grounding solid pattern, when a short circuit occurs between the two solid patterns, it is impossible to specify the occurrence position of the short circuit by resistance measurement. The short circuit position was specified by grinding the substrate gradually from the end face and visually observing the properties of the end face appearing on the surface. However, since such a conventional method requires a large work load, its efficiency has been a problem.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate inspection apparatus, a substrate inspection program, and a substrate inspection method that easily determine the occurrence position of a short circuit between two solid patterns.

  The substrate inspection apparatus according to claim 1, wherein a plurality of wiring patterns, a first insulating substrate, a first solid pattern, a second insulating substrate, and a second solid pattern are laminated in order, First and second wiring pattern groups, which are wiring patterns connected to the first and second solid patterns so as to be energized through vias disposed in the first and second insulating substrates, respectively. And a substrate inspection apparatus for obtaining a short-circuit occurrence position between the first and second solid patterns in a substrate to be inspected, wherein at least one of the first and second wiring pattern groups includes three or more wiring patterns. In order to pass a current through one of the first and second solid patterns, two of the wiring pattern groups connected to the solid pattern so as to be energized through vias. In order to select a wiring pattern, and to measure the potential generated in the other solid pattern via the short circuit due to the current supply means for connecting a power source between the selected wiring patterns and the current flowing in the one solid pattern A reference measuring means for measuring, as a reference potential difference, a potential difference between one of the two wiring patterns and one wiring pattern connected to the other solid pattern through a via so as to be energized; Comparison measuring means for measuring a potential difference between the one wiring pattern and the other wiring pattern as a comparative potential difference in the wiring pattern group connected to be energized via the via to the one solid pattern, Comparing the comparison potential difference with the reference potential difference, a wiring pattern corresponding to the comparison potential difference in which the difference from the reference potential difference is a predetermined threshold value or less It is characterized by comprising a position determining means for determining a short-circuit wiring pattern located near the generation position of the short.

  The substrate inspection program according to claim 8, wherein a plurality of wiring patterns, a first insulating substrate, a first solid pattern, a second insulating substrate, and a second solid pattern are laminated in order, First and second wiring pattern groups, which are wiring patterns connected to the first and second solid patterns so as to be energized through vias disposed in the first and second insulating substrates, respectively. And a substrate inspection apparatus for obtaining a short-circuit occurrence position between the first and second solid patterns in a substrate to be inspected, wherein at least one of the first and second wiring pattern groups includes three or more wiring patterns. In the board inspection program, the board inspection apparatus is energized through a via so as to pass a current through one of the first and second solid patterns. Current supply means for selecting two wiring patterns from a group of wiring patterns connected to each other and connecting a power source between the selected wiring patterns, and through the short circuit by the current flowing through the one solid pattern In order to measure the potential generated in the other solid pattern, one of the two wiring patterns and one wiring pattern connected to the other solid pattern through a via so as to be energized A reference measuring means for measuring a potential difference between the one wiring pattern and another wiring pattern in a wiring pattern group connected to the one solid pattern through a via so as to be energized. A comparison measurement means for measuring the potential difference of the reference potential difference as a comparison potential difference, and comparing the comparison potential difference with the reference potential difference, so that the difference from the reference potential difference is a predetermined threshold value. A wiring pattern corresponding to a is comparison potential below is characterized in that to function as a position determining means for determining a short-circuit wiring pattern located near the generation position of the short.

  The substrate inspection method according to claim 9, wherein a plurality of wiring patterns, a first insulating substrate, a first solid pattern, a second insulating substrate, and a second solid pattern are laminated in order, First and second wiring pattern groups, which are wiring patterns connected to the first and second solid patterns so as to be energized through vias disposed in the first and second insulating substrates, respectively. And a substrate inspection apparatus for obtaining a short-circuit occurrence position between the first and second solid patterns in a substrate to be inspected, wherein at least one of the first and second wiring pattern groups includes three or more wiring patterns. In the substrate inspection method, the current supply means of the substrate inspection apparatus passes a via in the solid pattern so that a current flows through one of the first and second solid patterns. Then, two wiring patterns are selected from the wiring pattern group connected to be energized, a power source is connected between the selected wiring patterns, and the one solid pattern is formed by the reference measuring means of the substrate inspection apparatus. In order to measure the potential generated in the other solid pattern through the short circuit due to the flowing current, one of the two wiring patterns is connected to the other solid pattern so as to be energized through a via. A potential difference between the first wiring pattern and the first wiring pattern is measured as a reference potential difference, and the one of the wiring pattern groups connected to the one solid pattern through the vias by the comparative measuring means of the substrate inspection apparatus. The potential difference between the one wiring pattern and the other wiring pattern is measured as a comparative potential difference, and is used as a position determination unit of the substrate inspection apparatus. Then, the comparison potential difference is compared with the reference potential difference, and a wiring pattern corresponding to the comparison potential difference whose difference from the reference potential difference is equal to or less than a predetermined threshold is set as a short-circuit wiring pattern located in the vicinity of the short-circuit occurrence position. It is characterized by seeking.

  According to these inventions, the current supply means is connected to the solid pattern through the via so as to allow current to flow through one of the first and second solid patterns. Two wiring patterns are selected from the wiring pattern group, and a power source is connected between the selected wiring patterns. Then, a power source is connected to measure the potential generated in the other solid pattern (no current is passed) through a short circuit by the current flowing in the one solid pattern by the current supply means by the reference measuring means. The potential difference between either one of the two wiring patterns that are present and one wiring pattern group that is connected to the other solid pattern (no current is passed) via a via so as to be energized is a reference. Measured as potential difference. This reference potential difference is generated by the current from the position on the solid pattern connected to the wiring pattern into which the current flows through the via to the position where the short circuit occurs in the solid pattern in which the current is supplied by the current supply means. This is consistent with the voltage drop.

  In addition, one of the wiring patterns connected to the one solid pattern (current flowed) via the via can be energized by the comparative measurement means (the reference potential difference is measured) and the other wiring pattern. A potential difference with respect to the wiring pattern is measured as a comparison potential difference. That is, the voltage drop amount generated by the current at the position corresponding to the solid pattern and the wiring pattern group that is connected to be energized through the via on the solid pattern through which the current is passed by the comparison measurement means. It is measured as a comparative potential difference.

  Then, the comparison potential difference is compared with the reference potential difference by the position determining means, and a wiring pattern corresponding to the comparison potential difference whose difference from the reference potential difference is equal to or less than a predetermined threshold is a short-circuit wiring pattern located in the vicinity of the short-circuit occurrence position. Desired. That is, the voltage drop amount (comparative potential difference) generated by the current from the position where the current flows on the solid pattern where the current flows is connected to the wiring pattern where the current flows through the via. A wiring pattern connected via a via to a point that substantially matches the voltage drop (reference potential difference) generated by the current from the position on the solid pattern to the short-circuit occurrence position (the difference is equal to or less than the threshold). However, it is calculated | required as a short circuit wiring pattern located near the generation | occurrence | production position of a short circuit.

  Therefore, the wiring pattern corresponding to the point where the amount of voltage drop caused by the current from the position where the current flows is substantially the same as the amount of voltage drop to the short-circuit occurrence position is the short-circuit wiring located near the short-circuit occurrence position. Since it is calculated | required as a pattern, the generation | occurrence | production position of the short circuit between two solid patterns is calculated | required easily and correctly.

  The board inspection apparatus according to claim 2, wherein the current supply unit selects at least one combination of the two wiring patterns having different wiring patterns, and the reference measuring unit and the comparative measuring unit are configured to use the current measuring unit. Each time a power source is connected between the two wiring patterns of each combination by the supply means, the reference potential difference and the comparison potential difference are measured, respectively, and the position determining means uses the current supply means for the two wiring patterns of each combination. Each time a power source is connected between the first and second short-circuit wiring patterns, the first and second short-circuit wiring patterns are obtained, and the occurrence position of the short circuit is obtained using the first and second short-circuit wiring patterns.

  According to the above configuration, the current supply means selects two combinations of two wiring patterns to which power sources having different wiring patterns are connected. Then, each time the power supply is connected between the two wiring patterns of each combination by the current supply means, the reference potential difference and the comparison potential difference are measured by the reference measurement means and the comparison measurement means, respectively. In addition, each time the power supply is connected between the two wiring patterns of each combination by the position determining means, the first and second short circuit patterns are obtained, and the first and second short circuits are obtained. The occurrence position of the short circuit is obtained using the wiring pattern.

  Therefore, the voltage generated by the current from the position where the current flows in, on two conditions where at least one of the position where the current flows in or the position where the current flows out differs from each other on the solid pattern where the current flows A wiring pattern corresponding to a point where the amount of drop substantially coincides with the amount of voltage drop to the short-circuit occurrence position is obtained as the first and second short-circuit lines, respectively. Therefore, since the occurrence position of the short circuit is obtained, the occurrence position of the short circuit between the two solid patterns can be obtained more accurately.

  4. The substrate inspection apparatus according to claim 3, wherein the position determining means includes threshold setting means for setting the threshold to obtain a plurality of wiring patterns as the first and second short-circuit wiring patterns, respectively. The means is characterized in that an intersection of a curve connecting the first short-circuit wiring pattern and a curve connecting the second short-circuit wiring pattern is obtained as the occurrence position of the short-circuit.

  According to the above configuration, the threshold value setting means sets the threshold value so that the position determining means obtains a plurality of wiring patterns as the first and second short-circuit wiring patterns. Then, a curve connecting the first short-circuit wiring pattern (this curve corresponds to an equipotential curve passing through the short-circuit position on the solid pattern) and a curve connecting the second short-circuit wiring pattern (this curve) by the position determining means. (Corresponding to another equipotential curve passing through the short-circuit position on the solid pattern) is obtained as the short-circuit occurrence position.

  Therefore, since the intersection of two curves corresponding to the equipotential curve passing through the short-circuit position is obtained as the short-circuit occurrence position, the short-circuit occurrence position between the two solid patterns can be obtained more accurately.

  The substrate inspection apparatus according to claim 4 is characterized in that the current supply means selects wiring patterns separated from each other as the two wiring patterns.

  According to the above configuration, the wiring patterns separated from each other are selected by the current supply means as the two wiring patterns corresponding to the position where the current flows into the solid pattern and the position where the current flows out. Therefore, since the point where the current flows into the solid pattern is separated from the point where it flows out, the probability that the short-circuit occurrence position is included in the current flow path increases, and the probability that the short-circuit occurrence position is detected. Will increase.

  The board inspection apparatus according to claim 5, wherein the current supply unit selects, as the two wiring patterns, a wiring pattern group having a larger number of the first and second wiring pattern groups. It is a feature.

  According to the above configuration, the number of the first and second wiring pattern groups as the two wiring patterns corresponding to the position where the current is supplied to the solid pattern and the position where the current is output by the current supply unit is the number of the wiring patterns. The wiring pattern group with the larger number is selected.

  On the other hand, as described above, the comparison potential difference is generated by the current at a position corresponding to the solid pattern and the wiring pattern group connected to be energized through the via on the solid pattern through which the current flows. The more the number of measurement points of the comparison potential difference, the more the voltage drop amount, and the accuracy of specifying the short-circuit occurrence position is improved.

  Therefore, as the two wiring patterns corresponding to the position where the current flows into the solid pattern and the position where the current flows out, the wiring pattern group with the larger number of the first and second wiring pattern groups is selected. (That is, the solid pattern having the larger number of wiring patterns connected via vias is selected as the solid pattern through which the current flows) among the first and second solid patterns. The number of points increases, and the occurrence position of the short circuit is more accurately obtained.

  The substrate inspection apparatus according to claim 6 is characterized in that the current supply means connects a direct current source for supplying a predetermined value of current to the two wiring patterns.

  According to said structure, the direct current source which supplies the electric current of a predetermined value to the two wiring patterns corresponding to the position where an electric current flows into a solid pattern, and the position where an electric current flows out is connected by an electric current supply means. . Accordingly, since a current is caused to flow by the direct current source, a current having an appropriate magnitude is caused to flow in a solid pattern having a small resistance value, and the occurrence position of the short circuit can be obtained more accurately.

  According to a seventh aspect of the present invention, there is provided the substrate inspection apparatus including a current setting unit that sets a current value supplied from the DC current source.

  According to the above configuration, since the current value supplied by the DC current source is set by the current setting means, a more appropriate current is passed through the solid pattern having a small resistance value, and the occurrence position of the short circuit is further increased. Accurately required.

  According to the first, eighth, and ninth aspects of the present invention, the wiring corresponding to the point that the amount of voltage drop generated by the current from the position where the current flows is substantially equal to the amount of voltage drop to the position where the short circuit occurs. Since the pattern is obtained as a short-circuit wiring pattern located in the vicinity of the short-circuit occurrence position, the short-circuit occurrence position between the two solid patterns can be obtained easily and accurately.

  According to the second aspect of the present invention, on the solid pattern through which the current flows, the current is flowed in under two conditions where at least one of the position where the current flows or the position where the current flows is different from each other. Wiring patterns corresponding to points where the voltage drop generated by the current from the current position substantially coincides with the voltage drop to the short-circuit occurrence position are obtained as the first and second short-circuit wiring patterns, respectively. Since the occurrence position of the short circuit is obtained using the first and second short circuit patterns, the occurrence position of the short circuit between the two solid patterns can be obtained more accurately.

  According to the third aspect of the present invention, since the intersection point between the two curves corresponding to the equipotential curve passing through the short-circuit position is obtained as the short-circuit occurrence position, the short-circuit occurrence position between the two solid patterns is more accurately determined. Can be requested.

  According to the fourth aspect of the present invention, since the point where the current flows into the solid pattern and the point where it flows out are separated from each other, the probability that the occurrence position of the short circuit is included in the current flow path increases. The probability that the occurrence position of the short circuit is detected can be increased.

  According to the fifth aspect of the present invention, the solid pattern having the larger number of wiring patterns connected via vias is selected as the solid pattern for passing current among the first and second solid patterns. For this reason, the number of measurement points for the comparison potential difference increases, and the occurrence position of the short circuit can be obtained more accurately.

  According to the sixth aspect of the present invention, since a current is caused to flow by the direct current source, a current having an appropriate magnitude is caused to flow in a solid pattern having a small resistance value, and the occurrence position of the short circuit can be obtained more accurately. .

  According to the seventh aspect of the present invention, since the current value supplied by the direct current source is set by the current setting means, a current having a more appropriate magnitude is caused to flow through the solid pattern having a small resistance value. The generation position can be determined more accurately.

  FIG. 1 is a side sectional view showing an embodiment of a substrate inspection apparatus according to the present invention, and FIG. 2 is a plan view of the substrate inspection apparatus of FIG. In order to clarify the directional relationship with each drawing described later, XYZ rectangular coordinate axes are described.

  As shown in these drawings, in this substrate inspection apparatus, an opening / closing door 11 is disposed on the front side (−Y side) of the apparatus so as to be openable and closable with respect to the apparatus main body 1, and the opening / closing door 11 is opened. Thus, the board 2 (corresponding to the board to be inspected), which is a multilayer printed board on which a wiring pattern, a solid pattern, and the like are formed, can be carried into the apparatus main body 1 from the carry-in / out part 3 provided in the central part on the front side of the apparatus. Has been. Further, a plurality of (for example, 200) contacts 44 for transmitting an inspection signal are provided on the rear side (+ Y side) of the carry-in / out section 3, and the contacts are arranged on the lands (inspection points) of the wiring pattern of the substrate 2. An inspection unit 4 for moving an inspection jig 41 (to be described later) to abut 44 is provided.

  Further, an instruction signal for moving the contact 44 to contact the inspection point and an inspection signal output to the inspection point via the contact 44 are output to the inspection unit 4, and A measurement execution unit 74 that receives an inspection signal or the like and determines whether the substrate is good or bad by using the inspection signal is disposed at an appropriate position (here, the upper portion in the apparatus main body 1). And the board | substrate 2 which the test | inspection (namely, quality determination) by the test | inspection part 4 and the measurement execution part 74 was complete | finished is returned to the carrying in / out part 3, the opening-and-closing door 11 is made into an open state, and an operator can carry out.

  In this substrate inspection apparatus, in order to transfer the substrate 2 between the loading / unloading unit 3 and the inspection unit 4, the transfer table 5 is provided movably in the Y direction, and the transfer table 5 is It is configured to be moved and positioned in the direction. That is, in the transport table drive mechanism 6, the two guide rails 61 extending in the Y direction are arranged apart from each other in the X direction by a predetermined interval, and the transport table 5 is slidable along these guide rails 61. .

  A ball screw 62 is disposed in parallel with the guide rails 61. One end (−Y side) of the ball screw 62 is pivotally supported by the apparatus main body 1, and the other end (+ Y side) is used for driving the transport table. It is connected with the rotating shaft 64 of the motor 63. Further, a bracket 65 to which the transport table 5 is fixed is screwed onto the ball screw 62, and when the motor 63 is driven to rotate in response to a command from a control unit 76 (see FIG. 3) described later, the amount of rotation is reduced. Accordingly, the transfer table 5 moves in the Y direction and is reciprocated between the loading / unloading unit 3 and the inspection unit 4.

  With reference to FIG. 2, the transfer table 5 includes a substrate mounting portion 51 for mounting the substrate 2. The substrate platform 51 includes an urging means (not shown) that urges the substrate 2 from a direction opposite to the engagement pins 53 while the substrate 2 placed is engaged with the three engagement pins 53. ), The substrate 2 is urged toward the engagement pin 53 and the substrate 2 can be held on the substrate mounting portion 51. Further, in order to bring a contact 44 of the lower inspection unit 4D, which will be described later, into contact with the wiring pattern formed on the lower surface of the substrate 2 held in this manner, the substrate mounting portion 51 has a through opening (not shown). Is formed.

  The inspection unit 4 includes an upper inspection unit 4U for inspecting a wiring pattern formed on the upper surface side of the substrate 2 on the upper side (+ Z side) across the movement path of the transport table 5, and a lower side (−Z side). And a lower inspection unit 4D for inspecting a wiring pattern formed on the lower surface side of the substrate 2. The inspection units 4U and 4D have substantially the same configuration, and are arranged substantially symmetrically across the movement path of the transport table 5. The inspection units 4U and 4D include an inspection jig 41 and an inspection jig driving mechanism 43.

  FIG. 3 is a configuration diagram illustrating an example of an electrical configuration of the substrate inspection apparatus. The board inspection apparatus includes a control unit 76 that includes a CPU, a ROM, a RAM, a motor driver, and the like and controls the entire apparatus according to a program stored in the ROM in advance, a tester controller 75, and a measurement execution unit 74. .

  The tester controller 75 receives an inspection start command from the control unit 76, and in accordance with a program stored in advance, the wiring pattern to be inspected from among the plurality of contacts 44 abutted against the land of the wiring pattern on the substrate 2 The two contacts 44 that are in contact with the two lands located at both ends of each are sequentially selected. In addition, the tester controller 75 outputs a scan command to the measurement execution unit 74 so as to perform an inspection between the two selected contacts 44.

  On the other hand, as shown in FIG. 3, the inspection jig driving mechanism 43 is connected to an X jig driving unit 43 </ b> X that moves the inspection jig 41 in the X direction with respect to the apparatus main body 1 and an X jig driving unit 43 </ b> X. Y jig driving portion 43Y for moving the inspection jig 41 in the Y direction, θ jig driving portion 43θ connected to the Y jig driving portion 43Y for rotating the inspection jig 41 around the Z axis, and θ It is composed of a Z jig driving unit 43Z which is connected to the jig driving unit 43θ and moves the inspection jig 41 in the Z direction. The contactor 44 can be brought into contact with or separated from the wiring pattern formed on the substrate 2 by positioning or raising / lowering the inspection jig 41 in the vertical direction (Z direction). ing.

  FIG. 4 is a conceptual diagram for explaining an example of the configuration of the measurement execution unit 74. The measurement execution unit 74 includes a current generation unit 742 including a DC current source that outputs a measurement DC current having a predetermined value (value set by the current setting unit 76a of the control unit 76) I0, and a solid pattern based on the measurement DC current. Here, a voltage measurement unit 743 that measures the amount of voltage drop (potential difference) generated in the grounding solid pattern 231 shown in FIG. 5 and a tester out of the plurality of contacts 44 provided in the inspection jig 41. A scanner 744 including a switch array or the like for connecting the current generator 742 and the voltage measuring unit 743 to the contactor 44 selected by the controller 75 (see FIG. 3) is provided.

  In response to a scan command from the tester controller 75, the inspection processing unit 741 connects a current generation unit 742 between the two contacts 44 that are current supply targets, and between the two contacts 44 that are potential difference detection targets. A control signal is output to the scanner 744 in order to connect the voltage measuring units 743 to each other. The inspection processing unit 741 transmits the voltage value (potential difference) measured by the voltage measuring unit 743 to the tester controller 75.

  FIG. 5 is a conceptual diagram showing an example of the configuration of the substrate 2. (A) is sectional drawing, (b) is a top view. The substrate 2 includes a first substrate 21 having a wiring pattern 211 formed on an upper surface 2a of an insulating substrate 212 (corresponding to a first insulating substrate) and an upper surface of an insulating substrate 222 (corresponding to a second insulating substrate). A multilayer composed of a second substrate 22 having a power solid pattern 221 formed thereon, and a third substrate 23 having a ground solid pattern 231 formed on the upper surface of the insulating substrate 232 and a wiring pattern 233 formed on the lower surface 2b. It is a printed wiring board (here, 4 layers). It is assumed that an impurity or the like exists in the insulating substrate 222 between the power supply solid pattern 221 and the grounding solid pattern 231 and a short-circuit portion SH is generated. The substrate inspection apparatus according to the present invention is characterized in that the position of the short-circuited portion SH is specified.

  As shown in (b), the wiring pattern 211 is connected to the power supply solid pattern 221 through the via THV formed in the insulating substrate 212 so as to be energized (to the first wiring pattern group). And a grounding wiring pattern 211G (corresponding to the second wiring pattern group) connected to the grounding solid pattern 231 through the via THG formed in the insulating substrates 212 and 222 so as to be energized. is doing. Similarly, the wiring pattern 233 includes a power supply wiring pattern 233 </ b> V connected to the power supply solid pattern 221 through the vias THV formed in the insulating substrates 222 and 232, and a via THG formed in the insulating substrate 232. And a grounding wiring pattern 233 </ b> G connected so as to be energized.

  Note that the ground wiring pattern 211G and the power supply wiring pattern 211V are referred to as a wiring pattern Phk (h: column number, k: row number) in order from the upper left end of the figure without distinguishing between the two. For example, the wiring patterns P11 and P13 are power supply wiring patterns 211V, and the wiring patterns P12 and P14 are grounding wiring patterns 211G.

  FIG. 6 is a functional configuration diagram illustrating an example of a functional configuration of the control unit 76. The control unit 76 includes a current setting unit 76a (corresponding to a current setting unit) that sets a current value supplied to the measurement execution unit 74 (current generation unit 742), and a measurement execution unit 74 (current generation unit 742). On the other hand, a current supply unit 76b (which corresponds to a part of the current supply means) that outputs an instruction signal for starting and stopping supply of current, and one of the power supply solid pattern 221 and the grounding solid pattern 231 (here, The reference measurement unit 76c (reference measurement) measures a reference potential difference V0 which is a potential difference generated with the other solid pattern (here, the power supply solid pattern 221) in a state where current is supplied to the grounding solid pattern 231). And a comparison measurement unit 76d (which corresponds to a means) and a comparison measurement unit 76d that measures a comparison potential difference Vi that is a potential difference between the wiring patterns 211G connected to the grounding solid pattern 231. A position determination unit 76e (corresponding to the position determination unit) for determining the occurrence position of the short-circuited portion SH using the reference potential difference V0 and the comparison potential difference Vi, and a determination for the position determination unit 76e. And a threshold value setting unit 76f that sets a threshold value ΔV used as a reference.

  The current setting unit 76 a sets the current value I 0 (I 01, I 02) to be supplied to the ground solid pattern 231 to the current generation unit 742 of the measurement execution unit 74 via the tester controller 75.

  The current supply unit 76b selects two grounding wiring patterns 211G from the grounding wiring patterns 211G connected to the grounding solid pattern 231 so as to be energized, and uses the selected two grounding wiring patterns 211G as a current generation unit. The scanner 744 is switched via the tester controller 75 so as to be connected to the terminals (positive terminal + F and negative terminal -F) at both ends of 742.

  Here, as shown in FIG. 5B, the number of the two grounding wiring patterns 211G from the grounding wiring pattern 211G that is connected to the grounding solid pattern 231 so as to be energized is equal to the power supply solid pattern 221. Since there are more power supply wiring patterns 211V that can be connected, the grounding solid pattern 231 is selected as a solid pattern for supplying current.

  In addition, the current supply unit 76b sends an instruction signal to start and stop supplying current between the two selected ground wiring patterns 211G to the current generation unit 742 of the measurement execution unit 74 via the tester controller 75. Output. Here, the current supply unit 76b selects two sets of two grounding wiring patterns 211G having at least one wiring pattern different from each other. Furthermore, the current supply unit 76b selects the grounding wiring patterns 211G that are separated from each other as the two grounding wiring patterns 211G that supply current. For example, the wiring patterns P18 and P92 are selected as the first set of grounding wiring patterns 211G, and the wiring patterns P31 and P98 are selected as the second set of grounding wiring patterns 211G.

  The reference measurement unit 76c measures the potential generated in the power supply solid pattern 221 through the short-circuited portion SH by the current flowing through the grounding solid pattern 231, and the power supply solid pattern 221 is energized through the via THV. One power supply wiring pattern 211V is selected from the power supply wiring patterns 211V that can be connected, and is selected by the selected power supply wiring pattern 211V (here, the wiring patterns P11 and P71) and the current supply unit 76b. The potential difference between one of the two grounding wiring patterns 211G and the grounding wiring pattern 211G (here, the grounding wiring pattern 211G connected to the plus terminal + F: wiring patterns P18 and P31) is a reference potential difference. It is measured as V0. However, the reference potential difference V0 when the first set of ground wiring patterns 211G is selected by the current supply unit 76b is referred to as a first reference potential difference V01, and the second set of ground wiring patterns 211G is selected. The reference potential difference V0 is referred to as a second reference potential difference V02.

  Specifically, the reference measurement unit 76c selects one power supply wiring pattern 211V from the power supply wiring pattern 211V, and supplies the selected power supply wiring pattern 211V (here, the wiring patterns P11 and P71) and current supply. The measurement execution is performed so that the ground wiring pattern 211G (wiring patterns P18, P31) connected to the plus terminal + F by the unit 76b is connected to both ends of the voltage measurement unit 743 of the measurement execution unit 74 via the tester controller 75. The reference potential difference V01, V02 is obtained by switching the scanner 744 of the unit 74.

  The comparison measurement unit 76d includes a grounding wiring pattern 211G (wiring pattern P18, wiring pattern P18) connected to the plus terminal + F among the grounding wiring patterns 211G connected to the grounding solid pattern 231 through the via THG. P31) is measured as a comparison potential difference Vij (i = 1, 2, j = 1 to N) as a potential difference between the other grounding wiring pattern 211G. However, the comparison potential difference when the first set of ground wiring patterns 211G is selected by the current supply unit 76b is referred to as a first comparison potential difference V1j (j = 1 to N), and the second set of ground wiring patterns 211G. The comparison potential difference when is selected is referred to as a second comparison potential difference V2j (j = 1 to N). Here, if the total number of grounding wiring patterns 211G is M, N = (M−1).

  Specifically, the comparison measurement unit 76d determines that the ground wiring pattern 211G connected to the ground solid pattern 231 is energized to the ground wiring pattern 211G connected to the plus terminal + F (wiring patterns P18 and P31). ) And one grounding wiring pattern 211G other than the grounding wiring pattern 211G, and the tester controller 75 is connected to connect the two selected grounding wiring patterns 211G to the terminals at both ends of the voltage measuring unit 743. Thus, the scanner 744 is switched to obtain a comparison potential difference Vij that is a measurement value of the voltage measurement unit 743.

  The position determination unit 76e first compares the comparison potential difference Vij with the reference potential difference V0i to obtain a ground wiring pattern 211G corresponding to the comparison potential difference Vij whose difference from the reference potential difference V0i is equal to or less than a predetermined threshold ΔVi. . However, i = 1, 2, j = 1-N. Then, the position determination unit 76e connects the ground wiring pattern 211G (corresponding to the first short-circuit wiring pattern) corresponding to the comparison potential difference V1j whose difference from the reference potential difference V01 is equal to or less than a predetermined threshold ΔV1, and a curve G1 The intersection CP with the curve G2 connecting the grounding wiring pattern 211G (corresponding to the second short-circuiting wiring pattern) corresponding to the comparison potential difference V2j whose difference from the reference potential difference V02 is equal to or less than the predetermined threshold ΔV2 is set as the short-circuit occurrence position. It is what you want.

  The threshold setting unit 76f causes the position determination unit 76e to cause the grounding wiring pattern 211G (corresponding to the first short-circuiting wiring pattern) corresponding to the comparison potential difference V1j whose difference from the reference potential difference V01 is equal to or less than the predetermined threshold ΔV1, and As the grounding wiring pattern 211G (corresponding to the second short-circuiting wiring pattern) corresponding to the comparison potential difference V2j whose difference from the reference potential difference V02 is equal to or less than the predetermined threshold value ΔV2, a plurality of grounding wiring patterns 211G are obtained. As much as possible, threshold values ΔV1 and ΔV2 are set for the position determination unit 76e.

  FIG. 7 is a flowchart showing an example of the operation of the substrate inspection apparatus. Here, it is assumed that current values I01 and I02 and threshold values ΔV1 and ΔV2 are set in advance by current setting unit 76a and threshold setting unit 76f, respectively. First, the value of the counter i is initialized to 1 by the current supply unit 76b (step S101). Then, the i-th set of two grounding wiring patterns 211G to which the current source is connected is selected by the current supply unit 76b from the grounding wiring pattern 211G that is connected to the grounding solid pattern 231 so as to be energized (step S103). ). Next, the current supply unit 76b supplies the current having the current value I0i set by the current setting unit 76a between the two ground wiring patterns 211G selected in step S103 (step S105).

  Next, the i-th reference potential difference V0i is measured by the reference measurement unit 76c (step S107). Then, the i-th comparison potential difference Vij (j = 1 to N) is measured by the comparison measurement unit 76d (step S109). Next, the position determination unit 76e extracts the ground wiring pattern 211G (i-th short-circuit wiring pattern) corresponding to the comparison potential difference Vij whose difference from the reference potential difference V0i is equal to or less than the predetermined threshold value ΔVi (step S111). Next, a curve Gi connecting the i-th short-circuit wiring pattern is obtained by the position determination unit 76e (step S113). Then, the current supply unit 76b determines whether or not the value of the counter i is 2 or more (step S115).

  If it is determined that the value of counter i is not 2 or more (1 or less) (NO in step S115), the value of counter i is incremented by 1 (step S117), and the process returns to step S103. Then, the processing from step S103 to step S113 is repeatedly executed. When it is determined that the value of the counter i is 2 or more (YES in step S115), the intersection CP between the curve G1 and the curve G2 obtained in step S113 is determined as the short-circuit occurrence position by the position determination unit 76e. Is obtained (step S119), and the process is terminated.

  8-10 is explanatory drawing which shows an example of the result of having specified the position of short circuit location SH using the board | substrate inspection apparatus of this invention in the board | substrate 2 shown in FIG. FIG. 8 is an explanatory diagram showing an example of a curve G1 obtained by connecting the current source I01 between the wiring patterns P18 and P92. (A) is a conceptual diagram of an equipotential line in the grounding solid pattern 231, and (b) is a curve G1 obtained by the position determining unit 76 e. As shown in (a), when the current source I01 is connected between the wiring patterns P18 and P92, there is a voltage drop due to the current flowing in the grounding solid pattern 231 from the wiring pattern P18 toward the wiring pattern P92. The equipotential lines from the upper left to the lower right are formed.

  As shown in (b), the reference potential difference V01 is measured between the wiring pattern P18 and the wiring pattern P11. And it is calculated | required as a curve (here a broken line) which connects wiring pattern P21, P42, P63, P74, P83, P96 as curve G1. Note that the curve G1 is a curve inclined in substantially the same direction as the equipotential lines shown in FIG.

  FIG. 9 is an explanatory diagram showing an example of a curve G2 obtained by connecting the current source I02 between the wiring patterns P31 and P98. (A) is a conceptual diagram of an equipotential line in the grounding solid pattern 231, and (b) is a curve G <b> 2 obtained by the position determining unit 76 e. As shown to (a), when the current source I02 is connected between the wiring patterns P31 and P98, along with the voltage drop due to the current flowing in the grounding solid pattern 231 from the wiring pattern P31 toward the wiring pattern P98. An equipotential line from the lower left to the upper right is formed.

  As shown in (b), the reference potential difference V02 is measured between the wiring pattern P31 and the wiring pattern P71. And it is calculated | required as a curve (here a broken line) which connects the wiring patterns P16, P23, P44, P52, and P62 as the curve G2. The curve G2 is a curve inclined in substantially the same direction as the equipotential line shown in FIG.

  FIG. 10 is an explanatory diagram illustrating an example of an intersection CP between the curves G1 and G2. As shown in FIG. 8, the curve G1 is a broken line connecting the wiring patterns P21, P42, P63, P74, P83, and P96, and the curve G2 is a broken line connecting the wiring patterns P16, P23, P44, P52, and P62. . Therefore, the intersection CP of the curve G1 and the curve G2 is obtained as the intersection of the line segment connecting the wiring pattern P42 and the wiring pattern P63 of the curve G1 and the line segment connecting the wiring pattern P52 and the wiring pattern P62 of the curve G2. It is done.

  In this manner, the voltage drop amount generated by the current from the position where the current flows (in this case, the wiring patterns P18 and P31) corresponds to the point where the voltage drop amount to the position where the short circuit SH occurs substantially coincides. Since the wiring patterns (here, the wiring patterns P21, P42, P63, P74, P83, and P96 and the wiring patterns P16, P23, P44, P52, and P62) are obtained as short-circuit wiring patterns that are located near the position where the short-circuit SH is generated. The occurrence position of the short circuit SH between the two solid patterns 221 and 231 is easily and accurately obtained.

  Further, on the solid pattern (here, the grounding solid pattern 231) through which the current is flowing, the position where the current flows (here, the wiring patterns P18, P31) or the position where the current flows (here, The wiring pattern corresponding to the point that the voltage drop amount generated by the current from the position where the current flows in substantially matches the voltage drop amount up to the short-circuit occurrence position under two conditions where the wiring patterns P92 and P98) are different from each other. Are obtained as first and second short-circuit wiring patterns (here, wiring patterns P21, P42, P63, P74, P83, P96 and wiring patterns P16, P23, P44, P52, P62), respectively. Since the occurrence position of the short circuit SH is obtained using the second short circuit pattern, the occurrence position of the short circuit SH between the two solid patterns is further changed. It is accurately determined.

  Furthermore, since the intersection of the two curves G1 and G2 corresponding to the equipotential curve passing through the position of the short circuit SH is obtained as the occurrence position of the short circuit SH, the occurrence position of the short circuit SH between the two solid patterns can be obtained more accurately. It is done.

  In addition, the point where the current flows into the solid pattern (here, the wiring patterns P18, P31) and the point where it flows out (here, the wiring patterns P92, P98) are separated from each other. Is included in the current flow path, and the probability that the occurrence position of the short circuit SH is detected increases.

  In addition, power wiring is used as two wiring patterns corresponding to positions where current flows into the solid pattern (here, wiring patterns P18, P31) and positions where current flows out (here, wiring patterns P92, P98). Of the pattern 211V and the grounding wiring pattern 211G, a large number of wiring patterns (here, the grounding wiring pattern 211G) are selected (that is, among the power supply wiring pattern 211V and the grounding wiring pattern 211G via vias). Therefore, the solid pattern having the larger number of connected wiring patterns is selected as a solid pattern through which a current flows), so that the number of measurement points for the comparison potential difference is increased, and the occurrence position of the short circuit SH is more accurately obtained.

  Furthermore, since a current is passed by the DC current source, currents I01 and I02 having appropriate magnitudes are passed through a solid pattern having a small resistance value (here, the ground wiring pattern 211G), and the occurrence position of the short circuit SH is more accurate. Is required. In addition, since current values I01 and I02 supplied from the DC current source are set by the current setting unit 76a, a current having a more appropriate magnitude for a solid pattern having a small resistance value (here, the ground wiring pattern 211G). And the position where the short circuit SH is generated is determined more accurately.

  In addition, this invention can take the following forms.

  (A) In the present embodiment, the case where the position determination unit 76e obtains the position of the short circuit SH as the intersection CP of the curves G1 and G2 has been described. However, the position determination unit 76e uses the curve G1 (wiring patterns P21, P42, P63, P74, P83, P96) may be obtained. In this case, the process is simplified. On the contrary, the position determining unit 76e may obtain the position of the short circuit SH as an intersection of three or more curves. In this case, the position of the short circuit SH is obtained more accurately.

  (B) In the present embodiment, the case where the position determination unit 76e obtains a polygonal line passing through the wiring pattern as the curves G1 and G2 has been described, but another interpolation curve (for example, a quadratic curve) may be obtained. In this case, the position of the short circuit SH can be obtained more accurately.

  (C) In the present embodiment, the case where the position of the short circuit SH is obtained using only the wiring pattern 211 on the upper surface side of the substrate 2 has been described, but only the wiring pattern 233 on the lower surface side of the substrate 2 may be used. Alternatively, the wiring patterns 211 and 233 on the upper surface side and the back surface side may be used.

  (D) In the present embodiment, the configuration in which the substrate inspection apparatus includes the upper inspection unit 4U and the lower inspection unit 4D has been described. However, the substrate inspection apparatus may include at least one of the upper inspection unit 4U and the lower inspection unit 4D. Good.

  (E) In this embodiment, an inspection jig (so-called multi-needle) that supports a large number of contacts 44 and presses the tips of the contacts 44 to the respective inspection points of the substrate 2 by being moved in the Z-axis direction. Although the case where the present invention is applied to a substrate inspection apparatus provided with a shape inspection jig) has been described, a pair of contacts 44 (or probes) are moved independently from each other in the X, Y, and Z axis directions. The present invention is applied to a substrate inspection apparatus provided with an inspection jig (so-called moving probe type inspection jig) that supports and enables the tip of the contactor 44 to press-contact with the inspection point of the substrate 2 sequentially according to a preset program. It may be a form.

It is side surface sectional drawing which shows one Embodiment of the board | substrate inspection apparatus which concerns on this invention. It is a top view of the board | substrate inspection apparatus shown in FIG. It is a block diagram which shows an example of the electrical structure of a board | substrate inspection apparatus. It is a conceptual diagram for demonstrating an example of a structure of a measurement execution part. It is a conceptual diagram which shows an example of a structure of a board | substrate. It is a functional block diagram which shows an example of a function structure of a control part. It is a flowchart which shows an example of operation | movement of a board | substrate inspection apparatus. It is explanatory drawing which shows an example of the curve G1 calculated | required by connecting the current source I01 between the wiring patterns P18 and P92. It is explanatory drawing which shows an example of the curve G2 calculated | required by connecting the current source I02 between the wiring patterns P31 and P98. It is explanatory drawing which shows an example of the intersection CP of curve G1 and G2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Apparatus main body 2 Board | substrate 211 Wiring pattern 211G Grounding wiring pattern (2nd wiring pattern group)
211V power supply wiring pattern (first wiring pattern group)
212 Insulating Substrate 221 Solid Pattern for Power Supply 222 Insulating Substrate 231 Solid Pattern for Grounding 232 Insulating Substrate 233 Wiring Pattern 233G Wiring Pattern for Grounding 233V Wiring Pattern for Power Supply 3 Carry In / Out Unit 4 Inspection Unit 44 Contact 74 Measurement Execution Unit 741 Inspection Processing Unit 742 Current generation unit 743 Voltage measurement unit 744 Scanner 75 Tester controller 76 Control unit 76a Current setting unit (current setting means)
76b Current supply unit (current supply means)
76c Reference measuring section (reference measuring means)
76d comparative measurement unit (comparative measurement means)
76e Position determining unit (position determining means)
76f Threshold setting unit (threshold setting means)

Claims (9)

A plurality of wiring patterns, a first insulating substrate, a first solid pattern, a second insulating substrate, and a second solid pattern are sequentially stacked, and are arranged in the first and second insulating substrates as the wiring pattern. The first and second wirings include first and second wiring pattern groups which are wiring patterns connected to the first and second solid patterns so as to be energized through the vias provided, respectively. In the substrate to be inspected, wherein at least one of the pattern groups is composed of three or more wiring patterns, a substrate inspection apparatus for obtaining a short-circuit occurrence position between the first and second solid patterns,
Two wiring patterns are selected from a group of wiring patterns connected to the solid pattern via a via so as to allow current to flow through one of the first and second solid patterns. Current supply means for connecting a power source between the selected wiring patterns;
In order to measure the potential generated in the other solid pattern via the short circuit due to the current flowing in the one solid pattern, the wiring pattern of either one of the two wiring patterns and the other solid pattern via vias. A reference measuring means for measuring a potential difference between the wiring pattern and one wiring pattern connected to be energized as a reference potential difference;
Comparison measuring means for measuring a potential difference between the one wiring pattern and the other wiring pattern as a comparison potential difference among the wiring pattern group connected to be energized through the via to the one solid pattern,
Position determination for comparing the comparison potential difference with the reference potential difference and obtaining a wiring pattern corresponding to the comparison potential difference whose difference from the reference potential difference is equal to or less than a predetermined threshold as a short-circuit wiring pattern in the vicinity of the short-circuit occurrence position And a substrate inspection apparatus. The current supply means selects at least one combination of the two wiring patterns having different wiring patterns,
The reference measurement unit and the comparison measurement unit measure the reference potential difference and the comparison potential difference, respectively, each time a power source is connected between the two wiring patterns of each combination by the current supply unit,
The position determining means obtains first and second short-circuited wiring patterns each time a power source is connected between the two wiring patterns of each combination by the current supply means, and the first and second short-circuited wirings. The substrate inspection apparatus according to claim 1, wherein the occurrence position of the short circuit is obtained using a pattern. The position determining means includes threshold setting means for setting the threshold to obtain a plurality of wiring patterns as the first and second short-circuit wiring patterns,
3. The substrate inspection according to claim 2, wherein the position determining means obtains an intersection of a curve connecting the first short-circuit wiring pattern and a curve connecting the second short-circuit wiring pattern as the occurrence position of the short-circuit. apparatus.   The substrate inspection apparatus according to claim 1, wherein the current supply unit selects wiring patterns separated from each other as the two wiring patterns.   5. The current supply unit selects a wiring pattern group having a larger number of the first wiring pattern group and the second wiring pattern group as the two wiring patterns. The board inspection apparatus according to 1.   The substrate inspection apparatus according to claim 1, wherein the current supply unit connects a direct current source that supplies a predetermined value of current to the two wiring patterns.   The substrate inspection apparatus according to claim 6, further comprising a current setting unit that sets a current value supplied from the DC current source. A plurality of wiring patterns, a first insulating substrate, a first solid pattern, a second insulating substrate, and a second solid pattern are sequentially stacked, and are arranged in the first and second insulating substrates as the wiring pattern. The first and second wirings include first and second wiring pattern groups which are wiring patterns connected to the first and second solid patterns so as to be energized through the vias provided, respectively. A substrate inspection program for a substrate inspection apparatus for obtaining a short-circuit occurrence position between the first and second solid patterns in a substrate to be inspected in which at least one of a pattern group includes three or more wiring patterns, the substrate inspection Equipment
Two wiring patterns are selected from a group of wiring patterns connected to the solid pattern via a via so as to allow current to flow through one of the first and second solid patterns. Current supply means for connecting a power source between the selected wiring patterns;
In order to measure the potential generated in the other solid pattern via the short circuit due to the current flowing in the one solid pattern, either one of the two wiring patterns and the other solid pattern via vias. A reference measuring means for measuring a potential difference between the wiring patterns connected to be energized as a reference potential difference;
Comparative measurement means for measuring a potential difference between the one wiring pattern and the other wiring pattern as a comparative potential difference in the wiring pattern group connected to be energized through the via to the one solid pattern,
Position determination in which the comparison potential difference is compared with the reference potential difference, and a wiring pattern corresponding to the comparison potential difference whose difference from the reference potential difference is equal to or less than a predetermined threshold is determined as a short-circuit wiring pattern located in the vicinity of the short-circuit occurrence position. A board inspection program which functions as means. A plurality of wiring patterns, a first insulating substrate, a first solid pattern, a second insulating substrate, and a second solid pattern are sequentially stacked, and are arranged in the first and second insulating substrates as the wiring pattern. The first and second wirings include first and second wiring pattern groups which are wiring patterns connected to the first and second solid patterns so as to be energized through the vias provided, respectively. A substrate inspection method for a substrate inspection apparatus for obtaining a position of occurrence of a short circuit between the first and second solid patterns in a substrate to be inspected in which at least one of a pattern group includes three or more wiring patterns,
A wiring pattern connected to the solid pattern through a via so as to allow current to flow through one of the first and second solid patterns by the current supply means of the substrate inspection apparatus. Select two wiring patterns from the group, connect the power supply between the selected wiring patterns,
In order to measure the potential generated in the other solid pattern via the short circuit by the current flowing in the one solid pattern by the reference measurement means of the substrate inspection apparatus, one of the two wiring patterns and , Measure the potential difference between the other solid pattern and one wiring pattern connected to be energized through a via as a reference potential difference,
The potential difference between the one wiring pattern and the other wiring pattern in the wiring pattern group that is connected to the one solid pattern through a via is compared by the comparison measurement unit of the substrate inspection apparatus. Measured as a potential difference,
By comparing the comparison potential difference with the reference potential difference by the position determining means of the substrate inspection apparatus, a wiring pattern corresponding to the comparison potential difference whose difference from the reference potential difference is equal to or less than a predetermined threshold is set near the short-circuit occurrence position. A method for inspecting a substrate, characterized in that it is obtained as a short-circuit wiring pattern located on the substrate.

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