KR102416051B1 - Resistance measuring devices and methods of measuring resistance - Google Patents

Abstract

SUMMARY OF THE INVENTION The present invention provides a resistance measuring device and a resistance measuring method capable of individually measuring the resistance of each connection portion of a substrate to be measured. The resistance measuring apparatus of the present invention includes a current supply unit for supplying a supply current to a supply-side conductive part, a current lead-in part for drawing a draw-in current from the lead-side conductive part, and a conductivity different from the supply-side conductive part and the lead-side conductive part A supply-side voltage detection unit that detects a supply-side voltage that is a voltage between the negative voltage measurement conductive portion and the supply-side conductive portion, and an incoming-side voltage that detects the incoming-side voltage that is a voltage between the voltage measurement conductive portion and the incoming-side conductive portion A resistor that calculates the resistance value of the voltage detector and the connection part paired with the supply-side conductive part based on the supply current and the supply-side voltage, and calculates the resistance value of the connection part paired with the lead-side conductive part based on the incoming current and the incoming voltage had an output.

Description

Resistance measuring devices and methods of measuring resistance

The present invention relates to a resistance measuring apparatus for measuring the resistance of a substrate, and a resistance measuring method.

Conventionally, such as vias formed in a circuit board, when a measurement object passing through one surface to the other surface of the circuit board is to be measured, a measurement current is passed through the measurement object to measure the voltage generated in the measurement object By doing so, the board|substrate inspection apparatus which measures the resistance value of the said measurement object from the current value and voltage value is known (for example, refer patent document 1).

[Patent Document 1] Japanese Patent Laid-Open No. 2012-117991

By the way, in a board provided with a planar conductor (hereinafter referred to as planar conductor) therein, conductive portions such as pads, bumps, and wiring on the surface of the board and the planar conductor are electrically connected in the thickness direction of the board. There is a substrate that is a connected structure. 7 and 8 are conceptual schematic diagrams showing an example of such a substrate.

Fig. 7 is a conceptual schematic diagram showing a multilayer substrate WB as an example of a substrate having a planar inner layer pattern IP on the inner layer of the substrate. In the multilayer substrate WB shown in FIG. 7 , conductive portions PA and PB such as pads and wiring patterns are formed on the substrate surface BS. The conductive portions PA and PB are electrically connected to the inner layer pattern IP by connecting portions RA and RB such as vias and wiring patterns. In the example of the multilayer board|substrate WB, the inner layer pattern IP corresponds to a planar conductor.

Further, as a method of manufacturing a substrate, a printed wiring board is formed by laminating a printed wiring board on both surfaces of the metal plate based on a conductive metal plate, and peeling the formed substrate from a metal plate as a base, whereby two printed wiring lines are formed. There is a method for forming a substrate. In such a method of manufacturing a substrate, the substrate (hereinafter referred to as an intermediate substrate) in a state before peeling the substrate from the metal plate as a base has a form in which the metal plate is sandwiched between two substrates.

8 is a conceptual schematic diagram showing an example of such an intermediate substrate B. As shown in FIG. As for the intermediate board|substrate B shown in FIG. 8, the board|substrate WB1 is formed in one surface of the metal plate MP, and the board|substrate WB2 is formed in the other surface of the metal plate MP. Conductive portions PA1, PB1, ..., PZ1 such as pads and wiring patterns are formed on the substrate surface BS1 of the substrate WB1. Conductive portions PA2, PB2, ..., PZ2 such as pads and wiring patterns are formed on the contact surface BS2 of the substrate WB1 with the metal plate MP. The metal plate MP is, for example, a conductive metal plate having a thickness of about 1 mm to 10 mm.

The conductive portions PA1 to PZ1 are electrically connected to the conductive portions PA2 to PZ2 by connecting portions RA to RZ such as vias and wiring patterns. Since the conductive portions PA2 to PZ2 are in close contact with and conduction with the metal plate MP, the conductive portions PA1 to PZ1 are electrically connected to the metal plate MP by the connecting portions RA to RZ. . The conductive part PA1 and the connection part RA become a pair, the conductive part PB1 and the connection part RB become a pair, and the conductive part and the connection part become a pair, respectively. Since the board|substrate WB2 is comprised similarly to the board|substrate WB1, the description is abbreviate|omitted. In the example of the intermediate board|substrate B, metal plate MP corresponds to a planar conductor.

As a test|inspection of the multilayer board|substrate WB, the intermediate board|substrate B, etc., resistance values Ra-Rz of the connection parts RA-RZ are measured in some cases.

FIG. 9 is an explanatory diagram for explaining a measurement method for measuring resistance values Ra and Rb of the connection portions RA and RB of the intermediate substrate B shown in FIG. 8 . In order to measure the resistance values Ra and Rb of the connection portions RA and RB, a current I for measurement is passed between the conductive portion PA1 and the conductive portion PB1, and the conductive portion PA1 and the conductive portion It is possible to measure the voltage (V) generated between (PB1) and calculate the resistance value as V/I. In this case, the resistance value calculated by V/I becomes Ra+Rb.

However, there is a demand to individually measure the resistance value of each connection portion, not the total resistance value of the connection portions of two places.

An object of the present invention is to have a pair of conductive planar conductors spread out in planar shape, a substrate surface opposite to the planar conductors, a conductive portion provided on the substrate surface, and a connection portion electrically connecting the conductive portion to the planar conductor. A resistance measuring apparatus capable of individually measuring the resistance of each connection portion of a substrate, and a resistance measuring method are provided.

A resistance measuring device according to an aspect of the present invention includes a planar conductive planar conductor, a substrate surface opposite to the planar conductor, a conductive portion provided on the substrate surface, and electrically connecting the conductive portion to the planar conductor A resistance measuring device for measuring the resistance of the connection portion of a substrate to be measured having a pair with a connection portion and having three or more pairs, wherein a supply current preset to a supply-side conductive portion which is one of the three or more conductive portions a current supply unit for supplying a supply-side voltage detector for detecting a supply-side voltage that is a voltage between the supply-side conductive part and a voltage-measuring conductive part which is a conductive part different from the supply-side conductive part and the incoming-side conductive part; An incoming-side voltage detection unit for detecting an incoming-side voltage that is a voltage between the conductive portion, and calculating a resistance value of a connecting portion paired with the supply-side conductive portion based on the supply current and the supply-side voltage, and calculating the incoming current and the and a resistance calculating unit that calculates a resistance value of the connecting portion to be paired with the lead-in conductive portion based on the incoming-side voltage.

In addition, the resistance measuring method according to an aspect of the present invention includes a planar conductive planar conductor, a substrate surface opposite to the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion electrically to the planar conductor In the resistance measurement method for measuring the resistance of the connection portion of a substrate to be measured having a pair with a connecting portion to be connected and having three or more pairs of the pair, a supply-side conductive portion that is one of the three or more conductive portions is set in advance A current supply step of supplying a supply current; a current drawing step of drawing in a predetermined drawing current from an incoming-side conductive portion which is one of the respective conductive portions and is different from the supply-side conductive portion; a supply-side voltage detection step of detecting a supply-side voltage that is a voltage between the supply-side conductive portion and a voltage-measuring conductive portion that is a conductive portion different from the negative and the incoming-side conductive portion, and the voltage measurement conductive portion and the incoming-side conductive portion an incoming-side voltage detection step of detecting an incoming-side voltage, which is a voltage between the negative and negative, and calculating a resistance value of a connecting portion paired with the supply-side conductive portion based on the supply current and the supply-side voltage, wherein the incoming current and the and a resistance calculation step of calculating a resistance value of the connecting portion to be paired with the lead-in conductive portion based on the incoming-side voltage.

1 is a schematic diagram conceptually showing the configuration of a resistance measuring apparatus using a resistance measuring method according to an embodiment of the present invention.
[FIG. 2] It is a block diagram which shows an example of the electrical configuration of the measuring part shown in FIG.
Fig. 3 is a flowchart showing an example of the operation of the resistance measuring device shown in Fig. 1 .
Fig. 4 is a flowchart showing an example of the operation of the resistance measuring device shown in Fig. 1 .
[FIG. 5] It is explanatory drawing for demonstrating the operation|movement of the resistance measuring apparatus shown in FIG.
Fig. 6 is an explanatory diagram for explaining the operation of the resistance measuring device shown in Fig. 1 .
Fig. 7 is a conceptual schematic diagram showing a multilayer substrate as an example of a substrate having a planar inner layer pattern on the inner layer of the substrate.
8 is a conceptual schematic diagram showing an example of an intermediate substrate.
[FIG. 9] It is explanatory drawing for demonstrating the measuring method of measuring the resistance value of the intermediate board|substrate shown in FIG.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment which concerns on this invention is described based on drawing. In addition, the structure which attached|subjected the same code|symbol in each figure shows that it is the same structure, and the description is abbreviate|omitted. 1 is a schematic diagram conceptually showing the configuration of a resistance measuring apparatus 1 using a resistance measuring method according to an embodiment of the present invention. The resistance measuring device 1 shown in Fig. 1 is a device for measuring the resistance of a measurement target substrate. The resistance measuring apparatus 1 may be a board|substrate test|inspection apparatus which judges the quality or failure of the to-be-measured board|substrate based on the measured resistance value.

The substrate to be measured is, for example, an intermediate substrate or a multilayer substrate, and a package substrate for a semiconductor package, a film carrier, a printed wiring board, a flexible substrate, a ceramic multilayer wiring board, an electrode plate for a liquid crystal display or a plasma display, and such a substrate It may be an intermediate substrate in the process of manufacturing the . The multilayer substrate WB shown in FIG. 7 and the intermediate substrate B shown in FIG. 8 correspond to an example of the substrate to be measured. In FIG. 1, the example in which the intermediate board|substrate B was attached to the resistance measuring apparatus 1 as a to-be-measured board|substrate is shown. An arbitrary number of conductive parts PA1, PB1, ..., PZ1 is provided. Hereinafter, the conductive portions PA1, PB1, ..., PZ1 are collectively referred to as the conductive portion P.

The resistance measuring device 1 shown in FIG. 1 has a housing 112 . In the inner space of the housing 112 , the substrate fixing device 110 , the measuring unit 121 , the measuring unit 122 , the measuring unit moving mechanism 125 , and the control unit 20 are mainly provided. The substrate holding device 110 is configured to fix the intermediate substrate B as a measurement target at a predetermined position.

The measurement unit 121 is located above the intermediate substrate B fixed to the substrate fixing device 110 . The measurement unit 122 is located below the intermediate substrate B fixed to the substrate fixing device 110 . The measuring parts 121 and 122 are equipped with measuring jigs 4U, 4L for making a probe contact the electroconductive part P formed in the intermediate|middle board|substrate B. As shown in FIG.

A plurality of probes Pr are attached to the measurement jigs 4U and 4L. The measurement jigs 4U and 4L arrange and hold the plurality of probes Pr so as to correspond to the arrangement of the conductive portion P of the measurement target formed on the surface of the intermediate substrate B. The measuring unit moving mechanism 125 appropriately moves the measuring units 121 and 122 in the housing 112 according to a control signal from the control unit 20 to move the probes Pr of the measuring jigs 4U and 4L. It is made to contact each electroconductive part P of the intermediate|middle board|substrate B.

In addition, the resistance measuring apparatus 1 may be equipped with only either one of the measuring parts 121 and 122. In addition, the resistance measuring apparatus 1 may make the board|substrate to be measured front and back reverse, and you may make it perform the measurement of the both surfaces sequentially by either measuring part.

The control unit 20 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, and a ROM (Read Only Memory) that stores a predetermined control program, for example. Memory) and HDD (Hard 　Disk 　 Drive), etc., and their peripheral circuits, etc. are equipped and constituted. And the control part 20 functions as the electroconductive part selection part 21 and the resistance calculation part 22 by executing the control program memorize|stored in the memory|storage part, for example.

FIG. 2 is a block diagram showing an example of the electrical configuration of the measurement unit 121 shown in FIG. 1 . In addition, since the measuring part 122 is comprised similarly to the measuring part 121, the description is abbreviate|omitted. The measurement unit 121 shown in Fig. 2 includes a plurality of measurement blocks M1 to Mn (n is a natural number), a scanner unit 31, and a plurality of probes Pr. The measurement blocks M1 to Mn correspond to an example of a set. Each of the measurement blocks M1 to Mn is provided with a current supply unit CS, a current lead-in unit CM, a supply-side voltage detection unit VM1, and a lead-side voltage detection unit VM2.

The scanner part 31 is a switching circuit comprised using switching elements, such as a transistor and a relay switch, for example. The scanner unit 31 is a conductive part ( P), n sets of voltage detection terminals (+S1, -S1, +S2, -S2) for detecting a voltage generated between P) are provided, and an arbitrary number of ground terminals (G) connected to the circuit ground are provided. In addition, a plurality of probes Pr are electrically connected to the scanner unit 31 . In response to a control signal from the control unit 20 , the scanner unit 31 includes current terminals (+F, -F), voltage detection terminals (+S1, -S1, +S2, -S2), and a ground terminal (G). and the connection relationship between the plurality of probes Pr is switched.

As for the current supply unit CS, one end of its output terminal is connected to the circuit ground, and the other end is connected to the current terminal (+F). The current supply unit CS is a constant current circuit that supplies a preset supply current Io to the current terminal +F according to a control signal from the control unit 20 .

The current lead-in unit CM has one end connected to the current terminal -F and the other end connected to the circuit ground. The current lead-in unit CM is a constant current circuit that draws in a preset draw-in current Ii from the current terminal -F to the circuit ground according to a control signal from the controller 20 .

An oxide film may be formed on the surface of each conductive portion P due to oxidation. When an oxide film is formed on the surface of the conductive portion P, the contact resistance with the probe Pr increases, so that the accuracy of the resistance measurement decreases. Such an oxide film can be removed by passing a current equal to or greater than a predetermined oxide film removal current value. The oxide film removal current value is, for example, 20 mA. In the probe Pr, a rated current value is determined as an upper limit value of a current value that can be passed without damaging the probe. The rated current value of the probe Pr is, for example, a current value less than 40 mA, and is, for example, 30 mA.

The draw current Ii and the supply current Io are set to, for example, 20 mA or more and 30 mA or less. Accordingly, the oxide film on the surface of the conductive portion P is removed without damaging the probe Pr, thereby improving the accuracy of resistance measurement.

The sum of the supply currents Io supplied from each current supply section CS of the measurement blocks M1 to Mn and the draw current Ii drawn by each current lead section CM of the measurement blocks M1 to Mn It is preferable that the sum totals are approximately the same. If the sum of the respective supply currents Io and the sum of the respective incoming currents Ii are approximately equal, then approximately all of the current supplied from the n current supply units CS to the intermediate substrate B is equal to the n current lead units CM ) from the intermediate substrate B, the flow of leakage current from the intermediate substrate B to the outside is suppressed.

Moreover, it is more preferable that each supply current Io and each draw-in current Ii be substantially equal to each other. When each supply current Io and each incoming current Ii are approximately equal to each other, the current flowing between the connection parts in each part of the intermediate substrate B is equalized, and as a result, the potential of the metal plate MP is stabilized. As a result, the resistance measurement accuracy is improved.

The supply-side voltage detection unit VM1 has one end connected to the voltage detection terminal (+S1) and the other end connected to the voltage detection terminal (-S1). The supply-side voltage detection unit VM1 is a voltage detection circuit that measures the voltage between the voltage detection terminals +S1 and -S1 and transmits the voltage value to the control unit 20 as the supply-side voltage V1.

The incoming-side voltage detection unit VM2 has one end connected to the voltage detection terminal (+S2) and the other end connected to the voltage detection terminal (-S2). The incoming-side voltage detection unit VM2 is a voltage detection circuit that measures the voltage between the voltage detection terminals +S2 and -S2 and transmits the voltage value to the control unit 20 as the incoming-side voltage V2.

The scanner unit 31, according to a control signal from the control unit 20, includes a ground terminal G, current terminals (+F, -F) and voltage detection terminals (+S1, of the measurement blocks M1 to Mn). -S1, +S2, -S2) can be electrically connected to arbitrary probe Pr. Accordingly, in response to the control signal from the control unit 20 , the scanner unit 31 passes a current between arbitrary conductor portions with which the probe Pr is in contact, and converts the voltage generated between the arbitrary conductor portions to the supply-side voltage. Measurement is made by the detection unit VM1 and the incoming voltage detection unit VM2, and it becomes possible to connect any conductor portion to the circuit ground. The scanner unit 31 corresponds to an example of a grounding unit.

The conductive part selection part 21 includes n supply-side conductive parts, n lead-side conductive parts, and n parts corresponding to the measurement blocks M1 to Mn, among the conductive parts P with which the probe Pr is in contact. Select (or 2n) conductive parts for voltage measurement and an arbitrary number of conductive parts for grounding. The resistance value of the connecting portion to be paired with the conductive portion P selected as the supply-side conductive portion and the incoming-side conductive portion is calculated by the resistance calculating section 22 . Therefore, the conductive part selection unit 21 sequentially selects a new conductive part P to be paired with a connection part for which a resistance value has not yet been calculated, as the supply-side conductive part and the incoming-side conductive part, to finally measure the resistance value. Measure the resistance of all connections.

The conductive part selection part 21 connects the probe Pr in contact with the supply-side conductive part and the current supply part CS (current terminal (+F)) by means of the scanner part 31 , and the lead-in conductive part Connect the probe Pr and the current lead-in section CM (current terminal (-F)) in contact with the The terminal (+S1)) is connected, and the probe Pr, which is in contact with the conductive part for voltage measurement, and the other end (voltage detection terminal (-S1)) of the supply-side voltage detection part VM1 are connected, and the conductive part for voltage measurement is connected. Connects the probe Pr in contact with one end (voltage detection terminal (+S2)) of the incoming-side voltage detection unit VM2 and the probe Pr and the incoming-side voltage detection unit VM2 in contact with the incoming-side conductive portion. ) to the other end (voltage detection terminal (-S2)).

Accordingly, the conductive part selection part 21 causes a current to flow through the metal plate MP between the supply-side conductive part and the lead-side conductive part by the current supply part CS and the current lead-in part CM, and the supply side The voltage detection unit VM1 detects the supply-side voltage V1 between the supply-side conductive part and the voltage-measuring conductive part, and the incoming-side voltage detection part VM2 detects the incoming-side conductive part and the voltage-measuring conductive part to detect the incoming-side voltage (V2) between

The resistance calculating unit 22 corresponds to the measurement blocks M1 to Mn, based on the supply current Io and the supply voltage V1 of each measurement block, the supply-side conductive portion of each measurement block and the paired connecting portion. Calculate the resistance value. In addition, the resistance calculation unit 22 corresponds to the measurement blocks M1 to Mn, and based on the incoming current Ii and the incoming voltage V2 of each measurement block, the lead-in side conductive part of each measurement block and Calculate the resistance value of the connecting part to be paired.

Next, operation|movement of the above-mentioned resistance measuring apparatus 1 is demonstrated. A description will be given of a resistance measurement method for measuring the resistance of the substrate WB1 using the measurement unit 121 using the case where the substrate to be measured is the intermediate substrate B as an example. Since the measurement of the resistance of the substrate WB2 using the measurement unit 122 is the same as the case of measuring the resistance of the substrate WB1 using the measurement unit 121 , the description thereof will be omitted.

3 and 4 are flowcharts showing an example of the operation of the resistance measuring apparatus 1 using the resistance measuring method according to the embodiment of the present invention. 5 and 6 are explanatory views for explaining the operation of the resistance measuring device 1 shown in FIG. 1 . The explanatory drawings shown in FIG. 5, FIG. 6 illustrate the case where the intermediate board|substrate B is measured. In Figs. 5 and 6, description of the scanner unit 31 is omitted in order to simplify the explanation.

First, the control part 20 moves the measuring part 121 by the measuring part moving mechanism 125, and the probe Pr of the measuring jig 4U to the intermediate board|substrate B fixed to the board|substrate fixing apparatus 110. ) is brought into contact (step S1). In the example shown in FIG. 5, FIG. 6, the case where resistance measurement is carried out according to the so-called quadrilateral measurement method is exemplified, and the probes Pr are in contact with each conductive part P two at a time.

In addition, the resistance measuring apparatus 1 is not limited to the example which measures resistance according to the four-probe measuring method, The probe Pr is made to contact each conductive part one by one, and a current supply and voltage are made to one probe Pr. It does not matter even if it is set as the structure which combines measurement.

Next, the conductive portion selection unit 21 selects a grounding conductive portion from among the conductive portions P with which the probe Pr is in contact, and further n supply-side conductive portions corresponding to the measurement blocks M1 to Mn. and n lead-side conductive parts and n voltage measurement conductive parts are selected (step S2: conductive part selection process).

Since the resistance value of two connection parts can be measured in response to one measurement block, if the number of connection parts to be measured is less than 2n, the supply-side conductive part and the incoming-side conductive part according to the number of connection parts to be measured and a conductive part for voltage measurement may be selected. At least one conductive part for grounding may be selected, and a plurality of conductive parts may be selected.

The conductive part selection unit 21 includes the supply-side conductive part, the incoming-side conductive part and the voltage measurement conductive part selected by the scanner part 31 , the current supply part CS and the current lead part of the measurement blocks M1 to Mn. (CM), the supply-side voltage detection unit VM1, and the incoming-side voltage detection unit VM2 are connected, and the conductive part for grounding and the circuit ground are connected.

5 shows the selected supply-side conductive part, the incoming-side conductive part, the voltage measuring conductive part and the grounding conductive part and the current supply part (CS), the current lead part (CM), the supply-side voltage detection part (VM1), the incoming-side voltage detection part ( It is explanatory drawing which shows an example of the connection relationship between VM2) and a circuit ground.

In the example shown in Fig. 5, corresponding to the measurement block M1, the conductive portion PA1 is selected as the supply-side conductive portion, the conductive portion PC1 is selected as the incoming-side conductive portion, and the conductive portion for voltage measurement is selected as the conductive portion. The conductive part PB1 is selected. Corresponding to the measurement block M2, the conductive portion PD1 is selected as the supply-side conductive portion, the conductive portion PF1 is selected as the incoming-side conductive portion, and the conductive portion PE1 is selected as the voltage measurement conductive portion, and have. Hereinafter, also about the other electroconductive part P, the supply-side electroconductive part, the incoming-side electroconductive part, the electroconductive part for voltage measurement, and the electroconductive part for ground are selected suitably. As the conductive portion for grounding, the conductive portion PZ1 is selected.

Next, the control unit 20 causes the supply current Io to be supplied from the current supply unit CS of the measurement blocks M1 to Mn to each supply-side conductive unit (step S3: current supply step). In the current supply step, for example, an ammeter is connected in series with the current supply unit CS, and the current actually supplied from the current supply unit CS to the supply-side conductive part is measured as the supply current Io, and this ammeter The supply current Io measured by may be used in the resistance calculation process of step S7 to be described later.

Next, the control unit 20 causes the drawing current Ii to be drawn in from each drawing-side conductive section by the current drawing section CM of the measurement blocks M1 to Mn (step S4: current drawing step). ). In the current drawing step, for example, an ammeter is connected in series with the current lead-in section CM, and the current drawn in from the lead-side conductive section by the current lead-in section CM is measured as the draw-in current Ii, and this You may use the draw-in current Ii measured by the ammeter in the resistance calculation process of step S7 mentioned later.

Next, in the measurement blocks M1 to Mn, the supply-side voltage V1 between the supply-side conductive part and the voltage measurement conductive part is detected by the supply-side voltage detection part VM1 (step S5: supply-side voltage) detection process).

In this case, as can be seen from the current path indicated by the broken line in FIG. 5 , the measurement blocks M1 to Mn and the corresponding conductive portions for voltage measurement, PB1 , PE1 , ..., PW1, and the connecting portions RB and RE paired with each other. , ..., RW), no current flows, and therefore no voltage is generated at these points. As a result, each supply-side voltage V1 measured by each supply-side voltage detection unit VM1 does not include the voltage generated by the connection units RB, RE, ..., RW. Accordingly, each supply-side voltage V1 is applied to the measurement blocks M1 to Mn and the corresponding supply-side conductive portions PA1, PD1, ..., PV1 and the connecting portions RA, RD, …, RV to be paired with the supply current Io. ) is approximately equal to the voltage generated by the flow.

Next, in the measurement blocks M1 to Mn, the lead-in voltage V2 between the lead-in-side conductive part and the voltage-measuring conductive part is detected by the lead-in voltage detection part VM2 (step S6). : incoming-side voltage detection process).

In this case, as can be seen from the current path indicated by the broken line in FIG. 5 , the measurement blocks M1 to Mn and the corresponding conductive portions for voltage measurement, PB1 , PE1 , ..., PW1, and the connecting portions RB and RE paired with each other. , ..., RW), no current flows, and therefore no voltage is generated at these points. As a result, the voltages generated by the connecting portions RB, RE, ..., RW are not included in the respective incoming-side voltages V2 measured by the respective incoming-side voltage detecting units VM2. Accordingly, each lead-side voltage V2 is the current drawn into the connecting portions RC, RF, …, RX that are paired with the measurement blocks M1 to Mn and the corresponding lead-side conductive portions PC1, PF1, …, PX1. (Ii) is approximately equal to the voltage produced by the flow.

Next, based on the supply-side voltage V1 and the lead-side voltage V2 detected corresponding to the measurement blocks M1 to Mn, and the lead-in current Ii and the supply current Io, the resistance calculation unit 22 , based on the following formulas (1) and (2), the resistance value Ro of the supply-side conductive part and the paired connection part corresponding to the measurement blocks M1 to Mn, and the lead-side conductive part and the paired connection part A resistance value Ri is calculated (step S7: resistance calculation step).

Resistance value of the connecting part to be paired with the supply-side conductive part Ro = V1/Io ... (One)

Resistance Ri = V2/Ii ... (2)

In the example shown in FIG. 5, the resistance values Ra, Rd, ..., Rv of the connection parts RA, RD, ..., RV are calculated as the resistance value Ro, and the connection parts RC, RF, ..., RX The resistance values Rc, Rf, ..., Rx of are calculated as the resistance value Ri.

Accordingly, the resistance values Ra, Rc, Rd, Rf, ..., Rv, Rx of the connecting portions RA, RC, RD, RF, ..., RV, RX can be individually measured. In this case, in each of the measurement blocks M1 to Mn, voltage detection can be performed at two locations, respectively. Therefore, since voltage detection for resistance measurement can be performed in parallel for a connection portion that is twice the number n of measurement blocks, the resistance measurement time can be shortened.

In addition, since the supply current Io and the draw current Ii have current values greater than or equal to the oxide film removal current value and less than or equal to the rated current value of the probe Pr, each conductive part ( P) The oxide film on the surface can be removed. As a result, the resistance measurement precision of each connection part can be improved.

5, if, for example, the current lead-in part CM is not provided and the lead-side conductive parts PC1, PF1, ..., PX1 are connected to the direct circuit ground, the measurement blocks M1-Mn are The current supply part CS is connected in parallel with respect to the metal plate MP, and the inlet-side conductive parts PC1 , PF1 , ..., PX1 are also connected in parallel with the metal plate MP.

Accordingly, the current supplied from the current supply unit CS of the measurement blocks M1 to Mn is the current path from each current supply unit CS to the circuit ground through the incoming-side conductive units PC1, PF1, ..., PX1. It is distributed according to the resistance value, and variations occur in the current flowing through the incoming conductive portions PC1, PF1, ..., PX1.

As a result, there is a risk that the current flowing through the lead-side conductive parts PC1, PF1, ..., PX1 exceeds the rated current value of the probe Pr or falls short of the oxide film removal current value. The probe Pr in contact with the lead-in conductive part in which the flowing current exceeds the rated current value is damaged, and the oxide film is not removed from the lead-in conductive part in which the flowing current does not reach the oxide film removal current value. The calculation precision of the resistance value of the connection part used as a negative and pair decreases.

On the other hand, according to the resistance measuring device 1, the current flowing through the lead-in conductive parts PC1, PF1, ..., PX1 is equal to or greater than the oxide film removal current value by each current supply unit CS, and the rating of the probe Pr Since it becomes less than a current value, the resistance measurement precision of each connection part can be improved without damaging the probe Pr.

Also, if, for example, the conductive part PZ1 for grounding is not connected to the circuit ground, the metal plate MP is connected to the circuit ground through the internal impedance of the current supply part CS or the current lead part CM. As a result, the potential of the metal plate MP becomes unstable. When the potential of the metal plate MP becomes unstable, the voltage measurement by the supply-side voltage detection unit VM1 and the incoming-side voltage detection unit VM2 becomes unstable, and the measurement accuracy of the supply-side voltage V1 and the incoming-side voltage V2 decreases. As a result, there exists a possibility that the calculation precision of the resistance value of each connection part may fall.

On the other hand, according to the resistance measuring device 1, the conductive part PZ1 for grounding is connected to the circuit ground by the scanner part 31 (ground part), and the metal plate MP is connected through the low resistance connection part RZ. Since it is connected to the circuit ground, the potential of the metal plate MP is stabilized. As a result, the measurement accuracy of the supply-side voltage V1 and the incoming-side voltage V2 is improved, and the calculation accuracy of the resistance value of each connection portion is improved.

Next, the conductive part selection part 21 confirms whether the resistance values of all the connection parts RA-RZ of a measurement object are in the calculated state (step S11). And if the resistance values of all the connection parts RA-RZ to be measured are in a state of being calculated (YES in step S11), the conductive part selection part 21 ends the process.

On the other hand, if the connection part for which the resistance value has not yet been calculated remains (NO in step S11), the conductive part selection part 21 becomes a pair with the connection part which the probe Pr contacted and the resistance value was not calculated. Among the sections, n supply-side conductive parts and n incoming-side conductive parts corresponding to the measurement blocks M1 to Mn are newly selected, and further, from among the conductive parts other than the newly selected conductive parts, a grounding conductive part and measurement blocks M1-Mn are newly selected. Mn), n conductive parts for voltage measurement are newly selected (step S12).

Then, the conductive part selection unit 21 selects the supply-side conductive part, the incoming-side conductive part, and the voltage measurement conductive part newly selected by the scanner part 31 as the current supply part CS of the measurement blocks M1 to Mn. , connect the current lead-in section CM, the supply-side voltage detector VM1 and the lead-side voltage detector VM2, connect the newly selected ground conductive section to the circuit ground, and repeat the process after step S3 again .

6 shows a newly selected supply-side conductive part, an incoming-side conductive part, a voltage measuring conductive part and a grounding conductive part, a current supply part CS, a current lead-in part CM, a supply-side voltage detection part VM1, and an incoming-side conductive part. It is explanatory drawing which shows an example of the connection relationship between voltage detection part VM2 and a circuit ground.

In the example shown in Fig. 6, corresponding to the measurement block M1, the conductive portion PB1 is selected as the supply-side conductive portion, the conductive portion PE1 is selected as the incoming-side conductive portion, and the conductive portion for voltage measurement is selected as the conductive portion. The conductive part PC1 and the conductive part PD1 are selected. In this way, the plurality of conductive portions may be used as the conductive portions for voltage measurement.

Further, corresponding to the measurement block Mn, the conductive portion PW1 is selected as the supply-side conductive portion, the conductive portion PZ1 is selected as the incoming-side conductive portion, and the conductive portion PX1 is selected as the voltage measurement conductive portion. being selected Hereinafter, also about the other electroconductive part P, the supply-side electroconductive part, the incoming-side electroconductive part, the electroconductive part for voltage measurement, and the electroconductive part for ground are selected suitably. As the conductive portion for grounding, the conductive portion PA1 is selected.

In the example shown in Fig. 6, in step S2, the conductive portion for voltage measurement or the conductive portion for grounding is used, and the conductive portions PB1, PE1, PW1, and PZ1, whose resistance is not measured, are the supply-side conductive portion or the incoming-side conductive portion. Thus, the resistance values of the connecting portions paired with the conductive portions PB1, PE1, PW1, and PZ1 are measured.

Hereinafter, the processing of steps S3 to S11 is repeated based on the newly selected supply-side conductive part, incoming-side conductive part, and voltage measurement conductive part, and finally the resistance values of all the connection parts to be measured are measured.

As mentioned above, according to the process of steps S1-S12, planar conductors, such as the electrically conductive intermediate board|substrate B spread|expanded in planar shape, the board|substrate surface BS1 which opposes the planar conductor, and the board|substrate surface BS1. The connecting portion RA of the substrate under measurement such as the intermediate substrate B having a pair of the conductive portions PA1 to PZ1 provided in the The resistance values (Ra-Rz) of ∼RZ) can be measured individually.

In addition, the number of measurement blocks may be one. Even if the number of measurement blocks is one, the resistance of the two connecting portions corresponding to the measurement blocks can be individually measured. In addition, it is not necessary to provide the conductive part for grounding, and the scanner unit 31 does not need to connect the conductive part for grounding to the circuit ground.

In addition, although the example in which the some probe Pr is arrange|positioned so that it may correspond with the arrangement|positioning of the conductive part of the board|substrate to be inspected is shown, the current supply part CS, the current lead part CM, and the supply side by a movable, so-called flying probe. The voltage detection unit VM1, the incoming-side voltage detection unit VM2, and the circuit ground may be electrically connected to the conductive unit.

A resistance measuring device according to an aspect of the present invention includes a planar conductive planar conductor, a substrate surface opposite to the planar conductor, a conductive portion provided on the substrate surface, and electrically connecting the conductive portion to the planar conductor A resistance measuring device for measuring the resistance of the connection portion of a substrate to be measured having a pair with a connection portion and having three or more pairs, wherein a supply current preset to a supply-side conductive portion which is one of the three or more conductive portions a current supplying unit for supplying and a supply-side voltage detector for detecting a supply-side voltage that is a voltage between the supply-side conductive part and the voltage-measuring conductive part, which is a conductive part different from the incoming-side conductive part, and the voltage measuring conductive part and the incoming-side conductive part; an incoming-side voltage detection unit for detecting an incoming-side voltage, which is a voltage between A resistance calculator is provided for calculating a resistance value of a connection part to be paired with the lead-in-side conductive part based on the .

According to this configuration, the supply current is supplied to the supply-side conductive part by the current supply part, and the incoming current is drawn in from the incoming-side conductive part by the current lead-in part. As a result, the supply-side conductive part, the supply-side conductive part and the paired connection part, planar conductor, A current flows in the connecting portion paired with the incoming-side conductive portion and the incoming-side conductive portion. However, since no current flows in the connecting portion to be paired with the voltage measurement conductive portion and therefore no voltage is generated in this connecting portion, the supply-side voltage, which is the voltage between the voltage measurement conductive portion and the supply-side conductive portion, includes the supply-side conductive portion The voltage generated at the connecting part that is paired with and is included, and the voltage generated at the other connecting parts is not included. As a result, the resistance value calculated by the resistance calculator based on the supply current and the supply-side voltage is approximately equal to the resistance value of the connection portion to be paired with the supply-side conductive portion. Similarly, the incoming-side voltage, which is the voltage between the voltage-measuring conductive portion and the incoming-side conductive portion, includes a voltage generated at a connecting portion paired with the incoming-side conductive portion, and does not include voltages generated at other connecting portions. As a result, the resistance value calculated by the resistance calculating section based on the drawing current and the drawing-side voltage is approximately equal to the resistance value of the connecting portion to be paired with the drawing-side conductive section. Thereby, the resistance value of the connection part paired with the supply-side conductive part and the resistance value of the connection part paired with the lead-side conductive part can be individually measured.

In addition, a plurality of sets including the current supply unit, the current lead-in unit, the supply-side voltage detection unit and the draw-side voltage detection unit are provided, and corresponding to each of the sets, the supply-side conductive part and the lead-side conductive part are provided. negative and the voltage measuring conductive part are set, and the resistance calculating part is a connecting part paired with the supply-side conductive part corresponding to each set, based on the supply current and the supply-side voltage detected corresponding to each set. It is preferable to calculate the resistance value, and calculate the resistance value of the connecting portion to be paired with the incoming-side conductive portion corresponding to the respective set based on the incoming current and the incoming voltage detected corresponding to each set .

According to this configuration, it is possible to simultaneously perform the measurement of the resistance value of the connection portion to be paired with the supply-side conductive portion for each set and the measurement of the resistance value of the connection portion to be paired with the incoming-side conductive portion, so that it is possible to shorten the resistance measurement time. becomes

It is also preferable that the sum of the supply currents corresponding to the respective sets and the sum of the draw currents corresponding to the respective sets are substantially the same.

According to this configuration, since approximately all of the current supplied from the current supply unit of each set to the substrate to be measured is withdrawn from the substrate to be measured by the current lead-in unit of each set, the leakage current from the substrate to be measured to the outside is suppressed. .

In addition, it is preferable that the said supply current and the said draw-in current are substantially equal to each other.

According to this configuration, the electric potential of the planar conductor is stabilized as a result of equalizing the current flowing between the connecting parts in each part of the substrate to be measured. As a result, the resistance measurement accuracy is improved.

Further, a probe for contacting each of the conductive parts in order to supply a current by the current supply unit, draw in a current by the current lead-in unit, detect a voltage by the supply-side voltage detection unit, and detect a voltage by the lead-side voltage detection unit Preferably, the supply current and the incoming current are set to be equal to or greater than an oxide film removal current value for removing an oxide film formed on the surface of each conductive part and equal to or less than a rated current value of the probe.

According to this configuration, a current greater than the oxide film removal current value for removing the oxide film and less than or equal to the rated current value of the probe flows through each probe. Therefore, the resistance is measured by removing the oxide film on the surface of the conductive part without damaging the probe. can improve the precision of

Further, it is preferable to further include a grounding portion for connecting a grounding conductive portion different from the supply-side conductive portion, the incoming-side conductive portion, and the voltage measuring conductive portion to a circuit ground among the respective conductive portions.

According to this configuration, since the conductive portion for grounding is connected to the circuit ground by the grounding portion and the planar conductor is connected to the circuit ground through the connecting portion, the potential of the planar conductor is stabilized. As a result, the measurement accuracy of the supply-side voltage and the incoming-side voltage is improved, and the calculation accuracy of the resistance value of each connection portion is improved.

In addition, the resistance measuring method according to an aspect of the present invention includes a planar conductive planar conductor, a substrate surface opposite to the planar conductor, a conductive portion provided on the substrate surface, and the conductive portion electrically to the planar conductor In the resistance measurement method for measuring the resistance of the connection portion of a substrate to be measured having a pair with a connecting portion to be connected and having three or more pairs of the pair, a supply-side conductive portion that is one of the three or more conductive portions is set in advance A current supply step of supplying a supply current; a current drawing step of drawing in a predetermined drawing current from an incoming-side conductive portion which is one of the respective conductive portions and is different from the supply-side conductive portion; a supply-side voltage detection step of detecting a supply-side voltage that is a voltage between the supply-side conductive portion and a voltage-measuring conductive portion that is a conductive portion different from the negative and the incoming-side conductive portion, and the voltage measurement conductive portion and the incoming-side conductive portion an incoming-side voltage detection step of detecting an incoming-side voltage, which is a voltage between the negative and negative, and calculating a resistance value of a connecting portion paired with the supply-side conductive portion based on the supply current and the supply-side voltage, wherein the incoming current and the and a resistance calculation step of calculating a resistance value of the connecting portion to be paired with the lead-in conductive portion based on the incoming-side voltage.

According to this configuration, the supply current is supplied to the supply-side conductive part in the current supply process, and the incoming current is drawn in from the lead-side conductive part in the current drawing process. As a result, the supply-side conductive part, the supply-side conductive part and the paired connection part, the planar conductor, the lead-in A current flows in the connecting portion to be paired with the side conductive portion and the incoming-side conductive portion. However, since no current flows in the connecting portion to be paired with the voltage measurement conductive portion and thus no voltage is generated in this connecting portion, the supply-side voltage, which is the voltage between the voltage measurement conductive portion and the supply-side conductive portion, includes the supply-side conductive portion The voltage generated at the connecting part that is paired with and is included, and the voltage generated at the other connecting parts is not included. As a result, the resistance value calculated on the basis of the supply current and the supply-side voltage in the resistance calculation step becomes substantially equal to the resistance value of the supply-side conductive portion and the connecting portion to be paired with. Similarly, the incoming-side voltage, which is the voltage between the voltage-measuring conductive portion and the incoming-side conductive portion, includes a voltage generated at a connecting portion paired with the incoming-side conductive portion, and does not include voltages generated at other connecting portions. As a result, in the resistance calculation step, the resistance value calculated based on the draw-in current and the pull-in voltage becomes substantially equal to the resistance value of the lead-in-side conductive part and the connecting part to be paired with. Thereby, the resistance value of the connection part paired with the supply-side conductive part and the resistance value of the connection part paired with the incoming-side conductive part can be measured separately.

A resistance measuring device and a resistance measuring method having such a configuration include a planar conductive planar conductor, a substrate surface facing the planar conductor, a conductive portion provided on the substrate surface, and a connecting portion electrically connecting the conductive portion to the planar conductor The resistance of the connecting portion of the substrate to be measured having the pair can be measured individually.

This application is based on Japanese Patent Application Japanese Patent Application No. 2016-233892 for which it applied on December 1, 2016, The content is taken in here. In addition, specific embodiments or examples made in the section for carrying out the invention are for clarifying the technical content of the present invention to the last, and the present invention is limited only to these specific examples and should be construed in a narrow sense. it is not

1: resistance measuring device
4U, 4L: measuring jig
20: control unit
21: conductive part selection part
22: resistance calculator
31: scanner unit
110: substrate holding device
112: housing (筐体)
121, 122: measurement unit
125: measuring unit moving mechanism
B: intermediate substrate
BS, BS1: substrate surface
BS2: contact surface
CM: Current Entry
CS: Current supply
G: ground terminal
II: incoming current
Io: supply current
IP: inner layer pattern
M1 to Mn: Measuring block
MP: metal plate
P, PA1 to PZ1: conductive part
Pr: probe
RA∼RZ: Connection
Ra to Rz: resistance value
V1: Supply-side voltage
V2: incoming voltage
VM1: Supply-side voltage detection unit
VM2: incoming voltage detection unit
WB: multilayer substrate
WB1, WB2: Substrate

Claims (10)

Having a pair of a planar conductive planar conductor, a substrate surface facing the planar conductor, and a conductive portion provided on the substrate surface and a connecting portion electrically connecting the conductive portion to the planar conductor, In the resistance measuring apparatus for measuring the resistance of the connection part of the substrate to be measured having three or more pairs,
a current supply unit for supplying a preset supply current to a supply-side conductive unit that is one of the three or more conductive units;
a current lead-in part for drawing in a predetermined draw-in current from an incoming-side conductive part which is one of the respective conductive parts and which is different from the supply-side conductive part;
a supply-side voltage detector for detecting a supply-side voltage that is a voltage between the supply-side conductive part and a voltage-measuring conductive part that is a conductive part different from the supply-side conductive part and the incoming-side conductive part of each of the conductive parts;
an incoming-side voltage detector for detecting an incoming-side voltage that is a voltage between the voltage-measuring conductive portion and the incoming-side conductive portion;
A resistance value of a connection part paired with the supply-side conductive part is calculated based on the supply current and the supply-side voltage, and a resistance value of a connection part paired with the lead-side conductive part is calculated based on the incoming current and the lead-side voltage resistance output unit
equipped with
The current supply unit,
having first and second terminals, wherein the first terminal is connected to the circuit ground, the second terminal is connected to the supply-side conductive portion side, and supplies the supply current from the first terminal to the second terminal;
The current inlet,
It has third and fourth terminals, the third terminal is connected to the lead-side conductive part side, the fourth terminal is connected to the circuit ground, and the drawing current is drawn from the third terminal to the fourth terminal do,
a plurality of sets including the current supply unit, the current lead-in unit, the supply-side voltage detection unit, and the incoming-side voltage detection unit;
Corresponding to each of the sets, the supply-side conductive part, the incoming-side conductive part, and the voltage measurement conductive part are set;
The resistance calculator,
Based on the supply current and the supply-side voltage corresponding to each set, a resistance value of a connecting portion to be paired with the supply-side conductive portion corresponding to each set is calculated, and the drawing-in current and the drawing-in corresponding to each set are calculated. A resistance measuring device for calculating a resistance value of a connection portion to be paired with the incoming-side conductive portion corresponding to each set based on a side voltage. According to claim 1,
and the sum of the supply currents corresponding to the respective sets and the sum of the draw currents corresponding to the respective sets are the same. 3. The method of claim 1 or 2,
The supply current and the draw-in current are equal to each other, resistance measuring device. 3. The method of claim 1 or 2,
A probe for contacting each of the conductive parts to perform current supply by the current supply unit, current draw in by the current lead-in unit, voltage detection by the supply-side voltage detection unit, and voltage detection by the incoming-side voltage detection unit
equipped with
The supply current and the draw current are
The resistance measuring device is set to be equal to or higher than an oxide film removal current value for removing an oxide film formed on a surface of each of the conductive portions and equal to or less than a rated current value of the probe. 3. The method of claim 1 or 2,
The resistance measuring device,
A grounding portion for connecting a grounding conductive portion different from the supply-side conductive portion, the incoming-side conductive portion, and the voltage measuring conductive portion to a circuit ground among the respective conductive portions
Further equipped with a resistance measuring device. 4. The method of claim 3,
A probe for contacting each of the conductive parts to perform current supply by the current supply unit, current draw in by the current lead-in unit, voltage detection by the supply-side voltage detection unit, and voltage detection by the incoming-side voltage detection unit
equipped with
The supply current and the draw current are
The resistance measuring device is set to be equal to or higher than an oxide film removal current value for removing an oxide film formed on a surface of each of the conductive portions and equal to or less than a rated current value of the probe. 4. The method of claim 3,
The resistance measuring device,
A grounding portion for connecting a grounding conductive portion different from the supply-side conductive portion, the incoming-side conductive portion, and the voltage measuring conductive portion to a circuit ground among the respective conductive portions
Further equipped with a resistance measuring device. 5. The method of claim 4,
The resistance measuring device,
A grounding portion for connecting a grounding conductive portion different from the supply-side conductive portion, the incoming-side conductive portion, and the voltage measuring conductive portion to a circuit ground among the respective conductive portions
Further equipped with a resistance measuring device. In the resistance measuring method for measuring the resistance of the connection part using the resistance measuring device according to claim 1,
Corresponding to each of the sets, the supply-side conductive part, the incoming-side conductive part, and the voltage measurement conductive part are set;
Based on the supply current and the supply-side voltage corresponding to each set, a resistance value of a connecting portion to be paired with the supply-side conductive portion corresponding to each set is calculated, and the drawing-in current and the drawing-in corresponding to each set are calculated. A resistance measuring method for calculating a resistance value of a connection portion to be paired with the incoming-side conductive portion corresponding to each set based on the side voltage. delete

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