KR920010888A - 입력보호회로를 갖춘 반도체 장치 - Google Patents
입력보호회로를 갖춘 반도체 장치 Download PDFInfo
- Publication number
- KR920010888A KR920010888A KR1019910020872A KR910020872A KR920010888A KR 920010888 A KR920010888 A KR 920010888A KR 1019910020872 A KR1019910020872 A KR 1019910020872A KR 910020872 A KR910020872 A KR 910020872A KR 920010888 A KR920010888 A KR 920010888A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor
- region
- semiconductor device
- semiconductor region
- ground potential
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0156—Manufacturing their doped wells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/85—Complementary IGFETs, e.g. CMOS
- H10D84/859—Complementary IGFETs, e.g. CMOS comprising both N-type and P-type wells, e.g. twin-tub
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (13)
- 제1도전형의 반도체기판(11)과, 이 반도체기판(11)의 표면영역의 일부에 형성된 제2도전형의 웰영역(17), 이 웰영역(17)의 표면영역의 일부에 형성되어 외부신호가 입력되는 입력패드(18)에 접속된 제1도전형의 제1반도체영역(12) 및, 상기 웰영역(17)의 표면영역의 일부에 각각 형성되어 일정한 전위가 각각 인가되는 제1도전형의 제2반도체영역(13,14) 및 제2도전형의 제3반도체 영역(15)을 구비하고, 상기 웰영역(17)은 상기 제1과 제2 및 제3반도체영역(12,13,14,15)이외의 반도체 영역을 포함하지 않고 상기 반도체기판(11)내에 설치된 다른 반도체회로(MC)로부터 독립되어 있는 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 제2반도체영역(13,14) 및 제3반도체영역(15)에는 각각 접지전위(Vss)가 인가되고, 상기 입력패드(18)와 접지전위(Vss)의 상호간에 기생트랜지스터(19)와 기생다이오드(10)의 병렬회로가 형성되는 것을 특징으로 하는 반도체 장치.
- 제2항에 있어서, 상기 제2반도체영역(13,14) 및 제3반도체영역(15)은 서로 접속되어 있는 것을 특징으로하는 반도체 장치.
- 제3항에 있어서, 상기 제2반도체영역(12)의 근방에 형성되고, 상기 제3반도체영역(15)은 상기 제2반도체영역(13,14)을 기준으로 상기 제1반도체영역(12)과는 반대측에 형성되어 있는 것을 특징으로 하는 반도체장치.
- 제4항에 있어서, 상기 제1반도체영역(12)은 상기 입력패드(18)의 근방에 설치되어 있는 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 웰영역(17)의 내부에서 상기 제1반도체영역(12)의 바로 밑에는 제1도전형의 웰영역(30)이 형성되어 있는 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 제2반도체영역(13,14)과 제3반도체영역(15)의 상호간격(a)은 상기 제1반도체영역(12)과 제2반도체영역(13,14)의 상호 간격(b)보다 길게 되어 있고, 상기 입력패드(18)과 접지전위(Vss)의 상호간에 기생트랜지스터(19)의 전류통로가 형성됨과 더불어 기생다이오드(10)과 기생저항(20)의 직렬회로가 형성되는 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 제2반도체영역(13,14)은 접지전위(Vss)에 접속되고, 상기 제3반도체영역(15)은 저항소자(31,32)를 매개하여 접지전위(Vss)에 접속되어 있는 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 제2반도체영역(13,14)은 접지전위(Vss)에 접속되고, 상기 제3반도체영역(15)은 접지전위(Vss)보다 낮은 백게이트바이어스전위(VBB)에 접속되어 있는 것을 특징으로 하는 반도체장치.
- 제9항에 있어서, 상기 백게이트바이어스전위(VBB)는 저항소자 (41,42)를 매개하여 상기 제3반도체영역(15)에 접속되어 있는 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 제2반도체영역(13,14)은 접지전위(Vss)에 접속되고, 상기 제3반도체영역(15)은 접지전위(Vss)보다 낮은 제1의 백게이트바이어스전위(VBB1)에 접속되며, 상기 반도체기판(11)은 상기 제1의 백게이트바이어스전위(VBB1)와는 다른 제2의 백게이트바이어스전위(VBB2)에 접속되어 있는 것을 특징으로 하는 반도체장치.
- 제11항에 있어서, 상기 반도체기판(11)은 각각 상기 제1 및 제2의 백게이트전위(VBB1, VBB2)를 발생시키는 제1 및 제2의 전위발생회로(62,63)가 설치되어 있는 것을 특징으로 하는 반도체장치.
- 제1항에 있어서, 상기 제1도전형은 n형이고, 상기 제2도전형은 p형인 것을 특징으로 하는 반도체장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP90-340617 | 1990-11-30 | ||
JP34061890 | 1990-11-30 | ||
JP90-340618 | 1990-11-30 | ||
JP34061790 | 1990-11-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920010888A true KR920010888A (ko) | 1992-06-27 |
KR960002094B1 KR960002094B1 (ko) | 1996-02-10 |
Family
ID=26576752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910020872A KR960002094B1 (ko) | 1990-11-30 | 1991-11-22 | 입력보호회로를 갖춘 반도체장치 |
Country Status (4)
Country | Link |
---|---|
US (2) | US5594265A (ko) |
EP (1) | EP0488340B1 (ko) |
KR (1) | KR960002094B1 (ko) |
DE (1) | DE69121845T2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100408796B1 (ko) * | 1995-11-07 | 2004-03-20 | 텍트로닉스 인코포레이티드 | 고대역폭증폭기용입력보호장치 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69232257T2 (de) * | 1991-09-30 | 2002-08-08 | Texas Industries, Inc. | Durch Verarmung kontrollierte Isolationsstufe |
US5485024A (en) * | 1993-12-30 | 1996-01-16 | Linear Technology Corporation | Electrostatic discharge circuit |
JPH07283405A (ja) * | 1994-04-13 | 1995-10-27 | Toshiba Corp | 半導体装置の保護回路 |
JP2943738B2 (ja) * | 1996-11-29 | 1999-08-30 | 日本電気株式会社 | 半導体装置における静電保護回路 |
KR100214566B1 (ko) * | 1997-04-22 | 1999-08-02 | 구본준 | 입력 보호회로 |
US5896313A (en) * | 1997-06-02 | 1999-04-20 | Micron Technology, Inc. | Vertical bipolar SRAM cell, array and system, and a method of making the cell and the array |
KR100481836B1 (ko) * | 1997-08-26 | 2006-05-29 | 삼성전자주식회사 | 이오에스 보호소자 |
US6002277A (en) * | 1998-04-06 | 1999-12-14 | Intersil Corporation | Sample-and-hold circuit having reduced parasitic diode effects and related methods |
US6016067A (en) * | 1998-04-06 | 2000-01-18 | Intersil Corporation | Sample-and-hold circuit having reduced amplifier offset effects and related methods |
US6069502A (en) * | 1998-04-06 | 2000-05-30 | Intersil Corporation | Sample-and-hold circuit having reduced subthreshold conduction effects and related methods |
JP4376348B2 (ja) * | 1998-05-18 | 2009-12-02 | パナソニック株式会社 | 半導体装置 |
JP3123984B2 (ja) * | 1998-07-31 | 2001-01-15 | 日本電気アイシーマイコンシステム株式会社 | 半導体集積回路装置 |
US6304423B1 (en) * | 1999-06-08 | 2001-10-16 | Delphi Technologies, Inc. | Input protection circuit for a semiconductor device |
DE19944487B4 (de) * | 1999-09-16 | 2005-04-28 | Infineon Technologies Ag | ESD-Schutzanordnung für eine Halbleitervorrichtung |
US6914306B1 (en) * | 2000-08-25 | 2005-07-05 | Micron Technology, Inc. | Electrostatic discharge protection device |
US6455896B1 (en) * | 2001-04-25 | 2002-09-24 | Macronix International Co., Ltd. | Protection circuit for a memory array |
US7808047B1 (en) * | 2002-11-14 | 2010-10-05 | Altera Corporation | I/O ESD protection device for high performance circuits |
US6919603B2 (en) * | 2003-04-30 | 2005-07-19 | Texas Instruments Incorporated | Efficient protection structure for reverse pin-to-pin electrostatic discharge |
KR101024483B1 (ko) * | 2004-05-14 | 2011-03-23 | 주식회사 하이닉스반도체 | 정전기 방전 보호 소자 |
DE102005027368A1 (de) * | 2005-06-14 | 2006-12-28 | Atmel Germany Gmbh | Halbleiterschutzstruktur für eine elektrostatische Entladung |
WO2010095003A1 (en) * | 2009-02-23 | 2010-08-26 | Freescale Semiconductor, Inc. | Semiconductor device with appraisal circuitry |
JP2010214724A (ja) * | 2009-03-16 | 2010-09-30 | Alps Electric Co Ltd | サーマルヘッド |
US10411086B2 (en) | 2014-04-07 | 2019-09-10 | Semiconductor Components Industries, Llc | High voltage capacitor and method |
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JPH02119262A (ja) * | 1988-10-28 | 1990-05-07 | Toshiba Corp | 半導体装置 |
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-
1991
- 1991-11-22 KR KR1019910020872A patent/KR960002094B1/ko not_active IP Right Cessation
- 1991-11-27 US US07/799,342 patent/US5594265A/en not_active Expired - Lifetime
- 1991-11-29 DE DE69121845T patent/DE69121845T2/de not_active Expired - Lifetime
- 1991-11-29 EP EP91120467A patent/EP0488340B1/en not_active Expired - Lifetime
-
1997
- 1997-01-30 US US08/790,804 patent/US5949109A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100408796B1 (ko) * | 1995-11-07 | 2004-03-20 | 텍트로닉스 인코포레이티드 | 고대역폭증폭기용입력보호장치 |
Also Published As
Publication number | Publication date |
---|---|
US5594265A (en) | 1997-01-14 |
DE69121845D1 (de) | 1996-10-10 |
US5949109A (en) | 1999-09-07 |
KR960002094B1 (ko) | 1996-02-10 |
DE69121845T2 (de) | 1997-02-06 |
EP0488340A1 (en) | 1992-06-03 |
EP0488340B1 (en) | 1996-09-04 |
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