KR890012398A - Mos형 반도체장치의 입력보호회로 - Google Patents
Mos형 반도체장치의 입력보호회로 Download PDFInfo
- Publication number
- KR890012398A KR890012398A KR1019890000192A KR890000192A KR890012398A KR 890012398 A KR890012398 A KR 890012398A KR 1019890000192 A KR1019890000192 A KR 1019890000192A KR 890000192 A KR890000192 A KR 890000192A KR 890012398 A KR890012398 A KR 890012398A
- Authority
- KR
- South Korea
- Prior art keywords
- input
- protection circuit
- circuit according
- protection
- gate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/811—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using FETs as protective elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/611—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using diodes as protective elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/711—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using bipolar transistors as protective elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/931—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs characterised by the dispositions of the protective arrangements
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Emergency Protection Circuit Devices (AREA)
Abstract
Description
Claims (10)
- 입력패드(11)와, 이 입력패드(11)의 신호가 게이트에 공급되는 입력단 MOS트랜지스터(13, 50, 56), 상기 입력패드(11)와 상기 입력단 MOS트랜지스터(13, 50, 56)게이트를 접속하는 배선 (12, 25, 41, 45, 46), 상기 입력패드(11) 근방에 설치되어 그 일단이 상기 배선에 접속된 제1보호소자(14, 16, 17, 18) 및 상기 입력단 MOS트랜지스터(13, 50, 56) 게이트 근방에 설치되어 그 일단이 상기 배선(12, 25, 41, 46)에 접속된 제2보호소자(15, 19)로 구성된 것을 특징으로 MOS형 반도체 장치의 입력보호회로.
- 제1항에 있어서, 상기 제2보호소자(15, 19)가 보호링영역(55)으로 둘러싸이면서 상기 입력단 MOS트랜지스터(13, 50, 56)가 형성되어 있는 회로블럭(54)내에 형성된 것을 특징으로 하는 MOS형 반도체 장치의 입력보호회로.
- 제1항에 있어서, 상기 제1보호소자(14, 16, 17, 18)가 1개의 바이폴러 트랜지스터(14)로 구성된 것을 특징으로 하는 MOS형 트랜지스터의 입력보호회로.
- 제1항에 있어서, 상기 제1보호소자(14, 16, 17, 18)가 2개의 다이오드(16, 17)로 구성된 것을 특징으로 하는 MOS형 트랜지스터의 입력보호회로.
- 제1항에 있어서, 상기 제1보호소자(14, 16, 17, 18)가 2개의 바이폴러 트랜지스터(14, 18)로 구성된 것을 특징으로 하는 MOS형 트랜지스터의 입력보호회로.
- 제1항에 있어서, 상기 제2보호소자(15,19)가 다이오드(15)인 것을 특징으로 하는 MOS형 트랜지스터의 입력보호회로.
- 제1항에 있어서, 상기 제2보호소자(15,19)가 소오스와 드레인이 상기 배선(12)에 공통접속된 MOS 트랜지스터(19)인 것을 특징으로 하는 MOS형 트랜지스터의 입력보호회로.
- 제7항에 있어서, 상기 MOS형 트랜지스터(19)의 게이트가 접지전위(Vss)에 접속된 것을 특징으로 하는 MOS형 트랜지스터의 입력보호회로.
- 제7항에 있어서, 상기 MOS형 트랜지스터(19)의 게이트가 전원전위(Vcc)에 접속된 것을 특징으로 하는 MOS형 트랜지스터의 입력보호회로.
- 제1항에 있어서, 상기 배선(12, 25, 41, 45, 46)도중에 저항(R)이 직렬로 연결되어진 것을 특징으로 하는 MOS형 트랜지스터의 입력보호회로.※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63-3612 | 1988-01-11 | ||
JP63003612A JPH07105446B2 (ja) | 1988-01-11 | 1988-01-11 | Mos型半導体装置の入力保護回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890012398A true KR890012398A (ko) | 1989-08-26 |
KR910009355B1 KR910009355B1 (ko) | 1991-11-12 |
Family
ID=11562315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890000192A KR910009355B1 (ko) | 1988-01-11 | 1989-01-10 | Mos형 반도체장치의 입력보호회로 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4924339A (ko) |
EP (1) | EP0324185B1 (ko) |
JP (1) | JPH07105446B2 (ko) |
KR (1) | KR910009355B1 (ko) |
DE (1) | DE3885263T2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100256465B1 (ko) * | 1995-11-27 | 2000-05-15 | 다니구찌 이찌로오, 기타오카 다카시 | 반도체 장치의 입력 보호 회로 |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2642543B1 (fr) * | 1989-01-27 | 1991-04-05 | Gemplus Card Int | Dispositif de securite pour circuit integre |
JPH061802B2 (ja) * | 1989-03-14 | 1994-01-05 | 株式会社東芝 | 半導体装置 |
DE3943279C2 (de) * | 1989-12-29 | 2001-07-12 | Bosch Gmbh Robert | Schaltung zum Ausgleichen sehr schneller Stromschwankungen |
US5049764A (en) * | 1990-01-25 | 1991-09-17 | North American Philips Corporation, Signetics Div. | Active bypass for inhibiting high-frequency supply voltage variations in integrated circuits |
KR960002094B1 (ko) * | 1990-11-30 | 1996-02-10 | 가부시키가이샤 도시바 | 입력보호회로를 갖춘 반도체장치 |
FR2676870B1 (fr) * | 1991-05-24 | 1994-12-23 | Sgs Thomson Microelectronics | Structure de protection dans un circuit cmos contre le verrouillage. |
JP2953192B2 (ja) * | 1991-05-29 | 1999-09-27 | 日本電気株式会社 | 半導体集積回路 |
EP0517391A1 (en) * | 1991-06-05 | 1992-12-09 | STMicroelectronics, Inc. | ESD protection circuit |
US5229635A (en) * | 1991-08-21 | 1993-07-20 | Vlsi Technology, Inc. | ESD protection circuit and method for power-down application |
DE69232257T2 (de) * | 1991-09-30 | 2002-08-08 | Texas Industries, Inc. | Durch Verarmung kontrollierte Isolationsstufe |
DE4135522C2 (de) * | 1991-10-28 | 1996-11-21 | Siemens Ag | Schaltungsanordnung zum Schutz integrierter Schaltkreise |
US5293057A (en) * | 1992-08-14 | 1994-03-08 | Micron Technology, Inc. | Electrostatic discharge protection circuit for semiconductor device |
JP2965840B2 (ja) * | 1993-12-02 | 1999-10-18 | 株式会社東芝 | トランジスタ回路 |
FR2715504B1 (fr) * | 1994-01-25 | 1996-04-05 | Sgs Thomson Microelectronics | Circuit intégré incorporant une protection contre les décharges électrostatiques. |
JPH07283405A (ja) * | 1994-04-13 | 1995-10-27 | Toshiba Corp | 半導体装置の保護回路 |
JP3332123B2 (ja) * | 1994-11-10 | 2002-10-07 | 株式会社東芝 | 入力保護回路及びこれを用いた半導体装置 |
JP2822915B2 (ja) * | 1995-04-03 | 1998-11-11 | 日本電気株式会社 | 半導体装置 |
US5578860A (en) * | 1995-05-01 | 1996-11-26 | Motorola, Inc. | Monolithic high frequency integrated circuit structure having a grounded source configuration |
WO1997010615A1 (en) * | 1995-09-11 | 1997-03-20 | Analog Devices, Inc. (Adi) | Electrostatic discharge protection network and method |
US6091114A (en) * | 1998-03-31 | 2000-07-18 | Texas Instruments Incorporated | Method and apparatus for protecting gate oxide from process-induced charging effects |
JP2001308282A (ja) * | 2000-04-19 | 2001-11-02 | Nec Corp | 半導体装置 |
DE10201056B4 (de) * | 2002-01-14 | 2007-06-21 | Infineon Technologies Ag | Halbleitereinrichtung mit einem bipolaren Schutztransistor |
KR20030078379A (ko) * | 2002-03-29 | 2003-10-08 | 주식회사 하이닉스반도체 | 정전기 보호회로 |
US9490245B1 (en) * | 2015-06-19 | 2016-11-08 | Qualcomm Incorporated | Circuit and layout for a high density antenna protection diode |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3676742A (en) * | 1971-05-24 | 1972-07-11 | Signetics Corp | Means including a spark gap for protecting an integrated circuit from electrical discharge |
US3819952A (en) * | 1973-01-29 | 1974-06-25 | Mitsubishi Electric Corp | Semiconductor device |
US4066918A (en) * | 1976-09-30 | 1978-01-03 | Rca Corporation | Protection circuitry for insulated-gate field-effect transistor (IGFET) circuits |
JPS5369589A (en) * | 1976-12-03 | 1978-06-21 | Mitsubishi Electric Corp | Insulating gate type field effect transistor with protective device |
JPS5376679A (en) * | 1976-12-17 | 1978-07-07 | Nec Corp | Semiconductor device |
US4282556A (en) * | 1979-05-21 | 1981-08-04 | Rca Corporation | Input protection device for insulated gate field effect transistor |
JPS60120569A (ja) * | 1983-12-02 | 1985-06-28 | Toshiba Corp | 入力回路 |
JPS60136241A (ja) * | 1983-12-23 | 1985-07-19 | Toshiba Corp | ゲ−トアレイの入力回路 |
JPS60207383A (ja) * | 1984-03-31 | 1985-10-18 | Toshiba Corp | 半導体装置 |
JPS6150358A (ja) * | 1984-08-20 | 1986-03-12 | Toshiba Corp | 半導体集積回路 |
US4760433A (en) * | 1986-01-31 | 1988-07-26 | Harris Corporation | ESD protection transistors |
JPH0758734B2 (ja) * | 1987-02-23 | 1995-06-21 | 株式会社東芝 | 絶縁ゲ−ト型セミカスタム集積回路 |
-
1988
- 1988-01-11 JP JP63003612A patent/JPH07105446B2/ja not_active Expired - Lifetime
- 1988-12-28 US US07/291,476 patent/US4924339A/en not_active Expired - Lifetime
- 1988-12-30 EP EP88121907A patent/EP0324185B1/en not_active Expired - Lifetime
- 1988-12-30 DE DE88121907T patent/DE3885263T2/de not_active Expired - Fee Related
-
1989
- 1989-01-10 KR KR1019890000192A patent/KR910009355B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100256465B1 (ko) * | 1995-11-27 | 2000-05-15 | 다니구찌 이찌로오, 기타오카 다카시 | 반도체 장치의 입력 보호 회로 |
Also Published As
Publication number | Publication date |
---|---|
KR910009355B1 (ko) | 1991-11-12 |
JPH07105446B2 (ja) | 1995-11-13 |
EP0324185A3 (en) | 1990-09-26 |
DE3885263T2 (de) | 1994-02-24 |
JPH01181565A (ja) | 1989-07-19 |
DE3885263D1 (de) | 1993-12-02 |
EP0324185A2 (en) | 1989-07-19 |
EP0324185B1 (en) | 1993-10-27 |
US4924339A (en) | 1990-05-08 |
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