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KR102681934B1 - 절삭 장치 - Google Patents

절삭 장치 Download PDF

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Publication number
KR102681934B1
KR102681934B1 KR1020190045283A KR20190045283A KR102681934B1 KR 102681934 B1 KR102681934 B1 KR 102681934B1 KR 1020190045283 A KR1020190045283 A KR 1020190045283A KR 20190045283 A KR20190045283 A KR 20190045283A KR 102681934 B1 KR102681934 B1 KR 102681934B1
Authority
KR
South Korea
Prior art keywords
holding
cutting
jig
workpiece
cutting blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020190045283A
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English (en)
Korean (ko)
Other versions
KR20190132203A (ko
Inventor
요시히로 구스노키
Original Assignee
가부시기가이샤 디스코
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Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20190132203A publication Critical patent/KR20190132203A/ko
Application granted granted Critical
Publication of KR102681934B1 publication Critical patent/KR102681934B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/02—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage
    • B23D45/021—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage with the saw blade mounted on a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042—Devices for removing chips
    • B23Q11/0046—Devices for removing chips by sucking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0092—Grinding attachments for lathes or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/01—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor for combined grinding of surfaces of revolution and of adjacent plane surfaces on work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Confectionery (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
KR1020190045283A 2018-05-18 2019-04-18 절삭 장치 Active KR102681934B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-096174 2018-05-18
JP2018096174A JP7043346B2 (ja) 2018-05-18 2018-05-18 切削装置

Publications (2)

Publication Number Publication Date
KR20190132203A KR20190132203A (ko) 2019-11-27
KR102681934B1 true KR102681934B1 (ko) 2024-07-04

Family

ID=68585726

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190045283A Active KR102681934B1 (ko) 2018-05-18 2019-04-18 절삭 장치

Country Status (4)

Country Link
JP (1) JP7043346B2 (ja)
KR (1) KR102681934B1 (ja)
CN (1) CN110497270B (ja)
TW (1) TWI797333B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7361595B2 (ja) * 2019-12-19 2023-10-16 株式会社ディスコ 保持テーブル
CN113017241B (zh) * 2021-03-17 2023-08-25 安徽三和刷业股份有限公司 一种刷板自动分切打磨一体化装置
CN113909579A (zh) * 2021-11-04 2022-01-11 扬州市金马机电制造有限公司 一种具有工件固定结构的切割机

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19814805A1 (de) * 1998-04-02 1999-10-07 Bosch Gmbh Robert Beschichtungsverfahren eines Wischergummis
SG118084A1 (en) * 2001-08-24 2006-01-27 Micron Technology Inc Method and apparatus for cutting semiconductor wafers
JP5226394B2 (ja) * 2008-06-16 2013-07-03 株式会社ディスコ フランジの端面修正方法
JP5350908B2 (ja) * 2009-06-24 2013-11-27 株式会社ディスコ ドレスボード保持テーブルおよび切削装置
JP5340832B2 (ja) * 2009-07-02 2013-11-13 株式会社ディスコ マウントフランジの端面修正方法
JP5636213B2 (ja) * 2010-06-09 2014-12-03 株式会社ディスコ 切削加工装置
JP5285672B2 (ja) * 2010-09-07 2013-09-11 三菱重工業株式会社 歯車研削盤
JP2012096274A (ja) * 2010-11-04 2012-05-24 Disco Corp レーザー加工装置
JP5679887B2 (ja) * 2011-04-19 2015-03-04 株式会社ディスコ フランジの端面修正方法
JP2013198944A (ja) * 2012-03-23 2013-10-03 Toshiba Corp ダイシング装置及びダイシング方法
JP5996260B2 (ja) * 2012-05-09 2016-09-21 株式会社ディスコ 被加工物の分割方法
JP6087565B2 (ja) * 2012-10-03 2017-03-01 株式会社ディスコ 研削装置および研削方法
JP6525643B2 (ja) * 2015-03-04 2019-06-05 Ｔｏｗａ株式会社 製造装置及び製造方法
JP6527034B2 (ja) * 2015-06-29 2019-06-05 株式会社ディスコ 端面接触確認器具
JP6762651B2 (ja) * 2016-02-22 2020-09-30 株式会社ディスコ 加工方法
JP6748523B2 (ja) * 2016-08-31 2020-09-02 株式会社ディスコ 基板の分割方法
JP6832666B2 (ja) * 2016-09-30 2021-02-24 株式会社ディスコ 半導体パッケージの製造方法
JP6791581B2 (ja) * 2016-11-11 2020-11-25 株式会社ディスコ パッケージ基板切断用治具テーブル

Also Published As

Publication number Publication date
JP7043346B2 (ja) 2022-03-29
TWI797333B (zh) 2023-04-01
TW202003149A (zh) 2020-01-16
KR20190132203A (ko) 2019-11-27
CN110497270A (zh) 2019-11-26
CN110497270B (zh) 2023-04-25
JP2019198944A (ja) 2019-11-21

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