JP6527034B2 - 端面接触確認器具 - Google Patents
端面接触確認器具 Download PDFInfo
- Publication number
- JP6527034B2 JP6527034B2 JP2015130113A JP2015130113A JP6527034B2 JP 6527034 B2 JP6527034 B2 JP 6527034B2 JP 2015130113 A JP2015130113 A JP 2015130113A JP 2015130113 A JP2015130113 A JP 2015130113A JP 6527034 B2 JP6527034 B2 JP 6527034B2
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- JP
- Japan
- Prior art keywords
- conductive
- face
- flange
- contact
- grindstone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012937 correction Methods 0.000 claims description 37
- 238000012790 confirmation Methods 0.000 claims description 23
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/20—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
- B26D5/22—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member and work feed mechanically connected
- B26D5/24—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member and work feed mechanically connected including a metering device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
Description
本発明の実施形態に係る端面接触確認器具を図面に基づいて説明する。図1は、実施形態に係る端面接触確認器具が用いられる切削装置の構成を示す外観斜視図であり、図2は、実施形態に係る端面接触確認器具の概略の構成を示す斜視図であり、図3は、実施形態に係る端面接触確認器具の回路図である。
10 接続部材
30 配線
41 電源
43 接触時点灯ランプ(ランプ)
50 導通性フランジ端面修正治具
60 砥石
70 砥石支持部材
80 支持基台
115 導通性保持テーブル
121 切削ブレード
122 スピンドル
123 導通性マウントフランジ
125 端面
Claims (1)
- 回転可能に支持されたスピンドルの先端に固定され、導通性保持テーブルに保持された被加工物を切削する切削ブレードをマウントする導通性マウントフランジの端面を、砥石と砥石支持部材と支持基台とを有する導通性フランジ端面修正治具を用いて修正する際に用いる端面接触確認器具であって、
2つの接続部材と、電源と、スイッチと、駆動時点灯ランプと、接触時点灯ランプと、を備え、
該接続部材と、電源と、スイッチと、駆動時点灯ランプと、接触時点灯ランプと、は配線で接続されており、
一方の接続部材は、該導通性フランジ端面修正治具に接続され、他方の接続部材は該導通性マウントフランジに接続され、
該スイッチがオンになると該駆動時点灯ランプが点灯し、
該砥石が該導通性マウントフランジに接触すると該接触時点灯ランプが点灯し該砥石と該導通性マウントフランジの接触を知らせることを特徴とする端面接触確認器具。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015130113A JP6527034B2 (ja) | 2015-06-29 | 2015-06-29 | 端面接触確認器具 |
TW105114752A TWI712476B (zh) | 2015-06-29 | 2016-05-12 | 端面接觸確認器具 |
KR1020160072109A KR102387756B1 (ko) | 2015-06-29 | 2016-06-10 | 단부면 접촉 확인 기구 |
CN201610478630.9A CN106271936A (zh) | 2015-06-29 | 2016-06-27 | 端面接触确认器械 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015130113A JP6527034B2 (ja) | 2015-06-29 | 2015-06-29 | 端面接触確認器具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017013154A JP2017013154A (ja) | 2017-01-19 |
JP6527034B2 true JP6527034B2 (ja) | 2019-06-05 |
Family
ID=57651406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015130113A Active JP6527034B2 (ja) | 2015-06-29 | 2015-06-29 | 端面接触確認器具 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6527034B2 (ja) |
KR (1) | KR102387756B1 (ja) |
CN (1) | CN106271936A (ja) |
TW (1) | TWI712476B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7043346B2 (ja) * | 2018-05-18 | 2022-03-29 | 株式会社ディスコ | 切削装置 |
CN114346859A (zh) * | 2021-12-25 | 2022-04-15 | 广东海龙建筑科技有限公司 | 一种无机人造石上光机 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5715648A (en) * | 1980-06-23 | 1982-01-27 | Seiko Epson Corp | Determination of reference position between tool and work piece |
JP3472390B2 (ja) | 1995-06-09 | 2003-12-02 | 株式会社ディスコ | フランジ端面修正治具 |
US6481939B1 (en) * | 2001-08-24 | 2002-11-19 | Robb S. Gillespie | Tool tip conductivity contact sensor and method |
JP5139720B2 (ja) * | 2007-06-05 | 2013-02-06 | 株式会社ディスコ | 切削装置 |
PL2676767T3 (pl) * | 2008-12-19 | 2016-01-29 | Etp Trans Ab | System przytrzymywania narzędzia i sposób ustawiania pozycji osiowej narzędzia lub części narzędzia |
JP5341564B2 (ja) * | 2009-03-05 | 2013-11-13 | 株式会社ディスコ | 工具取り付けマウントの修正冶具 |
JP5340832B2 (ja) * | 2009-07-02 | 2013-11-13 | 株式会社ディスコ | マウントフランジの端面修正方法 |
CN201524940U (zh) * | 2009-11-12 | 2010-07-14 | 茂名职业技术学院 | 机械加工对刀装置 |
JP5549010B2 (ja) * | 2010-03-30 | 2014-07-16 | 独立行政法人理化学研究所 | 加工装置、及び当該装置の駆動方法 |
JP5613439B2 (ja) * | 2010-04-15 | 2014-10-22 | 株式会社ディスコ | 切削装置 |
JP5690646B2 (ja) * | 2011-04-28 | 2015-03-25 | 株式会社ディスコ | 電極ユニット |
-
2015
- 2015-06-29 JP JP2015130113A patent/JP6527034B2/ja active Active
-
2016
- 2016-05-12 TW TW105114752A patent/TWI712476B/zh active
- 2016-06-10 KR KR1020160072109A patent/KR102387756B1/ko active IP Right Grant
- 2016-06-27 CN CN201610478630.9A patent/CN106271936A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2017013154A (ja) | 2017-01-19 |
TW201720605A (zh) | 2017-06-16 |
TWI712476B (zh) | 2020-12-11 |
KR102387756B1 (ko) | 2022-04-19 |
CN106271936A (zh) | 2017-01-04 |
KR20170002292A (ko) | 2017-01-06 |
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