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KR102387756B1 - 단부면 접촉 확인 기구 - Google Patents

단부면 접촉 확인 기구 Download PDF

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Publication number
KR102387756B1
KR102387756B1 KR1020160072109A KR20160072109A KR102387756B1 KR 102387756 B1 KR102387756 B1 KR 102387756B1 KR 1020160072109 A KR1020160072109 A KR 1020160072109A KR 20160072109 A KR20160072109 A KR 20160072109A KR 102387756 B1 KR102387756 B1 KR 102387756B1
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KR
South Korea
Prior art keywords
grindstone
flange
end surface
continuity
conductive
Prior art date
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Active
Application number
KR1020160072109A
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English (en)
Korean (ko)
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KR20170002292A (ko
Inventor
주삼 차
Original Assignee
가부시기가이샤 디스코
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Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20170002292A publication Critical patent/KR20170002292A/ko
Application granted granted Critical
Publication of KR102387756B1 publication Critical patent/KR102387756B1/ko
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/20—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
    • B26D5/22—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member and work feed mechanically connected
    • B26D5/24—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member and work feed mechanically connected including a metering device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
KR1020160072109A 2015-06-29 2016-06-10 단부면 접촉 확인 기구 Active KR102387756B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-130113 2015-06-29
JP2015130113A JP6527034B2 (ja) 2015-06-29 2015-06-29 端面接触確認器具

Publications (2)

Publication Number Publication Date
KR20170002292A KR20170002292A (ko) 2017-01-06
KR102387756B1 true KR102387756B1 (ko) 2022-04-19

Family

ID=57651406

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160072109A Active KR102387756B1 (ko) 2015-06-29 2016-06-10 단부면 접촉 확인 기구

Country Status (4)

Country Link
JP (1) JP6527034B2 (ja)
KR (1) KR102387756B1 (ja)
CN (1) CN106271936A (ja)
TW (1) TWI712476B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7043346B2 (ja) * 2018-05-18 2022-03-29 株式会社ディスコ 切削装置
CN114346859A (zh) * 2021-12-25 2022-04-15 广东海龙建筑科技有限公司 一种无机人造石上光机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3472390B2 (ja) 1995-06-09 2003-12-02 株式会社ディスコ フランジ端面修正治具
JP2011011299A (ja) 2009-07-02 2011-01-20 Disco Abrasive Syst Ltd マウントフランジの端面修正方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5715648A (en) * 1980-06-23 1982-01-27 Seiko Epson Corp Determination of reference position between tool and work piece
US6481939B1 (en) * 2001-08-24 2002-11-19 Robb S. Gillespie Tool tip conductivity contact sensor and method
JP5139720B2 (ja) * 2007-06-05 2013-02-06 株式会社ディスコ 切削装置
PL2676767T3 (pl) * 2008-12-19 2016-01-29 Etp Trans Ab System przytrzymywania narzędzia i sposób ustawiania pozycji osiowej narzędzia lub części narzędzia
JP5341564B2 (ja) * 2009-03-05 2013-11-13 株式会社ディスコ 工具取り付けマウントの修正冶具
CN201524940U (zh) * 2009-11-12 2010-07-14 茂名职业技术学院 机械加工对刀装置
JP5549010B2 (ja) * 2010-03-30 2014-07-16 独立行政法人理化学研究所 加工装置、及び当該装置の駆動方法
JP5613439B2 (ja) * 2010-04-15 2014-10-22 株式会社ディスコ 切削装置
JP5690646B2 (ja) * 2011-04-28 2015-03-25 株式会社ディスコ 電極ユニット

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3472390B2 (ja) 1995-06-09 2003-12-02 株式会社ディスコ フランジ端面修正治具
JP2011011299A (ja) 2009-07-02 2011-01-20 Disco Abrasive Syst Ltd マウントフランジの端面修正方法

Also Published As

Publication number Publication date
TWI712476B (zh) 2020-12-11
JP2017013154A (ja) 2017-01-19
TW201720605A (zh) 2017-06-16
JP6527034B2 (ja) 2019-06-05
CN106271936A (zh) 2017-01-04
KR20170002292A (ko) 2017-01-06

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