KR101750092B1 - 파워전환 장치 및 파워전환 조립체 - Google Patents
파워전환 장치 및 파워전환 조립체 Download PDFInfo
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- KR101750092B1 KR101750092B1 KR1020160125563A KR20160125563A KR101750092B1 KR 101750092 B1 KR101750092 B1 KR 101750092B1 KR 1020160125563 A KR1020160125563 A KR 1020160125563A KR 20160125563 A KR20160125563 A KR 20160125563A KR 101750092 B1 KR101750092 B1 KR 101750092B1
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- 238000006243 chemical reaction Methods 0.000 title description 8
- 238000009413 insulation Methods 0.000 claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 39
- 230000005855 radiation Effects 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 7
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 description 11
- 239000002184 metal Substances 0.000 description 8
- 238000002955 isolation Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000006854 communication Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007175 bidirectional communication Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
- H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
- H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
- H05K7/142—Spacers not being card guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20181—Filters; Louvers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20863—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Dc-Dc Converters (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Rectifiers (AREA)
- Inverter Devices (AREA)
Abstract
Description
도 1a는 본 발명의 일 구현예에 따른 파워전환 장치에 의해 사용된 절연 스트럿의 사시도이다.
도 1b는 본 발명의 일 구현예에 따른 파워전환 장치에 의해 사용된 절연 스트럿의 분해된 횡단면도이다.
도 2는 본 발명의 일 구현예에 따른 파워전환 장치의 분해도이다.
도 3은 본 발명의 다른 구현예에 따른 파워전환 장치의 분해도이다.
도 4는 본 발명의 또 다른 일 구현예에 따른 파워전환 장치의 분해도이다.
도 5는 도 4의 죔고정부재 및 전자 부품의 사시도이다.
도 6은 도 5의 개략적 분해 횡단면도이다.
도 7은 본 발명의 또 다른 구현예에 따른 파워전환 장치의 인쇄배선기판 조립체의 사시도이다.
도 8은 본 발명의 일 구현예에 따른 파워전환 장치의 인쇄배선기판 조립체의 분해도이다.
도 9는 본 발명의 또 다른 구현예에 따른 파워전환 장치의 인쇄배선기판 조립체의 분해도이다.
110, 472, 494, 592 : 제1 연결부
120, 474, 492, 594 : 제2 연결부
124 : 나사부
130, 476 : 플라스틱부
200, 300 : 파워전환 장치
210, 210', 310 : 방열 베이스(heat-dissipating base)
214 : 케이스
216 : 나사공
218, 325 : 핀 피트(fin feet)
220, 320, 400, 500 : 인쇄배선기판 조립체
222, 322, 410, 510 ; 인쇄회로기판
223, 323, 327, 412, 512 : 관통공(through hole)
224, 324 : 전자 부품
330, 450, 550 : 죔고정 부재
350, 480 , 580 : 방열 부재
420, 520 : 제1 전자 부품
430, 530 : 제2 전자 부품
440, 540 : 제한부재(restricting member)
442, 542 : 본체(body)
444, 544 : 개구(opening)
446, 546 : 배플(baffle)
548 : 결합부분(coupling portion)
Claims (10)
- 인쇄회로기판;
상기 인쇄회로기판 상에 배치된 다수의 제1 전자 부품;
상기 인쇄회로기판 상에 배치된 다수의 제2 전자 부품;
방열 부재를 포함하는 접지 부재;
상기 방열 부재에 고정된 죔고정 부재;
다수의 절연 스트럿; 및
본체와, 상기 본체에 배치된 개구 및 상기 개구의 단부 상에 배치되는 다수의 배플을 구비한 제한부재;를 포함하고,
상기 제2 전자 부품은 상기 방열 부재와 상기 죔고정 부재 사이에 죔고정되며, 상기 인쇄회로기판 상에 수직으로 배치되고,
상기 방열 부재는 다수의 고정 부분을 포함하며, 상기 절연 스트럿 중 일부가 상기 인쇄회로기판을 상기 고정부분에 고정하고,
상기 제1 전자 부품은 상기 개구에 배치되고, 상기 배플 중의 각각의 두 개는 서로 마주하고, 상기 본체로부터 거리를 둔 상기 배플의 선단들은 상기 개구의 중심을 향하여 기울어지는 것인 인쇄배선기판 조립체. - 제1항에 있어서,
상기 제1 전자 부품이 커패시터인 것을 특징으로 하는 인쇄배선기판 조립체. - 삭제
- 인쇄회로기판;
상기 인쇄회로기판 상에 배치된 다수의 제1 전자 부품;
본체와, 상기 본체에 배치된 개구 및 상기 개구의 단부 상에 배치되는 다수의 배플을 구비한 제한 부재;
상기 인쇄회로기판에 고정되며 상기 제한 부재로부터 전기적으로 절연된 방열 부재;
상기 인쇄회로기판 상에 배치된 다수의 제2 전자 부품;
상기 방열 부재에 고정된 죔고정 부재; 및
다수의 절연 스트럿;을 포함하고,
상기 제1 전자 부품은 상기 개구에 배치되고, 상기 배플 중의 각각의 두 개는 서로 마주하고, 상기 본체로부터 거리를 둔 상기 배플의 선단들은 상기 개구의 중심을 향하여 기울어지고,
상기 제2 전자 부품은 상기 방열 부재와 상기 죔고정 부재 사이에 죔고정되며, 상기 인쇄회로기판 상에 수직으로 배치되고,
상기 방열 부재는 다수의 고정 부분을 포함하며, 상기 절연 스트럿 중 일부가 상기 인쇄회로기판을 상기 고정부분에 고정하는 것인 파워전환 장치. - 제4항에 있어서,
상기 제1 전자 부품이 커패시터이고, 상기 제2 전자 부품이 파워장치인 것을 특징으로 하는 파워전환 장치. - 제4항에 있어서,
상기 절연 스트럿 중 일부가 상기 제한 부재와 상기 방열 부재를 물리적으로 연결하고 전기적으로 절연시키는 것을 특징으로 하는 파워전환 장치. - 제4항에 있어서,
방열 베이스를 추가로 포함하며,
상기 방열 부재가 상기 방열 베이스와 접촉하고,
상기 절연 스트럿 중 일부가 상기 인쇄회로기판과 상기 방열 베이스를 물리적으로 연결하며 전기적으로 절연시키는 것을 특징으로 하는 파워전환 장치. - 제4항에 있어서,
각각의 상기 절연 스트럿은 제1 연결부, 제2 연결부, 및 상기 제1 연결부와 상기 제2 연결부를 부분적으로 덮는 플라스틱부를 포함하는 것을 특징으로 하는 파워전환 장치. - 제4항에 있어서,
상기 제한 부재가 상기 본체 상에 수직으로 배치된 다수의 결합부분을 추가로 포함하며, 상기 방열 부재가 상기 결합부분에 대응하는 다수의 결합공을 포함하고, 상기 결합부분이 상기 결합공에 결합되는 것을 특징으로 하는 파워전환 장치. - 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201310612986.3 | 2013-11-26 | ||
CN201310612986.3A CN104682670B (zh) | 2013-11-26 | 2013-11-26 | 电源转换装置与其电源转换板组件 |
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KR1020140160150A Division KR20150060539A (ko) | 2013-11-26 | 2014-11-17 | 파워전환 장치 및 파워전환 조립체 |
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KR20160115907A KR20160115907A (ko) | 2016-10-06 |
KR101750092B1 true KR101750092B1 (ko) | 2017-06-21 |
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KR1020140160150A Ceased KR20150060539A (ko) | 2013-11-26 | 2014-11-17 | 파워전환 장치 및 파워전환 조립체 |
KR1020160125563A Active KR101750092B1 (ko) | 2013-11-26 | 2016-09-29 | 파워전환 장치 및 파워전환 조립체 |
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Country Status (6)
Country | Link |
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US (1) | US9414480B2 (ko) |
EP (1) | EP2876985B1 (ko) |
JP (3) | JP2015103801A (ko) |
KR (2) | KR20150060539A (ko) |
CN (2) | CN107591998A (ko) |
TW (1) | TWI562707B (ko) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
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US10772186B2 (en) * | 2015-01-29 | 2020-09-08 | Hewlett-Packard Development Company, L.P. | Printed circuit board component cover |
CN106655806B (zh) * | 2015-10-29 | 2019-02-26 | 台达电子企业管理(上海)有限公司 | 电源转换装置 |
CN106655807B (zh) * | 2015-10-29 | 2019-02-26 | 台达电子企业管理(上海)有限公司 | 电源转换装置 |
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JP2016208055A (ja) | 2016-12-08 |
TWI562707B (en) | 2016-12-11 |
CN104682670B (zh) | 2017-12-12 |
EP2876985B1 (en) | 2018-08-15 |
JP6390679B2 (ja) | 2018-09-19 |
TW201521549A (zh) | 2015-06-01 |
KR20150060539A (ko) | 2015-06-03 |
JP6315299B2 (ja) | 2018-04-25 |
EP2876985A3 (en) | 2015-12-09 |
CN104682670A (zh) | 2015-06-03 |
JP2015103801A (ja) | 2015-06-04 |
US20150146375A1 (en) | 2015-05-28 |
EP2876985A2 (en) | 2015-05-27 |
KR20160115907A (ko) | 2016-10-06 |
US9414480B2 (en) | 2016-08-09 |
JP2017130673A (ja) | 2017-07-27 |
CN107591998A (zh) | 2018-01-16 |
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