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KR100766205B1 - 피복 도전성 입자, 이방성 도전 재료 및 도전 접속 구조체 - Google Patents

피복 도전성 입자, 이방성 도전 재료 및 도전 접속 구조체 Download PDF

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Publication number
KR100766205B1
KR100766205B1 KR1020067000325A KR20067000325A KR100766205B1 KR 100766205 B1 KR100766205 B1 KR 100766205B1 KR 1020067000325 A KR1020067000325 A KR 1020067000325A KR 20067000325 A KR20067000325 A KR 20067000325A KR 100766205 B1 KR100766205 B1 KR 100766205B1
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KR
South Korea
Prior art keywords
particle
particles
insulating
conductive
metal
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KR1020067000325A
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English (en)
Korean (ko)
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KR20060052782A (ko
Inventor
다께시 와끼야
신야 우에노야마
아끼히꼬 다떼노
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20060052782A publication Critical patent/KR20060052782A/ko
Application granted granted Critical
Publication of KR100766205B1 publication Critical patent/KR100766205B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/62—Insulating-layers or insulating-films on metal bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/64—Insulating bodies with conductive admixtures, inserts or layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
KR1020067000325A 2003-07-07 2004-06-25 피복 도전성 입자, 이방성 도전 재료 및 도전 접속 구조체 KR100766205B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00271540 2003-07-07
JP2003271540 2003-07-07
JP2003413653A JP4387175B2 (ja) 2003-07-07 2003-12-11 被覆導電性粒子、異方性導電材料及び導電接続構造体
JPJP-P-2003-00413653 2003-12-11

Publications (2)

Publication Number Publication Date
KR20060052782A KR20060052782A (ko) 2006-05-19
KR100766205B1 true KR100766205B1 (ko) 2007-10-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067000325A KR100766205B1 (ko) 2003-07-07 2004-06-25 피복 도전성 입자, 이방성 도전 재료 및 도전 접속 구조체

Country Status (4)

Country Link
JP (1) JP4387175B2 (ja)
KR (1) KR100766205B1 (ja)
TW (1) TWI293764B (ja)
WO (1) WO2005004172A1 (ja)

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JP4532321B2 (ja) * 2005-03-30 2010-08-25 株式会社日立製作所 導電パターン形成装置
JP4936678B2 (ja) * 2005-04-21 2012-05-23 積水化学工業株式会社 導電性粒子及び異方性導電材料
JP2006331714A (ja) * 2005-05-24 2006-12-07 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP4589810B2 (ja) * 2005-06-07 2010-12-01 積水化学工業株式会社 導電性微粒子及び異方性導電材料
JP2006351464A (ja) * 2005-06-20 2006-12-28 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法及び異方性導電材料
JP4950451B2 (ja) * 2005-07-29 2012-06-13 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、接続構造体
JP2007035574A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
KR100719807B1 (ko) 2005-12-30 2007-05-18 제일모직주식회사 절연 도전성 미립자 및 이를 이용한 이방 도전성 필름
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KR20080106308A (ko) * 2006-02-27 2008-12-04 히다치 가세고교 가부시끼가이샤 회로 접속 재료, 이것을 이용한 회로 부재의 접속 구조 및 그의 제조 방법
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JP5151920B2 (ja) * 2008-02-05 2013-02-27 日立化成工業株式会社 導電粒子及び導電粒子の製造方法
JP5626288B2 (ja) * 2008-02-05 2014-11-19 日立化成株式会社 導電粒子、異方導電性接着剤、接続構造体、及び接続構造体の製造方法
JP5395482B2 (ja) * 2008-03-25 2014-01-22 積水化学工業株式会社 被覆導電性微粒子、異方性導電材料、及び、導電接続構造体
CN102047347B (zh) * 2008-07-01 2012-11-28 日立化成工业株式会社 电路连接材料和电路连接结构体
JP5368760B2 (ja) * 2008-09-29 2013-12-18 積水化学工業株式会社 絶縁被覆導電性粒子、異方性導電材料及び接続構造体
JP4758470B2 (ja) * 2008-12-18 2011-08-31 シャープ株式会社 突起電極の形成方法及び置換金めっき液
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JP5554077B2 (ja) * 2009-09-15 2014-07-23 株式会社日本触媒 絶縁性微粒子被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体
JP5534891B2 (ja) * 2010-03-26 2014-07-02 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体
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JP2003026813A (ja) * 2001-07-13 2003-01-29 Nippon Shokubai Co Ltd 異方導電性材料

Also Published As

Publication number Publication date
TW200506971A (en) 2005-02-16
KR20060052782A (ko) 2006-05-19
TWI293764B (en) 2008-02-21
JP2005044773A (ja) 2005-02-17
JP4387175B2 (ja) 2009-12-16
WO2005004172A1 (ja) 2005-01-13

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