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WO2009054386A1 - 被覆導電性粉体およびそれを用いた導電性接着剤 - Google Patents

被覆導電性粉体およびそれを用いた導電性接着剤 Download PDF

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Publication number
WO2009054386A1
WO2009054386A1 PCT/JP2008/069067 JP2008069067W WO2009054386A1 WO 2009054386 A1 WO2009054386 A1 WO 2009054386A1 JP 2008069067 W JP2008069067 W JP 2008069067W WO 2009054386 A1 WO2009054386 A1 WO 2009054386A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
particles
conductive powder
inorganic fine
coated
Prior art date
Application number
PCT/JP2008/069067
Other languages
English (en)
French (fr)
Inventor
Shinji Abe
Original Assignee
Nippon Chemical Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemical Industrial Co., Ltd. filed Critical Nippon Chemical Industrial Co., Ltd.
Priority to JP2009538218A priority Critical patent/JP5425636B2/ja
Priority to EP08841309.1A priority patent/EP2211354B1/en
Priority to KR1020107008683A priority patent/KR101505227B1/ko
Priority to CN200880112801XA priority patent/CN101836265B/zh
Priority to US12/738,017 priority patent/US8262940B2/en
Publication of WO2009054386A1 publication Critical patent/WO2009054386A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/017—Antistatic agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

　本発明は、導電性粒子同士の凝集が抑制され、電気信頼性にも優れた被覆導電性粉体およびそれを用いた微細化するＩＣチップ等の電子部品や回路基板の電極接続に対しても電気信頼性の高い接続ができる導電性接着剤を提供することにある。 　本発明の被覆導電性粉体は、導電性粒子の表面を絶縁性無機質微粒子で被覆処理した被覆導電性粉体であって、該被覆導電性粉体の体積固有抵抗値が１Ω・ｃｍ以下で、前記絶縁性無機質微粒子の比重が５．０ｇ／ｍｌ以下で、前記導電性粒子との粒径比（絶縁性無機質微粒子／導電性粒子）が１／１００以下であり、前記絶縁性無機質微粒子は導電性粒子の表面に付着していることを特徴とする。
PCT/JP2008/069067 2007-10-22 2008-10-21 被覆導電性粉体およびそれを用いた導電性接着剤 WO2009054386A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009538218A JP5425636B2 (ja) 2007-10-22 2008-10-21 被覆導電性粉体およびそれを用いた導電性接着剤
EP08841309.1A EP2211354B1 (en) 2007-10-22 2008-10-21 Coated conductive powder and conductive adhesive using the same
KR1020107008683A KR101505227B1 (ko) 2007-10-22 2008-10-21 피복 도전성 분체 및 그것을 이용한 도전성 접착제
CN200880112801XA CN101836265B (zh) 2007-10-22 2008-10-21 包覆导电性粉体和使用该粉体的导电性粘合剂
US12/738,017 US8262940B2 (en) 2007-10-22 2008-10-21 Coated conductive powder and conductive adhesive using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-273550 2007-10-22
JP2007273550 2007-10-22

Publications (1)

Publication Number Publication Date
WO2009054386A1 true WO2009054386A1 (ja) 2009-04-30

Family

ID=40579490

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069067 WO2009054386A1 (ja) 2007-10-22 2008-10-21 被覆導電性粉体およびそれを用いた導電性接着剤

Country Status (7)

Country Link
US (1) US8262940B2 (ja)
EP (1) EP2211354B1 (ja)
JP (1) JP5425636B2 (ja)
KR (1) KR101505227B1 (ja)
CN (1) CN101836265B (ja)
TW (1) TWI463505B (ja)
WO (1) WO2009054386A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011002065A1 (ja) * 2009-07-01 2011-01-06 日立化成工業株式会社 被覆導電粒子及びその製造方法
WO2011110163A1 (de) * 2010-03-11 2011-09-15 Bundesdruckerei Gmbh Sicherheits- und/oder wertdokument mit einem schaltkreis
CN102576798A (zh) * 2009-10-16 2012-07-11 索尼化学&信息部件株式会社 光反射性导电颗粒、各向异性导电粘合剂和发光装置
WO2013027575A1 (ja) * 2011-08-23 2013-02-28 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体
JP2015133301A (ja) * 2014-01-15 2015-07-23 日本化学工業株式会社 被覆導電性粉体、被覆導電性粉体の製造方法、被覆導電性粉体を含む導電性接着剤及び接着構造体
JP2016023248A (ja) * 2014-07-22 2016-02-08 Dic株式会社 熱可塑性樹脂組成物、その製造方法および成形体
JP2016541098A (ja) * 2013-11-15 2016-12-28 スリーエム イノベイティブ プロパティズ カンパニー 成形粒子を含有する導電性物品及びその作製方法
JP2017228533A (ja) * 2017-07-20 2017-12-28 日本化学工業株式会社 被覆導電性粉体、被覆導電性粉体の製造方法、被覆導電性粉体を含む導電性接着剤及び接着構造体
JP2018060799A (ja) * 2017-11-07 2018-04-12 日本化学工業株式会社 被覆導電性粉体、被覆導電性粉体の製造方法、被覆導電性粉体を含む導電性接着剤及び接着構造体
JP2018145418A (ja) * 2017-03-06 2018-09-20 デクセリアルズ株式会社 樹脂組成物、樹脂組成物の製造方法、及び構造体
WO2025047575A1 (ja) * 2023-08-25 2025-03-06 積水化学工業株式会社 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

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KR101054745B1 (ko) * 2009-04-21 2011-08-05 주식회사 엘지화학 안전성 향상을 위한 전기화학 소자 첨가제
JP5512306B2 (ja) * 2010-01-29 2014-06-04 日本化学工業株式会社 導電性粒子の製造方法
KR101899185B1 (ko) * 2011-05-18 2018-09-14 히타치가세이가부시끼가이샤 회로 접속 재료, 회로 부재의 접속 구조 및 회로 부재의 접속 구조의 제조 방법
KR101375298B1 (ko) * 2011-12-20 2014-03-19 제일모직주식회사 전도성 미립자 및 이를 포함하는 이방 전도성 필름
GB2504957A (en) * 2012-08-14 2014-02-19 Henkel Ag & Co Kgaa Curable compositions comprising composite particles
CN103730192A (zh) * 2012-10-16 2014-04-16 鸿富锦精密工业（深圳）有限公司 各向异性导电膜及其制备方法
CN105290388B (zh) * 2014-07-04 2020-04-07 通用电气公司 粉末处理方法和相应处理过的粉末
CN109983544A (zh) * 2017-03-23 2019-07-05 积水化学工业株式会社 导电性粒子、导电材料以及连接结构体
KR101976703B1 (ko) * 2017-08-31 2019-05-09 주식회사 아이에스시 검사용 소켓 및 도전성 입자
CN115841892B (zh) * 2023-02-20 2023-04-25 江阴市浩盛电器线缆制造有限公司 一种耐高温硅胶电缆线及其生产工艺

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Publication number Priority date Publication date Assignee Title
JPS6059070A (ja) 1983-09-12 1985-04-05 Nippon Chem Ind Co Ltd:The 粉粒体メツキ品の製造法
JPS6164882A (ja) 1984-09-05 1986-04-03 Nippon Chem Ind Co Ltd:The めつき材料の製造方法
JPS6230885A (ja) 1985-04-01 1987-02-09 Nippon Chem Ind Co Ltd:The ニツケルめつき材料の製造法
JPH01116083A (ja) 1987-10-29 1989-05-09 Nippon Chem Ind Co Ltd 改質無電解めっき被覆粉体
JPH01242782A (ja) 1988-03-24 1989-09-27 Nippon Chem Ind Co Ltd 無電解めっき粉末並びに導電性フィラーおよびその製造方法
JPH0215176A (ja) 1988-07-04 1990-01-18 Nippon Chem Ind Co Ltd 磁性無電解めっき粉体の製造方法
JPH03112011A (ja) * 1989-09-26 1991-05-13 Catalysts & Chem Ind Co Ltd 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
JPH04259766A (ja) * 1991-02-14 1992-09-16 Hitachi Chem Co Ltd 回路の接続部材
JPH0570750A (ja) 1991-09-10 1993-03-23 Fujitsu Ltd 導電性接着剤
JPH05217617A (ja) 1992-02-04 1993-08-27 Hitachi Chem Co Ltd 異方導電性樹脂フィルム状接着剤
JPH07118617A (ja) 1993-10-22 1995-05-09 Three Bond Co Ltd ファインピッチ用異方導電性接着剤
JPH08176836A (ja) 1994-12-26 1996-07-09 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体
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JP2017228533A (ja) * 2017-07-20 2017-12-28 日本化学工業株式会社 被覆導電性粉体、被覆導電性粉体の製造方法、被覆導電性粉体を含む導電性接着剤及び接着構造体
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WO2025047575A1 (ja) * 2023-08-25 2025-03-06 積水化学工業株式会社 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

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