EP0804722A4 - Systeme d'inspection de surfaces - Google Patents
Systeme d'inspection de surfacesInfo
- Publication number
- EP0804722A4 EP0804722A4 EP95943798A EP95943798A EP0804722A4 EP 0804722 A4 EP0804722 A4 EP 0804722A4 EP 95943798 A EP95943798 A EP 95943798A EP 95943798 A EP95943798 A EP 95943798A EP 0804722 A4 EP0804722 A4 EP 0804722A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- anomalies
- inspection system
- repeating patterns
- surface inspection
- adjacent repeating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95623—Inspecting patterns on the surface of objects using a spatial filtering method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8822—Dark field detection
- G01N2021/8825—Separate detection of dark field and bright field
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Analysis (AREA)
- Image Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Image Input (AREA)
Abstract
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US35166494A | 1994-12-08 | 1994-12-08 | |
US351664 | 1994-12-08 | ||
US361131 | 1994-12-21 | ||
US08/361,131 US5530550A (en) | 1994-12-21 | 1994-12-21 | Optical wafer positioning system |
US08/499,995 US5883710A (en) | 1994-12-08 | 1995-07-10 | Scanning system for inspecting anomalies on surfaces |
US499995 | 1995-07-10 | ||
US536862 | 1995-09-29 | ||
US08/536,862 US5864394A (en) | 1994-06-20 | 1995-09-29 | Surface inspection system |
PCT/US1995/016278 WO1996018094A1 (fr) | 1994-12-08 | 1995-12-08 | Systeme d'inspection de surfaces |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0804722A1 EP0804722A1 (fr) | 1997-11-05 |
EP0804722A4 true EP0804722A4 (fr) | 1999-03-24 |
EP0804722B1 EP0804722B1 (fr) | 2010-11-10 |
Family
ID=27502820
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95943798A Expired - Lifetime EP0804722B1 (fr) | 1994-12-08 | 1995-12-08 | Systeme d'inspection de surfaces |
EP07001285A Withdrawn EP1777511A3 (fr) | 1994-12-08 | 1995-12-08 | Dispositif de scannage permettant d'inspecter des anomalies de surfaces |
EP95943768A Expired - Lifetime EP0797763B1 (fr) | 1994-12-08 | 1995-12-08 | Dispositif de scannage permettant d'inspecter des anomalies de surfaces |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07001285A Withdrawn EP1777511A3 (fr) | 1994-12-08 | 1995-12-08 | Dispositif de scannage permettant d'inspecter des anomalies de surfaces |
EP95943768A Expired - Lifetime EP0797763B1 (fr) | 1994-12-08 | 1995-12-08 | Dispositif de scannage permettant d'inspecter des anomalies de surfaces |
Country Status (5)
Country | Link |
---|---|
US (1) | US5864394A (fr) |
EP (3) | EP0804722B1 (fr) |
JP (4) | JP3874421B2 (fr) |
KR (4) | KR100481118B1 (fr) |
WO (2) | WO1996018093A1 (fr) |
Families Citing this family (174)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6118525A (en) | 1995-03-06 | 2000-09-12 | Ade Optical Systems Corporation | Wafer inspection system for distinguishing pits and particles |
EP0979398B1 (fr) * | 1996-06-04 | 2012-01-04 | KLA-Tencor Corporation | Systeme de balayage optique pour l'examen d'une surface |
US6076465A (en) * | 1996-09-20 | 2000-06-20 | Kla-Tencor Corporation | System and method for determining reticle defect printability |
US6608676B1 (en) * | 1997-08-01 | 2003-08-19 | Kla-Tencor Corporation | System for detecting anomalies and/or features of a surface |
US5905572A (en) * | 1997-08-21 | 1999-05-18 | Li; Ming-Chiang | Sample inspection using interference and/or correlation of scattered superbroad radiation |
US6909500B2 (en) * | 2001-03-26 | 2005-06-21 | Candela Instruments | Method of detecting and classifying scratches, particles and pits on thin film disks or wafers |
US7714995B2 (en) | 1997-09-22 | 2010-05-11 | Kla-Tencor Corporation | Material independent profiler |
US6031615A (en) | 1997-09-22 | 2000-02-29 | Candela Instruments | System and method for simultaneously measuring lubricant thickness and degradation, thin film thickness and wear, and surface roughness |
US6897957B2 (en) | 2001-03-26 | 2005-05-24 | Candela Instruments | Material independent optical profilometer |
US7688435B2 (en) * | 1997-09-22 | 2010-03-30 | Kla-Tencor Corporation | Detecting and classifying surface features or defects by controlling the angle of the illumination plane of incidence with respect to the feature or defect |
US7123357B2 (en) * | 1997-09-22 | 2006-10-17 | Candela Instruments | Method of detecting and classifying scratches and particles on thin film disks or wafers |
US6665078B1 (en) * | 1997-09-22 | 2003-12-16 | Candela Instruments | System and method for simultaneously measuring thin film layer thickness, reflectivity, roughness, surface profile and magnetic pattern in thin film magnetic disks and silicon wafers |
US6930765B2 (en) * | 2001-03-26 | 2005-08-16 | Kla-Tencor Technologies | Multiple spot size optical profilometer, ellipsometer, reflectometer and scatterometer |
US7630086B2 (en) * | 1997-09-22 | 2009-12-08 | Kla-Tencor Corporation | Surface finish roughness measurement |
US6757056B1 (en) * | 2001-03-26 | 2004-06-29 | Candela Instruments | Combined high speed optical profilometer and ellipsometer |
US6477265B1 (en) * | 1998-12-07 | 2002-11-05 | Taiwan Semiconductor Manufacturing Company | System to position defect location on production wafers |
US6272018B1 (en) | 1999-02-11 | 2001-08-07 | Original Solutions Inc. | Method for the verification of the polarity and presence of components on a printed circuit board |
US6529270B1 (en) * | 1999-03-31 | 2003-03-04 | Ade Optical Systems Corporation | Apparatus and method for detecting defects in the surface of a workpiece |
US6587193B1 (en) * | 1999-05-11 | 2003-07-01 | Applied Materials, Inc. | Inspection systems performing two-dimensional imaging with line light spot |
WO2000070332A1 (fr) * | 1999-05-18 | 2000-11-23 | Applied Materials, Inc. | Procede et dispositif d'inspection d'articles par comparaison avec un original |
US6275770B1 (en) * | 1999-05-27 | 2001-08-14 | Ipec Precision Inc. | Method to remove station-induced error pattern from measured object characteristics and compensate the measured object characteristics with the error |
US7061601B2 (en) * | 1999-07-02 | 2006-06-13 | Kla-Tencor Technologies Corporation | System and method for double sided optical inspection of thin film disks or wafers |
US6441908B1 (en) | 1999-08-06 | 2002-08-27 | Metron Systems, Inc. | Profiling of a component having reduced sensitivity to anomalous off-axis reflections |
US6853446B1 (en) | 1999-08-16 | 2005-02-08 | Applied Materials, Inc. | Variable angle illumination wafer inspection system |
US7012684B1 (en) | 1999-09-07 | 2006-03-14 | Applied Materials, Inc. | Method and apparatus to provide for automated process verification and hierarchical substrate examination |
US6693708B1 (en) | 1999-09-07 | 2004-02-17 | Applied Materials, Inc. | Method and apparatus for substrate surface inspection using spectral profiling techniques |
US6813032B1 (en) | 1999-09-07 | 2004-11-02 | Applied Materials, Inc. | Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques |
US6630995B1 (en) | 1999-09-07 | 2003-10-07 | Applied Materials, Inc. | Method and apparatus for embedded substrate and system status monitoring |
US6882416B1 (en) * | 1999-09-07 | 2005-04-19 | Applied Materials, Inc. | Methods for continuous embedded process monitoring and optical inspection of substrates using specular signature analysis |
US6707544B1 (en) | 1999-09-07 | 2004-03-16 | Applied Materials, Inc. | Particle detection and embedded vision system to enhance substrate yield and throughput |
US6707545B1 (en) | 1999-09-07 | 2004-03-16 | Applied Materials, Inc. | Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems |
US6721045B1 (en) | 1999-09-07 | 2004-04-13 | Applied Materials, Inc. | Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques |
US6496256B1 (en) * | 1999-10-01 | 2002-12-17 | Applied Materials, Inc. | Inspection systems using sensor array and double threshold arrangement |
US6369888B1 (en) * | 1999-11-17 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for article inspection including speckle reduction |
JP2001168159A (ja) | 1999-12-03 | 2001-06-22 | Sony Corp | 検査装置及び検査方法 |
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JP4556302B2 (ja) | 2000-07-27 | 2010-10-06 | ソニー株式会社 | 薄膜トランジスタ製造システム及び方法、ポリシリコン評価方法及びポリシリコン検査装置 |
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Also Published As
Publication number | Publication date |
---|---|
WO1996018093A1 (fr) | 1996-06-13 |
KR100481118B1 (ko) | 2005-09-07 |
KR100457803B1 (ko) | 2005-04-20 |
KR100669846B1 (ko) | 2007-01-16 |
KR100669845B1 (ko) | 2007-01-16 |
JP4298720B2 (ja) | 2009-07-22 |
EP1777511A3 (fr) | 2007-12-12 |
KR19980700562A (fr) | 1998-03-30 |
EP1777511A2 (fr) | 2007-04-25 |
EP0797763A4 (fr) | 1999-03-24 |
KR20040033060A (ko) | 2004-04-17 |
WO1996018094A1 (fr) | 1996-06-13 |
JP3874422B2 (ja) | 2007-01-31 |
EP0797763B1 (fr) | 2010-12-01 |
EP0797763A1 (fr) | 1997-10-01 |
EP0804722A1 (fr) | 1997-11-05 |
JP3874421B2 (ja) | 2007-01-31 |
JPH10510359A (ja) | 1998-10-06 |
KR20040033059A (ko) | 2004-04-17 |
JP2001525918A (ja) | 2001-12-11 |
JP4090069B2 (ja) | 2008-05-28 |
US5864394A (en) | 1999-01-26 |
EP0804722B1 (fr) | 2010-11-10 |
JP2006276026A (ja) | 2006-10-12 |
JP2006220667A (ja) | 2006-08-24 |
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