CN2641835Y - image sensor - Google Patents

Abstract

An image sensor. In order to provide a sensor with reduced volume, improved quality and reduced production cost, the utility model is provided, which is electrically connected to a printed circuit board and comprises a plurality of metal sheets, a sealing colloid, an image sensing chip, a plurality of wires and a light transmission layer which are symmetrically arranged; the metal sheets are symmetrically arranged and provided with a first plate and a second plate with different heights and a third plate connected with the first plate and the second plate, and the metal sheets are arranged in a central position to form a groove; the sealing colloid covers and fixes a plurality of symmetrical metal sheets to form an upper surface and a lower surface, and the upper surfaces of the first plate and the second plate of the metal sheets are exposed from the upper surface of the sealing colloid; the image sensing chip is arranged in a groove formed by a plurality of metal sheets; a plurality of wires electrically connected to the image sensor chip and the second plate of the metal sheet; the light-transmitting layer is covered on the first plate of the plurality of metal sheets; the printed circuit board is electrically connected with the plurality of metal sheet first plates and is provided with a through groove with the size slightly larger than the euphotic layer.

Description

image sensor

technical field

The utility model belongs to sensors, in particular to an image sensor.

Background technique

As shown in FIG. 1 , the image sensor of the patent application No. 091203873 filed by the applicant on 91/03/27 includes a plurality of metal sheets 10 , a flange layer 16 and a transparent layer 22 arranged at intervals.

The metal sheet 10 forms a first plate 12 and a second plate 14 of different heights.

The flange layer 16 is formed on the periphery and the bottom surface of several metal sheets 10, so that the upper surface of the first plate 12 of the metal sheet 10 and the lower surface of the second plate 14 are exposed by the flange layer 16, and it is used for forming several metal sheets 10. An accommodating area 20 for accommodating the image sensing chip 18 .

The transparent layer 22 is disposed on the flange layer 16 to cover the image sensing chip 18 so that the image sensing chip 18 can receive light signals through the transparent layer 22 .

However, the aforementioned image sensor can achieve the effect and purpose of its creation. However, a rather high flange layer 16 must be formed in the overall structure, so that the light-transmitting layer 22 is disposed thereon so as to cover the image sensing chip 18 . In this way, it cannot meet the requirements of being thin, light and small. Moreover, the junction between the flange layer 16 and the first plate 12 of the metal sheet 10 is close to a right angle, and impurities are more likely to be trapped, which not only makes cleaning difficult in the manufacturing process, but also easily affects the quality of the image sensor.

Contents of the invention

The purpose of the utility model is to provide an image sensor with reduced volume, improved quality and reduced production cost.

The utility model is used to electrically connect to the printed circuit board, which includes several symmetrically arranged metal sheets, sealing colloids, image sensing chips, several wires and light-transmitting layers; several mutually symmetrically arranged metal sheets are designed There are first and second boards of different heights and a third board connected to the first and second boards. Several metal sheets arranged with each other form a groove in the central part; the sealant wraps and fixes several mutually symmetrical metal sheets to form an upper , the lower surface, and the upper surface of the first and second plates of several metal sheets is exposed from the upper surface of the sealant; the image sensing chip is arranged in the groove formed by several metal sheets; several wires are electrically connected to the image The sensing chip and the second board of the metal sheet; the light-transmitting layer is covered on the first board of several metal sheets; the printed circuit board is electrically connected to the first board of several metal sheets, and has a size slightly larger than the transparent layer. Hollow slot for the optical layer.

in:

A middle plate for setting an image sensing chip is arranged in the groove formed by the central part of several mutually arranged metal sheets.

The sealing system uses industrial plastic material injection molding to cover and fix several mutually symmetrical metal sheets.

Because the utility model is used to electrically connect to the printed circuit board, it includes several symmetrically arranged metal sheets, sealing glue, image sensing chip, several wires and light-transmitting layer; several mutually symmetrically arranged metal sheets There are first and second boards of different heights and a third board connected to the first and second boards. Several metal sheets arranged with each other form a groove in the central part; the sealant wraps and fixes several mutually symmetrical metal sheets to form The upper and lower surfaces, and the upper surface of the first and second plates of several metal sheets are exposed from the upper surface of the sealant; the image sensing chip is arranged in the groove formed by several metal sheets; several wires are electrically connected to the The image sensor chip and the second board of the metal sheet; the light-transmitting layer is covered on the first board of several metal sheets; the printed circuit board is electrically connected to the first board of several metal sheets, and has a size slightly larger than The hollow groove of the light-transmitting layer. Since the metal sheet forms a groove for setting the image sensing chip, the image sensing chip can be placed in the groove, and the light-transmitting layer is arranged on the first plate of the metal sheet, so there is no need to form a convex surface on the encapsulant. Insulation layer can reduce the height of the overall package, so as to achieve the purpose of lightness and shortness; the third board connecting the first and second boards of the metal sheet is inclined, which can reduce the residue of impurities and facilitate removal, improving the quality of its process. Not only the volume is reduced, but also the quality is improved and the production cost is reduced, so as to achieve the purpose of the utility model.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional image sensor structure.

Fig. 2 is a schematic sectional view of the structure of the utility model.

Fig. 3 is the implementation schematic diagram of the utility model.

Detailed ways

As shown in FIG. 2 , the present invention includes a plurality of metal sheets 30 , an encapsulant 31 , an image sensor chip 33 , several wires 35 and a light-transmitting layer 37 arranged symmetrically with each other.

Several mutually symmetrically arranged metal sheets 30 (Leadfram) are provided with a first plate 32, a second plate 34 of different heights and a third plate 36 connecting the first and second plates 32, 34, so that several mutually arranged metal sheets 30 forms a groove 38 in the central portion of which the middle plate 40 is disposed.

The encapsulant 31 is an industrial plastic material, which covers and fixes several mutually symmetrical metal sheets 30 by injection molding to form an upper surface 42 and a lower surface 44, and makes the first and second plates 32, 32, 34 is exposed by the upper surface 42 of the encapsulant 31 .

The image sensor chip 33 is disposed in the groove 38 formed by the metal sheets 30 and located above the middle board 40 .

Several wires 35 are electrically connected to the image sensing chip 33 and the second board 34 of the metal sheet 30 .

The transparent layer 37 is covered on the first plate 32 of the plurality of metal sheets 30 , so that the image sensing chip 33 can receive light signals through the transparent layer 37 .

As shown in Figure 3, when the utility model is implemented, the central part of the printed circuit board 39 is formed with a hollow groove 41 slightly larger than the light-transmitting layer 37, and the printed circuit board 39 is covered on the first plate of several metal sheets 30. 32, so that it forms an electrical connection with the first board 32, and the image sensing chip 33 can receive light signals through the light-transmitting layer 37 and the hollow groove 41, so that the signal of the image sensing chip 33 can pass through the metal sheet The first board 32 of 30 is transferred onto a printed circuit board 39 .

As mentioned above, the utility model has the following advantages:

1. Since the metal sheet 30 forms a groove 38 for setting the image sensing chip 33, the image sensing chip 33 can be arranged in the groove 38, and the light-transmitting layer 37 can be arranged on the first plate 32 of the metal sheet 30 Therefore, the height of the overall package can be reduced because there is no need to form a flange layer on the sealing body 31, so as to achieve the purpose of lightness, thinness and compactness.

2. The third plate 36 connecting the first and second plates 32 and 34 of the metal sheet 30 is inclined, which can reduce the residue of impurities and facilitate removal, so as to improve the process quality.

Claims (3)

1. An image sensor, which is used to electrically connect to a printed circuit board, which includes several symmetrically arranged metal sheets, a sealant, an image sensing chip, several wires and a light-transmitting layer; each The metal sheet is provided with first and second plates of different heights; the sealing body wraps and fixes several mutually symmetrical metal sheets to form the upper and lower surfaces, and the upper surface of the first plate of the metal sheet is exposed from the upper surface of the sealing body; A plurality of wires are electrically connected to the image sensing chip; it is characterized in that the metal sheet is provided with a third plate connecting the first and second plates, so that several metal sheets arranged with each other form a central part where the image sensing chip is arranged. Groove; the upper surface of the second plate of the metal sheet is exposed by the upper surface of the sealant, and is electrically connected to several wires electrically connected to the image sensing chip; the light-transmitting layer is covered on the first plate of several metal sheets; The printed circuit board is electrically connected to the first board of several metal sheets, and is provided with a hollow groove slightly larger in size than the light-transmitting layer. 2 . The image sensor according to claim 1 , wherein a middle plate for setting the image sensor chip is arranged in the groove formed in the central part of the plurality of mutually arranged metal sheets. 3. The image sensor according to claim 1, wherein the sealing system is formed by injection molding of industrial plastic material to cover and fix several mutually symmetrical metal sheets.

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